JP7088581B1 - Electronic component manufacturing method and electronic component manufacturing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of increasing productivity while maintaining quality in the manufacture of small electronic parts. SOLUTION: The method for manufacturing an electronic component of the present disclosure is a method for manufacturing an electronic component using a hoop material in which a plurality of rows of insert-molded components are mounted in the longitudinal direction. The method for manufacturing the electronic component is included in the transport step of transporting the hoop material by using a predetermined drive means, the cutting step of cutting the hoop material to a predetermined length in the middle of the transport process, and the drive means. A hoop material cut by a cutting step using a processing means including a rotating part, which is a rotating part and positions the hoop material by a protrusion formed on the outer periphery thereof, and a processing part, is applied to the hoop material. It has a processing process for processing a predetermined electronic component contained therein. [Selection diagram] Fig. 3

Description

The present invention relates to a method for manufacturing an electronic component using a hoop material on which a plurality of rows of insert-molded components are mounted in the longitudinal direction, and a manufacturing apparatus thereof.

In recent years, electronic components such as semiconductor devices and IC chips have been miniaturized due to the improvement of the degree of integration and the improvement of the manufacturing capacity. Further, conventionally, electronic parts whose miniaturization is progressing in this way may be continuously manufactured in large quantities by using insert molding.

In many cases, such small electronic components are mounted on a flexible hoop material in large quantities and handled. In this case, the hoop material sprinkled on the reel is pulled out, so that the electronic components mounted on the hoop material are conveyed. Then, the electronic component transported to a predetermined position by the hoop material can be peeled off from the hoop material, and the electronic component can be taken out. Here, since the hoop material has flexibility, bending and entanglement may become a problem.

For example, when collecting the hoop material after the electronic components have been taken out, if the amount of the empty hoop material sent to the recovery device becomes long, the empty hoop material may be bent or the empty hoop materials may be entangled with each other in the recovery device. It may happen. Therefore, Patent Document 1 discloses a method of cutting an empty tape after taking out a part and collecting it by a collecting means.

Japanese Patent No. 47668798

Among the small electronic components, for example, an electronic connector for 5G communication is surrounded by a metal component. When transporting such a small electronic component, if the electronic component is attempted to be transported in direct contact with a rotating body such as a sprocket, the electronic component may be damaged. On the other hand, when such a small electronic component is transported by a rotary table, the situation where the electronic component is damaged is suppressed, but the equipment tends to be large and costly, and it takes time and effort to adjust the equipment. It tends to take. Therefore, it is conceivable to mount such a small electronic component on a flexible hoop material by insert molding. According to this, by transporting the hoop material in direct contact with a rotating body such as a sprocket, the electronic component mounted on the hoop material can be transported, so that the electronic component may be damaged. It can be transported relatively easily while suppressing it.

Here, in the method of pulling out the hoop material sprinkled on the reel or the like and transporting the parts, bending or entanglement of the hoop material may become a problem. According to the technique described in Patent Document 1, bending and entanglement of the tape are suppressed by cutting the empty tape after taking out the parts. However, this technique is intended to prevent bending and entanglement of the tape when the empty tape is collected after the parts have been taken out.

On the other hand, in the method of manufacturing an electronic component for processing an electronic component mounted on a flexible hoop material by insert molding, the electronic component is mounted in order to process the electronic component using a predetermined processing means. In the process of transporting the hoop material, the hoop material may be partially bent or excessively tensioned. Here, precise processing is often required for small electronic components mounted on the hoop material. Therefore, if the hoop material is bent or excessively tensioned before such processing, processing defects may occur. Therefore, until now, in the above-mentioned method for manufacturing electronic components, a mechanism has been provided in which the hoop material has a margin in the longitudinal direction in the intermediate process of transporting the hoop material, and the hoop material (hoop material) uses this margin. The electronic component mounted on the above was positioned in the above-mentioned processing means. According to this, even if a situation occurs in which the hoop material is excessively stretched, positioning can be performed using the above margin. However, in such a positioning method, it is necessary for the operator to temporarily stop the transfer of the hoop material and position the hoop material (electronic component mounted on the hoop material) on the processing means each time the processing is performed. Not only did the man-hours increase, but the speedup of manufacturing electronic components was hindered. In addition, the hoop material has a margin in the longitudinal direction, which tends to increase the size of the manufacturing equipment.

An object of the present disclosure is to provide a technique for manufacturing small electronic components, which can increase productivity while maintaining quality.

The method for manufacturing an electronic component of the present disclosure is a method for manufacturing an electronic component using a hoop material in which a plurality of rows of insert-molded components are mounted in the longitudinal direction. The method for manufacturing the electronic component includes a transport step of transporting the hoop material using a predetermined drive means, a cutting step of cutting the hoop material to a predetermined length in the middle of the transport process, and a cutting step of cutting the hoop material to a predetermined length. It was cut by the cutting step using a processing means including a rotating portion included in the driving means and a rotating portion for positioning the hoop material by a protrusion formed on the outer periphery thereof and a processed portion. The hoop material has a processing step of processing a predetermined electronic component housed in the hoop material.

According to the above manufacturing method, the hoop material is cut to a predetermined length in the middle of the transfer process. Therefore, even if the hoop material is prone to bending or tension due to its flexibility and its length, the cut hoop material suppresses these. Then, unlike the conventional method for manufacturing electronic components, the hoop material is provided with a margin in the longitudinal direction, and it is not necessary to use the margin for positioning. According to this, it is possible to suppress the increase in size of the manufacturing equipment. Then, the hoop material cut in this way can be positioned relatively easily by the above-mentioned rotating portion. Specifically, a plurality of holes are formed in the hoop material at a predetermined pitch in the longitudinal direction, and the hoop material is positioned by the processing means by engaging the plurality of holes with the protrusions of the rotating portion. However, since the hoop material cut as described above suppresses bending and tension, the cut hoop material can be positioned in the process of being conveyed by the above-mentioned drive means. Then, the operator does not need to temporarily stop the transportation of the hoop material in order to position the hoop material (electronic component mounted on the hoop material) on the processing means. According to this, while maintaining the manufacturing quality of electronic parts by manufacturing electronic parts using hoop materials, it is possible to speed up the manufacturing of electronic parts by cutting the hoop materials, transporting and processing them. Can be done. In such a method for manufacturing an electronic component, the processing means includes a pair of rotating portions arranged in pairs in the longitudinal direction of the hoop material, and the hoop material is used in the cutting step. , The length may be longer than the distance between the pair of rotating portions. According to this, since the front and rear of the cut hoop material in the longitudinal direction come into contact with the pair of rotating portions, not only the cut hoop material can be reliably conveyed by the rotation of the rotating portions, but also the cut hoop material can be reliably conveyed. The cut hoop material can be reliably positioned by the protrusion of the rotating portion. Then, while maintaining the manufacturing quality of the electronic components, the speed of manufacturing the electronic components can be suitably increased.

The present disclosure can also be grasped from the aspect of the electronic component manufacturing apparatus. That is, the electronic component manufacturing apparatus of the present disclosure is an electronic component manufacturing apparatus using a hoop material on which a plurality of rows of insert molded parts are mounted in the longitudinal direction, and is a driving means for transporting the hoop material and the said. While the hoop material is being conveyed by the driving means, the cutting means for cutting the hoop material to a predetermined length and the hoop material cut by the cutting means are housed in the hoop material. It is equipped with a processing means for processing electronic parts.

According to the present disclosure, it is possible to increase the productivity of manufacturing small electronic components while maintaining the quality.

It is a figure which shows the schematic structure of the manufacturing apparatus of the electronic component in 1st Embodiment. It is a figure which illustrates the hoop material in which a plurality of rows of electronic components are mounted in the longitudinal direction in the 1st Embodiment. It is a figure which illustrates the flow of the manufacturing method of the electronic component in 1st Embodiment. It is a figure for demonstrating an aspect in which a cut hoop material is positioned and processed. It is a figure which shows the schematic structure of the manufacturing apparatus of the electronic component in 2nd Embodiment.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. The configurations of the following embodiments are exemplary and the present disclosure is not limited to the configurations of the embodiments.

<First Embodiment>
The method for manufacturing an electronic component of the present disclosure is a method for manufacturing an electronic component using a hoop material in which a plurality of rows of insert-molded components are mounted in the longitudinal direction. Then, in this manufacturing method, a transport step of transporting the hoop material, a cutting step of cutting the hoop material to a predetermined length, and the cut hoop material are processed into electronic parts housed in the hoop material. It has a processing process.

Here, FIG. 1 is a diagram showing a schematic configuration of a manufacturing apparatus for electronic components used in the above manufacturing method. The electronic component manufacturing apparatus 1 according to the present embodiment is an electronic component manufacturing apparatus using a hoop material on which a plurality of rows of insert-molded parts are mounted in the longitudinal direction, and includes a driving means 10 for transporting the hoop material. A cutting means 20 for cutting the hoop material to a predetermined length, and a processing means 30 for processing the electronic parts contained in the cut hoop material are provided.

The driving means 10 includes a hoop portion 11. The hoop portion 11 is a reel 12 in which the hoop material 100 is wound in a roll shape, and the hoop material 100 can be sequentially fed from the rotatably supported reel 12. Here, the hoop material 100 is made of, for example, a strip-shaped frame formed of a copper alloy having a thickness of 50 to 100 μm or the like, and the details thereof will be described later. Further, the driving means 10 includes a sprocket 32 (rotating portion of the present disclosure) described later.

The cutting means 20 has a cutting portion 21 for cutting the hoop material 100 unwound from the hoop portion 11. The hoop material 100 is cut to a predetermined length by the cutting means 20. The length of the hoop material 100 cut in this way will be described later.

The processing means 30 includes a processing unit 31 that press-processes the electronic component 2 housed in the hoop material 100, and a sprocket 32 that conveys the hoop material 100 and positions the hoop material 100 during press processing by the processing unit 31 (the present disclosure). (Rotating part of), and is configured to include. Here, in the present embodiment, as shown in FIG. 1, the sprockets 32 are arranged in pairs in the longitudinal direction of the hoop material 100. The above-mentioned electronic component 2 is an electronic component for 5G communication, an IC chip, various electronic components such as a memory element, and for example, an IC chip manufactured in advance by wire bonding, chip bonding, or the like is a hoop. It is mounted on the material 100.

Here, FIG. 2 is a diagram illustrating the hoop material 100 in which a plurality of rows of electronic components 2 are mounted in the longitudinal direction in the present embodiment. As shown in FIG. 2, the electronic component 2 is mounted on the hoop material 100 via the dam bar 120 with respect to the frame 110 extending in the longitudinal direction. According to this, since the electronic component 2 is transported by transporting the hoop material 100, the electronic component 2 can be transported relatively easily. Then, in the processing line of the electronic component 2, the productivity is enhanced, and the processed electronic component 2 can be taken out relatively easily by cutting the dam bar 120 after the processing. Then, in the frame 110 of the hoop material 100, feed holes 111 are formed at regular intervals along the longitudinal direction. As will be described later, when the feed hole 111 engages with the sprocket 32, the hoop material 100 can be conveyed and positioned by the sprocket 32.

Next, a method of manufacturing an electronic component using such a manufacturing apparatus 1 will be described in detail with reference to FIG. FIG. 3 is a diagram illustrating a flow of a manufacturing method of electronic components in the present embodiment. FIG. 3 describes a manufacturing process executed by using the manufacturing apparatus 1 in the present embodiment.

In the present embodiment, first, the hoop material 100 is unwound from the reel 12 of the hoop portion 11 to convey the hoop material (transfer step of S101). The hoop material 100 is continuously fed by being sequentially fed from the reel 12. That is, the process of S102 to S104 described later can be regarded as a process performed in the middle of this transfer process.

Then, the hoop material 100 conveyed in this way is cut to a predetermined length in the middle of the conveying process (cutting step of S102). Here, according to the conventional technique in which the hoop material 100 is transported to the processing means 30 without being cut, the hoop material 100 may be partially bent or excessively stretched.

On the other hand, according to the present disclosure, in the cutting step of S102, the hoop material 100 is cut before being transported to the processing means 30 in the middle of the transporting process of the hoop material 100, so that the processing means 30 is used. The situation where the hoop material 100 to be transported is bent or excessively tensioned is suppressed as much as possible.

In the present embodiment, in the cutting step of S102, the hoop material 100 is cut to a length equal to or longer than the distance between the pair of sprockets 32 (this is represented by the distance x1 in FIG. 4 described later). Here, the manufacturing apparatus 1 is provided with, for example, a sensor for measuring the number of feed holes 111 of the hoop material 100 passing through a predetermined fixed position, and a processing apparatus for controlling the operation of the cutting means 20. Then, the processing device described above has a pair of sprockets having a predetermined length of the hoop material 100 based on the number of feed holes 111 measured by the sensor and the predetermined distance between the feed holes 111. The hoop material 100 can be cut by controlling the operation of the cutting means 20 so that the distance is equal to or greater than the distance between 32.

Next, the hoop material 100 cut by the cutting step of S102 is positioned by the sprocket 32 (positioning step of S103). Then, with respect to the hoop material 100 positioned in this way, the electronic component 2 housed in the hoop material 100 is processed (processing step of S104). This will be described below with reference to FIG.

FIG. 4 is a diagram for explaining an embodiment in which the cut hoop material 100 is positioned and processed. In the present embodiment, the processing means 30 includes a pair of sprockets 32 arranged in pairs in the longitudinal direction of the hoop material 100. Then, as described above, in the cutting step, the hoop material 100 is cut into a length L1 having a distance x 1 or more between the sprockets 32.

In such a processing means 30, the front and rear in the longitudinal direction of the hoop material 100 cut to the length L1 are positioned by a pair of sprockets 32. Specifically, the feed holes 111 before and after the hoop material 100 engage with the respective teeth 321 formed on the sprocket 32, so that the hoop material 100 is positioned on the processing means 30. ..

Since the hoop material 100 cut as described above suppresses bending and tension, the cut hoop material 100 can be positioned in the process of being conveyed by the driving means 10. Then, the operator does not need to temporarily stop the transportation of the hoop material 100 in order to position the hoop material 100 (the electronic component 2 mounted on the hoop material 100) on the processing means 30. That is, the electronic component 2 housed in the hoop material 100 that is continuously conveyed can be continuously pressed by the processing unit 31. According to this, the hoop material 100 is used and the hoop material 100 is positioned to manufacture the electronic component 2, so that the hoop material 100 is cut and conveyed and processed while maintaining the manufacturing quality of the electronic component. It is possible to speed up the manufacture of electronic components.

Further, in the hoop material 100 cut to a length L1 having a distance x1 or more between the sprockets 32, the front and rear in the longitudinal direction thereof come into contact with the pair of sprockets 32, so that the hoop material was cut by the rotation of the sprockets 32. Not only can the hoop material 100 be reliably conveyed, but the cut hoop material 100 can be reliably positioned by the teeth 321 of the sprocket 32. Then, while maintaining the manufacturing quality of the electronic components, the speed of manufacturing the electronic components can be suitably increased.

Then, the electronic component 2 processed in the state of being housed in the hoop material 100 as described above is taken out by cutting the dam bar 120 of the hoop material 100. Further, the empty hoop material 100 from which the electronic component 2 has been taken out is recovered by a predetermined recovery device.

According to the method for manufacturing electronic components described above, it is possible to improve the productivity of manufacturing small electronic components while maintaining the quality.

<Second Embodiment>
A method for manufacturing an electronic component according to a second embodiment will be described with reference to FIG. FIG. 5 is a diagram showing a schematic configuration of an electronic component manufacturing apparatus according to a second embodiment. The electronic component manufacturing apparatus 1 according to the present embodiment includes a driving means 10, a cutting means 20, and a processing means 30 as in the first embodiment described above.

Here, in the electronic component manufacturing apparatus 1 according to the present embodiment, as shown in FIG. 5, a plurality of processing means 30 are arranged side by side in the longitudinal direction of the hoop material 100. Then, the distance x1 between the pair of sprockets 32 included in the processing means 30 arranged on the upstream side (hoop portion 11 side) and the distance x2 between the pair of sprockets 32 included in the processing means 30 arranged on the downstream side. And, the distance x2 is longer than the distance x1.

In this case, in the cutting step of S102 shown in FIG. 3 above, the hoop material 100 is cut to a length of a distance x 2 or more between the pair of sprockets 32 included in the processing means 30 arranged on the downstream side. That is, the hoop material 100 has a length equal to or greater than the distance between the pair of sprockets 32 for the pair of sprockets 32 having the longest distance between the sprockets 32 among the pair of sprockets 32 possessed by the plurality of processing means 30. Be disconnected. Here, the manufacturing apparatus 1 is provided with, for example, a sensor for measuring the number of feed holes 111 of the hoop material 100 passing through a predetermined fixed position, and a processing apparatus for controlling the operation of the cutting means 20. Then, in the above processing device, the length of the hoop material 100 is predetermined between the sprockets 32 based on the number of the feed holes 111 measured by the sensor and the distance between the predetermined feed holes 111. The hoop material 100 can be cut by controlling the operation of the cutting means 20 so that the distance between the two sprockets 32 is equal to or greater than the distance between the pair of sprockets 32 having the longest distance.

According to this, even if the plurality of processing means 30 are arranged, the front and rear in the longitudinal direction of the hoop material 100 are surely in contact with each pair of sprockets 32 of the plurality of processing means 30. Not only can the cut hoop material 100 be reliably conveyed by the rotation of the sprocket 32, but also the cut hoop material 100 can be reliably positioned by the teeth 321 of the sprocket 32. Then, while maintaining the manufacturing quality of the electronic components, the speed of manufacturing the electronic components can be suitably increased.

<Other variants>
The above embodiment is merely an example, and the present disclosure may be appropriately modified and implemented without departing from the gist thereof. In the above embodiment, an example in which an electronic component mounted on a hoop material is processed has been described, but the present invention is not intended to be limited thereto, and the manufacturing method of the present disclosure is, for example, any method insert-molded on the hoop material. It may be applied to machining a part.

1 ... Electronic component manufacturing equipment 2 ... Electronic component 10 ... Drive means 20 ... Cutting means 30 ... Processing means 32 ... Sprocket 100 ... Hoop material 111 ・ ・ ・ Feed hole S101 ・ ・ Transfer process S102 ・ ・ Cutting process S103 ・ ・ Positioning process S104 ・ ・ Processing process

Claims (4)

A method for manufacturing electronic components using a hoop material in which multiple rows of insert-molded components are mounted in the longitudinal direction.
A transfer process for transporting the hoop material using a predetermined drive means, and
In the middle of the transfer process, a cutting step of cutting the hoop material to a predetermined length and a cutting step of cutting the hoop material to a predetermined length.
It was cut by the cutting step using a processing means including a rotating portion included in the driving means and a rotating portion for positioning the hoop material by protrusions formed on the outer periphery thereof and a processed portion. With respect to the hoop material, a processing step of processing a predetermined electronic component housed in the hoop material, and
A method for manufacturing electronic components. The processing means is configured to include a pair of rotating portions arranged in pairs in the longitudinal direction of the hoop material.
In the cutting step,
The hoop material is cut to a length equal to or greater than the distance between the pair of rotating portions.
The method for manufacturing an electronic component according to claim 1. A plurality of the processing means are arranged side by side in the longitudinal direction of the hoop material.
In the cutting step,
The hoop material is cut into a length equal to or longer than the distance between the pair of rotating portions for the pair of rotating portions having the longest distance between the rotating portions among the pair of rotating portions of each of the plurality of processing means. Be done,
The method for manufacturing an electronic component according to claim 2. An electronic component manufacturing device that uses hoop materials to which multiple rows of insert-molded components are mounted in the longitudinal direction.
The driving means for transporting the hoop material and
A cutting means for cutting the hoop material to a predetermined length while the hoop material is being conveyed by the driving means.
With respect to the hoop material cut by the cutting means, a processing means for processing a predetermined electronic component housed in the hoop material and a processing means.
A device for manufacturing electronic components.

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