JP7082927B2 - Exposure device - Google Patents

Description

The present invention relates to an exposure apparatus.

Patent Documents 1 and 2 describe an exposure apparatus that exposes a photosensitive material in a desired two-dimensional pattern by irradiating the photosensitive material with a pattern light formed by spatial modulation. This exposure apparatus spatially modulates the light output from the light source with a micromirror device (DMD) to form patterned light. This pattern light is imaged on the photosensitive material by the optical system.

Here, the optical system includes, for example, a first imaging optical system that forms an image of a pattern light formed by DMD, a microlens array (MLA) arranged on an imaging surface of the first imaging optical system, and the like. It includes a second imaging optical system that forms an image of light that has passed through the MLA on a photosensitive material. The MLA comprises a plurality of microlenses arranged in two dimensions so as to correspond to each of the DMD's micromirrors. In other words, it is necessary that the plurality of pixels of the pattern light incident on the MLA from the DMD and the plurality of micromirrors of the MLA have a one-to-one correspondence with each other. Therefore, for example, the DMD and the MLA are fixed by various holding members or the like after the relative positions between the DMD and the MLA are adjusted.

However, after fixing the DMD and MLA, for example, due to thermal expansion of the holding member in response to a change in ambient temperature (also referred to as environmental temperature), release of residual stress generated during fixing of DMD and MLA over time, and vibration. , The relative positions of DMD and MLA may shift. In such a case, for example, a part of the beam to be incident on the adjacent microlens may be incident on the microlens to which the beam is not originally incident, and the extinction ratio may be lowered. That is, the accuracy of exposing the photosensitive material in a desired two-dimensional pattern (also referred to as exposure accuracy) may decrease.

On the other hand, for example, in the technique of Patent Document 2, the pattern light is arranged in a grid pattern near the photosensitive material on the stage so as to correspond to a total of four pixels of two vertical and two horizontal corners. A quadruple detector with four photodiodes is used to detect the relative positional deviation between the DMD and the MLA. Specifically, for example, the amount of deviation between the beam reflected by the DMD micromirror and the microlens corresponding to this beam is detected. In other words, the amount of beam deviation is detected. Then, for example, by adjusting the position of the MLA based on the amount of deviation of the beam detected by using the 4-split detector, the relative positional deviation between the DMD and the MLA is eliminated.

Japanese Unexamined Patent Publication No. 2004-335692 Japanese Unexamined Patent Publication No. 2004-296531

By the way, in the technique of Patent Document 2, for example, in order to detect the beam deviation amount (deviation amount ΔX in the X direction, deviation amount ΔY in the Y direction, and deviation amount θz in the rotation direction), the exposure area on the stage Four-divided detectors are placed in two of the four corners. Then, in these two places, four photodiodes of the four-division detector are arranged so as to correspond to four pixels of the pattern light incident on the MLA from the DMD.

However, the four-pixel beam emitted from the DMD and passing through the two corners of the MLA is projected onto the stage through the second imaging optical system. Therefore, it is necessary to position the four photodiodes at two locations on the stage according to the magnitude of the manufacturing error such as the magnification error and the aberration of the second imaging optical system. As the resolution of the drawing pattern increases due to exposure, the pitch of the microlens in the MLA becomes smaller, and even finer precision is required in the positioning of the four photodiodes at two locations on the stage. Further, for example, when a plurality of exposure heads are mounted on the exposure apparatus, it is necessary to align the four division detectors according to the number of exposure heads. Therefore, when manufacturing an exposure apparatus, there is a possibility that complicated steps required for alignment may increase.

Further, in the configuration in which the four-divided detector is installed on the stage, the structure of the stage may be complicated. Here, for example, considering that a 4-division detector is provided on another movable stage that can be inserted into and exited from the exposed area, which is different from the stage on which the photosensitive material is arranged, the 4-division detector is required. Moving accuracy and positioning accuracy corresponding to very fine positioning accuracy are also required for another movable stage. Therefore, the manufacture of the exposure apparatus may become more difficult.

Therefore, an object of the present invention is to provide an exposure apparatus capable of easily improving the exposure accuracy of a two-dimensional pattern.

In order to solve the above problems, the exposure apparatus according to the first aspect includes a light emitting unit, a microlens array unit, and a sensor unit. The light emitting unit has a plurality of light emitting regions that emit light, respectively. The microlens array unit has an effective region and a non-effective region. The effective domain includes a plurality of microlenses each located on the path of light emitted by each of the plurality of emission regions. The non-effective region is located outside the effective region in a direction perpendicular to the optical axis of the plurality of microlenses and includes an adjustment mark. The sensor unit has a plurality of light receiving elements arranged side by side along the first direction, and a plurality of light receiving elements arranged along a second direction intersecting the first direction. .. The sensor unit is emitted from the adjusting light emitting region among the plurality of light emitting regions on the path of light emitted from the light emitting unit and passing through the region including the adjusting mark in the ineffective region. It is possible to output a signal relating to the relative positional relationship between the adjustment light spot formed by the light radiating to the ineffective region and the adjustment mark. The adjustment mark shields a part of the adjustment light spot and the adjustment light spot as a signal relating to the relative positional relationship between the adjustment light spot and the adjustment mark by the sensor unit. It has a pattern for blocking the passage of light toward the sensor portion of a part of the adjustment light spot so that an image capturing the shadow of the adjustment mark can be output.

The exposure apparatus according to the second aspect is the exposure apparatus according to the first aspect, and the microlens array unit includes a microlens array in which the plurality of microlenses are integrally configured. , The microlens array includes the ineffective region.

The exposure device according to the third aspect is the exposure device according to the first or second aspect, and the microlens array unit has a first adjustment mark and a first adjustment mark included in the ineffective region, respectively. The sensor unit has two adjustment marks, and the sensor unit is a first adjustment formed by light emitted from a first adjustment light emitting region among the plurality of light emitting regions and irradiated to the ineffective region. It is possible to output a signal relating to the first relative positional relationship between the light spot and the first adjustment mark, and emit light from the second adjustment light emitting region of the plurality of light emitting regions. It is possible to output a signal relating to the second relative positional relationship between the second adjustment light spot formed by the light applied to the ineffective region and the second adjustment mark.

The exposure apparatus according to the fourth aspect is the exposure apparatus according to any one of the first to third aspects, and the sensor unit has a plurality of light receiving elements in a two-dimensionally arranged state. Includes area sensor.

The exposure apparatus according to the fifth aspect is the exposure apparatus according to any one of the first to the fourth aspects, and moves at least one of the light emitting unit and the microlens array unit. By moving at least one of the movable parts by the drive unit in response to the signal relating to the relative positional relationship between the drive unit capable of the light emitting unit and the light emitting unit, the plurality of light emitting units and the plurality of microlenses are relative to each other. It is further provided with a control unit for adjusting the positional relationship.

According to the exposure apparatus according to the first aspect, for example, information on the relative positional relationship between the adjustment light spot and the adjustment mark in the microlens array unit is obtained, and the information is obtained according to the relative positional relationship. By moving at least one of the light emitting unit and the microlens array unit, it is possible to reduce the relative positional deviation between the light emitting unit and the microlens array unit. Therefore, for example, even if there is an imaging optical system between the microlens array unit and the exposed object, which may cause manufacturing errors such as magnification error and aberration, the magnification in the imaging optical system Information on the relative positional relationship between the light emitting unit and the microlens array unit can be obtained without being affected by manufacturing errors such as errors and aberrations. Thereby, for example, the accuracy of alignment required for the sensor unit can be reduced. As a result, for example, the exposure accuracy related to the two-dimensional pattern in the exposure apparatus can be easily improved.

According to the exposure apparatus according to the second aspect, for example, since a plurality of microlenses and adjustment marks are located on the microlens array, it is easy to align the plurality of microlenses with the adjustment marks. .. As a result, for example, the exposure accuracy related to the two-dimensional pattern in the exposure apparatus can be improved.

According to the exposure apparatus according to the third aspect, for example, at least one of the light emitting unit and the microlens array unit is set according to the information regarding the relative positional relationship between the adjustment light spot and the adjustment mark at two locations. By moving it, it is possible to reduce the relative positional deviation including the rotation direction between the plurality of light emitting regions and the plurality of microlenses. As a result, for example, the exposure accuracy related to the two-dimensional pattern in the exposure apparatus can be improved.

According to the exposure apparatus according to the fourth aspect, for example, by using a sensor unit having an area sensor, the adjustment light spot and the adjustment mark are used regardless of the direction of deviation between the adjustment light spot and the adjustment mark. It is possible to acquire a signal related to the relative positional relationship with. As a result, for example, the exposure accuracy related to the two-dimensional pattern can be easily improved in the exposure apparatus. Further, for example, when a measurement sensor for grasping the relative positional relationship of a plurality of pattern lights emitted by a plurality of exposure heads exists, this measurement sensor is used as a sensor unit. By also using it, it is possible to reduce the size and complexity of the exposure apparatus.

According to the exposure apparatus according to the first aspect, for example, the sensor unit acquires an image that captures the adjustment light spot whose position corresponding to the reference position of the adjustment light spot can be recognized, and the reference of the adjustment mark. It is possible to acquire an image that captures an adjustment mark whose position corresponds to the position can be recognized by one imaging. Thereby, for example, the sensor unit can quickly acquire a signal relating to the relative positional relationship between the adjustment light spot and the adjustment mark. As a result, for example, the exposure accuracy related to the two-dimensional pattern in the exposure apparatus can be rapidly improved. Further, for example, the exposure apparatus irradiates the adjustment mark in addition to the light emitting unit in order to obtain a signal related to the image in which the adjustment mark whose position corresponding to the reference position of the adjustment mark can be recognized by the sensor unit is obtained. It does not have to have lighting to do so. This can reduce, for example, the increase in size and complexity of the exposure apparatus.

According to the exposure apparatus according to the fifth aspect, for example, depending on the information related to the relative positional relationship between the adjustment light spot and the adjustment mark, the plurality of light emitting regions and the plurality of microlenses are relative to each other. Misalignment can be reduced automatically. Thereby, for example, even when an operator who is unfamiliar with the adjustment work of the exposure apparatus uses the exposure apparatus, the relative positional deviation between the plurality of light emitting regions and the plurality of microlenses can be reduced. As a result, for example, the exposure accuracy related to the two-dimensional pattern in the exposure apparatus can be easily improved.

It is a side view which shows an example of the exposure apparatus which concerns on each embodiment. It is a top view which shows an example of the exposure apparatus which concerns on each embodiment. It is a schematic perspective view which shows an example of the structure of the exposure unit and the sensor part which concerns on each embodiment. It is a schematic side view which shows an example of the structure of the exposure head and the sensor part which concerns on each embodiment. FIG. 5 is a schematic side view showing an example of the configuration of the first unit according to the first embodiment. FIG. 6A is a schematic front view showing an example of the configuration of the microlens array unit according to the first embodiment. FIG. 6B is a schematic front view showing an example of the configuration of the adjustment mark in the microlens array unit according to the first embodiment. FIG. 7 is a schematic front view showing an example of the adjustment mark and the adjustment light spot according to the first embodiment. It is a block diagram which shows an example of the bus wiring of the exposure apparatus which concerns on 1st Embodiment. It is a schematic perspective view which shows an example of a plurality of exposure heads which perform pattern exposure. 10 (a) and 10 (b) are diagrams for explaining a method of recognizing the relative positional relationship between the spatial light modulator and the MLA unit. 11 (a) and 11 (b) are diagrams for explaining a method of recognizing the relative positional relationship between the spatial light modulator and the MLA unit. FIG. 12A is a schematic side view showing an example of the configuration of the first unit according to the second embodiment. FIG. 12B is a schematic front view showing an example of the configuration of the microlens array unit according to the second embodiment. It is a block diagram which shows an example of the bus wiring of the exposure apparatus which concerns on 3rd Embodiment. It is a flow chart which shows an example of the operation flow about the position adjustment operation in the exposure apparatus which concerns on 3rd Embodiment. It is a flow chart which shows an example of the operation flow about the position adjustment operation in the exposure apparatus which concerns on 3rd Embodiment. FIG. 16A is a schematic front view showing an example of variations of the adjustment mark. FIG. 16B is a schematic front view showing an example of a variation of the adjustment mark and an example of an adjustment light spot. FIG. 17A is a schematic front view showing another example of the variation of the adjustment mark. FIG. 17B is a schematic front view showing another example of the variation of the adjustment mark and another example of the adjustment light spot.

Hereinafter, each embodiment of the present invention will be described with reference to the drawings. In the drawings, parts having the same structure and function are designated by the same reference numerals, and duplicate description is omitted in the following description. The drawings are schematically shown, and the sizes and positional relationships of various structures in each figure are not accurately illustrated. A right-handed XYZ coordinate system is attached to FIGS. 1 to 3, 5 to 7, 7, 9, 12 (a), 12 (b), and 16 (a) to 17 (b). ing. In this XYZ coordinate system, the main scanning direction of the exposure device 10 is the Y-axis direction, the sub-scanning direction of the exposure device 10 is the X-axis direction, and the vertical direction orthogonal to both the X-axis direction and the Y-axis direction is. It is in the Z-axis direction. Specifically, the direction of gravity (vertical direction) is the −Z direction.

<1. First Embodiment>
FIG. 1 is a side view showing an example of a schematic configuration of the exposure apparatus 10 according to the first embodiment. FIG. 2 is a plan view showing an example of a schematic configuration of the exposure apparatus 10 according to the first embodiment.

The exposure apparatus 10 is an apparatus (also referred to as a pattern exposure apparatus) for exposing (drawing) a pattern (for example, a circuit pattern) by irradiating a processing object with a pattern light (drawing light) spatially modulated according to CAD data or the like. ), A direct drawing type drawing device. As the object to be treated, for example, the upper surface of the substrate W (the upper surface of the layer of the photosensitive material) on which the layer of the photosensitive material such as resist is formed is adopted. More specifically, the substrate W to be processed by the exposure apparatus 10 includes, for example, a semiconductor substrate, a printed circuit board, a color filter substrate provided in a liquid crystal display device, a liquid crystal display device, a plasma display device, or the like. A glass substrate for a flat panel display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a solar cell panel, and the like provided in the above are included. In the following description, it is assumed that the substrate W is a rectangular substrate.

The exposure apparatus 10 includes, for example, a base 15 and a support frame 16. The support frame 16 has, for example, a portal-like shape that is located on the base 15 and crosses the base 15 along the X-axis direction. Further, the exposure device 10 includes, for example, a stage 4, a stage drive mechanism 5, a stage position measurement unit 6, an exposure unit 8, and a control unit 9.

<Stage 4>
The stage 4 is a part for holding the substrate W. The stage 4 is located on the base 15, for example. Specifically, the stage 4 has, for example, a flat plate-like outer shape. In this case, the stage 4 can hold, for example, a substrate W placed on a flat upper surface in a horizontal posture. Here, for example, if a plurality of suction holes (not shown) are present on the upper surface of the stage 4, the stage 4 forms a negative pressure (suction pressure) in these plurality of suction holes, so that the stage 4 The substrate W can be held in a fixed state on the upper surface of the surface.

<Stage drive mechanism 5>
The stage drive mechanism 5 can, for example, move the stage 4 with respect to the base 15. The stage drive mechanism 5 is located on the base 15, for example. The stage drive mechanism 5 includes, for example, a rotation mechanism 51, a support plate 52, and a sub-scanning mechanism 53. The rotation mechanism 51 can rotate the stage 4 in the rotation direction (rotation direction (θ direction) around the Z axis), for example. The support plate 52 supports the stage 4 via, for example, a rotation mechanism 51. The sub-scanning mechanism 53 can, for example, move the support plate 52 in the sub-scanning direction (X-axis direction). Further, the stage drive mechanism 5 has, for example, a base plate 54 and a main scanning mechanism 55. The base plate 54 supports the support plate 52 via, for example, the sub-scanning mechanism 53. The main scanning mechanism 55 can, for example, move the base plate 54 in the main scanning direction (Y-axis direction).

Specifically, the rotation mechanism 51 passes through the center of the upper surface of the stage 4 (the mounting surface on which the substrate W is mounted) and is centered on the virtual rotation axis A perpendicular to the mounting surface. The stage 4 can be rotated. As the configuration of the rotation mechanism 51, for example, a configuration including a rotation shaft unit 511 and a rotation drive unit (for example, a rotation motor) 512 may be adopted. In this case, the rotation shaft portion 511 is in a state of extending along the vertical direction (Z-axis direction). The upper end of the rotating shaft portion 511 is fixed to, for example, the back surface side of the stage 4. The rotation drive unit 512 is in a state of rotatably holding the lower end of the rotation shaft portion 511, for example, and can rotate the rotation shaft portion 511. According to such a configuration, for example, the stage 4 can rotate about the rotation shaft A in the horizontal plane in response to the rotation of the rotation shaft portion 511 by the rotation drive unit 512. Here, for example, instead of providing the rotation mechanism 51, the pattern data 960 described later may be subjected to known rotation correction such as affine transformation to perform alignment in the rotation direction.

The sub-scanning mechanism 53 includes, for example, a linear motor 531 and a pair of guide members 532. The linear motor 531 has, for example, a mover attached to the lower surface of the support plate 52 and a stator located on the upper surface of the base plate 54. The pair of guide members 532 are located, for example, on the upper surface of the base plate 54 in a state of being laid parallel to each other along the sub-scanning direction. Here, for example, a ball bearing is located between each guide member 532 and the support plate 52. The ball bearing can move along the longitudinal direction (sub-scanning direction) of the guide member 532 while sliding with respect to the guide member 532, for example. Therefore, the support plate 52 is in a state of being supported by a pair of guide members 532 via ball bearings. Thereby, for example, when the linear motor 531 is operated, the support plate 52 can smoothly move along the sub-scanning direction while being guided by the pair of guide members 532.

The main scanning mechanism 55 includes, for example, a linear motor 551 and a pair of guide members 552. The linear motor 551 has, for example, a mover attached to the lower surface of the base plate 54 and a stator laid on the base 15. The pair of guide members 552 are laid, for example, on the upper surface of the base 15 in parallel with each other along the main scanning direction. Here, for example, an LM guide (registered trademark) as a machine element component that guides a linear motion portion of a machine by using "rolling" can be applied to each guide member 552. Further, if, for example, an air bearing is located between each guide member 552 and the base plate 54, the base plate 54 is supported in a non-contact state with respect to the pair of guide members 552. If such a configuration is adopted, for example, when the linear motor 551 is operated, the base plate 54 can move smoothly along the main scanning direction without causing friction while being guided by the pair of guide members 552.

<Stage position measurement unit 6>
The stage position measuring unit 6 can measure the position of the stage 4, for example. As the stage position measuring unit 6, for example, an interferometry type laser length measuring device is adopted. An interferometric laser length measuring instrument, for example, emits laser light from outside the stage 4 toward the stage 4 and receives the reflected light, and the position of the stage 4 is based on the interference between the reflected light and the emitted light. (Specifically, the position in the Y direction along the main scanning direction) can be measured. Here, for example, a linear scale may be used instead of the laser length measuring device.

<Exposure unit 8>
The exposure unit 8 can form, for example, pattern light and irradiate the substrate W with the pattern light. The exposure unit 8 has, for example, a plurality of exposure units 800 and a sensor unit 850. FIG. 3 is a schematic perspective view showing the configurations of the exposure unit 800 and the sensor unit 850 according to the first embodiment. FIG. 4 is a schematic side view showing the configuration of the exposure head 82 and the sensor unit 850 according to the first embodiment. In FIG. 4, the mirror 825 is omitted, and the spatial light modulator 820, the first imaging optical system 822, the microlens array unit (also referred to as the MLA unit) 824, the second imaging optical system 826, and the sensor unit 850 are included. They are arranged on the same optical axis. The exposure unit 8 has, for example, a plurality of exposure units (here, nine units) shown in FIG. 3, respectively. Here, for example, the number of the exposure units 800 in the exposure unit 8 may not be nine but may be one or more. Each exposure unit 800 has, for example, an exposure head 82 and is supported by a support frame 16. Here, the support frame 16 includes, for example, a plurality of exposure heads 82 arranged in the X-axis direction, and supports a row of a plurality of (for example, two) exposure heads 82 arranged in the Y-axis direction. It is located in the present state (see FIGS. 2 and 9).

<Light source unit 80>
The light source unit 80 can generate, for example, light that is the source of the pattern light that the exposure unit 8 irradiates the substrate W. For example, each exposure unit 800 may have one light source unit 80, or a plurality of exposure units 800 may have one light source unit 80. The light source unit 80 includes, for example, a laser oscillator and an illumination optical system. The laser oscillator can receive a drive signal from the laser drive unit and output a laser beam. The illumination optical system can make the light (spot beam) output from the laser oscillator into light having a uniform intensity distribution. The light output from the light source unit 80 is input to the exposure head 82. Here, for example, a configuration may be adopted in which the laser light output from one light source unit 80 is divided into a plurality of laser lights and input to the plurality of exposure heads 82.

<Exposure head 82>
The exposure head 82 includes, for example, a spatial light modulator 820, a first imaging optical system 822, an MLA unit 824, a mirror 825, and a second imaging optical system 826. Further, the exposure head 82 may have, for example, a measuring instrument 84. In the first embodiment, for example, as shown in FIG. 3, the spatial light modulator 820, the first imaging optical system 822, and the MLA unit 824 are located on the + Z direction side of the support frame 16. Then, for example, the second imaging optical system 826 and the measuring instrument 84 are located on the + Y direction side of the support frame 16. Such an exposure head 82 is located, for example, in a state of being housed in a first storage box (not shown). In this case, the first storage box is positioned so as to extend in the + Y direction on the + Z direction side of the support frame 16 and further extend in the −Z direction on the + Y direction side of the support frame 16. The light source unit 80 is located, for example, in the second storage box 802, which is fixedly located on the + Z direction side of the first storage box. Here, for example, the light output from the light source unit 80 in the −Z direction is reflected by the mirror 804 and incident on the spatial light modulator 820.

Further, in the first embodiment, as shown in FIG. 3, the spatial light modulator 820, the first imaging optical system 822 and the MLA unit 824 have the optical axis 822p of the first imaging optical system 822 (see FIG. 5). ) Is located on a straight line. Here, as shown in FIG. 3, the pattern light that has passed through the first imaging optical system 822 and the MLA unit 824 travels in the + Y direction, is applied to the mirror 825, and is reflected in the −Z direction. The reflected pattern light is incident on the second imaging optical system 826. Therefore, for example, among the configurations included in the exposure head 82, some configurations are located on a straight line along the Y-axis direction, and some other configurations are located on a straight line along the Z-axis direction. positioned. In other words, for example, a plurality of configurations included in the exposure head 82 are arranged on an L-shaped path. Thereby, for example, the height of the exposure head 82 in the Z-axis direction is reduced as compared with the case where the plurality of configurations included in the exposure head 82 are located on a straight line along the Z-axis direction. obtain. As a result, for example, the height of the exposure apparatus 10 can be reduced, and the degree of freedom in installing the exposure apparatus 10 can be increased.

<Spatial light modulator 820>
Spatial light modulator 820 has, for example, a digital mirror device (DMD). This DMD can spatially modulate the incident light by reflecting, for example, the necessary light that contributes to the drawing of the pattern and the unnecessary light that does not contribute to the drawing of the pattern in different directions. can. As the DMD, for example, a spatial modulation element in which a large number (1920 × 1080) of micromirrors M1 are arranged in a matrix on a memory cell is applied. Each micromirror M1 constitutes, for example, one square pixel having a side of about 10 μm. The DMD has a rectangular outer shape of, for example, about 20 mm × 10 mm when viewed in a plan view from the micromirror M1 side. In the DMD, for example, a digital signal is written to the memory cell based on the control signal from the control unit 9, and each of the micromirrors M1 is tilted at a required angle about the diagonal line. As a result, pattern light corresponding to the digital signal is formed. In other words, the spatial light modulator 820 has, for example, a portion (also referred to as a light emitting unit) having a plurality of micromirrors M1 as a plurality of regions (also referred to as light emitting regions) that emit light by reflection of light incident from the light source unit 80. ).

FIG. 5 is a schematic side view showing an example of the configuration of the first unit 850 in the exposure head 82 according to the first embodiment. As shown in FIG. 5, the first unit 850 has, for example, a reference unit 850b, a spatial light modulator 820, a first base unit 820b, an MLA unit 824, and a second base unit 824b.

The reference portion 850b is, for example, a portion that serves as a reference for the position of each portion constituting the first unit 850. In the first embodiment, the reference portion 850b includes, for example, the support frame 16 or another member fixed to the support frame 16. Other members may include, for example, the first storage box described above. Here, for example, if there is a lens moving portion that movably holds the second lens 12L (see FIG. 4) and the MLA portion 824 in the optical axis direction (Y-axis direction), the reference portion 850b has a lens moving portion. , The lens moving part may be included.

The first base portion 820b is, for example, in a state of being connected to the reference portion 850b and in a state of holding the spatial light modulator 820. In the example of FIG. 5, when viewed from the side in the −X direction, the first base portion 820b is in a state of extending from the reference portion 850b in the + Z direction (also referred to as the upward direction) opposite to the vertical direction. The spatial light modulator 820 is in a state of being held on one side by the first base portion 820b above the reference portion 850b (also referred to as a cantilever state). As a result, for example, the size of the first base portion 820b can be reduced, the material can be reduced, and the height of the exposure head 82 can be reduced. The first base portion 820b may be, for example, various members fixed to the reference portion 850b, or may be in a state of being integrally configured with the reference portion 850b.

Further, the first base portion 820b may hold the spatial light modulator 820 so that the relative position of the spatial light modulator 820 with respect to the reference portion 850b can be changed, for example. In this case, the first base unit 820b has, for example, a first drive unit 820d capable of moving the spatial light modulator 820 as a movable portion (also referred to as a movable portion). The first drive unit 820d is, for example, a mechanism for translating the spatial light modulator 820 along the X-axis direction (also referred to as a translation mechanism), a translation mechanism for translating the spatial light modulator 820 along the Z-axis direction, and the like. And a mechanism (also referred to as a rotation mechanism) for rotationally moving the spatial light modulator 820 about the optical axis 822p along the Y-axis direction. The translational mechanism is, for example, a linear motion mechanism such as a ball screw capable of converting a rotational force applied by a linear guide and a hexagon wrench into a force of a linear motion component, or a linear motion component automatically according to the application of an electric signal. It is realized by a configuration having a stepping motor or a piezoelectric element that generates the force of the above. The rotation mechanism is, for example, a mechanism capable of converting the force of a linear motion component applied by a rotary shaft, a bearing, and a linear motion mechanism such as a ball screw into a rotational force, or an automatic rotational force according to the application of an electric signal. It is realized by a configuration having a rotary motor and the like. Examples of the method of converting the linear motion component into the rotation component include a rack / spur gear method and a link mechanism method. The first drive unit 820d having such a configuration can adjust, for example, the relative positional relationship between the spatial light modulator 820 and the MLA unit 824.

<First imaging optical system 822>
The first imaging optical system 822 has a first lens barrel 8220 and a second lens barrel 8222. As shown in FIG. 4, the first lens barrel 8220 is in a state of holding the first lens 10L. The second lens barrel 8222 is in a state of holding the second lens 12L. The first lens 10L and the second lens 12L are located on the path of the pattern light formed by the spatial light modulator 820. As shown in FIG. 5A, for example, the optical axis 822p of the first imaging optical system 822 is located along the Y-axis direction. Here, the first lens 10L can, for example, arrange the pattern light output from each micromirror M1 of the spatial light modulator 820 into parallel light along the Y-axis direction and guide it to the second lens 12L. The first lens 10L may be composed of, for example, one lens or a plurality of lenses. The second lens 12L is, for example, an image-side telecentric lens, and can guide the pattern light from the first lens 10L to the MLA unit 824 in a state parallel to the optical axis 822p of the second lens 12L. Here, for the first imaging optical system 822, for example, a magnifying optical system that forms an image of the pattern light formed by the spatial light modulator 820 at a lateral magnification exceeding 1x (for example, about 2x) is applied. Will be done. In this case, for example, the radius of the second lens 12L is larger than the radius of the first lens 10L. The first lens barrel 8220 and the second lens barrel 8222 are located, for example, in a state of being directly or indirectly fixed to the support frame 16 via other members. Other members may include, for example, the first containment box described above.

<Microlens array section (MLA section) 824>
The MLA unit 824 has a microlens array (also referred to as MLA) 824a. This MLA824a has a plurality of microlenses ML1. In the MLA 824a of the first embodiment, the plurality of microlenses ML1 are positioned in a state of being integrally configured. The plurality of microlenses ML1 are located, for example, in a state of being arranged in a matrix so as to correspond to a plurality of micromirrors M1 as a plurality of light emitting regions in the spatial light modulator 820. In the first embodiment, a plurality of microlenses ML1 are located at predetermined pitches set in advance in each of the X-axis direction and the Z-axis direction. The microlens ML1 is located on the path of light emitted by each of the plurality of micromirrors M1 as the plurality of light emitting regions in the spatial light modulator 820. As a result, a spot for one pixel of the beam emitted by the micromirror M1 is formed in each of the plurality of microlenses ML1.

As shown in FIG. 5, the second base portion 824b is in a state of holding the MLA portion 824. The second base portion 824b is located, for example, in a state of being connected to the reference portion 850b. In the example of FIG. 5, when viewed from the side in the −X direction, the second base portion 824b is in a state of extending from the reference portion 850b in the + Z direction (also referred to as the upward direction) opposite to the vertical direction. The MLA unit 824 is held on one side by the second base unit 824b above the reference unit 850b (also referred to as a cantilever state). As a result, for example, the size of the second base portion 824b can be reduced, the material can be reduced, and the height of the exposure head 82 can be reduced. The second base portion 824b may be, for example, various members fixed to the reference portion 850b, or may be in a state of being integrally configured with the reference portion 850b.

Further, the second base unit 824b may hold the MLA unit 824 so that the relative position of the MLA unit 824 with respect to the reference unit 850b can be changed, for example. In this case, the second base unit 824b has, for example, a second drive unit 824d capable of moving the MLA unit 824 as a movable unit. The second drive unit 824d has, for example, a translation mechanism that translates the MLA unit 824 along the X-axis direction, a translation mechanism that translates the MLA unit 824 along the Z-axis direction, and an optical axis along the Y-axis direction. A rotation mechanism for rotating and moving the MLA unit 824 around 822p is included. The translational mechanism is, for example, a linear motion mechanism such as a ball screw capable of converting a rotational force applied by a linear guide and a hexagon wrench into a force of a linear motion component, or a linear motion component automatically according to the application of an electric signal. It is realized by a configuration having a stepping motor or a piezoelectric element that generates the force of the above. The rotation mechanism is, for example, a mechanism capable of converting the force of a linear motion component applied by a rotary shaft, a bearing, a linear motion mechanism such as a ball screw, etc. into a rotational force, or a mechanism that automatically rotates according to the application of an electric signal. It is realized by a configuration having a rotary motor that generates force and the like. The second drive unit 824d having such a configuration can adjust, for example, the relative positional relationship between the spatial light modulator 820 and the MLA unit 824.

FIG. 6A is a schematic front view showing an example of the configuration of the MLA unit 824 according to the first embodiment. As shown in FIG. 6A, the MLA unit 824 is effective, for example, in a region including a plurality of microlenses ML1 (also referred to as an effective region) Ar1 and a direction perpendicular to the optical axis of the plurality of microlenses ML1. It has a region (also referred to as an ineffective region) Ar2 located outside the region Ar1. The effective domain Ar1 is, for example, a region used for forming the pattern light to irradiate the substrate W in the MLA unit 824. Each microlens ML1 has, for example, an optical axis parallel to the optical axis 822p of the first imaging optical system 822. Here, the spatial light modulator 820 has the same number of micromirrors M1 as the plurality of microlenses ML1 included in the effective region Ar1 of the MLA unit 824. Here, the plurality of microlenses ML1 in the effective region Ar1 condense the light from the plurality of micromirrors M1 of the DMD, so that the spot array 824SA is composed of a plurality of spots of light (also referred to as condensing spots). To form. Here, the arrangement and pitch of the focused spots in the spot array 824SA correspond to the arrangement and pitch of the plurality of microlenses ML1 in the MLA 824a. In the first embodiment, for example, the first imaging optical system 822 magnifies the pattern light of about 20 mm × 10 mm formed by the spatial light modulator 820 by about twice, so that the image size of the MLA 824a is about 40 mm. A spot array 824SA having a size of × 20 mm is formed. Here, since the light from each of the micromirrors M1 of the DMD is focused by the microlens ML1 of the effective region Ar1, the size of the spot for one pixel connected by the light from each micromirror M1 is narrowed down and kept small. Dripping. Therefore, the sharpness of the image (DMD image) projected on the substrate W can be kept high.

By the way, in the first embodiment, the spatial light modulator 820 serves as a light emitting region for adjustment (also referred to as a light emitting region for adjustment) in addition to the plurality of micromirrors M1 corresponding to the plurality of microlenses ML1 in the effective region Ar1. It has one or more micromirrors (also referred to as adjustment micromirrors) M1r (see FIG. 5). The adjusting micromirror M1r can irradiate the ineffective region Ar2 of the MLA unit 824 with the light emitted by the reflection of the adjusting micromirror M1r. As a result, the light emitted from the adjustment micromirror M1r and irradiating the ineffective region Ar2 forms a spot for adjustment light for one pixel (also referred to as an adjustment light spot) S1r (see FIG. 7). obtain.

Further, as shown in FIG. 6A, the MLA unit 824 has an adjustment mark (also referred to as an adjustment mark) Mk1 in the non-effective region Ar2. In other words, the ineffective region Ar2 includes the adjustment mark Mk1. Here, for example, if a plurality of microlenses ML1 and an adjustment mark Mk1 are located on the MLA unit 824a, the alignment of the plurality of microlenses ML1 and the adjustment mark Mk1 is easy. In the first embodiment, among the non-effective regions Ar2, adjustment marks Mk1 are present in the vicinity of the four corners of the effective region Ar1. In other words, there are four adjustment marks Mk1. In the example of FIG. 6A, the four adjustment marks Mk1 are the first adjustment mark Mk1a, the second adjustment mark Mk1b, the third adjustment mark Mk1c, and the fourth adjustment mark. Includes Mk1d and. The first adjustment mark Mk1a is located on the + Z direction side of the effective region Ar1 and near the corner on the + X direction side. The second adjustment mark Mk1b is located on the + Z direction side of the effective region Ar1 and near the corner on the −X direction side. The third adjustment mark Mk1c is located on the −Z direction side and in the vicinity of the corner on the −X direction side of the effective region Ar1. The fourth adjustment mark Mk1d is located on the side in the −Z direction and near the corner on the side in the + X direction in the effective region Ar1. When the MLA unit 824 has four adjustment marks Mk1, the spatial light modulator 820 has four adjustment micromirrors M1r.

Then, for example, for each of the four adjustment marks Mk1, the light emitted from the corresponding adjustment micromirror M1r among the four adjustment micromirrors M1r and irradiating the ineffective region Ar2 is used for adjustment. The light spot S1r is formed. Specifically, for example, with respect to the first adjustment mark Mk1a, the light emitted from the first adjustment micromirror M1r as the first adjustment light emitting region and irradiating the ineffective region Ar2 is emitted. The first adjustment light spot S1r is formed. With respect to the second adjustment mark Mk1b, the light emitted from the second adjustment micromirror M1r as the second adjustment light emitting region and irradiating the ineffective region Ar2 is the second adjustment light spot. Form S1r. With respect to the third adjustment mark Mk1c, the light emitted from the third adjustment micromirror M1r and irradiating the ineffective region Ar2 forms the third adjustment light spot S1r. With respect to the fourth adjustment mark Mk1d, the light emitted from the fourth adjustment micromirror M1r and irradiating the ineffective region Ar2 forms the fourth adjustment light spot S1r. Each adjustment mark Mk1 is located in or near the region of the ineffective region Ar2 where the adjustment light spot is formed by the adjustment micromirror M1r.

The adjustment mark Mk1 has a property that the light transmission state is different from that of the surrounding portion of the ineffective region Ar2, for example. Specifically, for example, a film (also referred to as a light-shielding film) that blocks the transmission of light located on the surface portion of the MLA portion 824 or the like is applied to the adjustment mark Mk1. For the light-shielding film, for example, a thin film made of metal or resin having a light-shielding property is applied. Here, for example, when a metal thin film is applied to the light-shielding film, the light-shielding film can be easily thinned by various film forming methods such as sputtering, and the shape of the light-shielding film can be patterned in various ways. It is easily realized by a film forming method and etching. Chromium, nickel, aluminum, etc. are applied to the material of the thin film made of metal. Further, the light-shielding film may be located in a portion of the effective region Ar1 other than the plurality of microlenses ML1, or may be located in a region along the outer peripheral portion of each microlens ML1. In this case, for example, when the MLA unit 824a is viewed in a plan view in the + Y direction along the optical axis 822p, the light-shielding film is positioned so as to surround each microlens ML1.

FIG. 6B is a schematic front view showing an example of the configuration of the adjustment mark Mk1 in the MLA unit 824 according to the first embodiment. As shown in FIG. 6B, in the first embodiment, the adjustment mark Mk1 has, for example, a light-shielding film pattern Pt1. In the example of FIG. 6B, the pattern Pt1 is in a state of forming four portions (also referred to as window portions) W1 in which the light-shielding film does not exist. Each window portion W1 has, for example, a shape and a size corresponding to the adjustment light spot S1r for one pixel. Each window portion W1 has, for example, a square shape. The four window portions W1 are located in a state of being arranged in a matrix so that the two window portions W1 are arranged along the X-axis direction and the two window portions W1 are arranged along the Z-axis direction. Thereby, the pattern Pt1 includes a cross-shaped portion (also referred to as a cross-shaped portion) located between the four window portions W1. Here, the four window portions W1 are matrixes offset by half a predetermined pitch in each of the X-axis direction and the Z-axis direction with respect to the positions of the plurality of microlenses ML1 arranged in a matrix in the effective region Ar1. It exists in a similar position.

FIG. 7 is a schematic front view showing an example of the adjustment mark Mk1 and the adjustment optical spot S1r according to the first embodiment. When the adjustment mark Mk1 shown in FIG. 6B is adopted, as shown in FIG. 7, the pattern Pt1 of the adjustment mark Mk1 is a part of the sensor unit 850 of the adjustment optical spot S1r. It is possible to block the passage of light toward. Here, for example, in a state where the relative positional deviation (also referred to as positional deviation) between the spatial light modulator 820 and the MLA unit 824 does not occur, the first reference position Cn1 of the adjustment optical spot S1r and the first reference position Cn1. Matches with the second reference position Cn2 of the pattern Pt1. Here, for example, the center position of the adjusting light spot S1r is adopted as the first reference position Cn1, and the center position of the cross portion of the pattern Pt1 is adopted as the second reference position Cn2. Then, in a state where the relative positional deviation between the spatial light modulator 820 and the MLA unit 824 occurs, the first reference position Cn1 and the second reference position Cn2 are displaced according to the relative positional deviation.

<Second imaging optical system 826>
The second imaging optical system 826 is located, for example, on the path of light emitted from the plurality of microlenses ML1 in the MLA unit 824. The second imaging optical system 826 has, for example, a first lens barrel 8260 and a second lens barrel 8262. The first lens barrel 8260 is in a state of holding, for example, the first lens 20L. The second lens barrel 8262 is in a state of holding, for example, the second lens 22L. The first lens 20L and the second lens 22L are, for example, in a state of being fixed to the support frame 16 at a required interval in the Z-axis direction. More specifically, the first lens barrel 8260 and the second lens barrel 8262 are integrally connected by, for example, a connecting member, and the distance between these lens barrels is kept constant. As the connecting member, for example, a housing for accommodating the first lens barrel 8260 and the second lens barrel 8262 is adopted. The first lens 20L may be composed of one lens or may be composed of a plurality of lenses.

The second imaging optical system 826 is, for example, bilateral telecentric. For example, if the image side of the second imaging optical system 826 is telecentric, the size of the image of the pattern light becomes constant even if the position of the photosensitive material of the substrate W shifts in the optical axis direction of the pattern light, and the height is high. Exposure with accuracy is possible. Here, for example, if the object side of the second imaging optical system 826 is also telecentric, the second lens 12L and the MLA unit 824 of the first imaging optical system 822 can move in the optical axis direction. However, it is possible to expose the photosensitive material of the substrate W while maintaining the size of the image of the pattern light on the image side of the second imaging optical system 826.

For the second lens 22L of the second imaging optical system 826, for example, a magnifying optical system that magnifies and forms an image of pattern light at a lateral magnification exceeding 1x (for example, about 3x) is applied. At this time, the radius of the second lens 22L is larger than the radius of the first lens 20L. Therefore, for example, the spot array 824SA is magnified about 3 times by the second imaging optical system 826 to have a size of about 120 mm × 60 mm, and is formed on the upper surface (also referred to as the photosensitive material surface) of the photosensitive material of the substrate W. It is projected. This photosensitive material surface is a surface (also referred to as a projection surface) FL1 on which pattern light is projected by the exposure head 82.

<Projection of patterned light by the exposure head 82>
According to the exposure head 82 according to the first embodiment having the above configuration, the pattern light formed by the DMD as the spatial light modulator 820 is the first imaging optical system 822, the MLA unit 824, and the second imaging optics. It is projected onto the substrate W via the system 826. Then, the pattern light formed by the DMD is continuously changed by the reset pulse generated based on the encoder signal of the main scanning mechanism 55 as the stage 4 is moved by the main scanning mechanism 55. As a result, the pattern light is applied to the photosensitive material surface (projection surface FL1) of the substrate W, and a striped image is formed (see FIG. 9).

Here, for example, there may be a lens moving unit that movably holds the second lens 12L and the MLA unit 824 of the first imaging optical system 822 in the optical axis direction (here, the Y-axis direction). The lens moving part may be configured with, for example, a moving plate, a pair of guide rails and a moving drive part. For example, the pair of guide rails is located, for example, on the support frame 16. The moving plate is, for example, a member formed in the shape of a rectangular plate and is located on a guide rail. The second lens barrel 8222 and the MLA portion 824 are, for example, positioned on the upper surface of the moving plate in a state of being fixed at a required interval in the Y-axis direction. At this time, for example, the moving plate can move along the Y-axis direction while being guided by the pair of guide rails by receiving the driving force from the moving driving unit. As a result, the second lens 12L and the MLA unit 824 can move in the direction toward the first lens 10L (−Y direction) and the direction away from the first lens 10L (+ Y direction). The mobile drive unit is composed of, for example, a linear motor type drive unit or a ball screw type drive unit. This moving drive unit can move the moving plate based on, for example, a control signal from the control unit 9.

As described above, for example, if the second lens 12L and the MLA unit 824 are movable in the optical axis direction (Y-axis direction), the measuring instrument 84 may be present as shown in FIG. The measuring instrument 84 can measure the separation distance between the exposure head 82 and the photosensitive material surface (projection surface FL1) as the surface of the substrate W. The measuring instrument 84 may be arranged, for example, at the lower end of the second lens barrel 8262, at a position away from the second imaging optical system 826, or on the support frame 16. The measuring device 84 has, for example, an irradiator 840 that irradiates the substrate W with laser light, and a light receiver 842 that receives the laser light reflected by the substrate W. The irradiator 840 irradiates the upper surface of the substrate W with laser light, for example, along an axis inclined at a predetermined angle with respect to the normal direction (here, the Z-axis direction) with respect to the surface of the substrate W. The receiver 842 has, for example, a line sensor extending in the Z-axis direction, and can detect the incident position of the laser beam reflected on the upper surface of the substrate W on the line sensor. Thereby, for example, the separation distance between the exposure head 82 and the photosensitive material surface (projection surface FL1) of the substrate W can be measured. The control unit 9 can adjust the image formation position (focus position) in the optical axis direction of the pattern light output by the exposure head 82 according to the signal related to the separation distance detected by the measuring instrument 84. In this case, for example, the control unit 9 outputs a control signal to the lens moving unit to move the moving plate, thereby moving the second lens 12L and the MLA unit 824 of the second lens barrel 8222 along the Y-axis direction. Can be moved.

Here, for example, if the measuring instrument 84 is close to the position where the pattern light output from the second imaging optical system 826 on the photosensitive material surface (projection surface FL1) of the substrate W is irradiated, the exposure is performed. Immediately before or almost at the same time as the exposure, the fluctuation of the height of the photosensitive material surface (projection surface FL1) of the substrate W can be measured. At this time, for example, the focus position of the pattern light can be adjusted by the control unit 9 based on the measurement result. Further, for example, the height of each portion of the photosensitive material surface (projection surface FL1) of the substrate W is measured before exposure, and the control unit 9 adjusts the focus position at the timing when the exposure head 82 exposes each portion. You may.

<Sensor unit 850>
The sensor unit 850 includes, for example, an optical system 851 and a sensor 852. The optical system 851 and the sensor 852 can be located, for example, on the path of light emitted from the spatial light modulator 820 and passing through the region including the adjustment mark Mk1 in the ineffective region Ar2 of the MLA unit 824. It is arranged like this. Specifically, for example, as shown in FIGS. 3 and 4, a surface on which the projection surface FL1 on which the pattern light is projected by the exposure head 82 when the exposure head 82 irradiates the substrate W with the pattern light is located. When the virtual reference surface is used, the sensor unit 850 can be located on the opposite side of the exposure head 82 with the virtual reference surface interposed therebetween. The sensor unit 850 may be arranged, for example, on the base 15 so as to be located directly below the exposure head 82 with the stage 4 retracted from directly below the exposure unit 8. The sensor unit 850 is held by the base 15 in a movable state along the upper surface of the base 15, for example. The sensor unit 850 has a configuration that can be moved in the X-axis direction and the Y-axis direction along the upper surface of the base 15 by, for example, a combination of a linear motor, a linear guide, and a plate.

The optical system 851 includes, for example, an objective lens and an imaging lens. For the objective lens, for example, a lens having an appropriate magnification is applied. The imaging lens can form, for example, light incident from the subject through the objective lens on the sensor 852. In the first embodiment, the optical system 851 can form an image of light emitted from the ineffective region Ar2 of the MLA unit 824 on the light receiving surface of the sensor 852, for example. For example, an area sensor or the like is applied to the sensor 852. The area sensor is, for example, a state in which a plurality of light receiving elements arranged along the X-axis direction as the first direction and a state in which the area sensors are arranged along the Y-axis direction as the second direction intersecting the first direction. It has a plurality of light receiving elements in the above. For example, an image pickup device such as a CCD is applied to the area sensor. The first direction and the second direction in the area sensor may have a relationship of intersecting at different angles (for example, 60 °) without being orthogonal to each other. In other words, the area sensor may have, for example, a plurality of light receiving elements in a two-dimensionally arranged state. Further, the sensor unit 850 may have, for example, an illumination unit (also referred to as a coaxial illumination unit) 853 pseudo-arranged on the optical axis of the optical system 851. Thereby, for example, the sensor unit 850 can capture the subject (adjustment mark Mk1 or the like) located in a dark place with high accuracy while illuminating the subject by the coaxial illumination unit 853. For example, a laser light emitting diode (LED) as a light source, a collimating lens, a half mirror, or the like is applied to the coaxial illumination unit 853.

The sensor unit 850 is, for example, a plurality of light in the spatial light modulator 820 on the path of light emitted from the spatial light modulator 820 and passing through the region including the adjustment mark Mk1 in the ineffective region Ar2 of the MLA unit 824. Relative position of the adjustment light spot S1r formed by the light emitted from the adjustment micromirror M1r and irradiating the ineffective region Ar2 among the adjustment micromirrors M1 and the adjustment mark Mk1 of the MLA unit 824. It is possible to output the signal related to the relationship.

Here, for example, when the sensor unit 850 is irradiating the ineffective region Ar2 from the adjustment micromirror M1r, the sensor unit 850 images the adjustment light spot S1r, and the adjustment micromirror M1r becomes the ineffective region Ar2. It is assumed that the adjustment mark Mk1 is imaged when the beam is not irradiated. In this case, the sensor unit 850 captures the signal related to the first image that captures the adjustment optical spot S1r including the first reference position Cn1 and the adjustment mark Mk1 including the second reference position Cn2. It is possible to output a signal related to the image of. The relative relationship between the position of the adjustment light spot S1r in the first image and the position of the adjustment mark Mk1 in the second image is the relative position between the adjustment light spot S1r and the adjustment mark Mk1. Correspond to the relationship. Therefore, the sensor unit 850 has a relative positional relationship between the adjustment optical spot S1r and the adjustment mark Mk1 due to the output of the signal related to the first image and the output of the signal related to the second image. Such a signal can be output.

In the first embodiment, the sensor unit 850 can be moved along the base 15 to a position where each adjustment mark Mk1 can be imaged, and the MLA unit 824 has four adjustment marks. Mark Mk1 is present. Therefore, for example, the sensor unit 850 outputs a signal relating to the relative positional relationship (also referred to as the first relative positional relationship) between the first adjustment optical spot S1r and the first adjustment mark Mk1a. can do. The sensor unit 850 can output a signal relating to the relative positional relationship (also referred to as the second relative positional relationship) between the second adjustment optical spot S1r and the second adjustment mark Mk1b. The sensor unit 850 can output a signal relating to the relative positional relationship (also referred to as the third relative positional relationship) between the third adjustment optical spot S1r and the third adjustment mark Mk1c. The sensor unit 850 can output a signal relating to the relative positional relationship (also referred to as the fourth relative positional relationship) between the fourth adjustment optical spot S1r and the fourth adjustment mark Mk1d.

In this way, the exposure apparatus 10 can obtain information on the relative positional relationship between the adjustment light spot S1r and the adjustment mark Mk1 in the MLA unit 824, for example, by the sensor unit 850. Therefore, the exposure apparatus 10 is affected by manufacturing errors such as magnification error and aberration in the second imaging optical system 826 located between the MLA unit 824 and the photosensitive material of the substrate W, for example. It is possible to obtain information on the relative positional relationship between the spatial light modulator 820 and the MLA unit 824. Thereby, for example, the accuracy of alignment required for the sensor unit 850 can be reduced. Then, for example, by moving at least one of the spatial light modulator 820 and the MLA unit 824 according to the information related to the relative positional relationship between the adjustment optical spot S1r and the adjustment mark Mk1 in the MLA unit 824. The relative positional deviation between the spatial light modulator 820 and the MLA unit 824 can be reduced. Further, for example, if the sensor unit 850 is relatively movable with respect to the plurality of exposure heads 82 even if there is a magnification error and aberration in the second imaging optical system 826, the sensor unit 850 is an MLA unit. It is possible to capture the relative positional relationship between the adjustment optical spot S1r and the adjustment mark Mk1 in 824. As a result, for example, the exposure accuracy related to the two-dimensional pattern in the exposure apparatus 10 can be easily improved.

Here, for example, it is assumed that the size of the adjustment light spot S1r is about 60 μm × 60 μm, and the line width of the cross portion of the adjustment mark Mk1 is about 6 μm. In this case, for example, if the first reference position Cn1 and the second reference position Cn2 match, the adjustment optical spot S1r seen from the sensor unit 850 side has each window portion W1 due to the presence of the cross portion. Has a size of about 27 μm × 27 μm. Here, for example, it is assumed that the magnification of the objective lens is 20 times, the size of the light receiving surface of the area sensor is 8.4 mm × 7.0 mm, and the arrangement pitch of the light receiving elements is 3.45 μm. .. At this time, in the sensor unit 850, the observation field of view in the MLA unit 824 is 420 μm × 350 μm, and the size of the minute portion in the MLA unit 824 captured by one pixel of the image obtained by imaging is about 0.173 μm × 0.173 μm. Become. That is, the resolution of the sensor unit 850 is 0.173 μm. Therefore, in the image obtained by the image taken by the sensor unit 850, the information related to the relative positional relationship between the adjustment light spot S1r and the adjustment mark Mk1 is captured with sufficient accuracy. Further, here, for example, even if the adjustment optical spot S1r expands and contracts by several tens of μm when viewed from the sensor unit 850 side due to a magnification error and aberration of the second imaging optical system 826, the sensor unit 850 Can easily obtain an image that captures the adjustment optical spot S1r due to the wide observation field of view. Therefore, it is not necessary to perform complicated and highly accurate positioning of the sensor unit 850.

Then, for example, the sensor unit 850 having the area sensor has a relative positional relationship between the adjustment light spot S1r and the adjustment mark Mk1 regardless of the direction of deviation between the adjustment light spot S1r and the adjustment mark Mk1. Such a signal can be acquired. As a result, for example, in the exposure apparatus 10, the exposure accuracy related to the two-dimensional pattern can be easily improved.

By the way, for example, when the exposure apparatus 10 has a plurality of exposure heads 82, the exposure apparatus 10 is relative to the position of the pattern light irradiated on the projection surface FL1 by each exposure head 82 and the stage 4. It is assumed that the sensor (also referred to as a measurement sensor) for measuring the positional relationship is provided. According to this measurement sensor, the relative positional relationship of the plurality of pattern lights emitted by the plurality of exposure heads 82 can be grasped. Here, for example, the measurement sensor may capture a plurality of exposure heads 82 through a transparent glass plate to which a chart is attached. In this case, for example, if the measurement sensor is also used as the sensor unit 850, the size and complexity of the exposure apparatus 10 can be reduced. As a result, an increase in the manufacturing cost of the exposure apparatus 10 can be reduced.

<Control unit 9>
FIG. 8 is a block diagram showing an example of bus wiring of the exposure apparatus 10 according to the first embodiment. The control unit 9 includes a central processing unit (CPU) 90, a read-only memory (ROM) 92, a RAM (Random Access Memory) 94, and a storage unit 96. The CPU 90 has a function as an arithmetic circuit. The RAM 94 has a function as a temporary working area of the CPU 90. For example, a non-volatile recording medium is applied to the storage unit 96.

The control unit 9 is, for example, an exposure device 10 such as a rotation mechanism 51, a sub-scanning mechanism 53, a main scanning mechanism 55, a light source unit 80 (for example, a light source driver), a spatial light modulator 820, a measuring instrument 84, and a sensor unit 850. It is connected to each component by bus wiring, network line, serial communication line, etc., and controls the operation of various components. These components may include, for example, a lens moving portion that holds the second lens 12L and the MLA portion 824 so as to be movable in the optical axis direction (Y-axis direction).

The CPU 90 performs operations on various data stored in the RAM 94 or the storage unit 96 by executing the program 920 stored in the ROM 92 while reading the program 920. The control unit 9 has, for example, a general computer configuration. The drawing control unit 900 and the positional relationship recognition unit 910 are functional elements realized by operating the CPU 90 according to the program 920. Some or all of these elements may be realized, for example, in a logic circuit. Here, for example, the drawing control unit 900 can irradiate the upper surface of the substrate W with pattern light (drawing light) by controlling the operation of various components connected to the control unit 9. The positional relationship recognition unit 910 determines the relative positional relationship between the adjustment mark Mk1 of the MLA unit 824 and the adjustment optical spot S1r, for example, based on the signal related to the image obtained by the image captured by the sensor unit 850. Can be recognized.

The storage unit 96 stores, for example, pattern data 960 indicating a pattern to be drawn on the substrate W. For example, image data obtained by expanding vector format data created by CAD software into raster format data is applied to the pattern data 960. The control unit 9 can modulate the light beam output from the exposure head 82 by controlling the DMD of the spatial light modulator 820 based on the pattern data 960, for example. In the exposure apparatus 10, for example, a modulation reset pulse can be generated based on the linear scale signal sent from the linear motor 551 of the main scanning mechanism 55. The pattern light modulated according to the position of the substrate W can be output from each exposure head 82 by the DMD of the spatial light modulator 820 that operates based on this reset pulse. In the first embodiment, the pattern data 960 may, for example, indicate a single image (an image showing a pattern to be formed on the entire surface of the substrate W), or each of the single images. The exposure head 82 may individually show an image of a portion in charge of drawing.

For example, a display unit 980 and an operation unit 982 are connected to the control unit 9. For example, a general CRT monitor or a liquid crystal display is applied to the display unit 980, and the display unit 980 can display images related to various data. Here, for example, the display unit 980 visually displays the data related to the relative positional relationship between the adjustment mark Mk1 of the MLA unit 824 and the adjustment optical spot S1r as the recognition result in the positional relationship recognition unit 910. Can be displayed. The operation unit 982 is composed of, for example, at least one of various buttons, various keys, a mouse, and a touch panel, and is operated when the operator inputs various commands to the exposure apparatus 10. For example, when the operation unit 982 includes a touch panel, the operation unit 982 may have a part or all of the functions of the display unit 980.

FIG. 9 is a schematic perspective view showing an example of a plurality of exposure heads 82 performing pattern exposure. As shown in FIG. 9, the plurality of exposure heads 82 are located, for example, in a state of being linearly arranged along a plurality of rows (here, two rows). At this time, the exposure head 82 in the second row is located between the two exposure heads 82 in the adjacent first row, for example, in the sub-scanning direction (X-axis direction). In other words, the plurality of exposure heads 82 are arranged in a staggered manner. The exposure area 82R of each exposure head 82 has a rectangular shape having a short side along the main scanning direction (Y-axis direction). As the stage 4 moves in the Y-axis direction, a band-shaped exposed region 8R is formed on the photosensitive material of the substrate W for each exposure head 82. Here, as described above, for example, if the plurality of exposed heads 82 have a staggered arrangement or the like, the strip-shaped exposed regions 8R can be arranged without a gap in the X-axis direction. If the strip-shaped exposed areas 8R are arranged so as to be arranged without gaps in the X-axis direction, it is not necessary to move the stage 4 in the sub-scanning direction (X-axis direction), so that the sub-scanning mechanism 53 becomes unnecessary. The arrangement of the plurality of exposure heads 82 is not limited to that shown in FIG. For example, a plurality of exposure heads 82 may be arranged so that a gap of several times the length of the long side of the exposure area 82R is naturally formed between the adjacent exposed regions 8R. In this case, for example, the exposure apparatus 10 performs the main scan in the Y-axis direction a plurality of times while shifting the length of the long side of the exposure area 82R in the X-axis direction, so that the photosensitive material of the substrate W has a plurality of strips. The exposed area 8R can be formed without a gap.

<Recognizing the relative positional relationship between the spatial light modulator and the MLA section>
10 (a) to 11 (b) are diagrams for explaining a method of recognizing the relative positional relationship between the spatial light modulator 820 and the MLA unit 824 by the positional relationship recognition unit 910. FIG. 10A shows an image Im1a captured by an image taken by the sensor unit 850 of the first adjustment optical spot S1r via the first adjustment mark Mk1a according to the first embodiment. FIG. 10B shows an image Im2a that captures the first adjustment mark Mk1a according to the first embodiment. FIG. 11A shows an image Im1b in which the second adjustment optical spot S1r is captured by the sensor unit 850 via the second adjustment mark Mk1b according to the first embodiment. FIG. 11B shows an image Im2b that captures the second adjustment mark Mk1b according to the first embodiment.

For example, the sensor unit 850 captures a first adjustment light spot S1r formed by irradiating the first adjustment mark Mk1a of the MLA unit 824 with a beam by the first adjustment micromirror M1r. This makes it possible to acquire the image Im1a. At this time, the coaxial illumination unit 853 does not have to illuminate the MLA unit 824. On the other hand, for example, the sensor unit 850 does not irradiate the MLA unit 824 with the beam by the spatial light modulator 820, and the coaxial illumination unit 853 illuminates the first adjustment mark Mk1a for the first adjustment. By imaging the mark Mk1a, the image Im2a can be acquired. Further, for example, the sensor unit 850 provides a second adjustment optical spot S1r formed by irradiating the second adjustment mark Mk1b of the MLA unit 824 with a beam by the second adjustment micromirror M1r. The image Im1b can be acquired by taking an image. At this time, the coaxial illumination unit 853 does not have to illuminate the MLA unit 824. On the other hand, for example, the sensor unit 850 does not irradiate the MLA unit 824 with the beam by the spatial light modulator 820, and the coaxial illumination unit 853 illuminates the second adjustment mark Mk1b for the second adjustment. By imaging the mark Mk1b, the image Im2b can be acquired.

Here, the positional relationship recognition unit 910 recognizes, for example, the first relative positional relationship between the image Im1a and the image Im2a between the first adjustment light spot S1r and the first adjustment mark Mk1a. can do. Further, the positional relationship recognition unit 910 recognizes, for example, a second relative positional relationship between the image Im1b and the image Im2b between the second adjustment optical spot S1r and the second adjustment mark Mk1b. be able to.

Specifically, for example, for the image Im1a, the coordinates (Xa, Ya) of the position (also referred to as the first A corresponding reference position) Cn1a corresponding to the first reference position Cn1 of the first adjustment light spot S1r can be obtained. can. Here, for example, in the image Im1a, the four corners C1a, C2a, C3a, and C4a of the region in which the first adjustment optical spot S1r is captured are detected by using image processing such as pattern matching, and the four corners are detected. The coordinates (Xa, Ya) can be obtained by calculating the average of the coordinates of C1a, C2a, C3a, and C4a. Further, for example, with respect to the image Im2a, the coordinates (XAa, YAa) of the position (also referred to as the second A corresponding reference position) Cn2a corresponding to the second reference position Cn2 of the first adjustment mark Mk1a can be obtained. Here, for example, in the image Im2a, the coordinates (XAa, YAa) can be obtained by detecting the second A corresponding reference position Cn2a corresponding to the second reference position Cn2 by using image processing such as pattern matching. Then, the deviation between the coordinates (Xa, Ya) of the first A corresponding reference position Cn1a corresponding to the first reference position Cn1 and the coordinates (XAa, YYAa) of the second A corresponding reference position Cn2a corresponding to the second reference position Cn2. Can be recognized. The deviation between the coordinates (Xa, Ya) and the coordinates (XAa, YAa) corresponds to the first relative positional relationship between the first adjustment light spot S1r and the first adjustment mark Mk1a. Here, for example, the deviation of the coordinates on the image may be converted into the first relative positional relationship relating to the first adjustment light spot S1r and the first adjustment mark Mk1a in the real space.

Further, for example, with respect to the image Im1b, the coordinates (Xb, Yb) of the position (also referred to as the first B corresponding reference position) Cn1b corresponding to the first reference position Cn1 of the second adjustment light spot S1r can be obtained. Here, for example, in the image Im1b, the four corners C1b, C2b, C3b, and C4b of the region in which the second adjustment optical spot S1r is captured are detected by using image processing such as pattern matching, and the four corners are detected. The coordinates (Xb, Yb) can be obtained by calculating the average of the coordinates of C1b, C2b, C3b, and C4b. Further, for example, with respect to the image Im2b, the coordinates (XAb, YAb) of the position (also referred to as the second B corresponding reference position) Cn2b corresponding to the second reference position Cn2 of the second adjustment mark Mk1b can be obtained. Here, for example, in the image Im2b, the coordinates (XAb, YAb) can be obtained by detecting the second B corresponding reference position Cn2b corresponding to the second reference position Cn2 by using image processing such as pattern matching. Then, the deviation between the coordinates (Xb, Yb) of the first B corresponding reference position Cn1b corresponding to the first reference position Cn1 and the coordinates (XAb, YAb) of the second B corresponding reference position Cn2b corresponding to the second reference position Cn2. Can be recognized. The deviation between the coordinates (Xb, Yb) and the coordinates (XAb, YAb) corresponds to the second relative positional relationship between the second adjustment light spot S1r and the second adjustment mark Mk1b. Here, for example, the deviation of the coordinates on the image may be converted into a second relative positional relationship relating to the second adjustment light spot S1r and the second adjustment mark Mk1b in the real space.

In the first embodiment, the positional relationship recognition unit 910 recognizes, for example, the first relative positional relationship and the second relative positional relationship as described above, thereby recognizing the spatial light modulator 820 and the MLA unit. The relative positional relationship with 824 can be recognized.

<Reduction of relative positional deviation between the spatial light modulator and the MLA section>
For example, imaging by the sensor unit 850, recognition of the relative positional relationship between the spatial light modulator 820 and the MLA unit 824 by the positional relationship recognition unit 910, and the relative position between the spatial light modulator 820 and the MLA unit 824. By adjusting the relationship alternately, it is possible to reduce the relative positional deviation between the spatial light modulator 820 and the MLA unit 824.

In the examples of FIGS. 10A and 10B, the first adjustment light spot S1r is displaced in the −Z direction (downward) with respect to the first adjustment mark Mk1a. On the other hand, in the examples of FIGS. 11A and 11B, the second adjustment light spot S1r is displaced in the + Z direction (upward direction) with respect to the second adjustment mark Mk1b. Therefore, in the example of FIGS. 10A to 11B, the pattern light emitted from the spatial light modulator 820 toward the MLA unit 824 is along the Y-axis direction with the MLA unit 824 as a reference. The first imaging optical system 822 is displaced in the rotational direction about the optical axis 822p. In other words, the spatial light modulator 820 and the MLA unit 824 have a positional relationship that is relatively displaced in the rotation direction about the optical axis 822p.

In such a case, for example, the rotational direction around the optical axis 822p is caused by at least one of the rotational movement of the spatial light modulator 820 by the first drive unit 820d and the rotational movement of the MLA unit 824 by the second drive unit 824d. The relative positional deviation between the spatial light modulator 820 and the MLA unit 824 in the above can be reduced. Here, for example, as the difference between (Ya-YAa) and (Yb-YAb) becomes smaller, the relative positional deviation between the spatial light modulator 820 and the MLA unit 824 in the rotation direction about the optical axis 822p. Becomes smaller. Then, if the relationship of (Ya-YAa) = (Yb-YAb) is established, there is no relative positional deviation between the spatial light modulator 820 and the MLA unit 824 in the rotation direction about the optical axis 822p. Become.

In the first embodiment, as described above, for example, the sensor unit 850 outputs a signal relating to the relative positional relationship between the adjustment optical spot S1r and the adjustment mark Mk1 at two or more locations. Therefore, the positional relationship recognition unit 910 can recognize the relative positional deviation between the spatial light modulator 820 and the MLA unit 824 including the rotation direction. As a result, the spatial light modulator 820 and the MLA unit 824 are arranged according to the relative positional deviation including the rotation direction between the spatial light modulator 820 and the MLA unit 824 recognized by the positional relationship recognition unit 910. It is possible to reduce the relative misalignment of. As a result, for example, the exposure accuracy related to the two-dimensional pattern in the exposure apparatus 10 can be improved.

Further, for example, the X-axis is caused by at least one of the translational movement of the spatial light modulator 820 along the X-axis direction by the first drive unit 820d and the translational movement of the MLA unit 824 by the second drive unit 824d along the X-axis direction. It is possible to reduce the relative positional deviation between the spatial light modulator 820 and the MLA unit 824 in the direction. Here, for example, the smaller the difference between Xa and XAa and the difference between Xb and XAb, the smaller the relative positional deviation between the spatial light modulator 820 and the MLA unit 824 in the X-axis direction. Then, if the relationship of Xa = XAa and Xb = XAb is established, there is no relative positional deviation between the spatial light modulator 820 and the MLA unit 824 in the X-axis direction.

Further, for example, the Z-axis is caused by at least one of the translational movement of the spatial light modulator 820 along the Z-axis direction by the first drive unit 820d and the translational movement of the MLA unit 824 by the second drive unit 824d along the Z-axis direction. It is possible to reduce the relative positional deviation between the spatial light modulator 820 and the MLA unit 824 in the direction. Here, for example, the smaller the difference between Ya and YAa and the difference between Yb and YAb, the smaller the relative positional deviation between the spatial light modulator 820 and the MLA unit 824 in the Z-axis direction. Then, if the relationship of Ya = YAa and Yb = YAb is established, there is no relative positional deviation between the spatial light modulator 820 and the MLA unit 824 in the Z-axis direction.

<Summary of the first embodiment>
As described above, according to the exposure apparatus 10 according to the first embodiment, for example, information on the relative positional relationship between the adjustment light spot S1r and the adjustment mark Mk1 in the MLA unit 824 is obtained, and this relative relationship is obtained. By moving at least one of the spatial light modulator 820 and the MLA unit 824 according to the information related to the positional relationship, the relative positional deviation between the spatial light modulator 820 and the MLA unit 824 can be reduced. can. Therefore, for example, even if there is a second imaging optical system 826 between the MLA unit 824 and the exposed object, which may cause a manufacturing error such as a magnification error and an aberration, the second connection is made. Information on the relative positional relationship between the spatial optical modulator 820 and the MLA unit 824 can be obtained without being affected by manufacturing errors such as magnification error and aberration in the image optical system 826. Thereby, for example, the accuracy of alignment required for the sensor unit 850 can be reduced. As a result, for example, the exposure accuracy related to the two-dimensional pattern in the exposure apparatus 10 can be easily improved.

<2. Other embodiments>
The present invention is not limited to the above-mentioned first embodiment, and various changes and improvements can be made without departing from the gist of the present invention.

<2-1. 2nd Embodiment>
In the first embodiment, for example, the MLA unit 824 may have an MLA 824a and a lens holding unit 824h that holds the MLA 824a. FIG. 12A is a schematic side view showing an example of the configuration of the first unit 850 according to the second embodiment. FIG. 12B is a schematic front view showing an example of the configuration of the MLA unit 824 according to the second embodiment. In the examples of FIGS. 12 (a) and 12 (b), the lens holding portion 824h is a frame-shaped portion along the outer peripheral portion located so as to surround the effective region Ar1 of the MLA 824a. As the material of the lens holding portion 824h, for example, a metal having excellent thermal conductivity such as aluminum, stainless steel, brass and copper may be applied, or a transparent material such as glass may be applied.

Here, when the material of the lens holding portion 824h is transparent, the adjustment mark Mk1 composed of the light-shielding film pattern Pt1 is located in the portion of the lens holding portion 824h close to the MLA 824a. You may. In this case, the portion of the lens holding portion 824h that is close to the MLA 824a may be regarded as the ineffective region Ar2. On the other hand, for example, if a plurality of microlenses ML1 and an adjustment mark Mk1 are located on the MLA 824a, the alignment of the plurality of microlenses ML1 and the adjustment mark Mk1 is easy. As a result, for example, the exposure accuracy related to the two-dimensional pattern in the exposure apparatus 10 can be improved.

<2-2. Third Embodiment>
In each of the above embodiments, for example, the relative positional relationship between the spatial light modulator 820 and the MLA unit 824 may be automatically adjusted by the control of the control unit 9.

FIG. 13 is a block diagram showing a bus wiring of the exposure apparatus according to the third embodiment. The block diagram of FIG. 13 is based on the block diagram (FIG. 8) according to each of the above embodiments, and the drive unit 860 is added to the components of the exposure apparatus 10 connected to the control unit 9, and the CPU 90 is programmed 920. The position adjustment unit 911 is added to the functional elements realized by operating according to the above.

The drive unit 860 includes, for example, at least one of a first drive unit 820d and a second drive unit 824d. Thereby, the drive unit 860 can move, for example, at least one of the spatial light modulator 820 and the MLA unit 824. The control unit 9 including the positional relationship recognition unit 910 and the position adjustment unit 911 responds to, for example, a signal relating to the relative positional relationship between the spatial light modulator 820 and the MLA unit 824 output from the sensor unit 850. The drive unit 860 can move at least one of the spatial light modulator 820 and the MLA unit 824. Thereby, the control unit 9 can adjust the relative positional relationship between the spatial light modulator 820 and the MLA unit 824, for example.

Here, the position adjusting unit 911 controls the operation of the drive unit 860 based on the information related to the relative positional relationship between the spatial light modulator 820 and the MLA unit 824 recognized by the positional relationship recognition unit 910, for example. By doing so, the relative positional relationship between the spatial light modulator 820 and the MLA unit 824 can be adjusted. Here, for example, the relative positional deviation between the spatial light modulator 820 and the MLA unit 824 is automatically reduced according to the information related to the relative positional relationship between the adjustment optical spot S1r and the adjustment mark Mk1. Can be done. If such a configuration is adopted, for example, even an operator who is unfamiliar with the use of the exposure apparatus 10 can reduce the relative positional deviation between the spatial light modulator 820 and the plurality of MLA units 824. .. As a result, for example, the exposure accuracy related to the two-dimensional pattern in the exposure apparatus 10 can be easily improved.

14 and 15 show operation flows for the operation (also referred to as position adjustment operation) for reducing the relative positional deviation between the spatial light modulator 820 and the MLA unit 824 in the exposure apparatus 10 according to the third embodiment. It is a flow chart which shows an example. The flow chart of FIG. 14 shows the main operation flow of the position adjustment operation. In the flow chart of FIG. 15, the operation flow of the operation of acquiring the signal related to the relative positional relationship between the spatial light modulator 820 and the MLA unit 824 by the sensor unit 850 in step Sp1, step Sp8, and step Sp12 of FIG. It is shown. The position adjustment operation is started, for example, in response to a predetermined command input in response to the operation of the operation unit 982 by the operator of the exposure apparatus 10, and is executed by the control of the control unit 9.

In step Sp1 of FIG. 14, the sensor unit 850 acquires a signal relating to the relative positional relationship between the spatial light modulator 820 and the MLA unit 824. In this step Sp1, the operation flow of step Sp16 is executed from step Sp11 in FIG. Here, for convenience, one exposure head 82 will be described with reference to a process of acquiring a signal related to the relative positional relationship between the spatial light modulator 820 and the MLA unit 824.

In step Sp11, the control unit 9 sets the numerical value k indicating that the image pickup target by the sensor unit 850 is the kth adjustment mark Mk1 (k is a natural number) to 1. In step Sp12, under the control of the control unit 9, the sensor unit 850 moves to a position for imaging the kth adjustment mark Mk1. In step Sp13, the sensor unit 850 captures the k-th adjustment light spot (for example, the k-th adjustment light spot) S1r. At this time, the sensor unit 850 outputs a signal related to the image that captures the kth adjustment optical spot S1r toward the control unit 9. In step Sp14, the sensor unit 850 captures the kth adjustment mark (for example, the kth adjustment mark) Mk1. At this time, the sensor unit 850 outputs a signal related to the image in which the kth adjustment mark Mk1 is captured toward the control unit 9. In step Sp15, the control unit 9 determines whether or not the numerical value k has reached the numerical value n (n is a natural number) indicating the number of adjustment marks Mk1 to be imaged. In the example of FIGS. 6A and 12B, the control unit 9 sets, for example, the numerical value n to an arbitrary number from 2 to 4 according to the input in response to the operation of the operation unit 982 by the operator. Can be done. In step Sp15, if the numerical value k has not reached the numerical value n, in step Sp16, the control unit 9 adds 1 to the numerical value k and returns to step Sp12. Then, when the processing of step Sp12 to step Sp16 is repeated n times, the numerical value k reaches the numerical value n, and the operation flow of FIG. 15 ends.

In step Sp2 of FIG. 14, the positional relationship recognition unit 910 uses the spatial light modulator 820 in the rotation direction centered on the optical axis 822p based on the signal related to the image obtained by the imaging in the latest step Sp13 and step Sp14. And the positional deviation between the MLA unit 824 and the MLA unit 824 are calculated. The positional deviation in the rotation direction calculated here is represented by, for example, an angle.

In step Sp3, the positional relationship recognition unit 910 determines whether the positional deviation in the rotation direction calculated in step Sp2 is within the preset allowable range. Here, if the positional deviation in the rotation direction is not within the allowable range, the process proceeds to step Sp4. The permissible range may be defined by, for example, an angle.

In step Sp4, the position adjusting unit 911 moves at least one of the spatial light modulator 820 and the MLA unit 824 in the rotation direction about the optical axis 822p according to the positional deviation in the rotation direction calculated in step Sp2. Is moved by the drive unit 860. When the operation of this step Sp4 is completed, the process returns to step Sp1. That is, the operations of step Sp1 to step Sp4 are repeated until the adjustment of the positional deviation in the rotation direction is completed. Then, if it is determined in step Sp3 that the positional deviation in the rotation direction is within the allowable range, the process proceeds to step Sp5. This completes the adjustment of the positional deviation in the rotation direction.

In step Sp5, the positional relationship recognition unit 910 determines the positional deviation between the spatial light modulator 820 and the MLA unit 824 in the X-axis direction based on the signal related to the image obtained by the imaging in the latest step Sp13 and step Sp14. calculate. The positional deviation in the X-axis direction calculated here may be, for example, a positional deviation in real space or a positional deviation on an image.

In step Sp6, the positional relationship recognition unit 910 determines whether the positional deviation in the X-axis direction calculated in step Sp5 is within the preset allowable range. Here, if the positional deviation in the X-axis direction is not within the allowable range, the process proceeds to step Sp7. The permissible range is defined by, for example, the number of pixels on the image or the distance in real space.

In step Sp7, the position adjusting unit 911 moves at least one of the spatial light modulator 820 and the MLA unit 824 in the X-axis direction by the driving unit 860 according to the positional deviation in the X-axis direction calculated in step Sp5. Move it. When the operation of this step Sp7 is completed, the process proceeds to step Sp8.

In step Sp8, similarly to step Sp1, the sensor unit 850 acquires a signal relating to the relative positional relationship between the spatial light modulator 820 and the MLA unit 824. After the operation flow of FIG. 15 is executed in step Sp8, the process returns to step Sp5. That is, the operations of step Sp5 to step Sp8 are repeated until the adjustment of the positional deviation in the X-axis direction is completed. Then, if it is determined in step Sp6 that the positional deviation in the X-axis direction is within the allowable range, the process proceeds to step Sp9. This completes the adjustment of the positional deviation in the X-axis direction.

In step Sp9, the positional relationship recognition unit 910 determines the positional deviation between the spatial light modulator 820 and the MLA unit 824 in the Z-axis direction based on the signal related to the image obtained by the imaging in the latest step Sp13 and step Sp14. calculate. The positional deviation in the Z-axis direction calculated here may be, for example, a positional deviation in real space or a positional deviation on an image.

In step Sp10, the positional relationship recognition unit 910 determines whether the positional deviation in the Z-axis direction calculated in step Sp9 is within a preset allowable range. Here, if the positional deviation in the Z-axis direction is not within the allowable range, the process proceeds to step Sp11. The permissible range is defined by, for example, the number of pixels on the image or the distance in real space.

In step Sp11, the position adjusting unit 911 moves at least one of the spatial light modulator 820 and the MLA unit 824 in the Z-axis direction by the driving unit 860 according to the positional deviation in the Z-axis direction calculated in step Sp9. Move it. When the operation of this step Sp11 is completed, the process proceeds to step Sp12.

In step Sp12, similarly to step Sp1, the sensor unit 850 acquires a signal relating to the relative positional relationship between the spatial light modulator 820 and the MLA unit 824. After the operation flow of FIG. 15 is executed in step Sp12, the process returns to step Sp9. That is, the operations of step Sp9 to step Sp12 are repeated until the adjustment of the positional deviation in the Z-axis direction is completed. Then, if it is determined in step Sp10 that the positional deviation in the Z-axis direction is within the allowable range, the adjustment of the positional deviation in the Z-axis direction is completed, and the operation flow of the position adjusting operation is completed.

<2-3. Others>
In each of the above embodiments, for example, when there is no relative positional deviation between the spatial light modulator 820 and the MLA unit 824, the second reference position Cn2 of the adjustment mark Mk1 and the first reference of the adjustment optical spot S1r. It does not have to match the position Cn1, and may not match as long as the relative positional relationship is clear.

In each of the above embodiments, for example, in an image in which the adjustment mark Mk1 obtained by imaging by the sensor unit 850 is captured, the position corresponding to the second reference position Cn2 of the adjustment mark Mk1 can be recognized, and the image is captured by the sensor unit 850. The shape of the adjustment mark Mk1 may be any shape as long as the position corresponding to the first reference position Cn1 of the adjustment light spot S1r can be recognized in the image obtained by capturing the adjustment light spot S1r.

FIG. 16A is a schematic front view showing an example of a variation of the adjustment mark Mk1. FIG. 16B is a schematic front view showing an example of a variation of the adjustment mark Mk1 and the adjustment optical spot S1r. As shown in FIGS. 16A and 16B, the adjustment mark Mk1 does not have the four window portions W1 and has a cross portion formed by the light-shielding film pattern Pt1. It may have a configuration.

FIG. 17A is a schematic front view showing another example of the variation of the adjustment mark Mk1. FIG. 17B is a schematic front view showing another example of the variation of the adjustment mark Mk1 and the adjustment optical spot S1r. As shown in FIGS. 17 (a) and 17 (b), the adjustment mark Mk1 is a pattern Pt1 in which one large window portion W1 including a region in which the adjustment light spot S1r is formed is present. You may have.

In each of the above embodiments, the number of adjustment marks Mk1 possessed by the MLA unit 824 may be one. Even if such a configuration is adopted, for example, the relative positional deviation between the spatial light modulator 820 and the MLA unit 824 in each of the X-axis direction and the Z-axis direction can be reduced.

In each of the above embodiments, for example, if the number of adjustment marks Mk1 possessed by the MLA unit 824 is larger than three, even if the aberration of the second imaging optical system 826 is present. , The relative positional deviation between the spatial light modulator 820 and the MLA unit 824 can be reduced more accurately.

In each of the above embodiments, for example, as shown in FIGS. 6 (b) and 16 (a), the adjustment mark Mk1 passes light toward a part of the sensor unit 850 of the adjustment optical spot S1r. If the sensor unit 850 has the pattern Pt1 for shielding, the sensor unit 850 can recognize the position corresponding to the first reference position Cn1 and can recognize the position corresponding to the second reference position Cn2 for adjustment. It is possible to acquire and output an image that captures the light spot S1r and the adjustment mark Mk1 by one imaging. For example, if the amount of light of the adjustment light spot S1r is not excessive, as shown in FIGS. 10A and 11A, in the image capturing the adjustment light spot S1r, the adjustment light spot S1r The shadow of the cross part of the pattern Pt1 of the light-shielding film that shields the light is clearly captured. At this time, from the image in which the adjustment light spot S1r is captured, the position in which the first reference position Cn1 of the adjustment light spot S1r is captured and the position in which the second reference position Cn2 of the adjustment mark Mk1 is captured can be recognized. It becomes a state. Thereby, for example, the sensor unit 850 can quickly acquire a signal relating to the relative positional relationship between the adjustment optical spot S1r and the adjustment mark Mk1. As a result, for example, the exposure accuracy related to the two-dimensional pattern in the exposure apparatus 10 can be rapidly improved. Further, for example, the exposure apparatus 10 spatially photomodulates in order to obtain a signal related to an image in which the adjustment mark Mk1 whose position corresponding to the second reference position Cn2 of the adjustment mark Mk1 can be recognized by the sensor unit 850. In addition to the device 820, it is not necessary to have an illumination unit for irradiating the adjustment mark Mk1 such as the coaxial illumination unit 853. This can reduce, for example, the increase in size and complexity of the exposure apparatus 10.

Further, in such a case, for example, the positional relationship recognition unit 910 does not have to recognize the relative positional relationship between the adjustment optical spot S1r and the adjustment mark Mk1 in the MLA unit 824. For example, the sensor unit 850 may acquire the signal related to the image capturing the adjustment optical spot S1r and the adjustment mark Mk1 at any time, and the display unit 980 may visually output the signal related to this image. At this time, the operator drives at least one of the first drive unit 820d and the second drive unit 824d while looking at the display unit 980, so that the relative positions of the spatial light modulator 820 and the MLA unit 824 are relative to each other. The deviation can be reduced.

In each of the above embodiments, for example, the sensor unit 850 has a line sensor having a plurality of light receiving elements arranged side by side in the first direction (for example, the X-axis direction) instead of the area sensor, and the first direction. It may have a line sensor having a plurality of light receiving elements arranged side by side along a second direction (for example, the Y-axis direction) intersecting with the above. Even in this case, for example, the relative positional relationship between the adjustment light spot S1r and the adjustment mark Mk1 is acquired in the first direction, and the adjustment light spot S1r and the adjustment mark Mk1 are obtained in the second direction. Relative positional relationship of can be obtained.

For example, in each of the above embodiments, for example, two or more sensor units 850 may be present on the base 15.

For example, in each of the above embodiments, the plurality of light emitting regions are not limited to those that emit light by reflection of light, such as the micromirror M1 of the DMD, and may emit light by other forms such as self-luminous light. good. Here, for example, the spatial light modulator 820 as a light emitting unit transmits and shields the incident light from the light source unit, which is necessary light that contributes to the drawing of the pattern and unnecessary light that does not contribute to the drawing of the pattern. The incident light may be spatially modulated by switching between. In this case, for example, a backlight that emits light by itself is applied to the light source unit. For the spatial light modulator 820, for example, a transmissive liquid crystal display capable of switching between transmission and shielding of light in a plurality of regions is applied. In such a configuration, the transmissive liquid crystal function functions as a light emitting unit having a plurality of light emitting regions, each of which emits light by transmitting light incident from a backlight as a light source unit.

In each of the above embodiments, for example, the exposure apparatus 10 is applied to an apparatus for forming a three-dimensional model by irradiating a metal powder with pattern light and solidifying the metal powder so as to have a desired shape. You may.

Needless to say, all or a part of each of the above embodiments and various modifications can be combined as appropriate and within a consistent range.

9 Control unit 10 Exposure device 820 Spatial light modulator 820d First drive unit 824 Microlens array unit (MLA unit)
824a Microlens Array (MLA)
824d 2nd drive unit 850 Sensor unit 852 Sensor 860 Drive unit 910 Positional relationship recognition unit 911 Position adjustment unit Ar1 Effective area Ar2 Ineffective area Cn1 1st reference position Cn1a 1A Corresponding reference position Cn1b 1B Corresponding reference position Cn2 2nd reference Position Cn2a 2A Corresponding reference position Cn2b 2B Corresponding reference position Im1a, Im1b, Im2a, Im2b Image M1 Micromirror M1r Adjustment micromirror ML1 Microlens Mk1 Adjustment mark Mk1a First adjustment mark Mk1b Second adjustment mark Mk1c 3rd adjustment mark Mk1d 4th adjustment mark Pt1 pattern S1r Adjustment light spot

Claims (5)

A light emitting part having a plurality of light emitting regions that emit light, and
An effective region containing a plurality of microlenses located on the path of light emitted by each of the plurality of light emitting regions, and an effective region outside the effective region in a direction perpendicular to the optical axis of the plurality of microlenses. A microlens array unit having a non-effective region including an adjustment mark, and a microlens array unit.
A sensor unit having a plurality of light receiving elements arranged along the first direction and a plurality of light receiving elements arranged along the second direction intersecting the first direction. Prepare,
The sensor unit is emitted from the adjusting light emitting region among the plurality of light emitting regions on the path of light emitted from the light emitting unit and passing through the region including the adjusting mark in the ineffective region. It is possible to output a signal relating to the relative positional relationship between the adjustment light spot formed by the light applied to the ineffective region and the adjustment mark .
The adjustment mark shields a part of the adjustment light spot and the adjustment light spot as a signal relating to the relative positional relationship between the adjustment light spot and the adjustment mark by the sensor unit. An exposure device having a pattern for blocking the passage of light toward the sensor portion of a part of the adjustment light spot so that an image capturing the shadow of the adjustment mark can be output. .. The exposure apparatus according to claim 1.
The microlens array unit includes a microlens array in which the plurality of microlenses are integrally configured.
The microlens array is an exposure apparatus including the non-effective region. The exposure apparatus according to claim 1 or 2.
The microlens array unit has a first adjustment mark and a second adjustment mark contained in the non-effective region, respectively.
The sensor unit includes a first adjusting light spot formed by light emitted from a first adjusting light emitting region among the plurality of light emitting regions and irradiating the ineffective region, and the first adjusting light spot. It is possible to output a signal relating to the first relative positional relationship with the mark, and the non-effective region is emitted from the second adjustment light emitting region of the plurality of light emitting regions. An exposure apparatus capable of outputting a signal relating to a second relative positional relationship between a second adjustment light spot formed by light and the second adjustment mark. The exposure apparatus according to any one of claims 1 to 3.
The sensor unit is an exposure apparatus including an area sensor having a plurality of light receiving elements in a two-dimensionally arranged state. The exposure apparatus according to any one of claims 1 to 4 .
A drive unit capable of moving at least one of the light emitting unit and the microlens array unit, and a drive unit.
By moving at least one of the movable parts by the driving unit in response to the signal related to the relative positional relationship, the relative positional relationship between the plurality of light emitting units and the plurality of microlenses is adjusted. An exposure device further including a control unit.

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