JP7096676B2 - Optical unit and optical device - Google Patents

Description

The present invention relates to an optical unit and an optical device.

Patent Documents 1 and 2 describe a projection exposure apparatus that exposes a predetermined pattern to a photosensitive material by irradiating the photosensitive material with a pattern light formed by spatial modulation.

In this projection exposure device, the light output from the light source is spatially modulated by a micromirror device (DMD) to form patterned light. The pattern light is imaged on the photosensitive material by the optical system.

Here, the optical system includes, for example, a first imaging optical system that forms an image of a pattern light formed by DMD, a microlens array (MLA) arranged on an imaging surface of the first imaging optical system, and the like. It includes a second imaging optical system that forms an image of light that has passed through the MLA on a photosensitive material. The MLA comprises a plurality of microlenses arranged in two dimensions so as to correspond to each of the DMD's micromirrors.

Further, in Patent Document 2, temperature control is performed by a Pelche element so that DMD and MLA are maintained at preset temperatures, and the positional deviation between the DMD and the optical axis of MLA due to thermal expansion is reduced to extinguish the light. It is described that the image of DMD is accurately projected on the image plane in order to improve the ratio.

Japanese Unexamined Patent Publication No. 2004-335692 Japanese Unexamined Patent Publication No. 2004-343003

However, in the technique of Patent Document 2, a transparent Pelche element is arranged on the entire surface of the MLA. Therefore, the presence of the transparent Pelche element reduces the light transmittance in the MLA. As a result, the extinction ratio is lowered and the DMD image cannot be accurately projected on the image plane.

Such a problem is common to optical units and optics having a light source unit that emits a plurality of lights by self-emission or reflection, and a microlens array including a plurality of microlenses that form an image of the plurality of lights. ..

Therefore, an object of the present invention is to provide a technique for accurately projecting a plurality of lights onto a projection surface.

In order to solve the above problems, the optical unit according to the first aspect includes a reference unit, a light emitting unit, a first base unit, a microlens array, a lens holding unit, two heat insulating units, and a second. It has a base part. The light emitting unit is located in a state of being separated from the reference unit in the first direction, and has a plurality of light emitting regions that emit light. The first base portion is connected to the reference portion and is located in a state of holding the light emitting portion. The microlens array is a plurality of microlenses located in a state separated from the reference portion in the first direction, and each located on a plurality of paths of light emitted from the plurality of light emitting regions. Have. The lens holding portion includes an annular portion located along an annular region surrounding the plurality of microlenses in the microlens array in a direction perpendicular to the optical axis of the plurality of microlenses. It has two protrusions, each protruding outward from the annular portion in the radial direction, and is located in a state where at least a part of the annular region is attached. The two heat insulating portions are the first optical axis of the first microlens located at the end of the plurality of microlenses on the side of the first direction in the first direction, and the plurality of microlenses. It is located so as to sandwich the plurality of light paths in the section located between the second optical axis of the second microlens located at the end on the side opposite to the first direction and the second optical axis. It is located in a state of being attached to each of the two places of the lens holding portion. The second base portion is connected to the reference portion and is positioned in a state where the lens holding portion is held via the two heat insulating portions. The two locations include the surface of each of the protrusions.

Further, the optical unit according to the second aspect is the optical unit according to the first aspect, and the two locations are the centers of the plurality of microlenses in the first direction among the plurality of light paths. It is located so as to sandwich the path of light passing through the third microlens located in.

Further, the optical unit according to the third aspect is the optical unit according to the second aspect, and the two places are located so as to sandwich the third optical axis of the third microlens.

Further, the optical unit according to the fourth aspect is the optical unit according to the first aspect, and the two locations pass through the center of the plurality of microlenses and along the optical axis of the plurality of microlenses. It is located so as to sandwich the path.

Further, the optical unit according to the fifth aspect is the optical unit according to any one of the first to fourth aspects, and the two locations are located along a virtual plane perpendicular to the first direction. ing.

Further, the optical unit according to the sixth aspect is the optical unit according to any one of the first to fifth aspects, and the two places are the side of each of the protrusions in the second direction. Including the face of.
Further, the optical unit according to the seventh aspect is the optical unit according to any one of the first to sixth aspects, and the annular portion has a shape in which a part of the ring along the annular region is missing. Has.

Further, the optical unit according to the eighth aspect is the optical unit according to any one of the first to seventh aspects, and further includes a cooling unit for cooling the second base portion.

Further, the optical unit according to the ninth aspect is the optical unit according to any one of the first to seventh aspects, and further includes a first sensor unit, a second sensor unit, and a temperature control unit. I have. The first sensor unit measures the first temperature of the first base unit. The second sensor unit measures the second temperature of the second base unit. The temperature control unit cools or heats at least one of the first base unit and the second base unit.

Further, the optical device according to the tenth aspect includes an optical unit according to the ninth aspect and a control unit. Based on the first signal from the first sensor unit and the second signal from the second sensor unit, the control unit sets the temperature control unit so that the first temperature and the second temperature are the same. Control.

Further, the optical device according to the eleventh aspect includes an optical unit according to any one of the first to ninth aspects, an optical system located on a path of light emitted from a plurality of microlenses, and an optical system. It is equipped with.

According to the optical unit according to the first aspect, for example, even if the microlens array is heated by irradiation of light from the light emitting portion, the heat of the microlens array is easily dissipated through the lens holding portion, and the two heat insulating units are insulated. The presence of the portion makes it difficult for the second base portion to be heated. As a result, for example, the microlens array and the second base portion are less likely to undergo thermal expansion. Further, even if the microlens array causes thermal expansion, the thermal expansion of the microlens array itself is divided into upper and lower parts based on the portion sandwiched between the two places where the two heat insulating portions are attached to the lens holding portion. .. As a result, the positional deviation between the plurality of light paths from the light emitting portion and the optical axis of each microlens is unlikely to occur. Therefore, for example, a plurality of lights emitted from the light emitting unit can be accurately projected onto the projection surface.

According to the optical unit according to the second aspect, for example, the positional deviation between the plurality of light paths from the light emitting unit and the optical axis of each microlens can be further reduced. Thereby, for example, a plurality of lights emitted from the light emitting unit can be accurately projected by the projection surface.

By the optical unit according to any of the third and fourth aspects, for example, the positional deviation between the path of the plurality of lights from the light emitting unit and the optical axis of each microlens can be further reduced. Thereby, for example, a plurality of lights emitted from the light emitting unit can be projected more accurately on the projection surface.

According to the optical unit according to the fifth aspect, for example, even if the microlens array causes thermal expansion, the thermal expansion of the microlens array itself is divided into upper and lower parts with reference to a virtual surface. As a result, the positional deviation between the plurality of light paths from the light emitting portion and the optical axis of each microlens is unlikely to occur. Therefore, for example, a plurality of lights emitted from the light emitting unit can be accurately projected onto the projection surface.

With the optical unit according to any one of the first, sixth and seventh aspects, for example, the heat of the microlens array is more likely to be dissipated through the lens holding portion. As a result, for example, the microlens array is less likely to undergo thermal expansion. As a result, for example, the positional deviation between the plurality of light paths from the light emitting unit and the optical axis of each microlens can be further reduced. Therefore, for example, a plurality of lights emitted from the light emitting unit can be accurately projected by the projection surface.

According to the optical unit according to the eighth aspect, for example, the temperature rise of the second base portion can be reduced. Thereby, for example, thermal expansion of the second base portion can be made less likely to occur. As a result, for example, it is possible to reduce the positional deviation between the plurality of light paths from the light emitting unit and the optical axis of each microlens. Therefore, for example, a plurality of lights emitted from the light emitting unit can be accurately projected onto the projection surface.

In any of the optical unit according to the ninth aspect and the optical device according to the tenth aspect, for example, the positional deviation of the light emitting portion in the first direction from the reference portion and the microlens array in the first direction from the reference portion. It is possible to match with the misalignment of. Thereby, for example, it is possible to reduce the positional deviation between the plurality of light paths from the light emitting unit and the optical axis of each microlens. Therefore, for example, a plurality of lights emitted from the light emitting unit can be accurately projected onto the projection surface.

According to the optical device according to the eleventh aspect, for example, a plurality of lights emitted from the optical system unit can be accurately projected onto the projection surface via the optical system.

It is a side view which shows the pattern exposure apparatus which concerns on each embodiment. It is a top view which shows the pattern exposure apparatus which concerns on each embodiment. It is a schematic perspective view which shows the structure of the exposure unit which concerns on each embodiment. It is a schematic side view which shows the structure of the exposure head which concerns on each embodiment. It is a block diagram which shows the bus wiring of the pattern exposure apparatus which concerns on 1st Embodiment. It is a schematic perspective view which shows a plurality of exposure heads which perform pattern exposure. FIG. 7A is a schematic side view showing the configuration of the optical unit according to the first embodiment. 7 (b) is a schematic end view showing an example of a cut surface of a part of the optical unit along the line VIIb-VIIb of FIG. 7 (a). FIG. 8A is a schematic side view showing the configuration of the optical unit according to a reference example. 8 (b) is a schematic end view showing an example of a cut surface of a part of the optical unit along the line VIIIb-VIIIb of FIG. 8 (a). FIG. 9A is a schematic side view showing the configuration of the optical unit according to the second embodiment. 9 (b) is a schematic end view showing an example of a cut surface of a part of the optical unit along the IXb-IXb line of FIG. 9 (a). It is a block diagram which shows the bus wiring of the pattern exposure apparatus which concerns on 2nd Embodiment. 11 (a) and 11 (b) are schematic side views showing an example of the configuration of the optical unit according to the third embodiment, respectively. It is a block diagram which shows the bus wiring of the pattern exposure apparatus which concerns on 3rd Embodiment. FIG. 13A is a schematic side view showing the configuration of the optical unit according to the fourth embodiment. 13 (b) is a schematic end view showing an example of a cut surface of a part of the optical unit along the line XIIIb-XIIIb of FIG. 13 (a). 14 (a) and 14 (b) are diagrams illustrating a section in the Z-axis direction in which two locations where heat insulating portions are attached to the lens holding portions are present, respectively. 15 (a) and 15 (b) are schematic views showing a configuration example of an optical unit according to a modified example, respectively.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, parts having the same structure and function are designated by the same reference numerals, and duplicate description is omitted in the following description. Further, the drawings are schematically shown, and the sizes and positional relationships of various structures in each drawing are not accurately illustrated. A right-handed XYZ coordinate system is attached to FIGS. 1 to 3, 6 to 9 (b), 11 (a), 11 (b), and 13 (a) to 15 (b). ing. In this XYZ coordinate system, the main scanning direction of the pattern exposure device 10 is the Y-axis direction, the sub-scanning direction of the pattern exposure device 10 is the X-axis direction, and the vertical direction orthogonal to both the X-axis direction and the Y-axis direction. The direction is the Z-axis direction. Specifically, the direction of gravity (vertical direction) is the −Z direction.

<1. First Embodiment>
FIG. 1 is a side view showing a schematic configuration of a pattern exposure apparatus 10 as an optical apparatus according to the first embodiment. FIG. 2 is a plan view showing a schematic configuration of the pattern exposure apparatus 10 according to the first embodiment.

The pattern exposure apparatus 10 irradiates the upper surface (upper surface of the layer of the photosensitive material) on which the layer of the photosensitive material such as resist is formed with the pattern light (drawing light) spatially modulated according to CAD data or the like. , A direct drawing type drawing device, which is a device for exposing (drawing) a pattern (for example, a circuit pattern). The substrate W to be processed by the pattern exposure apparatus 10 is, for example, a semiconductor substrate, a printed circuit board, a color filter substrate provided in a liquid crystal display device, or a flat panel provided in a liquid crystal display device or a plasma display device. A glass substrate for a display, a substrate for a magnetic disk, a substrate for an optical disk, a panel for a solar cell, and the like can be adopted. In the following description, it is assumed that the substrate W is a rectangular substrate.

The pattern exposure apparatus 10 includes a base 15 and a support frame 16. The support frame 16 is located on the base 15, and has a portal shape in a state of crossing the base 15 along the X-axis direction.

Further, the pattern exposure device 10 includes a stage 4, a stage drive mechanism 5, a stage position measurement unit 6, an exposure unit 8, and a control unit 9.

<Stage 4>
The stage 4 is a part for holding the substrate W. The stage 4 is located on the base 15, for example. Specifically, the stage 4 has, for example, a flat plate-like outer shape. In this case, the stage 4 can hold the substrate W placed on the flat upper surface in a horizontal posture. Here, if a plurality of suction holes (not shown) are present on the upper surface of the stage 4, the stage 4 forms a negative pressure (suction pressure) in these plurality of suction holes, thereby forming a negative pressure (suction pressure) on the upper surface of the stage 4. The substrate W can be held in a fixed state.

<Stage drive mechanism 5>
The stage drive mechanism 5 can move the stage 4 with respect to the base 15. The stage drive mechanism 5 is located on the base 15, for example. The stage drive mechanism 5 includes, for example, a rotation mechanism 51, a support plate 52, and a sub-scanning mechanism 53. The rotation mechanism 51 can rotate the stage 4 in the rotation direction (rotation direction (θ direction) around the Z axis). The support plate 52 supports the stage 4 via the rotation mechanism 51. The sub-scanning mechanism 53 can move the support plate 52 in the sub-scanning direction (X-axis direction). Further, the stage drive mechanism 5 includes a base plate 54 and a main scanning mechanism 55. The base plate 54 supports the support plate 52 via the sub-scanning mechanism 53. The main scanning mechanism 55 can move the base plate 54 in the main scanning direction (Y-axis direction).

Specifically, the rotation mechanism 51 passes through the center of the upper surface of the stage 4 (the mounting surface on which the substrate W is mounted), and the stage 4 is centered on a virtual rotation axis A perpendicular to the mounting surface. Can be rotated. As the configuration of the rotation mechanism 51, for example, a configuration including a rotation shaft unit 511 and a rotation drive unit (for example, a rotation motor) 512 may be adopted. In this case, the rotation shaft portion 511 is positioned so as to extend along the vertical direction (Z-axis direction). The upper end of the rotating shaft portion 511 is located in a state of being fixed to the back surface side of the stage 4. The rotation drive unit 512 is positioned in a state where the lower end of the rotation shaft portion 511 is rotatably held, and the rotation shaft portion 511 can be rotated. If such a configuration is adopted, for example, the stage 4 can rotate about the rotation shaft A in the horizontal plane in response to the rotation of the rotation shaft portion 511 by the rotation drive unit 512. The rotation mechanism 51 is not indispensable, and when the rotation direction is aligned, for example, the pattern data 960 described later is subjected to known rotation correction such as affine transformation instead of the rotation mechanism 51 to perform the position in the rotation direction. You may make adjustments.

The sub-scanning mechanism 53 includes, for example, a linear motor 531 and a pair of guide members 532. The linear motor 531 has a mover attached to the lower surface of the support plate 52 and a stator located on the upper surface of the base plate 54. The pair of guide members 532 are located on the upper surface of the base plate 54 in a state of being laid parallel to each other along the sub-scanning direction. Here, for example, a ball bearing is located between each guide member 532 and the support plate 52. The ball bearing can move along the longitudinal direction (sub-scanning direction) of the guide member 532 while sliding with respect to the guide member 532. Therefore, the support plate 52 is positioned in a state of being supported by a pair of guide members 532 via ball bearings. If such a configuration is adopted, when the linear motor 531 is operated, the support plate 52 can smoothly move along the sub-scanning direction while being guided by the pair of guide members 532.

The main scanning mechanism 55 includes, for example, a linear motor 551 and a pair of guide members 552. The linear motor 551 has a mover attached to the lower surface of the base plate 54 and a stator laid on the base 15. The pair of guide members 552 are located on the upper surface of the base 15 in a state of being laid parallel to each other along the main scanning direction. Here, as each guide member 552, an LM guide (registered trademark) as a machine element component that guides the linear motion portion of the machine by using "rolling" can be adopted. Further, by using, for example, an air bearing between each guide member 552 and the base plate 54, the base plate 54 is supported in a non-contact state with respect to the pair of guide members 552. If such a configuration is adopted, when the linear motor 551 is operated, the base plate 54 can move smoothly along the main scanning direction without causing friction while being guided by the pair of guide members 552.

<Stage position measurement unit 6>
The stage position measuring unit 6 measures the position of the stage 4. As the stage position measuring unit 6, for example, an interferometry type laser length measuring device is adopted. The interferometric laser length measuring instrument, for example, emits laser light from the outside of the stage 4 toward the stage 4 and receives the reflected light, and the position of the stage 4 (specifically, from the interference between the reflected light and the emitted light). The position in the Y direction along the main scanning direction) can be measured. A linear scale may be used instead of the laser length measuring device.

<Exposure unit 8>
The exposure unit 8 is a device (also referred to as a light irradiation device) that forms a pattern light and irradiates the substrate W with the pattern light. The exposure unit 8 includes a plurality of exposure units 800. FIG. 3 is a schematic perspective view showing the configuration of the exposure unit 800 according to the first embodiment. FIG. 4 is a schematic side view showing the configuration of the exposure head 82 according to the first embodiment. In FIG. 4, the mirror 825 is omitted, and the spatial light modulator 820, the first imaging optical system 822, the microlens array 824, and the second imaging optical system 826 are arranged on the same optical axis. The exposure unit 8 includes a plurality of exposure units 800 (here, nine units) shown in FIG. The number of exposure units 800 mounted is not necessarily nine, but may be one or more. Each exposure unit 800 has, for example, an exposure head 82 and is supported by a support frame 16. Here, the support frame 16 includes a plurality of exposure heads 82 arranged in the X-axis direction, and supports a row of a plurality of (for example, two) exposure heads 82 arranged in the Y-axis direction. It is located at (see FIGS. 2 and 6).

<Light source unit 80>
The light source unit 80 is a portion that generates light that is the source of the pattern light that the exposure unit 8 irradiates the substrate W. For example, each exposure unit 800 may have one light source unit 80, or a plurality of exposure units 800 may have one light source unit 80. The light source unit 80 includes a laser oscillator and an illumination optical system. The laser oscillator can receive a drive signal from the laser drive unit and output a laser beam. In the illumination optical system, the light (spot beam) output from the laser oscillator can be made into light having a uniform intensity distribution. The light output from the light source unit 80 is input to the exposure head 82. Here, for example, a configuration may be adopted in which the laser light output from one light source unit 80 is divided into a plurality of laser lights and input to the plurality of exposure heads 82.

<Exposure head 82>
The exposure head 82 includes, for example, a spatial light modulator 820, a first imaging optical system 822, a microlens array 824, a mirror 825, and a second imaging optical system 826. Further, the exposure head 82 may include, for example, a measuring instrument 84. In the first embodiment, for example, as shown in FIG. 3, the spatial light modulator 820, the first imaging optical system 822, and the microlens array 824 are located on the + Z direction side of the support frame 16. The second imaging optical system 826 and the measuring instrument 84 are located on the + Y direction side of the support frame 16. Such an exposure head 82 is located, for example, in a state of being housed in a first storage box (not shown). In this case, the first storage box is positioned so as to extend in the + Y direction on the + Z direction side of the support frame 16 and further extend in the −Z direction on the + Y direction side of the support frame 16. The light source unit 80 is located, for example, in the second storage box 802, which is fixedly located on the + Z direction side of the first storage box. Here, the light output from the light source unit 80 in the −Z direction is reflected by the mirror 804 and incident on the spatial light modulator 820.

<Spatial light modulator 820>
The spatial light modulator 820 comprises, for example, a digital mirror device (DMD). This DMD can spatially modulate the incident light by reflecting the necessary light that contributes to the drawing of the pattern and the unnecessary light that does not contribute to the drawing of the pattern among the incident light in different directions. As the DMD, for example, a spatial modulation element in which a large number (1920 × 1080) of micromirrors are arranged in a matrix on a memory cell is applied. Each micromirror constitutes, for example, a pixel having a square shape with a side of about 10 μm. The DMD has a rectangular outer shape of, for example, about 20 mm × 10 mm when viewed in a plan view from the micromirror side. In the DMD, for example, a digital signal is written to the memory cell based on the control signal from the control unit 9, and each of the micromirrors is tilted at a required angle about the diagonal line. As a result, pattern light corresponding to the digital signal is formed. In other words, the spatial light modulator 820 has, for example, a portion (light emitting) having a plurality of micromirrors as a plurality of regions (also referred to as light emitting regions) that emit light by reflection of light incident from the light source unit 80. It also has a role as a department). The spatial light modulator 820 is located, for example, in a state of being directly or indirectly fixed to the support frame 16 via another member. Other members may include, for example, the first containment box described above.

<First imaging optical system 822>
The first imaging optical system 822 includes a first lens barrel 8220 and a second lens barrel 8222. The first lens barrel 8220 is positioned in a state of holding the first lens 10L. The second lens barrel 8222 is positioned while holding the second lens 12L. The first lens 10L and the second lens 12L are located on the path of the pattern light formed by the spatial light modulator 820. As shown in FIG. 7A, for example, the optical axis 822p of the first imaging optical system 822 is located along the Y-axis direction. Here, the first lens 10L can, for example, arrange the pattern light output from each micromirror of the spatial light modulator 820 into parallel light along the Y-axis direction and guide it to the second lens 12L. The second lens 12L is, for example, an image-side telecentric lens, and can guide the pattern light from the first lens 10L to the microlens array 824 in a state parallel to the optical axis 822p of the second lens 12L. .. Here, for the first imaging optical system 822, for example, a magnifying optical system that forms an image of the pattern light formed by the spatial light modulator 820 at a lateral magnification exceeding 1x (for example, about 2x) is applied. Will be done. In this case, for example, the radius of the second lens 12L is larger than the radius of the first lens 10L. The first lens barrel 8220 and the second lens barrel 8222 are located, for example, in a state of being directly or indirectly fixed to the support frame 16 via other members. Other members may include, for example, the first containment box described above. Further, the first lens 10L may be composed of a plurality of lenses.

<Microlens Array 824>
The microlens array 824 has a plurality of microlenses ML1. In the microlens array 824, a plurality of microlenses ML1 are positioned in a state of being integrally configured. The number of the plurality of microlenses ML1 is, for example, the same as the number of micromirrors of the DMD in the spatial light modulator 820. More specifically, the plurality of microlenses ML1 are located in a state of being arranged in a matrix so as to correspond to the plurality of micromirrors of the DMD in the spatial light modulator 820. Then, each microlens ML1 is located on the path of light emitted from the corresponding micromirror among the plurality of micromirrors of the DMD in the spatial light modulator 820. In other words, the plurality of microlenses ML1 are respectively located on a plurality of paths of light emitted from the plurality of micromirrors as the plurality of light emitting regions. Therefore, the light reflected by each of the DMD micromirrors is incident on the corresponding microlens ML1 and is condensed by the microlens ML1. Here, each microlens ML1 has, for example, an optical axis parallel to the optical axis 822p of the first imaging optical system 822. Further, the microlens array 824 may have a light-shielding film for blocking the transmission of light in a portion other than the plurality of microlenses ML1. In this case, for example, when the microlens array 824 is viewed in a plan view in the + Y direction along the optical axis 822p, a mode in which a light-shielding film is positioned so as to surround each microlens ML1 can be adopted. As the material of this light-shielding film, for example, chromium or the like is adopted.

The arrangement and pitch of the plurality of spots (also referred to as condensing spots) formed in the microlens array 824 correspond to the arrangement and pitch of the plurality of microlenses ML1 in the microlens array 824. Here, a spot array 824SA configured to have a plurality of light-collecting spots is formed. Here, for example, the pattern light of about 20 mm × 10 mm formed by the spatial light modulator 820 is magnified about twice by the first imaging optical system 822, and the image size is about 40 mm × 20 mm. Form 824SA. Here, since the light from each micromirror of the DMD is focused by the microlens ML1, the size of the spot formed by the light from each micromirror is narrowed down and kept small. Therefore, the sharpness of the image (DMD image) projected on the substrate W can be kept high.

The microlens array 824 may be fixed to the support frame 16 directly or indirectly, for example, or may be movable relative to the support frame 16. It may be in the attached state. Other members may include, for example, the first containment box described above.

<Form of exposure head 82>
In the first embodiment, as shown in FIG. 3, the DMD of the spatial optical modulator 820, the first lens 10L and the second lens 12L of the first imaging optical system 822, and the microlens array 824 are the first imaging. It is located on a straight line along the optical axis 822p of the optical system 822. Here, as shown in FIG. 3, the pattern light that has passed through the first imaging optical system 822 and the microlens array 824 travels in the + Y direction, is applied to the mirror 825, and is reflected in the −Z direction. This reflected pattern light is input to the second imaging optical system 826. Therefore, among the configurations included in the exposure head 82, some configurations are located on a straight line along the Y-axis direction, and some other configurations are located on a straight line along the Z-axis direction. ing. In other words, a plurality of configurations included in the exposure head 82 are arranged on an L-shaped path. As a result, for example, the height of the exposure head 82 in the Z-axis direction is reduced as compared with the case where the plurality of configurations included in the exposure head 82 are located on a straight line along the Z-axis direction. obtain. As a result, for example, the height of the pattern exposure apparatus 10 can be reduced. Therefore, for example, the degree of freedom in installing the pattern exposure apparatus 10 can be increased.

<Second imaging optical system 826>
The second imaging optical system 826 is located on the path of light emitted from the plurality of microlenses ML1 in the microlens array 824. The second imaging optical system 826 includes a first lens barrel 8260 and a second lens barrel 8262. The first lens barrel 8260 is positioned in a state of holding the first lens 20L. The second lens barrel 8262 is positioned in a state of holding the second lens 22L. The first lens 20L and the second lens 22L are in a state of being fixed to the support frame 16 at a required interval in the Z-axis direction. More specifically, the first lens barrel 8260 and the second lens barrel 8262 are integrally connected by a connecting member, and the distance between these lens barrels is kept constant. As the connecting member, for example, a housing for accommodating the first lens barrel 8260 and the second lens barrel 8262 is adopted. Further, the first lens 20L may be composed of a plurality of lenses.

The second imaging optical system 826 is here referred to as bilateral telecentric. By making the image side of the second imaging optical system 826 telecentric, the size of the image of the pattern light becomes constant even if the position of the photosensitive material of the substrate W shifts in the optical axis direction of the pattern light, and the image is highly accurate. Can be exposed. Here, the object side of the second imaging optical system 826 is also telecentric. Therefore, for example, even if the second lens 12L of the first imaging optical system 822 and the microlens array 824 are movable in the optical axis direction, the pattern light on the image side of the second imaging optical system 826 It is possible to expose the photosensitive material of the substrate W while maintaining the size of the image.

For the second lens 22L of the second imaging optical system 826, for example, a magnifying optical system that magnifies and forms an image of pattern light at a lateral magnification exceeding 1x (for example, about 3x) is applied. At this time, the radius of the second lens 22L is larger than the radius of the first lens 20L. Therefore, the spot array 824SA is magnified about 3 times by the second imaging optical system 826 to a size of about 120 mm × 60 mm, and is projected onto the upper surface (also referred to as the photosensitive material surface) of the photosensitive material of the substrate W. To. This photosensitive material surface is a surface (also referred to as a projection surface) FL1 on which pattern light is projected by the exposure head 82.

<Projection of patterned light by the exposure head 82>
According to the exposure head 82 having the above configuration, the pattern light formed by the DMD of the spatial light modulator 820 passes through the first imaging optical system 822, the microlens array 824, and the second imaging optical system 826. It is projected on the substrate W. Then, the pattern light formed by the DMD is continuously changed by the reset pulse generated based on the encoder signal of the main scanning mechanism 55 as the stage 4 is moved by the main scanning mechanism 55. As a result, the pattern light is applied to the photosensitive material surface (projection surface FL1) of the substrate W, and a striped image is formed (see FIG. 6).

Here, for example, there may be a lens moving portion that movably holds the second lens 12L of the first imaging optical system 822 and the microlens array 824 in the optical axis direction (here, the Y-axis direction). .. The lens moving part may be configured with, for example, a moving plate, a pair of guide rails and a moving drive part. For example, the pair of guide rails is located, for example, on the support frame 16. The moving plate is, for example, a member formed in the shape of a rectangular plate and is located on a guide rail. The second lens barrel 8222 and the microlens array 824 are, for example, positioned on the upper surface of the moving plate in a state of being fixed at a required interval in the Y-axis direction. At this time, for example, the moving plate can move along the Y-axis direction while being guided by the pair of guide rails by receiving the driving force from the moving driving unit. As a result, the second lens 12L and the microlens array 824 can be moved in the direction toward the first lens 10L (−Y direction) and the direction away from the first lens 10L (+ Y direction). The moving drive unit may be composed of, for example, a linear motor type drive unit or a ball screw type drive unit, and may be able to move the moving plate based on a control signal from the control unit 9.

As described above, for example, if the second lens 12L and the microlens array 824 are movable in the optical axis direction (Y-axis direction), the measuring instrument 84 may be present as shown in FIG. The measuring instrument 84 can measure the separation distance between the exposure head 82 and the photosensitive material surface (projection surface FL1) as the surface of the substrate W. The measuring instrument 84 may be arranged, for example, at the lower end of the second lens barrel 8262, at a position away from the second imaging optical system 826, or on the support frame 16. The measuring device 84 includes an irradiator 840 that irradiates the substrate W with laser light, and a light receiver 842 that receives the laser light reflected by the substrate W. The irradiator 840 irradiates the upper surface of the substrate W with laser light, for example, along an axis inclined at a predetermined angle with respect to the normal direction (here, the Z-axis direction) with respect to the surface of the substrate W. The receiver 842 has, for example, a line sensor extending in the Z-axis direction, and can detect the incident position of the laser beam reflected on the upper surface of the substrate W on the line sensor. Thereby, for example, the separation distance between the exposure head 82 and the photosensitive material surface (projection surface FL1) of the substrate W can be measured. The control unit 9 can adjust the image formation position (focus position) in the optical axis direction of the pattern light output by the exposure head 82 according to the signal related to the separation distance detected by the measuring instrument 84. In this case, for example, the control unit 9 outputs a control signal to the lens moving unit to move the moving plate, thereby moving the second lens 12L of the second lens barrel 8222 and the microlens array 824 in the Y-axis direction. It can be moved along.

Here, for example, if the measuring instrument 84 is close to the position where the pattern light output from the second imaging optical system 826 on the photosensitive material surface (projection surface FL1) of the substrate W is irradiated, the exposure is performed. Immediately before or almost at the same time as the exposure, the fluctuation of the height of the photosensitive material surface (projection surface FL1) of the substrate W can be measured. Based on the measurement result, the focus position of the pattern light can be adjusted by the control unit 9. Further, for example, the height of each portion of the photosensitive material surface (projection surface FL1) of the substrate W is measured before exposure, and the control unit 9 adjusts the focus position at the timing when the exposure head 82 exposes each portion. You may.

<Control unit 9>
FIG. 5 is a block diagram showing a bus wiring of the pattern exposure apparatus 10 according to the first embodiment. The control unit 9 includes a central processing unit (CPU) 90, a read-only memory (ROM) 92, a RAM (Random Access Memory) 94, and a storage unit 96. The CPU 90 has a function as an arithmetic circuit. The RAM 94 has a function as a temporary working area of the CPU 90. For example, a non-volatile recording medium is applied to the storage unit 96.

The control unit 9 is a bus with components of the pattern exposure device 10 such as a rotation mechanism 51, a sub-scanning mechanism 53, a main scanning mechanism 55, a light source unit 80 (for example, a light source driver), a spatial light modulator 820, and a measuring instrument 84, respectively. It is connected by wiring, network lines, serial communication lines, etc., and controls the operation of each of these components. These components may include, for example, a lens moving portion that movably holds the second lens 12L and the microlens array 824 in the optical axis direction (Y-axis direction).

The CPU 90 performs operations on various data stored in the RAM 94 or the storage unit 96 by executing the program 920 stored in the ROM 92 while reading the program 920. The control unit 9 has, for example, a configuration as a general computer. The drawing control unit 900 is a function realized by operating the CPU 90 according to the program 920. Some or all of these elements may be realized, for example, in a logic circuit.

The storage unit 96 stores, for example, pattern data 960 indicating a pattern to be drawn on the substrate W. For the pattern data 960, for example, image data obtained by expanding vector format data created by CAD software into raster format data is applied. The control unit 9 can modulate the light beam output from the exposure head 82 by controlling the DMD of the spatial light modulator 820 based on the pattern data 960, for example. In the pattern exposure apparatus 10, for example, a modulation reset pulse can be generated based on the linear scale signal sent from the linear motor 551 of the main scanning mechanism 55. The pattern light modulated according to the position of the substrate W can be output from each exposure head 82 by the DMD of the spatial light modulator 820 that operates based on this reset pulse.

In the first embodiment, the pattern data 960 may, for example, indicate a single image (an image showing a pattern to be formed on the entire surface of the substrate W), or each of the single images. The exposure head 82 may individually show an image of a portion in charge of drawing.

A display unit 980 and an operation unit 982 are connected to the control unit 9. The display unit 980 is composed of a general CRT monitor, a liquid crystal display, or the like, and can display images related to various data. The operation unit 982 is composed of at least one of various buttons, various keys, a mouse, and a touch panel, and is operated when the operator inputs various commands to the pattern exposure apparatus 10. When the operation unit 982 includes a touch panel, the operation unit 982 may include a part or all of the functions of the display unit 980.

FIG. 6 is a schematic perspective view showing a plurality of exposure heads 82 performing pattern exposure. As shown in FIG. 6, the plurality of exposure heads 82 are located, for example, in a state of being linearly arranged along a plurality of rows (here, two rows). At this time, the exposure head 82 in the second row is located between the two exposure heads 82, 82 in the adjacent first row, for example, in the sub-scanning direction (X-axis direction). In other words, the plurality of exposure heads 82 are arranged in a staggered manner.

The exposure area 82R of each exposure head 82 has a rectangular shape having a short side along the main scanning direction (Y-axis direction). As the stage 4 moves in the Y-axis direction, a band-shaped exposed region 8R is formed on the photosensitive material of the substrate W for each exposure head 82. Here, as described above, for example, if the plurality of exposed heads 82 have a staggered arrangement or the like, the strip-shaped exposed regions 8R can be arranged without a gap in the X-axis direction. When the strip-shaped exposed areas 8R are arranged so as to be lined up in the X-axis direction without gaps, it is not necessary to move the stage 4 in the sub-scanning direction (X-axis direction), so that the sub-scanning mechanism 53 is unnecessary. can.

The arrangement of the plurality of exposure heads 82 is not limited to that shown in FIG. For example, a plurality of exposure heads 82 may be arranged so that a gap of several times the length of the long side of the exposure area 82R is naturally formed between the adjacent exposed regions 8R. In this case, for example, by performing the main scan in the Y-axis direction a plurality of times while shifting the length of the long side of the exposure area 82R in the X-axis direction, a plurality of strip-shaped exposed areas 8R are formed on the photosensitive material of the substrate W. It can be formed without gaps.

<Factors that cause misalignment of the optical axis in the exposure head>
By the way, in the exposure head 82, for example, the microlens array 824 may generate heat in response to the irradiation of the light emitted from the spatial light modulator 820. In this case, for example, the microlens array 824 itself and the peripheral members supporting the microlens array 824 may cause thermal expansion. At this time, for example, the optical axes of the plurality of microlenses ML1 constituting the microlens array 824 tend to shift with respect to the optical axis 822p. Therefore, for example, the optical axis of each microlens ML1 may be displaced with respect to a plurality of light paths from the plurality of micromirrors of the DMD in the spatial light modulator 820. At this time, light to be incident on the adjacent microlens ML1 may be incident on each microlens ML1. As a result, for example, the extinction ratio in the exposure head 82 may decrease, and the accuracy of drawing by exposure in the pattern exposure apparatus 10 may decrease.

Further, for example, if the microlens array 824 has a light-shielding film in a portion other than the plurality of microlenses ML1, heat may be further generated by irradiation of the light-shielding film with light. In this case, the microlens array 824 itself and the peripheral members supporting the microlens array 824 may further undergo thermal expansion. At this time, for example, the optical axis of each microlens ML1 may further shift with respect to a plurality of light paths from the plurality of micromirrors of the DMD in the spatial light modulator 820. As a result, for example, the extinction ratio in the exposure head 82 may be further reduced, and the accuracy of drawing by exposure in the pattern exposure apparatus 10 may be further reduced.

<Reduction of optical axis deviation of microlens>
In the pattern exposure apparatus 10 according to the first embodiment, the configuration of the exposure head 82 in which the optical axis of each microlens ML1 is less likely to shift with respect to a plurality of light paths from the plurality of micromirrors of the DMD in the spatial light modulator 820. Has been adopted.

FIG. 7A is a schematic side view showing the configuration of the optical unit 850 in the exposure head 82 according to the first embodiment. 7 (b) is a schematic end view showing an example of a cut surface of a part of the optical unit 850 along the line VIIb-VIIb of FIG. 7 (a). As shown in FIGS. 7 (a) and 7 (b), the optical unit 850 includes, for example, a reference unit 850b, a spatial light modulator 820, a first base unit 820b, a microlens array 824, and a lens. It includes a holding portion 824h, two heat insulating portions HI1, and a second base portion 824b.

The reference portion 850b is, for example, a portion that serves as a reference for the position of each portion constituting the optical unit 850. In the first embodiment, the reference portion 850b may include, for example, a support frame 16 or a member fixed to the support frame 16. Here, for example, when there is a lens moving unit that movably holds the second lens 12L and the microlens array 824 in the optical axis direction (Y-axis direction), the reference unit 850b has a lens moving unit. Can be included.

The spatial light modulator 820 is located, for example, in a state of being separated from the reference unit 850b in the + Z direction as the first direction.

The first base portion 820b is located, for example, in a state of being connected to the reference portion 850b and holding the spatial light modulator 820. In the example of FIG. 7A, when viewed from the side in the −X direction, the first base portion 820b is located so as to extend from the reference portion 850b in the + Z direction (also referred to as the upward direction) opposite to the vertical direction. ing. The spatial light modulator 820 is in a state of being supported on one side by the first base portion 820b above the reference portion 850b (also referred to as a cantilever state). As a result, for example, the size of the first base portion 820b can be reduced, the material can be reduced, and the height of the exposure head 82 can be reduced. The first base portion 820b may be, for example, various members fixed to the reference portion 850b, or may be in a state of being integrally configured with the reference portion 850b.

As described above, the microlens array 824 has a plurality of microlenses ML1s located on the path of light emitted from the plurality of micromirrors of the DMD in the spatial light modulator 820. In the example of FIG. 7A, the microlens array 824 is located, for example, in a state of being separated from the reference portion 850b in the first direction (+ Z direction). As the material of the microlens array 824, for example, glass or quartz is adopted.

The lens holding portion 824h is located, for example, in a state of holding the microlens array 824. The lens holding portion 824h is, for example, at least an annular region (also referred to as an annular region) 824p surrounding the plurality of microlens ML1s in the microlens array 824 in a direction perpendicular to the optical axis of the plurality of microlens ML1s. Some are located in the attached state.

In the examples of FIGS. 7 (a) and 7 (b), as the annular region 824p, for example, a portion of the microlens array 824 along the outer periphery located so as to surround the optical axis 822p is adopted. .. Here, for example, at least a part of the annular region 824p is adhered to the surface (also referred to as the back surface) of the lens holding portion 824h located on the side opposite to the spatial light modulator 820 in the + Y direction. It is located in a state. At this time, for example, with the microlens array 824 mounted on a protrusion (not shown) located on the back surface of the lens holding portion 824h, at least a part of the annular region 824p is a lens holding portion with an adhesive. An aspect of being adhered to the back surface of 824h can be considered.

Further, in the examples of FIGS. 7A and 7B, for example, the lens holding portion 824h is located in a state of being close to and facing the annular region 824p of the microlens array 824. As a result, even if the microlens array 824 generates heat due to the irradiation of light from the spatial light modulator 820, heat dissipation from the microlens array 824 is promoted via the lens holding portion 824h adjacent to the annular region 824p. To. As the material of the lens holding portion 824h, for example, a metal having excellent thermal conductivity such as aluminum, stainless steel, brass and copper can be adopted. Further, here, for example, if the back surface of the lens holding portion 824h and the annular region 824p of the microlens array 824 are in close contact with each other, heat dissipation from the microlens array 824 via the lens holding portion 824h can be further promoted. Here, for example, instead of the microlens array 824 being adhered to the back surface of the lens holding portion 824h, the surface of the lens holding portion 824h located on the side in the −Y direction close to the spatial light modulator 820 (front surface). The microlens array 824 may be adhered to the microlens array 824.

The second base portion 824b is located, for example, in a state of being connected to the reference portion 850b and holding the lens holding portion 824h via the two heat insulating portions HI1. In the examples of FIGS. 7A and 7B, the second base portion 824b is located so as to extend from the reference portion 850b in the + Z direction (upward direction) opposite to the vertical direction. The lens holding portion 824h is in a state of being supported on one side by the second base portion 824b above the reference portion 850b (cantilever state). As a result, for example, the size of the second base portion 824b can be reduced, the material can be reduced, and the height of the exposure head 82 can be reduced. Further, in the example of FIG. 7B, the second base portion 824b has a U-shaped shape when viewed in a plan view in the main scanning direction (Y-axis direction). Specifically, the second base portion 824b has, for example, a first portion PN1, a second portion PN2, and a third portion PN3. Here, the first portion PN1 and the second portion PN2 are connected by the third portion PN3. The third portion PN3 is directly connected to the reference portion 850b. The first portion PN1 is positioned so as to protrude along the upward direction (+ Z direction) from the end portion of the third portion PN3 on the −X direction side. The second portion PN2 is positioned so as to protrude along the upward direction (+ Z direction) from the end portion of the third portion PN3 on the + X direction side. As described above, if the second base portion 824b has an integrated U-shaped shape, the second base portion 824b can be easily connected to the reference portion 850b. Further, the two heat insulating portions HI1 and the lens holding portion 824h can be easily arranged with respect to the second base portion 824b. That is, the optical unit 850 may be easily assembled.

The two heat insulating portions HI1 are located, for example, in a state of being attached to two locations of the lens holding portion 824h. The two heat insulating portions HI1 include a first heat insulating portion HI 11 and a second heat insulating portion HI 12. The first heat insulating portion HI 11 is located in a state of being attached to the lens holding portion 824h on the −X direction side. The second heat insulating portion HI12 is located in a state of being attached to the + X direction side of the lens holding portion 824h. Here, two of the lens holding portions 824h to which the heat insulating portion HI1 is attached are located so as to sandwich the path of light emitted from the spatial light modulator 820 and passing through the microlens array 824. is doing. From another point of view, when viewed in a plane along the optical axis 822p, the two locations where the heat insulating portion HI1 of the lens holding portion 824h is attached are the plurality of microlenses ML1 in the microlens array 824. It is located with the lens in between. In the first embodiment, two of the lens holding portions 824h to which the heat insulating portion HI1 is attached are, for example, a virtual surface (also referred to as a virtual surface) CP0 perpendicular to the first direction (+ Z direction). It is located along. In the example of FIG. 7B, the virtual surface CP0 is in a state of passing through the center in the first direction (+ Z direction) of the region in which the plurality of microlenses ML1 are arranged in the microlens array 824. In other words, the virtual surface CP0 is in a state of passing through the centers of the plurality of microlenses ML1. For example, the center of gravity is adopted as the center. From yet another point of view, the virtual plane CP0 is, for example, a plane parallel to the XY plane in which the optical axis 822p of the first imaging optical system 822 passes.

Further, here, for example, glass, ceramics and resin having excellent heat insulating properties can be applied to the material of the two heat insulating portions HI1. Here, each heat insulating portion HI1 may include, for example, a space that inhibits heat conduction. The dimensions of the two insulation HI1s can be set arbitrarily, for example. Further, if quartz glass or ceramics, which are hard and have a relatively small coefficient of linear expansion, are adopted as the materials of the two heat insulating portions HI1, the heat insulating portion HI1 itself is unlikely to undergo a change in shape such as thermal expansion. This also makes it difficult for the optical axis of each microlens ML1 to shift with respect to a plurality of light paths from the plurality of micromirrors of the spatial light modulator 820.

Here, as shown in FIGS. 8A and 8B, tentatively, the second base portion 824bA directly connected to the reference portion 850b is in a state of directly holding the microlens array 824. It is assumed that the optical unit 850A is located. Here, for example, when the microlens array 824 generates heat due to the irradiation of light from the spatial light modulator 820, heat is transferred from the microlens array 824 to the second base portion 824bA, and the second base portion 824bA causes thermal expansion. .. As a result, the optical axis of each microlens ML1 is likely to be greatly displaced with respect to a plurality of light paths from the spatial light modulator 820.

On the other hand, in the pattern exposure apparatus 10 according to the first embodiment, as shown in FIGS. 7A and 7B, the presence of the two heat insulating portions HI1 causes the microlens array 824 and the lens to be held. The heat in the portion 824h is not easily transferred to the second base portion 824b. Therefore, the second base portion 824b is less likely to be heated, and the second base portion 824b is less likely to undergo thermal expansion. Further, for example, even if the microlens array 824 generates heat due to the irradiation of light from the spatial light modulator 820, the heat of the microlens array 824 is likely to be dissipated through the lens holding portion 824h. Therefore, for example, the microlens array 824 itself is unlikely to cause thermal expansion. As a result, the optical axis of each microlens ML1 is less likely to shift with respect to a plurality of light paths from the spatial light modulator 820.

Further, even if the microlens array 824 itself expands due to heat generation, the portion of the plurality of microlens ML1 located on the upper side (+ Z direction) side of the virtual surface CP0 is based on the virtual surface CP0. It shifts upward (+ Z direction). On the other hand, the portion of the plurality of microlenses ML1 located on the lower side (-Z direction) of the virtual surface CP0 is displaced downward (-Z direction) with respect to the virtual surface CP0. In other words, for example, the thermal expansion of the microlens array 824 itself is divided into upper and lower parts with respect to the virtual surface CP0. As a result, the optical axis of each microlens ML1 is less likely to shift with respect to a plurality of light paths from the spatial light modulator 820. Therefore, for example, a plurality of lights emitted from the spatial light modulator 820 can be accurately projected onto the projection surface FL1.

Here, for example, as shown in FIGS. 7 (a) and 7 (b), the lens holding portion 824h is an annular portion (also an annular portion) located along the annular region 824p of the microlens array 824. A configuration having Cp1 and two protrusions PR1 can be adopted. In the example of FIGS. 7 (a) and 7 (b), the annular portion Cp1 forms a through hole TH0 penetrating in the + Y direction in which a plurality of light paths from the spatial light modulator 820 are located. It is located in the state of being. The two projecting portions PR1 are positioned so as to project from the annular portion Cp1 toward the outside of the annular portion Cp1 in the radial direction. The two protrusions PR1 include a first protrusion PR11 and a second protrusion PR12. In the examples of FIGS. 7 (a) and 7 (b), the first protruding portion PR11 is positioned so as to protrude in the −X direction from the portion of the annular portion Cp1 on the −X direction side. The second protruding portion PR12 is positioned so as to protrude in the + X direction from the portion of the annular portion Cp1 on the + X direction side. The two locations of the lens holding portion 824h where the two heat insulating portions HI1 are attached are in the second direction opposite to the first direction (+ Z direction) of each protruding portion PR1. It includes a surface (also referred to as a lower surface) on the side (in the −Z direction).

If such a configuration is adopted, for example, the heat of the microlens array 824 is transmitted through the lens holding portion 824h including the annular portion Cp1 located along the entire circumference of the annular region 824p of the microlens array 824. , It becomes easier to dissipate heat. As a result, for example, the microlens array 824 is less likely to undergo thermal expansion. As a result, for example, the optical axis of each microlens ML1 is less likely to shift with respect to a plurality of light paths from the spatial light modulator 820. Therefore, for example, a plurality of lights emitted from the spatial light modulator 820 can be accurately projected by the projection surface FL1.

<Summary of the first embodiment>
As described above, according to the optical unit 850 according to the first embodiment, for example, even if the microlens array 824 generates heat due to the irradiation of light from the spatial light modulator 820, the heat of the microlens array 824 retains the lens. It is easy to dissipate heat through the section 824h. Further, for example, due to the presence of the two heat insulating portions HI1, heat is less likely to be transferred from the lens holding portion 824h to the second base portion 824b, and the second base portion 824b is less likely to be heated. Therefore, the microlens array 824 and the second base portion 824b are less likely to undergo thermal expansion. Further, for example, even if the microlens array 824 causes thermal expansion, the thermal expansion of the microlens array 824 itself is held by the second base portion 824b by the lens holding portion 824h via the two heat insulating portions HI1. It is divided into upper and lower parts based on the virtual surface CP0 corresponding to the current position. As a result, the optical axis of each microlens ML1 is less likely to shift with respect to a plurality of light paths from the spatial light modulator 820. As a result, a plurality of lights emitted from the spatial light modulator 820 can be accurately projected onto the projection surface FL1.

Further, according to the pattern exposure apparatus 10 including the optical unit 850 according to the first embodiment, a plurality of lights emitted from the optical unit 850 are accurately projected onto the projection surface FL1 via the second imaging optical system 826. Can be done.

<2. Other embodiments>
The present invention is not limited to the above-mentioned first embodiment, and various changes and improvements can be made without departing from the gist of the present invention.

<2-1. 2nd Embodiment>
For example, the optical unit 850 according to the first embodiment may further include a cooling unit 824c for cooling the second base unit 824b, as shown in FIGS. 9A and 9B. For example, a Pelche element or a water-cooled jacket may be applied to the cooling unit 824c. Further, as the cooling portion 824c, a water cooling pipe (also referred to as a water cooling pipe) located inside the second base portion 824b may be adopted. In this case, as shown in FIG. 10, for example, the cooling unit 824c is connected to the control unit 9, and the control unit 9 operates the cooling unit 824c as a function realized by operating the CPU 90 according to the program 920. It may have a temperature control unit 910 to control.

If such a configuration is adopted, for example, the temperature rise of the second base portion 824b can be reduced. Thereby, for example, thermal expansion of the second base portion 824b can be made less likely to occur. As a result, for example, it is possible to reduce the positional deviation between the path of a plurality of lights emitted from the spatial light modulator 820 and the optical axis of each microlens ML1. Therefore, for example, a plurality of lights emitted from the spatial light modulator 820 can be accurately projected onto the projection surface FL1.

<2-2. Third Embodiment>
For example, as shown in FIGS. 11A and 11B, the optical unit 850 according to the first embodiment has a first sensor unit St1, a second sensor unit St2, and a temperature control unit 82c. And may be further provided. The first sensor unit St1 can measure, for example, the temperature (also referred to as the first temperature) of the first base unit 820b. The second sensor unit St2 can measure, for example, the temperature (also referred to as the second temperature) of the second base unit 824b. The temperature control unit 82c can, for example, cool or heat at least one of the first base unit 820b and the second base unit 824b. Here, for example, a contact-type temperature sensor such as a thermocouple or a thermistor or a non-contact-type temperature sensor such as a radiation thermometer may be applied to the first sensor unit St1 and the second sensor St2. A perche element for cooling the target portion, a water-cooled jacket or a water-cooled pipe, a resistance heating type heater for heating the target portion, an infrared heater, or the like may be applied to the temperature control unit 82c.

Here, for example, if the temperature control unit 82c is controlled so that the first temperature and the second temperature are the same, the spatial light modulator 820 is displaced from the reference unit 850b in the first direction (+ Z direction). , The misalignment of the microlens array 824 in the first direction (+ Z direction) from the reference unit 850b can be matched. Thereby, for example, it is possible to reduce the positional deviation between the path of the plurality of lights emitted from the spatial light modulator 820 and the optical axis of each microlens ML1. Therefore, for example, a plurality of lights emitted from the spatial light modulator 820 can be accurately projected onto the projection surface FL1.

Further, here, for example, the control unit 9 makes the first temperature and the second temperature the same based on the first signal from the first sensor unit St1 and the second signal from the second sensor unit St2. The temperature control unit 82c may be controlled. For example, as shown in FIG. 12, the first sensor unit St1, the second sensor unit St2, and the temperature control unit 82c are connected to the control unit 9, and the control unit 9 is realized by operating the CPU 90 according to the program 920. As a function to be performed, the temperature control unit 910 that controls the operation of the temperature control unit 82c may be provided.

<2-3. Fourth Embodiment>
For example, in the optical unit 850 according to each of the above embodiments, as shown in FIGS. 13 (a) and 13 (b), the lens holding portion 824h has two recesses Re1 and the two recesses Re1. The heat insulating portion HI1 may be located in each of them. In the examples of FIGS. 13 (a) and 13 (b), the lens holding portion 824h has a first recess Re11 on the −X direction side and a second recess Re12 on the + X direction side. The first heat insulating portion HI 11 is located in the first recess Re11, and the second heat insulating portion HI 12 is located in the second recess Re12. Even if such a configuration is adopted, for example, the first protrusion PR11 is located above the first recess Re11, and the second protrusion PR12 is located above the second recess Re12.

<2-4. Others>
For example, in each of the above embodiments, the virtual surface CP0 is not limited to the configuration that passes through the centers of the plurality of microlenses ML1 in the microlens array 824, and may be located within the section AR1 in the first direction (+ Z direction). .. 14 (a) and 14 (b) are diagrams illustrating the section AR1 in the first direction (+ Z direction) in which the heat insulating portion HI1 is attached to the lens holding portion 824h, respectively. 14 (a) and 14 (b) show diagrams focusing on the relationship between the microlens array 824 and the section AR1, respectively.

Here, for example, as shown in FIG. 14A, the section AR1 in the first direction (+ Z direction) is located at the end on the side of the plurality of microlenses ML1 in the first direction (+ Z direction). A microlens located at the end of the optical axis (also referred to as the first optical axis) Op1 of the microlens (also referred to as the first microlens) ML11 and the second direction (-Z direction) of the plurality of microlenses ML1. It may be a section located between the optical axis (also referred to as the second optical axis) Op2 of the ML12 (also referred to as a second microlens). Even if such a configuration is adopted, for example, even if the microlens array 824 itself causes thermal expansion, the thermal expansion of the region including the plurality of microlenses ML1 is divided into upper and lower parts based on the virtual surface CP0. .. As a result, the optical axis of each microlens ML1 is less likely to shift with respect to the plurality of light paths emitted by the spatial light modulator 820. Therefore, for example, a plurality of lights emitted from the spatial light modulator 820 can be accurately projected by the projection surface FL1.

At this time, for example, the spatial light modulator 820 in the section AR1 regardless of whether or not the two locations to which the two heat insulating portions HI1 of the lens holding portion 824h are attached are located along the virtual surface CP0. It may be located so as to sandwich a plurality of paths of light emitted from and passing through the microlens array 824. Even if such a configuration is adopted, even if the microlens array 824 undergoes thermal expansion, the thermal expansion of the microlens array 824 itself causes the lens holding portion 824h to have two heat insulating portions HI1 attached. It is divided into upper and lower parts based on the virtual surface that sandwiches the part. As a result, the positional deviation between the plurality of light paths from the spatial light modulator 820 and the optical axis of each microlens ML1 is unlikely to occur. Therefore, for example, a plurality of lights emitted from the spatial light modulator 820 can be accurately projected onto the projection surface FL1.

Here, for example, as shown in FIG. 14B, the section AR1 in the first direction (+ Z direction) is located at the center of the plurality of microlenses ML1 in the first direction (+ Z direction). It may be a section in which the existing microlens (also referred to as a third microlens) ML13 exists. In this case, the virtual surface CP0 passes over the third microlens ML13. If such a configuration is adopted, for example, even if the microlens array 824 itself causes thermal expansion, the thermal expansion of the microlens array 824 is divided substantially evenly above and below the virtual surface CP0. As a result, the optical axes of the plurality of microlenses ML1 are less likely to shift with respect to the plurality of light paths emitted by the spatial light modulator 820. As a result, for example, a plurality of lights emitted from the spatial light modulator 820 can be accurately projected by the projection surface FL1. At this time, for example, the two locations where the two heat insulating portions HI1 of the lens holding portion 824h are attached are emitted from the spatial light modulator 820 regardless of whether or not they are located along the virtual surface CP0. 3 The microlens may be positioned so as to sandwich the path of light passing through the ML 13.

Here, further, for example, as shown in FIG. 14B, if the virtual surface CP0 passes on the optical axis (also referred to as the third optical axis) Op3 of the third microlens ML13, for example, tentatively. Even if the microlens array 824 causes thermal expansion, the thermal expansion of the microlens array 824 itself is further evenly divided up and down with respect to the virtual surface CP0. As a result, the optical axes of the plurality of microlenses ML1 are less likely to shift with respect to the plurality of light paths emitted by the spatial light modulator 820. As a result, for example, a plurality of lights emitted from the spatial light modulator 820 can be more accurately projected onto the projection surface FL1. At this time, for example, regardless of whether or not the two locations where the two heat insulating portions HI1 of the lens holding portion 824h are attached are located along the virtual surface CP0, the third optical axis of the third microlens ML13. It may be positioned so as to sandwich Op3. Further, here, for example, regardless of whether or not the two locations where the two heat insulating portions HI1 of the lens holding portion 824h are attached are located along the virtual surface CP0, the center of the plurality of microlenses ML1 is set. It may be located so as to pass through and to sandwich a path along the optical axis of the plurality of microlenses ML1. Further, the place where the heat insulating portion HI1 is provided is not limited to two places, and may be three or more places. That is, the heat insulating portion HI1 may be provided at two or more locations.

Further, for example, when the light source unit 80 is a light source (also referred to as a laser light combined wave light source) 80B that combines a plurality of laser lights, a configuration similar to that of the optical unit 850 is applied to the laser light combined light source 80B. May be good. At this time, for example, as shown in FIG. 15A or FIG. 15B, the laser optical combined wave light source 80B includes, for example, a light emitting unit 820B, a microlens array 824B, a condenser lens Lz0, and one. The optical fiber Fv0 and the like. The light emitting unit 820B is a portion having a plurality of (for example, seven) semiconductor lasers LD1. Here, the direction in which the plurality of semiconductor lasers LD1 are arranged may be, for example, a vertical direction (Z-axis direction) as shown in FIG. 15A, or as shown in FIG. 15B. It may be in the horizontal direction (X-axis direction). The microlens array 824B is integrally composed of a plurality of microlenses ML1 each having a function as a collimated lens for converting light emitted from each semiconductor laser LD1 into parallel light. The condenser lens Lz0 collects the laser light emitted from each semiconductor laser LD1 and made into parallel light by the microlens ML1 with respect to the end face FL1B of the optical fiber Fv0. Here, the end face FL1B has a role as a projection plane. Here, for example, the optical unit 850B having the light emitting unit 820B and the microlens array 824B has the optical unit 850 according to each of the above embodiments as a basic configuration, and the first imaging optical system 822 is omitted to serve as the light emitting unit. The spatial optical modulator 820 may be replaced with the light emitting unit 820B, and the microlens array 824 may be replaced with the microlens array 824B. If such a configuration is adopted, for example, a plurality of laser beams can be accurately focused on the end surface FL1B of one optical fiber Fv0 as a projection surface.

Further, for example, in each of the above embodiments, the lens holding portion 824h may have a shape such that at least a part of the annular portion Cp1 is missing. Even in this case, for example, if at least a part of the annular region 824p of the microlens array 824 is located in the attached state, the lens holding portion 824h is located from the microlens array 824 via the lens holding portion 824h. The heat dissipation can be promoted.

For example, in each of the above embodiments, the plurality of light emitting regions are not limited to those that emit light by reflection of light, and may be those having a plurality of light emitting regions that emit light. For example, the spatial light modulator 820 as a light emitting unit switches transmission and shielding of incident light from a light source unit between necessary light that contributes to drawing a pattern and unnecessary light that does not contribute to drawing a pattern. Therefore, the incident light may be spatially modulated. In this case, for example, a backlight that emits light is applied to the light source unit. For the spatial light modulator 820, for example, a transmissive liquid crystal display capable of switching between transmission and shielding of light in a plurality of regions is applied. In such a configuration, the transmissive liquid crystal function functions as a light emitting unit having a plurality of regions (light emitting regions) that emit light by transmitting light incident from a backlight as a light source unit.

Needless to say, all or a part of each of the above-described embodiments and the above-mentioned various modifications can be combined as appropriate and within a consistent range.

8 Exposure unit 9 Control unit 10 Pattern exposure device 82c Temperature control unit 800 Exposure unit 820 Spatial optical modulator 820B Light emitting unit 820b First base unit 824,824B Microlens array 824b, 824bA Second base unit 824c Cooling unit 824h Lens holding unit 824p annular region 826 2nd imaging optical system 850, 850B optical unit 850b reference unit 900 drawing control unit 910 temperature control unit AR1 section CP0 virtual surface Cp1 annular part FL1 projection surface HI1 heat insulation part HI11 1st heat insulation part HI12 2nd heat insulation part ML1 microlens ML11 1st microlens ML12 2nd microlens ML13 3rd microlens PR1 protruding part PR11 1st protruding part PR12 2nd protruding part St1 1st sensor part St2 2nd sensor part

Claims (11)

The reference part and
A light emitting unit that is located away from the reference unit in the first direction and has a plurality of light emitting regions that emit light, and a light emitting unit.
A first base portion that is connected to the reference portion and is located while holding the light emitting portion.
A microlens array having a plurality of microlenses located apart from the reference unit in the first direction and located on a plurality of paths of light emitted from the plurality of light emitting regions. ,
An annular portion located along an annular region surrounding the plurality of microlenses in the microlens array in a direction perpendicular to the optical axis of the plurality of microlenses, and an annular portion to the annular portion. A lens holding portion having two protrusions, each protruding outward in the radial direction of the lens, and a lens holding portion located in a state where at least a part of the annular region is attached.
The first optical axis of the first microlens located at the end of the plurality of microlenses on the side of the first direction in the first direction is opposite to the first direction of the plurality of microlenses. The lens holding portion located so as to sandwich the plurality of light paths in a section located between the second optical axis of the second microlens located at the end on the side in the second direction. Two heat insulating parts that are located in the two places of each, and
A second base portion that is connected to the reference portion and is located in a state where the lens holding portion is held via the two heat insulating portions.
Equipped with
The two places are optical units including the surfaces of the protrusions . The optical unit according to claim 1.
The above two places
An optical unit located so as to sandwich a path of light passing through a third microlens located at the center of the first direction of the plurality of microlenses among the plurality of paths of light. The optical unit according to claim 2.
The above two places
An optical unit located so as to sandwich the third optical axis of the third microlens. The optical unit according to claim 1.
The above two places
An optical unit positioned so as to pass through the center of the plurality of microlenses and to sandwich a path along the optical axis of the plurality of microlenses. The optical unit according to any one of claims 1 to 4.
The two locations are optical units located along a virtual plane perpendicular to the first direction. The optical unit according to any one of claims 1 to 5.
The two points are optical units including the surface of each of the protrusions on the side in the second direction. The optical unit according to any one of claims 1 to 6.
The annular portion is an optical unit having a shape in which a part of the ring along the annular region is missing. The optical unit according to any one of claims 1 to 7 .
An optical unit further comprising a cooling unit for cooling the second base unit. The optical unit according to any one of claims 1 to 7 .
The first sensor unit that measures the first temperature of the first base unit and
A second sensor unit that measures the second temperature of the second base unit, and
A temperature control unit that cools or heats at least one of the first base portion and the second base portion.
Further equipped with an optical unit. The optical unit according to claim 9 and
A control unit that controls the temperature control unit so that the first temperature and the second temperature are the same based on the first signal from the first sensor unit and the second signal from the second sensor unit. ,
It is equipped with an optical device. The optical unit according to any one of claims 1 to 9 ,
An optical system located on the path of light emitted from the plurality of microlenses, and
It is equipped with an optical device.

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