TW202013084A - Exposure device - Google Patents

Abstract

The topic of the present invention is to easily improve the exposure accuracy of a two-dimensional pattern in an exposure device. The exposure device of the solution means of the present invention includes a light-emitting part, a microlens array part, and a sensor part. The light-emitting part has a plurality of light-emitting areas for emitting light. The microlens array part has an effective area and an ineffective area. The effective area includes: a plurality of microlenses, which are respectively located on the path of the light emitted from each of the plurality of light-emitting areas. The ineffective area is located outside the effective area, and contains the adjustment marks. The sensor part has a plurality of light-receiving elements arranged in the first direction and a plurality of light-receiving elements arranged in the second direction. The sensor part can output a signal of the relative positional relationship between the adjustment light spot and the adjustment mark on the path of the light emitted from the light-emitting part and passing through the area including the adjustment mark in the ineffective area. The adjustment light spot is emitted from the light-emitting areas for adjustment in the plurality of light-emitting areas, and forms the light irradiated onto the ineffective area.

Description

Exposure device

The invention relates to an exposure device.

Patent Documents 1 and 2 describe an exposure device that irradiates light on a photosensitive material with a pattern formed by spatial modulation, thereby exposing the photosensitive material in a desired two-dimensional pattern. The exposure device uses a micro mirror device (DMD) to spatially modulate the light output from the light source and form pattern light. The patterned light is imaged onto the photosensitive material by the optical system.

Here, the optical system includes, for example, a first imaging optical system that images the patterned light formed by DMD; a micro lens array (MLA; micro lens array), which is arranged in the imaging of the first imaging optical system Surface; and the second imaging optical system is to image the light that has passed through the MLA onto the photosensitive material. The MLA system is provided with a plurality of micro lenses, which are arranged in a two-dimensional manner corresponding to each of the micro mirrors of the DMD. In other words, the plural pixels of the pattern light incident on the MLA from the DMD and the plural micromirrors of the MLA need to be in one-to-one correspondence with each other. Therefore, for example, the DMD and MLA systems are fixed by various holding members and the like after the relative positions between DMD and MLA are adjusted.

However, after the fixing of DMD and MLA, for example, there will be time-dependent changes in the residual expansion of the holding member due to the thermal expansion of the holding member corresponding to the change of the surrounding temperature (also called the ambient temperature) and the fixing of DMD and MLA. Opening and vibration may cause the relative positional shift between DMD and MLA. In this case, for example, a part of the beam that should be incident on the adjacent microlens is incident on the microlens where the original beam is not incident, and the extinction ratio is reduced. That is, the accuracy of exposure of the photosensitive material in a desired two-dimensional pattern (also referred to as exposure accuracy) may decrease.

On the other hand, for example, in the technique of Patent Document 2, a photosensitive material having a stage near the stage is used so as to correspond to a total of four pixels in the vertical direction and two in the horizontal direction of the corner of the pattern light A four-division detector of four photo diodes arranged in a lattice is used to detect the relative positional deviation between DMD and MLA. Specifically, for example, the amount of deviation between the light beam reflected by the micromirror of the DMD and the microlens corresponding to the light beam is detected. In other words, the shift amount of the light beam is detected. Next, for example, the positional adjustment of the MLA is performed according to the amount of deviation of the light beam detected using the quadrant detector, thereby eliminating the relative positional deviation between the DMD and the MLA. [Prior Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2004-335692. Patent Document 2: Japanese Patent Laid-Open No. 2004-296531.

[Problems to be solved by the invention]

In addition, in the technique of the above-mentioned Patent Document 2, for example, in order to detect the deviation amount of the light beam (the deviation amount ΔX in the X direction, the deviation amount ΔY in the Y direction, and the deviation amount θz in the rotation direction), a quadrant detector is used. It is arranged in two of the four corners of the exposure area on the worktable. In addition, the four photodiodes of the quadrant detector are arranged in the two places so as to correspond to the four pixels of the pattern light incident from the DMD to the MLA.

However, the light beams emitted from the DMD and passing through the four pixel components at the two corners of the MLA pass through the second imaging optical system and are projected onto the worktable. Therefore, it is necessary to position the four photodiodes in two places on the table in response to the magnitude of manufacturing errors such as magnification errors and aberrations of the second imaging optical system. Moreover, as the resolution of the pattern drawn by the exposure increases, the pitch of the microlenses in the MLA becomes smaller, and the positioning of the four photodiodes in two places on the table is required to be very fine Accuracy. In addition, for example, in a case where a plurality of exposure heads are mounted on the exposure device, it is necessary to perform alignment of the quadrant detector according to the number of exposure heads. Therefore, when manufacturing an exposure apparatus, there is a possibility that a complicated process required for alignment is increased.

In addition, in the configuration in which the four-division detector is provided on the table, the structure of the table may become complicated. Here, for example, when considering that the quadrant detector is installed on another movable table different from the table provided with the photosensitive material and the other movable table can be inserted and withdrawn relative to the exposure area, this is also the case Other movable tables require movement accuracy and positioning accuracy corresponding to the very fine positioning accuracy required for the quadrant detector. Therefore, the manufacturing of the exposure device may become more difficult.

Therefore, an object of the present invention is to provide an exposure apparatus that can easily improve the exposure accuracy of a two-dimensional pattern. [Means to solve the problem]

In order to solve the above problems, the exposure apparatus of the first aspect of the present invention includes a light emitting unit, a microlens array unit, and a sensor unit. The light-emitting part has a plurality of light-emitting areas for emitting light respectively. The aforementioned microlens array section has an effective area and an ineffective area. The effective area includes: a plurality of microlenses, which are respectively located on the path of light emitted by each of the plurality of light-emitting areas. The non-effective area is located outside the effective area in a direction perpendicular to the optical axes of the plurality of microlenses, and includes adjustment marks. The sensor unit has a plurality of light-receiving elements arranged in a first direction and a plurality of light-receiving elements arranged in a second direction crossing the first direction. The sensor section may output the relativity between the adjustment spot and the adjustment mark on the path of the light emitted from the light-emitting section and passing through the area including the adjustment mark in the inactive area In the signal of the positional relationship of the light, the light spot for adjustment is emitted from the light-emitting areas for adjustment in the plurality of light-emitting areas and forms the light irradiated to the inactive area.

The exposure apparatus of the second aspect is the exposure apparatus described in the first aspect, wherein the microlens array section includes: a microlens array in which a plurality of the microlenses are integrally formed; the microlens The array includes the aforementioned inactive area.

The exposure apparatus of the third aspect is the exposure apparatus described in the first aspect or the second aspect, wherein the microlens array section includes: a first adjustment mark and a second adjustment mark, which are respectively included in the aforementioned Inactive area; the sensor section can output a signal of the first relative positional relationship between the first adjustment light spot and the first adjustment mark, and can output the second adjustment light spot and the first A signal of a second relative positional relationship between the two adjustment marks, the first adjustment light spot is emitted from the first adjustment light-emitting area among the plurality of light-emitting areas and is formed to irradiate the inactive area The light beams of the second adjustment are emitted from the second light-emitting areas for adjustment in the plurality of light-emitting areas and are formed to irradiate the inactive area.

The exposure apparatus of the fourth aspect is the exposure apparatus described in any of the first aspect to the third aspect, wherein the sensor section includes: an area sensor, which has a two-dimensional A plurality of light-receiving elements arranged in a ground state.

The exposure device of the fifth aspect is the exposure device as described in any of the first aspect to the fourth aspect, wherein the adjustment mark has a pattern for shielding a part of the adjustment light spot The light that has been directed toward the aforementioned sensor portion passes.

The exposure apparatus of the sixth aspect is the exposure apparatus as described in any of the first aspect to the fifth aspect, further comprising: a driving section that enables the light emitting section and the microlens array section The movable part of at least one of them moves; and the control part moves the movable part of the at least one by the driving part in response to the signal of the relative positional relationship, thereby adjusting the plurality of light-emitting parts and the plurality of The relative positional relationship between the aforementioned microlenses. [Effect of invention]

According to the exposure apparatus of the first aspect, for example, information on the relative positional relationship between the adjustment light spot and the adjustment mark in the microlens array section is obtained, and the light emitting section and the microlens are made according to the relative positional relationship At least one of the array sections moves, whereby the relative positional deviation between the light emitting section and the microlens array section can be reduced. Therefore, for example, even if there is an imaging optical system between the microlens array part and the object to be exposed that may cause manufacturing errors such as magnification error and aberration, it will not be affected by the magnification error in the imaging optical system and The manufacturing error is affected by the difference, and information on the relative positional relationship between the light emitting section and the microlens array section can be obtained. With this, for example, the accuracy of the alignment required by the sensor unit can be reduced. As a result, for example, the exposure accuracy of the two-dimensional pattern in the exposure device can be easily improved.

According to the exposure apparatus of the second aspect, for example, since the plurality of microlenses and the adjustment mark are located in the microlens array, the alignment of the plurality of microlenses and the adjustment mark is easy. As a result, for example, the exposure accuracy of the two-dimensional pattern in the exposure device can be improved.

According to the exposure apparatus of the third aspect, for example, at least one of the light emitting portion and the microlens array portion is moved in response to information on the relative positional relationship between the two adjustment light spots and the adjustment marks, thereby reducing It also includes a shift in the relative positions of the plurality of light-emitting regions and the rotation directions of the plurality of microlenses. As a result, for example, the exposure accuracy of the two-dimensional pattern in the exposure device can be improved.

According to the exposure apparatus of the fourth aspect, for example, a sensor portion having an area sensor is used, whereby the adjustment light spot and the adjustment mark can be obtained regardless of the direction of deviation of the adjustment light spot and the adjustment mark The signal of relative positional relationship. As a result, for example, the exposure accuracy of the two-dimensional pattern in the exposure device can be easily improved. In addition, for example, in the case where there is a measurement sensor useful for grasping the relative positional relationship between the plurality of pattern rays irradiated by the plurality of exposure heads, the sensor for the measurement device is also used as a sensor As a result, the size and complexity of the exposure device can be reduced.

According to the exposure device of the fifth aspect, for example, it is possible to obtain an image in which an adjustment light spot has been captured and an image in which an adjustment mark has been captured in one shot, and the adjustment light point can be used for identification and adjustment The position corresponding to the reference position of the light spot, the adjustment mark can recognize the position corresponding to the reference position of the adjustment mark. Thereby, for example, the sensor unit can quickly acquire the signal of the relative positional relationship between the adjustment light spot and the adjustment mark. As a result, the exposure accuracy of the two-dimensional pattern in the exposure device can be quickly improved. In addition, for example, in order to obtain the signal of the image of the adjustment mark that can recognize the position corresponding to the reference position of the adjustment mark through the sensor section, the exposure device may not be provided with an illumination adjustment other than the light emitting section. Marked lighting. With this, for example, it is possible to reduce the enlargement and complexity of the exposure device.

According to the exposure apparatus of the sixth aspect, for example, it is possible to automatically reduce the relative position between the plurality of light-emitting areas and the plurality of microlenses in response to information on the relative positional relationship between the adjustment light spot and the adjustment mark 'S offset. With this, for example, even when an operator who is not familiar with the adjustment work of the exposure device uses the exposure device, it is possible to reduce the relative positional deviation between the plurality of light-emitting regions and the plurality of microlenses. As a result, for example, the exposure accuracy of the two-dimensional pattern in the exposure device can be easily improved.

The embodiments of the present invention will be described below based on the drawings. In the drawings, parts having the same configuration and function are denoted by the same element symbols, and repeated description is omitted in the following description. The drawings schematically show that the sizes and positional relationships of various structures in the various drawings are not accurately depicted. Attach the XYZ coordinates of the right-hand system to (a), (b) in Figures 1 to 3, 5 to 7, 9, (a) and (b) in Figure 12, and (a) to (b) in Figure 17 system. In this XYZ coordinate system, the main scanning direction of the exposure device 10 is taken as the Y-axis direction, the sub-scanning direction of the exposure device 10 is taken as the X-axis direction, and the vertical direction orthogonal to the two directions of the X-axis direction and the Y-axis direction The direction is the Z-axis direction. Specifically, let the direction of gravity (vertical direction) be the -Z direction.

(1) First embodiment FIG. 1 is a side view showing an example of a schematic configuration of an exposure apparatus 10 of the first embodiment. FIG. 2 is a plan view showing an example of a schematic configuration of the exposure apparatus 10 of the first embodiment.

The exposure device 10 is a direct drawing type drawing device, and is used to irradiate the processing object with pattern light (drawing light) that has been spatially modulated in accordance with CAD (computer-aided design) data, etc. and draws the pattern (E.g., circuit patterns) devices (also called pattern exposure devices) that are exposed (drawn). As the object to be processed, for example, the upper surface of the substrate W (upper surface of the layer of photosensitive material) on which a layer of a photosensitive material such as a resist is formed, or the like is used. More specifically, the substrate W that is the object to be processed in the exposure device 10 includes, for example, a color filter substrate, a liquid crystal display device, or an electronic device included in a semiconductor substrate, a printed substrate, a liquid crystal display device, or the like A glass substrate for a flat panel display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a solar cell panel, etc., which are provided in a plasma display device and the like. In the following description, the substrate W is set as a rectangular substrate.

The exposure apparatus 10 includes, for example, a base 15 and a support frame 16. The support frame 16 is, for example, located on the base 15 and has a gate-like shape in a state where the base 15 is spanned in the X-axis direction. In addition, the exposure apparatus 10 includes, for example, a table 4, a table drive mechanism 5, a table position measuring device 6, an exposure unit 8, and a control unit 9.

(Workbench 4) The table 4 is a part for holding the substrate W. The table 4 is located on the base 15, for example. Specifically, the table 4 has, for example, a flat shape. In this case, the table 4 can hold the substrate W placed on a flat upper surface in a horizontal posture, for example. Here, for example, as long as there are a plurality of suction holes (not shown) on the upper surface of the table 4, the table 4 can form a negative pressure (suction pressure) by the plurality of suction holes in a fixed state. The substrate W is held on the upper surface of the table 4.

(Workbench drive mechanism 5) The table driving mechanism 5 can move the table 4 relative to the base 15, for example. The table driving mechanism 5 is located on the base 15, for example. The table driving mechanism 5 includes, for example, a rotating mechanism 51, a support plate 52, and a sub-scanning mechanism 53. The rotation mechanism 51 can rotate the table 4 in the rotation direction (the rotation direction around the Z axis (θ direction)), for example. The support plate 52 supports the table 4 via the rotation mechanism 51, for example. The sub-scanning mechanism 53 can move the support plate 52 in the sub-scanning direction (X-axis direction), for example. In addition, the table driving mechanism 5 includes, for example, a base plate 54 and a main scanning mechanism 55. The base plate 54 supports the support plate 52 via the sub-scanning mechanism 53, for example. The main scanning mechanism 55 can move the base plate 54 in the main scanning direction (Y-axis direction), for example.

Specifically, the rotating mechanism 51 passes, for example, the center of the upper surface of the table 4 (the mounting surface on which the substrate W is mounted), and can be centered on the virtual rotation axis A perpendicular to the mounting surface. The table 4 rotates. As a structure of the rotation mechanism 51, for example, a structure including a rotation shaft portion 511 and a rotation driving portion (for example, a rotation motor) 512 can be adopted. In this case, the rotation shaft portion 511 is in a state extending in the vertical direction (Z-axis direction). The upper end of the rotating shaft portion 511 is, for example, fixed to the back side of the table 4. The rotation drive unit 512 is, for example, in a state where the lower end of the rotation shaft portion 511 is rotatably held, and can rotate the rotation shaft portion 511. According to such a configuration, for example, the table 4 can rotate in the horizontal plane with the rotation axis A as the center in response to the rotation of the rotation shaft portion 511 by the rotation driving portion 512. Here, for example, the rotation mechanism 51 may be replaced by applying known rotation correction such as affine transformation to the pattern data 960 described later to perform position alignment in the rotation direction.

The sub-scanning mechanism 53 includes, for example, a linear motor 531 and a pair of guide members 532. The linear motor 531 includes, for example, a moving member located on the lower surface of the support plate 52 in a state of being mounted on the lower surface of the support plate 52, and a fixed member located on the base in a state of being laid on the upper surface of the base plate 54 The upper surface of the board 54. The pair of guide members 532 are placed on the upper surface of the base plate 54 in a state where they are laid on the upper surface of the base plate 54 in parallel with each other in the sub-scanning direction, for example. Here, for example, a ball bearing is located between each guide member 532 and the support plate 52. The ball bearing system can move along the longitudinal direction (sub-scanning direction) of the guide member 532 while sliding with respect to the guide member 532, for example. Therefore, the support plate 52 is in a state of being supported by the pair of guide members 532 via the ball bearings. Thus, for example, when the linear motor 531 is operated, the support plate 52 can be smoothly moved in the sub-scanning direction while being guided by the pair of guide members 532.

The main scanning mechanism 55 has, for example, a linear motor 551 and a pair of guide members 552. The linear motor 551 has, for example, a moving member in a state of being mounted on the lower surface of the base plate 54 and a fixing member in a state of being laid on the base 15. The pair of guide members 552 are, for example, in a state where they are laid parallel to each other on the upper surface of the base 15 along the main scanning direction. Here, each guide member 552 is applied to, for example, an LM guide assembly (registered trademark) that is a mechanical element member that uses a "rolling" to guide the linear motion portion of the machine. In addition, when, for example, an air bearing is located between each guide member 552 and the base plate 54, the base plate 54 is supported without contacting the guide member 552. According to this configuration, for example, when the linear motor 551 is operated, the base plate 54 can be smoothly moved along the main scanning direction without friction while being guided by the pair of guide members 552.

(Table position measurement section 6) The table position measuring unit 6 can measure the position of the table 4, for example. As the table position measuring unit 6, for example, an interference type laser length measuring device can be used. The interference type laser length measuring device can, for example, emit laser light from the outside of the work table 4 toward the work table 4 and receive the reflected light of the laser light, and measure the position of the work table 4 based on the interference between the reflected light and the emitted light (Specifically, the position in the Y direction along the main scanning direction). Here, for example, a linear scale can be used instead of the laser length measuring device.

(Exposure section 8) The exposure unit 8 can form pattern light and irradiate the pattern light onto the substrate W, for example. The exposure unit 8 includes, for example, a plurality of exposure units 800 and a sensor unit 850. FIG. 3 is a schematic perspective view showing the configuration of the exposure unit 800 and the sensor unit 850 of the first embodiment. FIG. 4 is a schematic side view showing the configuration of the exposure head 82 and the sensor unit 850 of the first embodiment. In FIG. 4, a mirror 825, a spatial light modulator 820, a first imaging optical system 822, a microlens array section (also called an MLA section) 824, a second imaging optical system 826, and a sensor section 850 are omitted They are arranged on the same optical axis. The exposure unit 8 includes, for example, a plurality of exposure units 800 (for example, nine units) shown in FIG. 3. Here, for example, the number of exposure units 800 in the exposure unit 8 may not be nine, but may be one or more. Each exposure unit 800 has, for example, an exposure head 82 and is supported by the support frame 16. Here, the support frames 16 include, for example, a plurality of exposure heads 82 arranged in the X-axis direction, and are provided in a state of supporting the arrangement of a plurality of (for example, two) exposure heads 82 arranged in the Y-axis direction (see FIG. 2 and Figure 9).

(Light source 80) The light source unit 80 can generate, for example, light that is the basis of pattern light irradiated to the substrate W by the exposure unit 8. For example, each exposure unit 800 may have one light source section 80, or a plurality of exposure units 800 may also have one light source section 80. The light source unit 80 includes, for example, a laser oscillator and an illumination optical system. The laser oscillator can receive the driving signal from the laser drive unit and output laser light. The illumination optical system can set the light (spot beam) output from the laser oscillator to light with a uniform intensity distribution. The light output from the light source unit 80 is input to the exposure head 82. Here, for example, a configuration may be adopted in which the laser light system output from one light source unit 80 is divided into a plurality of laser lights and input to a plurality of exposure heads 82.

(Exposure head 82) The exposure head 82 has, for example, a spatial light modulator 820, a first imaging optical system 822, an MLA portion 824, a mirror 825, and a second imaging optical system 826. In addition, the exposure head 82 may have a measuring device 84, for example. In the first embodiment, as shown in FIG. 3, for example, the spatial light modulator 820, the first imaging optical system 822, and the MLA unit 824 are located on the +Z direction side of the support frame 16. In addition, for example, the second imaging optical system 826 and the measuring device 84 are located on the +Y direction side of the support frame 16. Such an exposure head 82 is arranged in a state of being stored in a first storage box (not shown), for example. In this case, the first storage box is arranged in a state of extending in the +Y direction on the +Z direction side of the support frame 16 and extending in the -Z direction on the +Y direction side of the support frame 16. The light source unit 80 is located in the second storage box 802, for example, and the second storage box 802 is arranged in a state of being fixed to the +Z direction side of the first storage box. Here, for example, the light output from the light source unit 80 in the −Z direction is reflected by the mirror 804 and enters the spatial light modulator 820.

In addition, in the first embodiment, as shown in FIG. 3, the spatial light modulator 820, the first imaging optical system 822, and the MLA portion 824 are located along the optical axis 822p of the first imaging optical system 822 (see FIG. 5) ) Has been online. Here, as shown in FIG. 3, the pattern light passing through the first imaging optical system 822 and the MLA portion 824 advances in the +Y direction, irradiates the mirror 825 and is reflected in the -Z direction. The reflected pattern light is incident on the second imaging optical system 826. Therefore, for example, some of the components included in the exposure head 82 are located on a straight line along the Y-axis direction, and other components are located on a straight line along the Z-axis direction. In other words, for example, a plurality of components included in the exposure head 82 are arranged on an L-shaped path. With this, for example, the height of the exposure head 82 in the Z-axis direction can be reduced compared to the case where a plurality of components included in the exposure head 82 are located on a straight line along the Z-axis direction. As a result, for example, the height of the exposure device 10 can be reduced, and the degree of freedom in setting the exposure device 10 can be improved.

(Space Light Modulator 820) The spatial light modulator 820 has a digital mirror device (DMD; digital mirror device). The digital reflecting element can, for example, reflect necessary light rays that contribute to the drawing of the pattern and unnecessary light rays that do not contribute to the drawing of the pattern in different directions, thereby spatially modulating the incident light. A spatial modulation element can be used as a digital reflection element. The spatial condition element is arranged in a state in which a plurality of (1920×1080) micromirrors M1 are arranged in a matrix on the memory unit. Each micromirror M1 constitutes, for example, one pixel of a square shape with a side of about 10 µm. The digital reflective element has a rectangular outer shape of, for example, approximately 20 mm×10 mm when viewed from the side of the micromirror M1. In the digital reflection element, for example, the digital signal is written to the memory unit according to the control signal from the control unit 9, and each of the micromirrors M1 is tilted to a desired angle with the diagonal line as the center. Thereby, pattern light that has responded to digital signals is formed. In other words, the spatial light modulator 820 is, for example, a part having a plurality of micromirrors M1 (also referred to as a light-emitting part). The plurality of micromirrors M1 are used to reflect the light incident from the light source 80. Multiple areas (also called light-emitting areas) that emit light separately.

FIG. 5 is a schematic side view showing an example of the configuration of the first unit 850 in the exposure head 82 of the first embodiment. As shown in FIG. 5, the first unit 850 has, for example, a reference portion 850b, a spatial light modulator 820, a first base portion 820b, an MLA portion 824, and a second base portion 824b.

The reference portion 850b is, for example, a portion that becomes a reference for configuring the position of each portion of the first unit 850. In the first embodiment, the reference portion 850b includes the support frame 16 or other members fixed to the support frame 16. Other components may include, for example, the first storage box described above. Here, in the case where there is a lens moving portion that holds the second lens 12L (refer to FIG. 4) and the MLA portion 824 so as to be movable in the optical axis direction (Y-axis direction), the reference portion 850b may be used. Contains a lens moving unit.

The first base portion 820b is, for example, in a state of being connected to the reference portion 850b and in a state of holding the spatial light modulator 820. When viewed sideways in the −X direction in the example of FIG. 5, the first base portion 820 b extends from the reference portion 850 b in the +Z direction (also referred to as the upper direction) opposite to the vertical direction. In addition, the spatial light modulator 820 is in a state held by one side of the first base portion 820b (also referred to as a cantilever state) above the reference portion 850b. Thereby, for example, the first base portion 820b can be reduced in size and the number of members can be reduced, and the height of the exposure head 82 can be reduced. The first base portion 820b may be, for example, various members in a state of being fixed to the reference portion 850b, or may be in a state of being integrally formed with the reference portion 850b.

In addition, the first base portion 820b may hold the spatial light modulator 820 in such a manner that the relative position of the spatial light modulator 820 relative to the reference portion 850b can be changed. In this case, the first base portion 820b has, for example, a first driving portion 820d that can move the spatial light modulator 820 as a movable portion (also referred to as a movable portion). The first driving part 820d includes, for example, a mechanism (also referred to as a parallel mechanism) for moving the spatial light modulator 820 in the X-axis direction, and for moving the spatial light modulator 820 in the Z-axis direction. A parallel mechanism and a mechanism (also referred to as a rotation mechanism) for rotating the spatial light modulator 820 about the optical axis 822p along the Y-axis direction as a center. The parallel mechanism is realized by, for example, a structure having the following components: a linear guide; and a linear action mechanism such as a ball screw, which can convert the rotational force given by a hexagonal wrench or the like into a straight line The power of the action component; or the stepping motor (stepping motor) is a force that automatically generates a linear action component in response to the electrical signal; or the piezoelectric element. The rotating mechanism is realized by, for example, a structure having the following components: a rotating shaft; a bearing; and a mechanism that can convert the force of a linear motion component given by a linear motion mechanism such as a ball screw into a rotational force; or a rotary motor, which responds The imparting of electrical signals automatically generates rotational force. As a method for converting a linear motion component into a rotation component, for example, a rack, a spur wheel method, or a link mechanism method can be mentioned. With the first driving portion 820d having such a configuration, for example, the relative positional relationship between the spatial light modulator 820 and the MLA portion 824 can be adjusted.

(First imaging optical system 822) The first imaging optical system 822 has a first lens barrel 8220 and a second lens barrel 8222. As shown in FIG. 4, the first lens barrel 8220 is in a state of holding the first lens 10L. The second lens barrel 8222 is in a state of holding the second lens 12L. The first lens 10L and the second lens 12L are located on the path of the patterned light formed by the spatial light modulator 820. As shown in (a) of FIG. 5, for example, the optical axis 822p of the first imaging optical system 822 is located along the Y-axis direction. Here, for example, the first lens 10L can integrate the pattern light output from each micromirror M1 of the spatial light modulator 820 into parallel light along the Y-axis direction and guide it to the second lens 12L. The first lens 10L system may be composed of, for example, one lens or plural lenses. The second lens 12L is, for example, an image side telecentric lens, and can guide the pattern light from the first lens 10L to the MLA portion 824 in a state parallel to the optical axis 822p of the second lens 12L. Here, an expansion optical system is applied to the first imaging optical system 822, which images the patterned light formed by the spatial light modulator 820, for example, at a lateral magnification of more than one time (for example, about twice). In this case, for example, the radius of the second lens 12L becomes larger than the radius of the first lens 10L. The first lens barrel 8220 and the second lens barrel 8222 are provided, for example, in a state of being directly fixed to the support frame 16 or indirectly fixed to the support frame 16 via another member. Other members may include, for example, the first storage box described above.

(Microlens array section (MLA section) 824) The MLA part 824 has a microlens array (also called MLA) 824a. The MLA824a system has a plurality of microlenses ML1. In the MLA824a of the first embodiment, a plurality of microlenses ML1 are arranged integrally. The plurality of microlenses ML1 are arranged in a state of being arranged in a matrix so as to correspond to the plurality of micromirrors M1 as the plurality of light emitting regions in the spatial light modulator 820, for example. In the first embodiment, in each of the X-axis direction and the Z-axis direction, a plurality of microlenses ML1 are arranged at a predetermined pitch set in advance. In addition, the microlens ML1 is located on the path of the light emitted by each of the plurality of micromirrors M1 as the plurality of light emitting regions in the spatial light modulator 820. Thereby, a point of one pixel component of the light beam emitted by the micromirror M1 is formed in each of the plurality of microlenses ML1.

As shown in FIG. 5, the second base portion 824b is in a state where the MLA portion 824 is held. The second base portion 824b is arranged, for example, in a state of being connected to the reference portion 850b. When viewed sideways in the −X direction in the example of FIG. 5, the second base portion 824 b extends from the reference portion 850 b in the +Z direction (also referred to as the upper direction) opposite to the vertical direction. In addition, the MLA portion 824 is in a state held by one side of the second base portion 824b (also referred to as a cantilever state) above the reference portion 850b. Thereby, for example, the second base portion 824b can be reduced in size and the number of members can be reduced, and the height of the exposure head 82 can be reduced. The second base portion 824b may be, for example, various members fixed to the reference portion 850b, or may be in a state of being integrally formed with the reference portion 850b.

In addition, for example, the second base portion 824b may hold the MLA portion 824 such that the relative position of the MLA portion 824 relative to the reference portion 850b may be changed. In this case, the second base portion 824b has, for example, a second driving portion 824d that can move the MLA portion 824 as a movable portion. The second driving portion 824d includes, for example, a parallel mechanism for moving the MLA portion 824 in the X-axis direction, a parallel mechanism for moving the MLA portion 824 in the Z-axis direction, and a MLA portion 824 for moving along The optical axis 822p in the Y-axis direction serves as a rotation mechanism that rotates and moves in the center. The parallel mechanism is realized by, for example, a structure having the following components: a linear guide; and a linear motion mechanism such as a ball screw, which can convert the rotational force given by a hexagonal wrench or the like into a force of linear motion component; or stepping A motor is a force that automatically generates a linear motion component in response to an electrical signal; or a piezoelectric element. The rotating mechanism is realized by, for example, a structure having the following components: a rotating shaft; a bearing; and a mechanism that can convert the force of a linear motion component given by a linear motion mechanism such as a ball screw into a rotational force; or a rotary motor, which responds The imparting of electrical signals automatically generates rotational force. With the second driving portion 824d having such a configuration, for example, the relative positional relationship between the spatial light modulator 820 and the MLA portion 824 can be adjusted.

FIG. 6(a) is a schematic front view showing an example of the configuration of the MLA unit 824 of the first embodiment. As shown in (a) of FIG. 6, the MLA portion 824 has, for example, an area (also called an effective area) Ar1, which includes a plurality of microlenses ML1; and an area (also called an inactive area) Ar2, which is It is located outside the effective area Ar1 in a direction perpendicular to the optical axis of the plurality of microlenses ML1. The effective area Ar1 is, for example, an area in the MLA portion 824 that is used for the formation of pattern light irradiated to the substrate W. Each microlens ML1 has an optical axis parallel to the optical axis 822p of the first imaging optical system 822, for example. Here, the spatial light modulator 820 has the same number or more of micromirrors M1 as the plurality of microlenses ML1 included in the effective area Ar1 in the MLA portion 824. Here, the plurality of microlenses ML1 in the effective area Ar1 condenses light from the plurality of micromirrors M1 of the DMD, thereby forming a dot array composed of a plurality of dots of light (also referred to as a condensing spot) (spot array)824SA. Here, the arrangement and pitch of the light-converging points in the dot array 824SA correspond to the arrangement and pitch of the plurality of microlenses ML1 in the MLA 824a. In the first embodiment, for example, the first imaging optical system 822 is to enlarge the pattern light of about 20 mm×10 mm formed by the spatial light modulator 820 to about twice, so the MLA824a forms dots with an image size of about 40 mm×20 mm Array 824SA. Here, since the light from each micromirror M1 of the DMD is condensed by the microlens ML1 of the effective area Ar1, the size of the dot connecting one pixel component of the light from each micromirror M1 is narrowed and kept relatively high small. Therefore, the sharpness of the image (DMD image) projected on the substrate W can be kept high.

In addition, in the first embodiment, the spatial light modulator 820 has a plurality of micro-mirrors M1 corresponding to the plurality of micro-lenses ML1 corresponding to the effective area Ar1, and also has a light-emitting area for adjustment (also called adjustment One or more micromirrors (also referred to as adjustment micromirrors) M1r (refer to FIG. 5) of the light-emitting area. The adjustment micromirror M1r can irradiate the light emitted from the reflection in the adjustment micromirror M1r to the non-effective area Ar2 of the MLA portion 824. Thereby, the light emitted from the adjustment micromirror M1r and irradiated to the non-effective area Ar2 can form the adjustment light spot (also referred to as adjustment light spot) S1r of one pixel component (refer to FIG. 7 ).

In addition, as shown in (a) of FIG. 6, the MLA portion 824 has an adjustment mark (also referred to as an adjustment mark) Mk1 in the inactive area Ar2. In other words, the inactive area Ar2 includes the adjustment mark Mk1. Here, for example, as long as the plurality of microlenses ML1 and the adjustment mark Mk1 are located in the MLA portion 824, the positional alignment between the plurality of microlenses ML1 and the adjustment mark Mk1 will be easy. In the first embodiment, there are adjustment marks Mk1 near the four corners of the effective area Ar1 in the non-effective area Ar2. In other words, there are four adjustment marks Mk1. In the example of (a) in FIG. 6, the four adjustment marks Mk1 include a first adjustment mark Mk1a, a second adjustment mark Mk1b, a third adjustment mark Mk1c, and a fourth adjustment mark Mk1d. The first adjustment mark Mk1a is located on the side in the +Z direction and near the corner on the side in the +X direction in the effective area Ar1. The second adjustment mark Mk1b is located on the side in the +Z direction and near the corner in the -X direction in the effective area Ar1. The third adjustment mark Mk1c is located on the side in the −Z direction and near the corner on the side in the −X direction in the effective area Ar1. The fourth adjustment mark Mk1d is located on the side in the −Z direction and near the corner on the side in the +X direction in the effective area Ar1. In the case where the MLA portion 824 has four adjustment marks Mk1, the spatial light modulator 820 has four adjustment micromirrors M1r.

Further, for example, for each of the four adjustment marks Mk1, the light rays emitted from the corresponding adjustment micromirrors M1r among the four adjustment micromirrors M1r and irradiated to the non-effective area Ar2 form the adjustment light spot S1r. Specifically, for example, for the first adjustment mark Mk1a, the light emitted from the first adjustment micromirror M1r, which is the first adjustment light-emitting region, and irradiated to the inactive area Ar2 forms the first adjustment light spot S1r. For the second adjustment mark Mk1b, the light emitted from the second adjustment micromirror M1r, which is the second adjustment light-emitting area, and irradiated to the inactive area Ar2 forms the second adjustment light spot S1r. With respect to the third adjustment mark Mk1c, the light emitted from the third adjustment micromirror M1r and irradiated to the inactive area Ar2 forms the third adjustment light spot S1r. For the fourth adjustment mark Mk1d, the light rays emitted from the fourth adjustment micromirror M1r and irradiated to the non-effective area Ar2 form the fourth adjustment light spot S1r. Each adjustment mark Mk1 is located in or near the area where the adjustment light spot is formed by the adjustment micromirror M1r in the non-effective area Ar2.

The adjustment mark Mk1 has, for example, a property that the light transmission state is different from the surrounding part in the inactive area Ar2. Specifically, the adjustment mark Mk1 is applied to, for example, a film (also referred to as a light-shielding film) for blocking the transmission of light located on the surface portion of the MLA portion 824 and the like. As the light-shielding film, for example, a metal-made or resin-made film having light-shielding properties is used. Here, for example, when a metal thin film is used for the light shielding film, the light shielding film can be easily thinned by various film forming methods such as sputtering, and the light shielding film can be easily realized by various film forming methods and etching. Patterning of shapes. The material of the metal film is made of chromium, nickel or aluminum. In addition, the light-shielding film may be located in a portion other than the plurality of microlenses ML1 in the effective area Ar1, or may be located in a region along the outer peripheral portion of each microlens ML1. In this case, for example, when viewing the MLA portion 824 in a plan view along the +Y direction of the optical axis 822p, the light shielding film is arranged so as to surround each microlens ML1.

6(b) is a schematic front view showing an example of the configuration of the adjustment mark Mk1 in the MLA unit 824 of the first embodiment. As shown in (b) of FIG. 6, in the first embodiment, the adjustment mark Mk1 is, for example, a pattern Pt1 having a light-shielding film. In the example of (b) in FIG. 6, the pattern Pt1 is in a state where four portions (also referred to as window portions) W1 where no light-shielding film is present are formed. Each window portion W1 has, for example, a shape and size corresponding to the adjustment spot S1r of one pixel component. Each window portion W1 has a square shape, for example. The four window portions W1 are arranged in a state in which two window portions W1 are arranged along the X-axis direction and two window portions W1 are arranged along the Z-axis direction. Accordingly, the pattern Pt1 includes a cross-shaped portion (also referred to as a cross portion) between the four window portions W1. Here, the four window portions W1 refer to the positions of the plurality of microlenses ML1 arranged in a matrix in the effective area Ar1, and exist in the X-axis direction and the Z-axis direction at half of the predetermined pitch in each of them. The matrix-like position of the component.

7 is a schematic front view showing an example of the adjustment mark Mk1 and the adjustment light spot S1r in the first embodiment. In the case where the adjustment mark Mk1 shown in (b) in FIG. 6 is used, as shown in FIG. 7, the pattern Pt1 included in the adjustment mark Mk1 can shield a part of the orientation spot sensing of the adjustment light spot S1r The light of the instrument 850 passes through. In addition, here, for example, in a state where the relative positional shift (also referred to as positional shift) between the spatial light modulator 820 and the MLA portion 824 is not generated, the first reference of the adjustment spot S1r The position Cn1 coincides with the second reference position Cn2 of the pattern Pt1. Here, for example, the center position of the adjustment spot S1r is used as the first reference position Cn1, and the center position of the cross portion of the pattern Pt1 is used as the second reference position Cn2. In addition, in a state where the relative positional shift between the spatial light modulator 820 and the MLA unit 824 has occurred, in accordance with the relative positional shift between the spatial light modulator 820 and the MLA unit 824, the first A reference position Cn1 and the second reference position Cn2 are offset.

(Second Imaging Optical System 826) The second imaging optical system 826 is located, for example, on the path of light rays emitted from the plurality of microlenses ML1 in the MLA portion 824. The second imaging optical system 826 has, for example, a first lens barrel 8260 and a second lens barrel 8262. The first lens barrel 8260 is in a state where the first lens 20L is held, for example. The second lens barrel 8262 is in a state of holding the second lens 22L, for example. The first lens 20L and the second lens 22L are, for example, in a state of being fixed to the support frame 16 at a required interval in the Z-axis direction. More specifically, the first lens barrel 8260 and the second lens barrel 8262 are integrally connected by a connecting member, for example, and the distance between the lens barrels of the first lens barrel 8260 and the second lens barrel 8262 is maintained constant. . As the coupling member, for example, a frame for accommodating the first lens barrel 8260 and the second lens barrel 8262 is used. The first lens 20L may be composed of one lens, or a plurality of lenses.

The second imaging optical system 826 is configured to be telecentric on both sides, for example. For example, when the image side of the second imaging optical system 826 is telecentric, even if the position of the photosensitive material of the substrate W is shifted in the direction of the optical axis of the pattern light, the size of the image of the pattern light becomes constant, and high-precision exposure is possible . Here, for example, when the object side of the second imaging optical system 826 is also telecentric, even assuming that the second lens 12L and the MLA portion 824 of the first imaging optical system 822 can move in the optical axis direction, the second imaging can be maintained In the state of the size of the image of the pattern light on the image side of the optical system 826, the photosensitive material of the substrate W is directly exposed.

For the second lens 22L of the second imaging optical system 826, for example, a magnifying optical system is used. The magnifying optical system magnifies and images the pattern light with a lateral magnification of more than one time (for example, about three times). At this time, the radius of the second lens 22L is larger than the radius of the first lens 20L. Therefore, for example, the dot array 824SA is enlarged by about three times by the second imaging optical system 826 to a size of about 120 mm×60 mm, and is projected onto the upper surface of the photosensitive material of the substrate W (also referred to as a photosensitive material surface). The surface of the photosensitive material is a surface (also referred to as a projection surface) FL1 on which the pattern light is projected by the exposure head 82.

(Projection of patterned light from the exposure head 82) According to the exposure head 82 of the first embodiment having the above configuration, the pattern light formed by the DMD as the spatial light modulator 820 is projected through the first imaging optical system 822, the MLA portion 824, and the second imaging optical system 826 To the substrate W. Next, the pattern light formed by the DMD follows the movement of the table 4 for the main scanning mechanism 55, and the reset pulse made based on the encoder signal of the main scanning mechanism 55 is continuous Was changed sexually. With this, the pattern light is irradiated to the photosensitive material surface (projection surface FL1) of the substrate W and a stripe-like image is formed (see FIG. 9 ).

Here, for example, there may be a lens moving part for movably holding the second lens 12L of the first imaging optical system 822 and the MLA part 824 in the optical axis direction (here, the Y axis direction) ). The lens moving unit may be configured to include a moving plate, a pair of guide rails, and a moving driving unit, for example. For example, a pair of guide rails is located on the support frame 16, for example. The moving plate is, for example, a rectangular plate-shaped member, and is located on the guide rail. The second lens barrel 8222 and the MLA portion 824 are arranged, for example, in a state of being fixed to the upper surface of the moving plate at a required interval in the Y-axis direction. At this time, for example, the moving plate system receives the driving force from the moving driving unit and can move in the Y-axis direction while being guided by the pair of guide rails. As a result, the second lens 12L and the MLA portion 824 can move in the direction approaching the first lens 10L (−Y direction) and away from the first lens 10L (+Y direction). The moving drive unit is composed of, for example, a linear motor type or ball screw type drive unit. The mobile drive unit can move the mobile board according to the control signal from the control unit 9, for example.

Thus, for example, as long as the second lens 12L and the MLA portion 824 can move in the optical axis direction (Y-axis direction), the measuring device 84 may be present as shown in FIG. 3. The measuring device 84 can measure the separation distance between the exposure head 82 and the photosensitive material surface (projection surface FL1) which is the surface of the substrate W. The measuring device 84 can be disposed, for example, at the lower end of the second lens barrel 8262, at a position away from the second imaging optical system 826, or on the support frame 16. The measuring device 84 includes, for example, an illuminator 840 that irradiates the laser light onto the substrate W, and a light receiver 842 that receives the laser light reflected by the substrate W. The illuminator 840 irradiates the upper surface of the substrate W with laser light, for example, along an axis inclined at a predetermined angle with respect to the normal method to the surface of the substrate W (here, the Z-axis direction). The light receiver 842 has, for example, a line sensor extending in the Z-axis direction, and can detect the incident position of the laser light reflected on the surface of the substrate W on the line sensor. With this, for example, the separation distance between the exposure head 82 and the photosensitive material surface (projection surface FL1) of the substrate W can be measured. The control unit 9 can adjust the imaging position (focus position) in the optical axis direction of the pattern light output from the exposure head 82 in response to the signal of the separation distance detected by the measuring device 84. In this case, for example, the control unit 9 outputs a control signal to the lens moving unit and moves the moving plate, whereby the second lens 12L of the second lens barrel 8222 and the MLA unit 824 can move in the Y-axis direction.

Here, for example, when the measuring device 84 approaches the position of the photosensitive material surface (projection surface FL1) of the substrate W that is irradiated with the pattern light output from the second imaging optical system 826, it can be measured immediately before or at approximately the same time as the exposure The height of the photosensitive material surface (projection surface FL1) of the substrate W varies. At this time, for example, the control unit 9 can adjust the focal length position of the pattern light based on the measurement result. In addition, the height of each portion of the photosensitive material surface (projection surface FL1) of the substrate W may be measured in advance before exposure, and the control unit 9 adjusts the focus position at the timing of exposure of the exposure head 82 for each portion.

(Sensor part 850) The sensor unit 850 has an optical system 851 and a sensor 852, for example. The optical system 851 and the sensor 852 are arranged, for example, in such a way that they can be located on the path of the light including the adjustment mark Mk1 in the inactive area Ar2 emitted from the spatial light modulator 820 and having passed through the MLA portion 824 . Specifically, for example, as shown in FIGS. 3 and 4, when the exposure head 82 irradiates the substrate W with pattern light, the surface on which the projection surface FL1 on which the pattern light is projected by the exposure head 82 is located as an imaginary reference surface, the sensor The portion 850 can be located on the side opposite to the exposure head 82 with the virtual reference plane interposed. The sensor unit 850 can be arranged on the base 15 such that the table 4 is positioned directly under the exposure head 82 in a state where the table 4 is retracted from directly under the exposure unit 8. The sensor unit 850 is held by the base 15 in a state that it can move along the upper surface of the base 15, for example. The sensor unit 850 has a configuration such as a combination of a linear motor, a linear guide, and a plate, etc., which can move along the upper surface of the base 15 in the X-axis direction and the Y-axis direction, respectively.

The optical system 851 has, for example, an objective lens, an imaging lens, and the like. For the objective lens system, for example, a lens having an appropriate magnification is used. The imaging lens system can, for example, image the light incident from the subject through the objective lens to the sensor 852. In the first embodiment, the optical system 851 is capable of imaging light emitted from the non-effective area Ar2 of the MLA unit 824 onto the light-receiving surface of the sensor 852, for example. The sensor 852 is, for example, an application area sensor. The area sensor has, for example, a plurality of light-receiving elements arranged in the X-axis direction as the first direction and a plurality of light-receiving elements arranged in the Y-axis direction crossing the first direction and being the second direction Light receiving element. The area sensor is, for example, an imaging element such as a CCD (Charge Coupled Device). The first direction and the second direction in the area sensor may not be orthogonal, but have a relationship of crossing at different angles (for example, 60°, etc.). In other words, the area sensor may have, for example, a plurality of light-receiving elements in a two-dimensional arrangement. In addition, the sensor portion 850 may have, for example, an illumination portion (also referred to as a coaxial illumination portion) 853 that is artificially arranged on the optical axis of the optical system 851. With this, for example, the sensor unit 850 can image the subject (adjustment mark Mk1, etc.) located in a dark place with high accuracy while illuminating the subject with the coaxial illumination unit 853. The coaxial illumination unit 853 is applied to, for example, a laser light emitting diode as a light source, a collimated lens, a half mirror, or the like.

The sensor unit 850 can output the adjustment light spot S1r and the path of the light emitted from the spatial light modulator 820 and passing through the area including the adjustment mark Mk1 in the inactive area Ar2 of the MLA unit 824, for example. The signal of the relative positional relationship between the marks Mk1 for adjustment of the MLA unit 824 is emitted from the plurality of micromirrors M1 in the spatial light modulator 820 and is formed by the micromirrors M1r for adjustment There is light irradiating to the non-effective area Ar2.

Here, for example, it is assumed that the sensor section 850 captures the adjustment spot S1r when the light beam is irradiated from the adjustment micromirror M1r to the inactive area Ar2, and the light beam is not irradiated from the adjustment micromirror M1r to the non-effective area The mark Mk1 for shooting adjustment is in the effective area Ar2. In this case, the sensor unit 850 can output a signal that has captured the first image of the adjustment spot S1r including the first reference position Cn1 and an adjustment mark that has captured the second reference position Cn2 The signal of the second image of Mk1. The relative relationship between the position of the adjustment spot S1r in the first image and the position of the adjustment mark Mk1 in the second image is the relative position between the position of the adjustment spot S1r and the adjustment mark Mk1 Correspondence. Therefore, the sensor unit 850 can output the signal of the relative positional relationship between the adjustment spot S1r and the adjustment mark Mk1 by the output of the signal of the first image and the output of the signal of the second image.

In the first embodiment, the sensor unit 850 can be moved along the base 15 to a position where each adjustment mark Mk1 can be photographed, and there are four adjustment marks Mk1 in the MLA unit 824. Therefore, for example, the sensor unit 850 can output a signal of the relative positional relationship (also referred to as the first relative positional relationship) between the first adjustment spot S1r and the first adjustment mark Mk1a. The sensor unit 850 can output a signal of a relative positional relationship (also referred to as a second relative positional relationship) between the second adjustment spot S1r and the second adjustment mark Mk1b. The sensor unit 850 can output a signal of a relative positional relationship (also referred to as a third relative positional relationship) between the third adjustment spot S1r and the third adjustment mark Mk1c. The sensor unit 850 can output a signal of a relative positional relationship (also referred to as a fourth relative positional relationship) between the fourth adjustment spot S1r and the fourth adjustment mark Mk1d.

In this way, the exposure device 10 can obtain information on the relative positional relationship between the adjustment spot S1r and the adjustment mark Mk1 in the MLA unit 824 through the sensor unit 850, for example. Therefore, the exposure device 10 can obtain a spatial light modulator without being affected by manufacturing errors such as magnification errors and aberrations in the second imaging optical system 826 between the MLA portion 824 and the photosensitive material of the substrate W Information on the relative positional relationship between 820 and the MLA unit 824. With this, for example, the accuracy of the alignment required by the sensor unit 850 can be reduced. In addition, for example, according to information on the relative positional relationship between the adjustment spot S1r and the adjustment mark Mk1 in the MLA unit 824, at least one of the spatial light modulator 820 and the MLA unit 824 is moved, thereby reducing The relative position of the spatial light modulator 820 and the MLA unit 824 is shifted. In addition, for example, even if there is a magnification error and aberration in the second imaging optical system 826, the sensor portion 850 can capture the MLA portion 824 as long as the sensor portion 850 can relatively move relative to the plurality of exposure heads 82 The relative positional relationship between the adjustment spot S1r and the adjustment mark Mk1 in. As a result, for example, the exposure accuracy of the two-dimensional pattern in the exposure device 10 can be easily improved.

Here, for example, a case where the size of the adjustment spot S1r is about 60 μm×60 μm and the line width of the cross portion of the adjustment mark Mk1 is about 6 μm. In this case, for example, when the first reference position Cn1 and the second reference position Cn2 coincide, the adjustment spot S1r viewed from the side of the sensor portion 850 is in each window portion W1 by the presence of the cross portion It has a size of approximately 27µm×27µm×. Here, for example, the following sensor unit 850 is assumed: the magnification of the object lens is 20 times, the size of the light-receiving surface of the area sensor is 8.4 mm×7.0 mm, and the arrangement pitch of the light-receiving elements is 3.45 μm. At this time, in the sensor section 850, the observation field of view in the MLA section 824 becomes 420µm×350µm, and the size of the tiny portion of the MLA section 824 captured in one pixel of the image that can be captured becomes About 0.173µm×0.173µm. That is, the resolution of the sensor unit 850 becomes 0.173 µm. Therefore, in the image obtainable by the sensor unit 850 for capturing, information on the relative positional relationship between the adjustment spot S1r and the adjustment mark Mk1 is captured with sufficient accuracy. In addition, for example, it is assumed here that even if the adjustment spot S1r expands and contracts by several tens of μm when viewed from the side of the sensor portion 850 due to magnification error and aberration of the second imaging optical system 826, the sensor portion 850 can The wide observation field makes it easy to obtain an image in which the adjustment spot S1r has been captured. Therefore, there is no need for high-precision and complicated positioning of the sensor unit 850.

In addition, for example, the sensor portion 850 having an area sensor can obtain the difference between the adjustment spot S1r and the adjustment mark Mk1 regardless of the direction of the offset between the adjustment spot S1r and the adjustment mark Mk1 The signal of relative positional relationship. As a result, for example, the exposure accuracy of the two-dimensional pattern can be easily improved in the exposure device 10.

In addition, for example, the following case is assumed: In the case where the exposure device 10 has a plurality of exposure heads 82, the exposure device 10 has a position for measuring the pattern light irradiated by each exposure head 82 to the projection surface FL1 and the table 4 A relative positional sensor (also called measurement sensor). According to the measurement sensor, it is possible to grasp the relative positional relationship of the plural pattern rays irradiated by the plural exposure heads 82. Here, for example, a measurement sensor may shoot a plurality of exposure heads 82 across a transparent glass plate with a chart. In this case, for example, as long as the sensor for measurement is used as the sensor portion 850, the size and complexity of the exposure device 10 can be reduced. As a result, the increase in the manufacturing cost of the exposure device 10 can be reduced.

(Control section 9) FIG. 8 is a block diagram showing an example of the busbar wiring of the exposure apparatus 10 of the first embodiment. The control unit 9 has a central computing unit (that is, CPU (Central Processing Unit)) 90, a dedicated read memory (that is, ROM (Read Only Memory)) 92, and RAM (Random Access) Memory; random access memory) 94 and memory section 96. The CPU 90 has a function as an arithmetic circuit. The RAM94 system has a function as a temporary work area of the CPU 90. The memory section 96 uses a non-volatile recording medium.

The control unit 9 is connected to the rotating mechanism 51, the sub-scanning mechanism 53, the main scanning mechanism 55, the light source unit 80 (e.g., light source driver), the spatial light modulator 820, via bus wiring, a network line, or a serial communication line, respectively. The constituent elements of the exposure device 10 such as the measuring device 84 and the sensor section 850 are connected, and control the operations of various constituent elements. These constituent elements may include, for example, a lens moving part that holds the second lens 12L and the MLA part 824 so as to be movable in the optical axis direction (Y-axis direction).

The CPU 90 executes the program 920 stored in the ROM 92 while reading, thereby performing calculations on various data stored in the RAM 94 or the memory section 96. The control unit 9 has a general computer configuration, for example. The drawing control unit 900 and the positional relationship recognition unit 910 are functional elements realized by the CPU 90 operating in accordance with the program 920. Some or all of these elements may be realized by logic circuits, for example. Here, for example, the drawing control unit 900 controls the operations of various components connected to the control unit 9, whereby pattern light (drawing light) can be irradiated to the upper surface of the substrate W. The positional relationship recognition unit 910 can recognize the relative position between the adjustment mark Mk1 of the MLA unit 824 and the adjustment light spot S1r for each adjustment mark Mk1 of the MLA unit 824, for example, based on the signal of the image obtained by the sensor unit 850.

The memory section 96 stores, for example, pattern data 960 for displaying the pattern to be drawn on the substrate W. The pattern data 960 is, for example, image data in which data in the form of vectors made by CAD software or the like has been developed into data in the form of rasters. The control unit 9 controls, for example, the DMD of the spatial light modulator 820 according to the pattern data 960, whereby the light beam output from the exposure head 82 can be modulated. In the exposure device 10, for example, a modulated reset pulse wave can be generated in accordance with the linear scale signal sent from the linear motor 551 of the main scanning mechanism 55. The DMD of the spatial light modulator 820 operated according to the reset pulse wave can output pattern light that has been modulated according to the position of the substrate W from each exposure head 82. In the first embodiment, the pattern data 960 may be, for example, data for displaying a single image (image for displaying a comprehensive pattern to be formed on the substrate W), or may be used for displaying a single image individually Data of the part of the image that each exposure head 82 draws.

The control unit 9 is connected to, for example, a display unit 980 and an operation unit 982. The display unit 980 is, for example, a general CRT (cathode ray tube) screen or a liquid crystal display. The display unit 980 can display various data images. Here, the display unit 980 can, for example, visually display data on the positional relationship between the adjustment marks Mk1 of the MLA unit 824 and the adjustment light spot S1r as the identification result in the position relationship identification unit 910 . The operation unit 982 is composed of, for example, at least any one of various buttons, various keys, a mouse, and a touch panel, and is operated when the operator inputs various commands to the exposure device 10. For example, in the case where the operation unit 982 includes a touch panel, the operation unit 982 may have a part or all of the function of the display unit 980.

FIG. 9 is a schematic perspective view showing an example of a plurality of exposure heads 82 that are performing pattern exposure. As shown in FIG. 9, the plural exposure heads 82 are arranged, for example, in a linear state along plural columns (here, two rows). At this time, the exposure head 82 of the second line is located between the two exposure heads 82 of the adjacent first line in the sub-scanning direction (X-axis direction), for example. In other words, the plural exposure heads 82 are arranged in a staggered state. The exposure area 82R of each exposure head 82 has a rectangular shape with short sides along the main scanning direction (Y-axis direction). As the table 4 moves in the Y-axis direction, the photosensitive material on the substrate W is formed with a strip-shaped exposed region 8R for each exposure head 82. Here, as described above, for example, when a plurality of exposure heads 82 have a staggered arrangement and the mutually shifted arrangement, the strip-shaped exposed region 8R can be arranged in the X-axis direction without a gap. When the strip-shaped exposed region 8R is arranged in the X-axis direction without a gap, since it is not necessary to move the table 4 in the sub-scanning direction (X-axis direction), the sub-scanning mechanism 53 is unnecessary. The arrangement of the plurality of exposure heads 82 is not limited to the example shown in FIG. 9. For example, a plurality of exposure heads 82 may be arranged between the adjacent exposed regions 8R so as to generate a gap that is a natural multiple of the length of the long side of the exposure region 82R. In this case, for example, the exposure device 10 performs a plurality of main scanning in the Y-axis direction while shifting the length component of the long side of the exposure region 82R in the X-axis direction, whereby a plurality of strip-shaped objects can be exposed without gaps The region 8R is formed in the photosensitive material of the substrate W.

(Identification of the relative position between the spatial light modulator and the MLA unit) FIGS. 10( a) to 11 (b) are diagrams for explaining the identification method of the relative positional relationship between the spatial light modulator 820 and the MLA part 824 which the positional relationship identifying part 910 is. FIG. 10(a) shows an image Im1a captured by the sensor portion 850 and captured by the first adjustment mark Mk1a of the first embodiment through the first adjustment spot S1r. FIG. 10(b) shows the image Im2a in which the first adjustment mark Mk1a of the first embodiment has been captured. FIG. 11(a) shows an image Im1b captured by the sensor unit 850 and captured by the second adjustment mark Mk1b of the first embodiment, capturing the second adjustment spot S1r. FIG. 11(b) shows the image Im2b in which the second adjustment mark Mk1b of the first embodiment has been captured.

For example, the sensor unit 850 captures the first adjustment light spot S1r formed by irradiating the first adjustment mark Mk1a of the MLA unit 824 with the first adjustment micromirror M1r to the light beam, thereby obtaining the image Im1a. At this time, the coaxial lighting portion 853 may not illuminate the MLA portion 824. On the other hand, for example, the sensor unit 850 does not perform the spatial light modulator 820 to irradiate the MLA unit 824 with light beams, but shoots the first adjustment for the first adjustment in a state where the first adjustment mark Mk1a is illuminated by the coaxial illumination unit 853 Mark Mk1a to obtain the image Im2a. In addition, for example, the sensor unit 850 captures the second adjustment light spot S1r formed by irradiating the second adjustment mark Mk1b of the MLA unit 824 with the second adjustment micromirror M1r to the light beam, thereby obtaining the image Im1b. At this time, the coaxial lighting portion 853 may not illuminate the MLA portion 824. On the other hand, for example, the sensor unit 850 does not perform the spatial light modulator 820 to irradiate the MLA unit 824 with the light beam, but shoots the second adjustment for the second adjustment mark illuminating the second adjustment mark Mk1b by the coaxial illumination unit 853 Mark Mk1b to obtain the image Im2b.

Here, the positional relationship recognition unit 910 can recognize the first relative positional relationship between the first adjustment spot S1r and the first adjustment mark Mk1a from the image Im1a and the image Im2a, for example. In addition, the positional relationship recognition unit 910 can recognize, for example, the second relative positional relationship between the second adjustment spot S1r and the second adjustment mark Mk1b from the image Im1b and the image Im2b.

Specifically, for example, the coordinates (Xa, Ya) of the position corresponding to the first reference position Cn1 of the first adjustment spot S1r (also referred to as the first A-corresponding reference position) Cn1a can be obtained for the image Im1a. Here, for example, the four corners C1a, C2a, C3a, and C4a of the area where the first adjustment spot S1r has been captured can be detected using image processing such as pattern matching in the image Im1a, and the four corners can be calculated The average of the coordinates of C1a, C2a, C3a, and C4a, thereby obtaining the coordinates (Xa, Ya). In addition, for example, the coordinates (XAa, YAa) of the position corresponding to the second reference position Cn2 of the first adjustment mark Mk1a (also referred to as the second A-corresponding reference position) Cn2a can be obtained for the image Im2a. Here, for example, image processing such as pattern matching can be used to detect the second A corresponding reference position Cn2a corresponding to the second reference position Cn2 in the image Im2a, thereby obtaining coordinates (XAa, YAa). In addition, the coordinates (Xa, Ya) of the first A corresponding reference position Cn1a corresponding to the first reference position Cn1 and the coordinates (XAa, YAa) of the second A corresponding reference position Cn2a corresponding to the second reference position Cn2 can be recognized Offset. The offset between the coordinates (Xa, Ya) and the coordinates (XAa, YAA) corresponds to the first relative positional relationship between the first adjustment spot S1r and the first adjustment mark Mk1a. Here, for example, the offset of the coordinates on the image may be converted into a first relative positional relationship between the first adjustment spot S1r and the first adjustment mark Mk1a in the actual space.

In addition, for example, the coordinates (Xb, Yb) of the position corresponding to the first reference position Cn1 of the second adjustment light spot S1r (also referred to as the first B corresponding reference position) Cn1b can be obtained for the image Im1b. Here, for example, the four corners C1b, C2b, C3b, C4b of the area where the second adjustment spot S1r has been captured can be detected in the image Im1b using image processing such as pattern matching, and the four corners C1b, C2b, The average of the coordinates of C3b and C4b, thereby obtaining the coordinates (Xb, Yb). In addition, for example, the coordinates (XAb, YAb) of the position corresponding to the second reference position Cn2 of the second adjustment mark Mk1b (also referred to as the second B corresponding reference position) Cn2b can be obtained for the image Im2b. Here, for example, in the image Im2b, image processing such as pattern matching can be used to detect the second B corresponding reference position Cn2b corresponding to the second reference position Cn2, thereby obtaining coordinates (XAb, YAb). In addition, the coordinates (Xb, Yb) of the first B corresponding reference position Cn1b corresponding to the first reference position Cn1 and the coordinates (XAb, YAb) of the second B corresponding reference position Cn2b corresponding to the second reference position Cn2 can be recognized Offset. The offset between the coordinates (Xb, Yb) and the coordinates (XAb, YAb) corresponds to the second relative positional relationship between the second adjustment spot S1r and the second adjustment mark Mk1b. Here, for example, the offset of the coordinates on the image may be converted into a second relative positional relationship between the second adjustment spot S1r and the second adjustment mark Mk1b in the actual space.

In the first embodiment, as described above, the positional relationship recognition unit 910 recognizes, for example, the positional relationship of the first relative and the positional relationship of the second relative, whereby the spatial light modulator 820 and the MLA unit 824 can be recognized Relative positional relationship.

(Reduction of the relative positional deviation between the spatial light modulator and the MLA unit) For example, the photographing by the sensor unit 850 and the relative positional relationship between the spatial light modulator 820 and the MLA unit 824 by the position relationship recognition unit 910 and the spatial light modulator 820 and MLA are interactively performed The adjustment of the relative positional relationship between the parts 824, thereby reducing the relative positional deviation between the spatial light modulator 820 and the MLA part 824.

In the examples of (a) and (b) of FIG. 10, the first adjustment spot S1r is shifted in the −Z direction (downward direction) with respect to the first adjustment mark Mk1a. On the other hand, in the examples of (a) and (b) of FIG. 11, the second adjustment spot S1r is shifted in the +Z direction (upward direction) with respect to the second adjustment mark Mk1b. Therefore, in the examples from (a) in FIG. 10 to (b) in FIG. 11, the pattern light radiated from the spatial light modulator 820 toward the MLA portion 824 is based on the MLA portion 824 and will be along Y The rotation direction with the optical axis 822p of the first imaging optical system 822 in the axial direction as the center is shifted. In other words, the spatial light modulator 820 and the MLA portion 824 have a positional relationship that is relatively shifted in the rotation direction centered on the optical axis 822p.

In this case, for example, the optical axis 822p can be lowered by at least one of the rotational movement of the spatial light modulator 820 by the first driving section 820d and the rotational movement of the MLA section 824 by the second driving section 824d The relative positional deviation between the spatial light modulator 820 and the MLA portion 824 in the rotation direction of the center. Here, for example, the relative positional shift between the spatial light modulator 820 and the MLA portion 824 in the rotation direction centered on the optical axis 822p is set between (Ya-YAa) and (Yb-YAb) The way the difference becomes smaller becomes smaller. In addition, as long as the relationship (Ya-YAa)=(Yb-YAb) holds, there will be no relativity between the spatial light modulator 820 and the MLA portion 824 in the rotation direction centered on the optical axis 822p The state of displacement.

In the first embodiment, as described above, for example, the sensor unit 850 outputs a signal of the relative positional relationship between two or more adjustment light spots S1r and the adjustment mark Mk1. Therefore, the positional relationship recognition unit 910 can recognize that the relative positional deviation of the rotation direction between the spatial light modulator 820 and the MLA unit 824 is also included. Thereby, the relative positional deviation of the rotation direction between the spatial light modulator 820 and the MLA part 824, which is recognized by the position relationship identification part 910, can be reduced, and the spatial light modulator 820 and the MLA part 824 can be reduced The relative positional offset between. As a result, for example, the exposure accuracy of the two-dimensional pattern in the exposure device 10 can be improved.

In addition, for example, at least by the parallel movement of the first driving portion 820d along the X-axis direction of the spatial light modulator 820 and the second driving portion 824d along the X-axis direction of the MLA portion 824, at least One is to reduce the relative positional deviation between the spatial light modulator 820 and the MLA portion 824 in the X-axis direction. Here, for example, the relative positional shift between the spatial light modulator 820 and the MLA portion 824 in the X-axis direction changes in such a manner that the difference between Xa and XAa and the difference between Xb and XAb become smaller small. In addition, when the relationship of Xa=XAa and Xb=XAb is established, there is no relative positional shift between the spatial light modulator 820 and the MLA portion 824 in the X-axis direction.

In addition, for example, at least the parallel movement along the Z-axis direction of the spatial light modulator 820 by the first driving portion 820d and the parallel movement along the Z-axis direction of the MLA portion 824 by the second driving portion 824d can be at least One is to reduce the relative positional deviation between the spatial light modulator 820 and the MLA portion 824 in the Z-axis direction. Here, for example, the relative positional deviation between the spatial light modulator 820 and the MLA portion 824 in the Z-axis direction changes in such a manner that the difference between Ya and Yaa and the difference between Yb and YAb become smaller small. In addition, when the relationship of Ya=YAa and Yb=YAb is established, there is no relative positional deviation between the spatial light modulator 820 and the MLA portion 824 in the Z-axis direction.

(Consolidation of the first embodiment) As described above, according to the exposure apparatus 10 of the first aspect, for example, information on the relative positional relationship between the adjustment spot S1r and the adjustment mark Mk1 in the MLA unit 824 is obtained, and the positional relationship in accordance with the relative position The information moves at least one of the spatial light modulator 820 and the MLA part 824, thereby reducing the relative positional deviation between the spatial light modulator 820 and the MLA part 824. Therefore, for example, even if there is a second imaging optical system 826 that may cause manufacturing errors such as magnification error and aberration between the MLA portion 824 and the exposure object, it will not be affected by the second imaging optical system 826 It is possible to obtain information on the relative positional relationship between the spatial light modulator 820 and the MLA unit 824 due to manufacturing errors such as magnification errors and shrinkage. With this, for example, the accuracy of the alignment required by the sensor unit 850 can be reduced. As a result, for example, the exposure accuracy of the two-dimensional pattern in the exposure device 10 can be easily improved.

(2) Other embodiments The present invention is not limited to the first embodiment, and various changes and improvements can be made without departing from the spirit of the present invention.

(2-1) Second embodiment In the first embodiment described above, for example, the MLA portion 824 may include the MLA 824a and the lens holding portion 824h for holding the MLA 824a. FIG. 12(a) is a schematic side view showing an example of the configuration of the first unit 850 of the second embodiment. FIG. 12(b) is a schematic front view showing an example of the configuration of the MLA unit 824 of the second embodiment. In the examples of FIG. 12(a) and FIG. 12(b), the lens holding portion 824h is a frame-shaped portion along the outer peripheral portion that surrounds the MLA 824a and is arranged to surround the effective area Ar1. For the material of the lens holding portion 824h, a metal having excellent thermal conductivity such as aluminum, stainless steel, brass, and copper may be used, or a transparent material such as glass may be used.

Here, when the material of the lens holding portion 824h is transparent, the adjustment mark Mk1 composed of the pattern Pt1 of the light-shielding film may be located in the portion of the lens holding portion 824h close to the MLA 824a. In this case, the part of the lens holding portion 824h close to the MLA 824a can also be regarded as the non-effective area Ar2. On the other hand, for example, as long as the plurality of microlenses ML1 and the adjustment mark Mk1 are located in MLA824a, the alignment between the plurality of microlenses ML1 and the adjustment mark Mk1 is easy. As a result, for example, the exposure accuracy of the two-dimensional pattern in the exposure device 10 can be improved.

(2-2) Third embodiment In each of the above embodiments, for example, the relative positional relationship between the spatial light modulator 820 and the MLA unit 824 may be automatically adjusted by the control of the control unit 9.

13 is a block diagram showing the busbar wiring of the exposure apparatus of the third embodiment. The block diagram of FIG. 13 is based on the block diagrams (FIG. 8) of the above-mentioned embodiments, and a driving unit 860 is added to the constituent elements of the exposure device 10 connected to the control unit 9 and operates according to the program 920 by the CPU 90 The realized functional element is added to the position adjustment unit 911.

The driving unit 860 includes, for example, at least one of the first driving unit 820d and the second driving unit 824d. Thereby, the driving part 860 can move the movable part of at least one of the spatial light modulator 820 and the MLA part 824, for example. The control unit 9 including the position relationship recognition unit 910 and the position adjustment unit 911 is, for example, a signal that can respond to the relative positional relationship between the spatial light modulator 820 and the MLA unit 824 output from the sensor unit 850, by At least one of the movable part of the spatial light modulator 820 and the MLA part 824 is moved by the driving part 860. Thereby, the control unit 9 can adjust the relative positional relationship between the spatial light modulator 820 and the MLA unit 824, for example.

Here, the position adjusting unit 911 controls the operation of the driving unit 860 based on, for example, the information on the relative positional relationship between the spatial light modulator 820 and the MLA unit 824 recognized by the positional relationship identifying unit 910, thereby adjusting the space The relative positional relationship between the light modulator 820 and the MLA unit 824. Here, for example, it is possible to automatically reduce the positional deviation of the relative system between the spatial light modulator 820 and the MLA unit 824 in accordance with information on the positional relationship between the adjustment spot S1r and the adjustment mark Mk1. With such a configuration, for example, even an operator unfamiliar with the use of the exposure device 10 can reduce the relative positional deviation between the spatial light modulator 820 and the plurality of MLA portions 824. As a result, for example, the exposure accuracy of the two-dimensional pattern in the exposure device 10 can be easily improved.

FIGS. 14 and 15 are used to show the operation of the exposure apparatus 10 of the third embodiment for reducing the relative positional deviation between the spatial light modulator 820 and the MLA portion 824 (also referred to as position adjustment) Flow chart of an example of the flow of operation. The flowchart in FIG. 14 shows the main operation flow of the position adjustment operation. The flowchart in FIG. 15 shows that the sensor part 850 in step Sp1, step Sp8 and step Sp12 of FIG. 14 is used to obtain the relative positional relationship between the spatial light modulator 820 and the MLA part 824 The action flow of the signal action. The position adjustment operation is started, for example, in response to the operation of the operation unit 982 by the operator in response to the predetermined designation input in the exposure apparatus 10, and is performed under the control of the control unit 9.

In step Sp1 of FIG. 14, the sensor unit 850 obtains a signal of the relative positional relationship between the spatial light modulator 820 and the MLA unit 824. In step Sp1, the operation flow from step Sp11 to step Sp16 in FIG. 15 is executed. Here, for convenience of explanation, a process of acquiring the signal of the relative positional relationship between the spatial light modulator 820 and the MLA unit 824 by one exposure head 82 will be described.

In step Sp11, the control unit 9 sets the numerical value k of the adjustment mark Mk1 for displaying that the subject of the sensor unit 850 is the kth (k is a natural number) to 1. In step Sp12, under the control of the control unit 9, the sensor unit 850 is moved to the position for photographing the k-th adjustment mark Mk1. In step Sp13, the sensor part 850 photographs the kth adjustment light spot (for example, the kth adjustment light spot) S1r. At this time, the sensor unit 850 outputs a signal to the control unit 9 that the image of the kth adjustment light spot S1r has been captured. In step Sp14, the sensor part 850 photographs the kth adjustment mark (for example, the kth adjustment mark) Mk1. At this time, the sensor unit 850 outputs a signal of the captured image of the kth adjustment mark Mk1 to the control unit 9. In step Sp15, the control part 9 determines whether the numerical value k has reached the numerical value n (n is a natural number) which shows the number of the adjustment mark Mk1 for displaying a photographic subject. In the examples of (a) in FIG. 6 and (b) in FIG. 12, the control unit 9 can set the value n to any value from 2 to 4 in response to the input that has been responded to the operation of the operation unit 982 by the operator. Numbers. In step Sp15, when the value k does not reach the value n, the control unit 9 adds 1 to the value k in step Sp16 and returns to step Sp12. Next, when the processing from step Sp12 to step Sp16 is repeated for the nth time, the value k reaches the value n, and the operation flow of FIG. 15 is ended.

In step Sp2 of FIG. 14, the positional relationship recognition unit 910 calculates the spatial light modulator in the rotation direction with the optical axis 822p as the center based on the signal of the image obtained by shooting in the previous step Sp13 and step Sp14 The position between 820 and the MLA unit 824 is offset. Here, the calculated positional deviation in the rotation direction is expressed in terms of angle, for example.

In step Sp3, the positional relationship recognition unit 910 determines whether the positional deviation in the rotation direction calculated in step Sp2 is within a predetermined allowable range. Here, when the positional deviation in the rotation direction is not within the allowable range, the process proceeds to step Sp4. The allowable range can be specified by, for example, angle.

In step Sp4, the position adjusting unit 911 causes the moving unit of at least one of the spatial light modulator 820 and the MLA unit 824 to move the driving unit 860 in response to the positional deviation in the rotation direction calculated in step Sp2. The optical axis 822p moves in the rotation direction with the center. When the operation of step Sp4 ends, the process returns to step Sp1. That is, the operations of step Sp1 to step Sp4 are repeated until the adjustment of the positional deviation in the rotation direction is completed. Next, in step Sp3, when it is determined that the positional deviation in the rotation direction is within the allowable range, the process proceeds to step Sp5. With this, the adjustment of the positional deviation in the rotation direction is ended.

In step Sp5, the positional relationship recognition unit 910 calculates the positional deviation between the spatial light modulator 820 and the MLA unit 824 in the X-axis direction based on the signals of the images obtained in the previous steps Sp13 and Sp14 shift. Here, the calculated positional offset in the X-axis direction may be, for example, a positional offset in actual space or a positional offset on an image.

In step Sp6, the positional relationship recognition unit 910 determines whether the positional deviation in the X-axis direction calculated in step Sp5 is within a predetermined allowable range. Here, when the positional deviation in the X-axis direction is not within the allowable range, the process proceeds to step Sp7. The allowable range is defined by, for example, the number of pixels on the image or the distance in actual space.

In step Sp7, the position adjusting unit 911 causes the moving unit of at least one of the spatial light modulator 820 and the MLA unit 824 to be driven by the driving unit 860 in response to the positional offset in the X-axis direction calculated in step Sp5. Move in the X axis direction. When the action of step Sp7 ends, the process proceeds to step Sp8.

In step Sp8, as in step Sp1, the sensor unit 850 acquires a signal of the relative positional relationship between the spatial light modulator 820 and the MLA unit 824. In step Sp8, after performing the operation flow of FIG. 15, it returns to step Sp5. That is, the operations of steps Sp5 to Sp8 are repeated until the adjustment of the positional offset in the X-axis direction is completed. Next, in step Sp6, when it is determined that the positional deviation in the X-axis direction is within the allowable range, the process proceeds to step Sp9. With this, the adjustment of the positional offset in the X-axis direction is ended.

In step Sp9, the positional relationship recognition unit 910 calculates the positional deviation between the spatial light modulator 820 and the MLA unit 824 in the Z-axis direction based on the signals of the images obtained in the previous steps Sp13 and Sp14 shift. Here, the calculated positional offset in the Z-axis direction may be, for example, a positional offset in actual space, or a positional offset on an image.

In step Sp10, the positional relationship recognition unit 910 determines whether the positional deviation in the Z-axis direction calculated in step Sp9 is within a predetermined allowable range. Here, when the positional deviation in the Z-axis direction is not within the allowable range, the process proceeds to step Sp11. The allowable range is defined by, for example, the number of pixels on the image or the distance in actual space.

In step Sp11, the position adjusting unit 911 causes the moving unit of at least one of the spatial light modulator 820 and the MLA unit 824 to move at least one of the spatial light modulator 820 and the MLA unit 824 in response to the positional offset in the Z-axis direction calculated in step Sp9. Move in the Z axis direction. When the operation of step Sp11 ends, the process proceeds to step Sp12.

In step Sp12, as in step Sp1, the sensor unit 850 acquires a signal of the relative positional relationship between the spatial light modulator 820 and the MLA unit 824. In step Sp12, after performing the operation flow of FIG. 15, it returns to step Sp9. That is, the operations of step Sp9 to step Sp12 are repeated until the adjustment of the positional offset in the Z-axis direction is completed. Next, in step Sp10, when it is determined that the positional offset in the Z-axis direction is within the allowable range, the adjustment of the positional offset in the Z-axis direction is ended and the operation flow of the position adjustment operation is ended.

(2-3) Other In the above embodiments, for example, when there is no relative positional deviation between the spatial light modulator 820 and the MLA unit 824, the second reference position Cn2 of the adjustment mark Mk1 and the adjustment light spot S1r The first reference position Cn1 does not need to match, as long as the relative positional relationship is clear, they may not match.

In the above embodiments, for example, as long as the image of the adjustment mark Mk1 captured by the sensor unit 850 is captured, the position of the adjustment mark Mk1 corresponding to the second reference position Cn2 can be recognized, and The position of the adjustment light spot S1r corresponding to the first reference position Cn1 in the image captured by the sensor portion 850 and captured by the adjustment light spot S1r can be recognized, and the shape of the adjustment mark Mk1 may also be Any shape.

(A) in FIG. 16 is a schematic front view showing an example of the variation of the adjustment mark Mk1. (B) in FIG. 16 is a schematic front view showing an example of the variation of the adjustment mark Mk1 and the adjustment light spot S1r. As shown in (a) and (b) of FIG. 16, the adjustment mark Mk1 may not have four window portions W1 but a cross portion formed by a pattern Pt1 in which a light-shielding film is present.

(A) in FIG. 17 is a schematic front view showing another example of the variation of the adjustment marker Mk1. (B) in FIG. 17 is a schematic front view showing another example of the variation of the adjustment mark Mk1 and the adjustment light spot S1r. As shown in FIG. 17(a) and FIG. 17(b), the adjustment mark Mk1 may also have a pattern Pt1 in which there is a large window portion W1 including the adjustment Use the spot S1r area.

In the above embodiments, the number of adjustment marks Mk1 included in the MLA unit 824 may be one. Even with such a configuration, for example, it is possible to reduce the relative positional deviation between the spatial light modulator 820 and the MLA portion 824 in each of the X-axis direction and the Z-axis direction.

In each of the above-mentioned embodiments, for example, as long as the number of adjustment marks Mk1 included in the MLA unit 824 is a large number of three or more, even if there is a convergence of the second imaging optical system 826, etc. The relative positional deviation between the spatial light modulator 820 and the MLA unit 824 is reduced with high accuracy.

In each of the above-mentioned embodiments, for example, as shown in (b) in FIG. 6 and (a) in FIG. 16, as long as the adjustment mark Mk1 has a part for shielding a part of the adjustment light spot S1r, it has faced the sensor portion 850 The pattern Pt1 of light passing through, the sensor part 850 can realize the acquisition and output of the image that has captured the adjustment light spot S1r and the adjustment mark Mk1 in one shot, the adjustment light spot S1r and the adjustment The mark Mk1 can recognize the position corresponding to the first reference position Cn1 and can recognize the position corresponding to the second reference position Cn2. For example, when the amount of light of the adjustment spot S1r is not excessive, as shown in (a) of FIG. 10 and (a) of FIG. 11, the image captured by the adjustment spot S1r can be clearly captured. The image of the cross portion of the pattern Pt1 of the light-shielding film of the light spot S1r for adjustment is shielded. At this time, it becomes possible to recognize the position of the adjustment light spot S1r that has been captured to the first reference position Cn1 and the position of the adjustment mark Mk1 that has been captured to the second reference position Cn2 from the image captured to the adjustment light spot S1r The status of the location. As a result, for example, the sensor unit 850 can quickly acquire the signal of the relative positional relationship between the adjustment spot S1r and the adjustment mark Mk1. As a result, the exposure accuracy of the two-dimensional pattern in the exposure device 10 can be quickly improved. In addition, for example, in order to obtain the signal of the image of the adjustment mark Mk1 that has captured the position corresponding to the second reference position Cn2 in the recognizable adjustment mark Mk1 by the sensor portion 850, the exposure device 10 may not have a space The illumination part other than the light modulator 820 is used for illuminating the adjustment mark Mk1 like the coaxial illumination part 853. As a result, for example, the size and complexity of the exposure device 10 can be reduced.

In this case, for example, the positional relationship between the adjustment spot S1r and the adjustment mark Mk1 in the MLA unit 824 may not be recognized by the position relationship recognition unit 910. For example, the sensor unit 850 may obtain the signal of the image captured by the adjustment spot S1r and the adjustment mark Mk1 at any time, and allow the display unit 980 to output the signal of the image visually. At this time, the operator can drive at least one of the first driving part 820d and the second driving part 824d while watching the display part 980, thereby reducing the relativity between the spatial light modulator 820 and the MLA part 824 Position offset.

In each of the above-mentioned embodiments, for example, the sensor unit 850 may include a line sensor having a plurality of light-receiving elements arranged in a state along the first direction (for example, the X-axis direction) instead of the area sensor, and having A plurality of line sensors of light-receiving elements in a state of being aligned in a second direction (for example, Y-axis direction) crossing the first direction. In this case, for example, the relative positional relationship between the adjustment spot S1r and the adjustment mark Mk1 can also be obtained for the first direction, and the adjustment spot S1r and the adjustment mark Mk1 can be obtained for the second direction Relative positional relationship.

For example, in each of the above-mentioned embodiments, for example, two or more sensor parts 850 may be present on the base 15.

For example, in each of the above-mentioned embodiments, the plurality of light-emitting regions are not limited to the form of emitting light by reflection of light like the micromirror M1 of DMD, and may be a form of emitting light by other forms such as self-luminescence. Here, for example, the spatial light modulator 820 as a light-emitting part can also switch through and block the necessary light that contributes to the drawing of the pattern and the unnecessary light that does not contribute to the drawing of the pattern from the light incident from the light source. In this way, the incident light is used as spatial modulation. In this case, for example, a backlight that performs self-emission is applied to the light source. For the spatial light modulator 820, for example, a transmissive liquid crystal that can switch the transmission and shielding of light in a plurality of areas is used. In such a configuration, the transmissive liquid crystal system functions as a light-emitting portion having a plurality of light-emitting areas that emit light by the transmission of light incident from the backlight as the light source portion .

In each of the above embodiments, for example, the exposure device 10 may also apply the following device: irradiating the metal powder with pattern light, and stabilizing the metal powder in a desired shape, thereby forming a three-dimensional shaped object.

Of course, they can also be combined as appropriate to constitute all or part of the above-described embodiments and various modifications within the scope of no contradiction.

4: Workbench 5: table drive mechanism 6: Workbench position measuring instrument 8: Exposure section 8R: exposed area 9: Control Department 10: Exposure device 10L, 20L: the first lens 12L, 22L: second lens 15: Abutment 16: Support frame 51: Rotating mechanism 52: Support plate 53: Sub-scanning mechanism 54: base plate 55: main scanning mechanism 80: Light source department 82: exposure head 82R: exposure area 84: Measuring device 90: CPU (Central Computing Unit) 92: ROM (read only memory) 94: RAM 96: Memory Department 511: Rotating shaft 512: Rotary drive unit 531, 551: linear motor 532, 552: Guide member 800: exposure unit 802: Second containment box 804, 825: Mirror 820: Space light modulator 820b: First base part 820d: First drive 822: First imaging optical system 822p: optical axis 824: Microlens array section (MLA section) 824a: Microlens Array (MLA) 824b: Second base part 824d: Second drive unit 824h: lens holder 824SA: dot array 826: Second imaging optical system 840: Irradiator 842: Receiver 850: Sensor Department 850b: Reference Department 851: Optical system 852: Sensor 853: Lighting Department (Coaxial Lighting Department) 860: Drive Department 900: Drawing Control Department 910: Location Relationship Recognition Department 911: Position adjustment department 920: Program 960: pattern data 980: Display 982: Operation Department 8220, 8260: the first lens barrel 8222, 8262: Second lens barrel A: Rotating axis Ar1: effective area Ar2: Inactive area C1a, C1b, C2a, C2b, C3a, C3b, C4a, C4b: corner Cn1: first reference position Cn1a: The first A corresponds to the reference position (position) Cn1b: The first B corresponds to the reference position (position) Cn2: second reference position Cn2a: The second A corresponds to the reference position Cn2b: The second B corresponds to the reference position FL1: projection surface Im1a, Im1b, Im2a, Im2b: video M1: Micromirror M1r: Micromirror for adjustment ML1: micro lens Mk1: mark for adjustment Mk1a: Mark for the first adjustment Mk1b: Mark for the second adjustment Mk1c: Mark for third adjustment Mk1d: Fourth adjustment mark Pt1: pattern S1r: Light spot for adjustment Xa, XAa, XAb, Xb, Ya, Yaa, YAb, Yb: coordinates W: substrate W1: Part (window)

FIG. 1 is a side view showing an example of an exposure apparatus of each embodiment. FIG. 2 is a plan view showing an example of an exposure apparatus of each embodiment. FIG. 3 is a schematic perspective view showing an example of the configuration of the exposure unit and the sensor unit in each embodiment. FIG. 4 is a schematic side view showing an example of the configuration of the exposure head and the sensor unit in each embodiment. 5 is a schematic side view showing an example of the configuration of the first unit in the first embodiment. FIG. 6(a) is a schematic front view showing an example of the configuration of the microlens array section of the first embodiment; FIG. 6(b) is used to show the microlens array section of the first embodiment. A schematic front view of an example of the structure of the mark for adjustment. 7 is a schematic front view showing an example of an adjustment mark and an adjustment light spot of the first embodiment. 8 is a block diagram showing an example of bus wiring of the exposure apparatus of the first embodiment. 9 is a schematic perspective view showing an example of a plurality of exposure heads performing pattern exposure. FIG. 10(a) and FIG. 10(b) are diagrams for explaining the identification method of the relative positional relationship between the spatial light modulator and the MLA part. FIG. 11(a) and FIG. 11(b) are diagrams for explaining the identification method of the relative positional relationship between the spatial light modulator and the MLA part. FIG. 12 (a) is a schematic side view for showing an example of the configuration of the first unit of the second embodiment, and FIG. 12 (b) is for showing the configuration of the microlens array section of the second embodiment An example of a schematic front view. 13 is a block diagram showing an example of the busbar wiring of the exposure apparatus of the third embodiment. 14 is a flowchart showing an example of the operation flow for the position adjustment operation in the exposure apparatus of the third embodiment. 15 is a flowchart showing an example of the operation flow for the position adjustment operation in the exposure apparatus of the third embodiment. (A) in FIG. 16 is a schematic front view for showing an example of the variation of the adjustment mark, and (b) in FIG. 16 is for showing an example of the variation of the adjustment mark and the light spot for adjustment An example of a schematic front view. (A) in FIG. 17 is a schematic front view for showing another example of the variation of the adjustment mark, and (b) in FIG. 17 is for showing another example of the variation of the adjustment mark and another of the adjustment light spot. An example of a schematic front view.

16: Support frame

80: Light source department

82: exposure head

84: Measuring device

800: exposure unit

802: Second containment box

804, 825: Mirror

820: Space light modulator

822: First imaging optical system

824: Microlens array section (MLA section)

824a: Microlens Array (MLA)

826: Second imaging optical system

840: Irradiator

842: Receiver

850: Sensor Department

851: Optical system

852: Sensor

8220, 8260: the first lens barrel

8222, 8262: Second lens barrel

ML1: micro lens

Mk1: mark for adjustment

Claims (6)

An exposure device equipped with: The light-emitting part has a plurality of light-emitting areas for emitting light respectively; The microlens array part has an effective area and an ineffective area. The effective area includes a plurality of microlenses respectively located on the path of the light emitted by each of the plurality of light-emitting areas. The microlenses are located outside the effective area in the direction perpendicular to the optical axis and include adjustment marks; and The sensor part has a plurality of light-receiving elements arranged in a state along the first direction and a plurality of light-receiving elements arranged in a state intersecting the second direction crossing the aforementioned first direction; The sensor section may output the relativity between the adjustment spot and the adjustment mark on the path of the light emitted from the light-emitting section and passing through the area including the adjustment mark in the inactive area In the signal of the positional relationship of the light, the light spot for adjustment is emitted from the light-emitting areas for adjustment in the plurality of light-emitting areas and forms the light irradiated to the inactive area. The exposure device according to claim 1, wherein the microlens array section includes a microlens array in which a plurality of the microlenses are integrally formed; The microlens array includes the inactive area. The exposure device according to claim 1, wherein the microlens array section includes: a first adjustment mark and a second adjustment mark, which are respectively included in the inactive area; The sensor unit can output a signal of a first relative positional relationship between the first adjustment spot and the first adjustment mark, and can output the second adjustment spot and the second adjustment mark The signal of the second relative positional relationship between the first adjustment light spot is emitted from the first adjustment light-emitting area among the plurality of light-emitting areas and forms the light irradiated to the inactive area. The second adjustment light spot is emitted from a plurality of the second adjustment light-emitting areas among the plurality of light-emitting areas and forms light irradiated to the inactive area. The exposure device according to claim 1, wherein the sensor unit includes an area sensor having a plurality of light-receiving elements in a two-dimensional arrangement. The exposure device according to claim 1, wherein the adjustment mark has a pattern for shielding the passage of light that has been directed toward the sensor part of a part of the adjustment light spot. The exposure apparatus according to claim 1, further comprising: a driving section that can move at least one of the movable section of the light-emitting section and the microlens array section; and The control unit moves the at least one of the movable parts by the driving unit in response to the signal of the relative positional relationship, thereby adjusting the relative positional relationship between the plurality of light emitting units and the plurality of microlenses .

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