JP7076776B2 - Inorganic film laminated resin substrate dividing method and dividing device - Google Patents

Description

The present invention relates to an inorganic film laminated resin substrate in which an inorganic film is laminated on a resin substrate.

As substrates for display devices such as electronic components and organic EL, various substrates such as brittle material substrates such as glass substrates and semiconductor substrates, resin material substrates such as polyimide (PI), or predetermined substrates are laminated or laminated. Laminated substrates and bonded substrates formed by bonding are widely used.

As a method for processing (dividing) a brittle material substrate, a mode in which initial cracks are formed by a cutter wheel (scribing wheel) and then laser irradiation is performed twice is already known (see, for example, Patent Document 1).

Japanese Patent No. 5314674

As a kind of substrate as described above, a predetermined inorganic film (for example, a glass film made of SiO ₂ or SiNx) is formed on one main surface of a polyimide substrate having metal wiring formed on one main surface of about several hundred nm. A substrate coated with a thickness (hereinafter referred to as an inorganic film laminated resin substrate) may be used.

When such an inorganic film laminated resin substrate is to be divided by laser irradiation, carbon atoms constituting the resin substrate that has absorbed the laser are converted into plasma, so that carbon (graphite) is scattered and adheres between metal wirings. , May cause a short circuit in the metal wiring.

Further, when mechanically processed with a tool such as a scribe tool, cracks may be extended in the inorganic film, and the metal wiring may be cut due to the crack extension.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a method capable of suitably dividing an inorganic film laminated resin substrate.

In order to solve the above problems, the invention of claim 1 is a method of dividing an inorganic film laminated resin substrate in which an inorganic film is laminated on a resin substrate, along a predetermined street in the inorganic film laminated resin substrate. Then, the inorganic film laminated resin substrate is irradiated with laser light that can be absorbed by the resin substrate from the side of the inorganic film, and the laser light is emitted only in the absorption region near the interface of the resin substrate with the inorganic film. The exposed surface of the resin substrate formed by the laser light irradiation step of peeling the region of the inorganic film through which the laser light is transmitted by causing absorption and the peeling of the inorganic film by the laser light irradiation step. It is characterized by comprising a scribing step of cutting the resin substrate by scribing.

The invention of claim 2 is the method for dividing an inorganic film laminated resin substrate according to claim 1, which is made of superhard material in the scribe step, has a thickness of 0.4 mm to 1.2 mm, and has a diameter. Scrivener the exposed surface of the resin substrate using a scribing wheel having an acute angle of 4 mm to 10 mm and an acute angle of 15 ° to 90 ° (for example, 15 ° to 60 °, particularly 15 ° to 45 °). It is characterized by that.

The invention of claim 3 is the method for dividing an inorganic film laminated resin substrate according to claim 2, wherein the resin substrate is a polyimide substrate, the inorganic film is a SiO ₂ or SiNx glass film, and the laser is used. It is characterized in that the light is a UV laser.

The invention of claim 4 is an apparatus for dividing an inorganic film laminated resin substrate in which an inorganic film is laminated on a resin substrate, and the inorganic film laminated resin substrate can be horizontally placed and fixed, and is a horizontal plane. A table that can be moved inside, a laser beam irradiation unit that can irradiate the inorganic film laminated resin substrate that is placed and fixed on the table with laser light that can be absorbed by the resin substrate, and a table that is placed and fixed on the table. A scribing processing unit capable of scribing the inorganic film laminated resin substrate is provided, and the laser light is emitted from the laser light irradiation unit while moving the table on which the inorganic film laminated resin substrate is placed. Thereby, the laser beam is irradiated to the inorganic film laminated resin substrate from the side of the inorganic film along a predetermined street in the inorganic film laminated resin substrate, and the vicinity of the interface of the resin substrate with the inorganic film. By causing the absorption of the laser light only in the absorption region of the above, the region of the inorganic film through which the laser light is transmitted is peeled off, and the scribing processing portion is the resin substrate formed by the peeling of the inorganic film. The resin substrate is torn apart by scribing the exposed surface of the light beam.

The invention of claim 5 is the fragmentation apparatus of the inorganic film laminated resin substrate according to claim 4, wherein the scribe processing portion is made of super hard material, has a thickness of 0.4 mm to 1.2 mm, and has a diameter. It has a scribe wheel having an acute angle of 4 mm to 10 mm and an acute angle of 15 ° to 90 ° (for example, 15 ° to 60 °, particularly 15 ° to 45 °), and the resin substrate is provided by the scribe wheel. It is characterized by scribing the exposed surface of the wheel.

The invention of claim 6 is the splitting device for the inorganic film laminated resin substrate according to claim 5, wherein the laser light irradiation unit and the screen processing unit are separated by a predetermined distance in the moving direction of the table. Moreover, the beam center of the laser beam emitted from the laser beam irradiation unit and the cutting edge of the scribing wheel are provided so as to be located on one vertical plane, and the inorganic film laminated resin substrate by the table is provided. During the one-time moving operation, peeling of the inorganic film by irradiation of the laser beam from the laser beam irradiation unit and scribing of the resin substrate to the exposed surface of the resin substrate by the scribing processing unit are continuously performed. It is characterized by that.

The invention of claim 7 is the splitting device for an inorganic film laminated resin substrate according to any one of claims 4 to 6, wherein the resin substrate is a polyimide substrate and the inorganic film is SiO ₂ or SiNx. It is a glass film, and the laser beam is a UV laser.

According to the inventions of claims 1 to 7, the scattering of graphite caused by the plasma formation of carbon atoms, which occurs when the resin substrate is divided by laser light, and the adhesion to metal wiring and the inorganic film are mechanically used. The inorganic film laminated resin substrate can be divided on the street without causing problems such as expansion of cracks in the inorganic film and disconnection of the metal wiring, which occur in the case of specific division.

In particular, according to the invention of claim 6, the inorganic film laminated resin substrate can be divided efficiently and with high accuracy.

It is a perspective view which shows typically the structure of the inorganic film laminated resin substrate W. It is a figure which shows the state when the laser beam LB is irradiated to the inorganic film laminated resin substrate W. It is a schematic cross-sectional view which shows the state when the laser beam LB is irradiated to the inorganic film laminated resin substrate W. It is a figure which shows the state of the inorganic film laminated resin substrate W after scanning by a laser beam LB. It is a figure which shows the state before scribe of the resin substrate 1 by scribing wheel SH. It is a figure which shows the state after scribe the resin substrate 1 by the scribing wheel SH. It is a figure which shows schematically the structure of the dividing device 100. It is a figure for demonstrating the process of dividing an inorganic film laminated resin substrate W by two-step division in a division apparatus 100.

<Structure of Inorganic Film Laminated Resin Substrate>
FIG. 1 is a perspective view schematically showing the configuration of the inorganic film laminated resin substrate W which is the object of division according to the present embodiment. The inorganic film laminated resin substrate W is formed by coating an inorganic film 2 on a resin substrate 1. Examples of the material of the resin substrate 1 include polyimide and polyamide. As the inorganic film 2, a glass film made of SiO ₂ or SiNx is exemplified. It is a preferable example that the resin substrate 1 has a thickness of about 10 μm to 100 μm, and the inorganic film 2 has a thickness of about 0.1 μm to 1 μm. In addition, the ratio of the size of each part shown in FIG. 1 and each subsequent figure does not always match the actual one.

More specifically, on one main surface of the resin substrate 1, a large number of metal wirings 3 each having a width of about 0.1 μm to 1 μm are formed to a thickness of about 0.05 μm to 0.5 μm, and are inorganic. The film 2 is formed on one of the main surfaces as a coating film that protects the metal wiring 3 from corrosion and the like.

In the present embodiment, such an inorganic film laminated resin substrate W is processed to be divided into a predetermined width region called a predetermined street ST. It should be noted that the street ST is defined so as to cross the metal wiring 3. Further, the center position in the width direction of the street ST is referred to as a street center C.

In addition, in FIG. 1 and the following figures, four metal wirings 3 having the same shape are provided in parallel on the surface of the resin substrate 1, and one street ST is shown in a manner orthogonal to the metal wirings 3. However, these are just for explanation, and in the actual inorganic film laminated resin substrate W, many metal wirings having a more complicated shape are formed, and street STs are set in many places. You may.

<Two-stage division of inorganic film laminated resin substrate>
In the present embodiment, the splitting of the inorganic film laminated resin substrate W in the street ST is performed in two steps: peeling of the inorganic film by irradiation with a laser beam and scribe of the resin substrate 1 by pressure contact rolling of the scribing wheel. In the present embodiment, the division in such an embodiment is referred to as a two-stage division.

FIG. 2 is a diagram showing a state when the laser beam LB is irradiated to the inorganic film laminated resin substrate W. Further, FIG. 3 is a schematic cross-sectional view showing a state in which the laser beam LB is applied to the inorganic film laminated resin substrate W. However, in FIGS. 2 and 3, the light source, the optical system, and the emission source of the laser beam LB are not shown.

In dividing the inorganic film laminated resin substrate W, first, as shown in FIG. 2, a laser beam LB whose light collecting diameter d on the surface is about the same as or slightly smaller than the width t of the street ST is applied from above the inorganic film 2. The laser beam LB is irradiated and scanned along the street ST as shown by the arrow AR1 in such a manner that the beam center of the laser beam LB coincides with the street center C. The width t of the street ST is usually set to about 10 μm to 100 μm (for example, 50 μm).

As the laser beam LB, one that is absorbed by the resin substrate 1 is used. When the resin substrate 1 is a polyimide substrate, it is a preferable example to use a UV laser. Depending on the material of the resin substrate 1, a CO ₂ laser, a green laser, an IR laser, or the like may be used.

Irradiation of the laser beam LB is performed under irradiation conditions to the extent that absorption occurs only in the portion of the resin substrate 1 near the interface with the inorganic film 2. In other words, the irradiation condition is a condition that cannot be performed until the entire inorganic film laminated resin substrate W is divided.

When the resin substrate 1 is a polyimide substrate and the laser beam LB is a UV laser, for example, irradiation conditions such as a pulse width of 10 picoseconds to 100 nanoseconds, a repetition frequency of 1 kHz to 200 kHz, and a scanning speed of 50 to 500 mm / sec. It is preferable to irradiate the laser beam LB with.

The mode may be such that the laser light LB is absorbed by the inorganic film 2 until it reaches the resin substrate 1, but when the inorganic film 2 is a glass film and the laser light LB is a UV laser, the laser is used. The light LB substantially transmits the inorganic film 2.

As shown in FIG. 3, the laser beam LB irradiated from above the inorganic film 2 under the above conditions passes through the inorganic film 2 and is directly below the inorganic film 2 in the resin substrate 1. It is absorbed in the region near the interface (hereinafter referred to as the absorption region RE1). Then, the absorption region RE1 becomes a high energy state, and in the absorption region RE1, the carbon atoms constituting the resin substrate 1 are turned into plasma. This plasmatized carbon atom tends to rapidly desorb from the absorption region RE1 as shown by the arrow AR2.

However, the inorganic film 2 is present in the region above the absorption region RE1 through which the laser beam LB is transmitted (hereinafter referred to as the transmission region RE2). Therefore, the desorption of carbon atoms causes peeling (scattering) of the inorganic film 2 existing in the transmission region RE2 as shown by the arrow AR3. Since the laser beam LB is scanned along the street ST, such delamination will occur along the street ST.

FIG. 4 is a diagram showing the state of the inorganic film laminated resin substrate W after scanning with the laser beam LB. As a result of the peeling of the inorganic film 2 along the street ST, the exposed surface 1a of the resin substrate 1 is formed in the street ST. The exposed surface 1a may be a concave surface as shown in FIG. 4, but may be formed as a flat surface because carbon desorption that causes such peeling occurs.

Further, as shown in FIG. 4, as the inorganic film 2 is peeled off along the street ST, the portion of the metal wiring 3 that is orthogonal to the street ST is also peeled off. ..

The formation range of the absorption region RE1 in the thickness direction of the resin substrate 1 is at most about 1 μm to 5 μm from the interface between the resin substrate 1 and the inorganic film 2, which is sufficiently smaller than the thickness of the resin substrate 1. Therefore, even if graphite is scattered or adhered due to the plasma formation of carbon atoms, the entire resin substrate 1 is extremely limited as compared with the case where the entire resin substrate 1 is to be divided by irradiation with laser light LB. Therefore, when the inorganic film 2 is peeled off in the above-described manner, the occurrence of a short circuit of the metal wiring 3 due to the adhesion of graphite is suitably suppressed.

After the peeling of the inorganic film 2 in the street ST using the laser beam LB is completed, the resin substrate 1 is scribed in the street ST by the pressure contact rolling of the scribing wheel. FIG. 5 is a diagram showing a state before scribe the resin substrate 1 by the scribing wheel SH. Further, FIG. 6 is a diagram showing a state after scribe the resin substrate 1 by the scribing wheel SH.

The scribing wheel SH is a disk-shaped member having an outer peripheral portion having a cutting edge E, and is rotatably supported in a vertical plane by a support means (not shown) in FIG. 5, and is not shown. The elevating mechanism makes it possible to elevate within the vertical plane.

At the time of scribing, first, while arranging the scribing wheel SH at the scribing start position, the scribing wheel SH and the inorganic film laminated resin are positioned so that the rotating surface of the scribing wheel SH and the extending direction of the street center C are located in the same plane. Position the board W.

When such positioning is performed, the scribing wheel SH is pushed against the street center C with a predetermined load so that the cutting edge E is pressed against the exposed surface 1a of the resin substrate 1 as shown in FIG. Then, while maintaining the pressure contact state, the scribing wheel SH is moved relative to the inorganic film laminated resin substrate W along the street center C as shown by the arrow AR4, thereby, as shown by the arrow AR5. , Roll the scribing wheel SH. Then, with the pressure contact rolling of the scribing wheel SH, the resin substrate 1 is torn in two directions symmetrical and contradictory to the street center C as indicated by the arrows AR6a and AR6b. Finally, the inorganic film laminated resin substrate W is divided into individual pieces Wa and Wb as shown in FIG.

In such a case, the scribing wheel SH divides only the resin substrate 1, and the scribing wheel SH does not come into contact with the inorganic film 2 or the metal wiring 3, so that cracks may occur in the inorganic film 2 or the metal wiring 3 at the time of division. do not have.

The scribing wheel SH is made of cemented carbide, has a thickness of 0.4 mm to 1.2 mm, a diameter of 4 mm to 10 mm, and an acute angle of the cutting edge E (cutting edge angle) of 15 ° to 90 ° (for example, 15 ° to). It is preferable to use one having an acute angle of 60 °, particularly 15 ° to 45 °). The load (pressure contact load) when the scribing wheel SH is pressed against the exposed surface 1a of the resin substrate 1 is preferably 0.05 MPa to 1 MPa (particularly 0.1 MPa to 0.5 MPa).

As described above, in the present embodiment, the division of the inorganic film laminated resin substrate in the street is divided into the peeling of the inorganic film by irradiation with laser light and the scribing of the resin substrate by the pressure contact rolling of the scribing wheel. Do it in stages. As a result, the inorganic matter that occurs when the resin substrate is divided by laser light, the scattering of graphite due to the plasma formation of carbon atoms, the adhesion to metal wiring, and the mechanical division of the inorganic film. The inorganic film laminated resin substrate can be divided on the street without causing problems such as expansion of cracks in the film and disconnection of metal wiring.

<Dividing device>
Next, an example of a dividing device capable of executing the above-mentioned two-step dividing as a series of processes will be described. FIG. 7 is a diagram schematically showing such a configuration of the dividing device 100.

In the dividing device 100, the slide table 102 is provided on the horizontal pedestal 101. The slide table 102 is provided along a pair of guide rails 103 and 104 arranged in parallel in a horizontal plane. Further, a screw screw 105 is arranged between the guide rails 103 and 104 in parallel with the guide rails 103 and 104, and the screw screw 105 is screwed with a stay 106 fixed to the slide table 102. There is.

By rotating the screw screw 105 in the forward and reverse directions by a motor (not shown), the slide table 102 reciprocates along the guide rails 103 and 104. In FIG. 7, the moving direction of the slide table 102 (front-back direction in the drawing) is the Y-axis direction, the direction orthogonal to the moving direction in the horizontal plane (left-right direction in the drawing) is the X-axis direction, and the vertical direction (viewing in the drawing). The XYZ coordinates of the right-handed system with the Z-axis direction as the vertical direction) are attached.

On the slide table 102, a horizontal pedestal 107 is reciprocated along the guide rail 108 in the X-axis direction. Specifically, the screw screw 110 rotated by the motor 109 is screwed into the stay 110a fixed to the pedestal 107, and the pedestal 107 is guided by the motor 109 by rotating the screw screw 110 in the forward and reverse directions. It reciprocates in the X-axis direction along 108.

On the pedestal 107, a rotary table 112 which is made rotatable around the Z axis by the rotation mechanism 111 is provided. The inorganic film laminated resin substrate W to be divided in the dividing device 100 is placed and fixed on the horizontal upper surface of the rotary table 112. More specifically, the inorganic film laminated resin substrate W is fixed to the rotary table 112 by a suction chuck (not shown) in a posture in which the inorganic film 2 is on the upper side.

Above the rotary table 112, a laser irradiation unit 115 is provided, which includes a laser light source 113 for generating a laser beam LB and an optical holder 114 for adjusting the beam shape of the laser beam LB with various lens groups provided inside. Being done. The laser beam LB is emitted from the emission source 114a provided at the lowermost end of the optical holder 114 to the inorganic film laminated resin substrate W placed and fixed on the rotary table 112.

As the laser light source 113, as described above, a light source such as a UV laser, a CO ₂ laser, a green laser, or an IR laser is exemplified.

Further, in the dividing device 100, a scribing processing unit 118 including a scribing wheel 116 and an elevating mechanism 117 thereof is provided at a position separated from the optical holder 114 of the laser irradiation unit 115 by a predetermined distance in the X-axis direction.

More specifically, in the laser irradiation unit 115 and the scribe processing unit 118, the beam center of the laser beam LB emitted from the emission source 114a and the cutting edge E of the scribing wheel 116 are in the Y-axis direction at least at the time of two-step division. It is provided so as to be located on one vertical ZX plane. Such a plane is referred to as a reference plane.

The scribing wheel 116 corresponds to the scribing wheel SH in FIG. In the scribe processing unit 118, when the inorganic film laminated resin substrate W is located below the scribing wheel 116, the scribing wheel 116 is lowered by the elevating mechanism 117 to press the scribing wheel against the inorganic film laminated resin substrate W. You can do it.

FIG. 8 is a diagram for explaining a process of dividing the inorganic film laminated resin substrate W by two-step division in the dividing device 100 having the above configuration.

In performing the two-step division in the dividing device 100, first, the inorganic film laminated resin substrate W is placed and fixed on the rotary table 112 (not shown in FIG. 8), and the street center C coincides with the reference plane. As shown in FIG. 8A, the positioning is performed so as to be located on the opposite side of the scribing processing unit 118 with the laser irradiation unit 115 interposed therebetween.

When such positioning is performed, as shown by the arrow AR7, the inorganic film laminated resin substrate W is moved to the lower side of the laser irradiation unit 115 and further to the scribe processing unit 118. Such movement is performed by moving the pedestal 107 having the rotary table 112 upward along the guide rail 108.

Then, at the timing when the inorganic film laminated resin substrate W reaches below the emission source 114a of the laser irradiation unit 115, the irradiation to the extent that absorption occurs only in the above-mentioned portion of the resin substrate 1 near the interface with the inorganic film 2. Under the conditions, the laser beam LB is emitted from the emission source 114a. As a result, as shown in FIG. 8B, the laser beam LB is absorbed in the absorption region RE1 and the carbon atom in the absorption region RE1 is turned into plasma, and the inorganic film 2 is separated from the resin substrate 1 as the carbon atom is turned into plasma. Of these, the portion of the laser beam LB that is the transmission region RE2 is peeled off to form the exposed surface 1a of the resin substrate 1.

When the peeling of the inorganic film 2 due to the movement of the inorganic film laminated resin substrate W indicated by the arrow AR7 and the irradiation of the laser beam LB continues, the inorganic film laminated eventually becomes as shown in FIG. 8 (c). The resin substrate W reaches below the scribing wheel 116 provided in the scribing processing unit 118. At the timing of such arrival, the scribing wheel 116 is lowered vertically downward by the action of the elevating mechanism 117, and is pressed against the street center C on the exposed surface 1a of the resin substrate 1. Even after the pressure welding, the inorganic film laminated resin substrate W is moved so that the scribing wheel 116 rolls. Due to the pressure contact rolling, the resin substrate 1 is scribed and gradually torn. Then, at the latest, the inorganic film laminated resin substrate W is divided in the street ST until the tail end of the inorganic film laminated resin substrate W passes through the scribe processing section 118.

As described above, in the dividing device 100, in the one-time movement operation of the inorganic film laminated resin substrate W, the peeling of the inorganic film 2 by the irradiation of the laser beam LB and the scribing of the resin substrate 1 by the scribing wheel 116 are continuously performed. Since this can be done, the inorganic film laminated resin substrate W can be divided efficiently and with high accuracy.

<Modification example>
In the above-described embodiment, the dividing device 100 has one laser irradiation unit 115, but a plurality of laser irradiation units 115 may be provided at predetermined intervals in the Y-axis direction. In the dividing device having such a configuration, after the inorganic film 2 is peeled off by simultaneously irradiating the laser beam LB at a plurality of locations, the scribing wheel is sequentially applied to the exposed surface 1a of the resin substrate 1 at each location. By scribe with 116, one inorganic film laminated resin substrate W can be divided at a plurality of places.

Alternatively, a plurality of pairs of the laser irradiation unit 115 and the scribe processing unit 118 may be provided at predetermined intervals in the Y-axis direction. In the dividing device having such a configuration, the inorganic film laminated resin substrate W is moved once, and the inorganic film 2 is peeled off by the laser beam LB as shown in FIG. 8 and the exposed surface 1a of the resin substrate 1 is continuous therewith. Scribe can be performed at multiple locations in parallel. That is, the inorganic film laminated resin substrate W can be divided at a plurality of places by one movement operation of the inorganic film laminated resin substrate W.

Further, in the above-described embodiment, the scribing wheel SH (116) is used for the scribing of the resin substrate 1, but this is not an indispensable mode, and even if the scribing is performed by a rod-shaped scribing tool. good.

Further, in the above-described embodiment, the inorganic film laminated resin substrate W is a laminate of the resin substrate 1 and the inorganic film 2, but a protective film made of PET (polyethylene terephthalate) is formed below the resin substrate 1. Even if it is attached, the above-mentioned two-step division can be preferably performed.

A protective film made of PET may be attached to the upper surface of the inorganic film 2, but in such a case, the inorganic film 2 is exposed in advance at the position of the street ST by irradiating a CO ₂ laser or the like. After that, the above-mentioned two-step division may be performed.

1 Resin substrate 2 Inorganic film 3 Metal wiring 1a (resin substrate) exposed surface 100 Divider 102 Slide table 107 Pedestal 112 Rotating table 113 Laser light source 114a Emission source 115 Laser irradiation unit 116, SH scribing wheel 117 Elevating mechanism 118 Scribing processing unit C Street center E (scribing wheel) cutting edge LB Laser light RE1 (laser light) absorption area RE2 (laser light) transmission area ST Street W Inorganic film laminated resin substrate

Claims (7)

It is a method of dividing an inorganic film laminated resin substrate in which an inorganic film is laminated on a resin substrate.
Along a predetermined street in the inorganic film laminated resin substrate, the inorganic film laminated resin substrate is irradiated with laser light that can be absorbed by the resin substrate from the side of the inorganic film, and the inorganic material of the resin substrate is irradiated with laser light. A laser light irradiation step of causing the absorption of the laser beam only in the absorption region near the interface with the film to peel off the region of the inorganic film through which the laser beam is transmitted.
A scribing step of cutting the resin substrate by scribing the exposed surface of the resin substrate formed by peeling of the inorganic film by the laser light irradiation step.
A method for dividing an inorganic film laminated resin substrate, which comprises the above. The method for dividing an inorganic film laminated resin substrate according to claim 1.
In the scribe step, the scribe wheel is used, which is made of super hard material, has a thickness of 0.4 mm to 1.2 mm, a diameter of 4 mm to 10 mm, and an acute angle of 15 ° to 90 °. Scrivener the exposed surface of the resin substrate,
A method for dividing an inorganic film laminated resin substrate, which is characterized by the above. The method for dividing an inorganic film laminated resin substrate according to claim 2.
The resin substrate is a polyimide substrate, and the resin substrate is a polyimide substrate.
The inorganic film is a glass film of SiO ₂ or SiNx.
The laser beam is a UV laser.
A method for dividing an inorganic film laminated resin substrate, which is characterized by the above. It is a device for dividing an inorganic film laminated resin substrate in which an inorganic film is laminated on a resin substrate.
A table on which the inorganic film laminated resin substrate can be placed and fixed horizontally and which can be moved in a horizontal plane.
A laser light irradiation unit capable of irradiating the inorganic film laminated resin substrate placed and fixed on the table with laser light that may be absorbed by the resin substrate.
A scribing processing unit capable of scribing the inorganic film laminated resin substrate placed and fixed on the table, and
Equipped with
By emitting the laser beam from the laser light irradiation unit while moving the table on which the inorganic film laminated resin substrate is placed, the inorganic film laminated resin substrate is formed along a predetermined street. By irradiating the inorganic film laminated resin substrate with the laser light from the film side and causing absorption of the laser light only in the absorption region near the interface of the resin substrate with the inorganic film, the inorganic film can be absorbed. Of these, the region through which the laser beam was transmitted was peeled off,
The scribe processing unit cuts through the resin substrate by scribing the exposed surface of the resin substrate formed by peeling the inorganic film.
A device for dividing an inorganic film laminated resin substrate, which is characterized by the above. The device for dividing an inorganic film laminated resin substrate according to claim 4.
The scribe processing section is made of cemented carbide and has a thickness of 0. It has a scribing wheel that is 4 mm to 1.2 mm , has a diameter of 4 mm to 10 mm, and has an acute angle of 15 ° to 90 °.
The exposed surface of the resin substrate is scribed by the scribing wheel.
A device for dividing an inorganic film laminated resin substrate, which is characterized by the above. The device for dividing an inorganic film laminated resin substrate according to claim 5.
The laser light irradiation unit and the scribing processing unit are separated from each other by a predetermined distance in the moving direction of the table, and the beam center of the laser light emitted from the laser light irradiation unit and the cutting edge of the scribing wheel are aligned with each other. It is provided so that it is located on one vertical plane.
During one movement operation of the inorganic film laminated resin substrate by the table, the inorganic film is peeled off by irradiation of the laser beam from the laser light irradiation unit, and the exposed surface of the resin substrate by the scribe processing unit. Scribe to
A device for dividing an inorganic film laminated resin substrate, which is characterized by the above. The device for dividing an inorganic film laminated resin substrate according to any one of claims 4 to 6.
The resin substrate is a polyimide substrate, and the resin substrate is a polyimide substrate.
The inorganic film is a glass film of SiO ₂ or SiNx.
The laser beam is a UV laser.
A device for dividing an inorganic film laminated resin substrate, which is characterized by the above.

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