JP7075214B2 - 金属基板およびこれを用いた蒸着用マスク - Google Patents

金属基板およびこれを用いた蒸着用マスク Download PDF

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Publication number
JP7075214B2
JP7075214B2 JP2017555536A JP2017555536A JP7075214B2 JP 7075214 B2 JP7075214 B2 JP 7075214B2 JP 2017555536 A JP2017555536 A JP 2017555536A JP 2017555536 A JP2017555536 A JP 2017555536A JP 7075214 B2 JP7075214 B2 JP 7075214B2
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Japan
Prior art keywords
vapor deposition
hole
thickness
embodied
substrate
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Active
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JP2017555536A
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English (en)
Japanese (ja)
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JP2018513918A (ja
JP2018513918A5 (zh
Inventor
ロ，ゴンホ
チョ，スヒョン
ファン，チュヒョン
キム，ナムホ
イ，サンボム
イム，チョンリョン
ハン，テフン
ムン，ビョンヨル
パク，ジェソク
ソン，ヒョウォン
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LG Innotek Co Ltd
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LG Innotek Co Ltd
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Priority claimed from KR1020150058346A external-priority patent/KR102528582B1/ko
Priority claimed from KR1020150062137A external-priority patent/KR102590892B1/ko
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2018513918A publication Critical patent/JP2018513918A/ja
Publication of JP2018513918A5 publication Critical patent/JP2018513918A5/ja
Priority to JP2022026469A priority Critical patent/JP2022068330A/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2017555536A 2015-04-24 2015-08-25 金属基板およびこれを用いた蒸着用マスク Active JP7075214B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022026469A JP2022068330A (ja) 2015-04-24 2022-02-24 金属基板およびこれを用いた蒸着用マスク

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR1020150058346A KR102528582B1 (ko) 2015-04-24 2015-04-24 금속기판 및 이를 이용한 증착용마스크
KR10-2015-0058346 2015-04-24
KR10-2015-0062137 2015-04-30
KR1020150062137A KR102590892B1 (ko) 2015-04-30 2015-04-30 증착용마스크
PCT/KR2015/008894 WO2016171337A1 (ko) 2015-04-24 2015-08-25 금속 기판 및 이를 이용한 증착용마스크

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022026469A Division JP2022068330A (ja) 2015-04-24 2022-02-24 金属基板およびこれを用いた蒸着用マスク

Publications (3)

Publication Number Publication Date
JP2018513918A JP2018513918A (ja) 2018-05-31
JP2018513918A5 JP2018513918A5 (zh) 2019-12-19
JP7075214B2 true JP7075214B2 (ja) 2022-05-25

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JP2017555536A Active JP7075214B2 (ja) 2015-04-24 2015-08-25 金属基板およびこれを用いた蒸着用マスク
JP2022026469A Pending JP2022068330A (ja) 2015-04-24 2022-02-24 金属基板およびこれを用いた蒸着用マスク

Family Applications After (1)

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JP2022026469A Pending JP2022068330A (ja) 2015-04-24 2022-02-24 金属基板およびこれを用いた蒸着用マスク

Country Status (4)

Country Link
EP (2) EP3993075A1 (zh)
JP (2) JP7075214B2 (zh)
CN (3) CN110760793A (zh)
WO (1) WO2016171337A1 (zh)

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KR102330373B1 (ko) 2017-03-14 2021-11-23 엘지이노텍 주식회사 금속판, 증착용 마스크 및 이의 제조방법
KR20190059742A (ko) * 2017-11-23 2019-05-31 엘지이노텍 주식회사 증착용 마스크 및 이의 제조 방법
CN112534605B (zh) * 2018-07-12 2023-08-11 Lg伊诺特有限公司 用于oled像素蒸镀的金属板材料的蒸镀用掩模
KR102661470B1 (ko) * 2018-09-03 2024-04-29 삼성디스플레이 주식회사 증착 마스크 및 그 제조방법
US11991916B2 (en) 2018-11-19 2024-05-21 Lg Innotek Co., Ltd. Alloy metal plate and deposition mask including alloy metal plate
WO2020145718A1 (ko) 2019-01-11 2020-07-16 엘지이노텍 주식회사 디스플레이용 기판
KR20230048564A (ko) * 2019-10-04 2023-04-11 도판 인사츠 가부시키가이샤 증착 마스크, 증착 마스크의 제조 방법, 및, 표시 장치의 제조 방법
KR20240030154A (ko) * 2022-08-30 2024-03-07 엘지이노텍 주식회사 Oled 화소 증착을 위한 증착용 마스크
CN117364235B (zh) * 2023-12-07 2024-03-26 度亘核芯光电技术(苏州)有限公司 选区外延生长方法及其中使用的掩膜结构

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Also Published As

Publication number Publication date
JP2018513918A (ja) 2018-05-31
CN107709601A (zh) 2018-02-16
JP2022068330A (ja) 2022-05-09
CN107709601B (zh) 2019-12-13
EP3993075A1 (en) 2022-05-04
CN110760793A (zh) 2020-02-07
CN110923622B (zh) 2021-12-03
EP3288097A1 (en) 2018-02-28
CN110923622A (zh) 2020-03-27
EP3288097A4 (en) 2019-05-15
WO2016171337A1 (ko) 2016-10-27

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