JP7070106B2 - Imprint template, its manufacturing method, and imprint method - Google Patents

Description

The present disclosure relates to an imprint template, a manufacturing method thereof, and an imprint method.

Nanoimprint technology, which is known as microfabrication technology, is an imprint template (hereinafter, simply "template") which is a mold member in which a fine uneven pattern (hereinafter, simply referred to as "concavo-convex pattern") is formed on the surface of a base material. This is a pattern forming technique for transferring the uneven pattern of the template to the same size by transferring the uneven pattern to a workpiece such as an imprint resin. By using the nanoimprint technique, a pattern structure in which the uneven pattern of the template is transferred can be manufactured by an inexpensive device.

In recent years, various nanoimprint techniques have been proposed in order to realize mass production of semiconductor devices and large areas of optical components used in liquid crystal displays and the like.

For example, a roll-to-roll continuous mold structure produced by arranging a large number of molds having an uneven pattern side by side on a sheet is attached to a transfer roll, and the uneven pattern is transferred by roll-to-roll. A technique for manufacturing a replica mold has been proposed (see Patent Document 1). Further, a technique for manufacturing a large-area microstructure by arranging a plurality of basic microstructures side by side on a base material has been proposed (see Patent Document 2).

International release 2013/031460 Japanese Unexamined Patent Publication No. 2012-195599

In Patent Document 1, a roll-to-roll continuous mold structure is formed by arranging molds having an uneven pattern side by side on a sheet and curing a curable resin filled in a gap between adjacent molds. Is produced. However, in Patent Document 1, a step may be formed between the surface of the curable resin which is filled in the gap between adjacent molds and the surface of the cured resin and the surface of the mold. When the uneven pattern is transferred to the transfer resin using the roll-to-roll continuous mold structure having such a step, the step is also transferred to the transfer resin together with the uneven pattern, and as a result, the pattern structure formed is formed. May cause defects. Further, even if the step is not transferred to the transfer resin, the presence of the step makes it impossible to uniformly press the mold structure against the transfer resin, resulting in defects in the pattern structure. There is a risk that it will end up.

Further, in Patent Document 2, a microstructure is produced by arranging the basic microstructures as close as possible to each other on a base material, but there is a slight gap between adjacent basic microstructures. Therefore, a step is generated between the surface of the basic microstructure and the surface of the base material. When the uneven pattern is transferred to the transfer resin using the fine structure having such a step, the step is also transferred together with the uneven pattern, and as a result, there is a possibility that a defect may occur in the formed pattern structure.

Further, the uneven pattern in the above template is generally formed by electron beam lithography using a high-precision electron beam writing apparatus (hereinafter, simply referred to as "drawing apparatus"). As a template base material on which an uneven pattern is formed by using a drawing device, a material having a small area of about 6 inches (152 mm × 152 mm) is generally used.

In a template (also referred to as a master) in which an uneven pattern is formed on the template base material, a margin area (non-pattern area) in which an uneven pattern is not drawn around the pattern area where the uneven pattern is formed. If there are few, it is difficult to handle as it is. Therefore, usually, a template is set in a predetermined frame (sometimes called a holder) and used. However, if a step is created on the surface (unevenness pattern surface) of the holder-integrated template in which the master is set in the holder, when the unevenness pattern is transferred to the imprint resin using the holder-integrated template, the unevenness is uneven. Along with the pattern, the step is also transferred to the imprint resin, which may cause a defect in the formed pattern structure. Further, in the holder-integrated template, if there is a gap between the holder and the master, the imprint resin may invade the gap, which may cause a defect in the imprint template. ..

In view of the above problems, one object of the present disclosure is to provide an imprint template capable of manufacturing a defect-free pattern structure, a manufacturing method thereof, and an imprint method using the imprint template. ..

In order to solve the above problems, as one embodiment of the present disclosure, the first surface, the second surface facing the first surface, and the outer edge of the first surface and the outer edge of the second surface are continuous. A first gap is provided between a pattern substrate having a side surface and having a concavo-convex pattern formed on the first surface, at least an opening capable of exposing the concavo-convex pattern, and the side surface of the pattern substrate. A frame including a side wall portion surrounding the side surface thereof, and a joint portion for joining the pattern substrate and the frame body, the frame body further includes a bottom portion of the pattern substrate facing the second surface. The bottom portion of the frame body is provided with a continuous through hole in a first gap between the side surface of the pattern substrate and the side wall portion of the frame body, and the joint portion is the first. Located in one gap and the through hole, and located in the first surface of the pattern substrate, the upper surface of the frame body, and the first gap in a side view with the first surface of the pattern substrate facing upward. An imprint template is provided in which the upper surface of the joint is substantially flush with each other.
Further, as one embodiment of the present disclosure, a first surface, a second surface facing the first surface, and a continuous side surface between the outer edge of the first surface and the outer edge of the second surface are provided. A side wall that surrounds the side surface so as to provide a first gap between the pattern substrate on which the uneven pattern is formed on the first surface, at least an opening capable of exposing the uneven pattern, and the side surface of the pattern substrate. The pattern includes a frame including a portion, a joint portion located in a first gap between the side surface of the pattern substrate and the side wall portion of the frame, and a joint portion for joining the pattern substrate and the frame. In a side view with the first surface of the substrate facing upward, the first surface of the pattern substrate, the upper surface of the frame body, and the upper surface of the joint portion located in the first gap are substantially equal to each other. Provided is an imprint template that is flush with each other and has substantially the same thermal expansion coefficient for each of the pattern substrate and the frame.

The thickness of the frame may be thicker than the thickness of the pattern substrate, and the frame further has a bottom portion facing the second surface of the pattern substrate, and the bottom portion of the frame body has a bottom portion. A continuous through hole may be provided in the first gap. Further, the bottom portion of the frame body faces the second surface of the pattern substrate so as to provide a second gap continuous with the first gap between the second surface of the pattern substrate and the second surface of the pattern substrate. The through hole may be continuous with the first gap through the second gap.

Of the side wall portions of the frame body, at least the surface of the portion that abuts on the joint portion may be roughened , the pattern substrate and the frame body may be made of glass, and the joint portion may be used. May be composed of a cured resin.

The side wall portion of the frame body includes an outer frame portion and a partition frame portion that is continuous with the outer frame portion and divides the inside of the outer frame portion into a plurality of regions, and includes the plurality of regions in the outer frame portion. The pattern substrate is arranged in each, and the first gap is the said of the pattern substrate arranged in each of the inner wall surface of the outer frame portion, the side wall surface of the partition frame portion, and the plurality of regions. It may be a gap between the side surface or a gap between the side wall surface of the partition frame portion and the side surface of the pattern substrate arranged in each of the plurality of regions.

As one embodiment of the present disclosure, a flat plate having a flat surface and a flat surface facing the flat surface, a first surface, a second surface facing the first surface, and an outer edge of the first surface. A first gap can be formed between a pattern substrate having a continuous side surface between the outer edges of the second surface and a concave-convex pattern formed on the first surface and the side surface of the pattern substrate. A step of preparing a frame body having a side wall portion and an opening capable of exposing the uneven pattern, and the pattern substrate so that the first surface of the pattern substrate faces the flat surface of the flat plate. The step of placing the pattern substrate and the frame on the flat surface so as to surround the side surface with the side wall portion, and the side surface and the frame of the pattern substrate mounted on the flat surface. The step of filling the first gap existing between the side wall portions of the body with the composition for a bonding material for joining the pattern substrate and the frame body, and the bonding material filled in the first gap. Manufacture of an imprint template comprising a step of forming a joint portion for joining the pattern substrate and the frame body by curing the composition for use, and a step of removing the flat plate after forming the joint portion. The method is provided.

The frame has a bottomed tubular shape having the side wall portion, the opening portion, and the bottom portion, and is thicker than the thickness of the pattern substrate. A through hole is formed in the bottom portion of the frame body. In a state where the frame is placed on the flat surface, the pattern substrate is provided with a second gap existing between the second surface of the pattern substrate and the bottom of the frame. The through hole communicates with the first gap existing between the side surface and the side wall portion of the frame body, and in the step of filling the bonding material composition, the bonding material composition is formed through the through hole. Can be filled in the first gap with the composition for a bonding material.

The side wall portion of the frame body includes an outer frame portion and a partition frame portion that is continuous with the outer frame portion and divides the inside of the outer frame portion into a plurality of regions, and the pattern substrate is the said of the frame body. It may be arranged in each of the plurality of areas in the outer frame portion. Further, in the above disclosure, the surface of the portion of the side wall surface of the side wall portion of the frame body that abuts on the joint portion may be at least roughened, and the pattern substrate and the frame body are substantially mutual. It may be composed of materials having the same coefficient of thermal expansion.

The pattern substrate and the frame may be made of glass, and a curable resin composition can be used as the composition for the bonding material, and the viscosity of the curable resin composition at 25 ° C. is 1 Pa. It may be s to 5 Pa · s. Further, the curable resin composition is an active energy ray-curable resin composition, and the flat plate is made of a transparent material. In the step of forming the joint portion, the flat plate is formed along the thickness direction of the flat plate. The active energy ray-curable resin composition can be irradiated with active energy rays from the facing surface side toward the flat surface side.

A release layer may be provided on the flat surface of the flat plate in a region in contact with the composition for a joining material. Further, the flat plate is formed with suction holes that are opened at positions on the flat surface on which the pattern substrate and the frame are placed and penetrate in the thickness direction of the flat plate. After the pattern substrate and the frame body are placed on the flat surface of the above, the pattern substrate and the frame body may be vacuum-sucked to the flat surface of the flat plate through the suction holes.

Alignment marks are formed on each of the first surface of the pattern substrate and the flat surface of the flat plate, and the positions of the alignment marks formed on the first surface of the pattern substrate and the flat surface of the flat plate are described. The pattern substrate can be placed on the flat surface so as to align with the position of the alignment mark formed on the flat surface.

The first surface of the pattern substrate includes a pattern region in which the uneven pattern is formed and a non-pattern region surrounding the outer periphery of the pattern region, and the flat plate has a size capable of physically including the pattern region. In addition, the pattern substrate has a hole portion penetrating in the thickness direction of the flat plate, so that the pattern region is exposed from the hole portion of the flat plate, and the non-pattern region is flattened. It may be placed on the flat surface so as to be in contact with the surface.

As one embodiment of the present disclosure, the imprint template of the present disclosure and the base material having the transfer surface are prepared, and the uneven pattern of the imprint template is transferred to the imprint resin on the transfer surface. An imprint method comprising a step and a step of separating the imprint resin to which the uneven pattern is transferred and the imprint template is provided.

According to the present disclosure, it is possible to provide an imprint template capable of manufacturing a defect-free pattern structure, a manufacturing method thereof, and an imprinting method.

1 (A) is a plan view showing a schematic configuration of an imprint template according to an embodiment of the present disclosure, and FIG. 1 (B) is an X- of the imprint template shown in FIG. 1 (A). It is a schematic sectional drawing which shows the X sectional drawing. 2 (A) and 2 (B) are cross-sectional views showing a schematic configuration of an imprint template according to another embodiment of the present disclosure. FIG. 3 is a cross-sectional view showing a schematic configuration of an imprint template according to another embodiment of the present disclosure. 4 (A) is a plan view showing a schematic configuration of a template for multi-imprint imprint according to another embodiment of the present disclosure, and FIG. 4 (B) is a multi-imprint imprint shown in FIG. 4 (A). It is a schematic cross-sectional view which shows the YY cross section of the template. FIG. 5 is a process flow chart showing each process of the imprint template manufacturing method according to the embodiment of the present disclosure in a cross-sectional view. FIG. 6 is a process flow chart showing each process of the imprint template manufacturing method according to the embodiment of the present disclosure in a cross-sectional view. FIG. 7 is a process flow chart showing each step of the method for manufacturing a template for multi-imprint imprint according to another embodiment of the present disclosure in a cross-sectional view. FIG. 8 is a process flow chart showing each step of the method for manufacturing a template for multi-imprint imprint according to another embodiment of the present disclosure in a cross-sectional view. FIG. 9 is a schematic diagram illustrating a method of placing the pattern substrate on the flat surface of the flat plate using the alignment marks formed on the pattern substrate and the flat plate in the step shown in FIG. 5 (B). be. FIG. 10 is a schematic diagram illustrating a method of vacuum-sucking a pattern substrate and a frame body onto a flat surface of a flat plate through suction holes formed in the flat plate in the step shown in FIG. 5 (C). FIG. 11 is a process flow chart showing each step of the imprint method according to the embodiment of the present disclosure in a cross-sectional view. FIG. 12 is a schematic view showing an embodiment in which a release layer is formed on the flat surface of the flat plate shown in FIG. 5, and an imprint template is formed on the release layer. FIG. 13 is a modification of the process shown in FIG. 5B, in which the pattern substrate is placed on the flat surface of the flat plate so as to expose the pattern region (concave and convex pattern) of the pattern substrate from the holes formed in the flat plate. It is a schematic diagram explaining the method of mounting.

Embodiments of the present disclosure will be described with reference to the drawings. In the drawings attached to the present specification, in order to facilitate understanding, the shape, scale, aspect ratio, etc. of each part may be changed or exaggerated from the actual product.

The numerical range represented by using "-" in the present specification and the like means a range including each of the numerical values described before and after "-" as a lower limit value and an upper limit value. In the present specification and the like, terms such as "film", "sheet", and "board" are not distinguished from each other based on the difference in designation. For example, "board" is a concept that also includes members commonly referred to as "sheets" and "films".

[Template for imprint]
1 (A) is a plan view showing a schematic configuration of an imprint template according to an embodiment of the present disclosure, and FIG. 1 (B) is an X- of the imprint template shown in FIG. 1 (A). It is a schematic sectional drawing which shows the X sectional drawing. 2 and 3 are cross-sectional views showing a schematic configuration of an imprint template according to another embodiment of the present disclosure, respectively.

The imprint template 1 in one embodiment of the present disclosure is composed of a pattern substrate 11, a frame body 12, and a joint portion 13. The pattern substrate 11 has a first surface 11 _F , a second surface 11 _R facing the first surface 11 _F , and a continuous side surface 11 _S between the outer edge of the first surface 11 _F and the outer edge of the second surface 11 _R. Have. On the first surface 11 _F , a line-and-space-shaped uneven pattern 11 _P having a plurality of recesses 11 _PD recessed from the first surface 11 _F in the thickness direction of the pattern substrate 11 is formed (FIG. 1 (FIG. 1). A) See.).

The shape, dimensions, etc. of the uneven pattern 11 _P can be appropriately set according to the required shape, required dimensions, etc. in the pattern structure manufactured by transferring the uneven pattern 11 _P by the imprint method described later. For example, examples of the shape of the uneven pattern _11P include a pillar shape, a hole shape, a grid shape, and the like, in addition to the line and space shape. Further, the dimension of the uneven pattern 11 _P can be set to, for example, about 50 nm to 2000 nm. The dimension of the concave-convex pattern 11 _P means the width of the concave-convex or convex portion in the lateral direction when the concave-convex pattern 11 _P has a line-and-space shape or a grid shape, and the concave-convex pattern 11 _P has a pillar shape. Or, when it is in the shape of a hole, it means the diameter of the concave portion or the convex portion or the length of one side.

Examples of the pattern substrate 11 include a quartz glass substrate, a soda glass substrate, a talc substrate, a calcium fluoride substrate, a magnesium fluoride substrate, an acrylic glass substrate, a glass substrate such as a borosilicate glass substrate, a polycarbonate substrate, a polypropylene substrate, and a polyethylene. Transparent substrates such as substrates, resin substrates such as polymethylmethacrylate substrates and polyethylene terephthalate substrates, and laminated substrates made by laminating two or more substrates arbitrarily selected from these; nickel substrates, titanium substrates, aluminum substrates, etc. Metal substrate; A semiconductor substrate such as a silicon substrate or a gallium nitride substrate can be used. In the present embodiment, "transparent" means that light having a wavelength that can cure the imprint resin can be transmitted, and that the transmittance of light having a wavelength of 150 nm to 400 nm is 60% or more. However, it is preferably 90% or more, and particularly preferably 95% or more.

The pattern substrate 11 may be made of a material having substantially the same coefficient of thermal expansion as the material constituting the frame body 12. In the present disclosure, "the coefficient of thermal expansion is substantially the same" means that the difference between the coefficient of thermal expansion of the constituent material of the pattern substrate 11 and the coefficient of thermal expansion of the constituent material of the frame body 12 is ± 1.0 × 10 ⁻ . It means that it is ⁵ / ° C or less. The pattern substrate 11 may be made of the same material as the material constituting the frame body 12. Since the coefficients of thermal expansion of the materials constituting each of the pattern substrate 11 and the frame 12 are substantially the same, the dimensional stability of the pattern substrate 11 and the frame 12 can be made similar.

The plan view shape of the pattern substrate 11 shown in FIG. 1 (A) is substantially rectangular, but is not limited to this, and may be, for example, a substantially circular shape. When the imprint template 1 according to the present embodiment is made of quartz glass generally used for optical imprint, the plan view shape of the pattern substrate 11 is usually substantially rectangular.

The thickness of the pattern substrate 11 is not particularly limited, and may be appropriately set in the range of, for example, about 500 μm to 10 mm. Further, the size of the pattern substrate 11 (size in plan view) is not particularly limited, but for example, when the shape of the pattern substrate 11 in plan view is substantially rectangular, it is about 20 mm × 20 mm to 200 mm × 200 mm. It can be set appropriately in the range.

The frame body 12 has a side surface 11 _S so as to provide a first gap S ₁ (see FIG. 5 (C)) between an opening 12 _H capable of exposing the uneven pattern 11 _P and a side surface 11 _S of the pattern substrate 11. It has a side wall portion 12 _W surrounding the structure and a bottom portion 12 _B facing the second surface 11 _R of the pattern substrate 11 (see FIG. 1 (B)).

The bottom portion 12 _B faces the second surface 11 _R so as to provide a second gap S ₂ (see FIG. 5 (C)) with the second surface 11 _R of the pattern substrate 11. The second gap S ₂ is continuous with the first gap S ₁ , and the bottom portion 12 _B has a through hole 12 _BH continuous with the first gap S ₁ via the second gap S ₂ (FIG. 5 (C)). (See) is provided (see FIG. 1 (B)).

The side wall surface of the side wall portion 12 _W of the frame body 12 facing the side surface 11 _S of the pattern substrate 11, the bottom surface of the bottom portion 12 _B facing the second surface 11 _R of the pattern substrate 11, and the inner wall of the through hole 12 _BH are rough surfaces. It has been transformed. As a result, the joint strength between the frame body 12 and the joint portion 13 can be increased. The arithmetic average roughness Ra of the side wall surface, the bottom surface, and the inner wall may be such that the joint strength between the frame body 12 and the joint portion 13 can be increased, and may be, for example, about 1 μm to 10 μm. As long as the joint strength between the frame body 12 and the joint portion 13 can be increased, at least the joint portion of the side wall surface of the side wall portion 12 _W of the frame body 12, the bottom surface of the bottom portion 12 _B , and the inner wall of the through hole 12 _BH . It suffices if the surface of the portion in contact with 13 is roughened, and in that sense, at least the side wall surface of the side wall portion 12 _W may be roughened. The arithmetic average roughness Ra conforms to the JIS B0601: 2013 standard.

As the frame 12, a material of the same type as the material constituting the above-mentioned various substrates that can be used as the pattern substrate 11 can be used, and for example, quartz glass, soda glass, talc, calcium fluoride, magnesium fluoride, acrylic. Glass materials such as glass and borosilicate glass, resin materials such as polycarbonate, polypropylene, polyethylene, polymethylmethacrylate, and polyethylene terephthalate, and a laminate formed by laminating two or more materials arbitrarily selected from these; nickel, Metallic materials such as titanium and aluminum; semiconductor materials such as silicon and gallium nitride can be mentioned. The coefficient of thermal expansion of the material constituting the frame body 12 may be substantially the same as the coefficient of thermal expansion of the material constituting the pattern substrate 11, and the material constituting the frame body 12 constitutes the pattern substrate 11. It is preferable that the material is the same as the material to be used.

The plan view shape of the outer shell of the frame body 12 is substantially rectangular, but the shape is not limited to this, and the shape may be substantially the same as the plan view shape of the pattern substrate 11, or the pattern substrate 11 may have a shape substantially the same. The shape may be different from the plan view shape of. For example, when the plan view shape of the pattern substrate 11 is a substantially circular shape, the plan view shape of the outer shell of the frame body 12 may be a substantially circular shape or a substantially rectangular shape. Further, the plan view shape of the opening portion 12 _H of the frame body 12 is substantially rectangular, but the shape is limited as long as the first surface 11 _F (concavo-convex pattern 11 _P ) of the pattern substrate 11 can be exposed. However, the shape may be substantially the same as the shape of the first surface 11 _F of the pattern substrate 11, or the shape may be different from the shape of the first surface 11 _F. For example, when the shape of the first surface 11 _F of the pattern substrate 11 is a substantially circular shape, the plan view shape of the opening 12 _H may be a substantially circular shape or a substantially rectangular shape.

The size of the outer shell of the frame body 12 (size in plan view) and the size of the opening 12 _H of the frame body 12 (size in plan view) are the size of the pattern substrate 11 (size in plan view). It can be set as appropriate according to the situation. The size of the outer shell of the frame body 12 can be appropriately set in the range of about 50 mm × 50 mm to 300 mm × 300 mm when the shape of the outer shell of the frame body 12 in a plan view is substantially rectangular. Further, the size (size in a plan view) of the opening 12 _H of the frame body 12 is not particularly limited as long as it can expose the uneven pattern 11 _P of the pattern substrate 11, and the frame body 12 is not particularly limited. When the plan view shape of the opening portion 12 _H is substantially rectangular, it can be appropriately set in the range of about 20 mm × 20 mm to 200 mm × 200 mm.

The thickness 12 _T of the frame body 12 may be thicker than the thickness of the pattern substrate 11, and may be appropriately set in the range of, for example, about 500 μm to 20 mm. Further, the height 12 _HD (length in the thickness direction of the frame body 12) of the side wall surface of the side wall portion 12 _W of the frame body 12 can be appropriately set in the range of, for example, about 500 μm to 10 mm.

The joint portion 13 is located in the first gap S ₁ , the second gap S ₂ , and the through hole 12 _BH . The pattern substrate 11 and the frame body 12 can be joined to each other via the joining portion 13. The joint portion 13 may be made of a cured resin. Examples of the curing resin constituting the joint portion 13 include a heat-curing resin and an active energy ray-curing resin that is cured by irradiating with active energy rays such as ultraviolet rays and electron beams. Examples of the thermosetting resin include melamine resin, polyester-melamine resin, epoxy-melamine resin, polyimide resin, thermosetting acrylic resin, thermosetting polyurethane resin, phenol resin, thermosetting polyester resin and the like. As the active energy ray-curable resin, for example, an ultraviolet curable resin, an electron beam curable resin, or the like can be used.

The imprint template 1 in the present embodiment has the first surface 11 _F , the upper surface 12 _F of the frame body 12, and the upper surface of the joint portion 13 in a side view with the first surface 11 _F of the pattern substrate 11 facing upward. 13 _F is configured to be substantially flush with each other (see FIG. 1 (B)). In the present disclosure, "substantially flush" means that the first surface 11 _F , the upper surface 12 _F of the frame body 12, and the upper surface 13 _F of the joint portion 13 are substantially the same plane, for example, a pattern. The maximum height roughness Rz on the upper surface of the imprint template 1 formed by the first surface 11 _F of the substrate 11, the upper surface 12 _F of the frame body 12, and the upper surface 13 _F of the joint portion 13 is 1 μm or less. Means that. The maximum height roughness Rz conforms to the JIS B0601: 2013 standard.

In the imprint template 1 of the present embodiment, as long as the first surface 11 _F of the pattern substrate 11, the upper surface 12 _F of the frame body 12, and the upper surface 13 _F of the joint portion 13 are substantially flush with each other. , As shown in FIG. 2, the frame body 12 does not have to have the bottom portion 12 _B facing the second surface 11 _R of the pattern substrate 11 (see FIG. 2A), and the bottom portion 12 _B. It does not have to have a part (see FIG. 2B). In addition, as an embodiment having no part of the bottom portion 12 _B , the frame body 12 is an annular shape that is continuous with the side wall portion 12 _W and faces a part of the outer edge of the second surface 11 _R of the pattern substrate 11. It may have a bottom 12 _B.

As shown in FIG. 3, the pattern substrate 11 in the present embodiment may be formed with a concavo-convex pattern 11 _P having a plurality of convex portions 11 _PP protruding from the first surface 11 _F. Here, in FIG. 3, the region where the uneven pattern 11 _P is formed on the first surface 11 _F is referred to as the pattern region 11 _FP , and the region where the uneven pattern 11 _P is not formed is referred to as the non-pattern region 11 _FN . The imprint template 1 shown in FIG. 3 has a non-patterned region 11 _FN on the first surface 11 _F and an upper surface 12 _F on the frame body 12 in a side view with the first surface 11 _F of the pattern substrate 11 facing upward. And the upper surface 13 _F of the joint portion 13 are configured to be substantially flush with each other (see FIG. 3).

In the imprint template 1 in the present embodiment, as described above, the first surface 11 _F of the pattern substrate 11, the upper surface 12 _F of the frame body 12, and the upper surface 13 _F of the joint portion 13 are substantially flush with each other. Since there is almost no step on the upper surface (pattern surface) of the print template 1, by using the imprint template 1 in the present embodiment in the imprint method described later, the imprint template 1 is used with respect to the imprint resin. The upper surface (pattern surface) of the above can be pressed uniformly, and a defect-free pattern structure can be manufactured.

[Template for multi-sided imprint]
4 (A) is a plan view showing a schematic configuration of a template for multi-imprint imprint according to another embodiment of the present disclosure, and FIG. 4 (B) is a multi-imprint imprint shown in FIG. 4 (A). It is a schematic cross-sectional view which shows the YY cross section of the template. The same components as those of the imprint template 1 are designated by the same reference numerals, and detailed description thereof will be omitted. 4 (A) and 4 (B) show a template 1 for multi-imprint imprint in which a plurality of (here, four) pattern substrates 11 are multi-faceted vertically and horizontally.

As shown in FIGS. 4A and 4B, the side wall portion 12 _W of the frame body 12 included in the multi-imprint imprint template 1 is continuous with the outer frame portion 12 _WB and the outer frame portion 12 _WB . The outer frame portion 12 _WB includes a partition frame portion 12 _WP that divides the inside of the WB into a plurality of (here, four) substantially rectangular regions 12 _H1 , 12 _H2 , 12 _H3 , and 12 _H4 . The pattern substrate 11 is arranged in each of the above regions 12 _H1 , 12 _H2 , 12 _H3 , and 12 _H4 (see FIG. 4A). The outer frame portion 12 _WB and the partition frame portion 12 _WP are provided with a first gap S ₁ (see FIG. 7 (C)) between the outer frame portion 12 WB and the side surface 11 _S of the pattern substrate 11 arranged in each region 12 _H1 to 12 _H4 . In this way, the side surface 11 _S of the pattern substrate 11 is surrounded (see FIG. 4B).

The frame body 12 has each bottom portion 12 _B facing the second surface 11 _R of each pattern substrate 11 arranged in each region 12 _H1 to 12 _H4 . Each bottom portion 12 _B faces the second surface 11 _R so as to provide a second gap S ₂ (see FIG. 7 (C)) between the second surface 11 _R of each pattern substrate 11. The second gap S ₂ is continuous with the first gap S ₁ , and each bottom portion 12 _B has a through hole 12 _BH continuous with the first gap S ₁ via the second gap S ₂ (FIG. 7 (C). ) Is provided (see FIG. 4 (B)).

The joint portion 13 is located in the first gap S ₁ , the second gap S ₂ , and the through hole 12 _BH , respectively. The pattern substrate 11 and the frame body 12 can be joined to each other via the joining portions 13. The template 1 for multi-imprint imprinting in the present embodiment has the first surface 11 _F of each pattern board 11 and the frame body 12 (outer frame) in a side view with the first surface 11 _F of each pattern board 11 facing upward. The upper surface 12 _F of the portion 12 _WB and the partition frame portion 12 _WP ) and the upper surface 13 _F of each joint portion 13 are configured to be substantially flush with each other (see FIG. 4B).

By using the multi-imprint imprint template 1 in the present embodiment in the imprint method described later, a defect-free pattern structure can be manufactured for the same reason as described above. Further, by using the multi-imprint imprint template 1 in the imprint method described later, a plurality of pattern structures can be manufactured at one time, so that a large-area pattern structure can be manufactured.

[Manufacturing method of imprint template]
5 and 6 are process flow charts showing cross-sectional views of each step of the method for manufacturing an imprint template according to the embodiment of the present disclosure. In the present embodiment, a manufacturing method for manufacturing the imprint template 1 shown in FIG. 1 will be described as an example.

<Preparation process>
First, the flat plate 100, the pattern substrate 11, and the frame body 12 are prepared. The flat plate 100 has a flattened flat surface 100 _F and a facing surface 100 _R facing the flat surface 100 _F (FIG. 5A). Examples of the flat plate 100 include a quartz glass substrate, a soda glass substrate, a talc substrate, a calcium fluoride substrate, a magnesium fluoride substrate, an acrylic glass substrate, a glass substrate such as a borosilicate glass substrate, a polycarbonate substrate, a polypropylene substrate, and a polyethylene substrate. , Polymethylmethacrylate substrate, resin substrate such as polyethylene terephthalate substrate, transparent substrate such as laminated substrate formed by laminating two or more substrates arbitrarily selected from these; metal such as nickel substrate, titanium substrate, aluminum substrate, etc. Substrate: A semiconductor substrate such as a silicon substrate or a gallium nitride substrate can be used. It is particularly preferable to use a glass substrate having high surface flatness as the flat plate 100.

The maximum height roughness Rz of the flat surface 100 _F of the flat plate 100 may be 1 μm or less, preferably 100 nm or less, and particularly preferably 10 nm or less. The maximum height roughness Rz is a value measured by using LEXT OLS4000 (manufactured by Olympus Corporation) as a measuring device in a measurement environment of 23 ° C. in accordance with the JIS B0601: 2013 standard. ..

The plan view shape, size (size in plan view), thickness, etc. of the flat plate 100 are not particularly limited, and are appropriately set according to the plan view shape, size, etc. of the imprint template 1. obtain. Examples of the plan view shape of the flat plate 100 include a substantially rectangular shape and a substantially circular shape. Further, the size of the flat plate 100 can be appropriately set in the range of about 50 mm × 50 mm to 300 mm × 300 mm when the flat plate 100 has a substantially rectangular shape in a plan view. Further, the thickness of the flat plate 100 can be appropriately set in the range of, for example, about 500 μm to 20 mm.

The pattern substrate 11 has a first surface 11 _F , a second surface 11 _R facing the first surface 11 _F , and a continuous side surface 11 _S between the outer edge of the first surface 11 _F and the outer edge of the second surface 11 _R. An uneven pattern 11 _P is formed on the first surface 11 _F of the pattern substrate 11 (see FIG. 5 (B)). The frame body 12 has a side wall portion 12 _W capable of forming a first gap S ₁ with the side surface 11 _S of the pattern substrate 11, an opening portion 12 _H capable of exposing the uneven pattern 11 _P , and a first gap S ₁ . It has a bottom portion 12 _B capable of forming a continuous second gap S ₂ between the second surface 11 _R and the second surface 11 R of the pattern substrate 11 (see FIG. 5 (C)). A through hole 12 _BH continuous with the first gap S ₁ is formed in the bottom portion 12 _B via the second gap S ₂ .

The material constituting the pattern substrate 11 and the frame 12 is not particularly limited, and for example, glass such as quartz glass, soda glass, talc, calcium fluoride, magnesium fluoride, acrylic glass, and borosilicate glass. Materials, resin materials such as polycarbonate, polypropylene, polyethylene, polymethylmethacrylate, polyethylene terephthalate, and laminates made by laminating two or more materials arbitrarily selected from these; metal materials such as nickel, titanium, and aluminum; Although semiconductor materials such as silicon and gallium nitride can be appropriately set, it is preferable that the pattern substrate 11 and the frame 12 are made of materials having substantially the same thermal expansion coefficient. Further, in the forming step described later, when the active energy rays are irradiated from the imprint template 1 side, the pattern substrate 11 and the frame body 12 may be made of a transparent glass material.

The shape, size (size in plan view), thickness, etc. of the pattern substrate 11 are not particularly limited, and may be the shape, size, etc. of the pattern structure manufactured by the imprint method described later. It can be set as appropriate according to the situation. The plan view shape of the pattern substrate 11 in the present embodiment is substantially rectangular, but is not particularly limited, and may be, for example, a substantially circular shape. Further, the size of the pattern substrate 11 can be appropriately set in the range of about 20 mm × 20 mm to 200 mm × 200 mm when the plan view shape of the pattern substrate 11 is substantially rectangular. Further, the thickness of the pattern substrate 11 can be appropriately set in the range of, for example, about 500 μm to 10 mm.

The plan view shape, size (size in plan view), thickness, and the like of the outer shell of the frame body 12 can be appropriately set according to the plan view shape, size, thickness, and the like of the pattern substrate 11. The plan view shape of the outer shell of the frame body 12 in the present embodiment is substantially the same as the plan view shape of the pattern substrate 11, but the shape is not limited to this, and the plan view shape of the pattern substrate 11 is not limited to this. It may have a different shape from. For example, when the plan view shape of the pattern substrate 11 is, for example, a substantially circular shape, the plan view shape of the outer shell of the frame body 12 may be a substantially rectangular shape. Further, the plan view shape of the opening portion 12 _H of the frame body 12 is substantially the same as the plan view shape of the first surface 11 _F of the pattern substrate 11, but the shape is not limited to this. The shape may be different from the plan view shape of the first surface 11 _F of the pattern substrate 11. For example, when the plan view shape of the first surface 11 _F of the pattern substrate 11 is a substantially circular shape, the plan view shape of the opening portion 12 _H of the frame body 12 may be a substantially rectangular shape.

The size of the outer shell of the frame body 12 can be appropriately set in the range of about 50 mm × 50 mm to 300 mm × 300 mm when the shape of the outer shell of the frame body 12 in a plan view is substantially rectangular. The size of the opening 12 _H of the frame body 12 (size in a plan view) may be a size that allows the pattern substrate 11 to be exposed, and the frame body 12 has a substantially rectangular shape in a plan view. , 20 mm × 20 mm to 200 mm × 200 mm can be appropriately set. Further, the thickness 12 _T of the frame body 12 can be appropriately set in the range of, for example, about 500 μm to 20 mm.

The height 12 _HD (length in the thickness direction of the frame body 12) of the side wall surface 12 W of the side wall portion 12 _W of the frame body 12 is such that the side surface 11 _S of the pattern substrate 11 is the side wall of the frame body 12 in the mounting process described later. The height may be appropriately set to such that a second gap S ₂ is formed between the second surface 11 _R of the pattern substrate 11 and the bottom portion 12 _B of the frame body 12 when surrounded by the portion 12 _W. For example, the height 12 _HD can be appropriately set in the range of about 500 μm to 10 mm.

The side wall surface of the side wall portion 12 _W of the frame body 12 facing the side surface 11 _S of the pattern substrate 11, the bottom surface of the bottom portion 12 _B facing the second surface 11 _R of the pattern substrate 11, and the inner wall of the through hole 12 _BH are rough surfaces. It has been transformed. As a result, the joint strength between the frame body 12 and the joint portion 13 can be increased. The arithmetic average roughness Ra of the side wall surface, the bottom surface, and the inner wall may be such that the joint strength between the frame body 12 and the joint portion 13 can be increased, and may be, for example, about 1 μm to 10 μm. As long as the joint strength between the frame body 12 and the joint portion 13 can be increased, at least the joint portion of the side wall surface of the side wall portion 12 _W of the frame body 12, the bottom surface of the bottom portion 12 _B , and the inner wall of the through hole 12 _BH . It suffices if the surface of the portion in contact with 13 is roughened, and in that sense, at least the side wall surface of the side wall portion 12 _W may be roughened. The arithmetic mean roughness Ra conforms to the JIS B0601: 2013 standard. The frame body 12 having no bottom portion _12B shown in FIG. 2A has an opening as a through hole penetrating from one surface of the substrate which is the base material of the frame body 12 to the other surface. It can be made by forming 12 _H. Therefore, like the frame body 12 having the bottom portion 12 _B , the opening portion 12 _H and the bottom portion 12 _B are formed by forming a recess from one surface of the substrate serving as the base material, and the bottom portion 12 is further formed on the opening portion 12 H and the bottom portion 12 B. Compared with the case where the through hole 12 _BH is formed in _B , it is easier to fabricate the frame body 12 having no bottom portion 12 _B. Therefore, by using the frame body 12 having no bottom portion 12 _B , it is possible to reduce the cost required for manufacturing the imprint template 1 as compared with the case of using the frame body 12 having the bottom portion 12 _B. ..

<Placement process>
Next, the pattern substrate 11 is placed on the flat surface 100 _F so that the first surface 11 _F of the pattern substrate 11 faces the flat surface 100 _F of the flat plate 100 (FIG. 5 (B)). The frame body 12 is formed on the flat surface 100 _F so as to form a first gap S ₁ between the side surface 11 _S and the side wall portion 12 _W and to surround the side surface 11 _S of the pattern substrate 11 with the side wall portion 12 _W. Is placed (FIG. 5 (C)). In a state where the frame body 12 is placed on the flat surface 100 _F , the first gap S ₂ existing between the second surface 11 _R of the pattern substrate 11 and the bottom portion 12 _B of the frame body 12 is used. Through hole 12 _BH communicates with 1 gap S ₁ (see FIG. 5C). When the frame body 12 as shown in FIG. 2A is used, the frame body 12 is placed on the flat surface 100 _F of the flat plate 100, and then the side surface 11 _S and the side wall portion 12 _W of the pattern substrate 11 are placed. The pattern substrate 11 is placed on the flat surface 100 _F so as to form a first gap S ₁ between the two and the side surface 11 _S of the pattern substrate 11 so as to be surrounded by the side wall portion 12 _W of the frame body 12. You may place it.

<Filling process>
Subsequently, the composition 13 _BM for a joining material for joining the pattern substrate 11 and the frame body 12 is injected from the through hole 12 _BH , and the joining material is inserted into the first gap S ₁ , the second gap S ₂ and the through hole 12 _BH . Composition 13 _BM is filled (FIG. 6 (A)). The bonding material composition 13 _BM has a viscosity of 1 Pa · s at 25 ° C. from the viewpoint of preventing the filled bonding material composition 13 _BM from seeping out between the frame body 12 and the flat plate 100. It is preferably a curable resin composition having a temperature of about 5 Pa · s. Examples of the curable resin composition include a thermosetting resin composition and an active energy ray-curable resin composition that can be cured by irradiating with active energy rays such as ultraviolet rays and electron beams. In this step, as the curable resin composition, for example, an active energy ray-curable resin composition such as an ultraviolet curable resin or an electron beam curable resin is used.

<Formation process>
Next, the joint material 13 _BM filled in the first gap S ₁ , the second gap S ₂ and the through hole 12 _BH is cured to form a joint portion 13 for joining the pattern substrate 11 and the frame body 12. (See FIG. 6 (B)). In this step, as shown by the arrow R, the active energy ray-curable resin composition is directed from the facing surface 100 _R side to the flat surface 100 _F side along the thickness direction of the flat plate 100 made of the transparent material. By irradiating the bonding material composition 13 _BM with active energy rays through the flat plate 100, the bonding material composition 13 _BM can be cured. Of course, when the frame body 12 and the pattern substrate 11 are made of a transparent material, active energy rays may be irradiated from the bottom portion 12 _B side of the frame body 12.

<Plate removal process>
After forming the joint portion 13, the flat plate 100 is removed (see FIG. 6C). Through the above steps, the imprint template 1 in which the first surface 11 _F of the pattern substrate 11, the upper surface 12 _F of the frame body 12, and the upper surface 13 _F of the joint portion 13 are substantially flush with each other is obtained. Can be formed.

[Manufacturing method of template for multi-sided imprint]
7 and 8 are process flow charts showing cross-sectional views of each step of the method for manufacturing a template for multi-imprint imprint according to another embodiment of the present disclosure. In the present embodiment, a manufacturing method for manufacturing the template 1 for multi-imprint imprint shown in FIG. 4 will be described as an example. The same components as those used in the method for manufacturing the imprint template described with reference to FIGS. 5 and 6 are designated by the same reference numerals, and detailed description thereof will be omitted.

<Preparation process>
First, a flat plate 100 having a flat surface 100 _F and a facing surface 100 _R facing the flat surface 100 _F is prepared (FIG. 7A). The size of the flat plate 100 (size in plan view) in the present embodiment is appropriately set according to the size (size in plan view), number, and the like of the pattern substrate 11 constituting the template 1 for multi-imprint imprint. Can be done. For example, the size of the flat plate 100 (the size in the plan view) can be appropriately set in the range of about 100 mm × 100 mm to 600 mm × 600 mm when the plan view shape of the flat plate 100 is substantially rectangular. Further, the thickness of the flat plate 100 can be appropriately set in the range of, for example, about 500 μm to 20 mm.

A plurality of (4 in this case, 2 in the figure) pattern substrates 11 are prepared. The size (size in plan view) of each pattern substrate 11 is not particularly limited, but when the plan view shape of the pattern substrate 11 is substantially rectangular, it is about 20 mm × 20 mm to 200 mm × 200 mm. It can be set appropriately in the range. The plan view shape of each pattern substrate 11 can be appropriately set as a substantially rectangular shape, a substantially circular shape, or the like, as described above. Further, the thickness of each pattern substrate 11 can be appropriately set in the range of about 500 μm × 10 mm as described above.

The frame body 12 prepared in this step has a side wall portion 12 _W capable of forming a first gap S ₁ between the side surface 11 _S of each pattern substrate 11 and a second gap S continuous with the first gap S ₁ . ₂ has a bottom portion 12 _B that can be formed between the second surface 11 _R of each pattern substrate 11. The side wall portion 12 _W includes an outer frame portion 12 _WB and a partition frame portion 12 _WP continuous with the outer frame portion 12 _WB . The partition frame portion 12 _WP divides the inside of the outer frame portion 12 _WB into a plurality of substantially rectangular regions 12 _H1 , 12 _H2 , 12 _H3 , and 12 _H4 . In each bottom portion 12 _B , a through hole 12 _BH continuous with the first gap S ₁ is formed via the second gap S ₂ .

The plan view shape of the regions 12 _H1 to 12 _H4 of the frame body 12 is substantially the same as the plan view shape of the first surface 11 _F of each pattern substrate 11, but is not limited thereto. , The shape may be different from the plan view shape of the first surface 11 _F of each pattern substrate 11. For example, when the plan view shape of the first surface 11 _F of each pattern substrate 11 is a substantially circular shape, the plan view shape of the regions 12 _H1 to 12 _H4 may be a substantially rectangular shape. The size (size in plan view) of the outer shell of the frame body 12 can be appropriately set according to the size (size in plan view) and the number of the plurality of pattern substrates 11. The size of the outer shell of the frame body 12 can be appropriately set in the range of about 100 mm × 100 mm to 600 mm × 600 mm when the shape of the outer shell of the frame body 12 in a plan view is substantially rectangular. Further, the thickness 12 _T of the frame body 12 can be appropriately set in the range of about 500 μm × 20 mm according to the thickness of each pattern substrate 11 as described above.

The size of the areas 12 _H1 to 12 _H4 of the frame body 12 (the size in the plan view) may be a size that can expose each of the pattern substrates 11, and the planes of the areas 12 _H1 to 12 _H4 of the frame body 12 When the visual shape is substantially rectangular, it can be appropriately set in the range of about 20 mm × 20 mm to 200 mm × 200 mm. Further, the height 12 _HD of the side wall surface of the side wall portion 12 _W (outer frame portion 12 _WB and partition frame portion 12 _WP ) of the frame body 12 is the side surface 11 of each pattern substrate 11 in the mounting process described later as described above. When _S is surrounded by the side wall portion 12 _W of the frame body 12 (the inner wall surface of the outer frame portion 12 _WB and the side wall surface of the partition frame portion 12 _WP ), the second surface 11 _R of each pattern substrate 11 is viewed in cross section. The height may be appropriately set to such that a second gap S ₂ is formed between the frame body 12 and the bottom portion 12 _B. For example, the height 12 _HD can be appropriately set in the range of about 500 μm to 10 mm.

The side wall surface facing the side surface 11 _S of each pattern substrate 11 of the side wall portion 12 _W (outer frame portion 12 _WB and partition frame portion 12 _WP ) of the frame body 12 (inner wall surface of the outer frame portion 12 _WB and the partition frame portion 12 _WP ). The side wall surface), the bottom surface of each bottom portion 12 _B facing the second surface 11 _R of the pattern substrate 11, and the inner wall of each through hole 12 _BH are roughened. As a result, the joint strength between the frame body 12 and the joint portion 13 can be increased. The arithmetic average roughness Ra of the side wall surface, the bottom surface, and the inner wall may be such that the joint strength between the frame body 12 and the joint portion 13 can be increased, and may be, for example, about 1 μm to 10 μm. As long as the joint strength between the frame body 12 and the joint portion 13 can be increased, the side wall surface of the side wall portion 12 _W (outer frame portion 12 _WB and the partition frame portion 12 _WP ) of the frame body 12 and the bottom surface of the bottom portion 12 _B. And, of the inner wall of the through hole 12 _BH , at least the surface of the portion that comes into contact with the joint portion 13 may be roughened, and in that sense, at least the side wall portion 12 _W (outer frame portion 12 _WB and partition frame portion 12 _WP ). ) (The inner wall surface of the outer frame portion 12 _WB and the side wall surface of the partition frame portion 12 _WP ) may be roughened. The arithmetic average roughness Ra conforms to the JIS B0601: 2013 standard.

<Placement process>
Next, on the flat surface 100 _F of the flat plate 100, a plurality of (4 in this case, 2 in the figure) pattern substrates 11 are placed so that the first surface 11 _F of the pattern substrate 11 faces the flat surface 100 _F. (Fig. 7 (B)). At this time, each pattern substrate 11 is positioned at a predetermined portion on the flat surface 100 _F so as to leave a predetermined gap between the adjacent pattern substrates 11, and is placed on the flat surface 100 _F. The width of the predetermined gap is such that the partition frame portion 12 _WP of the frame body 12 can be accommodated in the gap when the frame body 12 is subsequently placed on the flat surface 100 _F. A width capable of forming a predetermined interval ( _first gap S1 described later) between the side wall surface of the 12 _WP and the side surface 11 _S of each pattern substrate 11 can be appropriately set. Further, when each pattern substrate 11 is placed on the flat surface 100 _F of the flat plate 100, a margin area on which the side wall portion 12 _W of the frame body 12 can be placed on the outer peripheral portion of the flat surface 100 _F of the flat plate 100. Is formed.

After each pattern substrate 11 is placed on the flat surface 100 _F of the flat plate 100, the frame body 12 is placed on the flat surface 100 _F (FIG. 7 (C)). The frame body 12 forms a first gap S ₁ between the side surface 11 _S of each pattern substrate 11 and the side wall portion 12 _W (outer frame portion 12 _WB and partition frame portion 12 _WP ), and each pattern is formed. The side surface 11 _S of the substrate 11 is placed on the flat surface 100 _F so as to be surrounded by the side wall portion 12 _W (the inner wall surface of the outer frame portion 12 _WB and the side wall surface of the partition frame portion 12 _WP ). In a state where the frame body 12 is placed on the flat surface 100 _F of the flat plate 100, the side surface 11 _S of each pattern substrate 11 and the side wall portion 12 _W (the inner wall surface of the outer frame portion 12 _WB and the partition frame portion 12 _WP ). A first gap S ₁ exists between the side wall surface), and a second gap S ₂ exists between the second surface 11 _R of each pattern substrate 11 and the bottom portion 12 _B of the frame body 12. The through hole 12 _BH of the bottom portion 12 _B communicates with the first gap S ₁ via the second gap S ₂ .

<Filling process>
Subsequently, the composition 13 _BM for a joining material for joining the pattern substrate 11 and the frame body 12 is injected from the through hole 12 _BH and joined to the first gap S ₁ , the second gap S ₂ and the through hole 12 _BH . The material composition 13 _BM is filled (FIG. 8 (A)). The composition 13 _BM for a bonding material is preferably a curable resin composition having a viscosity at 25 ° C. of 1 Pa · s to 5 Pa · s for the same reason as described above. In the present embodiment, the curable resin composition is, for example, an active energy ray-curable resin composition such as an ultraviolet curable resin or an electron beam curable resin, or a melamine resin, a polyester-melamine resin, or an epoxy-melamine resin. , A thermosetting resin composition containing a thermosetting resin such as a polyimide resin, a thermosetting acrylic resin, a thermosetting polyurethane resin, a phenol resin, and a thermosetting polyester resin is used.

<Formation process>
Next, the joint portion 13 for joining the pattern substrate 11 and the frame body 12 by curing the bonding material composition 13 _BM filled in the first gap S ₁ , the second gap S ₂ and the through hole 12 _BH . Can be formed (see FIG. 8B). In this step, as shown by the arrow R, the active energy ray-curable resin composition is used from the facing surface 100 _R side to the flat surface 100 _F side along the thickness direction of the flat plate 100 made of the transparent material. By irradiating a certain bonding material composition 13 _BM with active energy rays through the flat plate 100, the bonding material composition 13 _BM can be cured. Of course, when the frame body 12 and the pattern substrate 11 are made of a transparent material, active energy rays may be irradiated from the bottom portion 12 _B side of the frame body 12.

<Plate removal process>
After forming the joint portion 13, the flat plate 100 is removed (see FIG. 8C). By going through the above steps, for multi-imprint imprinting, the first surface 11 _F of each pattern substrate 11, the upper surface 12 _F of the frame body 12, and the upper surface 13 _F of the joint portion 13 are substantially flush with each other. Template 1 can be formed.

[Alignment mark]
FIG. 9 is a schematic diagram illustrating a method of placing the pattern substrate on the flat surface of the flat plate using the alignment marks formed on the pattern substrate and the flat plate in the step shown in FIG. 5 (B). be. In this figure, an alignment mark 100 _M having a predetermined shape is formed on a flat surface 100 _F of a flat plate 100, and the alignment mark 100 _M is composed of a metal film pattern. The metal film pattern constituting the alignment mark 100 _M is formed by patterning a metal film containing chromium (Cr) or the like. The size (dimensions) of the alignment mark 100 _M in a plan view is not particularly limited as long as it can be observed by the image pickup apparatus 200, but can be appropriately set in the range of about 100 μm × 100 μm to 2 mm × 2 mm. The film thickness of the alignment mark 100 _M is not particularly limited as long as it can be observed by the image pickup apparatus 200, and may be appropriately set in the range of about 2 nm to 100 nm. Further, a concave alignment mark 11 _M is formed on the first surface 11 _F of the pattern substrate 11. The size (dimensions) of the alignment mark 11 _M in a plan view can be appropriately set in the range of about 100 μm × 100 μm to 2 mm × 2 mm. The depth of the alignment mark 11 _M can be appropriately set in the range of about 100 nm to 100 μm. The size (dimensions) of the alignment mark 11 _M in a plan view is set within the above numerical range, and the depth of the alignment mark 11 _M is set within the above numerical range, whereby the alignment mark 100 is set. The pattern substrate 11 can be placed on the flat surface 100 _F of the flat plate 100 so that _M does not come into contact with the alignment mark 11 _M. Thereby, the pattern substrate 11 can be placed on the flat surface 100 _F of the flat plate 100 so that the first surface 11 _F of the pattern substrate 11 and the flat surface 100 _F of the flat plate 100 can be in close contact with each other without a gap. .. Further, from the viewpoint of making each alignment mark observable by the image pickup apparatus 200, the pattern substrate 11 and the flat plate 100 may be made of a transparent glass material. The alignment mark 100 _M may be a concave alignment mark like the alignment mark 11 _M , but is preferably a metal film pattern. Since the alignment mark 100 _M is a metal film pattern, visibility can be improved.

The planar view shapes of the alignment mark 100 _M and the alignment mark 11 _M are not particularly limited as long as they can be observed by the image pickup apparatus 200 or the like, and are, for example, a cross shape, a cross shape, a rectangular shape, a circular shape, and the like. The key shape and the like can be mentioned. Further, in the present embodiment, at least two alignment marks 100 _M may be formed on the flat surface 100 _F of the flat plate 100, and similarly, the alignment marks 11 _M may be the first surface 11 of the pattern substrate 11. It suffices if at least two are formed in _F. By forming three or more of the above alignment marks on each of the flat plate 100 and the pattern substrate 11, the alignment accuracy can be improved. Further, the alignment mark 100 _M may be formed on the facing surface 100 _R of the flat plate 100, or the alignment mark 11 _M may be formed on the second surface 11 _R of the pattern substrate 11.

Using the alignment mark 11 _M formed on the first surface 11 _F of the pattern substrate 11 and the alignment mark 100 _M formed on the flat surface 100 _F of the flat plate 100 as indicators, the pattern substrate 11 and the flat plate 100 Alignment is performed, and the pattern substrate 11 is placed on the flat surface 100 _F (see FIG. 9). For example, the flat plate 100 is placed on a stage (not shown) movable in the X, Y, and Z directions so that the flat surface 100 _F side faces the upper surface. The pattern substrate 11 is held by a predetermined holding device (not shown) with its first surface 11 _F facing the flat surface 100 _F of the flat plate 100. While observing the alignment mark 100 _M and the alignment mark 11 _M with the image pickup apparatus 200, the stage on which the flat plate 100 is placed is relatively moved in the X direction, the Y direction, or the Z direction. Then, using the alignment mark 11 _M of the pattern substrate 11 and the alignment mark 100 _M of the flat plate 100 as indicators, the pattern substrate 11 and the flat plate 100 were aligned (FIG. 9A), and both were aligned. In this state, the pattern substrate 11 can be placed on the flat surface 100 _F of the flat plate 100 by raising the stage in the Z direction (FIG. 9B). As a result, when the pattern substrate 11 is placed on the flat surface 100 _F of the flat plate 100, the pattern substrate 11 can be accurately aligned with a predetermined portion on the flat surface 100 _F.

The holding device may be configured to be movable in the X direction, the Y direction, and the X direction, and the stage may be fixed. In this case, the flat plate 100 is placed on the fixed stage, and the holding device for holding the pattern substrate 11 is relative to the X direction, the Y direction, or the Z direction while observing each of the alignment marks with the image pickup device 200. The position of the alignment mark 11 _M of the pattern substrate 11 and the position of the alignment mark 100 _M of the flat plate 100 may be aligned while being moved.

[Vacuum suction]
FIG. 10 is a schematic diagram illustrating a method of vacuum-sucking a pattern substrate and a frame body onto a flat surface of a flat plate through suction holes formed in the flat plate in the step shown in FIG. 5 (C). The flat plate 100 is formed with suction holes 100 _SH that are opened at positions on the flat surface 100 _F on which the pattern substrate 11 and the frame 12 are placed and penetrate in the thickness direction of the flat plate 100 (FIG. See 10).

In FIG. 5C, after the pattern substrate 11 and the frame body 12 are placed on the flat surface 100 _F of the flat plate 100, the pattern substrate 11 and the frame body 12 are placed on the flat surface 100 of the flat plate 100 via the suction holes 100 _SH . Vacuum-adsorb to _F (see FIG. 10). In FIG. 10, the suction hole 100 _SH is a position on the flat surface 100 _F on which the outer edge portion of the first surface 11 _F of the pattern substrate 11 is placed, and a predetermined portion of the upper surface 12 _F of the frame body 12 (in FIG. 10). The opening is near the center of the side wall portion 12 _W of the frame body 12, but the present invention is not limited to this, and the pattern substrate 11 or the frame body 12 may be opened at a position where it can be adsorbed. Further, as shown in FIG. 10, the flat plate 100 is formed with a total of four suction holes 100 _SH , but the present invention is not limited to this, and the size of the pattern substrate 11 (the size in a plan view) is not limited to this. ), The number of suction holes 100 _SH formed can be appropriately set.

By vacuum-sucking the pattern substrate 11 and the frame body 12 to the flat surface 100 _F of the flat plate 100 through the suction holes 100 _SH , the pattern substrate 11 and the frame body 12 are firmly adhered to the flat surface 100 _F of the flat plate 100. Even if distortion or warpage is present on the first surface 11 _F of the pattern substrate 11 or the upper surface 12 _F of the frame body 12, the distortion or warpage can be corrected. In that state (a state in which distortion and warpage are corrected), the first gap S ₁ , the second gap S ₂ and the through hole 12 _BH are filled with the composition 13 _BM for a joining material and cured to form a joining portion 13. .. As a result, the first surface 11 _F of the pattern substrate 11, the upper surface 12 _F of the frame body 12, and the upper surface 13 _F of the joint portion 13 can be made more flush with each other.

[Imprint method]
FIG. 11 is a process flow chart showing each step of the imprint method according to the embodiment of the present disclosure in a cross-sectional view. Here, an imprint method using the imprint template 1 shown in FIG. 1 will be described as an example.

<Preparation process>
First, the imprint template 1 shown in FIG. 1 and the base material 400 having the transfer surface 400 _F and the facing surface 400 _R facing the transfer surface 400 _F are prepared (see FIG. 11 (A)). The base material 400 includes, for example, a quartz glass base material, a soda glass base material, a calcium fluoride base material, a magnesium fluoride base material, an acrylic glass, or the like, and two or more base materials arbitrarily selected from these. Transparent base materials such as laminated base materials; metal base materials such as nickel base materials, titanium base materials and aluminum base materials; semiconductor base materials such as silicon base materials and gallium nitride base materials can be mentioned. The shape, size (size in plan view), and thickness of the base material 400 are not particularly limited, and are appropriately set according to the shape and size of the pattern structure formed by this imprint method. obtain.

<Resin supply process>
The imprint resin 500 is supplied to the transfer surface 400 _F of the base material 400 (see FIG. 11 (A)). As the imprint resin 500, a conventionally known ultraviolet curable resin or the like can be used. The supply amount of the imprint resin 500 is appropriately calculated and determined according to the residual film thickness of the pattern structure produced by the imprint method in the present embodiment, the volume of the uneven pattern _11P of the imprint template 1, and the like. obtain.

<Transfer process>
Subsequently, by contacting the uneven pattern 11 _P of the imprint template 1 with the imprint resin 500, the uneven pattern 11 _P of the imprint template 1 is transferred to the imprint resin 500 (see FIG. 11B). ..

<Curing process>
Next, the active energy rays (ultraviolet rays, etc.) L are irradiated from the bottom portion 12 _B side of the frame body 12 via the imprint template 1 to cure the imprint resin 500 (see FIG. 11 (C)).

<Base material removal process>
Finally, the cured imprint resin 500 and the imprint template 1 are separated from each other (see FIG. 11 (D)). As a result, a pattern structure _500'in which the uneven pattern 11P of the imprint template 1 is transferred can be formed on the surface to be transferred 400 _F of the base material 400.

As described above, the defect-free pattern structure 500'can be manufactured by performing the imprint process using the imprint template 1 according to the present embodiment.

The embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design ideas and equivalents belonging to the technical scope of the present invention.

FIG. 12 is a schematic view showing an embodiment in which a release layer is formed on the flat surface of the flat plate shown in FIG. 5, and an imprint template is formed on the release layer. The release layer 300 may be provided on the flat surface 100 _F of the flat plate 100 (see FIG. 12). The thickness of the release layer 300 is not particularly limited as long as the flatness of the flat surface 100 _F of the flat plate 100 is not impaired, and may be appropriately set in the range of 1 nm to 1 μm. Further, as a material constituting the release layer 300, for example, Optool DSX (manufactured by Daikin Industries, Ltd.) and the like can be mentioned.

The release layer 300 is not limited to the one provided on the entire surface of the flat surface 100 _F as shown in FIG. 12, and is, for example, in contact with the bonding material composition 13 _BM on the flat surface 100 _F. It may be provided in the area to be used. By providing the release layer 300 on the flat surface 100 _F , the imprint template 1 and the flat plate 100 can be easily separated from each other when the flat plate 100 is removed in FIG. 6C.

FIG. 13 is a modification of the process shown in FIG. 5 (B), and is a pattern substrate so as to expose the pattern region (concave and convex pattern 11 _P ) of the pattern substrate 11 from the hole portion 100 _H formed in the flat plate 100. It is a schematic diagram explaining the method of placing 11 on the flat surface 100 _F of a flat plate 100. Here, the region where the uneven pattern 11 _P having the plurality of convex portions 11 _PP protruding from the first surface 11 _F of the pattern substrate 11 is formed is referred to as the pattern region 11 _FP , and surrounds the outer periphery of the pattern region 11 _FP . The region where the pattern is not formed is defined as the non-pattern region 11 _FN . The flat plate 100 is formed with a hole portion 100 _H having a size that can physically include the pattern region 11 _FP and penetrating the flat plate 100 in the thickness direction (see FIG. 13A).

The pattern substrate 11 is placed on the flat surface 100 _F so that the pattern region 11 _FP is exposed from the hole 100 _H of the flat plate 100 and the non-pattern region 11 _FN is brought into contact with the flat surface 100 _F. It is placed (see FIG. 13 (B)). The pattern substrate 11 in which the uneven pattern 11 _P having the convex portion 11 _PP is formed on the flat surface 100 _F (see FIG. 5A) of the flat plate 100 in which the hole portion 100 _H is not formed is first. When the surface 11 _F is placed so as to face the flat surface 100 _F , the uneven pattern 11 _P (convex portion 11 _PP ) and the flat surface 100 _F come into contact with each other, so that the uneven pattern 11 _P (convex portion 11 P) is placed. 11 _PP ) may be damaged. According to this modification, when the pattern substrate 11 is placed on the flat plate 100 on which the hole portion 100 _H is formed so that the first surface 11 _F faces the flat surface 100 _F , the uneven pattern 11 _P The convex portion 11 _PP of the above can be released (retracted) to the hole portion 100 _H of the flat plate 100. As a result, the uneven pattern 11 _P (convex portion 11 _PP ) does not come into contact with the flat surface 100 _F , and the uneven pattern 11 _P (convex portion 11 _PP ) can be prevented from being damaged.

1 ... Imprint template 11 ... Pattern board 11 _P ... Concavo-convex pattern 12 ... Frame 12 _H ... Opening 12 _W ... Side wall 12 _WB ... Outer frame 12 _WP ... Partition frame 12 _B ... Bottom 12 _BH ... Through hole 13 ... Joint part 13 _BM ... Composition for joining material 100 ... Flat plate 100 _SH ... Suction hole 100 _H ... Hole part 11 _FP ... Pattern area 11 _FN ... Non-pattern area 11 _M , 100 _M ... Alignment mark

Claims (23)

It has a first surface, a second surface facing the first surface, and a continuous side surface between the outer edge of the first surface and the outer edge of the second surface, and an uneven pattern is formed on the first surface. Pattern board and
A frame including at least an opening capable of exposing the uneven pattern and a side wall portion surrounding the side surface so as to provide a first gap between the pattern substrate and the side surface thereof.
A joint portion for joining the pattern substrate and the frame body,
Equipped with
The frame further has a bottom facing the second surface of the pattern substrate.
The bottom portion of the frame body is provided with a continuous through hole in a first gap between the side surface portion of the pattern substrate and the side wall portion of the frame body.
The joint is located in the first gap and the through hole.
In a side view with the first surface of the pattern substrate facing upward, the first surface of the pattern substrate, the upper surface of the frame body, and the upper surface of the joint portion located in the first gap are substantially equal to each other. Imprint template that is flush with each other. It has a first surface, a second surface facing the first surface, and a continuous side surface between the outer edge of the first surface and the outer edge of the second surface, and an uneven pattern is formed on the first surface. Pattern board and
A frame including at least an opening capable of exposing the uneven pattern and a side wall portion surrounding the side surface so as to provide a first gap between the pattern substrate and the side surface thereof.
A joint portion located in the first gap between the side surface of the pattern substrate and the side wall portion of the frame body to join the pattern substrate and the frame body.
Equipped with
In a side view with the first surface of the pattern substrate facing upward, the first surface of the pattern substrate, the upper surface of the frame body, and the upper surface of the joint portion located in the first gap are substantially the same. Is flush with each other
The coefficients of thermal expansion of the pattern substrate and the frame are substantially the same .
Template for imprint . The frame further has a bottom facing the second surface of the pattern substrate.
The imprint template according to claim 2 , wherein the bottom of the frame is provided with a through hole continuous with the first gap. The bottom portion of the frame body faces the second surface of the pattern substrate so as to provide a second gap continuous with the first gap between the second surface of the pattern substrate and the second surface of the pattern substrate.
The through hole is continuous with the first gap through the second gap .
The joint is located in the first gap, the second gap and the through hole.
The imprint template according to claim 1 or 3 . The imprint template according to any one of claims 1 to 4 , wherein the thickness of the frame is larger than the thickness of the pattern substrate. The imprint template according to any one of claims 1 to 5 , wherein the surface of at least the portion of the side wall portion of the frame that abuts on the joint portion is roughened. The imprint template according to any one of claims 1 to 6, wherein the pattern substrate and the frame are made of glass. The imprint template according to any one of claims 1 to 7, wherein the joint is made of a cured resin. The side wall portion of the frame body includes an outer frame portion and a partition frame portion that is continuous with the outer frame portion and divides the inside of the outer frame portion into a plurality of regions.
The pattern substrate is arranged in each of the plurality of regions in the outer frame portion.
The first gap is a gap between the inner wall surface of the outer frame portion and the side wall surface of the partition frame portion and the side surface of the pattern substrate arranged in each of the plurality of regions, or the partition frame portion. The imprint template according to any one of claims 1 to 8, which is a gap between the side wall surface of the wall surface and the side surface of the pattern substrate arranged in each of the plurality of regions. A flat plate having a flat surface and a flat surface facing the flat surface, and a first surface, a second surface facing the first surface, an outer edge of the first surface, and an outer edge of the second surface. A pattern substrate having continuous side surfaces between them and having an uneven pattern formed on the first surface, a side wall portion capable of forming a first gap between the side surfaces of the pattern substrate, and the uneven pattern. The process of preparing a frame with an exposed opening and
The pattern substrate and the frame are placed on the flat surface so that the first surface of the pattern substrate faces the flat surface of the flat plate and the side surface of the pattern substrate is surrounded by the side wall portion. And the process of placing
Composition for a bonding material for joining the pattern substrate and the frame to the first gap existing between the side surface of the pattern substrate placed on the flat surface and the side wall portion of the frame. The process of filling things and
A step of forming a joint portion for joining the pattern substrate and the frame body by curing the composition for a joining material filled in the first gap.
A method for manufacturing an imprint template, comprising a step of forming the joint portion and then removing the flat plate. The frame has a bottomed tubular shape having the side wall portion, the opening portion, and the bottom portion, and is thicker than the thickness of the pattern substrate.
A through hole is formed in the bottom of the frame.
In a state where the frame is placed on the flat surface, the side surface of the pattern substrate and the side surface of the pattern substrate are provided through a second gap existing between the second surface of the pattern substrate and the bottom of the frame. The through hole communicates with the first gap existing between the side wall portions of the frame body.
The imprint according to claim 10, wherein in the step of filling the bonding material composition, the bonding material composition is filled in the first gap by injecting the bonding material composition through the through hole. How to make a template. The side wall portion of the frame body includes an outer frame portion and a partition frame portion that is continuous with the outer frame portion and divides the inside of the outer frame portion into a plurality of regions.
The method for manufacturing an imprint template according to claim 10, wherein the pattern substrate is arranged in each of the plurality of regions in the outer frame portion of the frame body. The method for manufacturing an imprint template according to any one of claims 10 to 12, wherein the surface of the portion of the side wall portion of the side wall portion of the frame that abuts on the joint portion is at least roughened. The method for manufacturing an imprint template according to any one of claims 10 to 13, wherein the pattern substrate and the frame are made of materials having substantially the same coefficient of thermal expansion from each other. The method for manufacturing an imprint template according to any one of claims 10 to 14, wherein the pattern substrate and the frame are made of glass. The method for producing an imprint template according to any one of claims 10 to 15, wherein the composition for a bonding material is a curable resin composition. The method for producing an imprint template according to claim 16, wherein the curable resin composition has a viscosity at 25 ° C. of 1 Pa · s to 5 Pa · s. The curable resin composition is an active energy ray curable resin composition.
The flat plate is made of a transparent material and is made of a transparent material.
16. 17. The method for manufacturing an imprint template according to 17. The method for producing an imprint template according to any one of claims 10 to 18, wherein a release layer is provided in a region of the flat plate in contact with the composition for a joining material on the flat surface. The flat plate has an opening at a position on the flat surface on which each of the pattern substrate and the frame is placed, and a suction hole is formed so as to penetrate in the thickness direction of the flat plate.
Claims 10 to 19 after placing the pattern substrate and the frame on the flat surface of the flat plate, and then vacuum-adsorbing the pattern substrate and the frame to the flat surface of the flat plate through the suction holes. The method for manufacturing an imprint template described in any of the above. Alignment marks are formed on each of the first surface of the pattern substrate and the flat surface of the flat plate.
The pattern substrate is formed on the flat surface by aligning the position of the alignment mark formed on the first surface of the pattern substrate with the position of the alignment mark formed on the flat surface of the flat plate. The method for manufacturing an imprint template according to any one of claims 10 to 20, which is placed above. The first surface of the pattern substrate includes a pattern region in which the uneven pattern is formed and a non-pattern region surrounding the outer periphery of the pattern region.
The flat plate has a hole having a size that can physically include the pattern region and penetrates in the thickness direction of the flat plate.
A claim that the pattern substrate is placed on the flat surface so that the pattern region is exposed from the hole portion of the flat plate and the non-pattern region is brought into contact with the flat surface. The method for manufacturing an imprint template according to any one of 10 to 21. The imprint template according to any one of claims 1 to 9 and a base material having a transfer surface are prepared, and the uneven pattern of the imprint template is transferred to the imprint resin on the transfer surface. Process and
An imprint method comprising a step of separating the imprint resin to which the uneven pattern is transferred and the imprint template.

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