JP7067907B2 - 固体撮像装置及び信号処理装置 - Google Patents

固体撮像装置及び信号処理装置 Download PDF

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Publication number
JP7067907B2
JP7067907B2 JP2017231686A JP2017231686A JP7067907B2 JP 7067907 B2 JP7067907 B2 JP 7067907B2 JP 2017231686 A JP2017231686 A JP 2017231686A JP 2017231686 A JP2017231686 A JP 2017231686A JP 7067907 B2 JP7067907 B2 JP 7067907B2
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signal
photoelectric conversion
conversion unit
phase difference
charge generated
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Japanese (ja)
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JP2019102967A (ja
JP2019102967A5 (https=
Inventor
理 小泉
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Canon Inc
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Canon Inc
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Priority to JP2017231686A priority Critical patent/JP7067907B2/ja
Priority to US16/199,926 priority patent/US10630929B2/en
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Publication of JP2019102967A5 publication Critical patent/JP2019102967A5/ja
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/703SSIS architectures incorporating pixels for producing signals other than image signals
    • H04N25/704Pixels specially adapted for focusing, e.g. phase difference pixel sets
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/778Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • H10F39/8063Microlenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/813Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Automatic Focus Adjustment (AREA)
  • Studio Devices (AREA)
  • Focusing (AREA)
JP2017231686A 2017-12-01 2017-12-01 固体撮像装置及び信号処理装置 Active JP7067907B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017231686A JP7067907B2 (ja) 2017-12-01 2017-12-01 固体撮像装置及び信号処理装置
US16/199,926 US10630929B2 (en) 2017-12-01 2018-11-26 Solid-state imaging device and signal processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017231686A JP7067907B2 (ja) 2017-12-01 2017-12-01 固体撮像装置及び信号処理装置

Publications (3)

Publication Number Publication Date
JP2019102967A JP2019102967A (ja) 2019-06-24
JP2019102967A5 JP2019102967A5 (https=) 2021-01-21
JP7067907B2 true JP7067907B2 (ja) 2022-05-16

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JP2017231686A Active JP7067907B2 (ja) 2017-12-01 2017-12-01 固体撮像装置及び信号処理装置

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US (1) US10630929B2 (https=)
JP (1) JP7067907B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI700824B (zh) * 2015-02-09 2020-08-01 日商索尼半導體解決方案公司 攝像元件及電子裝置
US11019294B2 (en) 2018-07-18 2021-05-25 Apple Inc. Seamless readout mode transitions in image sensors
US11563910B2 (en) 2020-08-04 2023-01-24 Apple Inc. Image capture devices having phase detection auto-focus pixels
EP4270934B1 (en) 2021-02-10 2026-04-01 Samsung Electronics Co., Ltd. Electronic device comprising image sensor and method of operating same
US11546532B1 (en) 2021-03-16 2023-01-03 Apple Inc. Dynamic correlated double sampling for noise rejection in image sensors
US12192644B2 (en) 2021-07-29 2025-01-07 Apple Inc. Pulse-width modulation pixel sensor
US12069384B2 (en) 2021-09-23 2024-08-20 Apple Inc. Image capture devices having phase detection auto-focus pixels

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014107835A (ja) 2012-11-29 2014-06-09 Canon Inc 撮像素子、撮像装置、および、撮像システム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6053750B2 (ja) 2012-02-28 2016-12-27 キヤノン株式会社 撮像装置、撮像システム、撮像装置の駆動方法
JP6239975B2 (ja) * 2013-12-27 2017-11-29 キヤノン株式会社 固体撮像装置及びそれを用いた撮像システム
JP2016131346A (ja) 2015-01-15 2016-07-21 キヤノン株式会社 制御装置、撮像装置、制御方法、プログラム、記憶媒体
JP6509018B2 (ja) 2015-04-17 2019-05-08 キヤノン株式会社 固体撮像装置、撮像システム及び信号処理方法
JP6650715B2 (ja) 2015-09-29 2020-02-19 キヤノン株式会社 撮像素子及びその制御方法、及び撮像装置
KR102524400B1 (ko) * 2016-07-04 2023-04-24 에스케이하이닉스 주식회사 하나의 컬러 필터 및 하나의 마이크로렌즈를 공유하는 다수 개의 포토다이오드들을 갖는 이미지 센서
JP6806494B2 (ja) 2016-08-24 2021-01-06 キヤノン株式会社 撮像装置、撮像システム、移動体及び撮像装置の駆動方法
JP6929114B2 (ja) 2017-04-24 2021-09-01 キヤノン株式会社 光電変換装置及び撮像システム
JP6904772B2 (ja) 2017-04-26 2021-07-21 キヤノン株式会社 固体撮像装置及びその駆動方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014107835A (ja) 2012-11-29 2014-06-09 Canon Inc 撮像素子、撮像装置、および、撮像システム

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JP2019102967A (ja) 2019-06-24
US10630929B2 (en) 2020-04-21
US20190174085A1 (en) 2019-06-06

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