JP7051502B2 - Vibration suppression method that suppresses vibration of cutting equipment - Google Patents

Description

The present invention relates to a vibration suppression method for suppressing vibration of a cutting device for cutting a plate-shaped workpiece such as a semiconductor wafer.

Conventionally, a cutting device (dicer) for cutting various plate-shaped workpieces such as a semiconductor wafer, a package substrate, a ceramics substrate, or a glass substrate with a cutting blade mounted on a spindle is known. Some cutting devices improve cutting efficiency by mounting cutting blades on two opposing spindles and performing dual cutting (simultaneous cutting of two axes) with those cutting blades (for example,). See Patent Document 1).

Japanese Patent No. 4975422

In a cutting device as described in Patent Document 1, when two spindles are rotating at the same time, vibration caused by the rotation of the two spindles may resonate and vibration with a large amplitude may be generated in the device. .. Then, when a large vibration exceeding the permissible value is generated in the cutting device, there is a problem that chipping or cracking, which is irregular fracture (hanging), occurs in the workpiece, which leads to product failure of the chip after division. ..

Therefore, when a plate-shaped workpiece is dual-cut with cutting blades arranged on each of the two spindles, a large vibration is generated in the cutting device due to the rotation of the two spindles, and the workpiece is chipped. There is a problem of preventing the situation where cracks and the like occur.

The present invention for solving the above problems is a cutting device for cutting a plate-like object in which a device is formed in a plurality of regions partitioned by a plurality of planned division lines in a grid pattern on the surface, and is a first spindle. And a first cutting means having a first cutting blade mounted on one end of the first spindle, and a second cutting blade mounted on the second spindle and one end of the second spindle. The rotation phase of the second cutting means having the above, the measuring means for measuring the vibration of the cutting device, and the first spindle of the first cutting means and the second spindle of the second cutting means. The plate shape held on a holding table using a cutting device provided with a control means for controlling and capable of suppressing vibration exceeding an allowable value due to the rotation phase of the first spindle and the second spindle. The first spindle and the second spindle when an object is cut by the first cutting blade that rotates with the first spindle and the second cutting blade that rotates with the second spindle. It is a vibration suppressing method for suppressing vibration caused by the rotation phase of the above, and the vibration measuring step of measuring the vibration of the cutting device during cutting by the measuring means and the measuring means exceeding the permissible value in the vibration measuring step. When the vibration is measured, the control means determines that the vibration caused by the rotation of the first spindle and the vibration caused by the rotation of the second spindle resonate, and the allowable value due to the resonance. The control means, which is determined to have generated vibration exceeding the above, controls the phase of the other spindle with reference to the phase of one of the first spindle and the second spindle, thereby controlling the first spindle. It is a vibration suppression method including a suppression control step for suppressing vibration exceeding a permissible value due to the rotation phase of the spindle and the second spindle.

The vibration suppression method according to the present invention, which is carried out when performing so-called dual cut using a cutting device, is a vibration measuring step for measuring the vibration of the cutting device during cutting by the measuring means, and the measuring means is permissible in the vibration measuring step. When the vibration exceeding the value is measured, the control means determines that the vibration caused by the rotation of the first spindle and the vibration caused by the rotation of the second spindle resonate, and the allowable value is determined by the resonance. The control means that determines that the vibration exceeding the vibration has occurred controls the phase of the other spindle with reference to the phase of one of the first spindle and the second spindle, thereby and the first spindle. Since it is equipped with a suppression control step that suppresses vibration (resonance) that exceeds the permissible value due to the rotation phase with the second spindle, chipping increases or cracks due to large vibration in the plate-shaped object to be cut. It is possible to prevent product defects such as.

It is a perspective view which shows an example of a cutting apparatus. It is explanatory drawing explaining the 1st cutting means, the 2nd cutting means, and the control means. FIG. 3A is a waveform graph showing the vibration of the first cutting means. FIG. 3B is a waveform graph showing the vibration of the second cutting means having the same phase as the vibration of the first cutting means. It is a waveform graph which shows the vibration amount exceeding the permissible value measured by the 1st measuring means and / and the 2nd measuring means at the time of resonance of a spindle. FIG. 5A is a waveform graph showing the vibration of the first cutting means. FIG. 5B is a waveform graph showing the vibration of the first cutting means and the vibration of the second cutting means having the opposite phase. It is a waveform graph which shows the vibration amount measured by the 1st measuring means and / and the 2nd measuring means after the suppression control step is performed.

The cutting device 1 shown in FIG. 1 according to the present invention may cut the plate-shaped object W held on the holding table 30 by a first cutting means 61 or a second cutting means 62 provided with a cutting blade for rotating the plate-shaped object W. It is a device that can be used.
The plate-shaped object W is, for example, a circular plate-shaped semiconductor wafer, and a device D is formed on the surface Wa of the plate-shaped object W in a grid-like region partitioned by a planned division line S. A tape T having a diameter larger than that of the plate-shaped object W is attached to the back surface Wb of the plate-shaped object W, and the outer peripheral portion of the adhesive surface of the tape-shaped object W is attached to an annular frame F having a circular opening. The plate-shaped object W is supported by the annular frame F via the tape T with the surface Wa exposed upward.

The holding table 30 arranged on the base 10 of the cutting device 1 and holding the plate-shaped object W has, for example, a suction portion 300 having a circular outer shape and made of a porous member that adsorbs the plate-shaped object W, and suction. A frame body 301 that supports the portion 300 is provided, and the plate-shaped object W is sucked and held on the holding surface 300a that is an exposed surface of the suction portion 300 and is flush with the frame body 301. Four fixed clamps 302 for fixing the annular frame F that supports the plate-shaped object W are evenly arranged around the frame body 301 in the circumferential direction. The holding table 30 can be rotated around the axis in the Z-axis direction by a rotating means (not shown) arranged below the holding table 30 while being surrounded by a cover 39.

Below the holding table 30, the cover 39, and the bellows cover 39a connected to the cover 39 (inside the base 10), a cutting feeding means 36 for moving the holding table 30 in the cutting feed direction (X-axis direction) is arranged. ing. The cutting feed means 36 includes a ball screw 360 having an axial center in the X-axis direction, a pair of guide rails 361 arranged in parallel with the ball screw 360, a motor 362 connected to the ball screw 360 to rotate the ball screw 360, and the inside. It is equipped with a movable plate (not shown) that is screwed into the ball screw 360 and moves on the guide rail 361. When the motor 362 rotates the ball screw 360, the movable plate (not shown) becomes the guide rail 361. Guided and reciprocated in the X-axis direction, the holding table 30 fixed on the movable plate moves in the X-axis direction. The bellows cover 39a expands and contracts in the X-axis direction as the holding table 30 moves.

A wafer cassette 20 for accommodating the plate-shaped object W is provided on the side of the moving path of the holding table 30. The wafer cassette 20 is installed on an elevating mechanism 21 that reciprocates in the Z-axis direction, and a plurality of plate-shaped objects W supported by the annular frame F are housed in the wafer cassette 20.
Further, a single-wafer cleaning means 22 for cleaning the machined plate-shaped object W is arranged beside the moving path of the holding table 30.

On the rear side of the base 10, a gantry column 14 is erected so as to straddle the movement path of the holding table 30. On the front surface of the portal column 14, for example, a first indexing feeding means 15 for reciprocating the first cutting means 61 in the Y-axis direction orthogonal to the X-axis direction and the Z-axis direction is arranged.

The first index feeding means 15 is connected to, for example, a ball screw 150 having an axial center in the Y-axis direction, a pair of guide rails 151 arranged in parallel with the ball screw 150, and one end of the ball screw 150 on the + Y direction side. It is provided with a motor (not shown) and a movable plate 153 whose internal nut is screwed into the ball screw 150 and whose side portion is in contact with the guide rail 151. Then, when a motor (not shown) rotates the ball screw 150, the movable plate 153 is guided by the guide rail 151 and moves in the Y-axis direction, and is moved onto the movable plate 153 via the first cutting feed means 17. The arranged first cutting means 61 is indexed and fed in the Y-axis direction.

The first notch feeding means 17 can move the first cutting means 61 in the Z-axis direction in the direction orthogonal to the holding surface 300a of the holding table 30, and has a ball screw 170 having an axial center in the Z-axis direction. A pair of guide rails 171 arranged in parallel with the ball screw 170, a motor 172 connected to the ball screw 170, and a first cutting means 61 are supported, and an internal nut is screwed into the ball screw 170 to form a side portion. It is provided with a support member 173 in contact with the guide rail 171.
When the motor 172 rotates the ball screw 170, the support member 173 is guided by the pair of guide rails 171 and moves in the Z-axis direction, and accordingly, the first cutting means 61 is cut and fed in the Z-axis direction. ..

As shown in FIG. 1, the cutting device 1 is composed of a storage element such as a CPU and a memory, and includes a control means 9 for controlling the entire device. The control means 9 is connected to the cutting feed means 36, the first cut feed means 17, and the like by wiring (not shown), and under the control of the control means 9, the X-axis of the holding table 30 by the cutting feed means 36. The cutting feed operation in the direction, the cut feed operation in the Z-axis direction of the first cutting means 61 by the first cut feed means 17, and the like are controlled.

The first cutting means 61 includes a first spindle 610 whose axial direction is the Y-axis direction, a first housing 611 fixed to the lower end side of the support member 173 and rotatably supporting the first spindle 610. A first motor 612 (see FIG. 2) that rotates the first spindle 610 and a first cutting blade 613 mounted on the tip of the first spindle 610 are provided, and the first motor 612 is the first. The first cutting blade 613 rotates as the spindle 610 of 1 is rotationally driven.

As shown in FIG. 2, a first motor driver 65 that supplies drive power to the first motor 612 and controls the first motor 612 is electrically connected to the first motor 612. The first motor driver 65 is configured to include a well-known diode, capacitor, or the like, converts an operation signal (pulse signal) supplied from the control means 9 into a current, and supplies the operation signal (pulse signal) to the first motor 612 to drive the first motor driver 65.

As shown in FIG. 2, the first cutting blade 613 includes, for example, a base metal (hub) 613b made of aluminum and a cutting edge 613a formed so as to project radially outward from the base metal 613b. Although it is a hub blade, it may be a washer-type cutting blade whose outer shape is composed only of an annular cutting blade.
The first cutting blade 613 is sandwiched from both sides in the Y-axis direction by the mount flange 614 and the fixing flange 615, and is fixed to one end (tip) of the first spindle 610.

As shown in FIG. 1, in the vicinity of the first cutting means 61, an alignment means 23 for detecting the planned division line S of the plate-shaped object W held on the holding table 30 to be cut is arranged. .. The alignment means 23 can perform image processing such as pattern matching based on the image captured by the camera 230 and detect the coordinate position of the scheduled division line S. The alignment means 23 and the first cutting means 61 are integrally configured, and both move in the Y-axis direction and the Z-axis direction in conjunction with each other.

On the front surface of the gantry column 14 shown in FIG. 1, for example, a second indexing feeding means 16 for reciprocating the second cutting means 62 in the Y-axis direction is arranged.
The second indexing feeding means 16 includes a ball screw 160 having an axial center in the Y-axis direction, a pair of guide rails 151 arranged in parallel with the ball screw 160, a motor 162 connected to the ball screw 160, and an internal nut. The ball screw 160 is screwed into the ball screw 160, and the side portion is provided with a movable plate 163 in contact with the guide rail 161. Then, when the motor 162 rotates the ball screw 160, the movable plate 163 is guided by the guide rail 151 and moves in the Y-axis direction, and is arranged on the movable plate 163 via the second cutting feed means 18. The provided second cutting means 62 is indexed and fed in the Y-axis direction.

The second notch feeding means 18 includes a ball screw 180 having an axial center in the Z-axis direction, a pair of guide rails 181 arranged in parallel with the ball screw 180, a motor 182 connected to the ball screw 180, and a second. A support member 183 that supports the cutting means 62, has an internal nut screwed onto the ball screw 180, and has a side portion in contact with the guide rail 181 is provided. Then, when the motor 182 rotates the ball screw 180, the support member 183 is guided by the pair of guide rails 181 and moves in the Z-axis direction, and accordingly, the second cutting means 62 moves in the Z-axis direction. ..

The second cutting means 62 is arranged so as to face the first cutting means 61 in the Y-axis direction. As shown in FIG. 2, the second cutting means 62 is fixed to the lower end side of the second spindle 620 whose axial direction is the Y-axis direction and the support member 183 shown in FIG. 1 and rotates the second spindle 620. It comprises a second housing 621 that is capable of supporting it, a second motor 622 that rotates the second spindle 620, and a second cutting blade 623 mounted on the tip of the second spindle 620. The second cutting blade 623 rotates as the second motor 622 rotationally drives the second spindle 620.

A second motor driver 66 that supplies drive power to the second motor 622 and controls the second motor 622 is electrically connected to the second motor 622. The second motor driver 66 is configured to include a well-known diode, capacitor, or the like, and converts an operating signal (pulse signal) supplied from the control means 9 into a current and supplies the second motor driver 66 to the second motor 622 for driving.

As shown in FIG. 2, the second cutting blade 623 includes, for example, a base metal (hub) 623b made of aluminum and a cutting edge 623a formed so as to project radially outward from the base metal (hub) 623b. It is a hub blade. The second cutting blade 623 is sandwiched from both sides in the Y-axis direction by the mount flange 624 and the fixing flange 625, and is fixed to one end (tip) of the second spindle 620.

The cutting device 1 is a measuring means for measuring the vibration of the cutting device 1 (vibration that can be generated by the rotation of each spindle of each cutting means 61, 62), that is, the first measuring means 81 and the first measuring means 81 shown in FIG. The measuring means 82 of 2 is provided. The first measuring means 81 is fixed to, for example, the first housing 611 of the first cutting means 61, and the second measuring means 82 is, for example, the second of the second cutting means 62. It is fixed to the housing 621. The location of the first measuring means 81 and the second measuring means 82 is not limited to this embodiment.

The first measuring means 81 (second measuring means 82) is, for example, a 3-axis type accelerometer capable of measuring vibration in the X-axis Y-axis Z-axis direction with one device, and is an X-axis Y-axis Z-axis direction. That is, each vibration of the first cutting means 61 (second cutting means 62) in the X-axis, Y-axis, and Z-axis directions is measured, and the combined vibration is measured. Then, the first measuring means 81 and the second measuring means 82 give the control means 9 each measurement information (combination of each vibration in the X-axis, Y-axis, and Z-axis directions) via a wireless or wired communication path (not shown). Vibration) can be transmitted.
The first measuring means 81 and the second measuring means 82 are not limited to the acceleration sensor as long as they are sensors that detect vibration, and may be, for example, a gyro sensor (angular velocity sensor). Further, the cutting device 1 may be configured to include only one of the first measuring means 81 and the second measuring means 82.

The operation of the cutting device 1 when the plate-shaped object W shown in FIG. 1 is cut by the cutting device 1 will be described below.
First, the plate-shaped object W is placed on the holding surface 300a of the holding table 30 so that the surface Wa is on the upper side. Then, the suction force generated by the suction source (not shown) is transmitted to the holding surface 300a, so that the holding table 30 sucks and holds the plate-shaped object W on the holding surface 300a. Further, the annular frame F is sandwiched and fixed by the fixed clamp 302.

After the plate-shaped object W is held by the holding table 30, the cutting feed means 36 shown in FIG. 1 feeds the plate-shaped object W held by the holding table 30 in the −X direction, and the plate-shaped object W by the camera 230 Imaging is performed. Based on the captured image of the surface Wa of the plate-shaped object W, the alignment means 23 executes image processing such as pattern matching, and the scheduled division line S and the second cutting to cut the first cutting blade 613. The coordinate position of the scheduled division line S to cut the blade 623 is detected. As the coordinate position of each scheduled division line S is detected, the first cutting means 61 is moved in the Y-axis direction by the first indexing feed means 15, and the scheduled division line S to be cut and the first Alignment with the cutting blade 613 in the Y-axis direction is performed. Further, the second cutting means 62 is moved in the Y-axis direction by the second indexing feed means 16, and the planned division line S to be cut and the second cutting blade 623 are aligned in the Y-axis direction.

After the above alignment is performed, the holding table 30 for holding the plate-shaped object W is further fed in the −X direction at a predetermined cutting feed rate. Further, the first cutting feeding means 17 lowers the first cutting means 61 in the −Z direction, and for example, the first cutting blade 613 cuts through the back surface Wb of the plate-shaped object W and reaches the tape T. The first cutting means 61 is positioned at the height position of. The second cutting feeding means 18 lowers the second cutting means 62 in the −Z direction, for example, a predetermined height at which the second cutting blade 623 cuts through the back surface Wb of the plate-shaped object W and reaches the tape T. The second cutting means 62 is positioned at the position.

The first motor 612 rotates the first spindle 610 at a high speed (for example, about 30,000 rpm), and the first cutting blade 613 fixed to the first spindle 610 rotates at a high speed accordingly to form a plate. A cut is made in W (for example, a down cut), and the scheduled division line S is cut. Further, the second motor 622 rotates the second spindle 620 at a high speed (for example, about 30,000 rpm), and the second cutting blade 623 fixed to the second spindle 620 rotates at a high speed along with the plate. A cut (for example, downcut) is made in the shape W, and the scheduled division line S is cut. Further, cutting water is sprayed from each cutting water nozzle to the contact portion between each cutting blade and the plate-shaped object W and its surroundings to cool and clean the contact portion (machining point).

When the plate-like object W advances in the −X direction to a predetermined position in the X-axis direction where the first cutting blade 613 and the second cutting blade 623 finish cutting each scheduled division line S, the plate-like object is formed by the cutting feed means 36. The cutting feed of the object W is stopped once, the first cutting feed means 17 separates the first cutting blade 613 from the plate-shaped object W, and the second cutting feed means 18 makes the second cutting blade 623 plate-shaped. It is separated from the object W, and then the cutting feed means 36 feeds the holding table 30 in the + X direction and returns it to its original position. Then, by sequentially performing the same cutting while indexing and feeding the first cutting means 61 and the second cutting means 62 at intervals of the adjacent division scheduled lines S in the Y-axis direction, all the division schedules in the same direction are scheduled. Cut the line S.

Further, when the holding table 30 is rotated 90 degrees and then the same cutting is performed, all the scheduled division lines S are fully cut vertically and horizontally, and the plate-shaped object W is divided into individual chips including the device D.

Using the cutting device 1 as described above, the plate-shaped object W held by the holding table 30 is rotated with the first spindle 610, the first cutting blade 613, and the second cutting blade, which is rotated with the second spindle 620. When cutting (dual cutting) with the 623, vibrations caused by the rotation of the first spindle 610 and the second spindle 620 may resonate and a large amplitude vibration may be generated in the cutting device 1. Therefore, the vibration suppressing method according to the present invention is carried out during the cutting process to prevent a situation in which the large vibration is generated and the plate-shaped object W is chipped or cracked.
Hereinafter, each step of the vibration suppression method according to the present invention will be described.

(1) Vibration measurement step When the dual cut is started, the first measuring means 81 (see FIG. 2) starts measuring the vibration of the first cutting means 61, which is the device vibration, and the second measuring means 82. Begins to measure the vibration of the second cutting means 62, which is the device vibration. That is, for example, in the first measuring means 81 configured by the acceleration sensor in the present embodiment, when the rotation of the first spindle 610 is started, the rotational vibration of the first spindle 610 acts on the first measurement means 81. The magnitude of the acceleration in the X-axis, Y-axis, and Z-axis directions of the housing 611 is measured, and integration is performed twice while removing information unrelated to the rotational vibration of the first spindle 610 with a filter, and the first cutting means 61. Measure the vibration amount (maximum amplitude) of. Then, the first measuring means 81 sequentially transmits the measurement information to the control means 9. Similarly, the second measuring means 82 measures the vibration amount of the second cutting means 62, and sequentially transmits the measured information to the control means 9.

For example, at the beginning of the dual cut, the first spindle 610 and the second spindle 620 are rotationally driven with a predetermined amount of phase difference under the control of the control means 9. Therefore, the vibration caused by the rotation of the first spindle 610 and the vibration caused by the rotation of the second spindle 620 do not resonate, and the vibration measured by the first measuring means 81 and the second measuring means 82 The vibration to be measured is equal to or less than the allowable value preset in the memory of the control means 9.

(2) Judgment step However, when dual cutting is continuously performed on, for example, a plurality of plate-shaped objects W, the phase of the second spindle 620 (or the first spindle 610) is preset. It may deviate from each phase. This is because, for example, the phase of the motor current of the second motor 622 is delayed by the stator coil inside the motor, causing a phase shift from the electromotive voltage, or the heat is stored in the second motor 622 that rotates at high speed. It can happen due to factors.

As a result, a predetermined amount of phase difference preset between the first spindle 610 and the second spindle 620 is filled, and the first spindle 610 and the second spindle 620 are in phase or It will be driven to rotate with almost no phase difference. That is, as shown in FIGS. 3A and 3B, the waveform graph G1 showing the vibration amount of the first cutting means 61 and the waveform graph G2 showing the vibration amount of the second cutting means 62 have a period. There is no deviation and the phase is the same.

When the first spindle 610 and the second spindle 620 are in phase with each other, in the vibration measuring step, the first measuring means 81 and / and the second measuring means 82 vibrate exceeding the allowable value (one point in FIG. 4). The waveform graph G3) shown by the chain line is measured, and the measurement information is transmitted to the control means 9. Then, the control means 9 resonates with the vibration caused by the rotation of the first spindle 610 and the vibration caused by the rotation of the second spindle 620, so that the vibration exceeds the permissible value (for example, the vibration before the resonance occurs. It is determined that vibration of twice the magnitude of the vibration measured by the measuring means 81 and / or the second measuring means 82 of 1) has occurred.

(3) Suppression control step Next, the control means for determining that the vibration exceeding the permissible value is generated due to the resonance between the vibration caused by the rotation of the first spindle 610 and the vibration caused by the rotation of the second spindle 620. 9 controls the phase of the other spindle with reference to the phase of either the spindle of the first spindle 610 or the second spindle 620. That is, in the present embodiment, for example, the control means 9 shown in FIG. 2 is used to control the phase of the second spindle 620 to be in the opposite phase (synchronous control) with the phase of the first spindle 610 as a reference. The pulse signal is delayed by a predetermined time and input to the second motor driver 66. Since the second motor driver 66 drives the second motor 622 by passing a current in synchronization with the pulse signal input with a delay, the phase of the second spindle 620 rotated by the second motor 622 is changed. For example, it is shifted by 180 degrees. As a result, the second spindle 620 rotates in a phase opposite to that of the first spindle 610 by a half wavelength.
The spindle phase control by the control means 9 is not limited to the above example.

That is, by performing the above control by the control means 9, as shown in FIGS. 5A and 5B, the waveform graph G1 showing the vibration amount of the first cutting means 61 and the second cutting means 62 The waveform graph G4 (graph with a half wavelength deviation from the graph G1) showing the vibration amount of the above has the opposite phase. As a result, the device vibration measured by the first measuring means 81 and / and the second measuring means 82 becomes 0 or a very small value as shown in the graph G5 shown by the alternate long and short dash line in FIG. Therefore, the vibration caused by the rotation of the first spindle 610 and the second spindle 620 does not cause resonance and is suppressed to 0 or a very small value.

As described above, the cutting device 1 according to the present invention has a first cutting means 61 having a first spindle 610 and a first cutting blade 613 mounted on one end of the first spindle 610, and a first cutting means 61. A second cutting means 62 having a second spindle 620 and a second cutting blade 623 mounted on one end of the second spindle 620, and a first measuring means 81 and a first measuring means 81 for measuring the vibration of the cutting device 1. The measuring means 82 of 2 and the control means 9 for controlling the rotation phase of the first spindle 610 of the first cutting means 61 and the second spindle 620 of the second cutting means 62 are provided. During the so-called dual cut, when the rotation phases of the two spindles 610 and 620 become the same, resonance occurs and the cutting device 1 vibrates with vibration exceeding the permissible value, it is provided in the device 1. The first measuring means 81 and the second measuring means 82 (acceleration sensor) are used to detect and measure device vibration exceeding the permissible value, and the control means 9 is used to detect and measure the spindle (second spindle 620 in the present embodiment). The phase of rotation can be shifted. Then, by shifting the rotation phase (for example, making the phase opposite), the vibration caused by the rotation of each spindle is changed to the vibration in opposite directions (in the present embodiment, the vibration cycle of the spindle is 180 degrees. It prevents the occurrence of resonance (by shifting), and suppresses the occurrence of product defects such as increased chipping and cracking in the plate-shaped object W to be cut.

In the vibration suppression method according to the present invention, which is carried out when the so-called dual cut is performed using the cutting device 1, the vibration of the cutting device 1 during cutting is measured by the first measuring means 81 and the second measuring means 82. When the first measuring means 81 and / and the second measuring means 82 measure the vibration exceeding the permissible value in the vibration measuring step and the vibration measuring step, the control means 9 is caused by the rotation of the first spindle 610. The first spindle 610 or the first spindle 610 or the first spindle 610 or the control means 9 determines that the vibration to be generated and the vibration caused by the rotation of the second spindle 620 resonate with each other and the control means 9 determines that the vibration exceeding the permissible value is generated due to the resonance. By controlling the phase of the other spindle (second spindle 620 in this embodiment) with reference to the phase of one of the two spindles 620, the first spindle 610 and the second spindle Since it is equipped with a suppression control step that suppresses vibration (resonance) that exceeds the permissible value due to the rotation phase with 620, products such as increased chipping and cracking due to large vibration in the plate-shaped object W to be cut are provided. It is possible to prevent defects from occurring.

The vibration suppression method according to the present invention is not limited to the above embodiment, and the configuration of the cutting device 1 shown in the attached drawings is not limited to this, and the effect of the present invention can be achieved. It can be changed as appropriate within the range that can be exhibited.

W: Plate-shaped material Wa: Surface of plate-shaped material Wb: Back surface of plate-shaped material S: Scheduled division line D: Device T: Tape F: Circular frame 1: Cutting device 10: Base 14: Portal column 20: Wafer Cassette 21: Elevating mechanism 22: Cleaning means 30: Holding table 300: Suction part 300a: Holding surface 301: Frame body 302: Fixed clamp 39: Cover 39a: Bellows cover 36: Cutting feed means 360: Ball screw 361: Guide rail 362: motor
15: First index feeding means 150: Ball screw 151: Pair of guide rails 153: Movable plate 17: First notch feeding means 170: Ball screw 171: Pair of guide rails 172: Motor 173: Support member 61: First Cutting means 610: First spindle 611: First housing 613: First cutting blade 614: Mount flange 615: Fixed flange 23: Alignment means 230: Camera 16: Second indexing feeding means 160: Ball screw 162: Motor 163: Movable plate 18: Second notch feeding means 180: Ball screw 181: Pair of guide rails 182: Motor 183: Support member 62: Second cutting means 620: Second spindle 621: Second housing 623: Second 2 cutting blade 624: mount flange 625: fixed flange 9: control means 65: first motor driver 66: second motor driver 81: first measuring means 82: second measuring means

Claims (1)

A cutting device that cuts a plate-like object in which a device is formed in a plurality of areas partitioned by a plurality of scheduled division lines in a grid pattern on the surface.
A first cutting means having a first spindle and a first cutting blade mounted on one end of the first spindle.
A second cutting means having a second spindle and a second cutting blade mounted on one end of the second spindle.
A measuring means for measuring the vibration of a cutting device,
Using a cutting device provided with a control means for controlling the rotational phase of the first spindle of the first cutting means and the second spindle of the second cutting means.
The first cutting blade when the plate-shaped object held by the holding table is cut by the first cutting blade rotating with the first spindle and the second cutting blade rotating with the second spindle. It is a vibration suppression method that suppresses vibration caused by the rotation phase of the spindle and the second spindle.
A vibration measurement step for measuring the vibration of a cutting device during cutting by the measuring means, and
When the measuring means measures the vibration exceeding the permissible value in the vibration measuring step, the vibration caused by the rotation of the first spindle and the vibration caused by the rotation of the second spindle resonate with the control means. Judgment steps to judge that it was done,
The control means that determines that vibration exceeding the permissible value is generated due to the resonance controls the phase of the other spindle with reference to the phase of either the first spindle or the second spindle. A vibration suppression method comprising a suppression control step for suppressing vibration exceeding an allowable value due to the rotation phase of the first spindle and the second spindle.

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