JP7048600B2 - キャッピングmemsデバイス用の垂直ストッパー - Google Patents
キャッピングmemsデバイス用の垂直ストッパー Download PDFInfo
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- JP7048600B2 JP7048600B2 JP2019524369A JP2019524369A JP7048600B2 JP 7048600 B2 JP7048600 B2 JP 7048600B2 JP 2019524369 A JP2019524369 A JP 2019524369A JP 2019524369 A JP2019524369 A JP 2019524369A JP 7048600 B2 JP7048600 B2 JP 7048600B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
- B81B3/0013—Structures dimensioned for mechanical prevention of stiction, e.g. spring with increased stiffness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0059—Constitution or structural means for controlling the movement not provided for in groups B81B3/0037 - B81B3/0056
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
- B81C1/0096—For avoiding stiction when the device is in use, i.e. after manufacture has been completed
- B81C1/00976—Control methods for avoiding stiction, e.g. controlling the bias voltage
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/097—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/025—Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/11—Treatments for avoiding stiction of elastic or moving parts of MEMS
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0109—Bonding an individual cap on the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
- G01P2015/0871—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system using stopper structures for limiting the travel of the seismic mass
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Micromachines (AREA)
- Gyroscopes (AREA)
- Pressure Sensors (AREA)
Description
本出願は、2016年11月11日に代理人整理番号G0766.70133US00の下で出願された「Vertical Stopper For Capping MEMS Devices」と題する米国仮特許出願第62/420,893号の利益を、米国特許法第119条(e)の下で主張し、その全体が本明細書に参照として組み込まれる。
102 ストッパー
104 くぼみ
106 可動プルーフマス
108 モード形状
110 ばね
112 MEMS基材
114 接合材
116 可動プルーフマス駆動方向
124 キャップ
128 可動プルーフマスの表面
130 ストッパーの表面
600 システム
602 MEMSデバイス
604 電源ユニット
606 感知回路
608 入出力(I/O)インターフェイス
700 自動車
Claims (18)
- 第1の可動プルーフマスと、前記第1の可動プルーフマスと同じ平面の面内を動くように構成された第2の可動プルーフマスとを有し、ストッパーを含むキャップに密封された微小電気機械システム(MEMS)デバイスの動作方法であって、
モード形状を有する第1の面内のモードで、前記第1の可動プルーフマスと前記第2の可動プルーフマスとを振動させることと、
前記ストッパーを使用して前記第1の可動プルーフマスの前記第1の面内のモードの動きを減衰させることと
を含み、
前記第1の可動プルーフマスが、前記第2の可動プルーフマスの内側エッジに隣接した外側エッジを有し、前記ストッパーが、前記第1の可動プルーフマスの前記外側エッジおよび前記第2の可動プルーフマスの前記内側エッジの上に重なっており、前記ストッパーの外辺部は、前記第2の可動プルーフマスの前記内側エッジと前記第2の可動プルーフマスの外側エッジとの間に位置する、
方法。 - 前記ストッパーが、前記第1の可動プルーフマスの面積の50%を超える面積を有する、請求項1に記載の方法。
- 前記第1の可動プルーフマスの前記動きを減衰させることが、前記第2の可動プルーフマスの面内の動きを減衰させることを含まない、請求項1に記載の方法。
- 前記第2の可動プルーフマスが、前記第1の可動プルーフマスと同心であり、かつその外側にある、請求項1に記載の方法。
- 前記第2の可動プルーフマスを、前記第1の可動プルーフマスと同一面内で、かつ前記第1の可動プルーフマスの振動と直交して動かすことを更に含む、請求項1に記載の方法。
- 前記ストッパーが、前記第1の可動プルーフマスと隣接した不連続な表面を有する、請求項1に記載の方法。
- 第1の可動プルーフマスと、前記第1の可動プルーフマスと同じ平面の面内を動くように構成された第2の可動プルーフマスとを有し、キャップ付き微小電気機械システム(MEMS)デバイスの減衰された動きを与える方法であって、
基材にばねで連結された前記第1の可動プルーフマス及び前記第2の可動プルーフマスを、前記基材に連結されたキャップのストッパーと平行に、かつその20マイクロメートル以内の運動平面内でモード形状にわたって振動させること
を含み、
前記第1の可動プルーフマスが、前記第2の可動プルーフマスの内側エッジに隣接した外側エッジを有し、前記ストッパーが、前記第1の可動プルーフマスの前記外側エッジおよび前記第2の可動プルーフマスの前記内側エッジの上に重なっており、前記ストッパーの外辺部は、前記第2の可動プルーフマスの前記内側エッジと前記第2の可動プルーフマスの外側エッジとの間に位置する、
方法。 - 前記第2の可動プルーフマスを、前記第1の可動プルーフマスと同一面内で、かつ前記第1の可動プルーフマスと直交して動かすことを更に含む、請求項7に記載の方法。
- 前記第2の可動プルーフマスが、前記ストッパーの下に重ならない周辺部を有する、請求項8に記載の方法。
- 前記第2の可動プルーフマスを、前記第1の可動プルーフマスと同一面内で、かつ前記第1の可動プルーフマスと直交して動かすことが、前記MEMSデバイスの回転に応じてなされる、請求項8に記載の方法。
- MEMSデバイスであって、
第1の可動プルーフマスと、
前記第1の可動プルーフマスと同じ平面の面内を動くように構成された第2の可動プルーフマスと、
前記第1の可動プルーフマス及び前記第2の可動プルーフマスをカバーするキャップと、
を含み、
前記キャップが、前記第1の可動プルーフマスの50%を超えて上に重なるストッパーを含み、
前記第1の可動プルーフマスが、前記第2の可動プルーフマスの内側の境界に隣接した外側の境界を有し、
前記ストッパーが、前記第1の可動プルーフマスの前記外側の境界および前記第2の可動プルーフマスの前記内側の境界の上に重なっており、
前記ストッパーの外辺部は、前記第2の可動プルーフマスの前記内側の境界と前記第2の可動プルーフマスの外側の境界との間に位置する、
MEMSデバイス。 - 前記ストッパーが前記第2の可動プルーフマスをカバーしない、請求項11に記載のMEMSデバイス。
- 前記第1および第2の可動プルーフマスを互いに接続する要素を更に含む、請求項12に記載のMEMSデバイス。
- 前記第2の可動プルーフマスが、前記第1の可動プルーフマスと同心であり、かつその外側にある、請求項13に記載のMEMSデバイス。
- 前記ストッパーが、前記第1の可動プルーフマスと隣接し、かつ前記第1の可動プルーフマスと実質的に平行である面を有し、前記ストッパーの面が、前記第1の可動プルーフマスに対応するモード形状の75%~125%の表面積を有する、請求項11に記載のMEMSデバイス。
- 前記ストッパーが、前記第1の可動プルーフマスと隣接し、かつ前記第1の可動プルーフマスと実質的に平行である面を有し、前記面が不連続である、請求項11に記載のMEMSデバイス。
- 第3の可動プルーフマスを更に含み、前記ストッパーが、前記第3の可動プルーフマスの50%を超えてカバーしている、請求項11に記載のMEMSデバイス。
- 第4および第5の可動プルーフマスを更に含み、前記ストッパーが、前記第4および第5の可動プルーフマスの各々の50%を超えてカバーしている、請求項17に記載のデバイス。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662420893P | 2016-11-11 | 2016-11-11 | |
US62/420,893 | 2016-11-11 | ||
US15/650,822 | 2017-07-14 | ||
US15/650,822 US10239746B2 (en) | 2016-11-11 | 2017-07-14 | Vertical stopper for capping MEMS devices |
PCT/US2017/061001 WO2018089733A1 (en) | 2016-11-11 | 2017-11-10 | Vertical stopper for capping mems devices |
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JP2020513332A JP2020513332A (ja) | 2020-05-14 |
JP7048600B2 true JP7048600B2 (ja) | 2022-04-05 |
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US (2) | US10239746B2 (ja) |
EP (1) | EP3538480A4 (ja) |
JP (1) | JP7048600B2 (ja) |
CN (1) | CN110023233B (ja) |
WO (1) | WO2018089733A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7083428B2 (ja) | 2018-11-15 | 2022-06-10 | ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | マイクロエレクトロメカニカルセンサを製造する方法およびマイクロエレクトロメカニカルセンサ |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10239746B2 (en) | 2016-11-11 | 2019-03-26 | Analog Devices, Inc. | Vertical stopper for capping MEMS devices |
US10800649B2 (en) | 2016-11-28 | 2020-10-13 | Analog Devices International Unlimited Company | Planar processing of suspended microelectromechanical systems (MEMS) devices |
US10732199B2 (en) * | 2017-12-20 | 2020-08-04 | Apple Inc. | Multi-stage MEMS accelerometer for mixed g-level operation |
US10843920B2 (en) | 2019-03-08 | 2020-11-24 | Analog Devices International Unlimited Company | Suspended microelectromechanical system (MEMS) devices |
DE102020205616A1 (de) | 2020-05-04 | 2021-11-04 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikromechanische Sensoranordnung, Verfahren zur Verwendung einer mikromechanischen Sensoranordnung |
EP4162282A1 (en) | 2020-06-08 | 2023-04-12 | Analog Devices, Inc. | Drive and sense stress relief apparatus |
CN115812153A (zh) | 2020-06-08 | 2023-03-17 | 美国亚德诺半导体公司 | 应力释放mems陀螺仪 |
US11698257B2 (en) | 2020-08-24 | 2023-07-11 | Analog Devices, Inc. | Isotropic attenuated motion gyroscope |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008292451A (ja) | 2007-01-19 | 2008-12-04 | Stmicroelectronics Srl | 酸素吸収剤及び耐膨潤性、耐剥離性及び表面平滑性に優れた脱酸素性容器 |
JP2010060336A (ja) | 2008-09-02 | 2010-03-18 | Dainippon Printing Co Ltd | 一軸半導体加速度センサ |
US20100089153A1 (en) | 2008-10-13 | 2010-04-15 | Hewlett-Packard Development Company, L.P. | Adjusting the Damping Level of an Encapsulated Device |
JP2011247812A (ja) | 2010-05-28 | 2011-12-08 | Seiko Epson Corp | 物理量センサーおよび電子機器 |
JP2013501941A (ja) | 2009-08-13 | 2013-01-17 | メギット (サン ファン キャピストラーノ) インコーポレイテッド | 高g範囲加速度センサにおける最大化された双方向の対称的な減衰のためのプルーフマス |
US20130020693A1 (en) | 2011-07-19 | 2013-01-24 | Xintec Inc. | Chip package structure and method for forming the same |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2831195B2 (ja) | 1992-03-25 | 1998-12-02 | 富士電機株式会社 | 半導体加速度センサ |
US5415726A (en) | 1993-12-21 | 1995-05-16 | Delco Electronics Corporation | Method of making a bridge-supported accelerometer structure |
JPH11237402A (ja) | 1998-02-19 | 1999-08-31 | Akebono Brake Ind Co Ltd | 半導体加速度センサ及びその自己診断法 |
WO2006046194A1 (en) * | 2004-10-27 | 2006-05-04 | Koninklijke Philips Electronics N. V. | Reduction of air damping in mems device |
DE602006005698D1 (de) * | 2005-10-14 | 2009-04-23 | Nxp Bv | Abstimmbare mems-anordnung |
KR100868759B1 (ko) | 2007-01-25 | 2008-11-17 | 삼성전기주식회사 | 멤스 디바이스 및 이의 제조방법 |
US8939029B2 (en) | 2008-09-05 | 2015-01-27 | Analog Devices, Inc. | MEMS sensor with movable Z-axis sensing element |
DE102008042366A1 (de) | 2008-09-25 | 2010-04-01 | Robert Bosch Gmbh | Sensor und Verfahren zur Herstellung eines Sensors |
JP2011128140A (ja) * | 2009-11-19 | 2011-06-30 | Dainippon Printing Co Ltd | センサデバイス及びその製造方法 |
KR101295670B1 (ko) * | 2009-12-11 | 2013-08-14 | 한국전자통신연구원 | 압전 발전기 |
JP5842467B2 (ja) | 2010-11-16 | 2016-01-13 | 株式会社リコー | アクチュエータ装置、このアクチュエータ装置用の保護カバー、このアクチュエータの製造方法、このアクチュエータ装置を用いた光偏向装置、二次元光走査装置及びこれを用いた画像投影装置 |
US8839670B2 (en) * | 2010-11-24 | 2014-09-23 | Invensense, Inc. | Anchor-tilt cancelling accelerometer |
TWI415786B (zh) * | 2010-12-30 | 2013-11-21 | Pixart Imaging Inc | 微機電系統元件以及用於其中之防止變形結構及其製作方法 |
WO2012153335A1 (en) * | 2011-05-09 | 2012-11-15 | Ramot At Tel-Aviv University Ltd. | Bistable force and/or acceleration sensor |
KR20130054473A (ko) | 2011-09-29 | 2013-05-27 | 삼성전기주식회사 | 관성센서 |
KR101321270B1 (ko) | 2011-10-28 | 2013-11-04 | 삼성전기주식회사 | 관성센서 |
US9134337B2 (en) | 2012-12-17 | 2015-09-15 | Maxim Integrated Products, Inc. | Microelectromechanical z-axis out-of-plane stopper |
US10913653B2 (en) | 2013-03-07 | 2021-02-09 | MCube Inc. | Method of fabricating MEMS devices using plasma etching and device therefor |
US9556017B2 (en) * | 2013-06-25 | 2017-01-31 | Analog Devices, Inc. | Apparatus and method for preventing stiction of MEMS devices encapsulated by active circuitry |
US9136822B2 (en) | 2013-08-19 | 2015-09-15 | Harris Corporation | Microelectromechanical system with a micro-scale spring suspension system and methods for making the same |
FI126598B (en) | 2014-02-26 | 2017-03-15 | Murata Manufacturing Co | Microelectromechanical device with motion limitation devices |
TWI580632B (zh) | 2014-03-14 | 2017-05-01 | 財團法人工業技術研究院 | 具用於旋轉元件之摺疊彈簧的微機電裝置 |
US20170328800A1 (en) * | 2014-07-11 | 2017-11-16 | Richtek Technology Corporation | Combo micro-electro-mechanical system device and manufacturing method thereof |
TWI549897B (zh) | 2014-12-19 | 2016-09-21 | 立錡科技股份有限公司 | 微機電系統晶片 |
US10053361B2 (en) * | 2014-12-26 | 2018-08-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of selectively removing an anti-stiction layer on a eutectic bonding area |
US9638712B2 (en) | 2015-01-22 | 2017-05-02 | Nxp Usa, Inc. | MEMS device with over-travel stop structure and method of fabrication |
EP3546954B1 (en) * | 2016-01-07 | 2022-12-14 | Analog Devices, Inc. | 3-axis angular accelerometer |
US9643838B1 (en) * | 2016-02-05 | 2017-05-09 | Taiwan Semiconductor Manufacturing Company Ltd | Semiconductor device and package and manufacturing method thereof |
US10239746B2 (en) | 2016-11-11 | 2019-03-26 | Analog Devices, Inc. | Vertical stopper for capping MEMS devices |
-
2017
- 2017-07-14 US US15/650,822 patent/US10239746B2/en active Active
- 2017-11-10 EP EP17868755.4A patent/EP3538480A4/en active Pending
- 2017-11-10 CN CN201780074019.2A patent/CN110023233B/zh active Active
- 2017-11-10 WO PCT/US2017/061001 patent/WO2018089733A1/en unknown
- 2017-11-10 JP JP2019524369A patent/JP7048600B2/ja active Active
-
2019
- 2019-01-22 US US16/254,065 patent/US10882735B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008292451A (ja) | 2007-01-19 | 2008-12-04 | Stmicroelectronics Srl | 酸素吸収剤及び耐膨潤性、耐剥離性及び表面平滑性に優れた脱酸素性容器 |
JP2010060336A (ja) | 2008-09-02 | 2010-03-18 | Dainippon Printing Co Ltd | 一軸半導体加速度センサ |
US20100089153A1 (en) | 2008-10-13 | 2010-04-15 | Hewlett-Packard Development Company, L.P. | Adjusting the Damping Level of an Encapsulated Device |
JP2013501941A (ja) | 2009-08-13 | 2013-01-17 | メギット (サン ファン キャピストラーノ) インコーポレイテッド | 高g範囲加速度センサにおける最大化された双方向の対称的な減衰のためのプルーフマス |
JP2011247812A (ja) | 2010-05-28 | 2011-12-08 | Seiko Epson Corp | 物理量センサーおよび電子機器 |
US20130020693A1 (en) | 2011-07-19 | 2013-01-24 | Xintec Inc. | Chip package structure and method for forming the same |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7083428B2 (ja) | 2018-11-15 | 2022-06-10 | ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | マイクロエレクトロメカニカルセンサを製造する方法およびマイクロエレクトロメカニカルセンサ |
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EP3538480A1 (en) | 2019-09-18 |
US10882735B2 (en) | 2021-01-05 |
US10239746B2 (en) | 2019-03-26 |
EP3538480A4 (en) | 2020-07-22 |
JP2020513332A (ja) | 2020-05-14 |
US20190152766A1 (en) | 2019-05-23 |
CN110023233A (zh) | 2019-07-16 |
WO2018089733A1 (en) | 2018-05-17 |
CN110023233B (zh) | 2023-06-02 |
US20180134543A1 (en) | 2018-05-17 |
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