JP7045416B2 - 生体温度制御電子製品のケーシングコンポーネント - Google Patents

生体温度制御電子製品のケーシングコンポーネント Download PDF

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Publication number
JP7045416B2
JP7045416B2 JP2020095519A JP2020095519A JP7045416B2 JP 7045416 B2 JP7045416 B2 JP 7045416B2 JP 2020095519 A JP2020095519 A JP 2020095519A JP 2020095519 A JP2020095519 A JP 2020095519A JP 7045416 B2 JP7045416 B2 JP 7045416B2
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Japan
Prior art keywords
heat conductive
casing
conductive sheet
electronic product
heat
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JP2020095519A
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Japanese (ja)
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JP2021052171A (ja
Inventor
陳俊廷
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陳俊廷
胡文松
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Publication of JP2021052171A publication Critical patent/JP2021052171A/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of Temperature (AREA)
JP2020095519A 2019-09-23 2020-06-01 生体温度制御電子製品のケーシングコンポーネント Active JP7045416B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW108134292A TWI791130B (zh) 2019-09-23 2019-09-23 能以生物控溫的電子產品的殼體組件
TW108134292 2019-09-23

Publications (2)

Publication Number Publication Date
JP2021052171A JP2021052171A (ja) 2021-04-01
JP7045416B2 true JP7045416B2 (ja) 2022-03-31

Family

ID=75013329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020095519A Active JP7045416B2 (ja) 2019-09-23 2020-06-01 生体温度制御電子製品のケーシングコンポーネント

Country Status (3)

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JP (1) JP7045416B2 (zh)
CN (1) CN112543577B (zh)
TW (1) TWI791130B (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3182659U (ja) 2013-01-23 2013-04-04 有限会社マクロ精機 タブレット型端末用保護カバー
US20140078679A1 (en) 2012-09-18 2014-03-20 Fujitsu Limited Electronic device
CN205491590U (zh) 2016-01-06 2016-08-17 东莞市健耀烨电子科技有限公司 一种帮助散热的数码设备保护装置
US20160295980A1 (en) 2015-04-09 2016-10-13 Electronic Silk Road (Shenzhen) Tech Co., Ltd. Protective case
JP2018531441A (ja) 2015-07-13 2018-10-25 クアルコム，インコーポレイテッド ヒートシンクとしてリストバンドを使用することによるウェアラブルデバイスのための熱に関する解決策

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI247574B (en) * 2004-11-30 2006-01-11 Silicon Integrated Sys Corp Heat dissipation mechanism for electronic device
JP2006179712A (ja) * 2004-12-22 2006-07-06 Toshiba Corp 電子機器及びそれを用いた表示装置
TWM347014U (en) * 2008-07-04 2008-12-11 yi-fang Zhuang Handheld electronic device with micro projection module
KR101624559B1 (ko) * 2010-02-04 2016-05-26 엘지전자 주식회사 이동 단말기
CN106455428B (zh) * 2016-09-29 2018-12-21 努比亚技术有限公司 一种移动终端
TWM555461U (zh) * 2017-07-21 2018-02-11 Dongguan Pu Wei Ma Precision Industry Co Ltd 行動電子裝置之熱管與金屬殼體的連結構造

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140078679A1 (en) 2012-09-18 2014-03-20 Fujitsu Limited Electronic device
JP2014060285A (ja) 2012-09-18 2014-04-03 Fujitsu Ltd 電子機器
JP3182659U (ja) 2013-01-23 2013-04-04 有限会社マクロ精機 タブレット型端末用保護カバー
US20160295980A1 (en) 2015-04-09 2016-10-13 Electronic Silk Road (Shenzhen) Tech Co., Ltd. Protective case
JP2018531441A (ja) 2015-07-13 2018-10-25 クアルコム，インコーポレイテッド ヒートシンクとしてリストバンドを使用することによるウェアラブルデバイスのための熱に関する解決策
CN205491590U (zh) 2016-01-06 2016-08-17 东莞市健耀烨电子科技有限公司 一种帮助散热的数码设备保护装置

Also Published As

Publication number Publication date
JP2021052171A (ja) 2021-04-01
TWI791130B (zh) 2023-02-01
CN112543577A (zh) 2021-03-23
TW202113544A (zh) 2021-04-01
CN112543577B (zh) 2024-04-26

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