JP7038932B1 - Display board bonding device and bonding method - Google Patents

Display board bonding device and bonding method Download PDF

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JP7038932B1
JP7038932B1 JP2021569468A JP2021569468A JP7038932B1 JP 7038932 B1 JP7038932 B1 JP 7038932B1 JP 2021569468 A JP2021569468 A JP 2021569468A JP 2021569468 A JP2021569468 A JP 2021569468A JP 7038932 B1 JP7038932 B1 JP 7038932B1
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義和 大谷
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Abstract

表示体構成要素パターンが基板端部近傍まで形成された表示基板を、特別なアライメントマークや配線等を利用せずとも、精度よく貼り合わせることのできる装置及び方法を提供する。表示体構成要素パターンが基板端部近傍まで形成された第一基板と表示体構成要素パターンが基板端部近傍まで形成された第二基板との貼り合わせを行う表示基板の貼り合わせ装置であって、撮像手段と、画像認識手段と、位置合わせ調整手段とを備え、前記画像認識手段は、前記撮像手段が撮像した前記第一基板の特徴及び前記第二基板の特徴から第一基板の第一基準点と第二基板の第二基準点を算出し、前記位置合わせ調整手段は、前記第一基準点と前記第二基準点を同時に観察できるように二つの基板の位置が平面方向にずらされた状態での予備処理を行い、その後に位置合わせを完了させつつ、貼り合わせを行うことを特徴とする表示基板の貼り合わせ装置。Provided is an apparatus and a method capable of accurately bonding a display board in which a display body component pattern is formed up to the vicinity of the edge of the board without using special alignment marks or wiring. It is a display board bonding device that bonds the first substrate in which the display component pattern is formed up to the vicinity of the edge of the substrate and the second substrate in which the display component pattern is formed up to the vicinity of the edge of the substrate. The image recognition means is provided with an image pickup means, an image recognition means, and an alignment adjustment means, and the image recognition means is the first of the first substrate based on the characteristics of the first substrate and the characteristics of the second substrate imaged by the image pickup means. The reference point and the second reference point of the second substrate are calculated, and the alignment adjusting means shifts the positions of the two substrates in the plane direction so that the first reference point and the second reference point can be observed at the same time. A display board bonding device characterized by performing preliminary processing in a state of being in a state of being bonded, and then performing bonding while completing alignment.

Description

本発明は、表示体構成要素パターンが基板端部近傍まで形成された表示基板、所謂ベゼルレスタイプの表示基板の貼り合わせ装置及び貼り合わせ方法に関する。 The present invention relates to a display board in which a display body component pattern is formed up to the vicinity of the edge of the board, that is, a so-called bezel-less type display board bonding device and bonding method.

従来、ＬＥＤアレイ表示体として、駆動回路基板や表示体発光基板とカラーフィルタ基板や色変換機能基板とを貼り合わせることによって実現するものがある。この際、ディスプレイを構成する薄板基板ないしフィルムを貼り合わせるための位置合わせの手法としては、２つの基板に設けられたアライメントマークを利用して位置合わせをするもの（特許文献１参照）や、センサフィルム上に配置された引き回し線を基準にして位置合わせをするもの（特許文献２参照）が見られる。
一方、大型ディスプレイの画面と現実世界を隔てる境界線である額縁（ベゼル）を如何に小さくしてデザイン性の優れたものとするかという狭ベゼル化の競争は近年激化している。また、このような狭ベゼル化の傾向は、スマートフォンやタブレットといった小型機器の表示パネルでも同様に当て嵌まることである。さらに、マイクロＬＥＤによって大型のディスプレイを構築する際には、多数のマイクロＬＥＤをタイル状に敷き詰めて１枚のディスプレイとすることから、規則的な配列を実現する上でベゼルを一切排除することが要求されるため、求められるのは狭ベゼル化に止まらず、実質上、ベゼルレス化といっても過言ではない。Conventionally, as an LED array display body, there is one realized by laminating a drive circuit board or a display body light emitting board with a color filter board or a color conversion function board. At this time, as an alignment method for bonding the thin plate substrate or the film constituting the display, an alignment mark provided on the two substrates is used for alignment (see Patent Document 1), or a sensor. Some of them are aligned with reference to the drawing line arranged on the film (see Patent Document 2).
On the other hand, the competition for narrowing the bezel has been intensifying in recent years as to how to make the frame (bezel), which is the boundary line separating the screen of a large display and the real world, into an excellent design. In addition, such a tendency toward narrow bezels also applies to the display panels of small devices such as smartphones and tablets. Furthermore, when constructing a large display with micro LEDs, a large number of micro LEDs are laid out in tiles to form a single display, so it is possible to eliminate the bezel altogether in order to realize a regular arrangement. It is not an exaggeration to say that the bezel-less design is not limited to narrowing the bezel because it is required.

特開２０１９－１３８９４９号公報Japanese Unexamined Patent Publication No. 2019-138949 特開２０１７－１０２７１３号公報Japanese Unexamined Patent Publication No. 2017-102713

しかしながら、特許文献１の手法では、ベゼルレスタイプの場合にはアライメントマークを配置できないため対応が不可能であるし、特許文献２の手法も、狭ベゼル化に貢献するものであるかもしれないが、ベゼルレス基板に対応できるものではない。このことに加えて、表示体発光基板の駆動配線は通常は発光素子の下面に配置されるものであって、必ずしも周辺部に引き回し配線が存在するものではなく、そもそも特許文献２のように、配線を基準として利用することが常にできるものではない。
このような状況の下、本発明は、表示体構成要素パターンが基板端部近傍まで形成された表示基板を、特別なアライメントマークや配線等を利用せずとも、精度よく貼り合わせることのできる装置及び方法を提供することを目的とする。However, the method of Patent Document 1 cannot be used because the alignment mark cannot be arranged in the case of the bezel-less type, and the method of Patent Document 2 may also contribute to narrowing the bezel. , Not compatible with bezel-less boards. In addition to this, the drive wiring of the display body light emitting substrate is usually arranged on the lower surface of the light emitting element, and there is not necessarily a routing wiring in the peripheral portion, and as in Patent Document 2, in the first place, It is not always possible to use wiring as a reference.
Under such circumstances, the present invention is a device capable of accurately bonding a display board in which a display body component pattern is formed up to the vicinity of the edge of the board without using special alignment marks or wiring. And to provide a method.

このような課題を解決するために本発明に係る表示基板の貼り合わせ装置は、表示体構成要素パターンが基板端部近傍まで形成された第一基板と表示体構成要素パターンが基板端部近傍まで形成された第二基板との貼り合わせを行う表示基板の貼り合わせ装置であって、撮像手段と、画像認識手段と、位置合わせ調整手段とを備え、前記画像認識手段は、前記撮像手段が撮像した前記第一基板の特徴及び前記第二基板の特徴から第一基板の第一基準点と第二基板の第二基準点を算出し、前記位置合わせ調整手段は、前記第一基準点と前記第二基準点を同時に観察できるように二つの基板の位置が平面方向にずらされた状態で、前記第一基準点と前記第二基準点との平面方向のズレ量が所定値となるようにステージを移動させる位置調整処理を行い、その後に前記所定値のズレ量がゼロとなるようにステージを移動させることによって、位置合わせを完了させつつ、貼り合わせを行うことを特徴とする。
また、このような課題を解決するために本発明に係る表示基板の貼り合わせ装置は、表示体構成要素パターンが基板端部近傍まで形成された第一基板と表示体構成要素パターンが基板端部近傍まで形成された第二基板との貼り合わせを行う表示基板の貼り合わせ装置であって、撮像手段と、画像認識手段と、位置合わせ調整手段とを備え、前記画像認識手段は、前記撮像手段が撮像した前記第一基板の特徴及び前記第二基板の特徴から第一基板の第一基準点と第二基板の第二基準点を算出し、前記位置合わせ調整手段は、前記第一基準点と前記第二基準点を同時に観察できるように二つの基板の位置が平面方向にずらされた状態で、前記第一基準点と前記第二基準点との平面方向のズレ量を検出するズレ検出処理を行い、その後に検出されたズレ量がゼロとなるようにステージを移動させることによって、位置合わせを完了させつつ、貼り合わせを行うことを特徴とする。
さらに、このような課題を解決するために本発明に係る表示基板の貼り合わせ方法は、表示体構成要素パターンが基板端部近傍まで形成された第一基板と表示体構成要素パターンが基板端部近傍まで形成された第二基板との貼り合わせを行う表示基板の貼り合わせ方法であって、前記第一基板の特徴及び前記第二基板の特徴を同時に観察できるように二つの基板の位置がずらされた状態で平面方向のズレ量が所定値となるように予備的な位置調整を行う工程、次いで、ズレ量がゼロとなるようにステージを移動させる工程、とを、少なくとも含むことを特徴とする。 In order to solve such a problem, in the display board bonding device according to the present invention, the first substrate in which the display body component pattern is formed up to the vicinity of the substrate end and the display body component pattern are formed up to the vicinity of the board end portion. It is a display board bonding device for bonding to the formed second substrate, and includes an image pickup means, an image recognition means, and an alignment adjustment means, and the image recognition means is imaged by the image pickup means. The first reference point of the first substrate and the second reference point of the second substrate are calculated from the characteristics of the first substrate and the characteristics of the second substrate, and the alignment adjusting means is the first reference point and the above. With the positions of the two substrates shifted in the plane direction so that the second reference point can be observed at the same time , the amount of deviation in the plane direction between the first reference point and the second reference point becomes a predetermined value. It is characterized in that a position adjusting process for moving the stage is performed, and then the stage is moved so that the deviation amount of the predetermined value becomes zero, so that the alignment is completed and the bonding is performed.
Further, in order to solve such a problem, in the display board bonding device according to the present invention, the first substrate in which the display body component pattern is formed up to the vicinity of the board end portion and the display body component element pattern are in the substrate end portion. It is a display board bonding device for bonding to a second substrate formed up to the vicinity, and includes an image pickup means, an image recognition means, and an alignment adjustment means, and the image recognition means is the image pickup means. The first reference point of the first substrate and the second reference point of the second substrate are calculated from the characteristics of the first substrate and the characteristics of the second substrate imaged by the image, and the alignment adjusting means is the first reference point. In a state where the positions of the two substrates are shifted in the plane direction so that the second reference point and the second reference point can be observed at the same time, the deviation detection for detecting the deviation amount in the plane direction between the first reference point and the second reference point. It is characterized in that the process is performed and then the stage is moved so that the amount of deviation detected becomes zero, so that the alignment is completed and the bonding is performed.
Further, in order to solve such a problem, in the method of bonding display boards according to the present invention, the first board in which the display body component pattern is formed up to the vicinity of the board end portion and the display body component element pattern are in the substrate end portion. It is a method of bonding display boards that are bonded to a second board formed up to the vicinity, and the positions of the two boards are shifted so that the characteristics of the first board and the features of the second board can be observed at the same time. It is characterized by including at least a step of performing preliminary position adjustment so that the amount of deviation in the plane direction becomes a predetermined value in the state of being moved, and then a step of moving the stage so that the amount of deviation becomes zero. do.

本発明の実施形態に係る装置の貼り合わせの対象とされる表示基板の断面図であり、（ａ）が第二基板のみを示したもの、（ｂ）が第二基板の上方に第一基板が位置するようにされた貼り合わせ前の状態を示したもの、（ｃ）が第一基板及び第二基板の貼り合わせが完了した状態を示したものである。It is sectional drawing of the display board which is the object of bonding of the apparatus which concerns on embodiment of this invention, (a) shows only the 2nd board, (b) is the 1st board above the 2nd board. Shows the state before bonding in which is located, and (c) shows the state in which the bonding of the first substrate and the second substrate is completed. 本発明の第１実施形態に係る表示基板の貼り合わせ装置を示す説明図である。It is explanatory drawing which shows the bonding | bonding apparatus of the display board which concerns on 1st Embodiment of this invention. 本発明の実施形態に係る表示基板の貼り合わせ装置により、予備処理を行う際の様子を示す説明図である。It is explanatory drawing which shows the state at the time of performing the pretreatment by the bonding apparatus of the display board which concerns on embodiment of this invention. 本発明の実施形態に係る表示基板の貼り合わせ装置が算出する第一基準点ないし第二基準点の算出手法の一例を示す説明図である。It is explanatory drawing which shows an example of the calculation method of the 1st reference point to the 2nd reference point calculated by the bonding apparatus of the display board which concerns on embodiment of this invention. 本発明の実施形態に係る表示基板の貼り合わせ装置が算出する第一基準点ないし第二基準点の算出手法の別の例を示す説明図である。It is explanatory drawing which shows another example of the calculation method of the 1st reference point to the 2nd reference point calculated by the bonding apparatus of the display board which concerns on embodiment of this invention. 本発明の第１実施形態に係る表示基板の貼り合わせ方法における第１工程及び第２工程を示す説明図である。It is explanatory drawing which shows the 1st step and 2nd step in the method of bonding the display board which concerns on 1st Embodiment of this invention. 本発明の第１実施形態に係る表示基板の貼り合わせ方法における第３工程及び第４工程を示す説明図である。It is explanatory drawing which shows the 3rd step and 4th steps in the method of bonding the display board which concerns on 1st Embodiment of this invention. 本発明の別の実施形態に係る表示基板の貼り合わせ装置を示す説明図であり、（ａ）は単一の構造の真空チャンバーが設けられた構造を、（ｂ）は分割チャンバーが設けられた構造を示している。It is explanatory drawing which shows the bonding apparatus of the display board which concerns on another Embodiment of this invention, (a) is the structure provided with the vacuum chamber of a single structure, (b) is provided with the division chamber. Shows the structure. 本発明の応用例を説明するための図である。It is a figure for demonstrating the application example of this invention.

（表示基板について）
先ず、本発明の実施形態に係る表示基板の貼り合わせ装置において、その貼り合わせ対象となる第一基板及び第二基板について説明する。図１（ａ）は第二基板のみを示しており、（ｂ）は第二基板の上方に第一基板が位置するようにされた貼り合わせ前の状態を示しており、（ｃ）は第一基板及び第二基板の貼り合わせが完了した状態を示している。(About the display board)
First, in the display board bonding device according to the embodiment of the present invention, the first substrate and the second substrate to be bonded will be described. FIG. 1A shows only the second substrate, FIG. 1B shows a state before bonding so that the first substrate is located above the second substrate, and FIG. 1C shows a state before bonding. It shows the state where the bonding of the first substrate and the second substrate is completed.

図１（ａ）等に示されるように、第二基板２の下地基板となる表示用配線基板２４上に形成された電極（電極形成層２３）には接着層２２を介して、それぞれが平滑な矩形（正方形及び長方形を含む角が直角の四辺形）の薄板状に形成されたＬＥＤ２１が配置されている。ＬＥＤ２１は、白色の単色基板が配置されるか、有色（青又は紫外）の単色基板が配置されるか、光の三原色に対応するＲＧＢの３つのＬＥＤが繰り返される形で配置される。ここでは、白色の単色基板が配置されるものとして描かれている。 As shown in FIG. 1A and the like, the electrodes (electrode forming layer 23) formed on the display wiring board 24 which is the base substrate of the second substrate 2 are smoothed via the adhesive layer 22. The LED 21 formed in a thin plate shape of a rectangular shape (a square and a quadrilateral having a right angle including a rectangle) is arranged. The LED 21 is arranged in such a form that a white monochromatic substrate is arranged, a colored (blue or ultraviolet) monochromatic substrate is arranged, or three RGB LEDs corresponding to the three primary colors of light are repeated. Here, it is drawn assuming that a white monochromatic substrate is arranged.

一方、図１（ｂ）等に示されるように第一基板１の下地基板となる透明基板１２の上（ただし、図面は上下を逆にした状態で描かれている）には、第一基板１と第二基板２とが貼り合わせられた際の配向特性を良くするために、或いは、ＲＧＢのＬＥＤが用いられる場合の三原色の構成要素となる光の混色を防ぐために、低屈折率材料の混色防止用隔壁１１が配置されている。後述するように、混色防止用隔壁１１で仕切られた各空間には、貼り合わせの際に樹脂が充填されることによって、配光上の損失を抑えるようにされる。ＬＥＤ２１が対向する位置には、カラーフィルタ１３が配置されており、白色光を赤・緑・青色に色変換するようにされている。ＬＥＤ２１が有色（青又は紫外）の単色基板である場合には、対向する位置に色変換素子が配置されて、色変換素子によって赤・緑・青色への色変換が行われることになる。ＲＧＢのＬＥＤ２１の場合には、隔壁基板、カバーガラスの何れかが対向配置されることになるし、透明基板１２については、ブラックマトリックス基板に代えられることもある。 On the other hand, as shown in FIG. 1B and the like, the first substrate is placed on the transparent substrate 12 which is the base substrate of the first substrate 1 (however, the drawing is drawn upside down). A material with a low refractive index, in order to improve the orientation characteristics when 1 and the second substrate 2 are bonded together, or to prevent color mixing of light, which is a component of the three primary colors when RGB LEDs are used. The color mixing prevention partition 11 is arranged. As will be described later, each space partitioned by the color mixing prevention partition wall 11 is filled with a resin at the time of bonding so as to suppress a loss in light distribution. A color filter 13 is arranged at a position facing the LED 21 so as to color-convert white light into red, green, and blue. When the LED 21 is a colored (blue or ultraviolet) monochromatic substrate, a color conversion element is arranged at opposite positions, and the color conversion element performs color conversion to red, green, and blue. In the case of the RGB LED 21, either the partition wall substrate or the cover glass is arranged to face each other, and the transparent substrate 12 may be replaced with the black matrix substrate.

ＬＥＤ２１の具体例としては、主にマイクロＬＥＤと呼ばれる５０μｍ×５０μｍ以下で厚みが５０μｍ未満のＬＥＤチップが挙げられる。この他、例えばミニＬＥＤと呼ばれる１００μｍ角前後のＬＥＤチップ、また、２００～３００μｍ角などの一般的なＬＥＤチップ、さらには、ＬＤチップなどの一般的なサイズの半導体ダイオードにも本発明は適用可能である。 Specific examples of the LED 21 include a micro LED, which is an LED chip having a thickness of 50 μm × 50 μm or less and a thickness of less than 50 μm. In addition, the present invention can be applied to, for example, an LED chip of about 100 μm square called a mini LED, a general LED chip of 200 to 300 μm square, and a semiconductor diode of a general size such as an LD chip. Is.

（第１実施形態）
次に、本発明の実施形態に係る表示基板の貼り合わせ装置について説明する。図２は、本発明の第１実施形態に係る表示基板の貼り合わせ装置１００を示す説明図である。本発明の第１実施形態に係る表示基板の貼り合わせ装置１００は、第一基板１を着脱自在に保持する上ベースプレート３と、第二基板２を着脱自在に保持する下ベースプレート４と複数の撮像手段５を有する。上ベースプレート３及び下ベースプレート４は、金属などの剛体で歪み（撓み）変形しない厚さの平板状に形成されており、着脱自在構成としては、真空吸着などの差圧チャックやメカニカルチャックなどが用いられる。また、本発明の第１実施形態に係る表示基板の貼り合わせ装置１００は、上ベースプレート３及び下ベースプレート４の間に、第一基板１及び第二基板２を差し入れる投入機構（不図示）や、上ベースプレート３及び下ベースプレート４を移動させるための上下のベースプレート駆動機構（不図示）、これらの機構部を駆動制御する制御手段（不図示）を有する。上下のベースプレート駆動機構と制御手段は、本発明の第１実施形態に係る表示基板の貼り合わせ装置１００における位置合わせ調整手段を構成することになる。(First Embodiment)
Next, the display board bonding device according to the embodiment of the present invention will be described. FIG. 2 is an explanatory diagram showing a display board bonding device 100 according to the first embodiment of the present invention. The display board bonding device 100 according to the first embodiment of the present invention includes an upper base plate 3 that detachably holds the first substrate 1, a lower base plate 4 that detachably holds the second substrate 2, and a plurality of imaging images. It has means 5. The upper base plate 3 and the lower base plate 4 are formed in a flat plate shape having a thickness that does not distort (deflect) and deform due to a rigid body such as metal, and a differential pressure chuck such as vacuum suction or a mechanical chuck is used as a detachable configuration. Be done. Further, the display board bonding device 100 according to the first embodiment of the present invention includes a charging mechanism (not shown) for inserting the first substrate 1 and the second substrate 2 between the upper base plate 3 and the lower base plate 4. It has an upper and lower base plate driving mechanism (not shown) for moving the upper base plate 3 and the lower base plate 4, and control means (not shown) for driving and controlling these mechanisms. The upper and lower base plate drive mechanisms and control means constitute the alignment adjusting means in the display board bonding device 100 according to the first embodiment of the present invention.

上ベースプレート３及び下ベースプレート４は、図示されない上下のベースプレート駆動機構により、平面内でのｘ軸及びｙ軸方向への前後ないし並進移動が可能であると共に、θ方向への回転移動（ｚ軸回りの回動）が可能である。また、上ベースプレート３及び下ベースプレート４は、相互に接近ないし離反できるようにｚ軸方向への上下移動も可能とされている。これら平面内でのｘ軸方向移動、ｙ軸方向移動、θ軸回転移動により、予備処理ないし位置調整処理を行い、ｚ軸方向上下移動により、貼り合わせを行う。なお、撮像手段５で第一基板１及び第二基板２を撮像する必要があることから、上ベースプレート３には、撮像手段５の視野部分に小さい孔が穿ってある。 The upper base plate 3 and the lower base plate 4 can be moved back and forth or in translation in the x-axis and y-axis directions in a plane by an upper and lower base plate drive mechanism (not shown), and rotationally move in the θ direction (around the z-axis). Rotation) is possible. Further, the upper base plate 3 and the lower base plate 4 can be moved up and down in the z-axis direction so that they can approach or separate from each other. Preliminary processing or position adjustment processing is performed by moving in the x-axis direction, moving in the y-axis direction, and rotational movement in the θ-axis in these planes, and bonding is performed by moving up and down in the z-axis direction. Since it is necessary for the image pickup means 5 to image the first substrate 1 and the second substrate 2, the upper base plate 3 is provided with a small hole in the visual field portion of the image pickup means 5.

撮像手段５は、ＣＣＤカメラやＣＭＯＳイメージセンサ等、位置合わせに必要とされる分解能を有するものであれば任意の撮像手段を用いることができる。また、撮像手段５は、第一基板１及び第二基板２の対角線上に位置する２つの頂点を観測できる位置に２つ設けられている。この理由として、単眼であると位置合わせ精度が不十分となるし、さりとて、３つの頂点上に３つの撮像手段を配置したり、４つの頂点上に４つの撮像手段を配置したりすることは、後述するように、然程には有効でないからである。このため、撮像手段５は、第１実施形態においては２つとされている。 As the image pickup means 5, any image pickup means can be used as long as it has the resolution required for alignment, such as a CCD camera or a CMOS image sensor. Further, two imaging means 5 are provided at positions where two vertices located on the diagonal lines of the first substrate 1 and the second substrate 2 can be observed. The reason for this is that the alignment accuracy is insufficient with a monocular, and it is not possible to arrange three imaging means on three vertices or four imaging means on four vertices. This is because, as will be described later, it is not so effective. Therefore, the number of image pickup means 5 is two in the first embodiment.

（位置合わせ手順と予備処理について）
位置合わせ手順の概略を述べると概ね、次のものとなる。先ず、（１）アライメント動作を行う前に、第一基板１と第二基板２との高さ方向のギャップを持った状態で、第一基板１と第二の基板２を平面方向にずらして装置内に投入する。次いで、（２）第一基板１の表示体構成要素の一部とこれに対応させるべき第二基板２の表示体構成要素の一部とのズレ量を設定ないし測定する。（３）その後、このずれ量をキャンセルするように第一基板１若しくは第二基板２又はその両方を平面方向にずらすようにして正確に位置合わせされた貼り合わせを行う。上記（２）のズレ量の設定ないし測定を行うことが、本発明の実施形態に係る表示基板の貼り合わせ装置１００が実行する動作であるところの、或いは、本発明の実施形態に係る表示基板の貼り合わせ方法の一工程であるところの、予備処理に相当する。(About alignment procedure and pretreatment)
The outline of the alignment procedure is as follows. First, (1) before performing the alignment operation, the first substrate 1 and the second substrate 2 are displaced in the plane direction with a gap in the height direction between the first substrate 1 and the second substrate 2. Put it in the device. Next, (2) a deviation amount between a part of the display body component of the first substrate 1 and a part of the display body component of the second board 2 to be associated with the display body component is set or measured. (3) After that, the first substrate 1 and / or the second substrate 2 are displaced in the plane direction so as to cancel this deviation amount, and the bonding is performed so as to be accurately aligned. Setting or measuring the deviation amount according to (2) above is an operation executed by the display board bonding device 100 according to the embodiment of the present invention, or the display board according to the embodiment of the present invention. It corresponds to the pretreatment, which is one step of the bonding method.

図３は、予備処理を行う際の様子を説明するための図である。この説明図では、第一基板１の下地基板がブラックマトリックス基板として描かれており、また、二つの基板の平面内θ方向のズレ（ｚ軸回りの回動ズレ）は誇張して描かれている。第一基板１及び第二基板２は予めオフセットされてズレを伴った状態で、装置内に投入される。この状態を示したものが図３の上方に描かれた図である。二つの基板のエッジ部分や表示体構成要素パターンを撮像して得られる画像に対して画像認識処理してローテーション補正を行う。画像認識処理としては、ルールベース、クラスタリング、決定木、ランダムフォレスト、ＣＮＮ（Convolutional Neural Network）といった既知の手法を用いることができる。要は、二つの基板のエッジやパターンが平行になっているか否かを認識できればよい。第一基板１と第二基板２とが平行になった状態で、第一基板１の特徴である混色防止用隔壁１１と第二基板２の特徴であるＬＥＤ２１とから第一基板１の第一基準点ＧＦと第二基板２の第二基準点ＧＲをそれぞれ算出する。このことについては、後述する。第一基準点ＧＦと第二基準点ＧＲのｘ方向のズレであるδｘと第一基準点ＧＦと第二基準点ＧＲのｙ方向のズレであるδｙとが予め定められた所定値となるように、第一基板１若しくは第二基板２又はその両方を平面方向に移動させる。このズレ量が所定値となるようにする処理が本発明の予備処理の一つの手法である。別の手法として、第一基板１と第二基板２とが平行になった状態で、第一基準点ＧＦと第二基準点ＧＲのｘ方向のズレであるδｘと第一基準点ＧＦと第二基準点ＧＲのｙ方向のズレであるδｙを測定し、測定値を一時記憶するようにしてもよい。この場合には、ズレ量を所定値とするような動作は行われないことになる。この手法も、本発明の予備処理の概念に含まれるものである。この設定された、ないし、測定されたズレ量がキャンセルされてゼロとなるように第一基板１若しくは第二基板２又はその両方を平面方向に移動させることで位置合わせが完了される。 FIG. 3 is a diagram for explaining a state when performing preliminary processing. In this explanatory diagram, the base substrate of the first substrate 1 is drawn as a black matrix substrate, and the deviation (rotational deviation around the z-axis) in the θ direction in the plane of the two substrates is exaggerated. There is. The first substrate 1 and the second substrate 2 are put into the apparatus in a state of being offset in advance and accompanied by a deviation. The figure showing this state is drawn in the upper part of FIG. Image recognition processing is performed on the images obtained by imaging the edge portions of the two substrates and the display body component pattern, and rotation correction is performed. As the image recognition process, known methods such as rule base, clustering, decision tree, random forest, and CNN (Convolutional Neural Network) can be used. The point is that it is only necessary to be able to recognize whether or not the edges and patterns of the two substrates are parallel. With the first substrate 1 and the second substrate 2 parallel to each other, the first substrate 1 is formed from the color mixing prevention partition wall 11 which is a feature of the first substrate 1 and the LED 21 which is a feature of the second substrate 2. The reference point GF and the second reference point GR of the second substrate 2 are calculated respectively. This will be described later. Δx, which is the deviation between the first reference point GF and the second reference point GR in the x direction, and δy, which is the deviation between the first reference point GF and the second reference point GR in the y direction, are predetermined values. In addition, the first substrate 1 and / or the second substrate 2 are moved in the plane direction. A process for adjusting the amount of deviation to a predetermined value is one method of the preliminary process of the present invention. As another method, with the first substrate 1 and the second substrate 2 parallel to each other, δx, the first reference point GF, and the second reference point GF, which are the deviations of the first reference point GF and the second reference point GR in the x direction. (2) δy, which is a deviation of the reference point GR in the y direction, may be measured and the measured value may be temporarily stored. In this case, the operation of setting the deviation amount to a predetermined value is not performed. This method is also included in the concept of pretreatment of the present invention. Alignment is completed by moving the first substrate 1 and / or the second substrate 2 in the plane direction so that the set or measured deviation amount is canceled and becomes zero.

図３に示されるように、観察される位置は、第一基板１及び第二基板２の左上と右下の対角線上の二頂点となっている。この理由は、図３の下方に描かれた図の左下の頂点位置が示すように、第二基板２が第一基板１によって全て隠されてしまっている状態の箇所を観測することは無意味であるし、右上の頂点位置が示すように、第一基板１の外縁である上辺及び右片が両方とも第二基板２の外縁である上辺及び右片の内側に収まっている状態では画像認識の上で若干不利になるからである。このため、無駄を省くべく撮像手段５は２つとされている。この構成とした場合に、第一基板１及び第二基板２の投入時のオフセットの向きは予め決められた位置とされる。図３の例でいえば、第一基板１が第二基板２に対して、紙面上で下向きかつ左向きにずらされた状態で投入されることになる。
一方、コストを度外視して撮像手段５を３つや４つ配置することが妨げられるものではない。４つの撮像手段５が備えられていれば、第一基板１及び第二基板２のオフセットの向きを無作為に投入して、第二基板２が第一基板１によって全て隠されてしまっている状態が四頂点のどの箇所で発生しても、第二基板２を観察できる撮像手段５を用いて対応すれば良いので、十分に意味がある。As shown in FIG. 3, the observed positions are two vertices on the diagonal line of the upper left and the lower right of the first substrate 1 and the second substrate 2. The reason for this is that it is meaningless to observe the part where the second substrate 2 is completely hidden by the first substrate 1, as shown by the apex position at the lower left of the figure drawn at the bottom of FIG. As shown by the apex position on the upper right, image recognition is performed when both the upper side and the right piece, which are the outer edges of the first substrate 1, are contained inside the upper side and the right piece, which are the outer edges of the second board 2. This is because it is a little disadvantageous on the above. Therefore, in order to reduce waste, the number of image pickup means 5 is two. With this configuration, the offset direction at the time of loading the first substrate 1 and the second substrate 2 is set to a predetermined position. In the example of FIG. 3, the first substrate 1 is inserted with respect to the second substrate 2 in a state of being shifted downward and leftward on the paper surface.
On the other hand, disregarding the cost, it does not prevent the arrangement of three or four image pickup means 5. If the four imaging means 5 are provided, the offset directions of the first substrate 1 and the second substrate 2 are randomly input, and the second substrate 2 is completely hidden by the first substrate 1. Regardless of where the state occurs at any of the four vertices, it is sufficient to use the image pickup means 5 capable of observing the second substrate 2, which is sufficiently meaningful.

（基準点の算出手法）
図３では、δｘとδｙの寸法線は第一基板１及び第二基板２のエッジ間のものとして描かれているが、説明のためのものであって、実際には、第一基準点ＧＦと第二基準点ＧＲの間隔を設定ないし測定することになる。このことを説明するための図が図４である。ＬＥＤ２１はマウンターで下地基板に配置されることになるところ、この配置精度によっては、各ＬＥＤ２１の配置位置に僅かながらバラツキが生じる場合がある。基準点を求める対象として、基板全体のうちの、例えば、左上端の唯一のＬＥＤ２１を選択したならば、偶々この端のＬＥＤ２１に本来配置されるべき地点との位置ズレが生じていた場合に、それが基板全体の位置合わせに悪影響を及ぼすことになる。このため、第二基板２に多数マウントされているＬＥＤ２１の一部における、複数のＬＥＤ２１の重心位置を計算してこれを基準とする。図４では、ＲＧＢを構成するＬＥＤ２１の４セット、すなわち、１２個のＬＥＤ２１から重心位置を算出する。重心位置の算出に際しては、最外縁に配置されたＬＥＤ２１であるか内側に配置されたＬＥＤ２１であるかの違いによる配置ズレ発生の期待値に応じて加重平均により求めるようにしてもよい。このようにして求められる基準点が図４に示される４隅に「＋」が表示された地点と４隅の「＋」を総合した基準点ＭＧである。図４は、説明のために、一つの基準点ＭＧとして描かれているが、実際には、２つの撮像手段５を有する場合にあっては、左上の基準点と右下の基準点とを用いて、ズレ量δｘ及びδｙが設定ないし測定されることになる。理論上は、左上の基準点のズレ量δｘ及びδｙと右下の基準点のズレ量δｘ及びδｙは同じになる筈であるが、最初のローテーション補正が不十分であったり、基板に歪みがあったり、先述したマウンターでのＬＥＤ２１の配置のバラツキを要因として、左上と右下との間で値に違いが出る可能性がある。その場合には、再度ローテーション補正をかけて、左上と右下との間での値の差が最小となるようにする。(Reference point calculation method)
In FIG. 3, the dimension lines of δx and δy are drawn as those between the edges of the first substrate 1 and the second substrate 2, but they are for illustration purposes only and are actually the first reference point GF. And the interval between the second reference point GR will be set or measured. FIG. 4 is a diagram for explaining this. The LED 21 is arranged on the base substrate by the mounter, and depending on the arrangement accuracy, the arrangement position of each LED 21 may be slightly varied. If, for example, the only LED 21 at the upper left end of the entire board is selected as the target for obtaining the reference point, if the position of the LED 21 at this end is displaced from the original position by chance. That will adversely affect the alignment of the entire substrate. Therefore, the positions of the centers of gravity of the plurality of LEDs 21 in a part of the LEDs 21 mounted on the second substrate 2 in large numbers are calculated and used as a reference. In FIG. 4, the position of the center of gravity is calculated from four sets of LEDs 21 constituting RGB, that is, twelve LEDs 21. When calculating the position of the center of gravity, it may be calculated by a weighted average according to the expected value of the occurrence of misalignment due to the difference between the LED 21 arranged at the outermost edge and the LED 21 arranged inside. The reference point obtained in this way is the reference point MG which is the sum of the points where "+" is displayed at the four corners shown in FIG. 4 and the "+" at the four corners. FIG. 4 is drawn as one reference point MG for the sake of explanation, but in reality, in the case of having two imaging means 5, the upper left reference point and the lower right reference point are used. By using, the deviation amounts δx and δy will be set or measured. Theoretically, the amount of deviation δx and δy of the upper left reference point and the amount of deviation δx and δy of the lower right reference point should be the same, but the initial rotation correction is insufficient or the substrate is distorted. There is a possibility that there will be a difference in the value between the upper left and the lower right due to the variation in the arrangement of the LED 21 on the mounter mentioned above. In that case, apply rotation correction again so that the difference in value between the upper left and the lower right is minimized.

図５は、基準点の別の算出手法を示す説明図である。マウンターによるＬＥＤ２１の下地基板への配置精度が極めて高いものであるならば、最外端の一つのＬＥＤ２１のみを基準にしてもよい。この場合には、基準点は、図５に示されるように、４隅に「＋」が表示された地点と４隅の「＋」を総合した基準点ＭＥとなる。図５は、説明のために、一つの基準点ＭＥとして描かれているが、実際には、２つの撮像手段５を有する場合にあっては、左上の基準点と右下の基準点とを用いて、ズレ量δｘ及びδｙが設定ないし測定されることになる。理論上は、左上の基準点のズレ量δｘ及びδｙと右下の基準点のズレ量δｘ及びδｙは同じになる筈であるが、最初のローテーション補正の不足や基板の歪みを要因して、左上と右下との間で値に違いが出る可能性がある。その場合には、再度ローテーション補正をかけて、左上と右下との間での値の差が最小となるようにする。 FIG. 5 is an explanatory diagram showing another calculation method of the reference point. If the mounting accuracy of the LED 21 on the base substrate by the mounter is extremely high, only one LED 21 at the outermost end may be used as a reference. In this case, as shown in FIG. 5, the reference point is the reference point ME which is the sum of the points where "+" is displayed at the four corners and the "+" at the four corners. FIG. 5 is drawn as one reference point ME for the sake of explanation, but in reality, in the case of having two imaging means 5, the upper left reference point and the lower right reference point are used. By using, the deviation amounts δx and δy will be set or measured. Theoretically, the amount of deviation δx and δy of the upper left reference point and the amount of deviation δx and δy of the lower right reference point should be the same, but due to the lack of initial rotation correction and the distortion of the substrate, There may be a difference in the value between the upper left and the lower right. In that case, apply rotation correction again so that the difference in value between the upper left and the lower right is minimized.

（貼り合わせ手順）
図６及び図７は、表示基板の貼り合わせ方法の一連の工程を示す説明図であって、左には、第一基板１及び第二基板２の状態が、右には、本発明の第１実施形態に係る表示基板の貼り合わせ装置１００の状態が描かれている。
第１工程では、第一基板１及び第二基板２が、予めオフセットされズレを伴った状態で装置内に投入され、上ベースプレート３及び下ベースプレート４にそれぞれ吸着される。第一基板１及び第二基板２が上ベースプレート３及び下ベースプレート４に吸着されている状態を示したものが、図６（ａ）である。なお、二つの基板の平面内θ方向のズレ（ｚ軸回りの回動ズレ）は誇張して描かれているのであって、実際には、これ程のズレを伴うものではないし、可能であればθ方向のズレはゼロの状態で投入されることが好ましい。θ方向のズレがある場合には、二つの基板のエッジ部分等を撮像して得られる画像を画像認識処理して上ベースプレート３及び下ベースプレート４との間でローテーション補正を行う。２つの撮像手段５の観測下で第一基板１と第二基板２のエッジ部分を同時に観察できない不測の事態が生じた場合には、同時に観測できるまでステージを平行移動させる。撮像手段５が４つあれば、このような不測の事態は先ず生じない。生じるとすれば、それは、両基板が最初から正確に揃っているときである。
第２工程では、第一基板１の特徴と第二基板２の特徴から第一基板１の第一基準点と第二基板２の第二基準点を算出し、次いで、第一基準点と第二基準点のｘ方向のズレであるδｘと第一基準点と第二基準点のｙ方向のズレであるδｙとが予め定められた所定値となるように、上ベースプレート３若しくは下ベースプレート４又はその両方を平面方向に移動させる。この様子を示したものが、図６（ｂ）である。なお、基板を精度よく投入できるのであれば、δｘとδｙとが予め定められた所定値となるように移動させることなく、測定されたδｘとδｙを一時記憶するようにしてもよい。
第３工程では、第２工程において所定値に設定されたズレ量、若しくは、第２工程において測定されて一時御記憶されたズレ量がキャンセルされてゼロとなるように上ベースプレート３若しくは下ベースプレート４又はその両方を平面方向に移動させる。図７（ｃ）は、ズレ量がゼロになった状態を示している。
第４工程では、図７（ｄ）に示されるように、正確に位置合わせされた第一基板１と第二基板２を貼り合わせるべく、上ベースプレート３若しくは下ベースプレート４又はその両方をｚ軸方向に上下移動させて貼り合わせを完了させる。
なお、第３工程と第４工程とを同時並行的に行うことも可能である。すなわち、基板間ギャップを狭めながら、アライメントを実施するようにしてもよい。第３工程の位置合わせ制御の際の残留偏差を最小化するのに時間を要する場合等に有効である。(Pasting procedure)
6 and 7 are explanatory views showing a series of steps of a method of bonding display boards. The state of the first board 1 and the second board 2 is on the left, and the first of the present invention is on the right. The state of the sticking apparatus 100 of the display board which concerns on 1 Embodiment is drawn.
In the first step, the first substrate 1 and the second substrate 2 are put into the apparatus in a state of being offset in advance and accompanied by a deviation, and are adsorbed on the upper base plate 3 and the lower base plate 4, respectively. FIG. 6A shows a state in which the first substrate 1 and the second substrate 2 are adsorbed on the upper base plate 3 and the lower base plate 4. It should be noted that the deviation (rotational deviation around the z-axis) in the θ direction in the plane of the two substrates is exaggerated and is not actually accompanied by such a deviation, and if possible. It is preferable that the deviation in the θ direction is zero. If there is a deviation in the θ direction, the image obtained by imaging the edge portions of the two substrates is image-recognized and rotation correction is performed between the upper base plate 3 and the lower base plate 4. If an unexpected situation occurs in which the edge portions of the first substrate 1 and the second substrate 2 cannot be observed at the same time under the observation of the two imaging means 5, the stage is translated until they can be observed at the same time. If there are four image pickup means 5, such an unexpected situation is unlikely to occur. If so, it happens when both boards are exactly aligned from the beginning.
In the second step, the first reference point of the first substrate 1 and the second reference point of the second substrate 2 are calculated from the characteristics of the first substrate 1 and the characteristics of the second substrate 2, and then the first reference point and the second reference point are calculated. (Ii) The upper base plate 3 or the lower base plate 4 or Move both in the plane direction. FIG. 6 (b) shows this situation. If the substrate can be loaded with high accuracy, the measured δx and δy may be temporarily stored without moving the δx and δy to predetermined predetermined values.
In the third step, the upper base plate 3 or the lower base plate 4 so that the deviation amount set to a predetermined value in the second step or the deviation amount measured and temporarily stored in the second step is canceled and becomes zero. Or both are moved in the plane direction. FIG. 7C shows a state in which the amount of deviation has become zero.
In the fourth step, as shown in FIG. 7 (d), the upper base plate 3 and / or the lower base plate 4 are placed in the z-axis direction in order to bond the accurately aligned first substrate 1 and the second substrate 2. Move up and down to complete the bonding.
It is also possible to perform the third step and the fourth step in parallel. That is, the alignment may be performed while narrowing the gap between the substrates. This is effective when it takes time to minimize the residual deviation during the alignment control in the third step.

（別の実施形態）
本願発明の別の実施形態につき、説明する。混色防止用隔壁１１で仕切られた空間に空気層が存在すると配向の上では損失が生じることになる。このため、配光上の損失を低減させるべく、混色防止用隔壁１１で仕切られた空間には貼り合わせの際に樹脂が充填されることがある。しかし、樹脂中に気泡が混入されると、損失低減効果が弱まるばかりか、却って配光曲線に歪みを生じさせてしまう等の悪影響となってしまう。このようなことから、貼り合わせを真空の状態で行うことが望ましい。
図８には、真空状態での基板貼り合わせに適した構造が示されている。図８（ａ）は、真空チャンバー６を設け、真空状態での雰囲気下で基板貼り合わせを行えるようにしたものである。撮像手段５の視野を妨げることが無いように、真空チャンバー６の撮像手段５の直下に位置する上面部分には透明窓が設けられている。
図８（ｂ）は、チャンバーを上下二分割にしたものであって、上チャンバー部材６１と下チャンバー部材６２とから構成されている。撮像手段５の視野を妨げることが無いように、上チャンバー部材６１の撮像手段５の直下に位置する上面部分には透明窓が設けられている。
また、図示はしないが、チャンバーを透明チャンバーによって構成したならば、チャンバーに窓を設けることなく、撮像手段５の視野を妨げないようにすることが可能となる。チャンバーと透視窓の組付け作業が省略できて有利である。(Another embodiment)
Another embodiment of the present invention will be described. If an air layer exists in the space partitioned by the color mixing prevention partition wall 11, a loss will occur in terms of orientation. Therefore, in order to reduce the loss in light distribution, the space partitioned by the color mixing prevention partition wall 11 may be filled with resin at the time of bonding. However, if bubbles are mixed in the resin, not only the loss reducing effect is weakened, but also the light distribution curve is distorted. For this reason, it is desirable to perform bonding in a vacuum state.
FIG. 8 shows a structure suitable for bonding substrates in a vacuum state. In FIG. 8A, a vacuum chamber 6 is provided so that the substrates can be bonded in an atmosphere in a vacuum state. A transparent window is provided on the upper surface portion of the vacuum chamber 6 located directly below the image pickup means 5 so as not to obstruct the field of view of the image pickup means 5.
FIG. 8B shows a chamber divided into upper and lower parts, and is composed of an upper chamber member 61 and a lower chamber member 62. A transparent window is provided on the upper surface portion of the upper chamber member 61 located directly below the image pickup means 5 so as not to obstruct the field of view of the image pickup means 5.
Further, although not shown, if the chamber is configured by a transparent chamber, it is possible to prevent the image pickup means 5 from obstructing the field of view without providing a window in the chamber. It is advantageous because the assembly work of the chamber and the fluoroscopic window can be omitted.

（本発明の応用例）
図４で説明した１２個のＬＥＤ２１から重心位置を算出して基準とする手法、或いは、図５で説明した最外端の一つのＬＥＤ２１のみを基準とする手法、何れの手法も、基板エッジが検出できて、エッジ近傍に配置されたＬＥＤ２１を検出できていることを前提としている。ところが、ある状況の下では、エッジが検出できない事態も生じえる。この場合の対応について説明する。
まず、ローテーション補正については、二つの基板の表示体構成要素パターンを撮像して得られる画像に対して、ルールベース、クラスタリング、決定木、ランダムフォレスト、ＣＮＮ（Convolutional Neural Network）といった既知の画像処理を適用して、二つの基板が平行となるように、上ベースプレート３若しくは下ベースプレート４又はその両方を回転制御すれば良いので、エッジが検出できなくても問題とはならない。
問題となるのは、ズレ量δｘ及びδｙの補正である。本発明は、表示基板に表示体構成要素パターンが規則正しく配列されていることを利用して位置合わせを行うものであるが、配列が規則正しいが故に、仮にエッジが検出できない状態であると、マトリクスの２行目を１行目と誤認識してしまったり、２列目を１列目と誤認識してしまったりする事態が発生する虞がある。図９は、そのような事態が発生してしまった状況を示しており、破線として描かれている線分が、第一基板１の下に配置されて隠れてしまっている第二基板２のエッジを表している。図９（ａ）は、第二基板２の１行目のＬＥＤ２１が第一基板１の２行目の混色防止用隔壁１１に配置されてしまったため、第一基板１の１行目の混色防止用隔壁１１に対してＬＥＤ２１が配置されていない状況を示している。また、図９（ｂ）は、第二基板２の１列目のＬＥＤ２１が第一基板１の２列目の混色防止用隔壁１１に配置されてしまったため、第一基板１の１列目の混色防止用隔壁１１に対してＬＥＤ２１が配置されていない状況を示している。(Application example of the present invention)
The method of calculating the position of the center of gravity from the 12 LEDs 21 described in FIG. 4 and using it as a reference, or the method of using only one of the outermost LEDs 21 described in FIG. 5 as a reference, both methods have a substrate edge. It is premised that the LED 21 arranged near the edge can be detected. However, under certain circumstances, it is possible that the edge cannot be detected. The correspondence in this case will be described.
First, regarding rotation correction, known image processing such as rule base, clustering, decision tree, random forest, and CNN (Convolutional Neural Network) is applied to the image obtained by imaging the display body component patterns of the two boards. By applying, the rotation of the upper base plate 3 and / or the lower base plate 4 may be controlled so that the two substrates are parallel to each other, so that it does not matter even if the edge cannot be detected.
The problem is the correction of the deviation amounts δx and δy. In the present invention, alignment is performed by utilizing the fact that the display body component patterns are regularly arranged on the display board. However, if the edges cannot be detected because the arrangement is regular, the matrix can be aligned. There is a possibility that the second row may be erroneously recognized as the first row, or the second column may be erroneously recognized as the first column. FIG. 9 shows a situation in which such a situation has occurred, and the line segment drawn as a broken line of the second substrate 2 is arranged under the first substrate 1 and is hidden. Represents an edge. In FIG. 9A, since the LED 21 in the first row of the second substrate 2 is arranged on the color mixing prevention partition wall 11 in the second row of the first substrate 1, color mixing prevention in the first row of the first substrate 1 is shown. It shows a situation where the LED 21 is not arranged with respect to the partition wall 11. Further, in FIG. 9B, since the LED 21 in the first row of the second substrate 2 is arranged on the color mixing prevention partition wall 11 in the second row of the first substrate 1, the first row of the first substrate 1 is shown. It shows a situation where the LED 21 is not arranged with respect to the color mixing prevention partition wall 11.

図９（ａ）及び図９（ｂ）のＬＥＤ２１の一部はベタ塗で示されているが、これは本発明の実施形態に係る表示基板の貼り合わせ装置１００に対してアドオンされている付加機能構成によりＬＥＤ２１が発光されていることを示したものである。当該付加機能構成とは、装置内に設置された点灯治具（不図示）である。この点灯治具には、ＬＥＤ２１のアレイ表示体である第一基板１の駆動回路（不図示）を接続しておき、位置合わせ後の動作確認時に、駆動回路を駆動させて、ＬＥＤ２１の素子の一部を点灯させる。図９（ａ）及び図９（ｂ）では、１行目と１列目のＲのＬＥＤ２１のみを点灯させている。このことによって、位置合わせが完了したと思われた第一基板１と第二基板２とが、実は、１行分のズレ或いは１列分のズレを伴った状態で対向していたということが検出できるのである。このように、点灯治具（不図示）は、基板エッジが検出できない状況下で、基板にアドレスを与える役目を果たすことになる。
このような付加機能構成を有する本発明の実施形態に係る表示基板の貼り合わせ装置１００の動作工程は概ね、次のようなものとなる。
（１）予め第二基板２（ＬＥＤアレイ表示体）の駆動回路を、測定装置内に設置された点灯治具に接続しておき、
（２）アライメント動作時及び／又はアライメント後の確認動作時に、第二基板２（ＬＥＤアレイ表示体）の駆動回路を駆動させてＬＥＤの一部を点灯させ、
（３）点灯させた一部のＬＥＤを素子アドレスの指標として、第一基板（カラーフィルタ基板や色変換機能基板)の予備処理を行い、
（４）設定ないし測定一時記憶されたズレ量をキャンセルするように、基板面に沿った方向にずらし、
（５）必要に応じて、点灯させた一部のＬＥＤを素子アドレスの指標として、合せ後の検証確認を行い、
（６）第一基板と第二基板を貼り合わせる。
このようにすることで、第二基板２のエッジが上手く検出できない場合にも適正に位置合わせを行うことができる。なお、第一基板１のエッジについては、撮像手段５の近位側に配置されていることから、第二基板２のアドレス点灯によってコントラストが高まるため、エッジを十分に検出することができる。A part of the LED 21 of FIGS. 9 (a) and 9 (b) is shown in solid color, which is an addition added to the display board bonding device 100 according to the embodiment of the present invention. It shows that the LED 21 is emitting light due to the functional configuration. The additional function configuration is a lighting jig (not shown) installed in the device. A drive circuit (not shown) of the first substrate 1 which is an array display body of the LED 21 is connected to this lighting jig, and the drive circuit is driven at the time of operation check after alignment to drive the element of the LED 21. Turn on a part. In FIGS. 9A and 9B, only the R LEDs 21 in the first row and the first column are turned on. As a result, the first substrate 1 and the second substrate 2, which were thought to have been aligned, actually faced each other with a deviation of one row or a deviation of one column. It can be detected. As described above, the lighting jig (not shown) serves to give an address to the substrate in a situation where the edge of the substrate cannot be detected.
The operation process of the display board bonding device 100 according to the embodiment of the present invention having such an additional function configuration is generally as follows.
(1) The drive circuit of the second substrate 2 (LED array display body) is connected in advance to the lighting jig installed in the measuring device.
(2) During the alignment operation and / or the confirmation operation after the alignment, the drive circuit of the second substrate 2 (LED array display body) is driven to light a part of the LED.
(3) Preliminary processing of the first substrate (color filter substrate and color conversion function substrate) is performed using some of the illuminated LEDs as an index of the element address.
(4) Setting or measurement Shift in the direction along the substrate surface so as to cancel the temporarily stored shift amount.
(5) If necessary, use some of the turned-on LEDs as an index of the element address to perform verification and confirmation after matching.
(6) The first substrate and the second substrate are bonded together.
By doing so, even when the edge of the second substrate 2 cannot be detected well, proper alignment can be performed. Since the edge of the first substrate 1 is arranged on the proximal side of the image pickup means 5, the contrast is increased by lighting the address of the second substrate 2, so that the edge can be sufficiently detected.

以上、本発明の実施形態に係る表示基板の貼り合わせ装置及び貼り合わせ方法について、図面を参照して詳述してきたが、具体的な構成は、これらの実施例に限られるものではなく、本発明の要旨を逸脱しない範囲の設計の変更等があっても本発明に含まれる。
例えば、本発明が対象とする表示体構成要素パターンが基板端部近傍まで形成された基板とはベゼルレス基板に限定されるものでなく、狭ベゼルの基板であってもよい。すなわち、アライメントマークを設けることが不可能な基板に止まることなく、アライメントマークを設けることが困難な基板も、本発明の対象とされるものである。換言すれば、基板が本来的に有する固有の特徴（ＬＥＤや混色防止用隔壁）を利用して位置合わせを行う態様であれば、本発明の技術的思想に含まれるものである。
このように、本発明は、表示基板に表示体構成要素パターンが規則正しく配列されていることを利用して位置合わせを行う点に、その技術的思想が存するということは十分に理解されるべきものである。As described above, the bonding device and the bonding method for the display board according to the embodiment of the present invention have been described in detail with reference to the drawings, but the specific configuration is not limited to these examples. Even if there is a design change or the like within a range that does not deviate from the gist of the invention, it is included in the present invention.
For example, the substrate in which the display component component pattern targeted by the present invention is formed up to the vicinity of the edge of the substrate is not limited to the bezelless substrate, and may be a substrate with a narrow bezel. That is, a substrate on which it is difficult to provide an alignment mark without stopping on a substrate on which an alignment mark cannot be provided is also an object of the present invention. In other words, it is included in the technical idea of the present invention as long as the alignment is performed by utilizing the inherent characteristics (LED and color mixing prevention partition wall) inherent in the substrate.
As described above, it should be fully understood that the present invention has a technical idea in that alignment is performed by utilizing the fact that the display body component patterns are regularly arranged on the display board. Is.

１００ 表示基板の貼り合わせ装置
１ 第一基板
１１ 混色防止用隔壁
１２ 透明基板（ブラックマトリクス基板）
１３ カラーフィルタ（色変換素子）
２ 第二基板
２１ ＬＥＤ
２２ 接着層
２３ 電極形成層
２４ 表示用配線基板
３ 上ベースプレート
４ 下ベースプレート
５ 撮像手段
６ 真空チャンバー
６１ 上チャンバー部材
６２ 下チャンバー部材100 Display board bonding device 1 First board 11 Color mixing prevention partition wall 12 Transparent board (black matrix board)
13 Color filter (color conversion element)
2 Second board 21 LED
22 Adhesive layer 23 Electrode forming layer 24 Display wiring board 3 Upper base plate 4 Lower base plate 5 Imaging means 6 Vacuum chamber 61 Upper chamber member 62 Lower chamber member

Claims (9)

表示体構成要素パターンが基板端部近傍まで形成された第一基板と表示体構成要素パターンが基板端部近傍まで形成された第二基板との貼り合わせを行う表示基板の貼り合わせ装置であって、
撮像手段と、画像認識手段と、位置合わせ調整手段とを備え、
前記画像認識手段は、前記撮像手段が撮像した前記第一基板の特徴及び前記第二基板の特徴から第一基板の第一基準点と第二基板の第二基準点を算出し、
前記位置合わせ調整手段は、前記第一基準点と前記第二基準点を同時に観察できるように二つの基板の位置が平面方向にずらされた状態で、前記第一基準点と前記第二基準点との平面方向のズレ量が所定値となるようにステージを移動させる位置調整処理を行い、その後に前記所定値のズレ量がゼロとなるようにステージを移動させることによって、位置合わせを完了させつつ、貼り合わせを行う
ことを特徴とする表示基板の貼り合わせ装置。 It is a display board bonding device that bonds the first substrate in which the display component pattern is formed near the edge of the substrate and the second substrate in which the display component pattern is formed near the edge of the substrate. ,
It is provided with an image pickup means, an image recognition means, and an alignment adjustment means.
The image recognition means calculates a first reference point of the first substrate and a second reference point of the second substrate from the characteristics of the first substrate and the characteristics of the second substrate imaged by the imaging means.
The alignment adjusting means has the first reference point and the second reference point in a state where the positions of the two substrates are shifted in the plane direction so that the first reference point and the second reference point can be observed at the same time . Position adjustment processing is performed to move the stage so that the amount of deviation in the plane direction becomes a predetermined value, and then the stage is moved so that the amount of deviation of the predetermined value becomes zero, thereby completing the alignment. At the same time, it is a display board bonding device characterized by bonding. 表示体構成要素パターンが基板端部近傍まで形成された第一基板と表示体構成要素パターンが基板端部近傍まで形成された第二基板との貼り合わせを行う表示基板の貼り合わせ装置であって、
撮像手段と、画像認識手段と、位置合わせ調整手段とを備え、
前記画像認識手段は、前記撮像手段が撮像した前記第一基板の特徴及び前記第二基板の特徴から第一基板の第一基準点と第二基板の第二基準点を算出し、
前記位置合わせ調整手段は、前記第一基準点と前記第二基準点を同時に観察できるように二つの基板の位置が平面方向にずらされた状態で、前記第一基準点と前記第二基準点との平面方向のズレ量を検出するズレ検出処理を行い、その後に検出されたズレ量がゼロとなるようにステージを移動させることによって、位置合わせを完了させつつ、貼り合わせを行う
ことを特徴とする表示基板の貼り合わせ装置。 It is a display board bonding device that bonds the first substrate in which the display component pattern is formed near the edge of the substrate and the second substrate in which the display component pattern is formed near the edge of the substrate. ,
It is provided with an image pickup means, an image recognition means, and an alignment adjustment means.
The image recognition means calculates a first reference point of the first substrate and a second reference point of the second substrate from the characteristics of the first substrate and the characteristics of the second substrate imaged by the imaging means.
The alignment adjusting means has the first reference point and the second reference point in a state where the positions of the two substrates are shifted in the plane direction so that the first reference point and the second reference point can be observed at the same time . It is characterized by performing a misalignment detection process that detects the amount of misalignment in the plane direction with , and then moving the stage so that the amount of misalignment detected becomes zero, thereby performing bonding while completing alignment. Display board bonding device. 前記位置合わせ調整手段は、前記撮像手段が前記第一基板と前記第二基板の特徴を同時に観察できない場合には、これらの特徴を同時に観測できるようにステージを移動させる
ことを特徴とする請求項１または２に記載の表示基板の貼り合わせ装置。 The claim is characterized in that, when the image pickup means cannot observe the features of the first substrate and the second substrate at the same time, the alignment adjusting means moves the stage so that these features can be observed at the same time. The display board bonding device according to 1 or 2 . 前記第一基板の特徴と前記第二基板の特徴は、一方が発光素子であり、他方がカラーフィルタ、色変換素子、カバーガラス、混色防止用隔壁、ブラックマトリクス基板の少なくとも一である
ことを特徴とする請求項１から３のいずれか一項に記載の表示基板の貼り合わせ装置。 The characteristics of the first substrate and the second substrate are that one is a light emitting element and the other is at least one of a color filter, a color conversion element, a cover glass, a color mixing prevention partition, and a black matrix substrate. The display board bonding device according to any one of claims 1 to 3 . 前記第一基準点と前記第二基準点は、前記第一基板の基板端部に位置する一の特徴及び前記第二基板の基板端部に位置する一の特徴から算出される
ことを特徴とする請求項４に記載の表示基板の貼り合わせ装置。 The first reference point and the second reference point are characterized in that they are calculated from one feature located at the substrate end of the first substrate and one feature located at the substrate end of the second substrate. The display board bonding device according to claim 4 . 前記第一基準点と前記第二基準点は、前記第一基板の基板端部に位置する複数の特徴及び前記第二基板の基板端部に位置する複数の特徴から算出される
ことを特徴とする請求項４に記載の表示基板の貼り合わせ装置。 The first reference point and the second reference point are characterized in that they are calculated from a plurality of features located at the substrate end of the first substrate and a plurality of features located at the substrate end of the second substrate. The display board bonding device according to claim 4 . 表示体構成要素パターンが形成された第一基板と表示体構成要素パターンが形成された第二基板との貼り合わせを行う表示基板の貼り合わせ装置であって、
撮像手段と、画像認識手段と、位置合わせ調整手段とを備え、
前記画像認識手段は、前記撮像手段が撮像した前記第一基板が本来的に有する固有の特徴及び前記第二基板が本来的に有する固有の特徴から第一基板の第一基準点と第二基板の第二基準点を算出し、
前記位置合わせ調整手段は、前記第一基準点と前記第二基準点を同時に観察できるように二つの基板の位置が平面方向にずらされた状態で、前記第一基準点と前記第二基準点との平面方向のズレ量が所定値となるようにステージを移動させる位置調整処理を行い、その後に前記所定値のズレ量がゼロとなるようにステージを移動させることによって、位置合わせを完了させつつ、貼り合わせを行う
ことを特徴とする表示基板の貼り合わせ装置。 A display board bonding device for bonding a first substrate on which a display component pattern is formed and a second substrate on which a display component pattern is formed.
It is provided with an image pickup means, an image recognition means, and an alignment adjustment means.
The image recognition means has a first reference point of the first substrate and a second substrate based on the unique characteristics inherently possessed by the first substrate and the inherent characteristics inherently possessed by the second substrate, which are imaged by the image pickup means. Calculate the second reference point of
The alignment adjusting means has the first reference point and the second reference point in a state where the positions of the two substrates are shifted in the plane direction so that the first reference point and the second reference point can be observed at the same time . Position adjustment processing is performed to move the stage so that the amount of deviation in the plane direction becomes a predetermined value, and then the stage is moved so that the amount of deviation of the predetermined value becomes zero, thereby completing the alignment. At the same time, it is a display board bonding device characterized by bonding. 表示体構成要素パターンが形成された第一基板と表示体構成要素パターンが形成された第二基板との貼り合わせを行う表示基板の貼り合わせ装置であって、
撮像手段と、画像認識手段と、位置合わせ調整手段とを備え、
前記画像認識手段は、前記撮像手段が撮像した前記第一基板が本来的に有する固有の特徴及び前記第二基板が本来的に有する固有の特徴から第一基板の第一基準点と第二基板の第二基準点を算出し、
前記位置合わせ調整手段は、前記第一基準点と前記第二基準点を同時に観察できるように二つの基板の位置が平面方向にずらされた状態で、前記第一基準点と前記第二基準点との平面方向のズレ量を検出するズレ検出処理を行い、その後に検出されたズレ量がゼロとなるようにステージを移動させることによって、位置合わせを完了させつつ、貼り合わせを行う
ことを特徴とする表示基板の貼り合わせ装置。 A display board bonding device for bonding a first substrate on which a display component pattern is formed and a second substrate on which a display component pattern is formed.
It is provided with an image pickup means, an image recognition means, and an alignment adjustment means.
The image recognition means has a first reference point of the first substrate and a second substrate based on the unique characteristics inherently possessed by the first substrate and the inherent characteristics inherently possessed by the second substrate, which are imaged by the image pickup means. Calculate the second reference point of
The alignment adjusting means has the first reference point and the second reference point in a state where the positions of the two substrates are shifted in the plane direction so that the first reference point and the second reference point can be observed at the same time . It is characterized by performing a misalignment detection process that detects the amount of misalignment in the plane direction with , and then moving the stage so that the amount of misalignment detected becomes zero, thereby performing bonding while completing alignment. Display board bonding device. 表示体構成要素パターンが基板端部近傍まで形成された第一基板と表示体構成要素パターンが基板端部近傍まで形成された第二基板との貼り合わせを行う表示基板の貼り合わせ方法であって、
前記第一基板の特徴及び前記第二基板の特徴を同時に観察できるように二つの基板の位置がずらされた状態で平面方向のズレ量が所定値となるように予備的な位置調整を行う工程、
次いで、ズレ量がゼロとなるようにステージを移動させる工程、
とを、少なくとも含むことを特徴とする表示基板の貼り合わせ方法。 It is a method of bonding a display board in which a first substrate having a display body component pattern formed up to the vicinity of the edge of the substrate and a second board having a display body component pattern formed up to the vicinity of the edge of the board are bonded to each other. ,
A step of performing preliminary position adjustment so that the amount of deviation in the plane direction becomes a predetermined value while the positions of the two substrates are shifted so that the characteristics of the first substrate and the characteristics of the second substrate can be observed at the same time. ,
Next, the process of moving the stage so that the amount of deviation becomes zero,
A method of bonding display boards, which comprises at least.
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