JP7032900B2 - Manufacturing methods for electronic components, electronic devices, and electronic components - Google Patents

Description

The present invention relates to electronic components, electronic devices, and methods for manufacturing electronic components.

It is known that a marker portion is provided on an electronic component in order to identify the direction (posture) of the electronic component. For example, there are known electronic components provided on the first surface of a rectangular parallelepiped prime field portion and provided with a marker portion exposed on a second surface adjacent to the first surface (for example, Patent Documents 1 and 2). ..

Japanese Unexamined Patent Publication No. 2006-108383 Japanese Unexamined Patent Publication No. 2005-166745

Electronic components may be mounted on a circuit board so that the stacking direction of a plurality of layers constituting the prime field is parallel to the mounting surface of the circuit board. For example, in coil components, it is known that a high Q value can be obtained by making the coil axis substantially parallel to the mounting surface of the circuit board. In this case, the coil component may be mounted on the circuit board so that the stacking direction of the plurality of layers constituting the prime field portion is substantially parallel to the mounting surface of the circuit board. Even in such a case, it is preferable to be able to identify the direction of the electronic component. On the other hand, with the recent miniaturization of electronic components, there is concern that the strength of the prime field will decrease.

The present invention has been made in view of the above problems, and provides a method for manufacturing an electronic component, an electronic device, and an electronic component capable of identifying the direction of the electronic component and improving the strength of the prime field portion. The purpose is.

The present invention includes a square-shaped prime field portion made of an insulator, a passive element provided inside the prime field portion, and a first marker portion provided on the surface of the prime field portion. The first marker portion is sandwiched between the plurality of first markers and the plurality of first markers among the plurality of first insulating sheets on which the first markers are formed and laminated . It is formed of an insulating sheet and extends from the side of the prime field portion that is in contact with the second surface adjacent to the first surface to the side that is in contact with the third surface on the opposite side of the second surface. It is an electronic component provided on the surface and exposed on the second surface and the third surface.

In the above configuration, the first marker portion may have a thickness of 14 μm or more in the direction perpendicular to the first surface of the prime field portion.

In the above configuration, the plurality of markers may have a thickness of 1 μm or more in the direction perpendicular to the first surface of the prime field portion.

In the above configuration, the plurality of markers and the insulating layer may be formed to include glass and aluminum oxide.

In the above configuration, the plurality of markers can be configured to have a smaller light transmittance than the insulating layer.

In the above configuration, the first marker portion may be configured to be provided in a region of half or more of the first surface of the prime field portion.

In the above configuration, the second marker portion provided on the surface of the prime field portion is provided, and the second marker portion includes a plurality of second markers and a plurality of second markers on which the second marker is formed and laminated . The second surface of the insulating sheet is formed by a second insulating sheet sandwiched between the plurality of second markers, and is formed on a fourth surface of the prime field portion opposite to the first surface. The configuration may be such that it extends from the side in contact with the third surface to the side in contact with the third surface and is exposed on the second surface and the third surface.

In the above configuration, the first marker portion is closer to the fifth surface side where the first surface, the second surface, the third surface, and the fourth surface of the prime field portion intersect with the first surface. The second marker portion may be provided and may be provided on the fourth surface of the prime field portion closer to the sixth surface side opposite to the fifth surface.

In the above configuration, the first surface of the prime field portion is provided extending from the side in contact with the second surface to the side in contact with the third surface, and is exposed to the second surface and the third surface. The configuration may include a third marker portion having a color different from that of the first marker portion.

In the above configuration, the first marker portion and the third marker portion may have a configuration in which at least one of the three color attributes is different.

In the above configuration, the first marker portion and the third marker portion may be provided adjacent to each other.

In the above configuration, the passive element may be a coil element.

In the above configuration, the passive element may be a capacitor element.

The present invention is an electronic device including the above-mentioned electronic component and a circuit board on which the electronic component is mounted.

In the above configuration, the electronic component may have a coil element, and the coil axis of the coil element may be substantially parallel to the mounting surface of the circuit board and mounted on the circuit board.

The present invention includes a step of forming a marker on the surface of a plurality of first insulating sheets, a step of forming a conductor constituting a passive element on the plurality of second insulating sheets, and the plurality of first insulating sheets. The plurality of second insulating sheets are laminated, and the side that is in contact with the second surface adjacent to the first surface to the first surface of the surface is the side that is in contact with the third surface on the side opposite to the second surface. The second of the plurality of first insulating sheets laminated with the plurality of markers extending to the second surface and exposed to the third surface, sandwiched between the plurality of markers . (1) A method for manufacturing an electronic component including a step of forming a rectangular body portion having a marker portion formed of an insulating sheet and the passive element provided inside.

According to the present invention, it is possible to identify the direction of the electronic component and improve the strength of the prime field portion.

1 (a) and 1 (b) are perspective views of the coil component according to the first embodiment. FIG. 2 is a perspective side view of the coil component according to the first embodiment as viewed from the side surface side of the prime field portion. 3 (a) and 3 (b) are enlarged partial cross-sectional views of a region provided with a marker portion. FIG. 4 is a diagram showing a method of manufacturing a coil component according to the first embodiment. 5 (a) is a perspective view of the coil component according to Comparative Example 1, FIG. 5 (b) is a sectional view between A and A of FIG. 5 (a), and FIG. 5 (c) is FIG. 5 (a). It is a cross-sectional view between BB of). 6 (a) to 6 (d) are perspective views of Samples 1 to 4 used in the experiment. FIG. 7 is a diagram showing the experimental results of evaluating the intensities of Samples 1 to 4. FIG. 8 is a diagram illustrating a method of recognizing a marker portion by an appearance sorting device. FIG. 9 shows the experimental results regarding the recognition of the marker portion by the appearance sorting device. FIG. 10 is a diagram illustrating the reason why the number of recognition errors in the marker portion is reduced. 11 (a) and 11 (b) are perspective views of the coil component according to the second embodiment. 12 (a) and 12 (b) are enlarged partial cross-sectional views of a region provided with a marker portion. FIG. 13 is a cross-sectional view of the capacitor component according to the third embodiment. FIG. 14 is a cross-sectional view of the electronic device according to the fourth embodiment.

Hereinafter, examples of the present invention will be described with reference to the drawings.

1 (a) and 1 (b) are perspective views of the coil component 100 according to the first embodiment. FIG. 1A is a perspective view seen from the upper surface 12 side of the prime field portion 10, and FIG. 1B is a perspective view seen from the lower surface 14 side of the prime field portion 10. FIG. 2 is a perspective side view of the coil component 100 according to the first embodiment as viewed from the side surface 18 side of the prime field portion 10. As shown in FIGS. 1 (a), 1 (b), and FIG. 2, the coil component 100 of the first embodiment has a prime field portion 10 made of an insulator, a coil element 30, an external electrode 40, and a marker portion. 50 and 52. The marker portions 50 and 52 are provided to identify the direction (posture) of the coil component 100.

The element body portion 10 has an upper surface 12, a lower surface 14, a pair of end faces 16 and a pair of side surfaces 18, and has a width direction in the X-axis direction, a length direction in the Y-axis direction, and a height direction in the Z-axis direction. It has a rectangular parallelepiped shape with each side of. The lower surface 14 is a mounting surface, and the upper surface 12 is a surface opposite to the lower surface 14. The end surface 16 is a surface connected to a pair of sides (for example, short sides) of the upper surface 12 and the lower surface 14, and the side surface 18 is a surface connected to a pair of sides (for example, long sides) of the upper surface 12 and the lower surface 14. .. The prime field portion 10 is not limited to the case of a perfect rectangular parallelepiped shape, and for example, each vertex is rounded, each ridge (the boundary portion of each surface) is rounded, or each surface is rounded. It may be a rectangular parallelepiped shape having a curved surface.

The prime field portion 10 is formed of a mixed material of glass and aluminum oxide (hereinafter referred to as alumina). For example, the prime field portion 10 is made of 50 wt% to 95 wt% borosilicate glass, 1 wt% to 50 wt% alumina, and several wt% inorganic additives. The glass is not limited to borosilicate glass, and may be other silicate glass such as soda-lime glass, or glass other than silicate glass. Further, the prime field portion 10 may be formed of another insulating material such as a magnetic material such as ferrite. The element body portion 10 has, for example, a width dimension of 0.05 mm to 0.3 mm, a length dimension of 0.1 mm to 0.6 mm, and a height dimension of 0.05 mm to 0.5 mm.

The coil element 30 is provided inside the prime field portion 10. The coil element 30 is formed by a spiral coil conductor 32 provided inside the prime field portion 10. The coil element 30 has a predetermined orbital unit and has a coil axis substantially orthogonal to the surface defined by the orbital unit. The side surface 18 of the prime field portion 10 is a surface substantially orthogonal to (intersects) the coil axis, and the upper surface 12, the lower surface 14 and the end surface 16 are surfaces substantially parallel to the coil axis. In this way, by using the lower surface 14 of the surface of the prime field portion 10, which is a surface substantially parallel to the coil axis, as the mounting surface on the circuit board, the Q value after the coil component 100 is mounted on the circuit board. Can be improved. The coil conductor 32 is made of a metal material such as copper, aluminum, nickel, silver, platinum, or palladium, or an alloy material containing these.

The external electrode 40 is provided on the surface of the prime field portion 10. The external electrode 40 is provided, for example, extending from the lower surface 14 of the prime field portion 10 to the upper surface 12 via the end surface 16 and the side surface 18. That is, the external electrode 40 is a five-sided electrode that covers the five sides of the prime field portion 10. The external electrode 40 may be a three-sided electrode extending from the lower surface 14 of the prime body portion 10 to the upper surface 12 via the end surface 16, or a two-sided electrode extending from the lower surface 14 to the end surface 16. It may be present, or it may be a one-sided electrode provided only on the lower surface 14.

The external electrode 40 is connected to the coil conductor 32 via an extraction conductor 34 provided inside the prime field portion 10. Therefore, the external electrode 40 is electrically connected to the coil element 30. The lead conductor 34 is provided, for example, at a position near the center of the prime field portion 10 in the height direction (Z-axis direction) of the prime field portion 10. The lead conductor 34 is normally drawn to the end face 16, but may be drawn out to a surface other than the end face 16 and connected to the external electrode 40 by connecting the conductors in layers using a through-hole filling technique.

The external electrode 40 includes, for example, a first metal layer provided on the surface of the prime field portion 10, a second metal layer covering the first metal layer, and a third metal layer covering the second metal layer. The first metal layer, the second metal layer, and the third metal layer are formed by a method used in a thin film process such as paste coating, plating, or sputtering. The first metal layer is formed of a metal material such as copper, aluminum, nickel, silver, platinum, or palladium, or an alloy material containing these. Further, the first metal layer may be formed of a conductive resin or conductive glass containing a metal material such as copper, aluminum, nickel, silver, platinum, or palladium, or an alloy material containing these. The third metal layer is formed of, for example, a metal having good solder wettability, and is, for example, a tin-plated layer. The second metal layer is, for example, a layer for suppressing the diffusion of the metal constituting the first metal layer to the solder bonded to the surface of the third metal layer, for example, a nickel plating layer. The lead conductor 34 is made of, for example, the same metal material or the same alloy material as the coil conductor 32.

The marker portions 50 and 52 are provided on the surface of the prime field portion 10. The marker portion 50 is exposed on the upper surface 12 and the lower surface 14 of the prime field portion 10 and is provided on one side surface 18 of the pair of side surfaces 18. The marker portion 52 is exposed on the upper surface 12 and the lower surface 14 of the prime field portion 10 and is provided on the other side surface 18 of the pair of side surfaces 18. That is, the marker portions 50 and 52 are provided on the side surface 18 of the prime field portion 10 extending from the side on the upper surface 12 side to the side on the lower surface 14 side, and are exposed on the upper surface 12 and the lower surface 14. Thereby, the marker portions 50 and 52 can be discriminated not only from the side surface 18 side of the prime field portion 10 but also from the upper surface 12 and the lower surface 14 side. The marker portions 50 and 52 may be provided on the outside of the surface of the prime field portion 10, or may be provided slightly inside the surface of the prime field portion 10 so as to be transparent from the outside through the prime field portion 10. good.

The marker portions 50 and 52 have a different color from the prime field portion 10. Having different colors means that at least one of the three attributes of color, hue, lightness, and saturation, is different. For example, the marker portions 50 and 52 have a lower brightness than the prime field portion 10. The marker portions 50 and 52 are preferably opaque. Opaque is a state in which the prime field portion 10 covered with the marker portions 50 and 52 passes through the marker portions 50 and 52 and is substantially invisible, and the light of the marker portions 50 and 52 (for example, visible light). It does not mean that the transparency of is 0. The marker unit 50 and the marker unit 52 may have the same color or may have different colors. Having the same color means that the hue, lightness, and saturation are all the same or substantially the same.

The lengths of the marker portions 50 and 52 in the length direction (Y-axis direction) of the prime field portion 10 may be the same or different. In the marker portions 50 and 52, the lengths in the length direction (Y-axis direction) of the element body portion 10 of the portion provided on the side surface 18, the portion provided on the upper surface 12, and the portion provided on the lower surface 14 are, for example, the same. It has become. Further, the marker portions 50 and 52 may be provided in a region of half or more of the side surface 18 of the prime field portion 10, or may be provided in a region of half or less.

FIG. 3A is an enlarged partial cross-sectional view of the area where the marker portion 50 is provided, and FIG. 3B is an enlarged partial cross-sectional view of the area where the marker portion 52 is provided. As shown in FIG. 3A, the marker portion 50 is formed by laminating an insulating sheet 58a on which the marker 50a is formed and an insulating sheet 58b on which the marker 50b is formed. The marker 50a, the marker 50b, and the portion 90 of the insulating sheet 58b sandwiched between the marker 50a and the marker 50b form the marker portion 50. As shown in FIG. 3B, the marker portion 52 is formed by laminating an insulating sheet 60a on which the marker 52a is formed and an insulating sheet 60b on which the marker 52b is formed. The marker 52a, the marker 52b, and the portion 92 of the insulating sheet 60b sandwiched between the marker 52a and the marker 52b form the marker portion 52. The marker portions 50 and 52 are not limited to the case where two layers of insulating sheets on which the markers are formed are laminated, and may be a case where three or more layers are laminated.

The markers 50a, 50b, 52a, and 52b are formed containing, for example, glass and alumina. For example, the markers 50a, 50b, 52a, and 52b are 35 wt% to 55 wt% borosilicate glass, 10 wt% to 30 wt% alumina, and 25 wt% to 45 wt% inorganic additives added for the purpose of coloring. For example, cobalt intended to be colored black) and. The glass contained in the markers 50a, 50b, 52a, and 52b is not limited to borosilicate glass, and may be other silicate glass such as soda-lime glass, or glass other than silicate glass. .. Further, the markers 50a, 50b, 52a, and 52b may not have an inorganic additive for coloring.

The insulating sheets 58a, 58b, 60a, and 60b are formed containing, for example, glass and alumina. For example, the insulating sheets 58a, 58b, 60a, and 60b are made of 50 wt% to 95 wt% borosilicate glass, 1 wt% to 50 wt% alumina, and a few wt% inorganic additives. The insulating sheets 58a, 58b, 60a, and 60b may have the same composition as the prime field portion 10, or may have different compositions.

The thickness of the markers 50a, 50b, 52a, and 52b is, for example, about 1 μm to 10 μm. The thickness of the insulating sheets 58a, 58b, 60a, and 60b is, for example, about 5 μm to 15 μm. For example, the thickness of the markers 50a, 50b, 52a, and 52b is thinner than the thickness of the insulating sheets 58a, 58b, 60a, and 60b.

FIG. 4 is a diagram showing a method of manufacturing the coil component 100 according to the first embodiment. The coil component 100 is formed including a step of laminating a plurality of green sheets (insulating sheets). The green sheet is a precursor of an insulating layer constituting the prime field portion 10, and is formed by applying, for example, an insulating material slurry containing glass and alumina in the form of a film by a doctor blade method or the like. The thickness of the green sheet is, for example, about 5 μm to 15 μm.

As shown in FIG. 4, a plurality of green sheets G1 to G15 are prepared. A paste containing at least glass and alumina is applied to the surfaces of the green sheets G3 and G4 by, for example, a printing method (screen printing method or the like) to form markers 50a and 50b. A paste containing at least glass and alumina is applied to the surfaces of the green sheets G12 and G13 by, for example, a printing method (screen printing method or the like) to form markers 52a and 52b.

Through holes are formed at predetermined positions of the green sheets G6 to G9 by laser processing or the like. Next, the precursors of the coil conductor 32 and the lead conductor 34 are formed by printing the conductive material on the green sheets G6 to G10 using, for example, a printing method. When these are fired, they become a coil conductor 32 and a lead conductor 34.

The green sheets G1 to G15 are laminated in a predetermined order, and pressure is applied in the stacking direction to crimp the green sheets G1 to G15. Then, the crimped green sheet is cut into chip units by a dicer or push-cutting, and then fired at a predetermined temperature (for example, 700 ° C to 900 ° C). Since the direction substantially parallel to the stacking direction is the coil axis, the planes corresponding to the top and bottom of the stacking direction are the pair of side surfaces 18 in FIGS. 1 (a) and 1 (b). As a result, as shown in FIGS. 1A, 1B, and 2, marker portions 50 and 52 extending from the upper surface 12 side to the lower surface 14 side on the side surface 18 and exposed on the upper surface 12 and the lower surface 14. Is provided, and the prime field portion 10 provided with the coil element 30 inside is formed.

Subsequently, the external electrode 40 is formed on the surface of the prime field portion 10. The external electrode 40 is, for example, coated with an electrode paste and baked at a predetermined temperature (for example, about 500 ° C. to 700 ° C.), or coated with a conductive resin and heated at a predetermined temperature (for example, about 150 ° C. to 200 ° C.). It is formed by curing and further plating. As a result, the coil component 100 shown in FIGS. 1 (a), 1 (b), and 2 is formed.

5 (a) is a perspective view of the coil component 500 according to Comparative Example 1, FIG. 5 (b) is a sectional view between A and A of FIG. 5 (a), and FIG. 5 (c) is FIG. 5 (c). It is sectional drawing between BB of a). In FIGS. 5 (b) and 5 (c), the coil element 30 provided inside the prime field portion 10 is not shown. As shown in FIGS. 5A, 5B, and 5C, in the coil component 500 of Comparative Example 1, the marker portions 50 and 52 are exposed on the upper surface 12 of the prime field portion 10. However, it is not exposed on the lower surface 14. That is, the marker portions 50 and 52 are provided in the region on the upper surface 12 side of the side surface 18 of the prime field portion 10, but are not provided in the region on the lower surface 14 side. Therefore, the dimension in the width direction (X-axis direction) of the coil component 500 of Comparative Example 1 is different between the portion where the marker portions 50 and 52 are provided and the portion where the marker portions 50 and 52 are not provided. When an external force is applied to the coil component 500 of Comparative Example 1, it is conceivable that the force is not uniformly applied to the prime field portion 10, and as a result, the strength of the prime field portion 10 decreases.

Here, an experiment for evaluating the relationship between the shapes of the marker portions 50 and 52 and the strength of the prime field portion 10 will be described. 6 (a) to 6 (d) are perspective views of Samples 1 to 4 used in the experiment. In Samples 1 to 4, the marker portion 52 has the same shape as the marker portion 50. As shown in FIG. 6A, in the sample 1 (Example 1), the marker portions 50 and 52 are provided over the entire half region of the side surface 18 of the prime field portion 10. That is, the marker portions 50 and 52 are provided on the side surface 18 of the prime field portion 10 extending from the side in contact with the upper surface 12 to the side in contact with the lower surface 14 and exposed on the upper surface 12 and the lower surface 14. As shown in FIGS. 6 (b), 6 (c), and 6 (d), in Sample 2 (Comparative Example 1), Sample 3 (Comparative Example 1), and Sample 4 (Comparative Example 1), the prime field portion is used. The marker portions 50 and 52 are provided on the upper surface 12 only in the region on the upper surface 12 side of the half region of the side surface 18 of 10. In sample 2 of FIG. 6B, the area of the marker portions 50 and 52 on the side surface 18 of the prime field portion 10 is the area of the marker portions 50 and 52 on the side surface 18 of the prime field portion 10 in FIG. 6 (a). It is 1/4. In sample 3 of FIG. 6 (c), the area of the marker portions 50 and 52 on the side surface 18 of the element body portion 10 is the area of the marker portions 50 and 52 on the side surface 18 of the element body portion 10 in FIG. 6 (a). It is 1/2. In sample 4 of FIG. 6 (d), the area of the marker portions 50 and 52 on the side surface 18 of the prime field portion 10 is the area of the marker portions 50 and 52 on the side surface 18 of the prime field portion 10 in FIG. 6 (a). It is 3/4.

In Samples 1 to 4, the marker portions 50 and 52 are formed by laminating two layers of insulating sheets on which markers are formed, as in FIGS. 3 (a) and 3 (b). The marker is composed of 45 wt% borosilicate glass, 20 wt% alumina, and 35 wt% inorganic additive added for the purpose of coloring, and has a thickness of 2 μm. The insulating sheet is made of 93 wt% borosilicate glass, 2 wt% alumina and 5 wt% inorganic additives and is 6 μm thick. The prime part 10 is made of 93 wt% borosilicate glass, 2 wt% alumina, and 5 wt% inorganic additives, and has a width of 0.2 mm, a length of 0.4 mm, and a height of 0. It is 3 mm.

The strength was evaluated by performing a pushing test with a pushing speed of 10 mm / min for the samples 1 to 4. The strength was evaluated for 20 samples each from sample 1 to sample 4. FIG. 7 is a diagram showing the experimental results of evaluating the intensities of Samples 1 to 4. The horizontal axis of FIG. 7 is the bending strength, and the vertical axis is the cumulative probability. As shown in FIG. 7, the strength of the prime field 10 of the sample 1 (Example 1) is higher than that of the sample 2 (Comparative Example 1), the sample 3 (Comparative Example 1), and the sample 4 (Comparative Example 1). it was high. From this, it can be seen that the strength of the prime field portion 10 can be improved by extending the marker portions 50 and 52 provided on the side surface 18 of the prime field portion 10 from the side on the upper surface 12 side to the side on the lower surface 14 side. This is because the marker portions 50 and 52 extend from the side on the upper surface 12 side to the side on the lower surface 14 side and are provided on the side surface 18, so that the dimensions in the width direction (X-axis direction) of the coil parts are non-uniform. It is considered that the force applied to the coil component from the outside is likely to be uniformly applied to the prime field portion 10 and the strength of the prime field portion 10 is improved.

Next, about an experiment evaluating whether the recognition error of the marker part by the appearance sorting device changes depending on the number of layers of the marker, the number of layers of the insulating sheet of the marker part, the thickness of the marker, and the thickness of the insulating sheet. explain. As shown in FIG. 8, the appearance sorting device 80 captures the surface of the prime field portion 10 by an image pickup means 82 such as a CCD camera, and recognizes the marker portions 50 and 52 based on the captured images.

In the experiment of recognizing the marker portion 50 by the appearance sorting device 80, regarding the insulating sheet on which the markers described in FIGS. 3 (a) and 3 (b) were formed, the number of layers of the markers and the insulating sheet of the marker portion were measured. A plurality of coil parts in which the marker portion 50 having a different number of layers, the thickness of the insulating sheet, and the thickness of the marker was formed on the surface of the prime field portion 10 were prepared. Then, it was evaluated whether or not the appearance sorting device 80 could recognize the marker portion 50 by imaging the surface of the prime field portion 10 with the imaging means 82 for the plurality of coil parts. The marker was formed of 45 wt% borosilicate glass, 20 wt% alumina, and 35 wt% inorganic additive added for the purpose of coloring. The insulating sheet was formed of 93 wt% borosilicate glass, 2 wt% alumina and 5 wt% inorganic additives. The prime part was formed of 93 wt% borosilicate glass, 2 wt% alumina, and 5 wt% inorganic additive.

FIG. 9 shows the experimental results regarding the recognition of the marker portion 50 by the appearance sorting device 80. As shown in FIG. 9, it can be seen that the number of recognition errors of the marker unit 50 by the appearance sorting device 80 can be reduced by setting the number of marker layers to two or more. In particular, when a plurality of markers are laminated and the thickness of the marker portion 50 (the total thickness of the plurality of markers and the thickness of the insulating sheet sandwiched between the plurality of markers) is 14 μm or more. It can be seen that the number of recognition errors in the marker portion is greatly reduced.

FIG. 10 is a diagram illustrating the reason why the number of recognition errors of the marker unit 50 is reduced. As shown in FIG. 10, the marker portion 50 is formed by laminating the insulating sheet 58a on which the marker 50a is formed and the insulating sheet 58b on which the marker 50b is formed to form the marker among the insulating sheets 58b. The portion 90 sandwiched between the 50a and the marker 50b is less likely to be irradiated with external light by the marker 50a and the marker 50b. Therefore, the portion 90 of the insulating sheet 58b sandwiched between the marker 50a and the marker 50b becomes the marker portion 50 that functions as a marker. From this, it is considered that the number of recognition errors of the marker portion was reduced by forming the marker portion by laminating a plurality of insulating sheets on which the marker was formed.

In this way, by laminating a plurality of insulating sheets on which markers are formed to form a marker portion, it is possible to increase the thickness of the marker portion while suppressing the thickness of the marker of each of the plurality of insulating sheets. For example, when the marker portion is formed by one insulating sheet on which a thick marker is formed, the insulating sheet is layered on the thick and soft marker paste to form a coil component, and the distortion of the molded body becomes large. However, by suppressing the thickness of the markers of each of the plurality of insulating sheets, it is possible to reduce the distortion during stacking.

According to the first embodiment, as shown in FIGS. 1 (a) and 1 (b), the upper surface 12 and the side surface 18 of the prime body portion 10 extend from the side in contact with the upper surface 12 to the side in contact with the lower surface 14. An exposed marker portion 50 is provided on the lower surface 14. As a result, as shown in FIG. 2, the marker portion 50 is recognized from above and from the side of the coil component 100 even when the coil axis of the coil element 30 is substantially parallel to the mounting surface of the circuit board in order to improve the Q value. be able to. Therefore, the direction (posture) of the coil component 100 can be identified. Further, since the marker portion 50 is provided on the side surface 18 of the prime body portion 10 extending from the side in contact with the upper surface 12 to the side in contact with the lower surface 14, as described in FIG. 7, the element body portion 10 is provided. The strength can be improved. Further, as shown in FIG. 3A, the marker portion 50 is formed by the markers 50a and 50b and the portion 90 sandwiched between the markers 50a and 50b in the insulating sheet 58b (insulating layer). ing. As a result, as described with reference to FIGS. 9 and 10, the recognition error of the marker unit 50 can be reduced.

Further, as described with reference to FIG. 9, the thickness of the marker portion 50 in the direction perpendicular to the side surface 18 of the element body portion 10 of the marker portion 50 is preferably 14 μm or more. As a result, the recognition error of the marker unit 50 can be further reduced. From the viewpoint of reducing the recognition error of the marker portion 50, the thickness of the marker portion 50 in the direction perpendicular to the side surface 18 of the element body portion 10 is preferably 17 μm or more, more preferably 20 μm or more, still more preferably 25 μm or more. In this case, preferably, the thickness of the markers 50a and 50b formed on the insulating sheets 58a and 58b in the direction perpendicular to the side surface 18 of the element body portion 10 is 1 μm or more, more preferably 1.5 μm or more. 2 μm or more is more preferable, and 4 μm or more is even more preferable. Further, preferably, the markers 50a and 50b and the insulating sheets 58a and 58b are formed containing glass and alumina. The fact that the thickness in the direction perpendicular to the side surface 18 of the element body portion 18 of the marker portion 50 is 14 μm or more means that the upper surface 12 of the element body portion 10 in FIGS. 1 (a) and 1 (b). The width W of the marker portion 50 on the lower surface 14 is 14 μm or more.

The thickness of the marker portion 50 in the direction perpendicular to the side surface 18 of the element body portion 10 is preferably 45 μm or less, more preferably 40 μm or less, and 35 μm or less from the viewpoint of securing the coil layer. More preferred. Further, the length (L in FIG. 1A) in the direction parallel to the side surface 18 of the element body portion 10 of the marker portion 50 is preferably 50 μm or more, more preferably 60 μm or more, still more preferably 70 μm or more.

Further, preferably, the markers 50a and 50b have a smaller transmittance of light (for example, visible light) than the insulating sheets 58a and 58b. As a result, as described with reference to FIG. 10, the portion 90 of the insulating sheet 58b sandwiched between the marker 50a and the marker 50b can easily function as a marker.

Further, preferably, the marker portion 50 is provided in a region of half or more of the side surface 18 of the prime field portion 10. Thereby, the strength of the prime field portion 10 can be further improved.

Further, preferably, as shown in FIGS. 1A and 1B, a marker portion 50 is provided on one side surface 18 of a pair of side surfaces 18 of the prime field portion 10, and the other side surface 18 is provided. A marker portion 52 is provided on the surface. As a result, the strength of the prime field portion 10 can be further improved. From the viewpoint of improving the strength of the prime field portion 10, the marker portion 50 is preferably provided on the side surface 18 closer to one end face 16 side of the pair of end faces 16, and the marker portion 52 is provided on the other end face 16. It is provided on the side surface 18 toward the side.

11 (a) and 11 (b) are perspective views of the coil component 200 according to the second embodiment. FIG. 11A is a perspective view seen from the upper surface 12 side of the prime field portion 10, and FIG. 11B is a perspective view seen from the lower surface 14 side of the prime field portion 10. As shown in FIGS. 11A and 11B, in the coil component 200 of the second embodiment, the marker portions 54 and 56 are provided on the surface of the prime field portion 10 in addition to the marker portions 50 and 52. There is. The marker portions 50, 52, 54, and 56 are provided to identify the direction (posture) of the coil component 200.

The marker portion 54 is provided extending from the side in contact with the upper surface 12 to the side in contact with the lower surface 14 on the side surface 18 provided with the marker portion 50 in the pair of side surfaces 18 of the prime body portion 10, and the upper surface 12 and the marker portion 54 are provided. It is exposed on the lower surface 14. The marker portion 56 is provided extending from the side in contact with the upper surface 12 to the side in contact with the lower surface 14 on the side surface 18 provided with the marker portion 52 in the pair of side surfaces 18 of the prime body portion 10, and the upper surface 12 and the marker portion 56 are provided. It is exposed on the lower surface 14. Thereby, similarly to the marker portions 50 and 52, the marker portions 54 and 56 can be discriminated not only from the side surface 18 side of the prime field portion 10 but also from the upper surface 12 side and the lower surface 14 side. The marker portions 54 and 56 may be provided on the outside of the surface of the prime field portion 10 like the marker portions 50 and 52, or may be seen from the outside through the prime field portion 10 slightly inside the surface of the prime field portion 10. It may be provided so that it can be done.

The marker portions 54 and 56 have a different color from the prime field portion 10, the marker portion 54 has a different color from the marker portion 50, and the marker portion 56 has a different color from the marker portion 52. That is, the marker unit 50 and the marker unit 54 differ in at least one of hue, lightness, and saturation, and the marker unit 52 and the marker unit 56 differ in at least one of hue, lightness, and saturation. For example, the marker portions 50 and 52 have a lower brightness than the prime field portion 10, and the marker portions 54 and 56 have a higher brightness than the prime field portion 10. The marker portions 50, 52, 54, and 56 are preferably opaque. The marker unit 54 and the marker unit 56 may have the same color or may have different colors. In the coil component 200 of the second embodiment, the coil element 30 is provided inside the prime field portion 10 as in the coil component 100 of the first embodiment, but this point will be described in the first embodiment. Therefore, the description is omitted here.

12 (a) is an enlarged partial cross-sectional view of a region provided with the marker portions 50 and 54, and FIG. 12 (b) is an enlarged partial cross-sectional view of the region provided with the marker portions 52 and 56. As shown in FIG. 12A, the marker portions 50 and 54 are formed by laminating an insulating sheet 58a on which the markers 50a and 54a are formed and an insulating sheet 58b on which the markers 50b and 54b are formed. ing. The marker 50a, the marker 50b, and the portion 90 of the insulating sheet 58b sandwiched between the marker 50a and the marker 50b form the marker portion 50. The marker 54a, the marker 54b, and the portion 94 sandwiched between the marker 54a and the marker 54b in the insulating sheet 58b form the marker portion 54.

As shown in FIG. 12B, the marker portions 52 and 56 are formed by laminating an insulating sheet 60a on which the markers 52a and 56a are formed and an insulating sheet 60b on which the markers 52b and 56b are formed. ing. The marker 52a, the marker 52b, and the portion 92 of the insulating sheet 60b sandwiched between the marker 52a and the marker 52b form the marker portion 52. The marker 56a, the marker 56b, and the portion 96 of the insulating sheet 60b sandwiched between the marker 56a and the marker 56b form the marker portion 56. The marker portions 50, 52, 54, and 56 are not limited to the case where two layers of the insulating sheets on which the markers are formed are laminated, and may be the case where three or more layers are laminated.

According to the second embodiment, as shown in FIGS. 11 (a) and 11 (b), the marker portion is added to the marker portion 50 on one side surface 18 of the pair of side surfaces 18 of the prime field portion 10. A marker portion 54 having a color different from that of 50 is provided. As a result, the marker unit 50 and the marker unit 54 can be recognized by comparing the colors of the marker unit 50 and the marker unit 54. That is, the marker portion 50 and the marker portion 54 can be recognized in a state in which the element body portion 10 is not easily affected. For example, the strength of the prime field portion 10 can be improved by forming the prime field portion 10 with a material in which alumina is mixed with glass, but the transparency of the prime field portion 10 becomes high depending on the content of alumina, and the internal coil element. It happens that 30 can be seen through. In such a case, the appearance sorting device 80 may not be able to recognize the marker portion only by providing one type of marker portion on one surface of the prime field portion 10. However, in the second embodiment, since the marker portions 50 and 54 can be recognized in a state where the element body portion 10 is not easily affected, the recognition error of the marker portions 50 and 54 can be reduced.

Further, as shown in FIGS. 11 (a) and 11 (b), the marker portion 50 and the marker portion 54 are preferably provided adjacent to each other. This makes it easier to compare the colors of the marker portions 50 and 54, so that the recognition error of the marker portion can be further reduced.

The marker portions 50, 52, 54, and 56 preferably have a different color from the prime field portion 10. Further, preferably, the marker portions 50 and 52 have a lower brightness than the prime field portion 10, and the marker portions 54 and 56 have a higher brightness than the prime field portion 10. In these cases, it becomes easy to compare the colors of the marker units 50 and 54 and the colors of the marker units 52 and 56, so that the recognition error of the marker unit can be reduced.

FIG. 13 is a cross-sectional view of the capacitor component 300 according to the third embodiment. As shown in FIG. 13, in the capacitor component 300 of the third embodiment, the capacitor conductor 38 is provided inside the prime field portion 10, and the capacitor element 36 is formed. In the capacitor component 300, the prime field portion 10 is formed of, for example, barium titanate (BaTIO ₃ ), calcium titanate (CaTIO ₃ ), strontium titanate (SrTiO ₃ ), or the like. The capacitor conductor 38 is made of a metal material such as copper, silver, nickel, or palladium. Since other configurations are the same as those in the first embodiment, the description thereof will be omitted.

In Examples 1 and 2, the case where the coil element 30 is formed inside the prime field portion 10 is shown as an example, but the case where the capacitor element 36 is formed as in the third embodiment may be used. It should be noted that other elements such as a thermistor element or a varistor element may be formed inside the prime field portion 10. The thermistor element and the varistor element can have an internal electrode structure similar to that of the capacitor element 36, for example.

FIG. 14 is a cross-sectional view of the electronic device 400 according to the fourth embodiment. As shown in FIG. 14, the electronic device 400 of the fourth embodiment includes a circuit board 70 and a coil component 100 of the first embodiment mounted on the circuit board 70. The coil component 100 is mounted on the circuit board 70 by joining the external electrode 40 to the electrode 72 provided on the mounting surface of the circuit board 70 by the solder 74. The coil component 100 is mounted on the circuit board 70 so that the coil shaft of the coil element 30 is substantially parallel to the mounting surface of the circuit board 70. It should be noted that "substantially parallel" allows a deviation of about a manufacturing error.

According to the fourth embodiment, the coil component 100 is mounted on the circuit board 70 so that the coil shaft of the coil element 30 is substantially parallel to the mounting surface of the circuit board 70. Even when the coil component 100 is mounted on the circuit board 70 with the coil axis oriented in such a direction, the marker portions 50 and 52 can be discriminated from the upper surface of the electronic device 400 as described in the first embodiment, so that the appearance can be selected. It can be better identified by the device. In Example 4, the case where the coil component 100 of the first embodiment is mounted on the circuit board 70 is shown as an example, but the coil component 200 of the second embodiment or the capacitor component 300 of the third embodiment is mounted. It may be present.

Although the examples of the present invention have been described in detail above, the present invention is not limited to such specific examples, and various modifications and variations are made within the scope of the gist of the present invention described in the claims. It can be changed.

10 Element body 12 Top surface 14 Bottom surface 16 End surface 18 Side surface 30 Coil element 32 Coil conductor 34 Drawer conductor 36 Capacitor element 38 Capacitor conductor 40 External electrode 50 Marker part 50a, 50b Marker 52 Marker part 52a, 52b Marker 54 Marker part 54a, 54b Marker 56 Marker part 56a, 56b Marker 58a, 58b Insulation sheet 60a, 60b Insulation sheet 70 Circuit board 72 Electrode 74 Solder 80 Appearance sorting device 82 Imaging means 90 to 96 Sandwiched part G1 to G15 Green sheet 100, 200 Coil Parts 300 Capacitor parts 400 Electronic devices

Claims (16)

A rectangular parallelepiped prime part made of an insulator,
Passive elements provided inside the prime field and
A first marker portion provided on the surface of the prime field portion is provided.
The first marker portion is a first insulation sandwiched between a plurality of first markers and a plurality of first markers among a plurality of first insulating sheets on which the first markers are formed and laminated . It is formed of a sex sheet and extends from the side of the prime body portion that is in contact with the second surface adjacent to the first surface to the side that is in contact with the third surface on the opposite side of the second surface. An electronic component provided and exposed on the second surface and the third surface. The electronic component according to claim 1, wherein the first marker portion has a thickness of 14 μm or more in a direction perpendicular to the first surface of the prime field portion. The electronic component according to claim 2, wherein the plurality of first markers have a thickness of 1 μm or more in a direction perpendicular to the first surface of the prime field portion. The electronic component according to claim 2 or 3, wherein the plurality of first markers and the plurality of first insulating sheets are formed of glass and aluminum oxide. The electronic component according to any one of claims 1 to 4, wherein the plurality of first markers have a smaller light transmittance than the plurality of first insulating sheets. The electronic component according to any one of claims 1 to 5, wherein the first marker portion is provided in a region of half or more of the first surface of the prime field portion. A second marker portion provided on the surface of the prime field portion is provided.
The second marker portion is a second insulation sandwiched between the plurality of second markers and the plurality of second markers among the plurality of second insulating sheets on which the second markers are formed and laminated . It is formed of a sex sheet, and is provided on a fourth surface of the prime body portion opposite to the first surface, extending from a side in contact with the second surface to a side in contact with the third surface. The electronic component according to any one of claims 1 to 6, which is exposed on the second surface and the third surface. The first marker portion is provided on the first surface of the prime field portion toward the fifth surface side intersecting the first surface, the second surface, the third surface, and the fourth surface. The electronic component according to claim 7, wherein the second marker portion is provided on the fourth surface of the prime field portion closer to the sixth surface side opposite to the fifth surface. The first marker is provided on the first surface of the prime body portion extending from the side in contact with the second surface to the side in contact with the third surface and exposed to the second surface and the third surface. The electronic component according to any one of claims 1 to 8, further comprising a third marker portion having a color different from that of the portion. The electronic component according to claim 9, wherein the first marker portion and the third marker portion differ from each other in at least one of the three color attributes. The electronic component according to claim 9 or 10, wherein the first marker portion and the third marker portion are provided adjacent to each other. The electronic component according to any one of claims 1 to 11, wherein the passive element is a coil element. The electronic component according to any one of claims 1 to 11, wherein the passive element is a capacitor element. The electronic component according to any one of claims 1 to 13 and
An electronic device including a circuit board on which the electronic component is mounted. The electronic device according to claim 14, wherein the electronic component has a coil element, and the coil axis of the coil element is mounted on the circuit board so as to be substantially parallel to the mounting surface of the circuit board. The process of forming markers on the surfaces of a plurality of first insulating sheets,
The process of forming conductors constituting a passive element on a plurality of second insulating sheets, and
The plurality of first insulating sheets and the plurality of second insulating sheets are laminated, and the second surface is from a side in contact with a second surface adjacent to the first surface on the first surface of the surface. The plurality of the first insulating sheets extending over the side in contact with the third surface on the opposite side and laminated with the plurality of markers exposed on the second surface and the third surface. An electron comprising a step of forming a rectangular parallelepiped-shaped element portion having a marker portion formed of a first insulating sheet sandwiched between the markers and the passive element provided inside. How to manufacture parts.

Images