JP7030060B2 - レチクル処理システム - Google Patents
レチクル処理システム Download PDFInfo
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- JP7030060B2 JP7030060B2 JP2018556414A JP2018556414A JP7030060B2 JP 7030060 B2 JP7030060 B2 JP 7030060B2 JP 2018556414 A JP2018556414 A JP 2018556414A JP 2018556414 A JP2018556414 A JP 2018556414A JP 7030060 B2 JP7030060 B2 JP 7030060B2
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- carrier
- reticle
- pins
- plate
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7096—Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
Claims (13)
- レチクル処理システムであって、
フレームに連結されたプレートを含む支持アセンブリと、
前記支持アセンブリに連結されたキャリアアセンブリであって、
前記プレートに連結されたキャリアベース、
前記キャリアベースの上に配置されたレチクル、
前記レチクルの上に配置され、前記レチクルへのアクセスを可能にする中央開口部を含むキャリアシールド、及び
前記キャリアベース、前記レチクル及び前記キャリアシールドを独立して支持するとともにこれらを相互に垂直に分離する複数のピン
を含むキャリアアセンブリと
を含み、前記キャリアアセンブリが上に向かって持ち上げられるまで、前記複数のピンが前記キャリアアセンブリを拡張された構成に保つことにより、前記キャリアベース、前記キャリアシールド及び前記レチクルが互いを圧縮し係合される、システム。 - 前記複数のピンが、前記プレートの上面から前記キャリアベースの第1の組の開口部を通って延びる第1の組のピンであって、前記レチクルの上で前記キャリアシールドを支持するために、前記キャリアシールドの底面と接触する第1の組のピンを更に含む、請求項1に記載のレチクル処理システム。
- 前記複数のピンが、前記プレートの前記上面から前記キャリアベースの第2の組の開口部を通って延びる第2の組のピンであって、前記キャリアベースの上で前記レチクルを支持するために前記レチクルと接触する第2の組のピンを更に含む、請求項2に記載のレチクル処理システム。
- 前記複数のピンが、前記プレートの前記上面から延びる第3の組のピンであって、前記プレートの上で前記キャリアベースを支持する第3の組のピンを更に含む、請求項2に記載のレチクル処理システム。
- 前記第3の組のピンの各々が、前記キャリアベースの底面と接触する上座面を含む、請求項4に記載のレチクル処理システム。
- レチクル処理システムであって、該レチクル処理システムは、
フレームに連結されたプレートを含む支持アセンブリと、
前記支持アセンブリに連結されたキャリアアセンブリであって、
前記プレートに連結されたキャリアベース、
前記キャリアベースの上に配置されたレチクル、及び
前記レチクルの上に配置され、前記レチクルへのアクセスを可能にする中央開口部を含むキャリアシールド
を含むキャリアアセンブリと、
前記プレートの上面から前記キャリアベースの第1の組の開口部を通って延びる第1の組のピンであって、前記レチクルの上で前記キャリアシールドを支持するために、前記キャリアシールドの底面と接触する第1の組のピンと、
前記プレートの前記上面から延びる第3の組のピンであって、前記プレートの上で前記キャリアベースを支持する第3の組のピンと、
を含み、
前記第3の組のピンの各々が、前記キャリアベースの底面と接触する上座面を含み、
前記第3の組のピンの前記上座面が凸状であり、かつ前記プレートの中心部分に向かって下に傾斜する、レチクル処理システム。 - 前記キャリアベースが第1の間隙によって前記プレートから垂直に分離し、前記レチクルが第2の間隙によって前記キャリアベースから垂直に分離し、前記キャリアシールドが第3の間隙によって前記レチクルから垂直に分離する、請求項1に記載のレチクル処理システム。
- 前記キャリアアセンブリを前記支持アセンブリに位置合わせするためのセンサシステムを更に含む、請求項1に記載のレチクル処理システム。
- レチクルブランクを処理する方法であって、
キャリアベース、キャリアシールド、及びレチクルブランクを含むキャリアアセンブリを提供することと、
フレームに連結されたプレートを含む支持アセンブリの上に前記キャリアベース及び前記キャリアシールドを載置することと、
前記キャリアシールドの開口部内に前記レチクルブランクを載置することと、
前記支持アセンブリから前記キャリアアセンブリを持ち上げることにより、前記キャリアベース、前記キャリアシールド及び前記レチクルブランクを相互に係合させることと、
前記支持アセンブリから前記キャリアアセンブリを除去することと
を含む方法。 - 前記プレートの上面から延びる複数のピンの上に前記キャリアアセンブリを載置することを更に含み、前記キャリアベースが第1の間隙によって前記プレートから垂直に分離し、前記レチクルブランクが第2の間隙によって前記キャリアベースから垂直に分離し、前記キャリアシールドが第3の間隙によって前記レチクルブランクから垂直に分離するように、前記複数のピンが前記キャリアアセンブリを支持する、請求項9に記載の方法。
- センサシステムを使用して、前記キャリアアセンブリの位置を特定することと、
前記キャリアアセンブリの特定された前記位置に従って、前記支持アセンブリの上に前記キャリアアセンブリを載置することと
を更に含む、請求項9に記載の方法。 - 前記プレートの上面から前記キャリアベースの第1の組の開口部を通って延び、前記レチクルの上で前記キャリアシールドを支持する、第1の組のピンの上に前記キャリアシールドを載置することと、
前記プレートの前記上面から前記キャリアベースの第2の組の開口部を通って延び、前記キャリアベースの上で前記レチクルを支持する、第2の組のピンの上に前記キャリアベースを載置することと、
前記プレートの前記上面から延び、前記プレートの上で前記キャリアベースを支持する、第3の組のピンの上に前記キャリアベースを載置することと
を更に含む、請求項9に記載の方法。 - レチクルブランクを処理する方法であって、
キャリアベース、キャリアシールド、及びレチクルブランクを含むキャリアアセンブリを提供することと、
フレームに連結されたプレートを含む支持アセンブリの上に前記キャリアベース及び前記キャリアシールドを載置することと、
前記キャリアシールドの開口部内に前記レチクルブランクを載置することと、
前記プレートの上面から前記キャリアベースの第1の組の開口部を通って延び、前記レチクルの上で前記キャリアシールドを支持する、第1の組のピンの上に前記キャリアシールドを載置することと、
前記プレートの前記上面から前記キャリアベースの第2の組の開口部を通って延び、前記キャリアベースの上で前記レチクルを支持する、第2の組のピンの上に前記キャリアベースを載置することと、
前記プレートの前記上面から延び、前記プレートの上で前記キャリアベースを支持する、第3の組のピンの上に前記キャリアベースを載置することと
凸状であり、かつ前記プレートの中心部分に向かって下に傾斜する、前記第3の組のピンの上座面の上に前記キャリアベースを載置することと
前記支持アセンブリから前記キャリアアセンブリを除去することと
を含む、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/140,633 US10256132B2 (en) | 2016-04-28 | 2016-04-28 | Reticle processing system |
US15/140,633 | 2016-04-28 | ||
PCT/US2017/029585 WO2017189695A1 (en) | 2016-04-28 | 2017-04-26 | Reticle processing system |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019519910A JP2019519910A (ja) | 2019-07-11 |
JP7030060B2 true JP7030060B2 (ja) | 2022-03-04 |
Family
ID=60158904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018556414A Active JP7030060B2 (ja) | 2016-04-28 | 2017-04-26 | レチクル処理システム |
Country Status (4)
Country | Link |
---|---|
US (2) | US10256132B2 (ja) |
JP (1) | JP7030060B2 (ja) |
TW (1) | TWI736613B (ja) |
WO (1) | WO2017189695A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW202129045A (zh) * | 2019-12-05 | 2021-08-01 | 美商應用材料股份有限公司 | 多陰極沉積系統與方法 |
TW202134774A (zh) * | 2019-12-05 | 2021-09-16 | 美商應用材料股份有限公司 | 光標處理系統 |
US11860528B2 (en) * | 2020-12-21 | 2024-01-02 | Applied Materials, Inc. | Multi-chamber substrate processing platform |
US11710621B2 (en) | 2021-04-28 | 2023-07-25 | Applied Materials, Inc. | Direct lift cathode for lithography mask chamber |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015023606A1 (en) | 2013-08-12 | 2015-02-19 | Applied Materials Israel, Ltd. | System and method for attaching a mask to a mask holder |
WO2018044678A1 (en) | 2016-08-27 | 2018-03-08 | Entegris, Inc. | Reticle pod having side containment of reticle |
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JP3243168B2 (ja) | 1996-02-06 | 2002-01-07 | キヤノン株式会社 | 原版保持装置およびこれを用いた露光装置 |
KR100383260B1 (ko) * | 2001-03-08 | 2003-05-09 | 삼성전자주식회사 | 레티클 위치감지장치기능을 갖는 포크 암을 구비한 레이클이송장치 |
US6646720B2 (en) | 2001-09-21 | 2003-11-11 | Intel Corporation | Euv reticle carrier with removable pellicle |
KR101019389B1 (ko) * | 2003-01-23 | 2011-03-07 | 가부시키가이샤 니콘 | 노광 장치 |
KR20040079536A (ko) * | 2003-03-07 | 2004-09-16 | 에프원 주식회사 | 와인딩 타입의 셀 스태킹머신용 셀센터링 유니트 |
US7236233B2 (en) | 2003-10-27 | 2007-06-26 | Asml Netherlands B.V. | Assembly of a reticle holder and a reticle |
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JP4710308B2 (ja) * | 2004-10-29 | 2011-06-29 | 株式会社ニコン | レチクル搬送装置、露光装置、及びレチクルの搬送方法 |
US7969548B2 (en) * | 2006-05-22 | 2011-06-28 | Asml Netherlands B.V. | Lithographic apparatus and lithographic apparatus cleaning method |
TWI501910B (zh) * | 2011-11-17 | 2015-10-01 | Gudeng Prec Ind Co Ltd | 具有排水結構之極紫外光光罩儲存傳送盒 |
CN104380444A (zh) * | 2012-06-29 | 2015-02-25 | 株式会社半导体能源研究所 | 半导体装置 |
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-
2016
- 2016-04-28 US US15/140,633 patent/US10256132B2/en active Active
-
2017
- 2017-04-24 TW TW106113600A patent/TWI736613B/zh active
- 2017-04-26 WO PCT/US2017/029585 patent/WO2017189695A1/en active Application Filing
- 2017-04-26 JP JP2018556414A patent/JP7030060B2/ja active Active
-
2019
- 2019-02-21 US US16/281,439 patent/US10831112B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015023606A1 (en) | 2013-08-12 | 2015-02-19 | Applied Materials Israel, Ltd. | System and method for attaching a mask to a mask holder |
WO2018044678A1 (en) | 2016-08-27 | 2018-03-08 | Entegris, Inc. | Reticle pod having side containment of reticle |
Also Published As
Publication number | Publication date |
---|---|
US20190189499A1 (en) | 2019-06-20 |
WO2017189695A1 (en) | 2017-11-02 |
US20170315437A1 (en) | 2017-11-02 |
US10256132B2 (en) | 2019-04-09 |
TWI736613B (zh) | 2021-08-21 |
US10831112B2 (en) | 2020-11-10 |
JP2019519910A (ja) | 2019-07-11 |
TW201802570A (zh) | 2018-01-16 |
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