JP7019681B2 - 回路基板への無はんだ実装のためのコネクタアセンブリ - Google Patents

回路基板への無はんだ実装のためのコネクタアセンブリ Download PDF

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Publication number
JP7019681B2
JP7019681B2 JP2019517051A JP2019517051A JP7019681B2 JP 7019681 B2 JP7019681 B2 JP 7019681B2 JP 2019517051 A JP2019517051 A JP 2019517051A JP 2019517051 A JP2019517051 A JP 2019517051A JP 7019681 B2 JP7019681 B2 JP 7019681B2
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Japan
Prior art keywords
wafer
along
mounting direction
assembly
connector assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019517051A
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English (en)
Japanese (ja)
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JP2019530182A (ja
JP2019530182A5 (enExample
Inventor
コク ホー イ，
サウジ バンドュ，
ユンロン チィアォ，
ラオ エル． ヴィタパリ，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
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Publication of JP2019530182A publication Critical patent/JP2019530182A/ja
Publication of JP2019530182A5 publication Critical patent/JP2019530182A5/ja
Priority to JP2022014589A priority Critical patent/JP2022048298A/ja
Application granted granted Critical
Publication of JP7019681B2 publication Critical patent/JP7019681B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/516—Means for holding or embracing insulating body, e.g. casing, hoods
    • H01R13/518—Means for holding or embracing insulating body, e.g. casing, hoods for holding or embracing several coupling parts, e.g. frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
JP2019517051A 2016-09-29 2017-09-28 回路基板への無はんだ実装のためのコネクタアセンブリ Active JP7019681B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022014589A JP2022048298A (ja) 2016-09-29 2022-02-02 回路基板への無はんだ実装のためのコネクタアセンブリ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662401322P 2016-09-29 2016-09-29
US62/401,322 2016-09-29
PCT/IB2017/055968 WO2018060922A1 (en) 2016-09-29 2017-09-28 Connector assembly for solderless mounting to a circuit board

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022014589A Division JP2022048298A (ja) 2016-09-29 2022-02-02 回路基板への無はんだ実装のためのコネクタアセンブリ

Publications (3)

Publication Number Publication Date
JP2019530182A JP2019530182A (ja) 2019-10-17
JP2019530182A5 JP2019530182A5 (enExample) 2020-11-12
JP7019681B2 true JP7019681B2 (ja) 2022-02-15

Family

ID=60083373

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019517051A Active JP7019681B2 (ja) 2016-09-29 2017-09-28 回路基板への無はんだ実装のためのコネクタアセンブリ
JP2022014589A Withdrawn JP2022048298A (ja) 2016-09-29 2022-02-02 回路基板への無はんだ実装のためのコネクタアセンブリ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022014589A Withdrawn JP2022048298A (ja) 2016-09-29 2022-02-02 回路基板への無はんだ実装のためのコネクタアセンブリ

Country Status (4)

Country Link
US (1) US11462845B2 (enExample)
JP (2) JP7019681B2 (enExample)
CN (1) CN109792114B (enExample)
WO (1) WO2018060922A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11462845B2 (en) * 2016-09-29 2022-10-04 3M Innovative Properties Company Connector assembly for solderless mounting to a circuit board
US10700452B2 (en) 2018-05-14 2020-06-30 3M Innovative Properties Company Connector terminal
EP4097800A4 (en) * 2020-01-27 2024-02-14 Amphenol Corporation Electrical connector with high speed mounting interface
CN119812829A (zh) * 2020-03-18 2025-04-11 东莞立讯技术有限公司 转接头连接器
WO2022185138A1 (en) * 2021-03-05 2022-09-09 3M Innovative Properties Company Cable assembly including printed circuit board
CN113224597B (zh) * 2021-04-16 2023-04-14 领翌技术(横琴)有限公司 电缆连接器和电子设备
CN116111381A (zh) * 2021-11-11 2023-05-12 华为技术有限公司 线缆连接器、线缆连接器组件及电子设备
JP2024060780A (ja) * 2022-10-20 2024-05-07 日本航空電子工業株式会社 コネクタ
US12476391B1 (en) * 2025-02-21 2025-11-18 Te Connectivity Solutions Gmbh Direct wire terminal assembly

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6776629B2 (en) 2002-06-13 2004-08-17 Fci Americas Technology, Inc. Connector for mounting to mating connector, and shield therefor
JP2008018633A (ja) 2006-07-13 2008-01-31 Sumitomo Wiring Syst Ltd インサート成形品の製造方法およびインサート成形用の成形型
JP2014157718A (ja) 2013-02-15 2014-08-28 Hitachi Metals Ltd ケーブルコネクタおよびケーブルアッセンブリ
US8926342B2 (en) 2011-10-24 2015-01-06 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
WO2015079845A1 (ja) 2013-11-29 2015-06-04 株式会社村田製作所 金属間化合物の生成方法および金属間化合物を用いた接続対象物の接続方法
WO2016112384A1 (en) 2015-01-11 2016-07-14 Molex, Llc Wire to board connectors suitable for use in bypass routing assemblies

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3586962A (en) * 1969-02-28 1971-06-22 Edward C Rebstock Battery cell monitoring apparatus
US4095867A (en) * 1974-10-10 1978-06-20 Bunker Ramo Corporation Component connection system
US4006388A (en) * 1975-03-03 1977-02-01 Hughes Aircraft Company Thermally controlled electronic system package
US4533187A (en) * 1983-01-06 1985-08-06 Augat Inc. Dual beam connector
US4615578A (en) * 1984-12-05 1986-10-07 Raychem Corporation Mass termination device and connection assembly
US4619490A (en) * 1984-12-18 1986-10-28 Raychem Corporation Guidance and retention device and connector assembly
US4591225A (en) * 1985-01-14 1986-05-27 Molex Incorporated Arrangement for interconnecting a printed circuit board with a multi-conductor cable
SE450534B (sv) * 1985-10-03 1987-06-29 Bofors Ab Mangpoligt kontaktdon
US4770639A (en) * 1987-03-02 1988-09-13 Switchcraft, Inc. Channelized jackfield
JPH0414372U (enExample) * 1990-05-28 1992-02-05
US6409521B1 (en) * 1997-05-06 2002-06-25 Gryphics, Inc. Multi-mode compliant connector and replaceable chip module utilizing the same
US6089920A (en) * 1998-05-04 2000-07-18 Micron Technology, Inc. Modular die sockets with flexible interconnects for packaging bare semiconductor die
US6923681B1 (en) 1998-05-22 2005-08-02 Raytheon Company Electrical assembly for solderless interconnection of circuit boards in a stacked configuration
US6441315B1 (en) * 1998-11-10 2002-08-27 Formfactor, Inc. Contact structures with blades having a wiping motion
US7137830B2 (en) * 2002-03-18 2006-11-21 Nanonexus, Inc. Miniaturized contact spring
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6183269B1 (en) * 2000-01-27 2001-02-06 Itt Manufacturing Enterprises, Inc. Termination adaptor for PCB
US6641430B2 (en) * 2000-02-14 2003-11-04 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
CN1206775C (zh) 2000-06-29 2005-06-15 3M创新有限公司 高速连接器
US7011530B2 (en) * 2002-05-24 2006-03-14 Sitaraman Suresh K Multi-axis compliance spring
US7270573B2 (en) * 2002-08-30 2007-09-18 Fci Americas Technology, Inc. Electrical connector with load bearing features
US6926553B2 (en) * 2003-06-19 2005-08-09 Hon Hai Precision Ind. Co., Ltd. Cable assembly with improved grounding means
DE10300532B4 (de) * 2003-01-09 2010-11-11 Qimonda Ag System mit mindestens einer Test-Sockel-Vorrichtung zum Testen von Halbleiter-Bauelementen
WO2004093252A2 (en) * 2003-04-11 2004-10-28 Neoconix, Inc. Electrical connector and method for making
US7244125B2 (en) * 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US6870381B2 (en) * 2003-06-27 2005-03-22 Formfactor, Inc. Insulative covering of probe tips
US6971929B2 (en) * 2004-03-31 2005-12-06 Itt Manufacturing Enterprises, Inc. Modular high density connector
US7371117B2 (en) * 2004-09-30 2008-05-13 Amphenol Corporation High speed, high density electrical connector
US20060079102A1 (en) * 2004-10-13 2006-04-13 The Ludlow Company Lp Cable terminal with flexible contacts
KR100687027B1 (ko) * 2005-02-22 2007-02-26 세크론 주식회사 프로브와 프로브 카드 구조 및 그 제조 방법
CN201075451Y (zh) * 2007-06-21 2008-06-18 富士康(昆山)电脑接插件有限公司 电连接器
WO2009091598A2 (en) * 2008-01-17 2009-07-23 Amphenol Corporation Electrical connector assembly
KR20090082783A (ko) * 2008-01-28 2009-07-31 삼성전자주식회사 Ｅｄｓ 공정용 프로브 카드 어셈블리
US8342888B2 (en) * 2008-08-28 2013-01-01 Molex Incorporated Connector with overlapping ground configuration
JP5684710B2 (ja) * 2008-09-23 2015-03-18 アンフェノール コーポレイション 高密度電気コネクタ
KR20100110023A (ko) * 2009-04-02 2010-10-12 삼성전기주식회사 커넥터
JP2011070776A (ja) * 2009-09-23 2011-04-07 Sumitomo Wiring Syst Ltd 雄コネクタおよび該雄コネクタを備えたプリント基板
TWM377746U (en) * 2009-09-30 2010-04-01 Hon Hai Prec Ind Co Ltd Electrical connector
CN102823073A (zh) * 2010-02-01 2012-12-12 3M创新有限公司 电连接器和组件
CN107069274B (zh) * 2010-05-07 2020-08-18 安费诺有限公司 高性能线缆连接器
US8485831B2 (en) * 2011-01-06 2013-07-16 International Business Machines Corporation Tall mezzanine connector
US8657627B2 (en) * 2011-02-02 2014-02-25 Amphenol Corporation Mezzanine connector
DE102011006867A1 (de) * 2011-04-06 2012-10-11 Robert Bosch Gmbh Steckverbinder zur Direktkontaktierung auf einer Leiterplatte
US9142921B2 (en) 2013-02-27 2015-09-22 Molex Incorporated High speed bypass cable for use with backplanes
WO2014134773A1 (en) * 2013-03-04 2014-09-12 3M Innovative Properties Company Electrical interconnection system and electrical connectors for the same
DE102013008324A1 (de) * 2013-05-08 2014-11-13 Feinmetall Gmbh Elektrische Kontaktiervorrichtung
CN105580210B (zh) * 2013-09-04 2017-07-07 莫列斯有限公司 设有旁路线缆的连接器系统
CN112234393B (zh) * 2014-01-22 2022-09-13 安费诺有限公司 电连接器、线缆组件、电气组件以及印刷电路板
CN107113994B (zh) * 2015-01-11 2019-12-27 莫列斯有限公司 芯片封装旁路组件
CN204464524U (zh) * 2015-01-23 2015-07-08 康舒电子(东莞)有限公司 免焊接的电源端子组件
DE112016002059T5 (de) * 2015-05-04 2018-01-18 Molex, Llc Rechenvorrichtung, die eine Bypass-Einheit verwendet
US11462845B2 (en) * 2016-09-29 2022-10-04 3M Innovative Properties Company Connector assembly for solderless mounting to a circuit board
WO2018231822A1 (en) * 2017-06-13 2018-12-20 Molex, Llc High density receptacle
US10522931B2 (en) * 2017-07-28 2019-12-31 Molex, Llc High density receptacle
US11070006B2 (en) * 2017-08-03 2021-07-20 Amphenol Corporation Connector for low loss interconnection system
KR102737332B1 (ko) * 2019-10-24 2024-12-04 몰렉스 엘엘씨 커넥터 조립체

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6776629B2 (en) 2002-06-13 2004-08-17 Fci Americas Technology, Inc. Connector for mounting to mating connector, and shield therefor
JP2008018633A (ja) 2006-07-13 2008-01-31 Sumitomo Wiring Syst Ltd インサート成形品の製造方法およびインサート成形用の成形型
US8926342B2 (en) 2011-10-24 2015-01-06 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
JP2014157718A (ja) 2013-02-15 2014-08-28 Hitachi Metals Ltd ケーブルコネクタおよびケーブルアッセンブリ
WO2015079845A1 (ja) 2013-11-29 2015-06-04 株式会社村田製作所 金属間化合物の生成方法および金属間化合物を用いた接続対象物の接続方法
WO2016112384A1 (en) 2015-01-11 2016-07-14 Molex, Llc Wire to board connectors suitable for use in bypass routing assemblies

Also Published As

Publication number Publication date
CN109792114A (zh) 2019-05-21
JP2019530182A (ja) 2019-10-17
JP2022048298A (ja) 2022-03-25
CN109792114B (zh) 2021-05-25
US11462845B2 (en) 2022-10-04
WO2018060922A1 (en) 2018-04-05
US20210296804A1 (en) 2021-09-23

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