JP7014884B1 - 表面処理銅箔、銅張積層板及びプリント配線板 - Google Patents

表面処理銅箔、銅張積層板及びプリント配線板 Download PDF

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Publication number
JP7014884B1
JP7014884B1 JP2020214142A JP2020214142A JP7014884B1 JP 7014884 B1 JP7014884 B1 JP 7014884B1 JP 2020214142 A JP2020214142 A JP 2020214142A JP 2020214142 A JP2020214142 A JP 2020214142A JP 7014884 B1 JP7014884 B1 JP 7014884B1
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Japan
Prior art keywords
copper foil
treated
layer
treated copper
surface treatment
Prior art date
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Active
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JP2020214142A
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English (en)
Japanese (ja)
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JP2022100020A (ja
Inventor
裕士 石野
慎介 坂東
宣明 宮本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=80774237&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP7014884(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2020214142A priority Critical patent/JP7014884B1/ja
Priority to JP2021118211A priority patent/JP7027602B1/ja
Priority to PCT/JP2021/046877 priority patent/WO2022138513A1/ja
Priority to KR1020237020774A priority patent/KR20230109728A/ko
Priority to CN202180085897.0A priority patent/CN116669948A/zh
Priority to TW110147726A priority patent/TWI806296B/zh
Publication of JP7014884B1 publication Critical patent/JP7014884B1/ja
Application granted granted Critical
Priority to JP2022022395A priority patent/JP2022100307A/ja
Publication of JP2022100020A publication Critical patent/JP2022100020A/ja
Active legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/22—Electroplating: Baths therefor from solutions of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2020214142A 2020-12-23 2020-12-23 表面処理銅箔、銅張積層板及びプリント配線板 Active JP7014884B1 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2020214142A JP7014884B1 (ja) 2020-12-23 2020-12-23 表面処理銅箔、銅張積層板及びプリント配線板
JP2021118211A JP7027602B1 (ja) 2020-12-23 2021-07-16 表面処理銅箔、銅張積層板及びプリント配線板
CN202180085897.0A CN116669948A (zh) 2020-12-23 2021-12-17 表面处理铜箔、覆铜积层板及印刷配线板
KR1020237020774A KR20230109728A (ko) 2020-12-23 2021-12-17 표면 처리 구리박, 동장 적층판 및 프린트 배선판
PCT/JP2021/046877 WO2022138513A1 (ja) 2020-12-23 2021-12-17 表面処理銅箔、銅張積層板及びプリント配線板
TW110147726A TWI806296B (zh) 2020-12-23 2021-12-20 表面處理銅箔、覆銅積層板及印刷配線板
JP2022022395A JP2022100307A (ja) 2020-12-23 2022-02-16 表面処理銅箔、銅張積層板及びプリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020214142A JP7014884B1 (ja) 2020-12-23 2020-12-23 表面処理銅箔、銅張積層板及びプリント配線板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021118211A Division JP7027602B1 (ja) 2020-12-23 2021-07-16 表面処理銅箔、銅張積層板及びプリント配線板

Publications (2)

Publication Number Publication Date
JP7014884B1 true JP7014884B1 (ja) 2022-02-01
JP2022100020A JP2022100020A (ja) 2022-07-05

Family

ID=80774237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020214142A Active JP7014884B1 (ja) 2020-12-23 2020-12-23 表面処理銅箔、銅張積層板及びプリント配線板

Country Status (5)

Country Link
JP (1) JP7014884B1 (zh)
KR (1) KR20230109728A (zh)
CN (1) CN116669948A (zh)
TW (1) TWI806296B (zh)
WO (1) WO2022138513A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017141501A (ja) 2016-02-05 2017-08-17 Ｊｘ金属株式会社 フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器
WO2019163962A1 (ja) 2018-02-23 2019-08-29 古河電気工業株式会社 電解銅箔、並びに該電解銅箔を用いたリチウムイオン二次電池用負極、リチウムイオン二次電池、銅張積層板及びプリント配線板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003027162A (ja) * 2001-07-13 2003-01-29 Nippon Mining & Metals Co Ltd 積層板用銅合金箔
JP4115293B2 (ja) * 2003-02-17 2008-07-09 古河サーキットフォイル株式会社 チップオンフィルム用銅箔
KR100654737B1 (ko) * 2004-07-16 2006-12-08 일진소재산업주식회사 미세회로기판용 표면처리동박의 제조방법 및 그 동박
CN103266335B (zh) * 2007-09-28 2016-08-10 Jx日矿日石金属株式会社 印刷电路用铜箔及覆铜箔层压板
TW200934330A (en) * 2007-11-26 2009-08-01 Furukawa Electric Co Ltd Surface treated copper foil and method for surface treating the same, and stack circuit board
US8512873B2 (en) * 2008-07-22 2013-08-20 Furukawa Electric Co., Ltd. Surface treated copper foil and copper clad laminate
JP4927963B2 (ja) * 2010-01-22 2012-05-09 古河電気工業株式会社 表面処理銅箔、その製造方法及び銅張積層基板
JP7017369B2 (ja) * 2017-10-27 2022-02-08 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
US11375624B2 (en) * 2018-04-27 2022-06-28 Jx Nippon Mining & Metals Corporation Surface treated copper foil, copper clad laminate, and printed circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017141501A (ja) 2016-02-05 2017-08-17 Ｊｘ金属株式会社 フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器
WO2019163962A1 (ja) 2018-02-23 2019-08-29 古河電気工業株式会社 電解銅箔、並びに該電解銅箔を用いたリチウムイオン二次電池用負極、リチウムイオン二次電池、銅張積層板及びプリント配線板

Also Published As

Publication number Publication date
JP2022100020A (ja) 2022-07-05
WO2022138513A1 (ja) 2022-06-30
TW202233898A (zh) 2022-09-01
TWI806296B (zh) 2023-06-21
CN116669948A (zh) 2023-08-29
KR20230109728A (ko) 2023-07-20

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