JP7008121B1 - 電磁波シールド材 - Google Patents

電磁波シールド材 Download PDF

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Publication number
JP7008121B1
JP7008121B1 JP2020204491A JP2020204491A JP7008121B1 JP 7008121 B1 JP7008121 B1 JP 7008121B1 JP 2020204491 A JP2020204491 A JP 2020204491A JP 2020204491 A JP2020204491 A JP 2020204491A JP 7008121 B1 JP7008121 B1 JP 7008121B1
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JP
Japan
Prior art keywords
metal layer
electromagnetic wave
layer
ground connection
wave shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020204491A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022091579A (ja
Inventor
悠貴友 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2020204491A priority Critical patent/JP7008121B1/ja
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to KR1020237016603A priority patent/KR20230088470A/ko
Priority to US18/265,771 priority patent/US12108583B2/en
Priority to PCT/JP2021/035726 priority patent/WO2022123864A1/ja
Priority to EP21902968.3A priority patent/EP4262332A4/de
Priority to CN202180075401.1A priority patent/CN116547140A/zh
Priority to TW110140572A priority patent/TWI790797B/zh
Application granted granted Critical
Publication of JP7008121B1 publication Critical patent/JP7008121B1/ja
Publication of JP2022091579A publication Critical patent/JP2022091579A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/42—Alternating layers, e.g. ABAB(C), AABBAABB(C)
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/737—Dimensions, e.g. volume or area
    • B32B2307/7375—Linear, e.g. length, distance or width
    • B32B2307/7376—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
JP2020204491A 2020-12-09 2020-12-09 電磁波シールド材 Active JP7008121B1 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2020204491A JP7008121B1 (ja) 2020-12-09 2020-12-09 電磁波シールド材
US18/265,771 US12108583B2 (en) 2020-12-09 2021-09-28 Electromagnetic shielding material
PCT/JP2021/035726 WO2022123864A1 (ja) 2020-12-09 2021-09-28 電磁波シールド材
EP21902968.3A EP4262332A4 (de) 2020-12-09 2021-09-28 Material zur elektromagnetischen abschirmung
KR1020237016603A KR20230088470A (ko) 2020-12-09 2021-09-28 전자파 실드재
CN202180075401.1A CN116547140A (zh) 2020-12-09 2021-09-28 电磁波屏蔽材料
TW110140572A TWI790797B (zh) 2020-12-09 2021-11-01 電磁波屏蔽材料、電氣設備或電子設備用的覆蓋材料或外包裝材料及電氣設備或電子設備

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020204491A JP7008121B1 (ja) 2020-12-09 2020-12-09 電磁波シールド材

Publications (2)

Publication Number Publication Date
JP7008121B1 true JP7008121B1 (ja) 2022-01-25
JP2022091579A JP2022091579A (ja) 2022-06-21

Family

ID=80629667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020204491A Active JP7008121B1 (ja) 2020-12-09 2020-12-09 電磁波シールド材

Country Status (7)

Country Link
US (1) US12108583B2 (de)
EP (1) EP4262332A4 (de)
JP (1) JP7008121B1 (de)
KR (1) KR20230088470A (de)
CN (1) CN116547140A (de)
TW (1) TWI790797B (de)
WO (1) WO2022123864A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024090069A1 (ja) * 2022-10-26 2024-05-02 Ｊｘ金属株式会社 金属樹脂複合電磁波シールド材料
WO2024219134A1 (ja) * 2023-04-20 2024-10-24 日立Astemo株式会社 導電性接着剤及びこれを用いた電子制御装置
CN116709759A (zh) * 2023-07-03 2023-09-05 广州方邦电子股份有限公司 一种电磁屏蔽膜及线路板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018171741A (ja) 2017-03-31 2018-11-08 Ｊｘ金属株式会社 積層体及び成形品の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07290449A (ja) 1994-04-27 1995-11-07 Matsushita Electric Works Ltd シート状の電磁波シールド成形材料及びその製造方法
JPH0990449A (ja) 1995-09-21 1997-04-04 Nippon Telegr & Teleph Corp <Ntt> 多波長光源
JP4235396B2 (ja) 2002-03-29 2009-03-11 真和工業株式会社 インバータカバー
TWI304321B (en) * 2002-12-27 2008-12-11 Toray Industries Layered products, electromagnetic wave shielding molded articles and method for production thereof
JP4602680B2 (ja) 2004-03-22 2010-12-22 株式会社オーツカ 電磁波シールド構造
KR100962924B1 (ko) 2006-07-14 2010-06-10 삼성코닝정밀소재 주식회사 전자파 차폐용 광학 부재, 이를 포함하는 광학 필터 및디스플레이 장치
JP2010278119A (ja) 2009-05-27 2010-12-09 Dainippon Printing Co Ltd 電磁波遮蔽材
JP2012053234A (ja) 2010-08-31 2012-03-15 Dainippon Printing Co Ltd Ｐｄｐ用前面フィルタの製造方法
JP6220132B2 (ja) 2013-02-21 2017-10-25 Ｊｘ金属株式会社 銅箔、銅張積層体、フレキシブル配線板及び立体成型体
US9480155B2 (en) 2014-07-10 2016-10-25 Apple Inc. Flexible cables in electronic devices with moving components
JP6278922B2 (ja) 2015-03-30 2018-02-14 Ｊｘ金属株式会社 電磁波シールド材
JP6129232B2 (ja) * 2015-03-31 2017-05-17 Ｊｘ金属株式会社 電磁波シールド材
JP6379071B2 (ja) * 2015-06-15 2018-08-22 Ｊｘ金属株式会社 電磁波シールド材
JP6341948B2 (ja) * 2016-03-31 2018-06-13 Ｊｘ金属株式会社 電磁波シールド材
JP6883449B2 (ja) * 2017-03-13 2021-06-09 Ｊｘ金属株式会社 電磁波シールド材

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018171741A (ja) 2017-03-31 2018-11-08 Ｊｘ金属株式会社 積層体及び成形品の製造方法

Also Published As

Publication number Publication date
TW202224552A (zh) 2022-06-16
US12108583B2 (en) 2024-10-01
CN116547140A (zh) 2023-08-04
WO2022123864A1 (ja) 2022-06-16
EP4262332A1 (de) 2023-10-18
JP2022091579A (ja) 2022-06-21
US20240057305A1 (en) 2024-02-15
EP4262332A4 (de) 2024-06-12
TWI790797B (zh) 2023-01-21
KR20230088470A (ko) 2023-06-19

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