JP7004181B2 - プリント配線板形成用エポキシ樹脂組成物 - Google Patents

プリント配線板形成用エポキシ樹脂組成物 Download PDF

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Publication number
JP7004181B2
JP7004181B2 JP2018546382A JP2018546382A JP7004181B2 JP 7004181 B2 JP7004181 B2 JP 7004181B2 JP 2018546382 A JP2018546382 A JP 2018546382A JP 2018546382 A JP2018546382 A JP 2018546382A JP 7004181 B2 JP7004181 B2 JP 7004181B2
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JP
Japan
Prior art keywords
group
resin composition
epoxy resin
epoxy
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018546382A
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English (en)
Japanese (ja)
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JPWO2018074517A1 (ja
Inventor
一樹 平佐田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
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Nissan Chemical Corp
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Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Publication of JPWO2018074517A1 publication Critical patent/JPWO2018074517A1/ja
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Publication of JP7004181B2 publication Critical patent/JP7004181B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3236—Heterocylic compounds
    • C08G59/3245—Heterocylic compounds containing only nitrogen as a heteroatom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2018546382A 2016-10-18 2017-10-18 プリント配線板形成用エポキシ樹脂組成物 Active JP7004181B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016204690 2016-10-18
JP2016204690 2016-10-18
PCT/JP2017/037708 WO2018074517A1 (ja) 2016-10-18 2017-10-18 プリント配線板形成用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2018074517A1 JPWO2018074517A1 (ja) 2019-08-08
JP7004181B2 true JP7004181B2 (ja) 2022-01-21

Family

ID=62019235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018546382A Active JP7004181B2 (ja) 2016-10-18 2017-10-18 プリント配線板形成用エポキシ樹脂組成物

Country Status (5)

Country Link
JP (1) JP7004181B2 (ko)
KR (1) KR102398796B1 (ko)
CN (1) CN109843965B (ko)
TW (1) TWI753959B (ko)
WO (1) WO2018074517A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102494437B1 (ko) 2015-11-10 2023-02-01 닛산 가가쿠 가부시키가이샤 장쇄 알킬렌기함유 에폭시 수지 조성물

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035641A1 (ja) 2004-09-29 2006-04-06 Nissan Chemical Industries, Ltd. 変性エポキシ樹脂組成物
WO2009008509A1 (ja) 2007-07-11 2009-01-15 Nissan Chemical Industries, Ltd. 無機粒子を含有した液状エポキシ樹脂形成用製剤
WO2009069429A1 (ja) 2007-11-29 2009-06-04 Nissan Chemical Industries, Ltd. シリカ含有エポキシ硬化剤及びエポキシ樹脂硬化体
WO2012124390A1 (ja) 2011-03-17 2012-09-20 日産化学工業株式会社 シリカ含有エポキシ硬化剤の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1015440A1 (en) * 1997-07-16 2000-07-05 Ciba SC Holding AG Polyglycidyl spirocompounds and their use in epoxy resins
JP2004221572A (ja) 2002-12-27 2004-08-05 Tdk Corp 電子部品及び多層基板
JP5423602B2 (ja) 2004-07-27 2014-02-19 日立化成株式会社 低誘電率絶縁性樹脂組成物
JP5282917B2 (ja) * 2008-11-12 2013-09-04 日産化学工業株式会社 レジスト下層膜形成組成物及びそれを用いたパターニング方法
EP2995633A4 (en) * 2013-05-10 2016-10-26 Daicel Corp HARDENABLE EPOXY RESIN COMPOSITION AND HARDENING PRODUCT THEREOF

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006035641A1 (ja) 2004-09-29 2006-04-06 Nissan Chemical Industries, Ltd. 変性エポキシ樹脂組成物
WO2009008509A1 (ja) 2007-07-11 2009-01-15 Nissan Chemical Industries, Ltd. 無機粒子を含有した液状エポキシ樹脂形成用製剤
WO2009069429A1 (ja) 2007-11-29 2009-06-04 Nissan Chemical Industries, Ltd. シリカ含有エポキシ硬化剤及びエポキシ樹脂硬化体
WO2012124390A1 (ja) 2011-03-17 2012-09-20 日産化学工業株式会社 シリカ含有エポキシ硬化剤の製造方法

Also Published As

Publication number Publication date
KR102398796B1 (ko) 2022-05-17
CN109843965A (zh) 2019-06-04
TWI753959B (zh) 2022-02-01
JPWO2018074517A1 (ja) 2019-08-08
CN109843965B (zh) 2021-07-27
WO2018074517A1 (ja) 2018-04-26
TW201821527A (zh) 2018-06-16
KR20190070328A (ko) 2019-06-20

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