JP6993782B2 - インプリント装置および物品製造方法 - Google Patents

インプリント装置および物品製造方法 Download PDF

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Publication number
JP6993782B2
JP6993782B2 JP2017045251A JP2017045251A JP6993782B2 JP 6993782 B2 JP6993782 B2 JP 6993782B2 JP 2017045251 A JP2017045251 A JP 2017045251A JP 2017045251 A JP2017045251 A JP 2017045251A JP 6993782 B2 JP6993782 B2 JP 6993782B2
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JP
Japan
Prior art keywords
substrate
mold
unit
relative position
mark
Prior art date
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JP2017045251A
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English (en)
Japanese (ja)
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JP2018152374A (ja
JP2018152374A5 (OSRAM
Inventor
憲司 八重樫
貴光 古巻
俊樹 岩井
康平 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2017045251A priority Critical patent/JP6993782B2/ja
Priority to KR1020180027233A priority patent/KR102262115B1/ko
Publication of JP2018152374A publication Critical patent/JP2018152374A/ja
Publication of JP2018152374A5 publication Critical patent/JP2018152374A5/ja
Application granted granted Critical
Publication of JP6993782B2 publication Critical patent/JP6993782B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017045251A 2017-03-09 2017-03-09 インプリント装置および物品製造方法 Active JP6993782B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017045251A JP6993782B2 (ja) 2017-03-09 2017-03-09 インプリント装置および物品製造方法
KR1020180027233A KR102262115B1 (ko) 2017-03-09 2018-03-08 임프린트 장치 및 물품 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017045251A JP6993782B2 (ja) 2017-03-09 2017-03-09 インプリント装置および物品製造方法

Publications (3)

Publication Number Publication Date
JP2018152374A JP2018152374A (ja) 2018-09-27
JP2018152374A5 JP2018152374A5 (OSRAM) 2020-04-16
JP6993782B2 true JP6993782B2 (ja) 2022-01-14

Family

ID=63681938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017045251A Active JP6993782B2 (ja) 2017-03-09 2017-03-09 インプリント装置および物品製造方法

Country Status (2)

Country Link
JP (1) JP6993782B2 (OSRAM)
KR (1) KR102262115B1 (OSRAM)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6982316B2 (ja) * 2018-09-26 2021-12-17 株式会社ソフイア 遊技機
JP2020154063A (ja) 2019-03-19 2020-09-24 キオクシア株式会社 アライメントマーク、インプリント方法、半導体装置の製造方法、及び位置合わせ装置
JP7236325B2 (ja) * 2019-05-28 2023-03-09 キヤノン株式会社 インプリント装置および物品製造方法
JP7395307B2 (ja) * 2019-10-01 2023-12-11 キヤノン株式会社 インプリント方法、インプリント装置および物品の製造方法
KR102804042B1 (ko) * 2021-08-12 2025-05-12 (주) 오로스테크놀로지 모아레 위상 변위 오버레이 타겟 및 그 타겟의 오버레이 오차 측정 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002195809A (ja) 2000-12-25 2002-07-10 Mitsutoyo Corp 光学式寸法測定方法及び装置
JP2008041852A (ja) 2006-08-04 2008-02-21 Hitachi Ltd インプリント方法及びインプリント装置
JP2012084732A (ja) 2010-10-13 2012-04-26 Canon Inc インプリント方法及び装置
JP2013030757A (ja) 2011-06-21 2013-02-07 Canon Inc 位置検出装置、インプリント装置及び位置検出方法
JP2014241398A (ja) 2013-05-16 2014-12-25 キヤノン株式会社 インプリント装置、デバイス製造方法およびインプリント方法
JP2015049197A (ja) 2013-09-03 2015-03-16 キヤノン株式会社 検出装置、リソグラフィ装置及び物品の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63119232A (ja) * 1986-11-07 1988-05-23 Nikon Corp 露光装置
JPH09306813A (ja) * 1996-05-15 1997-11-28 Nikon Corp 観察装置及び該装置を備えた露光装置
WO2002067055A2 (en) 2000-10-12 2002-08-29 Board Of Regents, The University Of Texas System Template for room temperature, low pressure micro- and nano-imprint lithography
JP5002211B2 (ja) 2005-08-12 2012-08-15 キヤノン株式会社 インプリント装置およびインプリント方法
EP2584408B1 (en) * 2007-02-06 2020-10-07 Canon Kabushiki Kaisha Imprint method and imprint apparatus
JP6552329B2 (ja) * 2014-09-12 2019-07-31 キヤノン株式会社 インプリント装置、インプリントシステム及び物品の製造方法
JP6549834B2 (ja) * 2014-11-14 2019-07-24 キヤノン株式会社 インプリント装置及び物品の製造方法
WO2016092697A1 (ja) * 2014-12-12 2016-06-16 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6492765B2 (ja) * 2015-02-27 2019-04-03 東芝ライテック株式会社 電源装置および照明システム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002195809A (ja) 2000-12-25 2002-07-10 Mitsutoyo Corp 光学式寸法測定方法及び装置
JP2008041852A (ja) 2006-08-04 2008-02-21 Hitachi Ltd インプリント方法及びインプリント装置
JP2012084732A (ja) 2010-10-13 2012-04-26 Canon Inc インプリント方法及び装置
JP2013030757A (ja) 2011-06-21 2013-02-07 Canon Inc 位置検出装置、インプリント装置及び位置検出方法
JP2014241398A (ja) 2013-05-16 2014-12-25 キヤノン株式会社 インプリント装置、デバイス製造方法およびインプリント方法
JP2015049197A (ja) 2013-09-03 2015-03-16 キヤノン株式会社 検出装置、リソグラフィ装置及び物品の製造方法

Also Published As

Publication number Publication date
KR20180103730A (ko) 2018-09-19
KR102262115B1 (ko) 2021-06-09
JP2018152374A (ja) 2018-09-27

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