JP6992276B2 - Inspection equipment for press-molded products - Google Patents

Inspection equipment for press-molded products Download PDF

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JP6992276B2
JP6992276B2 JP2017090976A JP2017090976A JP6992276B2 JP 6992276 B2 JP6992276 B2 JP 6992276B2 JP 2017090976 A JP2017090976 A JP 2017090976A JP 2017090976 A JP2017090976 A JP 2017090976A JP 6992276 B2 JP6992276 B2 JP 6992276B2
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宏 金原
全弘 岩本
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Toyota Motor Corp
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Description

本発明は、プレス成形品の検査装置に関する。 The present invention relates to an inspection device for press-molded products.

プレス成形品は、向かい合う一対の金型により賦形され、その賦形部位、例えば筋状の凹溝はガスや流体の流路となる。よって、プレス成形品は、プレス後に賦形部位の割れやピンホールの有無の検査に処され、この検査に当たり、複数の投光ランプから照射した光を複数のCCDカメラで受光する検査手法が提案されている(例えば特許文献1)。 The press-molded product is shaped by a pair of dies facing each other, and the shaped portion, for example, a streak-shaped groove becomes a flow path for gas or fluid. Therefore, the press-molded product is inspected for cracks and pinholes in the shaped part after pressing, and for this inspection, an inspection method is proposed in which the light emitted from a plurality of floodlight lamps is received by a plurality of CCD cameras. (For example, Patent Document 1).

特開2002-365227号公報JP-A-2002-365227.

ところで、割れやピンホールの発生部位や向きは一律ではない。このため、検出精度の向上のためには、プレス成形品に対する投光ランプの向きや位置、角度等の機器調整が必要となる。CCDカメラについても同様である。こうしたことから、プレス成形品における割れやピンホール等の検出精度の向上と機器調整の簡略化とをもたらし得る検査手法が要請されるに到った。 By the way, the location and direction of cracks and pinholes are not uniform. Therefore, in order to improve the detection accuracy, it is necessary to adjust the equipment such as the direction, position, and angle of the floodlight lamp with respect to the press-molded product. The same applies to the CCD camera. For these reasons, there has been a demand for an inspection method that can improve the detection accuracy of cracks and pinholes in press-molded products and simplify the adjustment of equipment.

本発明は、上述の課題の少なくとも一部を解決するためになされたものであり、以下の形態として実現することが可能である。第1の形態は、向かい合う一対の金型により賦形されたプレス成形品の検査装置としての形態である。この検査装置は、前記プレス成形品に向けて光を照射する光照射部と、該光照射部と前記プレス成形品を挟んで対向し、前記光照射部が照射した光を受光する受光部とを備え、前記光照射部は、前記一対の金型の一方の金型の金型面の面形状に倣った形状とされ、前記受光部は、前記一対の金型の他方の金型の金型面の面形状に倣った形状とされた構成を備える。また、第2の形態の検査装置は、前記プレス成形品に向けて光を照射する光照射部と、該光照射部と前記プレス成形品を挟んで対向し、前記光照射部が照射した光を受光する受光部と、前記プレス成形品と前記受光部の間に配置された透過性のプリズムからななり、前記プレス成形品側から入射した光を前記受光部に集光する集光部とを備え、前記光照射部は、前記一対の金型の一方の金型の金型面の面形状に倣った形状とされ、前記プリズムの前記プレス成形品の側は、前記一対の金型の他方の金型の金型面の面形状に倣った形状とされた構成を備える。 The present invention has been made to solve at least a part of the above-mentioned problems, and can be realized as the following forms. The first form is a form as an inspection device for a press-molded product formed by a pair of dies facing each other. This inspection device includes a light irradiation unit that irradiates light toward the press-molded product, and a light-receiving unit that faces the light irradiation unit with the press-molded product in between and receives the light emitted by the light irradiation unit. The light irradiation unit has a shape that follows the surface shape of the mold surface of one of the pair of molds, and the light receiving unit has a shape that follows the surface shape of the mold surface of one of the pair of molds. It has a structure that follows the surface shape of the mold surface. Further, the inspection device of the second embodiment has a light irradiation unit that irradiates light toward the press-molded product, and the light irradiation unit and the press-molded product are sandwiched between the light irradiation unit and the light irradiation unit. It consists of a light receiving part that receives light and a transmissive prism arranged between the press-molded product and the light-receiving part, and collects light incident from the press-molded product side to the light-receiving part. The light irradiation portion is provided with a portion, and the light irradiation portion has a shape that follows the surface shape of the mold surface of one of the pair of dies , and the side of the press-molded product of the prism is the pair of dies. It has a structure that follows the surface shape of the mold surface of the other mold of the mold .

(1)本発明の一形態によれば、プレス成形品の検査装置が提供される。この検査装置は、向かい合う一対の金型により賦形されたプレス成形品の検査装置であって、前記プレス成形品に向けて光を照射する光照射部と、該光照射部と前記プレス成形品を挟んで対向し、前記光照射部が照射した光を受光する受光部とを備え、前記光照射部と前記受光部の少なくとも一方は、前記一対の金型の一方の金型の金型面の面形状に倣った形状とされている。 (1) According to one embodiment of the present invention, an inspection device for a press-molded product is provided. This inspection device is an inspection device for a press-molded product shaped by a pair of dies facing each other, and is a light irradiation unit that irradiates light toward the press-molded product, and the light irradiation unit and the press-molded product. The light-irradiating portion and the light-receiving portion are provided with a light-receiving unit that faces the light-irradiating unit and receives the light emitted by the light-irradiating unit. It is said to have a shape that follows the surface shape of.

この形態のプレス成形品の検査装置では、光照射部が一対の金型の一方の金型の金型面の面形状に倣った形状であれば、この光照射部は、割れやピンホールが発生し得る領域を含むプレス成形品の賦形領域全域に亘って向き合う。よって、割れやピンホールが様々な賦形部位に起きていても、その割れやピンホールに向けて光照射部から光を照射でき、この際に、光照射部についての機器調整をさほど必要としない。また、受光部が一対の金型の一方の金型の金型面の面形状に倣った形状であれば、この受光部は、割れやピンホールが発生し得る領域を含むプレス成形品の賦形領域全域に亘って向き合う。よって、割れやピンホールが様々な賦形部位に起きていても、その割れやピンホールを通過した光を受光部で受光でき、この際に、受光部についての機器調整をさほど必要としない。この結果、この形態のプレス成形品の検査装置によれば、プレス成形品における割れやピンホール等の検出精度を向上できると共に、機器調整の簡略化も可能となる。 In the inspection device for press-molded products of this form, if the light-irradiated portion has a shape that follows the surface shape of the mold surface of one of the dies of a pair of dies, the light-irradiated portion has cracks or pinholes. It faces the entire shaping region of the press-molded product, including the region where it can occur. Therefore, even if cracks or pinholes occur in various shaping parts, light can be irradiated from the light irradiation part toward the cracks or pinholes, and at this time, it is necessary to adjust the equipment for the light irradiation part so much. do not do. Further, if the light receiving portion has a shape that follows the surface shape of the mold surface of one of the dies of the pair of dies, the light receiving portion is a press-molded product including a region where cracks and pinholes may occur. Facing over the entire shape area. Therefore, even if cracks or pinholes occur in various shaping parts, the light that has passed through the cracks or pinholes can be received by the light receiving portion, and at this time, it is not necessary to adjust the equipment for the light receiving portion so much. As a result, according to the inspection device for the press-molded product of this form, the detection accuracy of cracks, pinholes, etc. in the press-molded product can be improved, and the equipment adjustment can be simplified.

なお、本発明は、種々の態様で実現することが可能である。例えば、プレス成形品の検査方法、或いは、向かい合う一対の金型を用いたプレス成形品の型成形とその後の検査とを含むプレス成形品の製造方法・製造装置等の形態で実現することができる。 The present invention can be realized in various aspects. For example, it can be realized in the form of a press-molded product inspection method, or a press-molded product manufacturing method / manufacturing apparatus including mold molding of a press-molded product using a pair of facing dies and subsequent inspection. ..

第1実施形態のプレス成形品の検査装置を含むプレス成形ラインの概略構成を示す説明図である。It is explanatory drawing which shows the schematic structure of the press molding line including the inspection apparatus of the press molded article of 1st Embodiment. 図1におけるセパレータの一部領域Aを概略的に拡大して示す説明図である。It is explanatory drawing which shows the part area A of the separator in FIG. 1 which is shown by being roughly enlarged. 図2における3-3線に沿った鉛直面にてプレスセクションと検査セクションの上下の金型とセパレータを断面視して示す説明図である。FIG. 3 is an explanatory view showing a cross-sectional view of the upper and lower dies and separators of the press section and the inspection section in the vertical plane along the 3-3 line in FIG. 光照射プレートからの光照射の様子を模式的に示す説明図である。It is explanatory drawing which shows the state of the light irradiation from a light irradiation plate schematically. プレス成形ラインでのセパレータの製造工程の概要を示す工程図である。It is a process drawing which shows the outline of the manufacturing process of a separator in a press forming line. セパレータ検査に際しての手順の概略を示す工程図である。It is a process drawing which shows the outline of the procedure at the time of a separator inspection. セパレータ検査のための金型駆動を図るラムのストロークに対応付けて各種機器の駆動タイミングを説明する説明図である。It is explanatory drawing explaining the drive timing of various equipments corresponding to the stroke of the ram for driving a mold for separator inspection. セパレータ検査工程における金型とセパレータとの関係および検査の様子を示す説明図である。It is explanatory drawing which shows the relationship between a mold and a separator in a separator inspection process, and the state of inspection. 第2実施形態の検査セクションを概略的に示す説明図である。It is explanatory drawing which shows schematic of the inspection section of 2nd Embodiment. 第3実施形態の検査セクションを概略的に示す説明図である。It is explanatory drawing which shows schematic the inspection section of 3rd Embodiment. 第4実施形態の検査セクションを概略的に示す説明図である。It is explanatory drawing which shows schematic the inspection section of 4th Embodiment.

図1は、第1実施形態のプレス成形品の検査装置を含むプレス成形ライン100の概略構成を示す説明図である。プレス成形ライン100は、燃料電池セル(図視略)のセパレータWspをプレス成形するラインであり、プレスセクション100Pと検査セクション100Sとを含む。プレスセクション100Pは、セパレータWspに最終的に賦形される凹溝、凸状等の順次プレスのために、第1プレスセクションP1、第2プレスセクションP2・・・最終プレスセクションPFを並べて区画し、検査セクション100Sを、最終プレスセクションPFに並べて区画して備える。 FIG. 1 is an explanatory diagram showing a schematic configuration of a press molding line 100 including an inspection device for a press molded product according to the first embodiment. The press molding line 100 is a line for press molding a separator Wsp of a fuel cell (not shown), and includes a press section 100P and an inspection section 100S. In the press section 100P, the first press section P1, the second press section P2 ... the final press section PF are arranged and partitioned for the sequential pressing of the concave groove, the convex shape, etc. finally formed on the separator Wsp. , The inspection section 100S is provided side by side in the final press section PF.

第1から最終までの各プレスセクションと検査セクション100Sは、それぞれ下型をアンダーベースであるボルスター102に備え、上型をアッパーベースであるラム104に備える。第1プレスセクションP1の下型110と上型111とは、向かい合う一対の金型であり、0.1mm程度の厚みのチタン製プレートにセパレータWspの一部形状を賦形する。第2プレスセクションP2の下型120と上型121とは、向かい合う一対の金型であり、第1プレスセクションP1で賦形済みの半製品のセパレータWspに、第1プレスセクションP1とは異なる部位の賦形を行う。第2プレスセクションP2以降のプレスセクションも同様である。最終プレスセクションPFの下型140と上型141とは、向かい合う一対の金型であり、それ以前の各プレスセクションで賦形済みの半製品のセパレータWspを矩形形状に型抜きする。検査セクション100Sは、疑似下型150と疑似上型151とを備え、プレスセクション100Pで得られたプレス成形品であるセパレータWspの検査を行う。また、検査セクション100Sは、セパレータWspの検査に光照射とその受光を行うことから、プレスセクションとは異なり、疑似上型151に暗幕スクリーン153を有する。この暗幕スクリーン153は、後述するように疑似上型151が降下した際に、疑似下型150を取り囲んで疑似下型150と疑似上型151の対向領域を外部から遮蔽する。なお、検査を行うための疑似下型150および疑似上型151と、プレスセクション100Pにおける金型との関係については後述する。 Each of the first to final press sections and the inspection section 100S has a lower die on the underbase bolster 102 and an upper die on the upper base ram 104, respectively. The lower die 110 and the upper die 111 of the first press section P1 are a pair of dies facing each other, and a part of the shape of the separator Wsp is formed on a titanium plate having a thickness of about 0.1 mm. The lower die 120 and the upper die 121 of the second press section P2 are a pair of dies facing each other, and the semi-finished separator Wsp formed in the first press section P1 has a portion different from that of the first press section P1. Perform the shaping of. The same applies to the press sections after the second press section P2. The lower die 140 and the upper die 141 of the final press section PF are a pair of dies facing each other, and the semi-finished separator Wsp formed in each of the previous press sections is die-cut into a rectangular shape. The inspection section 100S includes a pseudo lower die 150 and a pseudo upper die 151, and inspects the separator Wsp, which is a press-molded product obtained in the press section 100P. Further, since the inspection section 100S performs light irradiation and light reception thereof for inspection of the separator Wsp, unlike the press section, the pseudo upper mold 151 has a blackout screen 153. As will be described later, the blackout screen 153 surrounds the pseudo lower die 150 and shields the facing region between the pseudo lower die 150 and the pseudo upper die 151 from the outside when the pseudo upper die 151 descends. The relationship between the pseudo lower die 150 and the pseudo upper die 151 for inspecting and the die in the press section 100P will be described later.

プレス成形ライン100は、ラム104を、上記の各上型と共に降下することで、第1プレスセクションP1~最終プレスセクションPFの各プレスセクションでのプレス成形と、検査セクション100Sでのプレス成形品検査とを同時に行う。そして、ラム104を上記の各上型と共に上昇させた際に、図示しない搬送機器で、第1プレスセクションP1でプレス済みの半製品を第2プレスセクションP2に、第2プレスセクションP2でプレス済みの半製品をその下流のプレスセクションに搬送する。最終プレスセクションPFから検査セクション100Sについても、外形抜き済みのプレス完成品であるセパレータWspを図示しない搬送機器で搬送する。検査セクション100Sからは、当該セクションで検査済みのセパレータWspを図示しない搬送機器でライン外に搬送する。 The press forming line 100 lowers the ram 104 together with each of the above upper dies to perform press forming in each press section of the first press section P1 to the final press section PF and inspection of the press molded product in the inspection section 100S. And at the same time. Then, when the ram 104 is raised together with each of the above upper molds, the semi-finished product pressed in the first press section P1 is pressed in the second press section P2 and the second press section P2 in a transport device (not shown). Transport the semi-finished product to the press section downstream of it. Also from the final press section PF to the inspection section 100S, the separator Wsp, which is a finished press product whose outer shape has been removed, is conveyed by a transfer device (not shown). From the inspection section 100S, the separator Wsp inspected in the section is conveyed out of the line by a transfer device (not shown).

次に、検査セクション100Sにおける疑似下型150と疑似上型151について説明する。図2は、図1におけるセパレータWspの一部領域Aを概略的に拡大して示す説明図である。図3は、図2における3-3線に沿った鉛直面にてプレスセクションと検査セクションの上下の金型とセパレータWspを断面視して示す説明図である。 Next, the pseudo lower mold 150 and the pseudo upper mold 151 in the inspection section 100S will be described. FIG. 2 is an explanatory diagram showing a partially enlarged region A of the separator Wsp in FIG. 1 in a substantially enlarged manner. FIG. 3 is an explanatory view showing a cross-sectional view of the upper and lower dies and separator Wsp of the press section and the inspection section in the vertical plane along the 3-3 line in FIG.

図2に示すように、セパレータWspは、複数の凸条Pkを備え、この凸条Pkは、図1に示す第1プレスセクションP1~最終プレスセクションPFにおける一対の金型である下型と上型で賦形され、その賦形形状は、最終プレスセクションPFにおける図3の下型金型面140sと上型金型面141sで規定されていると言える。つまり、凸条Pkは、最終プレスセクションPF以前の第1プレスセクションP1等の各プレスセクションで順次賦形されるが、最終プレスセクションPFの下型140の下型金型面140sと上型141の上型金型面141sは、最終プレスセクションPF以前の第1プレスセクションP1等の各プレスセクションにおける下型・上型の金型面と同一とされているからである。図3に示す検査セクションにおける疑似下型150と疑似上型151は、共に、プラスチック成形品であり、疑似下型150は、下型表面150sに光照射プレート160を備え、疑似上型151は、上型表面151sに受光部170を備える。 As shown in FIG. 2, the separator Wsp includes a plurality of ridges Pk, and the ridges Pk are a pair of dies in the first press section P1 to the final press section PF shown in FIG. It is shaped by a mold, and it can be said that the shaped shape is defined by the lower mold surface 140s and the upper mold surface 141s of FIG. 3 in the final press section PF. That is, the ridge Pk is sequentially formed in each press section such as the first press section P1 before the final press section PF, but the lower die surface 140s and the upper die 141 of the lower die 140 of the final press section PF This is because the upper mold surface 141s is the same as the mold surface of the lower mold and the upper mold in each press section such as the first press section P1 before the final press section PF. Both the pseudo lower mold 150 and the pseudo upper mold 151 in the inspection section shown in FIG. 3 are plastic molded products, the pseudo lower mold 150 is provided with a light irradiation plate 160 on the lower mold surface 150s, and the pseudo upper mold 151 is a pseudo upper mold 151. A light receiving unit 170 is provided on the upper mold surface 151s.

光照射プレート160は、有機或いは無機のELシート(EL:Electro-Luminescence)である。そして、この光照射プレート160は、疑似下型150の下型表面150sに密着して装着された状態において、プレート表面160sを、最終プレスセクションPFにおける一方の金型である下型140の下型金型面140sの面形状に倣った形状、具体的には金型面形状と同一形状、若しくは下型140の下型金型面140sから0.1~0.3mm程度、寸法を控えた金型面形状とし、このプレート表面160sの各部位から光を面状に照射する。このように、プレート表面160sが下型金型面140sに倣った形状であることから、対向する一対の金型である下型140と上型141で賦形されたセパレータWspは、検査セクションにおいて、疑似下型150における光照射プレート160のプレート表面160sに密着した状態で、疑似下型150に載置されて受け止められる。そして、光照射プレート160は、凸条Pkを含むセパレータWspの賦形領域全域に亘って向き合い、セパレータWspに向けて光を照射する。よって、この光照射プレート160は、疑似下型150と共に、本発明における光照射部を構築する。 The light irradiation plate 160 is an organic or inorganic EL sheet (EL: Electro-Luminescence). Then, in a state where the light irradiation plate 160 is closely attached to the lower die surface 150s of the pseudo lower die 150, the plate surface 160s is attached to the lower die 140 of the lower die 140 which is one of the dies in the final press section PF. A shape that follows the surface shape of the mold surface 140s, specifically the same shape as the mold surface shape, or a mold that is about 0.1 to 0.3 mm from the lower mold surface 140s of the lower mold 140, with dimensions reduced. The shape of the mold is formed, and light is radiated in a plane from each part of the plate surface 160s. As described above, since the plate surface 160s has a shape that imitates the lower mold surface 140s, the separator Wsp formed by the pair of opposite molds, the lower mold 140 and the upper mold 141, is in the inspection section. , In a state of being in close contact with the plate surface 160s of the light irradiation plate 160 in the pseudo lower mold 150, it is placed on the pseudo lower mold 150 and received. Then, the light irradiation plate 160 faces the entire shaping region of the separator Wsp including the convex Pk, and irradiates the separator Wsp with light. Therefore, this light irradiation plate 160, together with the pseudo lower mold 150, constructs the light irradiation unit in the present invention.

図4は、光照射プレート160からの光照射の様子を模式的に示す説明図である。この図4では、説明の便宜上、光照射プレート160のプレート表面160sとセパレータWspとの間に均一で微小な間隙(例えば、上記した0.1~0.3mmの隙間)があると仮定して、光照射の様子を示している。凸条Pkのコーナー部は、下型と上型とによるプレス成形の際、引っ張り力を図示の矢印のように逆向きに受けるので、割れやピンホールと言った欠陥Wcが生じやすく、欠陥Wcの発生角度は、図示するように種々の角度となり得る。しかしながら、光照射プレート160からの光照射は、図4における白抜き矢印に示すように、面状に照射されることから、欠陥Wcが様々な角度で起きても、その欠陥Wcに向けての光照射が可能となる。 FIG. 4 is an explanatory diagram schematically showing the state of light irradiation from the light irradiation plate 160. In FIG. 4, for convenience of explanation, it is assumed that there is a uniform and minute gap (for example, the above-mentioned gap of 0.1 to 0.3 mm) between the plate surface 160s of the light irradiation plate 160 and the separator Wsp. , The state of light irradiation is shown. Since the corner portion of the ridge Pk receives the tensile force in the opposite direction as shown by the arrow in the figure during press molding by the lower mold and the upper mold, defects Wc such as cracks and pinholes are likely to occur, and the defect Wc. The generation angle of can be various angles as shown in the figure. However, since the light irradiation from the light irradiation plate 160 is irradiated in a planar manner as shown by the white arrow in FIG. 4, even if the defect Wc occurs at various angles, the defect Wc is directed toward the defect Wc. Light irradiation becomes possible.

受光部170は、微小な受光素子、例えばCCD(Charge-Coupled Device)を疑似上型151の上型表面151sに整列して形成され、疑似上型151の上型表面151sに密着して装着された状態において、受光表面171sを、他方の金型である上型141の上型金型面141sの面形状に倣った形状、具体的には金型面形状と同一形状や0.1~0.3mm程度控えた金型面形状とし、この受光表面171sの各部位で光を受光する。このように、受光表面171sが上型金型面141sに倣った形状であることから、受光部170は、光照射プレート160のプレート表面160sに密着して疑似下型150に載置されたセパレータWspに、凸条Pkを含むセパレータWspの賦形領域全域に亘って向き合う。そして、疑似上型151に設けられた受光部170は、光照射プレート160とセパレータWspを挟んで対向し、光照射プレート160が照射した光を受光することになる。この受光部170と既述した光照射プレート160を備える検査セクション100Sは、本発明におけるプレス成形品の検査装置に該当する。 The light receiving unit 170 is formed by arranging a minute light receiving element, for example, a CCD (Charge-Coupled Device) on the upper mold surface 151s of the pseudo upper mold 151, and is mounted in close contact with the upper mold surface 151s of the pseudo upper mold 151. In this state, the light receiving surface 171s has a shape that follows the surface shape of the upper mold surface 141s of the upper mold 141, which is the other mold, specifically, the same shape as the mold surface shape or 0.1 to 0. The mold surface shape is reduced by about 3 mm, and light is received at each part of the light receiving surface 171s. In this way, since the light receiving surface 171s has a shape that imitates the upper mold surface 141s, the light receiving portion 170 is in close contact with the plate surface 160s of the light irradiation plate 160 and is placed on the pseudo lower mold 150. The Wsp is faced over the entire shaping region of the separator Wsp containing the ridge Pk. Then, the light receiving unit 170 provided on the pseudo upper mold 151 faces the light irradiation plate 160 with the separator Wsp interposed therebetween, and receives the light irradiated by the light irradiation plate 160. The inspection section 100S including the light receiving portion 170 and the light irradiation plate 160 described above corresponds to the inspection device for the press-molded product in the present invention.

図5は、プレス成形ライン100でのセパレータWspの製造工程の概要を示す工程図である。図6は、セパレータ検査に際しての手順の概略を示す工程図である。図7は、セパレータ検査のための金型駆動を図るラム104のストロークに対応付けて各種機器の駆動タイミングを説明する説明図である。図8は、セパレータ検査工程における金型とセパレータWspとの関係および検査の様子を示す説明図である。 FIG. 5 is a process diagram showing an outline of a manufacturing process of the separator Wsp in the press forming line 100. FIG. 6 is a process diagram showing an outline of the procedure for the separator inspection. FIG. 7 is an explanatory diagram illustrating drive timings of various devices in association with the stroke of the ram 104 for driving the mold for separator inspection. FIG. 8 is an explanatory diagram showing the relationship between the mold and the separator Wsp in the separator inspection step and the state of inspection.

図1のプレス成形ライン100におけるセパレータ製造工程では、セパレータWspがプレス成形ライン100において図示しない搬送機器により順送り搬送されつつ、図5に示す手順に従い、第1プレスセクションP1での1絞り(手順S100)がなされ、これに続き、第2プレスセクションP2での2絞り(手順S110)、その後のプレスセクションでの絞りと、最終プレスセクションPFでの外形型抜き(手順S150)がなされる。この外形型抜きにより、図2に示す凸条Pkが総て賦形済みの矩形形状のセパレータWspが得られ、このセパレータWspが検査セクション100Sの疑似下型150に載置されてセパレータ検査がなされる(手順S200)。この手順S200において、検査が合格となれば、プレス成形ライン100は、ライン停止を起こすことなく、セパレータWspのプレス成形を継続する。一方、手順S200において、検査が不合格となれば、プレス成形ライン100は、プレス加工を停止し、つまり、機器駆動を停止して加工を終了し、作業員による不合格復旧、例えば、金型面の修復を待機する。なお、不合格復旧の後は、第1プレスセクションP1での1絞り(手順S100)からセパレータWspのプレス成形が再開される。 In the separator manufacturing process in the press forming line 100 of FIG. 1, the separator Wsp is sequentially conveyed in the press forming line 100 by a transfer device (not shown), and one drawing in the first press section P1 (procedure S100) is performed according to the procedure shown in FIG. ) Is performed, followed by two drawing in the second press section P2 (procedure S110), subsequent drawing in the press section, and external die cutting in the final press section PF (procedure S150). By this outer die cutting, a rectangular separator Wsp in which all the ridges Pk shown in FIG. 2 have been shaped is obtained, and this separator Wsp is placed on the pseudo lower die 150 of the inspection section 100S and the separator is inspected. (Procedure S200). If the inspection is passed in this procedure S200, the press forming line 100 continues the press forming of the separator Wsp without causing a line stop. On the other hand, if the inspection fails in the procedure S200, the press forming line 100 stops the press processing, that is, stops the device drive and ends the processing, and the worker recovers the failure, for example, the mold. Wait for face repair. After the failure recovery, the press molding of the separator Wsp is restarted from one drawing (procedure S100) in the first press section P1.

図5のセパレータ製造工程におけるセパレータ検査(手順S200)は、疑似下型150と疑似上型151とを含む検査セクション100Sでなされる。このセパレータ検査(手順S200)では、図6に示す手順に従い、まず、疑似上型151の降下がなされる(手順S210)。疑似上型151は、図1のラム104の降下に伴って図7の時刻t1において上死点から降下を始め、セパレータWspは、この時刻t1で、図8に示すように疑似下型150に未装着である。疑似上型151の降下が進んだ図7の時刻t2において、図1の検査セクション100Sにそれ以前の最終プレスセクションPFから図示しない搬送機器によりセパレータWspが搬送され、そのセパレータWspが疑似下型150、詳しくは下型表面150sに密着した光照射プレート160に載置され、図8に示すようにセパレータWspのセパレータ下面は光照射プレート160のプレート表面160sと重なる。なお、この図8における時刻t4以降の各図では、プレート表面160s等の表記を省略した。 The separator inspection (procedure S200) in the separator manufacturing process of FIG. 5 is performed in the inspection section 100S including the pseudo lower mold 150 and the pseudo upper mold 151. In this separator inspection (procedure S200), first, the pseudo-upper mold 151 is lowered according to the procedure shown in FIG. 6 (procedure S210). The pseudo upper mold 151 starts descending from the top dead center at the time t1 of FIG. 7 with the descent of the ram 104 of FIG. 1, and the separator Wsp becomes the pseudo lower mold 150 at this time t1 as shown in FIG. Not installed. At time t2 in FIG. 7 where the descent of the pseudo upper mold 151 has progressed, the separator Wsp is conveyed to the inspection section 100S in FIG. 1 from the previous final press section PF by a transfer device (not shown), and the separator Wsp is transferred to the pseudo lower mold 150. More specifically, it is placed on a light irradiation plate 160 in close contact with the lower mold surface 150s, and as shown in FIG. 8, the lower surface of the separator of the separator Wsp overlaps with the plate surface 160s of the light irradiation plate 160. In each figure after the time t4 in FIG. 8, the notation of the plate surface 160s and the like is omitted.

疑似上型151の降下が更に進んだ図7の時刻t3となると、図1に示した暗幕スクリーン153が疑似下型150を取り囲んで疑似下型150と疑似上型151の対向領域を外部から遮蔽する(手順S220)。疑似上型151の降下が更に進んだ図7の時刻t4では、図8に示すように疑似上型151の下向き凸部位が疑似下型150の上向き凸部位より下方に位置し、この時刻t4において疑似上型151における受光部170がオンとされ(手順S230)、時刻t4以降において光受光が可能となる。そして、疑似上型151の降下が更に進んだ図7の時刻t5では、疑似上型151はその下死点の手前まで降下しており、この時刻t5において疑似下型150における光照射プレート160がオンとされる(手順S240)。こうしてオンとなった光照射プレート160は、図4に示すように、そのプレート表面160sの全域から面状に光を照射するので、時刻t5以降において、セパレータWspの賦形領域全域に亘って光照射プレート160から光が照射される。よって、時刻5以降において、受光部170による光検知の有無が判別される(手順S250)。 At time t3 in FIG. 7, when the descent of the pseudo upper mold 151 is further advanced, the blackout screen 153 shown in FIG. 1 surrounds the pseudo lower mold 150 and shields the facing region between the pseudo lower mold 150 and the pseudo upper mold 151 from the outside. (Procedure S220). At time t4 in FIG. 7, where the descent of the pseudo upper mold 151 was further advanced, the downward convex portion of the pseudo upper mold 151 was located below the upward convex portion of the pseudo lower mold 150 as shown in FIG. 8, and at this time t4. The light receiving unit 170 in the pseudo upper mold 151 is turned on (procedure S230), and light can be received after time t4. Then, at time t5 in FIG. 7, where the pseudo-upper mold 151 has further descended, the pseudo-upper mold 151 has descended to just before the bottom dead center, and at this time t5, the light irradiation plate 160 in the pseudo-lower mold 150 has descended. It is turned on (procedure S240). As shown in FIG. 4, the light irradiation plate 160 turned on in this way irradiates light in a planar manner from the entire area of the plate surface 160s. Therefore, after time t5, the light is applied over the entire shaping region of the separator Wsp. Light is emitted from the irradiation plate 160. Therefore, after time 5, it is determined whether or not the light receiving unit 170 has detected light (procedure S250).

時刻t5以降において、疑似上型151は、手順S250での光検知とは別に更に降下し、図7の時刻t6において、下死点で一旦停止した後、上昇を始める。時刻t6における疑似下型150と疑似上型151との関係は図8に示されており、疑似上型151の下死点は、光照射プレート160を介在して疑似下型150に載置済みのセパレータWspと疑似上型151における受光部170との間に0.3~1.0mm程度の隙間が残る位置とされている。こうすることで、疑似上型151に装着済みの受光部170をセパレータWspに接触しないようにでき、受光部170の損傷を回避できる。 After the time t5, the pseudo upper mold 151 further descends separately from the light detection in the procedure S250, and at the time t6 of FIG. 7, temporarily stops at the bottom dead center and then starts to rise. The relationship between the pseudo lower mold 150 and the pseudo upper mold 151 at time t6 is shown in FIG. 8, and the bottom dead center of the pseudo upper mold 151 has been placed on the pseudo lower mold 150 via the light irradiation plate 160. The position is such that a gap of about 0.3 to 1.0 mm remains between the separator Wsp of No. 1 and the light receiving portion 170 of the pseudo upper mold 151. By doing so, the light receiving portion 170 already mounted on the pseudo upper mold 151 can be prevented from coming into contact with the separator Wsp, and damage to the light receiving portion 170 can be avoided.

図6に示す手順S250の光検知判別は、上記した疑似上型151の降下と並行してなされ、受光部170により光検知があるとされると、検査セクション100Sの疑似下型150におけるセパレータWspの有無判別がなされる(手順S255)。図1に示したプレス成形ライン100では、プレスセクション100Pの各プレスセクションと検査セクション100Sとの間においてセパレータWspが順送りされることから、プレス加工開始当初では、検査セクション100SにセパレータWspが載置されていない状況が有り得る。こうしたセパレータ未載置の状況では、手順S250において受光部170により光検知があるとされるが、この光検知は、セパレータWspに図4に示すような欠陥Wcが生じたことに基づくものではない。その一方、プレス加工が進んで検査セクション100SにセパレータWspが載置されている状況での手順S250において受光部170により光検知があるとされれば、この光検知は、セパレータWspに図4に示すような欠陥Wcが生じたことに基づくものとなる。手順S255でのセパレータ有無の判別は、上記した状況を区別するためになされる。そして、手順S255でセパレータWspがないと判別されれば、後述の手順S260に移行する。その一方、手順S255でセパレータWspが有ると判別すれば、それ以前の手順S250における光検知は、セパレータWspの欠陥Wcに基づくものであることから、プレス成形ライン100のプレス機を停止して(手順S257)、一旦、検査を終了し、作業員による金型面の修復を待機する。なお、手順S255におけるセパレータWspの有無判定では、受光部170がその全域において光を受光している場合には、セパレータWspは検査セクション100Sに載置されていないと判定できる。 The light detection determination in the procedure S250 shown in FIG. 6 is performed in parallel with the descent of the pseudo upper mold 151 described above, and when it is determined that the light detection is performed by the light receiving unit 170, the separator Wsp in the pseudo lower mold 150 of the inspection section 100S (Procedure S255). In the press forming line 100 shown in FIG. 1, since the separator Wsp is sequentially fed between each press section of the press section 100P and the inspection section 100S, the separator Wsp is placed on the inspection section 100S at the beginning of press working. There may be situations where it has not been done. In such a situation where the separator is not placed, it is said that the light receiving unit 170 detects light in the procedure S250, but this light detection is not based on the occurrence of the defect Wc as shown in FIG. 4 in the separator Wsp. .. On the other hand, if it is determined that the light receiving unit 170 detects light in the procedure S250 in the situation where the press working is advanced and the separator Wsp is placed in the inspection section 100S, this light detection is shown in FIG. 4 on the separator Wsp. It is based on the occurrence of the defect Wc as shown. The determination of the presence or absence of the separator in the procedure S255 is made to distinguish the above-mentioned situation. Then, if it is determined in the procedure S255 that there is no separator Wsp, the process proceeds to the procedure S260 described later. On the other hand, if it is determined in the procedure S255 that the separator Wsp is present, the photodetection in the previous procedure S250 is based on the defect Wc of the separator Wsp, so that the press machine of the press forming line 100 is stopped ( Procedure S257) Once the inspection is completed, the worker waits for the repair of the mold surface. In the determination of the presence / absence of the separator Wsp in the procedure S255, when the light receiving unit 170 receives light in the entire area, it can be determined that the separator Wsp is not placed in the inspection section 100S.

手順S250で光検知なしと判別された場合は、検査セクション100Sにおいて検査対象となるセパレータWspは欠陥Wcを有しないことになる。よって、この欠陥なしの場合と手順S255でセパレータなしと判別された場合には、次のセパレータWspの検査に備え、図7の時刻t7において、光照射プレート160と受光部170をオフとすると共に(手順S260)、疑似上型151の上昇を継続し(手順S270)、セパレータ検査を終了する。なお、検査セクション100Sでは、時刻t7以降における疑似上型151の上昇過程の時刻t8において、暗幕スクリーン153による光遮蔽が解かれ、その後の時刻t9において、検査済みセパレータWspが検査セクション100Sからライン外に搬送される。 If it is determined in the procedure S250 that there is no light detection, the separator Wsp to be inspected in the inspection section 100S does not have the defect Wc. Therefore, when it is determined that there is no separator and that there is no separator in the procedure S255, the light irradiation plate 160 and the light receiving unit 170 are turned off at time t7 in FIG. 7 in preparation for the next inspection of the separator Wsp. (Procedure S260), the rise of the pseudo upper mold 151 is continued (Procedure S270), and the separator inspection is completed. In the inspection section 100S, the light shielding by the blackout screen 153 is released at the time t8 of the ascending process of the pseudo upper mold 151 after the time t7, and the inspected separator Wsp is out of the line from the inspection section 100S at the subsequent time t9. Will be transported to.

以上説明した本実施形態のプレス成形品の検査装置としての検査セクション100Sは、図3や図4に示すように、疑似下型150に装着する光照射プレート160を、そのプレート表面160sが最終プレスセクションPFにおける下型140の下型金型面140sの面形状に倣った形状となるようにして、割れやピンホールといった欠陥Wcが発生し得る領域を含むセパレータWspの賦形領域全域に亘って向き合わせる。これに加え、検査セクション100Sは、疑似上型151に装着する受光部170を、その受光表面171sが最終プレスセクションPFにおける上型141の上型金型面141sの面形状に倣った形状となるようにして、割れやピンホールといった欠陥Wcが発生し得る領域を含むセパレータWspの賦形領域全域に亘って向き合わせる。これらの結果、検査セクション100Sによれば、割れやピンホールといった欠陥Wcが様々な賦形部位に起きていても、その欠陥Wcに向けた光照射プレート160からの光照射、および欠陥Wcを通過した光の受光部170での受光を可能として、欠陥Wcの検出精度を向上できる。しかも、光照射に際しての機器調整と受光に際しての機器調整も簡便となる。 In the inspection section 100S as an inspection device for the press-molded product of the present embodiment described above, as shown in FIGS. 3 and 4, the light irradiation plate 160 mounted on the pseudo lower die 150 is finally pressed by the plate surface 160s. The shape follows the surface shape of the lower mold surface 140s of the lower mold 140 in the section PF, and covers the entire shaping region of the separator Wsp including the region where defective Wc such as cracks and pinholes may occur. Face each other. In addition to this, the inspection section 100S has a shape in which the light receiving portion 170 mounted on the pseudo upper die 151 has a light receiving surface 171s that follows the surface shape of the upper die surface 141s of the upper die 141 in the final press section PF. In this way, they face each other over the entire shaped region of the separator Wsp, including the region where defective Wc such as cracks and pinholes can occur. As a result, according to the inspection section 100S, even if the defect Wc such as a crack or a pinhole occurs in various shaping sites, the light irradiation from the light irradiation plate 160 toward the defect Wc and the defect Wc pass through. It is possible to receive the generated light by the light receiving unit 170, and it is possible to improve the detection accuracy of the defect Wc. Moreover, the equipment adjustment for light irradiation and the equipment adjustment for light reception are also simplified.

図9は、第2実施形態の検査セクション100SAを概略的に示す説明図である。図示するように、第2実施形態の検査セクション100SAは、既述した第1実施形態の検査セクション100Sと同一の疑似下型150と光照射プレート160とを備え、受光部170に代わり平板状の受光部170Aを有する。受光部170Aは、CCDを平板状に整列して形成され、疑似上型151Aの内面天井壁および内面側壁に埋設されて、疑似下型150の光照射プレート160とセパレータWspを挟んで対向する。この疑似上型151Aにあっても、図1に示すラム104に装着されて上下動する。なお、プレスセクション100Pからの振動の影響を抑制するため、受光部170Aは、それぞれ防振ゴム155を介して疑似上型151Aに埋め込み・装着されている。この第2実施形態の検査セクション100SAにあっても、疑似下型150に装着する光照射プレート160を、そのプレート表面160sが最終プレスセクションPFにおける下型140の下型金型面140sの面形状に倣った形状となるようにして、割れやピンホールといった欠陥Wcが発生し得る領域を含むセパレータWspの賦形領域全域に亘って向き合わせる。よって、第2実施形態の検査セクション100SAによっても、欠陥Wcの検出精度を向上できると共に、機器調整も簡便となる。また、受光部170Aを平板状の既存の受光部とできるので、低コスト化を図ることもできる。 FIG. 9 is an explanatory diagram schematically showing the inspection section 100SA of the second embodiment. As shown in the figure, the inspection section 100SA of the second embodiment includes the same pseudo-lower mold 150 and the light irradiation plate 160 as the inspection section 100S of the first embodiment described above, and has a flat plate shape instead of the light receiving portion 170. It has a light receiving unit 170A. The light receiving portion 170A is formed by arranging the CCDs in a flat plate shape, is embedded in the inner ceiling wall and the inner side wall of the pseudo upper die 151A, and faces the light irradiation plate 160 of the pseudo lower die 150 with the separator Wsp interposed therebetween. Even in this pseudo upper mold 151A, it is attached to the ram 104 shown in FIG. 1 and moves up and down. In order to suppress the influence of vibration from the press section 100P, the light receiving portion 170A is embedded and mounted in the pseudo upper mold 151A via the vibration-proof rubber 155, respectively. Even in the inspection section 100SA of the second embodiment, the light irradiation plate 160 to be mounted on the pseudo lower mold 150 has a surface shape of the lower mold surface 140s of the lower mold 140 in the final press section PF. The separator Wsp is faced over the entire shape region including the region where defects Wc such as cracks and pinholes may occur. Therefore, the inspection section 100SA of the second embodiment can also improve the detection accuracy of the defect Wc and simplify the equipment adjustment. Further, since the light receiving unit 170A can be used as an existing flat plate-shaped light receiving unit, the cost can be reduced.

図10は、第3実施形態の検査セクション100SBを概略的に示す説明図である。図示するように、第3実施形態の検査セクション100SBは、既述した第1実施形態の検査セクション100Sと同一の疑似上型151と受光部170とを備え、疑似下型150を光透過性のプリズムから構成し、下型表面150sを最終プレスセクションPFにおける下型140の下型金型面140sの面形状に倣った形状とする。その上で、検査セクション100SBは、疑似下型150のベース158に平板状の光源159を組み込んで備え、光源159の照射した光を疑似下型150にてセパレータWspの賦形領域の全域に導く。よって、この第3実施形態の検査セクション100SAによっても、第1実施形態と同様に欠陥Wcの検出精度を向上できると共に、機器調整も簡便となる。 FIG. 10 is an explanatory diagram schematically showing the inspection section 100SB of the third embodiment. As shown in the figure, the inspection section 100SB of the third embodiment includes the same pseudo upper mold 151 and the light receiving portion 170 as the inspection section 100S of the first embodiment described above, and the pseudo lower mold 150 is light-transmitting. It is composed of prisms, and the lower die surface 150s has a shape that follows the surface shape of the lower die surface 140s of the lower die 140 in the final press section PF. In addition, the inspection section 100SB incorporates a flat plate-shaped light source 159 into the base 158 of the pseudo-lower mold 150, and guides the light emitted by the light source 159 to the entire area of the shape-forming region of the separator Wsp by the pseudo-lower mold 150. .. Therefore, even with the inspection section 100SA of the third embodiment, the detection accuracy of the defect Wc can be improved and the equipment adjustment becomes simple as in the first embodiment.

図11は、第4実施形態の検査セクション100SCを概略的に示す説明図である。図示するように、第4実施形態の検査セクション100SCは、既述した第1実施形態の検査セクション100Sと同一の疑似下型150と光照射プレート160とを備え、受光部170に代わり平板状の受光部170Aとこの受光部170Aへの集光機能を発揮する光透過性のプリズムからなる集光部152とを有する。受光部170Aは、CCDを平板状に整列して形成され、疑似上型151Aの天井壁に埋設されて、疑似下型150の光照射プレート160とセパレータWspを挟んで対向する。集光部152は、図示しない保持シャフトで受光部170Aと対向するように保持されている。この疑似上型151Aにあっても、図1に示すラム104に装着されて上下動する。なお、プレスセクション100Pからの振動の影響を抑制するため、受光部170Aは、それぞれ防振ゴム155を介して疑似上型151Aに埋め込み・装着されている。この第4実施形態の検査セクション100SCにあっても、疑似下型150に装着する光照射プレート160を、そのプレート表面160sが最終プレスセクションPFにおける下型140の下型金型面140sの面形状に倣った形状となるようにして、割れやピンホールといった欠陥Wcが発生し得る領域を含むセパレータWspの賦形領域全域に亘って向き合わせる。よって、第4実施形態の検査セクション100SCによっても、欠陥Wcの検出精度を向上できると共に、機器調整も簡便となる。また、受光部170Aを平板状の既存の受光部とした上で、疑似上型151Aの内面天井壁に埋設すればよいので、低コスト化を図ることもできる。 FIG. 11 is an explanatory diagram schematically showing the inspection section 100SC of the fourth embodiment. As shown in the figure, the inspection section 100SC of the fourth embodiment includes the same pseudo-lower mold 150 and the light irradiation plate 160 as the inspection section 100S of the first embodiment described above, and has a flat plate shape instead of the light receiving portion 170. It has a light receiving unit 170A and a light collecting unit 152 composed of a light transmitting prism that exerts a light collecting function on the light receiving unit 170A. The light receiving unit 170A is formed by arranging the CCDs in a flat plate shape, is embedded in the ceiling wall of the pseudo upper mold 151A, and faces the light irradiation plate 160 of the pseudo lower mold 150 with the separator Wsp interposed therebetween. The light collecting unit 152 is held by a holding shaft (not shown) so as to face the light receiving unit 170A. Even in this pseudo upper mold 151A, it is attached to the ram 104 shown in FIG. 1 and moves up and down. In order to suppress the influence of vibration from the press section 100P, the light receiving portion 170A is embedded and mounted in the pseudo upper mold 151A via the vibration-proof rubber 155, respectively. Even in the inspection section 100SC of the fourth embodiment, the light irradiation plate 160 to be mounted on the pseudo lower mold 150 has a surface shape of the lower mold surface 140s of the lower mold 140 in the final press section PF. The separator Wsp is faced over the entire shape region including the region where defects Wc such as cracks and pinholes may occur. Therefore, the inspection section 100SC of the fourth embodiment can also improve the detection accuracy of the defect Wc and simplify the equipment adjustment. Further, since the light receiving portion 170A may be an existing flat plate-shaped light receiving portion and then embedded in the inner ceiling wall of the pseudo upper die 151A, the cost can be reduced.

本発明は、上述の実施形態や実施例、変形例に限られるものではなく、その趣旨を逸脱しない範囲において種々の構成で実現することができる。例えば、発明の概要の欄に記載した各形態中の技術的特徴に対応する実施形態、実施例、変形例中の技術的特徴は、上述の課題の一部または全部を解決するために、あるいは、上述の効果の一部または全部を達成するために、適宜、差し替えや組み合わせを行うことが可能である。また、その技術的特徴が本明細書中に必須なものとして説明されていなければ、適宜、削除することが可能である。 The present invention is not limited to the above-described embodiments, examples, and modifications, and can be realized with various configurations within a range not deviating from the gist thereof. For example, the technical features in the embodiments, examples, and modifications corresponding to the technical features in each of the embodiments described in the column of the outline of the invention may be used to solve some or all of the above-mentioned problems. , Can be replaced or combined as appropriate to achieve some or all of the above effects. Further, if the technical feature is not described as essential in the present specification, it can be appropriately deleted.

既述した実施形態では、検査セクション100Sをプレスセクション100Pに連続して設けたが、検査セクション100Sをプレスセクション100Pから独立して設けてもよい。また、プレスセクション100Pを1つのプレスセクションとしてもよい。 In the above-described embodiment, the inspection section 100S is continuously provided in the press section 100P, but the inspection section 100S may be provided independently of the press section 100P. Further, the press section 100P may be used as one press section.

既述した実施形態では、光照射プレート160をELシートから形成したが、これに限らない。例えば、アクリル等の光透過性の透明な樹脂プレートを、ELシートからなる光照射プレート160と同一形状に形成し、この樹脂プレートの端面から樹脂プレートに光を照射するようにしてもよい。この場合には、透明な樹脂プレートが導光路として機能するので、ELシートからなる光照射プレート160と同様に、セパレータWspに光を照射できる。 In the above-described embodiment, the light irradiation plate 160 is formed from an EL sheet, but the present invention is not limited to this. For example, a light-transmitting transparent resin plate such as acrylic may be formed in the same shape as the light irradiation plate 160 made of an EL sheet, and the resin plate may be irradiated with light from the end face of the resin plate. In this case, since the transparent resin plate functions as a light guide path, the separator Wsp can be irradiated with light in the same manner as the light irradiation plate 160 made of an EL sheet.

既述した実施形態では、疑似上型151に暗幕スクリーン153を設けたが、検査セクション100Sを暗室内に配設したりして、暗幕スクリーン153を省略してもよい。 In the above-described embodiment, the blackout screen 153 is provided on the pseudo upper mold 151, but the blackout screen 153 may be omitted by disposing the inspection section 100S in the dark room.

100…プレス成形ライン
100P…プレスセクション
100S、100SA~100SC…検査セクション
102…ボルスター
104…ラム
110…下型
111…上型
120…下型
121…上型
140…下型
140s…下型金型面
141…上型
141s…上型金型面
150…疑似下型
150s…下型表面
151…疑似上型
151A…疑似上型
151s…上型表面
152…集光部
153…暗幕スクリーン
155…防振ゴム
158…ベース
159…光源
160…光照射プレート
160s…プレート表面
170…受光部
170A…受光部
171s…受光表面
P1…第1プレスセクション
P2…第2プレスセクション
PF…最終プレスセクション
Pk…凸条
Wc…欠陥
Wsp…セパレータ
100 ... Press molding line 100P ... Press section 100S, 100SA-100SC ... Inspection section 102 ... Bolster 104 ... Ram 110 ... Lower mold 111 ... Upper mold 120 ... Lower mold 121 ... Upper mold 140 ... Lower mold 140s ... Lower mold surface 141 ... Upper mold 141s ... Upper mold surface 150 ... Pseudo lower mold 150s ... Lower mold surface 151 ... Pseudo upper mold 151A ... Pseudo upper mold 151s ... Upper mold surface 152 ... Condensing part 153 ... Blackout screen 155 ... Anti-vibration rubber 158 ... Base 159 ... Light source 160 ... Light irradiation plate 160s ... Plate surface 170 ... Light receiving part 170A ... Light receiving part 171s ... Light receiving surface P1 ... First press section P2 ... Second press section PF ... Final press section Pk ... Convex Wc ... Defect Wsp ... Separator

Claims (2)

向かい合う一対の金型により賦形されたプレス成形品の検査装置であって、
前記プレス成形品に向けて光を照射する光照射部と、
該光照射部と前記プレス成形品を挟んで対向し、前記光照射部が照射した光を受光する受光部とを備え、
前記光照射部は、前記一対の金型の一方の金型の金型面の面形状に倣った形状とされ、前記受光部は、前記一対の金型の他方の金型の金型面の面形状に倣った形状とされている、
プレス成形品の検査装置。
An inspection device for press-molded products shaped by a pair of facing dies.
A light irradiation unit that irradiates light toward the press-molded product,
It is provided with a light receiving unit that faces the light irradiation unit with the press-molded product interposed therebetween and receives the light irradiated by the light irradiation unit.
The light irradiation portion has a shape that follows the surface shape of the mold surface of one of the pair of molds, and the light receiving portion has a shape of the mold surface of the other mold of the pair of molds. It is said to have a shape that follows the surface shape.
Inspection equipment for press-molded products.
向かい合う一対の金型により賦形されたプレス成形品の検査装置であって、
前記プレス成形品に向けて光を照射する光照射部と、
該光照射部と前記プレス成形品を挟んで対向し、前記光照射部が照射した光を受光する受光部と、
前記プレス成形品と前記受光部の間に配置された透過性のプリズムからなり、前記プレス成形品側から入射した光を前記受光部に集光する集光部とを備え、
前記光照射部は、前記一対の金型の一方の金型の金型面の面形状に倣った形状とされ
前記プリズムの前記プレス成形品の側は、前記一対の金型の他方の金型の金型面の面形状に倣った形状とされている、
プレス成形品の検査装置。
An inspection device for press-molded products shaped by a pair of facing dies.
A light irradiation unit that irradiates light toward the press-molded product,
A light receiving unit that faces the light irradiation unit with the press-molded product interposed therebetween and receives the light irradiated by the light irradiation unit.
It is composed of a transmissive prism arranged between the press-molded product and the light-receiving portion, and includes a light-collecting portion that collects light incident from the press-molded product side on the light-receiving portion .
The light irradiation unit has a shape that follows the surface shape of the mold surface of one of the pair of molds .
The side of the press-molded product of the prism has a shape that follows the surface shape of the mold surface of the other mold of the pair of dies .
Inspection equipment for press-molded products.
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Citations (1)

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JP2011209032A (en) 2010-03-29 2011-10-20 J Quality Kk Illumination system

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