JP6989562B2 - 半導体加工用テープ - Google Patents

半導体加工用テープ Download PDF

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Publication number
JP6989562B2
JP6989562B2 JP2019081609A JP2019081609A JP6989562B2 JP 6989562 B2 JP6989562 B2 JP 6989562B2 JP 2019081609 A JP2019081609 A JP 2019081609A JP 2019081609 A JP2019081609 A JP 2019081609A JP 6989562 B2 JP6989562 B2 JP 6989562B2
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adhesive layer
wafer
tape
resin
semiconductor processing
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Japanese (ja)
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JP2019176157A (ja
JP2019176157A5 (enExample
Inventor
透 佐野
晃 仙台
浩介 橋本
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Priority claimed from JP2018061063A external-priority patent/JP6535118B1/ja
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2019081609A priority Critical patent/JP6989562B2/ja
Publication of JP2019176157A publication Critical patent/JP2019176157A/ja
Publication of JP2019176157A5 publication Critical patent/JP2019176157A5/ja
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JP2019081609A 2018-03-28 2019-04-23 半導体加工用テープ Active JP6989562B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019081609A JP6989562B2 (ja) 2018-03-28 2019-04-23 半導体加工用テープ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018061063A JP6535118B1 (ja) 2018-03-28 2018-03-28 半導体加工用テープ
JP2019081609A JP6989562B2 (ja) 2018-03-28 2019-04-23 半導体加工用テープ

Related Parent Applications (1)

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JP2018061063A Division JP6535118B1 (ja) 2018-03-28 2018-03-28 半導体加工用テープ

Publications (3)

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JP2019176157A JP2019176157A (ja) 2019-10-10
JP2019176157A5 JP2019176157A5 (enExample) 2020-12-17
JP6989562B2 true JP6989562B2 (ja) 2022-01-05

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JP2019081609A Active JP6989562B2 (ja) 2018-03-28 2019-04-23 半導体加工用テープ

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JP (1) JP6989562B2 (enExample)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012174945A (ja) * 2011-02-23 2012-09-10 Furukawa Electric Co Ltd:The 半導体ウエハの加工方法
KR102032590B1 (ko) * 2012-05-14 2019-10-15 린텍 가부시키가이샤 접착성 수지층이 부착된 시트 및 반도체 장치의 제조 방법
JP6306362B2 (ja) * 2014-02-13 2018-04-04 リンテック株式会社 伸長可能シートおよび積層チップの製造方法
JP6295135B2 (ja) * 2014-04-24 2018-03-14 日東電工株式会社 ダイシング・ダイボンドフィルム

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JP2019176157A (ja) 2019-10-10

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