JP6987434B2 - Grinding wheel - Google Patents

Grinding wheel Download PDF

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JP6987434B2
JP6987434B2 JP2017119717A JP2017119717A JP6987434B2 JP 6987434 B2 JP6987434 B2 JP 6987434B2 JP 2017119717 A JP2017119717 A JP 2017119717A JP 2017119717 A JP2017119717 A JP 2017119717A JP 6987434 B2 JP6987434 B2 JP 6987434B2
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grindstone
annular groove
grinding
grinding wheel
adhesive
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JP2019000966A (en
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裕俊 星川
智治 木原
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Disco Corp
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Disco Corp
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Priority to KR1020180066758A priority patent/KR102508740B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Description

本発明は、半導体ウェーハ等の被加工物を研削するための研削装置に装着される研削ホイールに関する。 The present invention relates to a grinding wheel mounted on a grinding device for grinding a workpiece such as a semiconductor wafer.

ＩＣ、ＬＳＩ等の数多くのデバイスが表面に形成され、且つ個々のデバイスが互いに交差する複数の分割予定ライン（ストリート）によって区画された半導体ウェーハは、研削装置によって裏面が研削されて所定の厚みに加工された後、切削装置（ダイシング装置）によって分割予定ラインを切削して個々のデバイスチップに分割され、分割されたデバイスチップは携帯電話、パソコン等の各種電子機器に利用されている。 A semiconductor wafer in which a large number of devices such as ICs and LSIs are formed on the front surface and is partitioned by a plurality of planned division lines (streets) in which the individual devices intersect each other is ground on the back surface by a grinding device to a predetermined thickness. After being processed, the scheduled division line is cut by a cutting device (dicing device) and divided into individual device chips, and the divided device chips are used in various electronic devices such as mobile phones and personal computers.

ウェーハの裏面を研削する研削工程では、公知の研削装置を使用し、研削装置のスピンドルの先端（下端）に固定されたホイールマウントに研削ホイールを装着して、粗研削及び仕上げ研削を経てウェーハは所定の厚さまで薄化される（例えば、特開２０００−２８８８８１号公報参照）。 In the grinding process for grinding the back surface of a wafer, a known grinding device is used, a grinding wheel is attached to a wheel mount fixed to the tip (lower end) of the spindle of the grinding device, and the wafer is subjected to rough grinding and finish grinding. It is thinned to a predetermined thickness (see, for example, Japanese Patent Application Laid-Open No. 2000-288881).

研削加工に使用する研削ホイールは、ホイール基台と該ホイール基台の自由端面に形成された環状溝中に配設された複数の砥石とから構成されており、環状溝内に接着剤を充填し、その後各砥石を環状溝内に挿入して固定する。 The grinding wheel used for grinding is composed of a wheel base and a plurality of grindstones arranged in an annular groove formed on the free end face of the wheel base, and the annular groove is filled with an adhesive. After that, each grindstone is inserted into the annular groove and fixed.

特開２０００−２８８８８１号公報Japanese Unexamined Patent Publication No. 2000-288881

然し、従来の研削ホイールでは、環状溝と砥石との隙間が僅かなため、接着剤が十分充填されていない場合、接着不良となり、そのまま研削加工を実施すると、研削加工中に砥石が脱落したり、破損したりする問題がある。 However, in the conventional grinding wheel, the gap between the annular groove and the grindstone is small, so if the adhesive is not sufficiently filled, the adhesion will be poor, and if the grinding process is performed as it is, the grindstone may fall off during the grinding process. , There is a problem of damage.

本発明はこのような点に鑑みてなされたものであり、その目的とするところは、研削加工中に研削ホイールから砥石が脱落したり、或いは脱落せずに破損したりすることを防止できる研削ホイールを提供することである。 The present invention has been made in view of such a point, and an object thereof is grinding capable of preventing the grindstone from falling off from the grinding wheel during grinding or being damaged without falling off. To provide a wheel.

本発明によると、自由端面とホイールマウントへの装着面とを有する環状基台と、該環状基台の該自由端面に環状に形成された環状溝と、該環状溝内に充填された接着剤によって該環状溝に固着された複数の砥石とを含む研削ホイールであって、該環状溝は一対の側壁と頂面とにより画成され、該側壁は、該自由端面から該頂面に向かって末広がり形状をしており、該砥石は、該接着剤が入り込むための両側面を貫通する貫通孔を有している研削ホイールが提供される。 According to the present invention, an annular base having a free end surface and a mounting surface for a wheel mount, an annular groove formed in an annular shape on the free end surface of the annular base, and an adhesive filled in the annular groove. A grinding wheel containing a plurality of grindstones fixed to the annular groove, wherein the annular groove is defined by a pair of side walls and a top surface, the side walls extending from the free end face toward the top surface. The grindstone has a divergent shape, and the grindstone is provided with a grinding wheel having through holes penetrating both side surfaces for the adhesive to enter.

好ましくは、該環状溝の頂面は、該頂面の幅より小さい幅を有し、該環状溝に連通する該複数の砥石を固着するための環状の接着剤溜まり部を更に備える。 Preferably, the top surface of the annular groove has a width smaller than the width of the top surface and further includes an annular adhesive reservoir for fixing the plurality of grindstones communicating with the annular groove .

本発明の研削ホイールによると、環状溝の側壁が自由端面から頂面に向かって末広がり形状に形成されているので、十分な量の接着剤によって砥石を環状溝中に強固に固着できる。 According to the grinding wheel of the present invention, since the side wall of the annular groove is formed in a divergent shape from the free end surface toward the top surface, the grindstone can be firmly fixed in the annular groove with a sufficient amount of adhesive.

更に、砥石の側面や頂面には、接着剤との接着力を向上させるための凹凸形状や接着剤が充填される貫通孔又は接着剤溜まり部が形成されていることで、接着剤により砥石をさらに強固に固着できる。 Further, the side surface and the top surface of the grindstone are formed with an uneven shape for improving the adhesive force with the adhesive, a through hole filled with the adhesive, or an adhesive pool, so that the grindstone is formed by the adhesive. Can be fixed even more firmly.

研削装置の斜視図である。It is a perspective view of a grinding apparatus. 研削ホイールの底面側斜視図である。It is a bottom side perspective view of a grinding wheel. 図３（Ａ）は第１実施形態に係る研削ホイールの図２の３Ａ−３Ａ線断面図、図３（Ｂ）は第２実施形態に係る研削ホイールの図２の３Ａ−３Ａ線断面図である。3A is a sectional view taken along line 3A-3A of FIG. 2 of the grinding wheel according to the first embodiment, and FIG. 3B is a sectional view taken along line 3A-3A of FIG. 2 of the grinding wheel according to the second embodiment. be. 図４（Ａ）は第２実施形態の砥石の斜視図、図４（Ｂ）は図４（Ａ）に示す第２実施形態の砥石を固着した第３実施形態の研削ホイールの図２の３Ａ−３Ａ線断面図である。4 (A) is a perspective view of the grindstone of the second embodiment, and FIG. 4 (B) is 3A of FIG. 2 of the grinding wheel of the third embodiment to which the grindstone of the second embodiment shown in FIG. 4 (A) is fixed. -3A is a cross-sectional view taken along the line A. 図５（Ａ）は第３実施形態の砥石の斜視図、図５（Ｂ）は図５（Ａ）に示す第３実施形態の砥石を固着した第４実施形態の研削ホイールの図２の３Ａ−３Ａ線断面図である。5 (A) is a perspective view of the grindstone of the third embodiment, and FIG. 5 (B) is 3A of FIG. 2 of the grinding wheel of the fourth embodiment to which the grindstone of the third embodiment shown in FIG. 5 (A) is fixed. -3A is a cross-sectional view taken along the line A. 図６（Ａ）は第４実施形態の砥石の斜視図、図６（Ｂ）は図６（Ａ）に示す第４実施形態の砥石を固着した第５実施形態の研削ホイールの図２の３Ａ−３Ａ線断面図である。6 (A) is a perspective view of the grindstone of the fourth embodiment, and FIG. 6 (B) is 3A of FIG. 2 of the grinding wheel of the fifth embodiment to which the grindstone of the fourth embodiment shown in FIG. 6 (A) is fixed. -3A is a cross-sectional view taken along the line A. 図７（Ａ）は第５実施形態の砥石の斜視図、図７（Ｂ）は図７（Ａ）に示す第５実施形態の砥石を固着した第６実施形態の研削ホイールの図２の３Ａ−３Ａ線断面図である。7 (A) is a perspective view of the grindstone of the fifth embodiment, and FIG. 7 (B) is 3A of FIG. 2 of the grinding wheel of the sixth embodiment to which the grindstone of the fifth embodiment shown in FIG. 7 (A) is fixed. -3A is a cross-sectional view taken along the line A. 図８（Ａ）は第６実施形態の砥石の斜視図、図８（Ｂ）は図８（Ａ）に示す第６実施形態の砥石を固着した第７実施形態の研削ホイールの図２の３Ａ−３Ａ線断面図である。8 (A) is a perspective view of the grindstone of the sixth embodiment, and FIG. 8 (B) is 3A of FIG. 2 of the grinding wheel of the seventh embodiment to which the grindstone of the sixth embodiment shown in FIG. 8 (A) is fixed. -3A is a cross-sectional view taken along the line A.

以下、本発明の実施形態を図面を参照して詳細に説明する。図１を参照すると、本発明実施形態の研削ホイール２４を装着した研削装置２の外観斜視図が示されている。４は研削装置２のベースであり、ベース４の後方にはコラム６が立設されている。コラム６には、上下方向に伸びる一対のガイドレール８が固定されている。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, an external perspective view of the grinding apparatus 2 equipped with the grinding wheel 24 according to the embodiment of the present invention is shown. Reference numeral 4 is a base of the grinding device 2, and a column 6 is erected behind the base 4. A pair of guide rails 8 extending in the vertical direction are fixed to the column 6.

一対のガイドレール８に沿って研削ユニット（研削手段）１０が上下方向に移動可能に装着されている。研削ユニット１０は、スピンドルハウジング１２と、スピンドルハウジング１２を保持する支持部１４を有しており、支持部１４が一対のガイドレール８に沿って上下方向に移動する移動基台１６に取り付けられている。 A grinding unit (grinding means) 10 is mounted so as to be movable in the vertical direction along the pair of guide rails 8. The grinding unit 10 has a spindle housing 12 and a support portion 14 for holding the spindle housing 12, and the support portion 14 is attached to a moving base 16 that moves in the vertical direction along a pair of guide rails 8. There is.

研削ユニット１０は、スピンドルハウジング１２中に回転可能に収容されたスピンドル１８と、スピンドル１８を回転駆動するモータ２０と、スピンドル１８の先端に固定されたホイールマウント２２と、ホイールマウント２２に着脱可能に装着された研削ホイール２４とを含んでいる。 The grinding unit 10 can be attached to and detached from the spindle 18 rotatably housed in the spindle housing 12, the motor 20 for rotationally driving the spindle 18, the wheel mount 22 fixed to the tip of the spindle 18, and the wheel mount 22. Includes the mounted grinding wheel 24.

研削装置２は、研削ユニット１０を一対の案内レール８に沿って上下方向に移動するボールねじ３０とパルスモータ３２とから構成される研削ユニット送り機構３４を備えている。パルスモータ３２を駆動すると、ボールねじ３０が回転し、移動基台１６に装着された研削ユニット１０が上下方向に移動される。 The grinding device 2 includes a grinding unit feed mechanism 34 including a ball screw 30 for moving the grinding unit 10 in the vertical direction along a pair of guide rails 8 and a pulse motor 32. When the pulse motor 32 is driven, the ball screw 30 rotates, and the grinding unit 10 mounted on the moving base 16 is moved in the vertical direction.

ベース４の上面には凹部４ａが形成されており、この凹部４ａにチャックテーブル機構３６が配設されている。チャックテーブル機構３６はチャックテーブル３８を有し、図示しない移動機構によりウェーハ着脱位置Ａと、研削ユニット１０に対向する研削位置Ｂとの間でＹ軸方向に移動される。４０，４２は蛇腹である。ベース４の前方側には、研削装置２のオペレータが研削条件等を入力する操作パネル４４が配設されている。 A recess 4a is formed on the upper surface of the base 4, and a chuck table mechanism 36 is arranged in the recess 4a. The chuck table mechanism 36 has a chuck table 38 and is moved in the Y-axis direction between the wafer attachment / detachment position A and the grinding position B facing the grinding unit 10 by a moving mechanism (not shown). 40 and 42 are bellows. On the front side of the base 4, an operation panel 44 for inputting grinding conditions and the like by the operator of the grinding device 2 is arranged.

図２を参照すると、本発明第１実施形態の研削ホイール２４の底面側斜視図が示されている。研削ホイール２４は、環状基台２６と、環状基台２６の自由端面２６ａ（図３参照）に形成された環状溝２７中に挿入され、環状溝２７中に充填された接着剤３１により環状溝２７中に固着された複数の砥石（研削砥石）２８とから構成される。 With reference to FIG. 2, a bottom perspective view of the grinding wheel 24 according to the first embodiment of the present invention is shown. The grinding wheel 24 is inserted into the annular base 26 and the annular groove 27 formed in the free end surface 26a (see FIG. 3) of the annular base 26, and the annular groove is formed by the adhesive 31 filled in the annular groove 27. It is composed of a plurality of grindstones (grinding grindstones) 28 fixed in 27.

以下、図３乃至図８を参照して、本発明の各種実施形態に係る研削ホイールについて詳細に説明する。図３（Ａ）を参照すると、第１実施形態に係る研削ホイール２４の図２の３Ａ−３Ａ線断面図が示されている。 Hereinafter, the grinding wheel according to various embodiments of the present invention will be described in detail with reference to FIGS. 3 to 8. With reference to FIG. 3A, a sectional view taken along line 3A-3A of FIG. 2 of the grinding wheel 24 according to the first embodiment is shown.

研削ホイール２４の環状基台２６は、自由端面２６ａと装着面２６ｂを有しており、複数のねじにより環状基台２６の装着面２６ｂでホイールマウント２２に着脱可能に固定される。 The annular base 26 of the grinding wheel 24 has a free end surface 26a and a mounting surface 26b, and is detachably fixed to the wheel mount 22 on the mounting surface 26b of the annular base 26 by a plurality of screws.

環状基台２６の自由端面２６ａには、断面逆台形状の環状溝２７が形成されている。環状溝２７は、一対の側壁２７ａと頂面２７ｂを有しており、側壁２７ａは自由端面２６ａから頂面２７ｂに向かって末広がりに形成されている。 An annular groove 27 having an inverted trapezoidal cross section is formed on the free end surface 26a of the annular base 26. The annular groove 27 has a pair of side walls 27a and a top surface 27b, and the side wall 27a is formed so as to spread toward the top surface 27b from the free end surface 26a.

砥石２８を固定するには、環状溝２７内に接着剤３１を充填し、その後砥石２８を環状溝２７内に挿入し、接着剤３１により砥石２８を環状溝２７内に固着する。好ましくは、接着剤３１としては、エポキシ樹脂が使用されるが、接着剤３１はエポキシ樹脂に限定されるものではない。 To fix the grindstone 28, the annular groove 27 is filled with an adhesive 31, then the grindstone 28 is inserted into the annular groove 27, and the grindstone 28 is fixed in the annular groove 27 by the adhesive 31. Preferably, an epoxy resin is used as the adhesive 31, but the adhesive 31 is not limited to the epoxy resin.

本実施形態の研削ホイール２４によると、環状溝２７の側壁２７ａが環状基台２６の自由端面２６ａから環状溝２７の頂面２７ｂに向かって末広がり形状をしているため、環状溝２７内に十分な量の接着剤３１を充填することができ、十分な量の接着剤３１により砥石２８を強固に固着することができる。 According to the grinding wheel 24 of the present embodiment, the side wall 27a of the annular groove 27 has a divergent shape from the free end surface 26a of the annular base 26 toward the top surface 27b of the annular groove 27, so that the inside of the annular groove 27 is sufficient. A large amount of the adhesive 31 can be filled, and the grindstone 28 can be firmly fixed by the sufficient amount of the adhesive 31.

これを接着剤３１のアンカー効果と称する。このアンカー効果により、被加工物の研削加工中に砥石２８が環状基台２６の環状溝２７から脱落したり、脱落せずとも砥石２８が破損したりすることを防止できる。 This is referred to as the anchor effect of the adhesive 31. Due to this anchor effect, it is possible to prevent the grindstone 28 from falling off from the annular groove 27 of the annular base 26 during the grinding process of the workpiece, or to prevent the grindstone 28 from being damaged even if it does not fall off.

図３（Ｂ）を参照すると、本発明第２実施形態の研削ホイール２４Ａの図２の３Ａ−３Ａ線断面図が示されている。本実施形態の研削ホイール２４Ａは、図３（Ａ）に示した第１実施形態の研削ホイール２４に環状の接着剤溜まり部３３を付加したものである。接着剤溜まり部３３は、環状溝２７の頂面２７ｂに連通するように形成されており、頂面２７ｂの幅より小さい幅を有している。 With reference to FIG. 3B, a sectional view taken along line 3A-3A of FIG. 2 of the grinding wheel 24A according to the second embodiment of the present invention is shown. The grinding wheel 24A of the present embodiment is obtained by adding an annular adhesive reservoir 33 to the grinding wheel 24 of the first embodiment shown in FIG. 3A. The adhesive reservoir 33 is formed so as to communicate with the top surface 27b of the annular groove 27, and has a width smaller than the width of the top surface 27b.

接着剤溜まり部３３の形状は、図示のような断面長方形状、又は正方形状、台形状或いは逆台形状の何れでもよい。接着剤溜まり部３３を環状溝２７の頂面２７ｂの幅内に複数形成するようにしてもよい。 The shape of the adhesive reservoir 33 may be a rectangular cross section as shown in the figure, a square shape, a trapezoidal shape, or an inverted trapezoidal shape. A plurality of adhesive pools 33 may be formed within the width of the top surface 27b of the annular groove 27.

本実施形態の研削ホイール２４Ａによると、第１実施形態の研削ホイール２４の効果に加えて、接着剤溜まり部３３中に充填された接着剤３１により、砥石２８をより強固に環状溝２７中に固着することができる。 According to the grinding wheel 24A of the present embodiment, in addition to the effect of the grinding wheel 24 of the first embodiment, the adhesive 31 filled in the adhesive collecting portion 33 makes the grindstone 28 more firmly in the annular groove 27. Can stick.

図４（Ａ）を参照すると、本発明第２実施形態の砥石２８Ａの斜視図が示されている。本実施形態の砥石２８Ａは、両側面２８ａに複数の溝３５を有している。即ち、砥石２８Ａは側面２８ａに凹凸形状を有している。 With reference to FIG. 4A, a perspective view of the grindstone 28A according to the second embodiment of the present invention is shown. The grindstone 28A of the present embodiment has a plurality of grooves 35 on both side surfaces 28a. That is, the grindstone 28A has an uneven shape on the side surface 28a.

図４（Ｂ）は図４（Ａ）に示した第２実施形態の砥石２８Ａを環状溝２７中に固着した、第３実施形態の研削ホイール２４Ｂの図２の３Ａ−３Ａ線断面図である。本実施形態では、砥石２８Ａが側面２８ａに複数の溝３５を有しているため、接着剤３１が溝３５中に充填されて、より強固に砥石２８Ａを環状溝２７中に固着することができる。 FIG. 4B is a cross-sectional view taken along the line 3A-3A of FIG. 2 of the grinding wheel 24B of the third embodiment in which the grindstone 28A of the second embodiment shown in FIG. 4A is fixed in the annular groove 27. .. In the present embodiment, since the grindstone 28A has a plurality of grooves 35 on the side surface 28a, the adhesive 31 can be filled in the grooves 35 and the grindstone 28A can be more firmly fixed in the annular groove 27. ..

図５（Ａ）を参照すると、本発明第３実施形態の砥石２８Ｂの斜視図が示されている。本実施形態の砥石２８Ｂは、頂面２８ｂに複数の溝３７を有している。 With reference to FIG. 5A, a perspective view of the grindstone 28B according to the third embodiment of the present invention is shown. The grindstone 28B of the present embodiment has a plurality of grooves 37 on the top surface 28b.

図５（Ｂ）は図５（Ａ）に示した第３実施形態の砥石２８Ｂを環状溝２７中に固着した、本発明第４実施形態の研削ホイール２４Ｃの図２の３Ａ−３Ａ線に沿った断面図を示している。 5 (B) shows the grindstone 28B of the third embodiment shown in FIG. 5 (A) fixed in the annular groove 27, along the line 3A-3A of FIG. 2 of the grinding wheel 24C of the fourth embodiment of the present invention. The cross-sectional view is shown.

本実施形態の研削ホイール２４Ｃでは、砥石２８Ｂの頂面２８ｂに複数の溝３７が形成されているため、これらの溝３７中に接着剤３１が入り込むので、図３（Ａ）に示した実施形態に比較して、より強固に砥石２８Ｂを環状溝２７中に固着することができる。 In the grinding wheel 24C of the present embodiment, since a plurality of grooves 37 are formed on the top surface 28b of the grindstone 28B, the adhesive 31 enters the grooves 37, and therefore, the embodiment shown in FIG. 3 (A). The grindstone 28B can be more firmly fixed in the annular groove 27 as compared with the above.

図６（Ａ）を参照すると、本発明第４実施形態の砥石２８Ｃの斜視図が示されている。本実施形態の砥石２８Ｃは、両側面２８ａを貫通する複数の貫通孔３９を有している。 With reference to FIG. 6A, a perspective view of the grindstone 28C according to the fourth embodiment of the present invention is shown. The grindstone 28C of the present embodiment has a plurality of through holes 39 penetrating the both side surfaces 28a.

図６（Ｂ）は図６（Ａ）に示した砥石２８Ｃを環状溝２７内に固着した、本発明第５実施形態の研削ホイール２４Ｄの図２の３Ａ−３Ａ線に沿う断面図を示している。本実施形態の研削ホイール２４Ｄでは、複数の貫通孔３９内に接着剤３１が充填されるため、図３（Ａ）に示した実施形態に比較して、より強固に砥石２８Ｃを環状溝２７内で固着することができる。 FIG. 6B shows a cross-sectional view of the grinding wheel 24D of the fifth embodiment of the present invention along the line 3A-3A of FIG. 2 in which the grindstone 28C shown in FIG. 6A is fixed in the annular groove 27. There is. In the grinding wheel 24D of the present embodiment, since the adhesive 31 is filled in the plurality of through holes 39, the grindstone 28C is more firmly placed in the annular groove 27 as compared with the embodiment shown in FIG. 3 (A). Can be fixed with.

図７（Ａ）を参照すると、本発明第５実施形態の砥石２８Ｄの斜視図が示されている。本実施形態の砥石２８Ｄは、側面２８ａに複数の接着剤溜まり部４１を有している。 With reference to FIG. 7A, a perspective view of the grindstone 28D according to the fifth embodiment of the present invention is shown. The grindstone 28D of the present embodiment has a plurality of adhesive pools 41 on the side surface 28a.

図７（Ｂ）は、図７（Ａ）に示した砥石２８Ｄを環状溝２７中に固着した本発明第６実施形態の研削ホイール２８Ｅの図２の３Ａ−３Ａ線斜視図が示されている。本実施形態の研削ホイール２４Ｅでは、砥石２８Ｄの側面２８ａに形成した接着剤溜まり部４１中に接着剤３１が侵入するため、図３（Ａ）に示した実施形態の研削ホイール２４に比較して、より強固に砥石２８Ｄを環状溝２７中で固着することができる。 FIG. 7B shows a perspective view of the grinding wheel 28E of the sixth embodiment of the present invention in which the grindstone 28D shown in FIG. 7A is fixed in the annular groove 27, in line 3A-3A of FIG. .. In the grinding wheel 24E of the present embodiment, the adhesive 31 penetrates into the adhesive collecting portion 41 formed on the side surface 28a of the grindstone 28D, so that the grinding wheel 24E of the present embodiment is compared with the grinding wheel 24 of the embodiment shown in FIG. , The grindstone 28D can be more firmly fixed in the annular groove 27.

図８（Ａ）を参照すると、本発明第６実施形態の砥石２８Ｅの斜視図が示されている。本実施形態の砥石２８Ｅは、頂面２８ｂに複数の接着剤溜まり部４３を有している。 With reference to FIG. 8A, a perspective view of the grindstone 28E according to the sixth embodiment of the present invention is shown. The grindstone 28E of the present embodiment has a plurality of adhesive pools 43 on the top surface 28b.

図８（Ｂ）は図８（Ａ）に示した砥石２８Ｅを環状溝２７中に固着した第７実施形態の研削ホイール２４Ｆの図２の３Ａ−３Ａ線断面図を示している。本実施形態の研削ホイール２４Ｆでは、砥石２８Ｅの頂面２８ｂに形成した複数の接着剤溜まり部４３中に接着剤３１が充填されるため、図３（Ａ）に示した実施形態の研削ホイール２４に比較して、より強固に砥石２８Ｅを環状溝２７中に固着することができる。 FIG. 8B shows a cross-sectional view taken along the line 3A-3A of FIG. 2 of the grinding wheel 24F of the seventh embodiment in which the grindstone 28E shown in FIG. 8A is fixed in the annular groove 27. In the grinding wheel 24F of the present embodiment, since the adhesive 31 is filled in the plurality of adhesive collecting portions 43 formed on the top surface 28b of the grindstone 28E, the grinding wheel 24 of the embodiment shown in FIG. 3A is shown. The grindstone 28E can be more firmly fixed in the annular groove 27 as compared with the above.

２ 研削装置
１０ 研削ユニット
２４ 研削ホイール
２６ 環状基台
２７ 環状溝
２８ 砥石（研削砥石）
３１ 接着剤
３３，４１ 接着剤溜まり部
３５，３７ 溝
３８ チャックテーブル
３９ 貫通孔 2 Grinding device 10 Grinding unit 24 Grinding wheel 26 Circular base 27 Circular groove 28 Grinding stone (grinding grindstone)
31 Adhesive 33, 41 Adhesive reservoir 35, 37 Groove 38 Chuck table 39 Through hole

Claims (2)

自由端面とホイールマウントへの装着面とを有する環状基台と、該環状基台の該自由端面に環状に形成された環状溝と、該環状溝内に充填された接着剤によって該環状溝に固着された複数の砥石とを含む研削ホイールであって、
該環状溝は一対の側壁と頂面とにより画成され、
該側壁は、該自由端面から該頂面に向かって末広がり形状をしており、
該砥石は、該接着剤が入り込むための両側面を貫通する貫通孔を有していることを特徴とする研削ホイール。 An annular base having a free end surface and a mounting surface for a wheel mount, an annular groove formed in an annular shape on the free end surface of the annular base, and an adhesive filled in the annular groove to form the annular groove. A grinding wheel that includes multiple grindstones that are fixed.
The annular groove is defined by a pair of side walls and a top surface.
The side wall has a divergent shape from the free end surface toward the top surface .
The grindstone is a grinding wheel characterized by having through holes penetrating both side surfaces for the adhesive to enter. 該環状溝の頂面は、該頂面の幅より小さい幅を有し、該環状溝に連通する該複数の砥石を固着するための環状の接着剤溜まり部を更に備える請求項１記載の研削ホイール。 The grinding according to claim 1, wherein the top surface of the annular groove has a width smaller than the width of the top surface, and further includes an annular adhesive reservoir for fixing the plurality of grindstones communicating with the annular groove. wheel.
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