JP7171128B2 - Grinding equipment - Google Patents

Description

The present invention relates to a grinding apparatus used for grinding workpieces.

By dividing a plate-shaped work piece typified by a semiconductor wafer on which devices such as IC (Integrated Circuit) and LSI (Large Scale Integration) are formed on the surface side, along the dividing lines (street), the device A plurality of device chips are obtained, each containing This device chip is built in various electronic devices, and in recent years, along with the miniaturization and thinning of electronic devices, the device chip is also required to be small and thin. Therefore, a method of thinning the workpiece by grinding the back side of the workpiece with a grinding wheel is used.

A grinding apparatus that includes a chuck table that holds the workpiece and a grinding unit that grinds the workpiece held on the chuck table is used for grinding the workpiece. The grinding unit of the grinding device has a wheel mount fixed to the tip of a spindle that serves as a rotating shaft, and a grinding wheel equipped with a grinding wheel for grinding the workpiece is attached to the wheel mount. The workpiece is ground by bringing the grinding wheel into contact with the workpiece while rotating the grinding wheel.

The attachment of the grinding wheel to the wheel mount is performed, for example, by fastening the wheel mount and the grinding wheel with bolts (screws). Patent Document 1 discloses a grinding wheel mounting mechanism that fixes the wheel mount and the grinding wheel by inserting a screw into a through hole formed in the wheel mount and screwing it into a threaded hole formed in the grinding wheel. ing.

JP 2003-181767 A

The attachment of the grinding wheel to the wheel mount is done manually by the operator. For example, when mounting the grinding wheel using a screw as described above, first, the grinding wheel is positioned so that the through hole formed in the wheel mount and the threaded hole formed in the grinding wheel are aligned, and then the grinding wheel is ground. It is necessary to insert the screw into the through hole and screw it into the threaded hole while holding the wheel in that position. Therefore, it takes time and effort to attach the grinding wheel.

Also, there is a risk that the screw may accidentally fall into the grinding machine during the process of installing the grinding wheel. In this case, it is necessary to search for and recover the dropped screw, which slows down the work of mounting the grinding wheel.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a grinding apparatus in which a grinding wheel can be easily attached to a wheel mount.

According to one aspect of the present invention, there is provided a grinding apparatus comprising a chuck table that holds a workpiece, and a grinding unit that grinds the workpiece held on the chuck table, wherein the grinding unit is , a spindle, and a wheel mount having a first base whose upper surface side is fixed to the tip of the spindle, and the upper surface side of the wheel mount is attached to the lower surface side of the first base. A grinding wheel having an annular second base and a grinding wheel disposed on the lower surface side of the second base is mounted, and the second base moves the second base from the upper surface to the lower surface. The wheel mount includes a plurality of first chuck claws fixed to the lower surface side of the first base and in contact with the inner circumferential surface of the second base. and a second chuck claw mounted on the lower surface side of the first base and in contact with the inner peripheral surface of the second base, wherein the second chuck claw is located on the center side of the first base. is connected via a biasing member to a support member fixed to the first chuck claw and is supported so as to be movable in the radial direction of the first base by expansion and contraction of the biasing member; Provided is a grinding apparatus in which when the spindle is rotated while the grinding wheel is supported by the second chuck claws, centrifugal force exerts pressure radially outward of the first base on the second chuck claws. be done. A threaded hole is formed in the lower surface of the first base, and an elongated hole passing through the second chuck claw is formed in the second chuck claw. It may be attached to the lower surface side of the first base by means of holes and screws inserted into the screw holes.

In the grinding apparatus according to one aspect of the present invention, the wheel mount includes a first chuck claw fixed to the base and a second chuck claw mounted on the base and movable in a radial direction of the base, A grinding wheel is supported by the chuck jaws and the second chuck jaws. Therefore, the grinding wheel can be easily attached to the wheel mount without complicated work such as screwing the grinding wheel and the wheel mount together.

It is a perspective view which shows a grinding apparatus. FIG. 2A is a perspective view showing the upper surface side of the grinding wheel, and FIG. 2B is a perspective view showing the lower surface side of the grinding wheel. FIG. 3(A) is a bottom view showing the wheel mount, and FIG. 3(B) is a sectional view showing the wheel mount. 4(A) and 4(B) are cross-sectional views showing how the grinding wheel is attached to the wheel mount.

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a perspective view showing a grinding device 2 according to this embodiment. The grinding device 2 grinds a plate-like workpiece, typically a semiconductor wafer having devices such as ICs and LSIs formed on its front side, with a grinding wheel.

The grinding device 2 includes a base 4 on which each component of the grinding device 2 is mounted, and a rectangular parallelepiped support structure 6 is provided at the rear end of the base 4 . An opening 4a is formed in the upper surface of the base 4 along the X-axis direction (front-rear direction).

A ball-screw type X-axis moving mechanism 8 and a dust/splash proof cover 10 covering a part of the X-axis moving mechanism 8 are arranged inside the opening 4a. The X-axis moving mechanism 8 has an X-axis moving table 8a, and moves this X-axis moving table 8a in the X-axis direction. Further, in front of the opening 4a, an operation panel 12 for inputting grinding processing conditions and the like is installed.

A chuck table 14 for holding a workpiece is provided on the X-axis moving table 8a, and a part of the upper surface of the chuck table 14 constitutes a suction surface 14a for sucking the workpiece. Here, the chuck table 14 and the suction surface 14a are formed in a circular shape assuming that a disk-shaped workpiece is to be held. It can be changed as appropriate according to the shape of the workpiece.

The suction surface 14 a is formed in a porous shape by porous ceramics or the like, and is connected to a suction source (not shown) through a suction path (not shown) formed inside the chuck table 14 . The workpiece is sucked and held by the chuck table 14 by applying the negative pressure of the suction source to the suction surface 14a while the workpiece is placed in contact with the suction surface 14a.

The chuck table 14 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the Z-axis direction (vertical direction). Also, the chuck table 14 moves in the X-axis direction together with the X-axis moving table 8a. Movement of the chuck table 14 is controlled by the X-axis movement mechanism 8 .

A Z-axis movement mechanism 16 is provided on the front side of the support structure 6 . The Z-axis moving mechanism 16 has a pair of Z-axis guide rails 18 arranged so that the longitudinal direction thereof extends along the Z-axis direction. It is mounted in a slidable manner along the direction. A nut portion (not shown) is provided on the rear surface side (rear surface side) of the Z-axis moving plate 20, and the Z-axis ball screw is arranged along a direction substantially parallel to the Z-axis guide rail 18 in this nut portion. 22 are screwed together.

A Z-axis pulse motor 24 is connected to one end of the Z-axis ball screw 22 . When the Z-axis ball screw 22 is rotated by the Z-axis pulse motor 24, the Z-axis moving plate 20 moves along the Z-axis guide rail 18 in the Z-axis direction.

A support 26 projecting forward is provided on the front side (front side) of the Z-axis movement plate 20 . The support 26 supports a grinding unit (grinding means) 28 for grinding the workpiece. The grinding unit 28 includes a spindle housing 30 fixed to the support 26, and a spindle 32 serving as a rotation shaft is rotatably accommodated in the spindle housing 30. As shown in FIG.

A tip (lower end) of the spindle 32 is exposed to the outside of the spindle housing 30 , and a disk-shaped wheel mount 34 is fixed to the tip of the spindle 32 . A disk-shaped grinding wheel 36 having approximately the same diameter as the wheel mount 34 is attached to the lower surface of the wheel mount 34 .

When grinding the workpiece, the chuck table 14 is sucked and held, and the X-axis moving mechanism 8 moves the chuck table 14 to position the chuck table 14 under the grinding wheel 36 . Then, while rotating the chuck table 14 and the spindle 32 in predetermined directions at a predetermined number of revolutions, the grinding wheel 36 is lowered at a predetermined speed to bring the grinding wheel 36 into contact with the workpiece. As a result, the grinding wheel 36 grinds the workpiece so as to scrape off a part of the workpiece, and the workpiece is thinly processed.

For example, a semiconductor wafer having a plurality of devices formed on the front side thereof is sucked and held by the chuck table 14 so that the back side thereof is exposed upward, and the back side of the semiconductor wafer is ground by the grinding wheel 36, whereby the semiconductor wafer is ground. It can be made thin.

There are no restrictions on the material, shape, structure, size, etc. of the workpiece sucked and held by the chuck table 14 . For example, wafers made of materials such as semiconductors (silicon, GaAs, InP, GaN, SiC, etc.), glass, ceramics, resins, and metals can be used as workpieces.

Next, a configuration example of the grinding wheel 36 mounted on the wheel mount 34 will be described. 2A is a perspective view showing the upper surface side of the grinding wheel 36, and FIG. 2B is a perspective view showing the lower surface side of the grinding wheel 36. FIG.

Grinding wheel 36 includes an annular base 40 having an upper surface 40a, a lower surface 40b and an outer peripheral surface 40c. A truncated conical opening 40d is formed in the central portion of the base 40 so as to pass through the base 40 from the upper surface 40a to the lower surface 40b and continuously increase in diameter from the upper surface 40a to the lower surface 40b. It is Inside the opening 40d, an inner peripheral surface 40e of the base 40 defining the outline of the opening 40d is exposed, and the inner peripheral surface 40e is inclined with respect to the upper surface 40a.

A pair of recessed portions 42 are formed on the upper surface 40a side of the base 40 so as to extend from the outer peripheral surface 40c to the inner peripheral surface 40e and are separated from each other by 180° in the circumferential direction of the base 40 . The pair of recesses 42 are formed in a rectangular shape when viewed from above, and are arranged such that the longitudinal direction thereof extends along the radial direction of the base 40 . A pair of recesses 42 are used for positioning when mounting the grinding wheel 36 to the wheel mount 34, as will be described below.

A plurality of grinding wheels 44 for grinding a workpiece are arranged along the circumference of the base 40 on the lower surface 40 b side of the base 40 . The grinding wheel 44 is formed, for example, by fixing abrasive grains made of diamond or the like with a binding material such as a metal bond, a resin bond, or a vitrified bond. FIG. 2B shows an example in which a plurality of rectangular parallelepiped grinding wheels 44 are annularly arranged along the outer periphery of the base 40 . The grinding wheel 44 is, for example, partially embedded in the lower surface 40b side of the base 40 and fixed with an adhesive or the like (see FIG. 4).

In addition, a plurality of grinding fluid supply paths 46 are formed at approximately equal intervals in the base 40 so as to pass through the base 40 from the upper surface 40a to the lower surface 40b. When grinding a workpiece with the grinding wheel 44 , a grinding liquid such as pure water is supplied to the grinding wheel 44 through the grinding liquid supply path 46 .

Grinding wheel 36 is mounted on a wheel mount 34 fixed to the distal end of spindle 32 . A configuration example of the wheel mount 34 according to the present embodiment will be described below. FIG. 3A is a bottom view showing the wheel mount 34, and FIG. 3B is a cross-sectional view of the wheel mount 34 taken along line AA'.

The wheel mount 34 includes a disk-shaped base 50 having approximately the same diameter as the base 40 of the grinding wheel 36. The base 50 has an upper surface 50a, a lower surface 50b and an outer peripheral surface 50c. A plurality of bolt insertion holes 52 penetrating through the base 50 from the upper surface 50 a to the lower surface 50 b are formed in the base 50 at approximately equal intervals in the circumferential direction of the base 50 .

A bolt for fixing the base 50 to the spindle 32 (see FIG. 1) is inserted into the bolt insertion hole 52, and the upper surface 50a side of the base 50 is fixed to the tip of the spindle 32 by the bolt.

A pair of protrusions 54 protruding downward from the lower surface 50b are provided on the lower surface 50b side of the base 50 at intervals of 180° in the circumferential direction of the base 50 . The pair of protrusions 54 are formed in a rectangular shape when viewed from the bottom, and are arranged on the outer peripheral portion of the base 50 so that the longitudinal direction thereof extends along the radial direction of the base 50 . When the lower surface 50b of the base 50 of the wheel mount 34 and the upper surface 40a of the base 40 of the grinding wheel 36 (see FIG. 2) face each other, the projection 54 is positioned to overlap the recess 42. As shown in FIG.

Also, the shape of the projection 54 corresponds to the shape of the recess 42 formed in the base 40 of the grinding wheel 36 , and the projection 54 can be partially or wholly inserted into the recess 42 . For example, the width of the convex portion 54 (the length in the direction perpendicular to the longitudinal direction of the convex portion 54) is substantially the same as the width of the concave portion 42 (the length in the direction perpendicular to the longitudinal direction of the concave portion 42). is formed as

When mounting the grinding wheel 36 on the wheel mount 34 , the upper surface 40 a of the base 40 and the lower surface 50 b of the base 50 are brought into contact so that the pair of protrusions 54 are inserted into the pair of recesses 42 . This positions the grinding wheel 36 at a predetermined angle with respect to the wheel mount 34 and circumferentially positions the wheel mount 34 and the grinding wheel 36 . Also, when the pair of protrusions 54 are inserted into the pair of recesses 42, the rotation of the grinding wheel 36 with respect to the wheel mount 34 is restricted to prevent misalignment of the grinding wheel 36. FIG.

A pair of semicircular grinding fluid supply grooves 56 a and 56 b are provided along the outer periphery of the base 50 on the side of the lower surface 50 b of the base 50 . The grinding liquid supply groove 56a and the grinding liquid supply groove 56b are separated by a convex portion 54 formed on the outer peripheral portion of the base 50, and a plurality of grinding liquid supply paths 58 are formed at the bottoms of the grinding liquid supply grooves 56a and 56b. The ends are open.

As shown in FIG. 3B, inside the base 50, a grinding fluid supply path 60 is formed in the center of the base 50 and supplied with a grinding fluid such as pure water. A grinding fluid supply path 58 is formed which branches off from and is connected to the grinding fluid supply groove 56a or the grinding fluid supply groove 56b.

Furthermore, two first chuck claws (fixed chuck claws) 62 are spaced apart by 120° in the circumferential direction of the base 50 in a region surrounded by the grinding fluid supply grooves 56a and 56b on the lower surface 50b side of the base 50. It is installed in the position where A through hole is formed in the first chuck claw 62, and a screw hole is formed in the lower surface 50b side of the base 50. A screw 64 inserted into the through hole formed in the first chuck claw 62 is inserted into the base. The first chuck claw 62 is fixed to the lower surface 50b side of the base 50 by being screwed into a screw hole formed in the lower surface 50b of the base 50 .

As shown in FIG. 3B, the first chuck claw 62 has an inclined surface 62a facing the outer peripheral surface 50c of the base 50 and inclined with respect to the lower surface 50b of the base 50. As shown in FIG. The inclined surface 62a has an angle between the lower surface 50b of the base 50 and the inclined surface 62a that is substantially equal to the angle between the upper surface 40a of the base 40 of the grinding wheel 36 shown in FIG. It is formed to be Therefore, the tip of the base 40 on the side of the opening 40 d can be inserted into the space sandwiched between the lower surface 50 b of the base 50 and the inclined surface 62 a of the first chuck claw 62 .

Furthermore, in the area surrounded by the grinding liquid supply grooves 56a and 56b on the lower surface 50b side of the base 50, a second chuck claw 62 is spaced apart from the two first chuck claws 62 in the circumferential direction of the base 50 by 120°. Chuck claws (movable chuck claws) 66 are provided. The second chuck claw 66 is mounted on the lower surface 50b side of the base 50 so as to be movable in the radial direction of the base 50 .

As shown in FIG. 3B, the second chuck claw 66 has an inclined surface 66d facing the outer peripheral surface 50c of the base 50 and inclined with respect to the lower surface 50b of the base 50. As shown in FIG. The angle between the lower surface 50b of the base 50 and the inclined surface 66d of the inclined surface 66d is substantially equal to the angle between the upper surface 40a of the base 40 of the grinding wheel 36 shown in FIG. It is formed to be Therefore, the tip of the base 40 on the side of the opening 40d can be inserted into the space sandwiched between the lower surface 50b of the base 50 and the inclined surface 66d of the second chuck claw 66. As shown in FIG.

Further, a supporting member 72 adjacent to the second chuck claw 66 on the center side of the base 50 is fixed to the lower surface 50 b side of the base 50 , and the second chuck claw 66 is supported via a biasing member 74 . It is connected with member 72 . As shown in FIG. 3B, the second chuck claw 66 has a support surface 66e facing the center side of the base 50, one end of the biasing member 74 is on the support surface 66e, and the other end is on the support surface 66e. Each is connected to a support member 72 .

The biasing member 74 is a member capable of biasing the second chuck claws 66, and is composed of, for example, an elastic member (such as a spring) capable of pressing the second chuck claws 66 with an elastic force. FIGS. 3A and 3B show an example in which a spring is used as the biasing member 72. FIG.

A long hole 66a is formed in the second chuck claw 66 so as to vertically penetrate the second chuck claw 66 . The long hole 66a is formed so that the longitudinal direction is along a straight line connecting the center of the base 50 and the position where the long hole 66a is provided. A threaded hole 68 is formed at a position corresponding to the elongated hole 66a on the lower surface 50b side of the base 50. As shown in FIG. The second chuck claw 66 is attached to the lower surface 50b side of the base 50 by a plurality of (two in this embodiment) screws 70 inserted into the long holes 66a and screwed into the screw holes 68. As shown in FIG.

As shown in FIG. 3B, the screw 70 is composed of a main body portion 70a inserted into the long hole 66a or the screw hole 68, and a head portion 70b connected to the main body portion 70a and having a larger diameter than the main body portion 70a. be. The diameter of the head portion 70b is larger than the length of the long hole 66a in the direction perpendicular to the longitudinal direction, and the second chuck claw 66 is supported from below by the head portion 70b.

The diameter of the body portion 70a of the screw 70 is approximately equal to the length of the long hole 66a in the direction perpendicular to the longitudinal direction. Also, the length from the side surface of the body portion 70a of the screw 70 closest to the outer peripheral surface 50c of the base 50 to the side surface of the body portion 70a of the screw 70 closest to the center of the base 50 (the length in FIG. 3(B) L) is shorter than the longitudinal length of the slot 66a. When the second chuck claw 66 is fixed by one screw 70, the length of the elongated hole 66a in the longitudinal direction is made larger than the diameter of the body portion 70a of the screw 70. As shown in FIG.

Further, the screwing amount of the screw 70 into the screw hole 68 is adjusted so that the second chuck claw 66 can slide between the lower surface 50b of the base 50 and the head 70b of the screw 70. As shown in FIG. Therefore, the second chuck claws 66 are movable (slidable) along the radial direction of the base 50 . The distance that the second chuck claw 66 can move corresponds to the length obtained by subtracting the length L shown in FIG. 3B from the length of the long hole 66a in the longitudinal direction.

When an external force is applied to the second chuck claws 66 in a direction toward the center of the base 50, the second chuck claws 66 slide radially inward of the base 50 (toward the center of the base 50) and move toward the biasing member. 74 shrinks. Further, when the application of the external force to the second chuck claws 66 is released, the second chuck claws 66 slide outward in the radial direction of the base 50 due to the restoring force of the biasing member 74 that has contracted.

In this manner, the second chuck claw 66 is supported so as to be movable in the radial direction of the base 50 by expansion and contraction of the biasing member 74 . When a spring is used as the biasing member 74, the biasing member 74 is provided so that the length of the second chuck claw 66 becomes equal to or less than the natural length when the second chuck claw 66 is arranged at the outermost position in the radial direction of the base 50. be done.

Further, as shown in FIG. 3A, the second chuck claw 66 has a first region 66b located on the center side of the base 50 and a position closer to the outer peripheral surface 50c of the base 50 than the first region 66b. , and a second region 66c narrower than the first region 66b in bottom view. However, the shape of the second chuck claws 66 can be changed as appropriate.

The grinding wheel 36 shown in FIG. 2 is attached to the lower surface 50b side of the base 50 on which the first chuck claws 62 and the second chuck claws 66 are provided as described above. Details of the procedure for mounting the grinding wheel 36 on the wheel mount 34 will be described below. 4A and 4B are sectional views showing how the grinding wheel 36 is attached to the wheel mount 34. FIG.

First, a part of the inner peripheral surface 40 e of the base 40 of the grinding wheel 36 is brought into contact with the inclined surface 66 d of the second chuck claw 66 so that the second chuck claw 66 is pressed toward the center of the base 50 . to move the grinding wheel 36 to. As a result, the biasing member 74 contracts, the second chuck claw 66 slides toward the center of the base 50, and the grinding wheel 36 reaches a position where the first chuck claw 62 can be inserted into the opening 40d of the base 40. Moving.

Next, as shown in FIG. 4A, the upper surface 40a of the base 40 and the base 50 are separated so that the projections 54 provided on the base 50 are inserted into the recesses 42 provided on the base 40. As shown in FIG. is brought into contact with the lower surface 50b of the . As a result, the circumferential angle of the grinding wheel 36 with respect to the wheel mount 34 is determined, and the first chuck claws 62 and the second chuck claws 66 are inserted into the openings 40 d of the base 40 .

After that, as shown in FIG. 4B, the grinding wheel 36 is slid while the protrusion 54 is kept inserted into the recess 42, and a part of the inner peripheral surface 40e of the base 40 is moved to the first chuck claw. 62 is brought into contact with the inclined surface 62a. At this time, the support surface 66e of the second chuck claw 66 is pressed by the biasing member 74, and the second chuck claw 66 is in a state where the inclined surface 66d and a part of the inner peripheral surface 40e of the base 40 are in contact. As it is, it slides radially outward of the base 50 .

As a result, the inner peripheral surface 40 e of the base 40 comes into contact with the inclined surfaces 62 a and 66 d , and the grinding wheel 36 is supported by the first chuck claws 62 and the second chuck claws 66 . Grinding wheel 36 is thus mounted to wheel mount 34 .

When the grinding wheel 36 is attached to the wheel mount 34, as shown in FIG. 4(B), the grinding fluid supply path 46 formed in the base 40 of the grinding wheel 36 and the base 50 of the wheel mount 34 are formed. The grinding fluid supply grooves 56a and 56b are connected to each other. Therefore, when the grinding fluid is supplied to the grinding fluid supply path 60 with the grinding wheel 36 attached to the wheel mount 34, the grinding fluid flows through the grinding fluid supply path 58, the grinding fluid supply grooves 56a and 56b, and the grinding fluid supply path 46. It is supplied to the grinding wheel 44 via.

When grinding a workpiece using a grinding wheel 36 attached to a wheel mount 34, the wheel mount 34 is rotated by rotating the spindle 32 (see FIG. 1). At this time, centrifugal force acts on the second chuck claws 66 in a radially outward direction of the base 50 . That is, in addition to the pressure caused by the restoring force of the biasing member 74 , the pressure caused by the centrifugal force is applied to the inner peripheral surface 40 e of the base 40 . As a result, the grinding wheel 36 is firmly fixed to the wheel mount 34, thereby preventing the grinding wheel 36 from coming off during the grinding process.

As described above, in the grinding apparatus 2 according to the present embodiment, the wheel mount 34 includes the first chuck claw 62 fixed to the base 50 and the second chuck claw 62 attached to the base 50 and movable in the radial direction of the base 50 . The grinding wheel 36 is supported by the first chuck jaws 62 and the second chuck jaws 66 . Therefore, the grinding wheel 36 can be easily attached to the wheel mount 34 without complicated work such as fixing the grinding wheel 36 and the wheel mount 34 with screws.

Further, in the grinding device 2 according to the present embodiment, since it is not necessary to use a screw for mounting the grinding wheel 36, there is no problem that the screw accidentally falls inside the grinding device when mounting the grinding wheel 36. Therefore, it is possible to avoid delays in the mounting operation of the grinding wheel 36 due to searching for and collecting the dropped screws.

In the above description, the first chuck claw 62 and the second chuck claw 66 are provided on the lower surface 50b side of the base 50. However, the second chuck claw 66 may be provided instead of the first chuck claw 62. good. In this case, grinding wheel 36 is supported by a plurality of movable second chuck jaws 66 . When a plurality of second chuck claws 66 are used, the same number of supporting members 72 and biasing members 74 as the number of second chuck claws 66 are provided, and each second chuck claw 66 is moved through the biasing members 74 . It is connected to the support member 72 .

Moreover, although the attachment of the grinding wheel 36 has been described above, the removal of the grinding wheel 36 can be carried out in the same manner. Specifically, first, the grinding wheel 36 is slid to separate the inner peripheral surface 40e of the base 40 from the inclined surface 62a of the first chuck claw 62, and the support of the base 40 by the first chuck claw 62 is released ( See FIG. 4(A)).

After that, the base 40 is separated from the base 50 of the wheel mount 34 so that the first chuck claw 62 is taken out from the opening 40 d of the base 40 . This removes the grinding wheel 36 from the wheel mount 34 . As described above, in the grinding apparatus according to this embodiment, the grinding wheel 36 can be easily removed from the wheel mount 34 simply by moving the base 40 .

In addition, the structures, methods, and the like according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention.

2 Grinding device 4 Base 4a Opening 6 Support structure 8 X-axis movement mechanism 8a X-axis movement table 10 Dust and drip proof cover 12 Operation panel 14 Chuck table 14a Suction surface 16 Z-axis movement mechanism 18 Z-axis guide rail 20 Z-axis movement plate 22 Z-axis ball screw 24 Z-axis pulse motor 26 support tool 28 grinding unit 30 spindle housing 32 spindle 34 wheel mount 36 grinding wheel 40 base 40a upper surface 40b lower surface 40c outer peripheral surface 40d opening 40e inner peripheral surface 42 recess 44 grinding wheel 46 grinding fluid Supply path 50 Base 50a Upper surface 50b Lower surface 50c Peripheral surface 52 Bolt insertion hole 54 Protrusions 56a, 56b Grinding fluid supply groove 58 Grinding fluid supply path 60 Grinding fluid supply path 62 First chuck claw 62a Inclined surface 64 Screw 66 Second chuck Claw 66a Long hole 66b First region 66c Second region 66d Inclined surface 66e Support surface 68 Screw hole 70 Screw 70a Main body 70b Head 72 Support member 74 Biasing member

Claims (2)

A grinding apparatus comprising a chuck table that holds a workpiece and a grinding unit that grinds the workpiece held on the chuck table,
The grinding unit has a spindle and a wheel mount having a first base whose upper surface side is fixed to the tip of the spindle,
The wheel mount includes an annular second base whose upper surface side is attached to the lower surface side of the first base, and a grinding wheel provided on the lower surface side of the second base. is worn and
The second base has an inner peripheral surface defining an opening penetrating the second base from the top surface to the bottom surface,
The wheel mount includes a plurality of first chuck claws fixed to the lower surface side of the first base and in contact with the inner peripheral surface of the second base; a second chuck claw that contacts the inner peripheral surface of the two bases;
The second chuck claw is connected via a biasing member to a support member fixed to the center side of the first base, and is moved in the radial direction of the first base by expansion and contraction of the biasing member. supported as possible
When the spindle is rotated while the grinding wheel is supported by the plurality of first chuck claws and the second chuck claws, centrifugal force exerts pressure on the second chuck claws toward the outside in the radial direction of the first base. A grinding device characterized in that is given. A screw hole is formed on the lower surface side of the first base,
A long hole penetrating the second chuck claw is formed in the second chuck claw,
2. The grinding apparatus according to claim 1, wherein said second chuck claw is attached to the lower surface side of said first base by screws inserted into said long hole and said screw hole.

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