JPH03117565U - - Google Patents
Info
- Publication number
- JPH03117565U JPH03117565U JP2585190U JP2585190U JPH03117565U JP H03117565 U JPH03117565 U JP H03117565U JP 2585190 U JP2585190 U JP 2585190U JP 2585190 U JP2585190 U JP 2585190U JP H03117565 U JPH03117565 U JP H03117565U
- Authority
- JP
- Japan
- Prior art keywords
- metal bond
- grinding wheel
- bond grinding
- holes
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
第１図は本考案のコンパウンド砥石の実施例を
一部を切り欠いて示す斜視図、第２図は同実施例
の断面図、第３図は正面図、第４図ないし第６図
は実施例を得るための工程を示す斜視図及び断面
図、第７図は第１図に示す実施例の断面を拡大し
て示す拡大図、第８図は作用を説明するための斜
視図、第９図はメタルボンド砥石の他の構成例を
示す斜視図、第１０図及び第１１図はメタルボン
ド砥石のさらに他の構成例を示す説明図、第１２
図および第１３図は従来の砥石を示す図である。
１０，１０ａ，１０ｂ，１０ｃ……円盤状基板
、１１，１１ａ，１１ｂ，１１ｃ……メタルボン
ド砥石、１２……機械保持用孔、１３……レジン
ボンド砥石、１６……貫通小孔。
Fig. 1 is a partially cutaway perspective view of an embodiment of the compound grinding wheel of the present invention, Fig. 2 is a sectional view of the same embodiment, Fig. 3 is a front view, and Figs. FIG. 7 is an enlarged view showing the cross section of the embodiment shown in FIG. 1; FIG. 8 is a perspective view for explaining the operation; FIG. The figure is a perspective view showing another example of the structure of the metal bond grindstone, FIGS. 10 and 11 are explanatory views showing still another example of the structure of the metal bond grindstone, and FIG.
1 and 13 are diagrams showing a conventional grindstone. 10, 10a, 10b, 10c... Disc-shaped substrate, 11, 11a, 11b, 11c... Metal bond grindstone, 12... Machine holding hole, 13... Resin bond grindstone, 16... Small through hole.
Claims (1)
したメタルボンド砥石と、 このメタルボンド砥石の前記貫通小孔を介して
一体的に連結して挟持する両側レジンボンド砥石
とから構成されたことを特徴とする砥石。[Claims for Utility Model Registration] A metal bond grinding wheel that has a through hole in the center and has a large number of through holes, and a metal bond grinding wheel that is integrally connected and held through the through holes of the metal bond grinding wheel. A whetstone characterized by being composed of a resin bonded whetstone on both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2585190U JPH03117565U (en) | 1990-03-13 | 1990-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2585190U JPH03117565U (en) | 1990-03-13 | 1990-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03117565U true JPH03117565U (en) | 1991-12-04 |
Family
ID=31528771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2585190U Pending JPH03117565U (en) | 1990-03-13 | 1990-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03117565U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011251351A (en) * | 2010-05-31 | 2011-12-15 | Mitsubishi Materials Corp | Thin-edged blade |
| JP2019000966A (en) * | 2017-06-19 | 2019-01-10 | 株式会社ディスコ | Abrasive wheel |
-
1990
- 1990-03-13 JP JP2585190U patent/JPH03117565U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011251351A (en) * | 2010-05-31 | 2011-12-15 | Mitsubishi Materials Corp | Thin-edged blade |
| JP2019000966A (en) * | 2017-06-19 | 2019-01-10 | 株式会社ディスコ | Abrasive wheel |
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