JP6984531B2 - Inspection equipment and protective sheet - Google Patents

Description

The present invention relates to an inspection device and a protective sheet.

Patent Document 1 discloses an inspection device that inspects a circuit board for electrical characteristics. In this inspection device, a circuit board in which a solder ball is formed on one side as an external connection terminal is targeted for inspection. A conductive sheet for electrically connecting the contact probe and the solder ball is disposed between the solder ball and the contact probe. Further, the inspection device is provided with a sliding means for sliding the conductive sheet so that the points pressed by the contact probe and the solder ball are different.

Japanese Unexamined Patent Publication No. 2008-157681

Generally, in a semiconductor chip characteristic inspection device, a semiconductor chip may be mounted on a test stage and the semiconductor chip may be energized to perform characteristic inspection. It is generally difficult to replace the test stage every time the characteristics of the semiconductor chip are inspected. Therefore, foreign matter may remain on the test stage and the back surface of the semiconductor chip may be scratched.

As a means of protecting the back surface of the semiconductor chip, it is conceivable to attach a conductive member between the test stage and the semiconductor chip. In this case, even if foreign matter remains on the conductive member, the foreign matter is recovered by exchanging the member, and damage to the back surface of the semiconductor chip can be prevented. However, since the conductive member is replaced by human work, the work load may increase. Further, since the conductive member is prepared for each chip size, the member cost may increase.

Further, in the inspection device of Patent Document 1, a conductor path that electrically connects the contact probe and the solder ball is formed on the conductive sheet by the pressing force. Therefore, the configuration of Patent Document 1 cannot be applied when the conductive member and the back surface of the semiconductor chip are made conductive and the contact probe is brought into contact with the upper surface of the semiconductor chip.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to obtain an inspection device and a protective sheet capable of suppressing the number of times of replacement of members.

The inspection device according to the present invention has a test stage, a protective sheet on which a semiconductor chip is mounted on the upper surface, and the protective sheet is slid on the test stage, and the semiconductor chip is mounted on the protective sheet. The protective sheet includes a feeding portion for switching portions, a probe for sending an electric signal to the semiconductor chip, and an electrode, and the protective sheet includes a sheet-shaped insulating portion and a plurality of striped portions on the upper surface of the insulating portion. A conductive portion is provided, and the electrode is electrically connected to a conductive portion in contact with the back surface of the semiconductor chip among the plurality of conductive portions.

The protective sheet according to the present disclosure includes a sheet-shaped insulating portion and a plurality of conductive portions provided in stripes on the upper surface of the insulating portion, and a back electrode of a semiconductor chip is provided on the plurality of conductive portions. It will be installed.

In the inspection device according to the present invention, a plurality of conductive portions are provided in a striped pattern on the upper surface side of the protective sheet. Therefore, even if the size of the semiconductor chip is changed, the semiconductor chip can be mounted on the plurality of conductive portions. Therefore, the number of times the members are replaced can be suppressed.
In the protective sheet according to the present invention, a plurality of conductive portions are provided in a striped pattern on the upper surface side. Therefore, even if the size of the semiconductor chip is changed, the semiconductor chip can be mounted on the plurality of conductive portions. Therefore, the number of times the members are replaced can be suppressed.

It is a perspective view of the inspection apparatus which concerns on Embodiment 1. FIG. It is a perspective view of the inspection apparatus which concerns on 1st comparative example. It is a perspective view of the inspection apparatus which concerns on the 2nd comparative example. It is a top view of the protective sheet which concerns on the 1st modification of Embodiment 1. FIG. It is a top view of the protective sheet which concerns on the 2nd modification of Embodiment 1. FIG. 2 is a plan view and a cross-sectional view of the protective sheet according to the second embodiment.

The inspection device and the protective sheet according to the embodiment of the present invention will be described with reference to the drawings. The same or corresponding components may be designated by the same reference numerals and the description may be omitted.

Embodiment 1.
FIG. 1 is a perspective view of the inspection device 100 according to the first embodiment. The inspection device 100 is a characteristic inspection device for the semiconductor chip 30. The inspection device 100 includes a test stage 10. The test stage 10 is a stage for inspecting the semiconductor chip 30. An adsorption mechanism for adsorbing the protective sheet 11 or the semiconductor chip 30, which will be described later, may be provided on the upper surface of the test stage 10.

The inspection device 100 includes a protective sheet 11. The protective sheet 11 is provided between the test stage 10 and the semiconductor chip 30. On the test stage 10, the semiconductor chip 30 is mounted on the upper surface of the protective sheet 11. The protective sheet 11 protects the back surface of the semiconductor chip 30 when inspecting the semiconductor chip 30. Further, the protective sheet 11 is provided to energize the back surface of the semiconductor chip 30.

The protective sheet 11 includes a sheet-shaped insulating portion 12 and a plurality of conductive portions 14 provided in stripes on the upper surface of the insulating portion 12. Each of the plurality of conductive portions 14 is linear. Further, each of the plurality of conductive portions 14 extends in a direction intersecting the longitudinal direction of the insulating portion 12. That is, each of the plurality of conductive portions 14 extends along the lateral direction of the insulating portion 12. The plurality of conductive portions 14 are arranged at equal intervals.

The semiconductor chip 30 is mounted on a plurality of conductive portions 14. At this time, the plurality of conductive portions 14 are in contact with the back surface of the semiconductor chip 30. The distance between the plurality of conductive portions 14 is narrower than the width of the semiconductor chip 30. As a result, the semiconductor chip 30 is provided between the plurality of conductive portions 14.

The inspection device 100 includes a supply unit 16 and a collection unit 18 of the protective sheet 11. The supply unit 16 and the collection unit 18 are, for example, rollers. A protective sheet 11 is wrapped around the supply unit 16 and the collection unit 18. On one side of the test stage 10, the protective sheet 11 is pulled out of the supply section 16. Further, the protective sheet 11 is collected by the collection unit 18 on the other side of the test stage 10.

The protective sheet 11 is pulled out from the supply unit 16, passes over the test stage 10, and is collected by the collection unit 18. On the test stage 10, the semiconductor chip 30 is mounted on the protective sheet 11 and the inspection is performed. The collection unit 18 collects the portion of the protective sheet 11 used for the inspection. Further, a new portion of the protective sheet 11 is supplied onto the test stage 10 by the supply unit 16. In the present embodiment, the supply unit 16 and the collection unit 18 slide the protective sheet 11 to form a feed unit that switches the portion of the protective sheet 11 on which the semiconductor chip 30 is mounted.

Each of the plurality of conductive portions 14 extends in a direction intersecting the sliding direction 81 of the protective sheet 11. Therefore, when the protective sheet 11 is slid by the feeding portion, the conductive portion 14 on which the semiconductor chip 30 is mounted is switched among the plurality of conductive portions 14. In this way, the conductive portion 14 on which the semiconductor chip 30 is mounted is automatically replaced. The conductive portion 14 is thinly provided so that the protective sheet 11 can be slid by the supply portion 16 and the recovery portion 18.

Further, the inspection device 100 includes a transport unit 22. The transport unit 22 transports the semiconductor chip 30 onto the test stage 10. The transport unit 22 sucks and transports, for example, the semiconductor chip 30. The operator may manually transport the semiconductor chip 30 using the transport unit 22, or the transport unit 22 may automatically transport the semiconductor chip 30.

Further, the inspection device 100 includes an electrode 20. The electrode 20 is provided at one end of the protective sheet 11 in the lateral direction. The electrode 20 is electrically connected to, for example, the conductive portion 14 on the test stage 10 among the plurality of conductive portions 14. The electrode 20 may be electrically connected to at least the conductive portion 14 in contact with the back surface of the semiconductor chip 30 among the plurality of conductive portions 14. When the electrode 20 comes into contact with the conductive portion 14, the conductive portion 14 is energized. As a result, a bias is applied to the back electrode of the semiconductor chip 30.

The electrode 20 has a vertical mechanism. As a result, the electrode 20 moves up and down as shown by the arrow 82. The electrode 20 is separated from the conductive portion 14 in a raised state, and is electrically connected to the conductive portion 14 in a lowered state. Further, when the protective sheet 11 is slid by the feeding portion, the conductive portion 14 electrically connected to the electrode 20 is switched among the plurality of conductive portions 14.

Further, the inspection device 100 includes an inspection unit 40 and a probe 41. The probe 41 contacts the top electrode of the semiconductor chip 30 and sends an electric signal to the semiconductor chip 30. The inspection unit 40 is connected to the probe 41 and the electrode 20. The conductive portion 14 comes into contact with the back electrode of the semiconductor chip 30, and the probe 41 comes into contact with the top electrode, whereby a circuit for characteristic inspection is formed. This circuit is formed by a semiconductor chip 30, a conductive portion 14, an electrode 20, an inspection portion 40, and a probe 41.

The inspection unit 40 supplies a bias to the electrode 20. Further, the inspection unit 40 transmits an electric signal to the semiconductor chip 30 via the probe 41. As a result, the inspection unit 40 inspects the characteristics of the semiconductor chip 30.

Next, the operation of the inspection device 100 will be described. First, the protective sheet 11 is laid on the test stage 10 by the supply unit 16. Next, the semiconductor chip 30 is conveyed onto the conductive portion 14 by the conveying portion 22 and mounted. Next, the electrode 20 is lowered to bring the electrode 20 into contact with the conductive portion 14. Further, the probe 41 is brought into contact with the top electrode of the semiconductor chip 30. As a result, the top electrode and the back electrode of the semiconductor chip 30 are energized.

In this state, the inspection unit 40 carries out a characteristic inspection. When the inspection is completed, the probe 41 is separated from the semiconductor chip 30. Then, the semiconductor chip 30 after the inspection is collected by the transport unit 22. After that, the electrode 20 is raised to separate the electrode 20 from the conductive portion 14. Next, the protective sheet 11 is slid to supply a new portion of the protective sheet 11 onto the test stage 10. After that, the characteristic inspection of the next semiconductor chip 30 is carried out by the same procedure.

FIG. 2 is a perspective view of the inspection device 800 according to the first comparative example. In the inspection device 800, a metal plate 814 for protecting the back surface of the semiconductor chip 30 is attached between the test stage 810 and the semiconductor chip 30. In such a configuration, by replacing the metal plate 814 at the time of maintenance, foreign matter adhering to the metal plate 814 at the time of inspection is recovered. Therefore, damage to the back surface of the chip due to foreign matter can be reduced.

Here, as the frequency of replacement of the metal plate 814 is increased, the scratch prevention effect is improved, but the member cost and the work load are increased. Further, when the metal plate 814 is automatically replaced, it is considered that the cost of the device is increased and the size of the device is increased. Therefore, it may be difficult to replace the metal plate 814 for each chip in the inspection device 800.

FIG. 3 is a perspective view of the inspection device 900 according to the second comparative example. The structure of the protective sheet 911 of the inspection device 900 is different from that of the present embodiment. In the protective sheet 911, the conductive portion 914 is provided on the insulating portion 912. The conductive portion 914 is square and corresponds to the shape of the semiconductor chip 30. By attaching the protective sheet 911, the conductive portion 914 can be replaced more easily than the metal plate 814. In addition, since foreign matter can be collected by feeding the sheet, it is possible to prevent the back surface of the chip from being scratched.

However, in the inspection device 900, if the conductive portion 914 does not fit the chip shape, it is necessary to replace the protective sheet 911. By preparing a plurality of types of protective sheets 911, the member cost may increase. In addition, the replacement of the protective sheet 911 may increase the equipment cost and workload. Further, it is conceivable to increase the conductive portion 914 in order to adapt to the shapes of a plurality of types of semiconductor chips 30, but in this case, the feed amount of the protective sheet 911 for each inspection becomes large, and the efficiency of the apparatus may decrease. There is sex.

Next, the effect of this embodiment will be described. In the present embodiment, a plurality of conductive portions 14 are provided in a striped pattern on the upper surface side of the protective sheet 11. Therefore, even if the size of the semiconductor chip 30 is changed, the semiconductor chip 30 can be mounted on the plurality of conductive portions 14 and the inspection can be performed. Therefore, it is not necessary to replace the protective sheet 11 for each chip size, and the number of replacements of the protective sheet 11 can be suppressed. Therefore, the device cost and workload for replacing the protective sheet 11 can be reduced. Further, since it is not necessary to prepare the protective sheet 11 for each chip size, the member cost can be reduced.

Further, by sliding the protective sheet 11 by the feeding portion, the conductive portion 14 on which the semiconductor chip 30 is mounted can be replaced for each chip. The protective sheet 11 may be slid for each semiconductor chip 30, or may be slid for each of a plurality of semiconductor chips 30 or when foreign matter is generated. Therefore, it is possible to prevent the back surface of the semiconductor chip 30 from being scratched by the foreign matter remaining on the protective sheet 11. Further, since the foreign matter is automatically collected and the new conductive portion 14 is supplied to the test stage 10, it is not necessary to perform cleaning work on the test stage 10. Further, by preventing the inspection from being carried out with the foreign matter adhering to the conductive portion 14, the inspection device 100 itself can be protected from the influence of the foreign matter. Therefore, the frequency of replacement of parts of the inspection device 100 can be reduced.

Further, by optimizing the feed amount according to the chip size, even if the chip size is changed, the conductive portion 14 on which the semiconductor chip 30 is mounted can be easily replaced for each chip. Further, unlike the second comparative example, it is not necessary to always set a large feed amount in accordance with the increase in size of the conductive portion 914, so that the efficiency of the apparatus can be improved.

Further, in the present embodiment, only a part of the plurality of conductive portions 14 is electrically connected to the electrode 20. In particular, the conductive section 14 housed in the supply section 16 or the recovery section 18 does not conduct with the electrode 20. Thereby, the discharge from the protective sheet 11, the supply unit 16 or the recovery unit 18 can be suppressed.

As a modification of the present embodiment, the electrode 20 may be electrically connected to at least the conductive portion 14 in contact with the back surface of the semiconductor chip 30, and may have another structure. Further, although the feeding portion is assumed to be a roller in the present embodiment, the feeding portion may be any as long as it can slide the protective sheet 11. Further, as the inspection unit 40 and the probe 41, any configuration capable of inspecting the semiconductor chip 30 can be adopted. Further, the transport unit 22 may hold the semiconductor chip 30 by a method other than adsorption as long as the semiconductor chip 30 can be transported.

Further, the plurality of conductive portions 14 may be inclined with respect to the lateral direction of the protective sheet 11, or may be provided along the longitudinal direction of the protective sheet 11. Further, the plurality of conductive portions 14 do not have to be arranged at equal intervals.

FIG. 4 is a plan view of the protective sheet 11a according to the first modification of the first embodiment. In FIG. 4, the semiconductor chip 30 is shown by a broken line for convenience. The distance between the plurality of conductive portions 14 is narrower in the protective sheet 11a than in the protective sheet 11. As described above, the distance between the conductive portions 14 may be changed according to the shape of the semiconductor chip 30 to be inspected, the required contact area between the semiconductor chip 30 and the conductive portion 14, and the like. At this time, the distance between the plurality of conductive portions 14 may be set to be narrower than the width of the minimum semiconductor chip 30 assumed to be an inspection target.

FIG. 5 is a plan view of the protective sheet 11b according to the second modification of the first embodiment. In FIG. 5, the semiconductor chip 30 is shown by a broken line for convenience. The protective sheet 11b is provided with a plurality of conductive portions 14b. The plurality of conductive portions 14b are wavy. In this way, the plurality of conductive portions 14b may be curved. As a result, the contact area between the plurality of conductive portions 14b and the semiconductor chip 30 can be increased. Therefore, the stability of energization can be improved. In addition, the stability of the chipset can be improved.

These modifications can be appropriately applied to the inspection device and the protective sheet according to the following embodiments. Since the inspection device and the protective sheet according to the following embodiments have much in common with the first embodiment, the differences from the first embodiment will be mainly described.

Embodiment 2.
FIG. 6 is a plan view and a cross-sectional view of the protective sheet 211 according to the second embodiment. The protective sheet 211 has a suction hole 224. The suction holes 224 are provided between the plurality of conductive portions 14. The suction hole 224 penetrates the insulating portion 12 from the upper surface to the back surface.

Further, the protective sheet 211 has an enclosure 226 surrounding the suction hole 224. The enclosure 226 is provided on the upper surface of the insulating portion 12. The enclosure 226 is provided in an annular shape so as to surround the suction hole 224. The enclosure 226 is formed from, for example, an insulator. The enclosure 226 has the same height as the plurality of conductive portions 14.

When the semiconductor chip 30 is mounted on the protective sheet 211 between the plurality of conductive portions 14, the semiconductor chip 30 closes the suction hole 224. The suction hole 224 is connected to, for example, the suction mechanism of the test stage 10. The suction hole 224 sucks the semiconductor chip 30. As a result, the semiconductor chip 30 is adsorbed on the protective sheet 211. Further, the enclosure 226 holds the semiconductor chip 30 together with the plurality of conductive portions 14. As a result, the semiconductor chip 30 can be stably set on the protective sheet 211.

The suction hole 224 and the enclosure 226 are not limited to a circle, but may be a triangle, a quadrangle, a polygon, or an ellipse.

The technical features described in each embodiment may be used in combination as appropriate.

100 Inspection equipment, 10 Test stages, 11, 11a, 11b, 211 Protective sheet, 12 Insulation part, 14, 14b Conductive part, 16 Supply part, 18 Recovery part, 30 Semiconductor chip, 41 Probe, 20 Electrode, 224 Suction hole, 226 Enclosure

Claims (10)

Test stage and
On the test stage, a protective sheet on which a semiconductor chip is mounted on the upper surface,
A feeding unit that slides the protective sheet to switch the portion of the protective sheet on which the semiconductor chip is mounted.
A probe that sends an electrical signal to the semiconductor chip,
With electrodes
Equipped with
The protective sheet includes a sheet-shaped insulating portion and a plurality of conductive portions provided in stripes on the upper surface of the insulating portion.
An inspection device characterized in that the electrode is electrically connected to a conductive portion in contact with the back surface of the semiconductor chip among the plurality of conductive portions. The inspection device according to claim 1, wherein each of the plurality of conductive portions extends in a direction intersecting the sliding direction of the protective sheet. The inspection device according to claim 2, wherein when the protective sheet slides, the conductive portion electrically connected to the electrode is switched among the plurality of conductive portions. The inspection according to any one of claims 1 to 3, wherein the electrode moves up and down, separates from the conductive portion in an raised state, and is electrically connected to the conductive portion in a lowered state. Device. The protective sheet is
A suction hole provided between the plurality of conductive portions for sucking the semiconductor chip,
Surrounding the suction holes and surrounding them at the same height as the plurality of conductive portions,
The inspection device according to any one of claims 1 to 4, wherein the inspection device is characterized by having. The inspection device according to any one of claims 1 to 5, wherein the plurality of conductive portions are arranged at equal intervals. The inspection device according to any one of claims 1 to 6, wherein the distance between the plurality of conductive portions is narrower than the width of the semiconductor chip. The inspection according to any one of claims 1 to 7 , wherein each of the plurality of conductive portions has a wavy shape having an amplitude in a direction intersecting the direction in which the conductive portions extend in a plan view. Device. Sheet-shaped insulation and
A plurality of conductive portions provided in stripes on the upper surface of the insulating portion, and
Equipped with
A protective sheet characterized in that a back surface electrode of a semiconductor chip is mounted on the plurality of conductive portions. The insulating portion has a longitudinal direction and a lateral direction in a plan view, and has a longitudinal direction and a lateral direction.
Each of said plurality of conductive portions, a protective sheet according to claim 9, characterized in that extending in a direction crossing the longitudinal direction of the insulating portion in a plan view.

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