JP2019190876A - Inspection device and protective sheet - Google Patents

Abstract

To provide an inspection device and a protective sheet which can reduce the number of exchanging a member.SOLUTION: The inspection device according to the present invention includes: a test stage; a protective sheet on the test stage, on which a semiconductor chip is to be quipped; a sending unit for sliding the protective sheet and switching a part of the protective sheet which is equipped with the semiconductor chip; a probe for sending an electric signal to the semiconductor chip; and an electrode. The protective sheet has a sheet-like insulating part and a plurality of conductive parts provided on the insulating part in a stripe pattern, and the electrode is electrically connected to one of the conductive parts which is in contact with the back surface of the semiconductor chip.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an inspection device and a protective sheet.

  Patent Document 1 discloses an inspection apparatus that performs an electrical characteristic inspection on a circuit board. In this inspection apparatus, a circuit board in which solder balls are formed on one side as external connection terminals is an inspection target. A conductive sheet for electrically connecting the contact probe and the solder ball is disposed between the solder ball and the contact probe. In addition, the inspection apparatus includes a sliding unit that slides the conductive sheet so that the place pressed by the contact probe and the solder ball becomes a different place.

JP 2008-157681 A

  Generally, in a semiconductor chip characteristic inspection apparatus, a semiconductor chip is mounted on a test stage, and the semiconductor chip is energized to perform characteristic inspection. It is generally difficult to replace the test stage every time the semiconductor chip is inspected. For this reason, foreign matters may remain on the test stage, and the back surface of the semiconductor chip may be damaged.

  As a means for protecting the back surface of the semiconductor chip, it is conceivable to attach a conductive member between the test stage and the semiconductor chip. In this case, even if foreign matter remains on the conductive member, the foreign matter is recovered by replacing the member, and damage to the back surface of the semiconductor chip can be prevented. However, since the conductive member is replaced by human work, the work load may be increased. Moreover, since a conductive member is prepared for each chip size, the member cost may increase.

  Moreover, in the inspection apparatus of patent document 1, the conductor path which electrically connects both by the pressing force of a contact probe and a solder ball is formed in a conductive sheet. For this reason, the configuration of Patent Document 1 cannot be applied when the conductive member and the back surface of the semiconductor chip are electrically connected and the contact probe is brought into contact with the top surface of the semiconductor chip.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to obtain an inspection device and a protective sheet that can suppress the number of member replacements.

  The inspection apparatus according to the present invention includes a test stage, a protective sheet on which the semiconductor chip is mounted on the test stage, and the protective sheet is slid, and the semiconductor chip is mounted on the protective sheet. A feed portion for switching the portion, a probe for sending an electric signal to the semiconductor chip, and an electrode, and the protective sheet includes a sheet-like insulating portion and a plurality of stripes provided on the upper surface of the insulating portion. A conductive portion, and the electrode is electrically connected to a conductive portion in contact with a back surface of the semiconductor chip among the plurality of conductive portions.

  A protective sheet according to the present invention includes a sheet-like insulating portion and a plurality of conductive portions provided in stripes on the upper surface of the insulating portion, and a semiconductor chip is mounted on the plurality of conductive portions. .

In the inspection apparatus according to the present invention, a plurality of conductive portions are provided in stripes on the upper surface side of the protective sheet. For this reason, even if the size of the semiconductor chip is changed, the semiconductor chip can be mounted on the plurality of conductive portions. Therefore, the number of member replacements can be suppressed.
In the protective sheet according to the present invention, a plurality of conductive portions are provided in stripes on the upper surface side. For this reason, even if the size of the semiconductor chip is changed, the semiconductor chip can be mounted on the plurality of conductive portions. Therefore, the number of member replacements can be suppressed.

1 is a perspective view of an inspection apparatus according to Embodiment 1. FIG. It is a perspective view of the inspection apparatus which concerns on a 1st comparative example. It is a perspective view of the inspection apparatus which concerns on a 2nd comparative example. FIG. 10 is a plan view of a protective sheet according to a first modification of the first embodiment. 6 is a plan view of a protective sheet according to a second modification of the first embodiment. FIG. It is the top view and sectional drawing of the protection sheet which concern on Embodiment 2. FIG.

  An inspection apparatus and a protective sheet according to an embodiment of the present invention will be described with reference to the drawings. The same or corresponding components are denoted by the same reference numerals, and repeated description may be omitted.

Embodiment 1 FIG.
FIG. 1 is a perspective view of an inspection apparatus 100 according to the first embodiment. The inspection apparatus 100 is a characteristic inspection apparatus for the semiconductor chip 30. The inspection apparatus 100 includes a test stage 10. The test stage 10 is a stage for inspecting the semiconductor chip 30. An adsorption mechanism that adsorbs a protection sheet 11 or a semiconductor chip 30 described later may be provided on the upper surface of the test stage 10.

  The inspection device 100 includes a protective sheet 11. The protective sheet 11 is provided between the test stage 10 and the semiconductor chip 30. A semiconductor chip 30 is mounted on the upper surface of the protective sheet 11 on the test stage 10. The protective sheet 11 protects the back surface of the semiconductor chip 30 when the semiconductor chip 30 is inspected. The protective sheet 11 is provided to energize the back surface of the semiconductor chip 30.

  The protective sheet 11 includes a sheet-like insulating portion 12 and a plurality of conductive portions 14 provided in a stripe shape on the upper surface of the insulating portion 12. Each of the plurality of conductive portions 14 is linear. Further, each of the plurality of conductive portions 14 extends in a direction intersecting with the longitudinal direction of the insulating portion 12. That is, each of the plurality of conductive portions 14 extends along the short direction of the insulating portion 12. The plurality of conductive portions 14 are arranged at equal intervals.

  The semiconductor chip 30 is mounted on the plurality of conductive portions 14. At this time, the plurality of conductive portions 14 are in contact with the back surface of the semiconductor chip 30. The interval between the plurality of conductive portions 14 is narrower than the width of the semiconductor chip 30. Thereby, the semiconductor chip 30 is provided between the plurality of conductive portions 14.

  The inspection apparatus 100 includes a supply unit 16 and a collection unit 18 for the protective sheet 11. The supply unit 16 and the collection unit 18 are, for example, rollers. A protective sheet 11 is wound around the supply unit 16 and the recovery unit 18. On one side of the test stage 10, the protective sheet 11 is pulled out from the supply unit 16. Further, the protective sheet 11 is collected by the collection unit 18 on the other side of the test stage 10.

  The protective sheet 11 is pulled out from the supply unit 16, passes over the test stage 10, and is collected by the collection unit 18. On the test stage 10, a semiconductor chip 30 is mounted on the protective sheet 11, and an inspection is performed. The collection unit 18 collects a portion of the protective sheet 11 that was used for the inspection. Further, a new portion of the protective sheet 11 is supplied onto the test stage 10 by the supply unit 16. In the present embodiment, the supply unit 16 and the collection unit 18 constitute a feeding unit that slides the protective sheet 11 and switches a portion of the protective sheet 11 on which the semiconductor chip 30 is mounted.

  Each of the plurality of conductive portions 14 extends in a direction intersecting the direction 81 in which the protective sheet 11 slides. For this reason, when the protective sheet 11 is slid by the feeding portion, the conductive portion 14 on which the semiconductor chip 30 is mounted is switched among the plurality of conductive portions 14. In this way, the conductive portion 14 on which the semiconductor chip 30 is mounted is automatically replaced. The conductive portion 14 is thinly provided so that the protective sheet 11 can be slid by the supply portion 16 and the collection portion 18.

  In addition, the inspection apparatus 100 includes a transport unit 22. The transport unit 22 transports the semiconductor chip 30 onto the test stage 10. For example, the transport unit 22 sucks and transports the semiconductor chip 30. An operator may manually transport the semiconductor chip 30 using the transport unit 22, or the transport unit 22 may transport the semiconductor chip 30 automatically.

  The inspection apparatus 100 includes an electrode 20. The electrode 20 is provided at one end of the protective sheet 11 in the short direction. The electrode 20 is electrically connected to, for example, the conductive portion 14 on the test stage 10 among the plurality of conductive portions 14. The electrode 20 only needs to be electrically connected to at least the conductive portion 14 in contact with the back surface of the semiconductor chip 30 among the plurality of conductive portions 14. The conductive portion 14 is energized when the electrode 20 contacts the conductive portion 14. Thereby, a bias is applied to the back electrode of the semiconductor chip 30.

  The electrode 20 has a vertical mechanism. As a result, the electrode 20 moves up and down as indicated by an arrow 82. The electrode 20 is separated from the conductive portion 14 in the raised state, and is electrically connected to the conductive portion 14 in the lowered state. Further, when the protective sheet 11 is slid by the feeding portion, the conductive portion 14 electrically connected to the electrode 20 among the plurality of conductive portions 14 is switched.

  In addition, the inspection apparatus 100 includes an inspection unit 40 and a probe 41. The probe 41 contacts the upper surface electrode of the semiconductor chip 30 and sends an electrical signal to the semiconductor chip 30. The inspection unit 40 is connected to the probe 41 and the electrode 20. A circuit for characteristic inspection is formed when the conductive portion 14 is in contact with the back electrode of the semiconductor chip 30 and the probe 41 is in contact with the top electrode. This circuit is formed by the semiconductor chip 30, the conductive portion 14, the electrode 20, the inspection portion 40 and the probe 41.

  The inspection unit 40 supplies a bias to the electrode 20. Further, the inspection unit 40 transmits an electrical signal to the semiconductor chip 30 via the probe 41. Thereby, the inspection unit 40 performs a characteristic inspection of the semiconductor chip 30.

  Next, the operation of the inspection apparatus 100 will be described. First, the protective sheet 11 is laid on the test stage 10 by the supply unit 16. Next, the semiconductor chip 30 is transported and mounted on the conductive portion 14 by the transport unit 22. Next, the electrode 20 is lowered to bring the electrode 20 into contact with the conductive portion 14. Further, the probe 41 is brought into contact with the upper surface electrode of the semiconductor chip 30. Thereby, energization is performed to the upper surface electrode and the rear surface electrode of the semiconductor chip 30.

  In this state, the inspection unit 40 performs a characteristic inspection. When the inspection is completed, the probe 41 is separated from the semiconductor chip 30. Then, the semiconductor chip 30 after the inspection is collected by the transport unit 22. Thereafter, the electrode 20 is raised and the electrode 20 is separated from the conductive portion 14. Next, the protection sheet 11 is slid and a new part of the protection sheet 11 is supplied onto the test stage 10. Thereafter, the characteristic inspection of the next semiconductor chip 30 is performed in the same procedure.

  FIG. 2 is a perspective view of an inspection apparatus 800 according to the first comparative example. In the inspection apparatus 800, a metal plate 814 for protecting the back surface of the semiconductor chip 30 is attached between the test stage 810 and the semiconductor chip 30. In such a configuration, by replacing the metal plate 814 during maintenance, foreign matter attached to the metal plate 814 during inspection is collected. For this reason, damage on the back surface of the chip due to foreign matter can be reduced.

  Here, as the replacement frequency of the metal plate 814 is increased, the effect of preventing scratches is improved, while the member cost and the work load are increased. Further, when the metal plate 814 is automatically replaced, it can be considered that the apparatus cost is increased and the apparatus is enlarged. Therefore, it may be difficult to replace the metal plate 814 for each chip in the inspection apparatus 800.

  FIG. 3 is a perspective view of an inspection apparatus 900 according to the second comparative example. In the inspection apparatus 900, the configuration of the protective sheet 911 is different from that of the present embodiment. In the protective sheet 911, the conductive portion 914 is provided on the insulating portion 912. The conductive part 914 is square and corresponds to the shape of the semiconductor chip 30. By attaching the protective sheet 911, the conductive portion 914 can be replaced more easily than the metal plate 814. Further, since foreign matters can be collected by sheet feeding, it is possible to prevent the back surface of the chip from being damaged.

  However, in the inspection apparatus 900, when the conductive part 914 does not match the chip shape, it is necessary to replace the protective sheet 911. By preparing a plurality of types of protective sheets 911, member costs may increase. In addition, the replacement of the protective sheet 911 may increase the apparatus cost and the work load. In addition, it is conceivable to increase the conductive portion 914 in order to adapt to the shapes of a plurality of types of semiconductor chips 30, but in this case, the feed amount of the protective sheet 911 for each inspection is increased, and the efficiency of the apparatus may be reduced. There is sex.

  Next, the effect of this embodiment will be described. In the present embodiment, a plurality of conductive portions 14 are provided in stripes on the upper surface side of the protective sheet 11. For this reason, even if the size of the semiconductor chip 30 is changed, the semiconductor chip 30 can be mounted on the plurality of conductive portions 14 and the inspection can be performed. For this reason, it is not necessary to replace the protective sheet 11 for each chip size, and the number of replacements of the protective sheet 11 can be suppressed. Therefore, the apparatus cost and work load for replacement | exchange of the protection sheet 11 can be reduced. Moreover, since it is not necessary to prepare the protective sheet 11 for every chip size, the member cost can be reduced.

  Moreover, the conductive sheet 14 on which the semiconductor chip 30 is mounted can be replaced for each chip by sliding the protective sheet 11 by the feeding unit. The protective sheet 11 may be slid for each semiconductor chip 30 or may be slid for each of the plurality of semiconductor chips 30 or when a foreign substance is generated. Accordingly, it is possible to prevent the back surface of the semiconductor chip 30 from being damaged by the foreign matter remaining on the protective sheet 11. In addition, since foreign matter is automatically collected and a new conductive portion 14 is supplied to the test stage 10, it is not necessary to perform cleaning work on the test stage 10. Further, the inspection apparatus 100 itself can be protected from the influence of the foreign matter by preventing the inspection from being performed with the foreign matter adhering to the conductive portion 14. For this reason, the replacement frequency of the components of the inspection apparatus 100 can be reduced.

  Further, by optimizing the feeding amount according to the chip size, the conductive portion 14 on which the semiconductor chip 30 is mounted can be easily replaced for each chip even if the chip size is changed. In addition, since it is not necessary to always set the feed amount large in accordance with the increase in size of the conductive portion 914 as in the second comparative example, the efficiency of the apparatus can be improved.

  Furthermore, in this embodiment, only a part of the plurality of conductive portions 14 is electrically connected to the electrode 20. In particular, the conductive part 14 accommodated in the supply part 16 or the recovery part 18 is not electrically connected to the electrode 20. Thereby, the discharge from the protection sheet 11, the supply part 16, or the collection | recovery part 18 can be suppressed.

  As a modification of the present embodiment, the electrode 20 may be electrically connected to at least the conductive portion 14 that is in contact with the back surface of the semiconductor chip 30 and may have another structure. In the present embodiment, the feeding unit is a roller, but the feeding unit may be any unit that can slide the protective sheet 11. Further, as the inspection unit 40 and the probe 41, any configuration capable of inspecting the semiconductor chip 30 can be adopted. In addition, the transport unit 22 may hold the semiconductor chip 30 by a method other than adsorption as long as the semiconductor chip 30 can be transported.

  The plurality of conductive portions 14 may be inclined with respect to the short direction of the protective sheet 11, and may be provided along the longitudinal direction of the protective sheet 11. Further, the plurality of conductive portions 14 may not be arranged at equal intervals.

  FIG. 4 is a plan view of the protective sheet 11a according to the first modification of the first embodiment. In FIG. 4, the semiconductor chip 30 is indicated by a broken line for convenience. The intervals between the plurality of conductive portions 14 are narrower than the protective sheet 11 in the protective sheet 11a. As described above, the interval between the conductive portions 14 may be changed according to the shape of the semiconductor chip 30 to be inspected or the contact area between the semiconductor chip 30 and the conductive portion 14 required. At this time, the interval between the plurality of conductive portions 14 is preferably set to be narrower than the width of the smallest semiconductor chip 30 assumed as an inspection target.

  FIG. 5 is a plan view of a protective sheet 11b according to a second modification of the first embodiment. In FIG. 5, the semiconductor chip 30 is indicated by a broken line for convenience. The protective sheet 11b is provided with a plurality of conductive portions 14b. The plurality of conductive portions 14b are wavy. As described above, the plurality of conductive portions 14b may be curved. Thereby, the contact area of the some electroconductive part 14b and the semiconductor chip 30 can be enlarged. Therefore, the stability of energization can be improved. In addition, stability during chip setting can be improved.

  These modifications can be applied as appropriate to inspection devices and protective sheets according to the following embodiments. Note that the inspection apparatus and the protective sheet according to the following embodiment have much in common with the first embodiment, and therefore, differences from the first embodiment will be mainly described.

Embodiment 2. FIG.
FIG. 6 is a plan view and a cross-sectional view of the protective sheet 211 according to the second embodiment. The protective sheet 211 has a suction hole 224. The suction hole 224 is provided between the plurality of conductive portions 14. The suction hole 224 penetrates the insulating portion 12 from the upper surface to the back surface.

  Further, the protective sheet 211 has an enclosure 226 that surrounds the suction hole 224. The enclosure 226 is provided on the upper surface of the insulating portion 12. The enclosure 226 is provided in an annular shape so as to surround the suction hole 224. The enclosure 226 is formed from an insulator, for example. The enclosure 226 has the same height as the plurality of conductive portions 14.

  When the semiconductor chip 30 is mounted on the protective sheet 211 across the plurality of conductive portions 14, the semiconductor chip 30 closes the suction holes 224. The suction hole 224 is connected to, for example, the suction mechanism of the test stage 10. The suction hole 224 sucks the semiconductor chip 30. Thereby, the semiconductor chip 30 is adsorbed on the protective sheet 211. The enclosure 226 holds the semiconductor chip 30 together with the plurality of conductive portions 14. Thereby, the semiconductor chip 30 can be stably set on the protective sheet 211.

  The suction hole 224 and the enclosure 226 are not limited to a circle, but may be a triangle, a rectangle, a polygon, or an ellipse.

  The technical features described in each embodiment may be used in appropriate combination.

DESCRIPTION OF SYMBOLS 100 Inspection apparatus, 10 Test stage, 11, 11a, 11b, 211 Protective sheet, 12 Insulating part, 14, 14b Conductive part, 16 Supply part, 18 Recovery part, 30 Semiconductor chip, 41 Probe, 20 Electrode, 224 Adsorption hole, 226 enclosure

Claims (10)

The test stage,
On the test stage, a protective sheet on which a semiconductor chip is mounted on the upper surface,
A slide unit that slides the protective sheet and switches a portion of the protective sheet on which the semiconductor chip is mounted; and
A probe for sending an electrical signal to the semiconductor chip;
Electrodes,
With
The protective sheet includes a sheet-like insulating portion, and a plurality of conductive portions provided in stripes on the upper surface of the insulating portion,
The inspection apparatus according to claim 1, wherein the electrode is electrically connected to a conductive portion in contact with a back surface of the semiconductor chip among the plurality of conductive portions.   The inspection apparatus according to claim 1, wherein each of the plurality of conductive portions extends in a direction intersecting a direction in which the protection sheet slides.   The inspection apparatus according to claim 2, wherein when the protective sheet slides, a conductive portion electrically connected to the electrode among the plurality of conductive portions is switched.   4. The inspection according to claim 1, wherein the electrode moves up and down, separates from the conductive portion in a raised state, and is electrically connected to the conductive portion in a lowered state. 5. apparatus. The protective sheet is
A suction hole that is provided between the plurality of conductive portions and sucks the semiconductor chip;
Surrounding the suction hole, and surrounding the same height as the plurality of conductive parts;
5. The inspection apparatus according to claim 1, further comprising:   6. The inspection apparatus according to claim 1, wherein the plurality of conductive parts are arranged at equal intervals.   The inspection apparatus according to claim 1, wherein an interval between the plurality of conductive portions is narrower than a width of the semiconductor chip.   The inspection apparatus according to claim 1, wherein the plurality of conductive portions are wavy. A sheet-like insulating part;
A plurality of conductive portions provided in stripes on the upper surface of the insulating portion;
With
A protective sheet, wherein a semiconductor chip is mounted on the plurality of conductive portions.   The protective sheet according to claim 9, wherein each of the plurality of conductive portions extends in a direction intersecting with a longitudinal direction of the insulating portion.

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