JP6973023B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6973023B2 JP6973023B2 JP2017243057A JP2017243057A JP6973023B2 JP 6973023 B2 JP6973023 B2 JP 6973023B2 JP 2017243057 A JP2017243057 A JP 2017243057A JP 2017243057 A JP2017243057 A JP 2017243057A JP 6973023 B2 JP6973023 B2 JP 6973023B2
- Authority
- JP
- Japan
- Prior art keywords
- heat radiating
- semiconductor element
- semiconductor device
- sealing resin
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
110:半導体素子
112:上面
114:下面
116:外縁
120、140:放熱板
130:放熱ブロック
136:外縁
150:ボンディングワイヤ
160:端子
310:放熱材
320:プライマ層
320B:プライマ層
330:封止樹脂
Claims (1)
- 半導体装置であって、
上面および下面を有する板状の半導体素子と、
前記下面にはんだ付けされた第1の金属板と、
前記半導体素子の外縁より内側において前記上面にはんだ付けされた放熱ブロックと、
前記半導体素子とは反対側において前記放熱ブロックにはんだ付けされた第2の金属板と、
少なくとも前記上面から前記放熱ブロックの外縁にわたって設けられた放熱材と、
前記第1の金属板と前記第2の金属板との間に、前記半導体素子、前記放熱ブロックおよび前記放熱材を封止する封止樹脂と、
を備えており、
前記放熱材は、前記封止樹脂の熱伝導率以上の熱伝導率を有しているとともに、前記封止樹脂の体積抵抗率以上の体積抵抗率と、前記封止樹脂の絶縁破壊耐圧以上の絶縁破壊耐圧の少なくとも一方を有している、半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017243057A JP6973023B2 (ja) | 2017-12-19 | 2017-12-19 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017243057A JP6973023B2 (ja) | 2017-12-19 | 2017-12-19 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019110244A JP2019110244A (ja) | 2019-07-04 |
JP6973023B2 true JP6973023B2 (ja) | 2021-11-24 |
Family
ID=67180151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017243057A Active JP6973023B2 (ja) | 2017-12-19 | 2017-12-19 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6973023B2 (ja) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02288256A (ja) * | 1989-04-28 | 1990-11-28 | Hitachi Ltd | 冷却素子 |
JP3807354B2 (ja) * | 2001-08-06 | 2006-08-09 | 株式会社デンソー | 半導体装置 |
CN102473653B (zh) * | 2010-02-01 | 2016-05-04 | 丰田自动车株式会社 | 半导体装置的制造方法以及半导体装置 |
JP5698542B2 (ja) * | 2011-01-14 | 2015-04-08 | アロン化成株式会社 | 放熱構造体及びその製造方法 |
-
2017
- 2017-12-19 JP JP2017243057A patent/JP6973023B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2019110244A (ja) | 2019-07-04 |
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