JP6956068B2 - バリアフィルム構成体 - Google Patents

バリアフィルム構成体 Download PDF

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Publication number
JP6956068B2
JP6956068B2 JP2018508199A JP2018508199A JP6956068B2 JP 6956068 B2 JP6956068 B2 JP 6956068B2 JP 2018508199 A JP2018508199 A JP 2018508199A JP 2018508199 A JP2018508199 A JP 2018508199A JP 6956068 B2 JP6956068 B2 JP 6956068B2
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JP
Japan
Prior art keywords
barrier
barrier film
resin
adhesive
nanoclay
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JP2018508199A
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Japanese (ja)
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JP2018529550A5 (enExample
JP2018529550A (ja
Inventor
ピー． ジョンソン，ジェイコブ
ピー． ジョンソン，ジェイコブ
マコーミック，フレッド　ビー．
ビー． マコーミック，フレッド
ジェイ． ミュラー，アダム
ジェイ． ミュラー，アダム
ジェイ． ポコーニー，リチャード
ジェイ． ポコーニー，リチャード
ジェイ． シュミット，ダニエル
ジェイ． シュミット，ダニエル
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2018529550A publication Critical patent/JP2018529550A/ja
Publication of JP2018529550A5 publication Critical patent/JP2018529550A5/ja
Priority to JP2021123808A priority Critical patent/JP7186267B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C08L23/22—Copolymers of isobutene; Butyl rubber; Homopolymers or copolymers of other iso-olefins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
    • C08L93/04—Rosin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/151—Copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesive Tapes (AREA)
JP2018508199A 2015-08-17 2016-08-15 バリアフィルム構成体 Active JP6956068B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021123808A JP7186267B2 (ja) 2015-08-17 2021-07-29 バリアフィルム構成体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562206070P 2015-08-17 2015-08-17
US62/206,070 2015-08-17
PCT/US2016/046974 WO2017031031A1 (en) 2015-08-17 2016-08-15 Barrier film constructions

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021123808A Division JP7186267B2 (ja) 2015-08-17 2021-07-29 バリアフィルム構成体

Publications (3)

Publication Number Publication Date
JP2018529550A JP2018529550A (ja) 2018-10-11
JP2018529550A5 JP2018529550A5 (enExample) 2019-09-26
JP6956068B2 true JP6956068B2 (ja) 2021-10-27

Family

ID=58052255

Family Applications (2)

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JP2018508199A Active JP6956068B2 (ja) 2015-08-17 2016-08-15 バリアフィルム構成体
JP2021123808A Active JP7186267B2 (ja) 2015-08-17 2021-07-29 バリアフィルム構成体

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Country Status (6)

Country Link
US (1) US10581015B2 (enExample)
JP (2) JP6956068B2 (enExample)
KR (1) KR20180031793A (enExample)
CN (1) CN107925010B (enExample)
TW (1) TW201726851A (enExample)
WO (1) WO2017031031A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10738224B2 (en) 2015-08-17 2020-08-11 3M Innovative Properties Company Nanoclay filled barrier adhesive compositions
US11034865B2 (en) * 2016-06-16 2021-06-15 3M Innovative Properties Company Nanoparticle filled barrier adhesive compositions
JP6903992B2 (ja) * 2017-03-27 2021-07-14 味の素株式会社 封止用樹脂組成物および封止用シート
EP3613091A4 (en) 2017-04-21 2021-08-04 Kateeva, Inc. COMPOSITIONS AND TECHNIQUES FOR FORMING ORGANIC THIN FILMS
WO2018193392A1 (en) 2017-04-21 2018-10-25 3M Innovative Properties Company Barrier adhesive compositions and articles
WO2019111182A1 (en) 2017-12-06 2019-06-13 3M Innovative Properties Company Barrier adhesive compositions and articles
US11784282B2 (en) 2018-10-26 2023-10-10 Samsung Electronics Co., Ltd. Quantum dot display device
KR102496596B1 (ko) * 2020-11-25 2023-02-06 엘지디스플레이 주식회사 배리어성이 우수한 알루미늄을 이용한 봉지 접착 필름 및 이를 포함하는 유기발광다이오드
CN120677217A (zh) * 2023-03-07 2025-09-19 Dic株式会社 导电性粘合带

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5097800A (en) 1983-12-19 1992-03-24 Spectrum Control, Inc. High speed apparatus for forming capacitors
US5018048A (en) 1983-12-19 1991-05-21 Spectrum Control, Inc. Miniaturized monolithic multi-layer capacitor and apparatus and method for making
US5032461A (en) 1983-12-19 1991-07-16 Spectrum Control, Inc. Method of making a multi-layered article
US4842893A (en) 1983-12-19 1989-06-27 Spectrum Control, Inc. High speed process for coating substrates
US5125138A (en) 1983-12-19 1992-06-30 Spectrum Control, Inc. Miniaturized monolithic multi-layer capacitor and apparatus and method for making same
US4722515A (en) 1984-11-06 1988-02-02 Spectrum Control, Inc. Atomizing device for vaporization
EP0242460A1 (en) 1985-01-18 1987-10-28 SPECTRUM CONTROL, INC. (a Pennsylvania corporation) Monomer atomizer for vaporization
US4954371A (en) 1986-06-23 1990-09-04 Spectrum Control, Inc. Flash evaporation of monomer fluids
JP2825736B2 (ja) 1993-07-30 1998-11-18 京セラ株式会社 誘電体磁器組成物および半導体素子収容用パッケージ
BR9407741A (pt) 1993-10-04 1997-02-12 Catalina Coatings Inc Revestimento de acrilato
US5440446A (en) 1993-10-04 1995-08-08 Catalina Coatings, Inc. Acrylate coating material
US6083628A (en) 1994-11-04 2000-07-04 Sigma Laboratories Of Arizona, Inc. Hybrid polymer film
US5916685A (en) 1996-07-09 1999-06-29 Tetra Laval Holdings & Finance, Sa Transparent high barrier multilayer structure
US6045864A (en) 1997-12-01 2000-04-04 3M Innovative Properties Company Vapor coating method
CA2353506A1 (en) 1998-11-02 2000-05-11 3M Innovative Properties Company Transparent conductive oxides for plastic flat panel displays
CN1714460A (zh) * 2000-11-02 2005-12-28 3M创新有限公司 发射显示器的亮度增强
JP2002260847A (ja) * 2001-02-27 2002-09-13 Bando Chem Ind Ltd エレクトロルミネッセンス素子封止用フィルム及び封止有機エレクトロルミネッセンス素子
US7018713B2 (en) 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
KR101130199B1 (ko) 2006-11-06 2012-04-23 에이전시 포 사이언스, 테크놀로지 앤드 리서치 나노입자 캡슐 배리어 스택
US8241713B2 (en) * 2007-02-21 2012-08-14 3M Innovative Properties Company Moisture barrier coatings for organic light emitting diode devices
KR101563025B1 (ko) * 2007-12-28 2015-10-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 캡슐화 필름 및 그의 제조 방법
KR101623220B1 (ko) 2008-06-02 2016-05-20 쓰리엠 이노베이티브 프로퍼티즈 컴파니 접착성 캡슐화 조성물 및 그로 제조된 전자 소자
JP5768718B2 (ja) * 2009-11-18 2015-08-26 味の素株式会社 樹脂組成物
KR101213499B1 (ko) 2009-12-31 2012-12-20 삼성디스플레이 주식회사 배리어 필름 복합체, 이를 포함하는 표시 장치
JP2012193335A (ja) 2010-09-27 2012-10-11 Dainippon Printing Co Ltd 粘着組成物、積層体及び画像表示装置
US8663407B2 (en) * 2010-11-17 2014-03-04 3M Innovative Properties Company Isobutylene (Co)polymeric adhesive composition
KR101308480B1 (ko) * 2011-06-14 2013-09-16 엘지디스플레이 주식회사 플라스틱 유기 전계 발광 표시 장치 및 그 제조 방법
EP2727972B1 (en) * 2011-06-28 2017-11-01 Lintec Corporation Adhesive composition and adhesive sheet
JP5938514B2 (ja) * 2012-03-12 2016-06-22 エルジー・ケム・リミテッド 粘着剤組成物
US8796376B2 (en) * 2012-03-26 2014-08-05 Exxonmobil Chemical Patents Inc. Functionalized polymers and oligomers
EP2909027B1 (en) * 2012-10-18 2019-10-09 Tera-Barrier Films Pte Ltd Encapsulation barrier stack
KR101426741B1 (ko) 2013-01-08 2014-08-05 김한기 배터리 일체형 전자 흡입기
JP2014231586A (ja) * 2013-05-30 2014-12-11 大日本印刷株式会社 粘着剤組成物およびそれを用いた粘着シート
US10738224B2 (en) 2015-08-17 2020-08-11 3M Innovative Properties Company Nanoclay filled barrier adhesive compositions

Also Published As

Publication number Publication date
CN107925010B (zh) 2020-11-06
US10581015B2 (en) 2020-03-03
WO2017031031A1 (en) 2017-02-23
JP7186267B2 (ja) 2022-12-08
KR20180031793A (ko) 2018-03-28
JP2021176709A (ja) 2021-11-11
US20180248149A1 (en) 2018-08-30
CN107925010A (zh) 2018-04-17
TW201726851A (zh) 2017-08-01
JP2018529550A (ja) 2018-10-11

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