JP6950536B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP6950536B2
JP6950536B2 JP2018001494A JP2018001494A JP6950536B2 JP 6950536 B2 JP6950536 B2 JP 6950536B2 JP 2018001494 A JP2018001494 A JP 2018001494A JP 2018001494 A JP2018001494 A JP 2018001494A JP 6950536 B2 JP6950536 B2 JP 6950536B2
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JP
Japan
Prior art keywords
resin composition
component
mass
resin
meth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018001494A
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English (en)
Japanese (ja)
Other versions
JP2019119818A (ja
Inventor
成弘 唐川
成弘 唐川
将毅 長嶋
将毅 長嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2018001494A priority Critical patent/JP6950536B2/ja
Priority to CN201811635874.9A priority patent/CN110018613A/zh
Priority to TW108100306A priority patent/TWI795506B/zh
Priority to KR1020190002453A priority patent/KR20190084897A/ko
Publication of JP2019119818A publication Critical patent/JP2019119818A/ja
Application granted granted Critical
Publication of JP6950536B2 publication Critical patent/JP6950536B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
JP2018001494A 2018-01-09 2018-01-09 樹脂組成物 Active JP6950536B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018001494A JP6950536B2 (ja) 2018-01-09 2018-01-09 樹脂組成物
CN201811635874.9A CN110018613A (zh) 2018-01-09 2018-12-29 树脂组合物
TW108100306A TWI795506B (zh) 2018-01-09 2019-01-04 樹脂組成物
KR1020190002453A KR20190084897A (ko) 2018-01-09 2019-01-08 수지 조성물

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018001494A JP6950536B2 (ja) 2018-01-09 2018-01-09 樹脂組成物

Publications (2)

Publication Number Publication Date
JP2019119818A JP2019119818A (ja) 2019-07-22
JP6950536B2 true JP6950536B2 (ja) 2021-10-13

Family

ID=67188721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018001494A Active JP6950536B2 (ja) 2018-01-09 2018-01-09 樹脂組成物

Country Status (4)

Country Link
JP (1) JP6950536B2 (zh)
KR (1) KR20190084897A (zh)
CN (1) CN110018613A (zh)
TW (1) TWI795506B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110554567B (zh) * 2019-08-28 2022-04-15 浙江福斯特新材料研究院有限公司 树脂组合物及其应用
JPWO2022009640A1 (zh) * 2020-07-08 2022-01-13
CN114058034A (zh) * 2021-12-20 2022-02-18 洛阳赛图新材料科技有限公司 一种纳米橡胶分散方法
WO2023119503A1 (ja) * 2021-12-22 2023-06-29 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、プリント配線板、及びプリント配線板の製造方法
CN116080214A (zh) * 2022-11-11 2023-05-09 山东金宝电子有限公司 一种led用白色覆铜板及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010077283A (ja) * 2008-09-26 2010-04-08 Japan U-Pica Co Ltd 多分岐ポリエステル（メタ）アクリレート化合物
JP5381869B2 (ja) * 2010-03-31 2014-01-08 住友ベークライト株式会社 エポキシ樹脂前駆体組成物、プリプレグ、積層板、樹脂シート、プリント配線板および半導体装置
JP5344022B2 (ja) * 2011-11-16 2013-11-20 住友ベークライト株式会社 エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置
JP6094271B2 (ja) * 2012-03-05 2017-03-15 味の素株式会社 感光性樹脂組成物
CN105308506B (zh) * 2013-07-04 2020-10-27 味之素株式会社 感光性树脂组合物
JP6372108B2 (ja) * 2014-03-11 2018-08-15 味の素株式会社 配線板及びその製造方法
KR20240036148A (ko) 2016-01-12 2024-03-19 가부시끼가이샤 레조낙 감광성 수지 조성물, 그것을 사용한 드라이 필름, 프린트 배선판, 및 프린트 배선판의 제조 방법
TWI781918B (zh) * 2016-02-02 2022-11-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、印刷電路板及半導體裝置

Also Published As

Publication number Publication date
KR20190084897A (ko) 2019-07-17
JP2019119818A (ja) 2019-07-22
TW201938682A (zh) 2019-10-01
TWI795506B (zh) 2023-03-11
CN110018613A (zh) 2019-07-16

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