JP6947280B2 - Silver paste and its manufacturing method and joint manufacturing method - Google Patents
Silver paste and its manufacturing method and joint manufacturing method Download PDFInfo
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- JP6947280B2 JP6947280B2 JP2020204335A JP2020204335A JP6947280B2 JP 6947280 B2 JP6947280 B2 JP 6947280B2 JP 2020204335 A JP2020204335 A JP 2020204335A JP 2020204335 A JP2020204335 A JP 2020204335A JP 6947280 B2 JP6947280 B2 JP 6947280B2
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- Prior art keywords
- silver
- less
- silver paste
- binder
- additive
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims description 405
- 229910052709 silver Inorganic materials 0.000 title claims description 341
- 239000004332 silver Substances 0.000 title claims description 341
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000002245 particle Substances 0.000 claims description 130
- 239000011259 mixed solution Substances 0.000 claims description 72
- 239000000654 additive Substances 0.000 claims description 65
- 239000011230 binding agent Substances 0.000 claims description 65
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 60
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 59
- 229930195729 fatty acid Natural products 0.000 claims description 59
- 239000000194 fatty acid Substances 0.000 claims description 59
- 239000010949 copper Substances 0.000 claims description 58
- 230000000996 additive effect Effects 0.000 claims description 56
- 229910052802 copper Inorganic materials 0.000 claims description 53
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 52
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 48
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 45
- 239000002904 solvent Substances 0.000 claims description 45
- 150000004665 fatty acids Chemical class 0.000 claims description 38
- 238000010438 heat treatment Methods 0.000 claims description 30
- 239000000203 mixture Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 22
- 238000002156 mixing Methods 0.000 claims description 22
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 20
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 13
- 239000001301 oxygen Substances 0.000 claims description 13
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 11
- 239000002202 Polyethylene glycol Substances 0.000 claims description 9
- 229920001223 polyethylene glycol Polymers 0.000 claims description 9
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000005711 Benzoic acid Substances 0.000 claims description 7
- 235000010233 benzoic acid Nutrition 0.000 claims description 7
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 238000004898 kneading Methods 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 1
- 239000010419 fine particle Substances 0.000 description 42
- 230000000052 comparative effect Effects 0.000 description 34
- -1 silver fatty acid Chemical class 0.000 description 31
- 239000000843 powder Substances 0.000 description 29
- 239000002994 raw material Substances 0.000 description 27
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 21
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 14
- 239000007864 aqueous solution Substances 0.000 description 12
- 239000002002 slurry Substances 0.000 description 12
- 238000009826 distribution Methods 0.000 description 11
- 238000001556 precipitation Methods 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 238000007747 plating Methods 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 239000005416 organic matter Substances 0.000 description 8
- 239000011164 primary particle Substances 0.000 description 7
- 229910001961 silver nitrate Inorganic materials 0.000 description 7
- 238000005245 sintering Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 230000003111 delayed effect Effects 0.000 description 5
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 5
- 229940071536 silver acetate Drugs 0.000 description 5
- 230000008961 swelling Effects 0.000 description 5
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 4
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 4
- 239000003638 chemical reducing agent Substances 0.000 description 4
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 238000004502 linear sweep voltammetry Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 150000003378 silver Chemical class 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 3
- 238000002296 dynamic light scattering Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 3
- 239000011268 mixed slurry Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 239000001509 sodium citrate Substances 0.000 description 3
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 2
- ARXKVVRQIIOZGF-UHFFFAOYSA-N 1,2,4-butanetriol Chemical compound OCCC(O)CO ARXKVVRQIIOZGF-UHFFFAOYSA-N 0.000 description 2
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004280 Sodium formate Substances 0.000 description 2
- YFHNDHXQDJQEEE-UHFFFAOYSA-N acetic acid;hydrazine Chemical compound NN.CC(O)=O YFHNDHXQDJQEEE-UHFFFAOYSA-N 0.000 description 2
- 239000005456 alcohol based solvent Substances 0.000 description 2
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 2
- 229940088601 alpha-terpineol Drugs 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- LAWOZCWGWDVVSG-UHFFFAOYSA-N dioctylamine Chemical compound CCCCCCCCNCCCCCCCC LAWOZCWGWDVVSG-UHFFFAOYSA-N 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 238000003411 electrode reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N glycerol group Chemical group OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 150000003141 primary amines Chemical class 0.000 description 2
- 150000003335 secondary amines Chemical class 0.000 description 2
- 239000011163 secondary particle Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229940071575 silver citrate Drugs 0.000 description 2
- XNGYKPINNDWGGF-UHFFFAOYSA-L silver oxalate Chemical compound [Ag+].[Ag+].[O-]C(=O)C([O-])=O XNGYKPINNDWGGF-UHFFFAOYSA-L 0.000 description 2
- OHGHHPYRRURLHR-UHFFFAOYSA-M silver;tetradecanoate Chemical compound [Ag+].CCCCCCCCCCCCCC([O-])=O OHGHHPYRRURLHR-UHFFFAOYSA-M 0.000 description 2
- HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 description 2
- 235000019254 sodium formate Nutrition 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- BGHCVCJVXZWKCC-UHFFFAOYSA-N tetradecane Chemical compound CCCCCCCCCCCCCC BGHCVCJVXZWKCC-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- QUTYHQJYVDNJJA-UHFFFAOYSA-K trisilver;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Ag+].[Ag+].[Ag+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QUTYHQJYVDNJJA-UHFFFAOYSA-K 0.000 description 2
- ZWVMLYRJXORSEP-UHFFFAOYSA-N 1,2,6-Hexanetriol Chemical compound OCCCCC(O)CO ZWVMLYRJXORSEP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000004108 freeze drying Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- WSTNFGAKGUERTC-UHFFFAOYSA-N n-ethylhexan-1-amine Chemical compound CCCCCCNCC WSTNFGAKGUERTC-UHFFFAOYSA-N 0.000 description 1
- FJDUDHYHRVPMJZ-UHFFFAOYSA-N nonan-1-amine Chemical compound CCCCCCCCCN FJDUDHYHRVPMJZ-UHFFFAOYSA-N 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- AZJXQVRPBZSNFN-UHFFFAOYSA-N octane-3,3-diol Chemical compound CCCCCC(O)(O)CC AZJXQVRPBZSNFN-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- JKOCEVIXVMBKJA-UHFFFAOYSA-M silver;butanoate Chemical compound [Ag+].CCCC([O-])=O JKOCEVIXVMBKJA-UHFFFAOYSA-M 0.000 description 1
- CYLMOXYXYHNGHZ-UHFFFAOYSA-M silver;propanoate Chemical compound [Ag+].CCC([O-])=O CYLMOXYXYHNGHZ-UHFFFAOYSA-M 0.000 description 1
- PPASLZSBLFJQEF-RKJRWTFHSA-M sodium ascorbate Substances [Na+].OC[C@@H](O)[C@H]1OC(=O)C(O)=C1[O-] PPASLZSBLFJQEF-RKJRWTFHSA-M 0.000 description 1
- 235000010378 sodium ascorbate Nutrition 0.000 description 1
- 229960005055 sodium ascorbate Drugs 0.000 description 1
- PPASLZSBLFJQEF-RXSVEWSESA-M sodium-L-ascorbate Chemical compound [Na+].OC[C@H](O)[C@H]1OC(=O)C(O)=C1[O-] PPASLZSBLFJQEF-RXSVEWSESA-M 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- Powder Metallurgy (AREA)
- Die Bonding (AREA)
- Conductive Materials (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Description
本発明は、電子部品を接合する銀ペーストと、この銀ペーストを製造する方法と、この銀ペースト用いて接合体を製造する方法に関するものである。 The present invention relates to a silver paste for joining electronic components, a method for producing the silver paste, and a method for producing a bonded body using the silver paste.
従来より、銀ペーストを用いて高出力ＬＥＤ素子やパワー半導体素子等の半導体素子、半導体パッケージのような電子部品をＤＢＣ基板（銅張り基板）やリードフレーム等の銅又は銅合金部材の表面に接着・固定（ダイボンディング）するために、銀粉末、熱硬化性樹脂、及び溶媒を含む銀ペーストが用いられている。 Conventionally, using silver paste, semiconductor elements such as high-power LED elements and power semiconductor elements, and electronic components such as semiconductor packages are bonded to the surface of copper or copper alloy members such as DBC substrates (copper-clad substrates) and lead frames. -For fixing (die bonding), a silver paste containing silver powder, a thermosetting resin, and a solvent is used.
この種の銀ペーストとして、例えば、銀粉、銀微粒子、脂肪酸銀、アミン及び銀レジネートを含む熱伝導性組成物が開示されている（例えば、特許文献１参照。）。この熱伝導性組成物において、銀粉は平均粒径が０．３μｍ〜１００μｍであり、銀微粒子は１次粒子の平均粒子径が５０〜１５０ｎｍであり、銀微粒子の結晶子径が２０〜５０ｎｍであり、かつ結晶子径に対する平均粒子径の比が１〜７．５である。この熱伝導性組成物は、粘度調整等のために、更にメタノール、エチレングリコール、プロピレングリコール等のアルコール系溶媒を含有する。特許文献１には、このように構成された熱伝導性組成物では、高い熱伝導率を有する熱伝導体を得ることができることが記載されている。 As this type of silver paste, for example, a thermally conductive composition containing silver powder, silver fine particles, fatty acid silver, amine and silver resinate is disclosed (see, for example, Patent Document 1). In this thermally conductive composition, the silver powder has an average particle size of 0.3 μm to 100 μm, the silver fine particles have an average particle size of 50 to 150 nm, and the silver fine particles have an average particle size of 20 to 50 nm. Yes, and the ratio of the average particle size to the crystallite size is 1 to 7.5. This thermally conductive composition further contains an alcohol solvent such as methanol, ethylene glycol, and propylene glycol for adjusting the viscosity and the like. Patent Document 1 describes that the heat conductive composition having such a structure can obtain a heat conductor having a high thermal conductivity.
また別の銀ペーストとして、平均粒径が１〜２００ｎｍである銀微粒子と、ブランケット膨潤率が２．０％以下となる低膨潤性有機溶媒を含む有機溶媒とを含み、低膨潤性有機溶媒の含有率が３．０〜３０ｗｔ％である導電性ペーストが開示されている（例えば、特許文献２参照。）。特許文献２には、この導電性ペーストにおいて、銀微粒子の表面の少なくとも一部に有機成分が付着していることが好ましく、この有機成分は銀微粒子の分散性及び導電性等の観点から、アミン及びカルボン酸を含むことが好ましいことが記載されている。また特許文献２には、ブランケット膨潤率が２．０％以下となる低膨潤性有機溶媒としては、官能基としてヒドロキシル基を有する溶媒が好ましく、例えば、ヒドロキシル基を複数有する多価アルコールや、その他１価のアルコール溶媒等を挙げることができること、及びヒドロキシル基を２〜３有している多価アルコールとしては、グリセリン、１，２，４−ブタントリオール、１，２，６−ヘキサントリオール、エチレングリコール、ジエチレングリコール、１，２−ブタンジオール、プロピレングリコール、２−メチルペンタン−２，４−ジオール等を挙げることができることが記載されている。特許文献２には、この導電性ペーストは、十分な導電性及び基板との良好な密着性を有する微細導電性パターンを形成することができることが記載されている。
Another silver paste contains silver fine particles having an average particle size of 1 to 200 nm and an organic solvent containing a low swelling organic solvent having a blanket swelling rate of 2.0% or less, and is a low swelling organic solvent. A conductive paste having a content of 3.0 to 30 wt% is disclosed (see, for example, Patent Document 2). In
銀ペースト層が塗布されるＤＢＣ基板（銅張り基板）やリードフレーム等の銅又は銅合金部材の表面は、ＣｕＯ、ＣｕＯ2の酸化皮膜が形成され易い。このため、銅又は銅合金部材の表面に銀めっきやニッケルめっき等のメタライズ層を形成し、その上に銀ペーストを塗布し、チップ素子等の電子部品を接合している。しかしながら、メタライズ層を形成せずに、特許文献１及び２に示される銀ペーストを用いて、チップ素子等の電子部品を銅又は銅合金部材に接合した場合、高い強度で電子部品を銅又は銅合金部材に接合することが困難であった。
また、電子部品を銅又は銅合金部材に接合する際の加熱雰囲気は、銅又は銅合金部材の表面に上記酸化皮膜の形成を抑制する観点で、低酸素濃度の窒素雰囲気が望まれる。しかし、特許文献１及び２に示される銀ペーストを用いて、電子部品を接合するときの加熱を低酸素濃度の窒素雰囲気下で行うと、銀ペースト中の銀成分の焼結性が低下して、接合強度が低くなる課題があった。
An oxide film of CuO or CuO 2 is likely to be formed on the surface of a copper or copper alloy member such as a DBC substrate (copper-clad substrate) or a lead frame to which a silver paste layer is applied. Therefore, a metallized layer such as silver plating or nickel plating is formed on the surface of a copper or copper alloy member, a silver paste is applied on the metallized layer, and electronic parts such as a chip element are bonded. However, when an electronic component such as a chip element is bonded to a copper or copper alloy member using the silver paste shown in
Further, as the heating atmosphere when joining the electronic component to the copper or copper alloy member, a nitrogen atmosphere having a low oxygen concentration is desired from the viewpoint of suppressing the formation of the oxide film on the surface of the copper or copper alloy member. However, when the silver paste shown in
本発明の目的は、銀めっきやニッケルめっき等のメタライズ層を有しない銅又は銅合金部材の表面に、直接銀ペーストを塗布し、低酸素濃度の窒素雰囲気下で加熱したときに、高い強度で電子部品を銅又は銅合金部材に接合する銀ペースト、その製造方法及び接合体の製造方法を提供することにある。 An object of the present invention is to apply silver paste directly to the surface of a copper or copper alloy member that does not have a metallized layer such as silver plating or nickel plating, and heat it in a low oxygen concentration nitrogen atmosphere with high strength. It is an object of the present invention to provide a silver paste for joining an electronic component to a copper or copper alloy member, a method for producing the same, and a method for producing the bonded body.
本発明の第１の観点は、銀粉末とバインダと溶媒とを含む銀ペーストにおいて、前記バインダは少なくとも脂肪酸銀と脂肪族アミンとを含み、前記バインダの交換電流密度が１０μＡ／ｄｍ2以上１０００μＡ／ｄｍ2以下の範囲内にあることを特徴とする銀ペーストである。より好ましくは、前記交換電流密度は２０μＡ／ｄｍ2以上５００μＡ／ｄｍ2以下の範囲内であり、１００μＡ／ｄｍ2以上３００μＡ／ｄｍ2以下の範囲内であってもよい。本明細書におけるバインダの交換電流密度とは、バインダ中に作用極Ｃｕ、対極Ａｇ、および参照電極Ｐｔを配置した状態で、リニアスイープボルタメトリー法（ＬＳＶ法／電位走査法）により、開回路電位を基準にして＋２５０ｍＶから−２５０ｍＶまで電極電位を変化させて測定した交換電流密度であり、測定条件は後述する。
The first aspect of the present invention is in a silver paste containing silver powder, a binder and a solvent, the binder containing at least fatty acid silver and an aliphatic amine, and the exchange current density of the binder is 10 μA / dm 2 or more and 1000 μA /. It is a silver paste characterized by being within the range of dm 2 or less. More preferably, the exchange current density is in the range of 20 μA /
本発明の第２の観点は、第１の観点に基づく発明であって、前記バインダは、添加剤として、ジエチレングリコール、トリエチレングリコール、ポリエチレングリコール又は安息香酸のいずれか１種又は２種以上を含む銀ペーストである。 The second aspect of the present invention is an invention based on the first aspect, and the binder contains any one or more of diethylene glycol, triethylene glycol, polyethylene glycol and benzoic acid as additives. It is a silver paste.
本発明の第３の観点は、第２の観点に基づく発明であって、前記バインダ中の前記添加剤の含有割合が質量比（添加剤／バインダ）で０．００３以上０．３３３以下の範囲内にある銀ペーストである。より好ましくは、０．０２０以上０．２００以下である。 The third aspect of the present invention is the invention based on the second aspect, in which the content ratio of the additive in the binder is in the range of 0.003 or more and 0.333 or less in terms of mass ratio (additive / binder). The silver paste inside. More preferably, it is 0.020 or more and 0.200 or less.
本発明の第４の観点は、第１ないし第３のいずれかの観点に基づく発明であって、前記銀粉末は、粒径が１００ｎｍ以上５００ｎｍ未満である第１銀粒子を５５体積％以上９５体積％以下の範囲で含み、粒径が５０ｎｍ以上１００ｎｍ未満である第２銀粒子を５体積％以上４０体積％以下の範囲で含み、粒径が５０ｎｍ未満である第３銀粒子を５体積％以下の範囲で含む銀ペーストである。 A fourth aspect of the present invention is an invention based on any one of the first to third aspects, and the silver powder contains 55% by volume or more of first silver particles having a particle size of 100 nm or more and less than 500 nm. 5% by volume of 2nd silver particles having a particle size of 50 nm or more and less than 100 nm are contained in a range of 5% by volume or more and 40% by volume or less and 5% by volume of 3rd silver particles having a particle size of less than 50 nm. It is a silver paste included in the following range.
本発明の第５の観点は、脂肪酸銀と脂肪族アミンを混合するか、又は脂肪酸銀と脂肪族アミンとグリコール系溶媒を除いた溶媒を混合して混合物を得る工程と、前記混合物を加熱して撹拌した後に冷却して混合溶液を得る工程と、前記混合溶液と添加剤とにより構成されるバインダと銀粉末とを混練して銀ペーストを得る工程とを含み、前記添加剤は、ジエチレングリコール、トリエチレングリコール、ポリエチレングリコール又は安息香酸のいずれか１種又は２種以上を含み、前記バインダ中の前記添加剤の含有割合が質量比（添加剤／バインダ）で０．００３以上０．３３３以下の範囲内にあることを特徴とする銀ペーストの製造方法である。
A fifth aspect of the present invention is a step of mixing fatty acid silver and an aliphatic amine or mixing a solvent excluding fatty acid silver, an aliphatic amine and a glycol-based solvent to obtain a mixture, and heating the mixture. obtaining a mixed solution was cooled after stirring Te, wherein the mixing solution and added pressure agent by kneading a binder and silver powder composed look including the step of obtaining a silver paste, the additive, It contains one or more of diethylene glycol, triethylene glycol, polyethylene glycol and benzoic acid, and the content ratio of the additive in the binder is 0.003 or more and 0.333 in mass ratio (additive / binder). It is a method for producing a silver paste, which is characterized by being within the following range.
本発明の第６の観点は、銅又は銅合金部材の表面に、第１ないし第４のいずれかの観点の銀ペーストを直接塗布して銀ペースト層を形成する工程と、前記銀ペースト層上に電子部品を積層して積層体を作製する工程と、前記積層体を、酸素濃度が体積基準で１０００ｐｐｍ以下の窒素雰囲気下で、加熱することにより前記銀ペースト層中の銀粉末を焼結させて接合層を形成させ、前記銅又は銅合金部材と前記電子部品とが接合層を介して接合された接合体を作製する工程とを含む接合体の製造方法である。より好ましくは、前記酸素濃度は体積基準で７００ｐｐｍ以下であり、５００ｐｐｍ以下であってもよく、１００ｐｐｍ以下であってもよい。酸素濃度の下限値は制限されないが、０．１ｐｐｍであってもよい。 A sixth aspect of the present invention is a step of directly applying the silver paste of any of the first to fourth aspects to the surface of a copper or copper alloy member to form a silver paste layer, and on the silver paste layer. The silver powder in the silver paste layer is sintered by heating the laminate in a nitrogen atmosphere having an oxygen concentration of 1000 ppm or less on a volume basis in a step of laminating electronic parts on the surface to prepare a laminate. This is a method for manufacturing a bonded body, which comprises a step of forming a bonded layer and producing a bonded body in which the copper or copper alloy member and the electronic component are bonded via the bonded layer. More preferably, the oxygen concentration is 700 ppm or less, 500 ppm or less, or 100 ppm or less on a volume basis. The lower limit of the oxygen concentration is not limited, but may be 0.1 ppm.
本発明の第１の観点の銀ペーストは、銀粉末と、少なくとも脂肪酸銀と脂肪族アミンとを含むバインダであって、このバインダの交換電流密度が１０μＡ／ｄｍ2以上１０００μＡ／ｄｍ2以下の範囲内にある。この銀ペーストでは、脂肪酸銀の少なくとも一部と脂肪族アミンの少なくとも一部が反応して錯体が形成されている。銀ペーストが加熱されると、この錯体から銀ナノ粒子が析出する。 The first aspect of the silver paste of the present invention, a silver powder, a binder containing at least a fatty acid silver and an aliphatic amine, a range exchange current density of the binder is 10 .mu.A / dm 2 or more 1000μA / dm 2 or less Is inside. In this silver paste, at least a part of fatty acid silver reacts with at least a part of an aliphatic amine to form a complex. When the silver paste is heated, silver nanoparticles are precipitated from this complex.
従来、銀ペーストが加熱されたときの錯体からの銀ナノ粒子の析出が速く、析出した銀ナノ粒子が銀ペースト中の銀粉末の間に介在して、図２（ａ）、図２（ｂ）に示すように、メタライズ層を有しない銅又は銅合金部材１の表面１ａに、銀粉末２を積み重ねながら銀ペースト層３を形成する。図２において、符号４はバインダである。
Conventionally, silver nanoparticles are rapidly precipitated from the complex when the silver paste is heated, and the precipitated silver nanoparticles are interposed between the silver powders in the silver paste to be interposed between FIGS. 2 (a) and 2 (b). ), The silver paste layer 3 is formed by stacking the
本発明では、バインダの交換電流密度が上記範囲内にあるため、銀ペーストが加熱されたときの錯体からの銀ナノ粒子の析出が遅くなり、析出した銀ナノ粒子が、銀ペースト中の銀粉末の間に介在するとともに、図１（ａ）、図１（ｂ）に示すように、銅又は銅合金部材１１の表面１１ａに粒成長しながら集まって、粒成長した銀ナノ粒子の層が銀めっき疑似膜１５として形成される。図１において、符号１２は銀粉末、符号１３は銀ペースト層、符号１４はバインダである。
In the present invention, since the exchange current density of the binder is within the above range, the precipitation of silver nanoparticles from the complex when the silver paste is heated is delayed, and the precipitated silver nanoparticles are the silver powder in the silver paste. As shown in FIGS. 1 (a) and 1 (b), the layers of silver nanoparticles that have grown and gathered on the surface 11a of the copper or
本発明では、その後の加熱により、銀ペースト層中の銀粉末が銀めっき疑似膜１５を介して焼結し、銀ペースト層が接合層になる（図示せず。）。銀めっき疑似膜１５の存在により、加熱が低酸素濃度の窒素雰囲気下で行われても、従来の銀めっき疑似膜を有しない場合と比較して、メタライズ層を有しない銅又は銅合金部材の表面に、電子部品がこの接合層を介してより高い強度で接合される。
In the present invention, by subsequent heating, the silver powder in the silver paste layer is sintered via the silver plating
本発明の第２の観点の銀ペーストは、バインダは、添加剤として、ジエチレングリコール、トリエチレングリコール、ポリエチレングリコール又は安息香酸のいずれか１種又は２種以上を含む。この添加剤は、銀ペーストが加熱されたときの錯体の還元力を弱める。この結果、錯体からの銀ナノ粒子の析出を遅くして、銅又は銅合金部材の表面に銀めっき疑似膜を形成することができる。 In the silver paste according to the second aspect of the present invention, the binder contains one or more of diethylene glycol, triethylene glycol, polyethylene glycol and benzoic acid as additives. This additive weakens the reducing power of the complex when the silver paste is heated. As a result, the precipitation of silver nanoparticles from the complex can be delayed, and a silver-plated pseudo film can be formed on the surface of the copper or copper alloy member.
本発明の第３の観点の銀ペーストでは、バインダ中の添加剤の含有割合が質量比（添加剤／バインダ）で０．００３以上０．３３３以下の範囲内にある。バインダが前記質量比で添加剤を含むと、バインダの交換電流密度が１０μＡ／ｄｍ2以上１０００μＡ／ｄｍ2以下の範囲内に容易に制御され、これにより、銀ペーストが加熱されたときの錯体からの銀ナノ粒子の析出を遅くして、銅又は銅合金部材の表面に銀めっき疑似膜をより的確に形成することができる。 In the silver paste according to the third aspect of the present invention, the content ratio of the additive in the binder is in the range of 0.003 or more and 0.333 or less in terms of mass ratio (additive / binder). When the binder contains an additive in the mass ratio, a complex of when the exchange current density of the binder is easily controlled within a range of 10 .mu.A / dm 2 or more 1000μA / dm 2 or less, thereby, the silver paste is heated The precipitation of silver nanoparticles can be delayed, and a silver-plated pseudo film can be more accurately formed on the surface of a copper or copper alloy member.
本発明の第４の観点の銀ペーストでは、銀粉末が、粒径が１００ｎｍ以上５００ｎｍ未満である第１銀粒子を５５体積％以上９５体積％以下の範囲で含み、粒径が５０ｎｍ以上１００ｎｍ未満である第２銀粒子を５体積％以上４０体積％以下の範囲で含み、粒径が５０ｎｍ未満である第３銀粒子を５体積％以下の範囲で含むので、前記銀粉末が比較的広い粒度分布を有することによって、焼結の際に、第１〜第３銀粒子同士の隙間が小さく緻密になることで、ボイドの少ない接合層を作製できる。 In the silver paste according to the fourth aspect of the present invention, the silver powder contains first silver particles having a particle size of 100 nm or more and less than 500 nm in the range of 55% by volume or more and 95% by volume or less, and the particle size is 50 nm or more and less than 100 nm. Since the second silver particles are contained in the range of 5% by volume or more and 40% by volume or less and the third silver particles having a particle size of less than 50 nm are contained in the range of 5% by volume or less, the silver powder has a relatively wide particle size. By having a distribution, the gaps between the first to third silver particles become small and dense at the time of sintering, so that a bonding layer having few voids can be produced.
本発明の第５の観点の銀ペーストの製造方法では、添加剤を、混合溶液を調製した後で、混合溶液とともに銀粉末に混合するため、脂肪酸銀と脂肪族アミンとの反応を添加剤が阻害することを防ぐ効果がある。また混合液体中で、脂肪酸銀の少なくとも一部と脂肪族アミンの少なくとも一部とが反応して錯体を形成する。銀ペーストが加熱されるときに、添加剤により、銀ペーストが加熱されたときの錯体からの銀ナノ粒子の析出を遅くして、銅又は銅合金部材の表面に銀めっき疑似膜を形成することができる。 In the method for producing silver paste according to the fifth aspect of the present invention, since the additive is mixed with the silver powder together with the mixed solution after preparing the mixed solution, the additive reacts with the fatty acid silver and the aliphatic amine. It has the effect of preventing inhibition. Further, in the mixed liquid, at least a part of silver fatty acid and at least a part of an aliphatic amine react to form a complex. When the silver paste is heated, the additive slows the precipitation of silver nanoparticles from the complex when the silver paste is heated to form a silver-plated pseudofilm on the surface of the copper or copper alloy member. Can be done.
本発明の第６の観点の接合体の製造方法では、先ず、銅又は銅合金部材の表面に、第１ないし第４いずれかの観点の銀ペーストを直接塗布して銀ペースト層を形成する。ここで、「銅又は銅合金部材の表面に直接塗布する」とは、銅又は銅合金部材の表面に銀、ニッケル、金等のメタライズ層が形成されていない銅又は銅合金部材の表面に銀ペーストを塗布することを意味する。次いで銀ペースト層を介して銅又は銅合金部材上に電子部品を積層して積層体を作製し、この積層体を加熱する。銀ペーストが加熱されると、錯体から銀ナノ粒子が析出する。添加剤により、銀ペーストが加熱されたときの錯体からの銀ナノ粒子の析出を遅くなり、その結果、銅又は銅合金部材の表面に銀めっき疑似膜を形成し、更に続く加熱により、銀めっき疑似膜を介して、銀粉末を焼結させて接合層を形成する。このため、加熱時の酸素濃度が体積基準で１０００ｐｐｍ以下の窒素雰囲気であっても、またメタライズ層を有しない銅又は銅合金部材であっても、この銅又は銅合金部材の表面に電子部品がこの接合層を介して、高い強度で直接接合することが可能となる。加熱時の酸素濃度が体積基準で１０００ｐｐｍ以下の窒素雰囲気にすることにより、加熱時の銅又は銅合金部材の酸化が防止され、電子部品がより高い強度で接合される。 In the method for producing a bonded body according to the sixth aspect of the present invention, first, a silver paste from any of the first to fourth aspects is directly applied to the surface of a copper or copper alloy member to form a silver paste layer. Here, "applying directly to the surface of a copper or copper alloy member" means that silver is applied to the surface of a copper or copper alloy member in which a metallized layer such as silver, nickel, or gold is not formed on the surface of the copper or copper alloy member. Means to apply the paste. Next, electronic components are laminated on a copper or copper alloy member via a silver paste layer to prepare a laminate, and the laminate is heated. When the silver paste is heated, silver nanoparticles are precipitated from the complex. The additive slows the precipitation of silver nanoparticles from the complex when the silver paste is heated, resulting in the formation of a silver-plated pseudofilm on the surface of the copper or copper alloy member, which is further heated for silver plating. The silver powder is sintered through the pseudo-film to form a bonding layer. Therefore, even if the oxygen concentration during heating is a nitrogen atmosphere of 1000 ppm or less on a volume basis, or even if the copper or copper alloy member does not have a metallized layer, electronic components are present on the surface of the copper or copper alloy member. Through this bonding layer, it is possible to directly bond with high strength. By creating a nitrogen atmosphere in which the oxygen concentration during heating is 1000 ppm or less on a volume basis, oxidation of the copper or copper alloy member during heating is prevented, and the electronic components are joined with higher strength.
次に本発明を実施するための形態を説明する。銀ペーストは、銀粉末とバインダとを含み、バインダは少なくとも脂肪酸銀と銀脂肪族アミンとを含む。銀ペーストは溶媒を更に含んでもよい。以下、各成分について、詳述する。 Next, a mode for carrying out the present invention will be described. The silver paste contains silver powder and a binder, which contains at least fatty acid silver and silver aliphatic amines. The silver paste may further contain a solvent. Hereinafter, each component will be described in detail.
〔銀粉末〕
本実施形態の銀粉末は、特に限定されず、市販の銀粉末を使用することができる。好ましくは、互いに粒径が異なる第１銀粒子（第１群の銀粒子）、第２銀粒子（第２群の銀粒子）、及び第３銀粒子（第３群の銀粒子）を含む。これら第１〜第３銀粒子はいずれも一次粒子として互いに凝集し、凝集体（銀粉末）を形成している。第１銀粒子は、粒径が１００ｎｍ以上５００ｎｍ未満であることが好ましく、第１〜第３銀粒子の合計量を１００体積％とするとき、５５体積％以上９５体積％以下の範囲で含むことが好ましい。また、第２銀粒子は、粒径が５０ｎｍ以上１００ｎｍ未満であることが好ましく、第１〜第３銀粒子の合計量を１００体積％とするとき、５体積％以上４０体積％以下の範囲で含むことが好ましい。更に、第３銀粒子は、粒径が５０ｎｍ未満であることが好ましく、第１〜第３銀粒子の合計量を１００体積％とするとき、５体積％以下の範囲で含むことが好ましい。なお、ここでの「体積」は銀粒子そのものの体積を示す。ここで、第１〜第３銀粒子の含有割合をそれぞれ前記範囲に限定したのは、比較的広い粒度分布を有することによって、焼結の際に、第１〜第３銀粒子同士の隙間が小さく緻密な凝集体になることにより、ボイドの少ない接合層を作り易くなるからである。なお、第１〜第３銀粒子中の銀の純度は、９０質量％以上であることが好ましく、９９質量％以上であることがより好ましい。これは、第１〜第３銀粒子の純度が高い方が溶融し易くなるので、第１〜第３銀粒子を比較的低温で焼結させることができるからである。第１〜第３銀粒子中の銀以外の元素としては、Ａｕ、Ｃｕ、Ｐｄなどを含んでもよい。
[Silver powder]
The silver powder of the present embodiment is not particularly limited, and a commercially available silver powder can be used. Preferably, it includes first silver particles (first group of silver particles), second silver particles (second group of silver particles), and third silver particles (third group of silver particles) having different particle sizes. All of these first to third silver particles aggregate with each other as primary particles to form an agglomerate (silver powder). The particle size of the first silver particles is preferably 100 nm or more and less than 500 nm, and when the total amount of the first to third silver particles is 100% by volume, it is contained in the range of 55% by volume or more and 95% by volume or less. Is preferable. The particle size of the second silver particles is preferably 50 nm or more and less than 100 nm, and when the total amount of the first to third silver particles is 100% by volume, the particle size is in the range of 5% by volume or more and 40% by volume or less. It is preferable to include it. Further, the third silver particles preferably have a particle size of less than 50 nm, and preferably contain 5% by volume or less when the total amount of the first to third silver particles is 100% by volume. The "volume" here indicates the volume of the silver particles themselves. Here, the content ratio of the first to third silver particles is limited to the above range because the particle size distribution is relatively wide, so that the gaps between the first to third silver particles are formed during sintering. This is because the small and dense agglomerates make it easier to form a bonding layer with few voids. The purity of silver in the first to third silver particles is preferably 90% by mass or more, and more preferably 99% by mass or more. This is because the higher the purity of the first to third silver particles, the easier it is to melt, so that the first to third silver particles can be sintered at a relatively low temperature. The elements other than silver in the first to third silver particles may include Au, Cu, Pd and the like.
また、第１〜第３銀粒子の合計量を１００体積％とするとき、粒径が１００ｎｍ以上５００ｎｍ未満である第１銀粒子は７０体積％以上９０体積％以下の範囲で含むことが好ましく、粒径が５０ｎｍ以上１００ｎｍ未満である第２銀粒子は１０体積％以上３０体積％以下の範囲で含むことが好ましく、粒径が５０ｎｍ未満である第３銀粒子は１体積％以下の範囲で含むことが好ましい。第１〜第３銀粒子の粒度分布が前記範囲内にあることによって、焼結の際に、第１〜第３銀粒子同士の隙間の小さい緻密な銀粉末の凝集体を形成できる効果が高くなり、更にボイドの少ない接合層を作製し易くなる。なお、第１〜第３銀粒子の粒径は、例えばＳＥＭ（Scanning Electron Microscope：走査型顕微鏡写真）を用いて、前記銀粉末中の第１〜第３銀粒子の投影面積を測定し、得られた投影面積から円相当径（第１〜第３銀粒子の投影面積と同じ面積を持つ円の直径）を算出し、この算出した粒径を体積基準の粒径に換算することによって得ることができる。具体的な測定方法の例は、後述する実施例中で説明する。 Further, when the total amount of the first to third silver particles is 100% by volume, the first silver particles having a particle size of 100 nm or more and less than 500 nm are preferably contained in the range of 70% by volume or more and 90% by volume or less. The second silver particles having a particle size of 50 nm or more and less than 100 nm are preferably contained in the range of 10% by volume or more and 30% by volume or less, and the third silver particles having a particle size of less than 50 nm are contained in the range of 1% by volume or less. Is preferable. When the particle size distribution of the first to third silver particles is within the above range, the effect of forming a dense silver powder agglomerate with a small gap between the first to third silver particles is high at the time of sintering. Therefore, it becomes easier to produce a bonding layer having few voids. The particle size of the 1st to 3rd silver particles can be obtained by measuring the projected area of the 1st to 3rd silver particles in the silver powder using, for example, SEM (Scanning Electron Microscope). Obtained by calculating the equivalent circle diameter (the diameter of a circle having the same area as the projected area of the 1st to 3rd silver particles) from the projected area and converting the calculated particle size into the volume-based particle size. Can be done. An example of a specific measurement method will be described in Examples described later.
前記銀粉末は、有機還元剤或いはその分解物からなる有機物を含むことが好ましく、この有機物は、１５０℃の温度で分解若しくは揮発するものであることが好ましい。また、有機還元剤の例としては、アスコルビン酸、ギ酸、酒石酸等が挙げられる。有機還元剤或いはその分解物からなる有機物は、第１〜第３銀粒子が凝集した二次粒子（即ち銀ペーストを作製する前の銀粉末）の状態で保存されているときに、第１〜第３銀粒子の表面の酸化を抑制し、第１〜第３銀粒子の相互拡散、即ち保存時における拡散接合を抑制し易くする。また、前記有機物は、銀粒子の凝集体を含む銀ペーストを接合対象部材の被接合面に印刷して加熱したときに、容易に分解若しくは揮発して、第１〜第３銀粒子の高活性な表面を露出させることにより、第１〜第３銀粒子同士の焼結反応を進行し易くする効果がある。更に、前記有機物の分解物若しくは揮発物は、接合対象部材の被接合面の酸化膜を還元させる還元能力を有する。
なお、銀粉末に含まれる有機物が接合層に残留すると、時間の経過とともに分解して、接合層にボイドを発生させるおそれがある。このため、有機物の含有割合は、第１〜第３銀粒子の合計量を１００質量％とするとき、２質量％以下とすることが好ましい。より好ましくは、前記有機物の含有割合は１．５質量％以下であり、０．７質量％以下であってもよい。但し、有機物による前記効果を得るためには、有機物の含有割合は第１〜第３銀粒子の合計量を１００質量％とするとき、０．０５質量％以上であることが好ましい。さらに好ましくは、前記有機物の含有割合は０．１質量％以上であってもよい。
The silver powder preferably contains an organic substance composed of an organic reducing agent or a decomposition product thereof, and the organic substance is preferably decomposed or volatilized at a temperature of 150 ° C. Further, examples of the organic reducing agent include ascorbic acid, formic acid, tartaric acid and the like. The organic substance composed of the organic reducing agent or its decomposition product is stored in the state of secondary particles in which the first to third silver particles are aggregated (that is, silver powder before preparing the silver paste), and the first to third silver particles are stored. It suppresses the oxidation of the surface of the third silver particles, and makes it easier to suppress the mutual diffusion of the first to third silver particles, that is, the diffusion bonding during storage. Further, the organic substance is easily decomposed or volatilized when a silver paste containing an aggregate of silver particles is printed on the surface to be bonded of the member to be bonded and heated, and the high activity of the first to third silver particles is obtained. By exposing the surface, there is an effect of facilitating the sintering reaction between the first to third silver particles. Further, the decomposed product or volatile substance of the organic substance has a reducing ability to reduce the oxide film on the surface to be bonded of the member to be bonded.
If the organic matter contained in the silver powder remains in the bonding layer, it may be decomposed with the passage of time to generate voids in the bonding layer. Therefore, the content ratio of the organic substance is preferably 2% by mass or less when the total amount of the first to third silver particles is 100% by mass. More preferably, the content ratio of the organic substance is 1.5% by mass or less, and may be 0.7% by mass or less. However, in order to obtain the effect of the organic substance, the content ratio of the organic substance is preferably 0.05% by mass or more when the total amount of the first to third silver particles is 100% by mass. More preferably, the content ratio of the organic substance may be 0.1% by mass or more.
〔バインダ〕
本実施形態のバインダは脂肪酸銀と銀脂肪族アミンとを含む。本実施形態におけるバインダは、その交換電流密度が１０μＡ／ｄｍ2以上１０００μＡ／ｄｍ2以下の範囲内にある。これにより、銀ペーストが加熱されたときに、錯体からの銀ナノ粒子の析出が遅くなり、銅又は銅合金部材の表面に銀めっき疑似膜が容易に形成される。バインダの交換電流密度が１０μＡ／ｄｍ2未満の場合、銀ペーストが加熱されたときの錯体からの銀ナノ粒子の析出が遅くなり過ぎ、銅又は銅合金部材の表面に銀めっき疑似膜が形成されにくくなり、接合体の接合強度が低下する。バインダの交換電流密度が１０００μＡ／ｄｍ2を超える場合、銀ペーストが加熱されたときの錯体からの銀ナノ粒子の析出が速まり、銀の核生成が優先されるため、銅又は銅合金部材の表面に銀めっき疑似膜が形成されにくくなり、接合体の接合強度が低下する。バインダが上記所定の交換電流密度の範囲内になるためには、バインダが添加剤を含むことが望ましい。バインダが添加剤を含む代わりに、後述する銀ペーストに含まれる脂肪族アミンや溶媒の種類を選定することによって、上記所定の交換電流密度の範囲内に制御することが可能になる。バインダの交換電流密度の測定方法は後述する。より好ましくは、前記交換電流密度は２０μＡ／ｄｍ2以上５００μＡ／ｄｍ2以下の範囲内であってもよく、１００μＡ／ｄｍ2以上３００μＡ／ｄｍ2以下の範囲内であってもよい。
[Binder]
The binder of this embodiment contains silver fatty acid and silver aliphatic amine. Binder in the present embodiment, the exchange current density is in the range of 10 .mu.A / dm 2 or more 1000μA / dm 2 or less. As a result, when the silver paste is heated, the precipitation of silver nanoparticles from the complex is delayed, and a silver-plated pseudo film is easily formed on the surface of the copper or copper alloy member. When the exchange current density of the binder is less than 10 μA / dm 2, the precipitation of silver nanoparticles from the complex when the silver paste is heated becomes too slow, and a silver-plated pseudo film is formed on the surface of the copper or copper alloy member. It becomes difficult and the bonding strength of the bonded body decreases. When the exchange current density of the binder exceeds 1000 μA / dm 2 , the precipitation of silver nanoparticles from the complex when the silver paste is heated is accelerated, and silver nucleation is prioritized. It becomes difficult for a silver-plated pseudo-film to be formed on the surface, and the bonding strength of the bonded body is reduced. In order for the binder to be within the above-mentioned predetermined exchange current density range, it is desirable that the binder contains an additive. By selecting the type of aliphatic amine or solvent contained in the silver paste described later instead of the binder containing the additive, it becomes possible to control within the above-mentioned predetermined exchange current density range. The method for measuring the exchange current density of the binder will be described later. More preferably, the exchange current density may be in the range of 20 μA /
〔脂肪酸銀〕
本実施形態の脂肪酸銀としては、酢酸銀、シュウ酸銀、プロピオン酸銀、ミリスチン酸銀、酪酸銀等が挙げられる。
[Fatty acid silver]
Examples of the fatty acid silver of the present embodiment include silver acetate, silver oxalate, silver propionate, silver myristate, silver butyrate and the like.
〔脂肪族アミン〕
本実施形態の脂肪族アミンとしては、第１級アミン、第２級アミン、第３級アミン等が挙げられる。脂肪族アミンの炭素数は好ましくは８〜１２とすることが望ましい。上記炭素数が小さすぎると脂肪族アミンの沸点が低い傾向があるので、銀ペーストの印刷性が低下するおそれがある。上記炭素数が大きすぎると銀ペースト中の銀粒子の焼結を妨げ、十分な強度を有する接合体が得られないおそれがある。具体的な例として、第１級アミンには、エチルヘキシルアミン、アミノデカン、ドデシルアミン、ノニルアミン、ヘキシルアミン、オクチルアミン等があり、第２級アミンには、ジメチルアミン、ジエチルアミン、ジオクチルアミン等があり、第３級アミンには、トリメチルアミン、トリエチルアミン等がある。前記炭素数は１０〜１２であってもよい。
[Alphatic amine]
Examples of the aliphatic amine of the present embodiment include primary amines, secondary amines, and tertiary amines. The number of carbon atoms of the aliphatic amine is preferably 8 to 12. If the number of carbon atoms is too small, the boiling point of the aliphatic amine tends to be low, which may reduce the printability of the silver paste. If the number of carbon atoms is too large, the sintering of silver particles in the silver paste may be hindered, and a bonded body having sufficient strength may not be obtained. Specific examples include ethylhexylamine, aminodecane, dodecylamine, nonylamine, hexylamine, octylamine and the like as primary amines, and dimethylamine, diethylamine, dioctylamine and the like as secondary amines. Tertiary amines include trimethylamine, triethylamine and the like. The carbon number may be 10 to 12.
ここで、銀ペーストにおいて、脂肪酸銀に対する脂肪族アミンのモル比、即ち、脂肪族アミンのモル量／脂肪酸銀のモル量は、１．５以上３以下の範囲内にあることが好ましい。脂肪族アミンの割合が少ないと、固体である脂肪酸銀の割合が相対的に高くなるため、銀ペースト中に均一に分散しにくくなり、加熱して得た接合層内部にボイドが生じやすくなるおそれがある。脂肪族アミンの割合が多すぎると、過剰量の脂肪族アミンが銀ペースト中の銀粉末の粒成長を招き易く、ペースト粘度が低下し易くなるので印刷性が悪化するおそれがある。脂肪族アミンのモル量／脂肪酸銀のモル量は、１．７以上２．８以下の範囲内にあることが更に好ましく、２．０以上２．５以下の範囲内がより一層好ましい。 Here, in the silver paste, the molar ratio of the aliphatic amine to the fatty acid silver, that is, the molar amount of the aliphatic amine / the molar amount of the fatty acid silver is preferably in the range of 1.5 or more and 3 or less. When the proportion of aliphatic amines is small, the proportion of solid fatty acid silver is relatively high, so that it is difficult to disperse uniformly in the silver paste, and voids may easily occur inside the bonding layer obtained by heating. There is. If the proportion of the aliphatic amine is too large, the excess amount of the aliphatic amine tends to cause the grain growth of the silver powder in the silver paste, and the paste viscosity tends to decrease, which may deteriorate the printability. The molar amount of the aliphatic amine / the molar amount of the silver fatty acid is more preferably in the range of 1.7 or more and 2.8 or less, and further preferably in the range of 2.0 or more and 2.5 or less.
銀ペーストは、脂肪酸銀と脂肪族アミンを含むため、この脂肪酸銀の少なくとも一部と脂肪族アミンの少なくとも一部とが反応して錯体が形成される。この錯体は、銀アミン錯体であると推定される。 Since the silver paste contains silver fatty acid and an aliphatic amine, at least a part of the silver fatty acid and at least a part of the aliphatic amine react to form a complex. This complex is presumed to be a silver amine complex.
〔添加剤〕
本実施形態のバインダには、添加剤を更に含んでもよい。添加剤としては、ジエチレングリコール、トリエチレングリコール、ポリエチレングリコール又は安息香酸のいずれか１種又は２種以上の化合物が挙げられる。上述したように、バインダが添加剤を含むことにより、バインダの交換電流密度が１０μＡ／ｄｍ2以上１０００μＡ／ｄｍ2以下の範囲内に制御し易くなる。しかし、銀ペーストに含まれる脂肪族アミンや次に述べる溶媒の種類を選定することによって、上記所定の交換電流密度の範囲内になるので、その場合には、添加剤は必ずしも必要ではない。バインダが添加剤を含む場合には、バインダ中の添加剤の含有割合が質量比（添加剤／バインダ）で０．００３以上０．３３３以下、好ましくは０．０２０以上０．２００以下の範囲内にあることが好ましい。
〔Additive〕
The binder of the present embodiment may further contain an additive. Examples of the additive include any one or more compounds of diethylene glycol, triethylene glycol, polyethylene glycol and benzoic acid. As described above, by the binder contains additives, exchange current density of the binder is easily controlled within a range of 10 .mu.A / dm 2 or more 1000μA / dm 2 or less. However, by selecting the type of aliphatic amine contained in the silver paste or the solvent described below, the exchange current density is within the above-mentioned predetermined exchange current density, and in that case, an additive is not always necessary. When the binder contains an additive, the content ratio of the additive in the binder is within the range of 0.003 or more and 0.333 or less, preferably 0.020 or more and 0.200 or less in terms of mass ratio (additive / binder). It is preferable to be in.
〔溶媒〕
銀ペーストは、更に溶媒を含んでもよい。溶媒としては、アルコール系溶媒、水、アセテート系溶媒、炭化水素系溶媒、及びそれらの混合物等が挙げられる。アルコール系溶媒には、α−テルピネオール、イソプロピルアルコール、エチルヘキサンジオール、１−ヘキサノール、１−オクタノール及びそれらの混合物等があり、アセテート系溶媒には、ブチルカルビトールアセテート等があり、炭化水素系溶媒としては、デカン、ドデカン、テトラデカン、及びそれらの混合物等がある。溶媒の含有量は銀ペースト全体を１００質量％とするときに０質量％以上３０質量％以下の範囲内にあることが好ましい。前記溶媒の含有量が０質量％であっても、銀ペースト中の脂肪族アミン及び／又は添加剤が溶媒としての機能を果たすことから問題ない。３０質量％を超えると粘度が低くなり過ぎ、塗布時の形状保持性が悪化し易い。前記溶媒の更に好ましい含有量は、０質量％以上１０質量％以下の範囲内である。
〔solvent〕
The silver paste may further contain a solvent. Examples of the solvent include alcohol-based solvents, water, acetate-based solvents, hydrocarbon-based solvents, and mixtures thereof. Alcohol-based solvents include α-terpineol, isopropyl alcohol, ethylhexanediol, 1-hexanol, 1-octanol and mixtures thereof, and acetate-based solvents include butyl carbitol acetate and the like, and hydrocarbon-based solvents. Examples include decane, dodecane, tetradecane, and mixtures thereof. The content of the solvent is preferably in the range of 0% by mass or more and 30% by mass or less when the total amount of the silver paste is 100% by mass. Even if the content of the solvent is 0% by mass, there is no problem because the aliphatic amine and / or the additive in the silver paste functions as a solvent. If it exceeds 30% by mass, the viscosity becomes too low, and the shape retention at the time of coating tends to deteriorate. A more preferable content of the solvent is in the range of 0% by mass or more and 10% by mass or less.
〔樹脂〕
銀ペーストは、更に樹脂を含んでもよい。樹脂としては、エポキシ系樹脂、シリコーン系樹脂、アクリル系樹脂、及びそれらの混合物等が挙げられる。エポキシ系樹脂には、ビスフェノールＡ型エポキシ樹脂、ノボラック型エポキシ樹脂、環状脂肪族型エポキシ樹脂、及びそれらの混合物等があり、シリコーン系樹脂には、メチルシリコーン樹脂、エポキシ変性シリコーン樹脂、ポリエステル変性シリコーン樹脂、及びそれらの混合物等があり、アクリル系樹脂には、アクリレート系モノマー樹脂等がある。これらの樹脂は、銀ペーストの加熱によって硬化し、その硬化体が、銀粉末の焼結体の空隙に充填される。熱硬化性樹脂組成物の硬化体が、銀粉末の焼結体の空隙に充填されることによって、接合層の機械的強度が向上し、更に冷熱サイクル負荷時における接合強度の低下が抑えられる。前記樹脂の含有量は銀ペースト全体を１００質量％とするときに０質量％以上３質量％以下の範囲内にあることが好ましい。前記樹脂の含有量が３質量％を超えると銀粉末の焼結が妨げられ接合層の機械的強度が低下するおそれがある。前記樹脂の更に好ましい含有量は、０質量％以上２．５質量％以下の範囲内であり、より一層好ましい含有量は、０質量％以上２．０質量％以下の範囲内である。
〔resin〕
The silver paste may further contain a resin. Examples of the resin include epoxy-based resins, silicone-based resins, acrylic-based resins, and mixtures thereof. Epoxy-based resins include bisphenol A-type epoxy resins, novolac-type epoxy resins, cyclic aliphatic epoxy resins, and mixtures thereof. Silicone-based resins include methyl silicone resins, epoxy-modified silicone resins, and polyester-modified silicones. There are resins and mixtures thereof, and acrylic resins include acrylate-based monomer resins and the like. These resins are cured by heating the silver paste, and the cured product is filled in the voids of the sintered body of the silver powder. By filling the voids of the sintered body of silver powder with the cured product of the thermosetting resin composition, the mechanical strength of the bonding layer is improved, and the decrease in bonding strength under a thermal cycle load is suppressed. The content of the resin is preferably in the range of 0% by mass or more and 3% by mass or less when the total amount of the silver paste is 100% by mass. If the content of the resin exceeds 3% by mass, sintering of the silver powder may be hindered and the mechanical strength of the bonding layer may decrease. A more preferable content of the resin is in the range of 0% by mass or more and 2.5% by mass or less, and a further preferable content is in the range of 0% by mass or more and 2.0% by mass or less.
〔銀ペーストの製造方法〕
このように構成された銀ペーストの製造方法を説明する。先ず、脂肪酸銀、脂肪族アミン及び溶媒を用意し、脂肪酸銀と脂肪族アミンと溶媒とを混合し、混合物を調製する。ここで脂肪族アミンが常温で液体の場合には、溶媒は必ずしも混合しなくてもよい。この混合物の合計量を１００質量％とするときに、脂肪酸銀が０．１質量％以上４０質量％以下、脂肪族アミンが０．１質量％以上６０質量％以下、溶媒が８０質量％以下の割合で混合することが好ましい。ここで、脂肪酸銀、脂肪族アミン及び溶媒の混合割合を前記範囲内に限定したのは、混合液に沈殿等を生じにくいからである。より好ましい混合割合は、脂肪酸銀と脂肪族アミンと溶媒との合計量を１００質量％とするときに、脂肪酸銀が２０質量％以上３０質量％以下、脂肪族アミンが２０質量％以上４０質量％以下、溶媒が４０質量％以上６０質量％以下である。
[Manufacturing method of silver paste]
A method for producing the silver paste thus constructed will be described. First, silver fatty acid, an aliphatic amine and a solvent are prepared, and silver fatty acid, an aliphatic amine and a solvent are mixed to prepare a mixture. Here, when the aliphatic amine is a liquid at room temperature, the solvent does not necessarily have to be mixed. When the total amount of this mixture is 100% by mass, the fatty acid silver is 0.1% by mass or more and 40% by mass or less, the aliphatic amine is 0.1% by mass or more and 60% by mass or less, and the solvent is 80% by mass or less. It is preferable to mix in a ratio. Here, the mixing ratio of the fatty acid silver, the aliphatic amine and the solvent is limited to the above range because precipitation and the like are unlikely to occur in the mixed solution. A more preferable mixing ratio is, when the total amount of the fatty acid silver, the aliphatic amine and the solvent is 100% by mass, the fatty acid silver is 20% by mass or more and 30% by mass or less, and the aliphatic amine is 20% by mass or more and 40% by mass. Hereinafter, the amount of the solvent is 40% by mass or more and 60% by mass or less.
次に、前記混合物を３０℃以上１００℃以下の範囲内の温度で加熱して５分間以上１０時間以下の範囲内の時間撹拌して混合液を調製することが好ましい。調製した後に、この混合液を室温（２５℃）まで下げて冷却する。これにより脂肪酸銀、脂肪族アミン及び溶媒の混合溶液（以下、単に混合溶液という。）が調製される。ここで、前記混合物の加熱温度及び加熱時間を前記範囲内とするのは、脂肪酸銀、脂肪族アミン及び溶媒を均一に混合し易くするためである。 Next, it is preferable to heat the mixture at a temperature in the range of 30 ° C. or higher and 100 ° C. or lower and stir for a time in the range of 5 minutes or more and 10 hours or less to prepare a mixed solution. After preparation, the mixture is cooled to room temperature (25 ° C.). As a result, a mixed solution of silver fatty acid, an aliphatic amine and a solvent (hereinafter, simply referred to as a mixed solution) is prepared. Here, the heating temperature and heating time of the mixture are set within the above ranges in order to facilitate uniform mixing of the fatty acid silver, the aliphatic amine and the solvent.
次に、前記混合溶液と前記銀粉末と前記添加剤を混合した後、プラネタリー遊星撹拌機等にて撹拌し、更に３本ロールミル等にて混練することにより、銀ペーストを得る。ここで、前記銀ペーストを１００質量％とするとき、前記銀粉末の含有量は５０質量％〜９５質量％の範囲内にすることが好ましい。より好ましくは、前記銀粉末の含有量は７０質量％以上９５質量％以下の範囲内であり、８０質量％以上９３質量％以下の範囲内であってもよい。銀ペーストにおいて、前記銀粉末の含有量が少ないと銀ペーストの粘度が低下してダレ等の塗布不良が生じ易くなるおそれがあり、高すぎると粘度が増大してハンドリング性が悪化するおそれがある。添加剤と混合溶液とを先に混合した後に銀粉末を混合してもよく、又は混合溶液と銀粉末とを混合した後に添加剤を混合してもよい。添加剤は、バインダ中の含有割合が、質量比（添加剤／バインダ）で０．００３以上０．３３３以下の範囲内で混合することが好ましい。前記質量比は０．０２０以上０．２００以下の範囲内であってもよい。上述したように、脂肪族アミンや溶媒の種類を選定することによって、添加剤をバインダに含ませなくてもよい。この質量比で混合することにより、銀ペーストが加熱されたときの錯体の還元力が弱まり、錯体からの銀ナノ粒子の析出が遅くなり、銅又は銅合金部材の表面に銀めっき疑似膜が容易に形成される。また、銀ペーストは前記樹脂を含んでもよい。この場合、冷熱サイクル特性が向上する。また、混合溶液と添加剤を混合した後で、銀粉末を添加して混合し、銀ペーストを得てもよい。 Next, after mixing the mixed solution, the silver powder, and the additive, the mixture is stirred with a planetary planetary stirrer or the like, and further kneaded with a three-roll mill or the like to obtain a silver paste. Here, when the silver paste is 100% by mass, the content of the silver powder is preferably in the range of 50% by mass to 95% by mass. More preferably, the content of the silver powder is in the range of 70% by mass or more and 95% by mass or less, and may be in the range of 80% by mass or more and 93% by mass or less. In the silver paste, if the content of the silver powder is small, the viscosity of the silver paste may decrease and coating defects such as sagging may easily occur, and if it is too high, the viscosity may increase and the handleability may deteriorate. .. The additive and the mixed solution may be mixed first and then the silver powder may be mixed, or the mixed solution and the silver powder may be mixed and then the additive may be mixed. The additive is preferably mixed in the range of 0.003 or more and 0.333 or less in terms of mass ratio (additive / binder) in the binder. The mass ratio may be in the range of 0.020 or more and 0.200 or less. As described above, by selecting the type of aliphatic amine or solvent, it is not necessary to include the additive in the binder. By mixing at this mass ratio, the reducing power of the complex when the silver paste is heated is weakened, the precipitation of silver nanoparticles from the complex is delayed, and a silver-plated pseudo film is easily formed on the surface of the copper or copper alloy member. Is formed in. Further, the silver paste may contain the resin. In this case, the cold cycle characteristics are improved. Alternatively, after mixing the mixed solution and the additive, silver powder may be added and mixed to obtain a silver paste.
なお、この混合溶液において、脂肪酸銀に対する脂肪族アミンのモル比、即ち、脂肪族アミンのモル量／脂肪酸銀のモル量は、１．５以上３以下の範囲内とすることが好ましく、１．７以上２．８以下の範囲内とすることが更に好ましい。このような混合溶液を用いて、銀ペーストを作製すると、混合溶液における脂肪酸銀に対する脂肪族アミンのモル比が、銀ペーストにおける脂肪酸銀に対する脂肪族アミンのモル比となる。 In this mixed solution, the molar ratio of the aliphatic amine to the silver fatty acid, that is, the molar amount of the aliphatic amine / the molar amount of the silver fatty acid is preferably in the range of 1.5 or more and 3 or less. It is more preferably in the range of 7 or more and 2.8 or less. When a silver paste is prepared using such a mixed solution, the molar ratio of the aliphatic amine to the fatty acid silver in the mixed solution becomes the molar ratio of the aliphatic amine to the fatty acid silver in the silver paste.
〔接合体の製造方法〕
前記銀ペーストを用いて接合体を製造する方法について説明する。
本実施形態の製造方法では、メタライズ層を有しない銅又は銅合金部材と電子部品を用意する。電子部品としては、半導体チップ、高出力ＬＥＤ素子、パワー半導体素子等の半導体素子、パッケージ等が挙げられる。銅又は銅合金部材には、例えばＤＢＣ基板（銅張り基板）や銅合金製のリードフレームが挙げられる。但し、銅又は銅合金部材はＤＢＣ基板やリードフレームに限定されない。次いで、銅又は銅合金部材の表面に、前記銀ペーストを、例えば、メタルマスク法等により直接塗布して、所望の平面形状を有する銀ペースト層を形成する。
[Manufacturing method of bonded body]
A method for producing a bonded body using the silver paste will be described.
In the manufacturing method of the present embodiment, a copper or copper alloy member and an electronic component having no metallized layer are prepared. Examples of electronic components include semiconductor chips, high-power LED elements, semiconductor elements such as power semiconductor elements, packages, and the like. Examples of the copper or copper alloy member include a DBC substrate (copper-clad substrate) and a lead frame made of a copper alloy. However, the copper or copper alloy member is not limited to the DBC substrate and the lead frame. Next, the silver paste is directly applied to the surface of the copper or copper alloy member by, for example, a metal mask method or the like to form a silver paste layer having a desired planar shape.
次に、銀ペースト層を介して銅又は銅合金部材上に電子部品を積層し、積層体を作製する。そして、この積層体を、酸素濃度が体積基準で１０００ｐｐｍ以下、好ましくは７００ｐｐｍ以下、より好ましくは２００ｐｐｍ以下、さらに好ましくは１００ｐｐｍ以下の低酸素濃度の窒素雰囲気下で、加熱する。例えば、積層体を１２０℃以上２８０℃以下の温度（加熱温度）の範囲内に１０分間以上２４０分間以下（加熱時間）加熱保持する。この加熱により、銀ペースト中の脂肪酸銀の少なくとも一部と脂肪族アミンの少なくとも一部とが反応して形成された錯体から銀ナノ粒子が析出する。銀ペースト中の添加剤が錯体の還元力を弱め、錯体からの銀ナノ粒子の析出を遅くして、析出された銀ナノ粒子の一部は銅又は銅合金部材の表面に銀めっき疑似膜が形成する。続く加熱により、銀ペースト層中の銀粉末（第１銀粒子と第２銀粒子と第３銀粒子）が、析出された残りの銀ナノ粒子及び銀めっき疑似膜とともに、焼結して、接合層を形成する。これにより、低酸素濃度の窒素雰囲気下で加熱を行っても、表面にメタライズ層を有しない銅又は銅合金部材に電子部品がこの接合層を介して高い強度で直接接合された接合体を作製できる。ここで、前記積層体の加熱温度及び加熱時間を前記範囲内に限定したのは、１０分未満では焼結が進みにくくなるおそれがあり、２４０分を超えても接合特性に変化がなくコスト増となるという理由に基づく。なお、加熱時において、前記積層体に対して、その積層方向への加圧は行わなくてもよい。これは、加圧工程を省いてコストを低減するという理由に基づく。 Next, electronic components are laminated on a copper or copper alloy member via a silver paste layer to prepare a laminated body. Then, this laminate is heated in a nitrogen atmosphere having a low oxygen concentration of 1000 ppm or less, preferably 700 ppm or less, more preferably 200 ppm or less, still more preferably 100 ppm or less on a volume basis. For example, the laminate is heated and held for 10 minutes or more and 240 minutes or less (heating time) within a temperature range of 120 ° C. or higher and 280 ° C. or lower (heating temperature). By this heating, silver nanoparticles are precipitated from the complex formed by the reaction of at least a part of the fatty acid silver in the silver paste and at least a part of the aliphatic amine. Additives in the silver paste weaken the reducing power of the complex, slowing the precipitation of silver nanoparticles from the complex, and some of the precipitated silver nanoparticles have a silver-plated pseudo-film on the surface of the copper or copper alloy member. Form. Subsequent heating causes the silver powder (first silver particles, second silver particles, and third silver particles) in the silver paste layer to be sintered and bonded together with the remaining precipitated silver nanoparticles and silver plating pseudofilm. Form a layer. As a result, even if heating is performed in a nitrogen atmosphere with a low oxygen concentration, an electronic component is directly bonded to a copper or copper alloy member having no metallized layer on the surface via this bonding layer with high strength. can. Here, the reason why the heating temperature and the heating time of the laminated body are limited to the above ranges is that sintering may be difficult to proceed in less than 10 minutes, and even if it exceeds 240 minutes, the bonding characteristics do not change and the cost increases. Based on the reason that At the time of heating, it is not necessary to pressurize the laminated body in the laminating direction. This is based on the reason that the pressurization process is omitted to reduce the cost.
次に本発明の実施例を比較例とともに詳しく説明する。はじめに、銀粉末を含まない銀ペースト前駆体である混合溶液１〜１８及び混合溶液２０〜２２を説明し、次いで、これらの混合溶液を用いた実施例１〜２８及び比較例１〜９を説明する。 Next, examples of the present invention will be described in detail together with comparative examples. First, mixed solutions 1 to 18 and mixed solutions 20 to 22, which are silver paste precursors containing no silver powder, will be described, and then Examples 1 to 28 and Comparative Examples 1 to 9 using these mixed solutions will be described. do.
〔銀ペースト前駆体（混合溶液）の製造例〕
＜混合溶液１＞
先ず、酢酸銀（脂肪酸銀）、アミノデカン（脂肪族アミン）及びブチルカルビトールアセテート（溶媒）を用意し、脂肪酸銀、脂肪族アミン及び溶媒の合計量を１００質量％とするとき、酢酸銀（脂肪酸銀）２２質量％、アミノデカン（脂肪族アミン）４１．３質量％、ブチルカルビトールアセテート（溶媒）３６．７質量％の割合で量り取り、これらをスターラーの撹拌子とともにガラス製の容器に入れた。そして、５０℃に加熱したホットプレートに前記容器を載せ、スターラーの撹拌子を３００ｒｐｍで回転させながら、１時間撹拌して混合液を調製した。次いで、この混合液が貯留された容器をホットプレートから降ろしてこの混合液の温度を室温まで下げた。これにより銀ペースト前駆体である脂肪酸銀・脂肪族アミン混合溶液（以下、単に混合溶液という。）である混合溶液１を調製した。
[Production example of silver paste precursor (mixed solution)]
<Mixed solution 1>
First, silver acetate (silver fatty acid), aminodecane (aliphatic amine) and butyl carbitol acetate (solvent) are prepared, and when the total amount of silver fatty acid, aliphatic amine and solvent is 100% by mass, silver acetate (fatty acid). Weighed 22% by mass of silver), 41.3% by mass of aminodecane (aliphatic amine), and 36.7% by mass of butyl carbitol acetate (solvent), and placed them in a glass container together with a stirrer of Stirrer. .. Then, the container was placed on a hot plate heated to 50 ° C., and the mixture was prepared by stirring for 1 hour while rotating the stirrer of the stirrer at 300 rpm. Then, the container in which the mixed solution was stored was removed from the hot plate to lower the temperature of the mixed solution to room temperature. As a result, a mixed solution 1 which is a fatty acid silver / aliphatic amine mixed solution (hereinafter, simply referred to as a mixed solution) which is a silver paste precursor was prepared.
＜混合溶液２〜１８及び混合溶液２０〜２２＞
混合溶液２〜１８及び混合溶液２０〜２２は、脂肪酸銀、脂肪族アミン及び溶媒として、表１に示す種類のものを用いるとともに、脂肪酸銀、脂肪族アミン及び溶媒を、表１に示すような割合でそれぞれ配合した。混合溶液１８では、溶媒を用いなかった。なお、混合溶液２０は脂肪酸銀を含まず、混合溶液２１は脂肪族アミンを含まないため、混合溶液ではないけれども、本明細書では、便宜上、混合溶液２０、２１も混合溶液と呼ぶ。また、表１及び表２中の脂肪酸銀の種類の欄において、『Ａ１』は酢酸銀であり、『Ａ２』はシュウ酸銀であり、『Ａ３』はミリスチン酸銀である。また、表１及び表２中の脂肪族アミンの種類の欄において、『Ｂ１』はアミノデカンを示し、『Ｂ２』はヘキシルアミンを示し、『Ｂ３』はオクチルアミンであり、『Ｂ４』はドデシルアミンであり、『Ｂ５』はジオクチルアミンである。更に、表１及び表２中の溶媒の種類の欄において、『Ｃ１』はブチルカルビトールアセテートであり、『Ｃ２』は水であり、『Ｃ３』はα−テルピネオールであり、『Ｃ４』は２−エチル１，３−ヘキサンジオールであり、『Ｃ５』は１−ヘキサノールであり、『Ｃ６』は１−オクタノールであり、『Ｃ７』は平均分子量が２００のポリエチレングリコールである。
<Mixed solution 2-18 and mixed solution 20-22>
As the
＜比較試験１及び評価＞
混合溶液１〜１８及び混合溶液２０〜２２をそれぞれ別々に撹拌しながら１３０℃で１０分間加熱した後、それぞれの混合溶液１ｇをシリコンウェーハ上に滴下し、２５℃の温度で減圧乾燥することにより、乾燥物が表面に付着したウェーハを作製した。そして、このウェーハの表面をＳＥＭ（走査電子顕微鏡）観察し、表面に付着した粒子を１０００個計数し、画像処理ソフト（Ｉｍａｇｅ−Ｊ（アメリカ国立衛生研究所：開発））を用いて、抽出した粒子（一次粒子）の投影面積を測定し、得られた投影面積から円相当径を算出し、これを一次粒子径とした。輪郭が視認できない箇所がある粒子については、円相当径を測定しなかった。得られた一次粒子径を、体積基準の粒径に変換し、その体積基準の粒径の平均値を乾燥物の平均粒径とした。また、前記乾燥物中に銀粉末が生じたものを『可』とし、乾燥物中に銀粉末が生じなかったもの、或いは銀粉末の一次粒子径を測定できなかったものを『不可』と判定した。前記乾燥物中の銀粉末の平均粒径と、判定結果を表２に示す。なお、表２には、脂肪酸銀の種類と、脂肪族アミンの種類と溶媒の種類も示した。
<Comparative test 1 and evaluation>
After heating the mixed solutions 1 to 18 and the mixed solutions 20 to 22 separately at 130 ° C. for 10 minutes, 1 g of each mixed solution is dropped onto a silicon wafer and dried under reduced pressure at a temperature of 25 ° C. , A wafer in which a dried product adhered to the surface was produced. Then, the surface of this wafer was observed with an SEM (scanning electron microscope), 1000 particles adhering to the surface were counted, and extracted using image processing software (Image-J (National Institutes of Health: development)). The projected area of the particles (primary particles) was measured, and the equivalent circle diameter was calculated from the obtained projected area, which was used as the primary particle diameter. For particles with invisible contours, the equivalent circle diameter was not measured. The obtained primary particle size was converted into a volume-based particle size, and the average value of the volume-based particle size was taken as the average particle size of the dried product. Further, the one in which silver powder is generated in the dried product is judged as "possible", and the one in which silver powder is not generated in the dried product or the one in which the primary particle size of the silver powder cannot be measured is judged as "impossible". bottom. Table 2 shows the average particle size of the silver powder in the dried product and the determination results. Table 2 also shows the types of silver fatty acids, the types of aliphatic amines, and the types of solvents.
表２から明らかなように、脂肪酸銀を含まない混合溶液２０は、接合層の緻密化に寄与すると期待される銀を含まないため、ＳＥＭ（走査電子顕微鏡）観察時に銀粉末の発生は見られず、判定結果は不可であった。 As is clear from Table 2, since the mixed solution 20 containing no fatty acid silver does not contain silver, which is expected to contribute to the densification of the bonding layer, generation of silver powder is observed during SEM (scanning electron microscope) observation. However, the judgment result was not possible.
また、脂肪族アミンを含まない混合溶液２１は、均一な混合溶液が得られず、シリコンウェーハ上での乾燥物が塊となったため、ＳＥＭ（走査電子顕微鏡）観察で銀粉末を測定することができず、判定結果は不可であった。これは、混合溶液２１は、脂肪族アミンを含まないため、脂肪酸銀の分解が十分に進行せずに銀粉末が生成しなかったためであると考えられる。 Further, in the mixed solution 21 containing no aliphatic amine, a uniform mixed solution could not be obtained, and the dried product on the silicon wafer became a lump. Therefore, the silver powder can be measured by SEM (scanning electron microscope) observation. The judgment result was impossible. It is considered that this is because the mixed solution 21 does not contain an aliphatic amine, so that the decomposition of the fatty acid silver did not proceed sufficiently and the silver powder was not produced.
これらに対し、脂肪酸銀及び脂肪族アミンを含む混合溶液１〜１８及び混合溶液２２では、ＳＥＭ（走査電子顕微鏡）観察時に平均粒径５０ｎｍ以上１００ｎｍ以下の銀粉末の発生が見られ、判定結果は可であった。これは、混合溶液１〜１８及び混合溶液２２が脂肪酸銀及び脂肪族アミンを含むので、加熱により有機物が速やかに分解され、高活性な表面を露出させた銀ナノ粒子が容易に形成されたからであると推定される。 On the other hand, in the mixed solutions 1 to 18 and the mixed solution 22 containing the fatty acid silver and the aliphatic amine, the generation of silver powder having an average particle size of 50 nm or more and 100 nm or less was observed during SEM (scanning electron microscope) observation, and the judgment result was as follows. It was possible. This is because the mixed solutions 1 to 18 and the mixed solution 22 contain fatty acid silver and an aliphatic amine, so that the organic matter is rapidly decomposed by heating, and highly active surface-exposed silver nanoparticles are easily formed. Presumed to be.
〔銀ペーストの製造例〕
先ず、実施例１〜２８及び比較例１〜９で調製される銀ペーストの原料として用いられる銀粉末の調製方法について述べる。これらの１０種類の銀粉末を以下の表３において、『No.1〜No.10』で示す。表３には、１０種類の銀粉末中の有機物含有量も示す。
[Production example of silver paste]
First, a method for preparing silver powder used as a raw material for the silver paste prepared in Examples 1 to 28 and Comparative Examples 1 to 9 will be described. These 10 types of silver powder are shown in "No. 1 to No. 10" in Table 3 below. Table 3 also shows the organic matter content in the 10 types of silver powder.
表３に示すNo.１の銀粉末（第１〜第３銀粒子の混合物／凝集体）は次のようにして調製した。先ず、Ｄ１０、Ｄ５０及びＤ９０がそれぞれ２０ｎｍ、５０ｎｍ及び１００ｎｍである銀微粒子（原料粉Ａ）と、Ｄ１０、Ｄ５０及びＤ９０がそれぞれ１５０ｎｍ、３００ｎｍ及び５００ｎｍである銀微粒子（原料粉Ｂ）とを用意した。銀微粒子（原料粉Ａ）と銀微粒子（原料粉Ｂ）の調製方法は後述する。Ｄ１０は混合物中のその粒径以下の粒子の比率が１０％になる値であり、Ｄ５０は混合物中のその粒径以下の粒子の比率が５０％になる値であり、Ｄ９０は混合物中のその粒径以下の粒子の比率が９０％になる値である。各銀微粒子のＤ１０、Ｄ５０及びＤ９０は、銀微粒子の粒度分布曲線から求めた。銀微粒子の粒度分布曲線は、後述する動的光散乱法により測定した。No.１の銀粉末は、原料粉Ａと、原料粉Ｂとを、質量比で１：３の割合にて混合し、銀微粒子混合物を得た。
動的光散乱法による測定では、先ず、銀微粒子０．１ｇをイオン交換水２０ｇ中に投入し、２５ｋＨｚの超音波を５分間照射して、イオン交換水に銀粒子を分散させた。次に、得られた銀微粒子分散液を、動的光散乱式粒度分布測定装置（堀場製作所：ＬＢ−５５０）用の観察セルに注ぎ、この装置の手順に従い粒度分布を測定した。
The No. 1 silver powder (mixture / aggregate of first to third silver particles) shown in Table 3 was prepared as follows. First, silver fine particles (raw material powder A) in which D10, D50 and D90 are 20 nm, 50 nm and 100 nm, respectively, and silver fine particles (raw material powder B) in which D10, D50 and D90 are 150 nm, 300 nm and 500 nm, respectively, were prepared. .. The method for preparing the silver fine particles (raw material powder A) and the silver fine particles (raw material powder B) will be described later. D10 is a value in which the proportion of particles below the particle size in the mixture is 10%, D50 is a value in which the proportion of particles below the particle size in the mixture is 50%, and D90 is the value in the mixture. This is a value at which the ratio of particles having a particle size or less is 90%. D10, D50 and D90 of each silver fine particle were obtained from the particle size distribution curve of the silver fine particle. The particle size distribution curve of the silver fine particles was measured by the dynamic light scattering method described later. For the No. 1 silver powder, raw material powder A and raw material powder B were mixed at a mass ratio of 1: 3 to obtain a silver fine particle mixture.
In the measurement by the dynamic light scattering method, first, 0.1 g of silver fine particles was put into 20 g of ion-exchanged water, and ultrasonic waves of 25 kHz were irradiated for 5 minutes to disperse the silver particles in the ion-exchanged water. Next, the obtained silver fine particle dispersion was poured into an observation cell for a dynamic light scattering particle size distribution measuring device (HORIBA, Ltd .: LB-550), and the particle size distribution was measured according to the procedure of this device.
次いで、この銀微粒子混合物とアスコルビン酸ナトリウム（有機還元剤）と水とを、質量比で１０：１：８９となる割合にて混合し、銀微粒子スラリーを調製した。この銀微粒子スラリーを、９０℃の温度で３時間加熱して、銀微粒子を還元処理した。次に、銀微粒子スラリーを室温まで放冷した後、遠心分離器を用いて、固形物を分離して回収した。この回収した固形物（含水銀微粒子凝集体）を数回水洗し、乾燥して、表３に示すNo.１の銀粉末（第１〜第３銀粒子の混合物／凝集体）を得た。 Next, this silver fine particle mixture, sodium ascorbate (organic reducing agent), and water were mixed at a mass ratio of 10: 1: 89 to prepare a silver fine particle slurry. The silver fine particle slurry was heated at a temperature of 90 ° C. for 3 hours to reduce the silver fine particles. Next, the silver fine particle slurry was allowed to cool to room temperature, and then the solid matter was separated and recovered using a centrifuge. The recovered solid (mercury-containing fine particle agglomerates) was washed with water several times and dried to obtain No. 1 silver powder (mixture / agglomerates of first to third silver particles) shown in Table 3.
No.2の銀粉末は、銀微粒子（原料粉Ａ）と銀微粒子（原料粉Ｂ）との混合割合を、質量比で１：１としたこと以外は、上述したNo.1の銀粉末の調製方法と同様にして、得た。 The No. 2 silver powder is the same as the No. 1 silver powder described above, except that the mixing ratio of the silver fine particles (raw material powder A) and the silver fine particles (raw material powder B) is 1: 1 by mass ratio. Obtained in the same manner as the preparation method.
No.3の銀粉末は、銀微粒子（原料粉Ａ）と銀微粒子（原料粉Ｂ）との混合割合を、質量比で１：５としたこと以外は、上述したNo.1の銀粉末の調製方法と同様にして、得た。 The No. 3 silver powder is the same as the No. 1 silver powder described above, except that the mixing ratio of the silver fine particles (raw material powder A) and the silver fine particles (raw material powder B) is 1: 5 by mass ratio. Obtained in the same manner as the preparation method.
No.4の銀粉末は、以下の方法で得た。５０℃に保持した１２００ｇのイオン交換水に、５０℃に保持した９００ｇの硝酸銀水溶液と、５０℃に保持した６００ｇのクエン酸ナトリウム水溶液とを、５分かけて同時に滴下し、クエン酸銀スラリーを調製した。なお、イオン交換水中に硝酸銀水溶液とクエン酸ナトリウム水溶液を同時に滴下している間、イオン交換水を撹拌し続けた。また、硝酸銀水溶液中の硝酸銀の濃度は６６質量％であり、クエン酸ナトリウム水溶液中のクエン酸の濃度は５６質量％であった。次いで、５０℃に保持したクエン酸銀スラリーに、５０℃に保持した３００ｇのギ酸ナトリウム水溶液を３０分かけて滴下して混合スラリーを得た。このギ酸ナトリウム水溶液中のギ酸の濃度は５８質量％であった。次に、前記混合スラリーに所定の熱処理を行った。具体的には、前記混合スラリーを昇温速度１０℃／時間で最高温度６０℃まで昇温し、６０℃（最高温度）で３０分保持した後に、６０分間かけて２０℃まで温度を下げた。これにより銀粉末スラリーを得た。前記銀粉末スラリーを遠心分離機に入れて１０００ｒｐｍの回転速度で１０分間回転させた。これにより銀粉末スラリー中の液層が除去され、脱水及び脱塩された銀粉末スラリーを得た。この脱水及び脱塩された銀粉末スラリーを凍結乾燥法により３０時間乾燥することで、表３に示す体積基準の粒径の粒度分布を有するNo.4の銀粉末を得た。 No. 4 silver powder was obtained by the following method. A 900 g silver nitrate aqueous solution kept at 50 ° C. and a 600 g sodium citrate aqueous solution kept at 50 ° C. were simultaneously added dropwise to 1200 g of ion-exchanged water held at 50 ° C. over 5 minutes to prepare a silver citrate slurry. Prepared. The ion-exchanged water was continuously stirred while the silver nitrate aqueous solution and the sodium citrate aqueous solution were simultaneously added dropwise to the ion-exchanged water. The concentration of silver nitrate in the silver nitrate aqueous solution was 66% by mass, and the concentration of citric acid in the sodium citrate aqueous solution was 56% by mass. Next, a 300 g aqueous sodium formate solution kept at 50 ° C. was added dropwise to the silver citrate slurry held at 50 ° C. over 30 minutes to obtain a mixed slurry. The concentration of formic acid in this sodium formate aqueous solution was 58% by mass. Next, the mixed slurry was subjected to a predetermined heat treatment. Specifically, the mixed slurry was raised to a maximum temperature of 60 ° C. at a heating rate of 10 ° C./hour, held at 60 ° C. (maximum temperature) for 30 minutes, and then lowered to 20 ° C. over 60 minutes. .. As a result, a silver powder slurry was obtained. The silver powder slurry was placed in a centrifuge and rotated at a rotation speed of 1000 rpm for 10 minutes. As a result, the liquid layer in the silver powder slurry was removed to obtain a dehydrated and desalted silver powder slurry. The dehydrated and desalted silver powder slurry was dried by a freeze-drying method for 30 hours to obtain No. 4 silver powder having a volume-based particle size distribution shown in Table 3.
No.5の銀粉末は、銀微粒子（原料粉Ａ）と銀微粒子（原料粉Ｂ）との混合割合を、質量比で２：１としたこと以外は、上述したNo.1の銀粉末の調製方法と同様にして、得た。 The No. 5 silver powder is the same as the No. 1 silver powder described above, except that the mixing ratio of the silver fine particles (raw material powder A) and the silver fine particles (raw material powder B) is 2: 1 by mass ratio. Obtained in the same manner as the preparation method.
No.6の銀粉末は、銀微粒子（原料粉Ａ）と銀微粒子（原料粉Ｂ）との混合割合を、質量比で１：６としたこと以外は、上述したNo.1の銀粉末の調製方法と同様にして、得た。 The No. 6 silver powder is the same as the No. 1 silver powder described above, except that the mixing ratio of the silver fine particles (raw material powder A) and the silver fine particles (raw material powder B) is 1: 6 by mass ratio. Obtained in the same manner as the preparation method.
No.7の銀粉末は、銀微粒子（原料粉Ａ）と銀微粒子（原料粉Ｂ）との混合割合を、質量比で２：９としたこと以外は、上述したNo.1の銀粉末の調製方法と同様にして、得た。 The No. 7 silver powder is the same as the No. 1 silver powder described above, except that the mixing ratio of the silver fine particles (raw material powder A) and the silver fine particles (raw material powder B) is 2: 9 by mass ratio. Obtained in the same manner as the preparation method.
No.8の銀粉末は、銀微粒子（原料粉Ａ）と銀微粒子（原料粉Ｂ）とを混合することなく、銀微粒子（原料粉Ａ）のみを用いたこと以外は、上述したNo.1の銀粉末の調製方法と同様にして、得た。 The silver powder of No. 8 was No. 1 described above except that only the silver fine particles (raw material powder A) were used without mixing the silver fine particles (raw material powder A) and the silver fine particles (raw material powder B). It was obtained in the same manner as in the preparation method of the silver powder of.
No.9の銀粉末は、銀微粒子（原料粉Ａ）と銀微粒子（原料粉Ｂ）との混合割合を、質量比で４：３としたこと以外は、上述したNo.1の銀粉末の調製方法と同様にして、得た。 The No. 9 silver powder is the same as the No. 1 silver powder described above, except that the mixing ratio of the silver fine particles (raw material powder A) and the silver fine particles (raw material powder B) is 4: 3 in mass ratio. Obtained in the same manner as the preparation method.
No.10の銀粉末は、銀微粒子（原料粉Ａ）と銀微粒子（原料粉Ｂ）との混合割合を、質量比で１：９としたこと以外は、上述したNo.1の銀粉末の調製方法と同様にして、得た。 The No. 10 silver powder is the same as the No. 1 silver powder described above, except that the mixing ratio of the silver fine particles (raw material powder A) and the silver fine particles (raw material powder B) is 1: 9 by mass ratio. Obtained in the same manner as the preparation method.
なお、上記銀微粒子（原料粉Ａ）の製造方法は、以下の通りである。まず、硝酸銀とクエン酸と水酸化カリウムとを、硝酸銀中の銀イオンに対して等モル比（１：１：１）となるよう蒸留水中で混合して懸濁液を作製した。この懸濁液に、銀イオン１に対して２のモル比で酢酸ヒドラジンを加える。酢酸ヒドラジンを加えた懸濁液を４０℃の液温で反応させ、得られた反応液スラリーから洗浄、回収、乾燥することで銀微粒子（原料粉Ａ）が得られた。 The method for producing the silver fine particles (raw material powder A) is as follows. First, silver nitrate, citric acid, and potassium hydroxide were mixed in distilled water so as to have an equimolar ratio (1: 1: 1) with respect to silver ions in silver nitrate to prepare a suspension. Hydrazine acetate is added to this suspension in a molar ratio of 2 to 1 silver ion. The suspension to which hydrazine acetate was added was reacted at a liquid temperature of 40 ° C., and the obtained reaction liquid slurry was washed, recovered, and dried to obtain silver fine particles (raw material powder A).
また銀微粒子（原料粉Ｂ）は、硝酸銀水溶液とアンモニア水と蒸留水を混合し銀濃度が２２ｇ／Ｌである銀アンミン水溶液を調製し、この銀アンミン水溶液に、還元液を加え、生じた銀粒子スラリーを洗浄、回収、乾燥することで得られた。なお、還元液は、ヒドロキノン水溶液と水酸化ナトリウム水溶液との混合液であり、酸化還元電位がＡｇ／ＡｇＣｌ基準で−３８０ｍＶとなるように調製された液である。 For the silver fine particles (raw material powder B), a silver nitrate aqueous solution, ammonia water, and distilled water were mixed to prepare a silver ammine aqueous solution having a silver concentration of 22 g / L, and a reducing solution was added to the silver ammine aqueous solution to generate silver. It was obtained by washing, recovering, and drying the particle slurry. The reducing solution is a mixed solution of a hydroquinone aqueous solution and a sodium hydroxide aqueous solution, and is a solution prepared so that the redox potential is -380 mV based on Ag / AgCl.
＜銀粒子の粒度分布の測定方法＞
ＳＥＭを用いて、第１〜第３銀粒子が凝集した凝集体（二次粒子）５００個の画像を取得し、各銀粒子凝集体に含まれている銀粒子（一次粒子）の粒径を測定した。このときＳＥＭの装置倍率は１０００００倍とした。５００個の銀粒子凝集体のＳＥＭ画像から、銀粒子（一次粒子）の全体の輪郭が視認できる銀粒子を抽出した。次いで、画像処理ソフト（Ｉｍａｇｅ−Ｊ）を用いて、抽出した銀粒子の投影面積を測定し、得られた投影面積から円相当径を算出し、これを銀粒子の粒径とした。輪郭が視認できない箇所がある銀粒子については、円相当径を測定しなかった。得られた銀粒子の粒径を、体積基準の粒径に変換し、その体積基準の粒径の粒度分布を求めた。その結果を表３に示す。
<Measurement method of particle size distribution of silver particles>
Using SEM, 500 images of aggregates (secondary particles) in which the first to third silver particles are aggregated are acquired, and the particle size of the silver particles (primary particles) contained in each silver particle aggregate is determined. It was measured. At this time, the device magnification of the SEM was set to 100,000 times. From the SEM image of 500 silver particle aggregates, silver particles in which the entire outline of the silver particles (primary particles) can be visually recognized were extracted. Next, the projected area of the extracted silver particles was measured using image processing software (Image-J), and the equivalent circle diameter was calculated from the obtained projected area, which was used as the particle size of the silver particles. The diameter equivalent to the circle was not measured for silver particles whose contours could not be visually recognized. The particle size of the obtained silver particles was converted into a volume-based particle size, and the particle size distribution of the volume-based particle size was obtained. The results are shown in Table 3.
＜有機物の含有量の測定方法＞
No.1〜No.10の銀粉末中の有機物の含有量は次の方法で算出した。混合溶液と混合する前の銀粉末を量り取り、大気中にて１５０℃の温度で３０分間加熱した。加熱後、室温まで放冷し、銀粉末の質量を測定した。次の式（１）より、有機物の含有量を算出した。この結果、有機物の含有量は０．２質量％であった。
有機物の含有量（質量％）＝｛（Ａ−Ｂ）／Ａ｝×１００ ……（１）
但し、式（１）中のＡは加熱前の銀粉末の質量であり、Ｂは加熱後の銀粉末の質量である。得られた結果を表３に示す。
<Measuring method of organic matter content>
The content of organic matter in the silver powders No. 1 to No. 10 was calculated by the following method. The silver powder before mixing with the mixed solution was weighed and heated in the air at a temperature of 150 ° C. for 30 minutes. After heating, the mixture was allowed to cool to room temperature, and the mass of the silver powder was measured. The content of organic matter was calculated from the following formula (1). As a result, the content of organic matter was 0.2% by mass.
Organic matter content (mass%) = {(AB) / A} × 100 …… (1)
However, A in the formula (1) is the mass of the silver powder before heating, and B is the mass of the silver powder after heating. The results obtained are shown in Table 3.
次に、銀ペーストを調製する実施例１〜２８及び比較例１〜９について述べる。 Next, Examples 1 to 28 and Comparative Examples 1 to 9 for preparing a silver paste will be described.
＜実施例１＞
銀ペーストを１００質量％とするために、混合溶液１（２４．５０質量％）とNo.1の銀粉末（７５．００質量％）と添加剤としてのジエチレングリコール（Ｄ１）（０．５０質量％）を混合した後、プラネタリー遊星撹拌機にて撹拌し、更に３本ロールミルにて混練した。これにより銀ペーストを得た。この銀ペーストを実施例１とした。
<Example 1>
In order to make the silver paste 100% by mass, the mixed solution 1 (24.50% by mass), the No. 1 silver powder (75.00% by mass), and diethylene glycol (D1) (0.50% by mass) as an additive. ) Was mixed, then stirred with a planetary planetary stirrer, and further kneaded with a three-roll mill. This gave a silver paste. This silver paste was designated as Example 1.
＜実施例２〜２８及び比較例１〜９＞
実施例２〜２８及び比較例１〜９の３６種類の銀ペーストは、それぞれの混合溶液が、表１及び表２に示される脂肪酸銀、脂肪族アミン及び溶媒を用いて調製されるとともに、銀粉末と混合溶液と添加剤とを、表４及び表５に示すような割合でそれぞれ配合した。表４及び表５に示した銀粉末と混合溶液と添加剤との配合以外は、実施例１と同様にして、銀ペーストを調製した。しかし、比較例２と４は後述する理由でペーストにならなかった。実施例５と実施例６では、添加剤を２種類用いた。実施例１２、比較例１、比較例２、比較例５、比較例６及び比較例９では、添加剤を用いなかった。
<Examples 2 to 28 and Comparative Examples 1 to 9>
The 36 types of silver pastes of Examples 2 to 28 and Comparative Examples 1 to 9 are prepared by preparing their mixed solutions using the fatty acid silver, aliphatic amines and solvents shown in Tables 1 and 2, and silver. The powder, the mixed solution and the additive were blended in the ratios shown in Tables 4 and 5, respectively. A silver paste was prepared in the same manner as in Example 1 except for the blending of the silver powder, the mixed solution and the additive shown in Tables 4 and 5. However, Comparative Examples 2 and 4 did not become a paste for the reason described later. In Example 5 and Example 6, two kinds of additives were used. No additives were used in Example 12, Comparative Example 1, Comparative Example 2, Comparative Example 5, Comparative Example 6 and Comparative Example 9.
なお、実施例１〜２８及び比較例１〜９で用いた混合溶液は、表４及び表５中の混合溶液の種類の欄において、『混合溶液１〜１８』又は『混合溶液２０〜２２』のいずれかで示した。また、実施例１〜２８及び比較例１〜９では、表３に示す粒度分布の異なる１０種類（No.1〜No.10）の銀粉末のいずれかを配合している。実施例１〜２８及び比較例１〜９で用いた銀粉末を、表４及び表５中の銀粉末の種類の欄において、『No.1〜No.10』のいずれかで示した。また、表４及び表５中の添加剤の種類の欄において、『Ｄ１』はジエチレングリコールであり、『Ｄ２』はトリエチレングリコールであり、『Ｄ３』は平均分子量が１０００のポリエチレングリコールであり、『Ｄ４』は安息香酸であり、『Ｄ５』はエチレングリコールである。バインダ中の添加剤の含有割合（質量比）を表４及び表５に示す。 The mixed solutions used in Examples 1 to 28 and Comparative Examples 1 to 9 are "mixed solutions 1 to 18" or "mixed solutions 20 to 22" in the column of the type of mixed solution in Tables 4 and 5. Shown in one of. Further, in Examples 1 to 28 and Comparative Examples 1 to 9, any one of 10 types (No. 1 to No. 10) of silver powder having different particle size distributions shown in Table 3 is blended. The silver powder used in Examples 1 to 28 and Comparative Examples 1 to 9 is shown by any of "No. 1 to No. 10" in the column of the type of silver powder in Tables 4 and 5. Further, in the column of additive types in Tables 4 and 5, "D1" is diethylene glycol, "D2" is triethylene glycol, and "D3" is polyethylene glycol having an average molecular weight of 1000. "D4" is benzoic acid and "D5" is ethylene glycol. The content ratio (mass ratio) of the additive in the binder is shown in Tables 4 and 5.
＜比較試験２及び評価＞
〔交換電流密度〕
実施例１〜２８及び比較例１〜９の銀ペーストを作製する前のバインダの交換電流密度を次の方法により測定した。交換電流密度とは、電極反応が平衡状態にある際の電流密度をいう。電極反応が平衡状態にある場合、正の電流と負の電流の絶対値が等しくなる。この電流を交換電流といい、電極の単位面積当たりの交換電流を交換電流密度という。電気化学測定装置（ＢＡＳ社製、ＡＬＳ７００シリーズ）を用いて、バインダ中に作用極Ｃｕ、対極Ａｇを配置し、更に参照電極Ｐｔを配置した。具体的には、内径φ２０ｍｍのガラス容器にバインダ１０ｍＬ、露出面積０．００２５ｄｍ2の作用極Ｃｕを使用し、極間距離（作用極Ｃｕと対極Ａｇの距離）を１０ｍｍとなるように配置した。リニアスイープボルタメトリー法（ＬＳＶ（電位走査）法）により、開回路電位を基準にして、＋２５０ｍＶから−２５０ｍＶまで電極電位を変化させ、電流値を測定した。スキャンスピードは１００ｍＶ／秒であった。
ｉ ≒ (ｉ0Ｆη)／(ＲＴ)の式を用いて、低過電圧近似にて交換電流密度（ｉ0）を算出した。上記式中、Ｒは気体定数であり、Ｔは絶対温度（Ｋ）であり、ηは過電圧（Ｖ）である。
測定データの電流密度がゼロとなる電位を平衡電位とし、平衡電位から−１ｍＶから−１０ｍＶまで、１ｍＶ毎に合計１０点の電流値データを抽出した。抽出した１０点の電流値データを最小二乗法で近似し、その傾きを交換電流密度とした。実施例１〜２８及び比較例１〜９のバインダの交換電流密度を表４及び表５に示す。
<
[Exchange current density]
The exchange current density of the binder before preparing the silver pastes of Examples 1 to 28 and Comparative Examples 1 to 9 was measured by the following method. The exchange current density refers to the current density when the electrode reaction is in an equilibrium state. When the electrode reaction is in equilibrium, the absolute values of the positive and negative currents are equal. This current is called the exchange current, and the exchange current per unit area of the electrode is called the exchange current density. Using an electrochemical measuring device (ALS700 series manufactured by BAS), the working electrode Cu and the counter electrode Ag were arranged in the binder, and the reference electrode Pt was further arranged. Specifically, 10 mL of binder and a working electrode Cu having an exposed area of 0.0025 dm 2 were used in a glass container having an inner diameter of φ20 mm, and the distance between the electrodes (distance between the working electrode Cu and the counter electrode Ag) was 10 mm. By the linear sweep voltammetry method (LSV (potential scanning) method), the electrode potential was changed from +250 mV to −250 mV with reference to the open circuit potential, and the current value was measured. The scan speed was 100 mV / sec.
The exchange current density (i 0 ) was calculated by low overvoltage approximation using the equation i ≈ (i 0 Fη) / (RT). In the above equation, R is the gas constant, T is the absolute temperature (K), and η is the overvoltage (V).
The potential at which the current density of the measurement data becomes zero was defined as the equilibrium potential, and a total of 10 current value data were extracted for each 1 mV from the equilibrium potential to -1 mV to -10 mV. The extracted current value data of 10 points were approximated by the least squares method, and the slope was taken as the exchange current density. The exchange current densities of the binders of Examples 1 to 28 and Comparative Examples 1 to 9 are shown in Tables 4 and 5.
〔接合体の接合強度の測定方法〕
実施例１〜２８及び比較例１、３、５〜９の３５種類の銀ペーストを用いて接合体をそれぞれ作製した。比較例２と４では、ペーストにならなかったため、接合体の接合強度の測定は行わなかった。先ず、電子部品に模した表面に金めっきを施した１０ｍｍ角のＳｉウェーハ（厚さ：２００μｍ）を用意した。銅又は銅合金部材として、２０ｍｍ角の無酸素銅板（厚さ：１ｍｍ）を用意した。なお、この銅板の表面にはメタライズ層は形成されていない。次いで、無酸素銅板の表面に、銀ペーストを、メタルマスク法により塗布して銀ペースト層を形成した。次に、銀ペースト層上にＳｉウェーハを載せて、積層体を作製した。更に、この積層体を、酸素濃度が体積基準で１００ｐｐｍの窒素雰囲気下で２５０℃の温度に６０分間保持することにより加熱して、無酸素銅板にＳｉウェーハとを接合層を介して接合した。これらの接合体を実施例１〜２８及び比較例１、３、５〜９の接合体とした。なお、前記積層体は、その積層方向に加圧しなかった。これらの接合体の接合強度を次のように測定した。
[Measurement method of joint strength of joint body]
Bonds were prepared using 35 kinds of silver pastes of Examples 1 to 28 and Comparative Examples 1, 3 and 5 to 9, respectively. In Comparative Examples 2 and 4, since the paste was not formed, the bonding strength of the bonded body was not measured. First, a 10 mm square Si wafer (thickness: 200 μm) having a gold-plated surface imitating an electronic component was prepared. A 20 mm square oxygen-free copper plate (thickness: 1 mm) was prepared as a copper or copper alloy member. No metallized layer is formed on the surface of this copper plate. Next, a silver paste was applied to the surface of the oxygen-free copper plate by a metal mask method to form a silver paste layer. Next, a Si wafer was placed on the silver paste layer to prepare a laminate. Further, this laminate was heated by holding it at a temperature of 250 ° C. for 60 minutes in a nitrogen atmosphere having an oxygen concentration of 100 ppm on a volume basis, and a Si wafer was bonded to an oxygen-free copper plate via a bonding layer. These joints were used as the joints of Examples 1 to 28 and Comparative Examples 1, 3, 5 to 9. The laminated body was not pressurized in the laminating direction. The joint strength of these joints was measured as follows.
実施例１〜２８及び比較例１、３、５〜９の３５種類の接合体の接合強度は、せん断強度評価試験機（ＴＲＹ ＰＲＥＣＩＳＩＯＮ製：ＭＦＭ−１５００ＨＦ）を用いて測定した。具体的には、接合強度の測定は、接合体の無酸素銅板を水平に固定し、接合層の表面（上面）から５０μｍ上方の位置でシェアツールにより、接合体のＳｉウェーハを横から水平方向に押して、Ｓｉウェーハが破断されたときの強度を測定することによって行った。なお、シェアツールの移動速度は０．１ｍｍ／秒とした。１条件に付き３回強度試験を行い、それらの算術平均値を接合強度の測定値とした。 The joint strength of 35 types of joints of Examples 1 to 28 and Comparative Examples 1, 3 and 5 to 9 was measured using a shear strength evaluation tester (manufactured by TRY PRECISION: MFM-1500HF). Specifically, the joint strength is measured by fixing the oxygen-free copper plate of the joint horizontally and using a share tool at a position 50 μm above the surface (upper surface) of the joint layer to horizontally move the Si wafer of the joint from the side. This was done by measuring the strength of the Si wafer when it was broken. The moving speed of the share tool was 0.1 mm / sec. The strength test was performed three times under one condition, and the arithmetic mean value thereof was used as the measured value of the joint strength.
〔銀ペーストの安定性〕
実施例１〜２８及び比較例１、３、５〜９で得られた３５種類の銀ペーストを容器に入れて密封し、２５℃で２週間保管した。保管前と保管後の銀ペーストの各粘度をスパイラル式粘度計（マルコム製：ＰＣＶ−０２Ｖ）で測定した。測定条件は、２５℃、回転速度１０ｒｐｍとした。保管後の銀ペーストの粘度が、保管前の銀ペーストの粘度より、２５％以上増加したものは『可』と判定し、１０％以上２５％未満増加したものは『良』と判定し、１０％未満増加したものは『優』と判定した。その結果を表４及び表５に示す。
[Stability of silver paste]
The 35 kinds of silver pastes obtained in Examples 1 to 28 and Comparative Examples 1, 3 and 5 to 9 were placed in a container, sealed, and stored at 25 ° C. for 2 weeks. The viscosities of the silver paste before and after storage were measured with a spiral viscometer (Malcolm: PCV-02V). The measurement conditions were 25 ° C. and a rotation speed of 10 rpm. If the viscosity of the silver paste after storage is 25% or more higher than the viscosity of the silver paste before storage, it is judged as "OK", and if it is increased by 10% or more and less than 25%, it is judged as "Good". Those with an increase of less than% were judged to be "excellent". The results are shown in Tables 4 and 5.
表５から明らかなように、比較例１では、脂肪酸銀を添加しなかった混合溶液２０（１５．００質量％）を含む一方、添加剤を含まない銀ペーストを用いて接合体を作製したので、添加剤を含まないことにより、バインダの交換電流密度が１μＡ／ｄｍ2未満と極めて小さかった。加えて、混合溶液が脂肪酸銀を含まなかったため、接合体の接合強度は１０ＭＰａと小さかった。 As is clear from Table 5, in Comparative Example 1, a conjugate was prepared using a silver paste containing 20 (15.00% by mass) of a mixed solution to which no fatty acid silver was added, but not containing an additive. By not including the additive, the exchange current density of the binder was extremely small, less than 1 μA / dm 2. In addition, since the mixed solution did not contain silver fatty acid, the bonding strength of the bonded body was as small as 10 MPa.
また、比較例２では、脂肪族アミンを添加しなかった混合溶液２１（１５．００質量％）を含む一方、添加剤を含まない銀ペーストを用いて接合体を作製しようとしたが、混合溶液２１が脂肪族アミンを含まないことに起因して、銀ペーストにならなかったため、接合体を作製できなかった。 Further, in Comparative Example 2, a mixed solution 21 (15.00% by mass) containing no aliphatic amine was contained, while an attempt was made to prepare a conjugate using a silver paste containing no additive, but the mixed solution was used. Since 21 did not form a silver paste due to the absence of aliphatic amines, a conjugate could not be prepared.
また、比較例３では、脂肪酸銀を添加しなかった混合溶液２０（１４．００質量％）と、添加剤としてジエチレングリコール（Ｄ１）（１．００質量％）を含む銀ペーストを用いて接合体を作製したので、添加剤がバインダに対して質量比０．０６７であったけれども、混合溶液が脂肪酸銀を含まず、またバインダの交換電流密度が１μＡ／ｄｍ2未満と極めて小さかった。このため、ジエチレングリコール（添加剤）を用いても、接合体の接合強度は１０ＭＰａと小さかった。 Further, in Comparative Example 3, the conjugate was prepared by using a mixed solution 20 (14.00% by mass) to which silver fatty acid was not added and a silver paste containing diethylene glycol (D1) (1.00% by mass) as an additive. Since it was prepared, the additive had a mass ratio of 0.067 to the binder, but the mixed solution did not contain silver fatty acid, and the exchange current density of the binder was extremely small, less than 1 μA / dm 2. Therefore, even if diethylene glycol (additive) was used, the bonding strength of the bonded body was as small as 10 MPa.
また、比較例４では、脂肪族アミンを添加しなかった混合溶液２１（１４．００質量％）と、添加剤としてジエチレングリコール（Ｄ１）（１．００質量％）を含む銀ペーストを用いて接合体を作製しようとしたが、混合溶液２１が脂肪族アミンを含まないことに起因して、銀ペーストにならなかったため、接合体を作製できなかった。 Further, in Comparative Example 4, a conjugate was used using a mixed solution 21 (14.00% by mass) to which no aliphatic amine was added and a silver paste containing diethylene glycol (D1) (1.00% by mass) as an additive. However, because the mixed solution 21 did not contain an aliphatic amine, it did not become a silver paste, so that a conjugate could not be prepared.
また、比較例５では、脂肪酸銀及び脂肪族アミンを添加した混合溶液１（１５．００質量％）と、No.10の銀粉末（８５．００質量％）を含む一方、添加剤を含まない銀ペーストを用いて接合体を作製したので、添加剤を含まないことにより、バインダの交換電流密度が２０００μＡ／ｄｍ2と極めて大きかった。このため、接合体の接合強度は６ＭＰａと小さかった。 Further, in Comparative Example 5, the mixed solution 1 (15.00% by mass) to which the fatty acid silver and the aliphatic amine were added and the No. 10 silver powder (85.00% by mass) were contained, but no additive was contained. Since the conjugate was prepared using silver paste, the exchange current density of the binder was extremely large at 2000 μA / dm 2 because no additive was included. Therefore, the bonding strength of the bonded body was as small as 6 MPa.
また、比較例６では、脂肪酸銀及び脂肪族アミンを添加した混合溶液７（１５．００質量％）を含む一方、添加剤を含まない銀ペーストを用いて接合体を作製したので、添加剤を含まないことにより、バインダの交換電流密度が３０００μＡ／ｄｍ2と極めて大きかった。このため、接合体の接合強度は７ＭＰａと小さかった。 Further, in Comparative Example 6, a conjugate was prepared using a silver paste containing 15.00% by mass of a mixed solution 7 (15.00% by mass) containing silver fatty acid and an aliphatic amine, while the silver paste containing no additive was used. By not including it, the exchange current density of the binder was extremely large at 3000 μA / dm 2. Therefore, the bonding strength of the bonded body was as small as 7 MPa.
また、比較例７では、脂肪酸銀及び脂肪族アミンを添加した混合溶液７（１４．００質量％）を含む一方、添加剤としてエチレングリコール（Ｄ５）（１．００質量％）を含む銀ペーストを用いて接合体を作製したので、添加剤がエチレングリコールであったため、バインダの交換電流密度が３０００μＡ／ｄｍ2と極めて大きかった。このため、接合体の接合強度は９ＭＰａと小さかった。 Further, in Comparative Example 7, a silver paste containing ethylene glycol (D5) (1.00% by mass) as an additive while containing a mixed solution 7 (14.00% by mass) to which silver fatty acid and an aliphatic amine were added was used. Since the conjugate was prepared using ethylene glycol, the exchange current density of the binder was extremely large at 3000 μA / dm 2. Therefore, the bonding strength of the bonded body was as small as 9 MPa.
また、比較例８では、脂肪酸銀及び脂肪族アミンを添加した混合溶液１（５．００質量％）と、添加剤としてジエチレングリコール（Ｄ１）（１０．００質量％）を含む銀ペーストを用いて接合体を作製したので、添加剤としてのジエチレングリコールの含有割合（０．６６７）が大きすぎたため、バインダの交換電流密度が５μＡ／ｄｍ2と極めて小さかった。このため、接合体の接合強度は９ＭＰａと小さかった。 Further, in Comparative Example 8, bonding was performed using a mixed solution 1 (5.00% by mass) to which silver fatty acid and an aliphatic amine were added, and a silver paste containing diethylene glycol (D1) (10.00% by mass) as an additive. Since the body was prepared, the content ratio of diethylene glycol as an additive (0.667) was too large, so that the exchange current density of the binder was extremely small at 5 μA / dm 2. Therefore, the bonding strength of the bonded body was as small as 9 MPa.
また、比較例９では、脂肪酸銀及び脂肪族アミンを添加した混合溶液２２（１５．００質量％）を含む一方、添加剤を含まない銀ペーストを調製したので、混合溶液２２の溶媒は、ポリエチレングリコール（Ｃ７）であった。この銀ペーストを用いて接合体を作製した場合、添加剤を含まないこと、及び溶媒にポリエチレングリコール（Ｃ７）を用いたことにより、バインダの交換電流密度が８μＡ／ｄｍ2と極めて小さかった。そのため、接合体の接合強度は１０ＭＰａと小さかった。 Further, in Comparative Example 9, a silver paste containing the mixed solution 22 (15.00% by mass) to which the fatty acid silver and the aliphatic amine was added was prepared, while the silver paste containing no additive was prepared. Therefore, the solvent of the mixed solution 22 was polyethylene. It was glycol (C7). When a conjugate was prepared using this silver paste, the exchange current density of the binder was extremely small, 8 μA / dm 2, due to the absence of additives and the use of polyethylene glycol (C7) as the solvent. Therefore, the bonding strength of the bonded body was as small as 10 MPa.
これらの比較例１、３、５〜９に対して、実施例１〜１１、１３〜２８では、本発明の第１の観点に規定する交換電流密度範囲にあるバインダを用い、かつ脂肪酸銀と脂肪族アミンと溶媒を含むか、脂肪酸銀と脂肪族アミンを含んだ混合溶液１〜１８と、粒径が１００ｎｍ以上５００ｎｍ未満である第１銀粒子を５５体積％以上９５体積％以下の範囲で含み、粒径が５０ｎｍ以上１００ｎｍ未満である第２銀粒子を５体積％以上４０体積％以下の範囲で含み、粒径が５０ｎｍ未満である第３銀粒子を５体積％以下の範囲で含む『No.1〜No.6の銀粉末』又は粒径が１００ｎｍ以上５００ｎｍ未満の第１銀粒子を１００体積％含む『No.10の銀粉末』と、本発明の第２又は第３の観点に規定する添加剤とを混練して調製して銀ペーストを用いて接合体を作製した。
また実施例１２では、添加剤を用いる代わりに、酢酸銀、ドデシルアミン、ブチルカルビトールアセテートを含む混合溶液９を用いた。このため、実施例１〜２８では、接合体の接合強度は１５ＭＰａから３０ＭＰａまでの範囲と大きくなり、接合強度の高い接合体が得られることが分かった。
また、銀ペーストの安定性も『可』、『良』及び『優』であった。特に添加剤として、ジエチレングリコール（Ｄ１）及びトリエチレングリコール（Ｄ２）を用いた銀ペーストの安定性は『優』であり、安定性が高かった。これは銀アミン錯体を安定化させる効果であると推察される。
In contrast to Comparative Examples 1, 3, 5 to 9, in Examples 1 to 11 and 13 to 28, a binder in the exchange current density range specified in the first aspect of the present invention was used, and the binder was used with the fatty acid silver. Mixing solutions 1 to 18 containing an aliphatic amine and a solvent or containing silver fatty acid and an aliphatic amine and first silver particles having a particle size of 100 nm or more and less than 500 nm in a range of 55% by volume or more and 95% by volume or less. The second silver particles having a particle size of 50 nm or more and less than 100 nm are contained in the range of 5% by volume or more and 40% by volume or less, and the third silver particles having a particle size of less than 50 nm are contained in the range of 5% by volume or less. "No. 1 to No. 6 silver powder" or "No. 10 silver powder" containing 100% by volume of first silver particles having a particle size of 100 nm or more and less than 500 nm, and the second or third viewpoint of the present invention. A bonded body was prepared by kneading with the specified additives and using a silver paste.
Further, in Example 12, instead of using an additive, a mixed solution 9 containing silver acetate, dodecylamine, and butyl carbitol acetate was used. Therefore, in Examples 1 to 28, it was found that the bonding strength of the bonded body was as large as the range of 15 MPa to 30 MPa, and a bonded body having high bonding strength could be obtained.
The stability of the silver paste was also "OK", "Good" and "Excellent". In particular, the stability of the silver paste using diethylene glycol (D1) and triethylene glycol (D2) as additives was "excellent", and the stability was high. This is presumed to be the effect of stabilizing the silver amine complex.
本発明の銀ペーストは、高出力ＬＥＤ素子やパワー半導体素子等の半導体素子、半導体パッケージのような電子部品をＤＢＣ基板（銅張り基板）やリードフレーム等の基板である銅又は銅合金部材に接合する接合層等に利用することができる。 The silver paste of the present invention joins semiconductor elements such as high-power LED elements and power semiconductor elements, and electronic components such as semiconductor packages to copper or copper alloy members which are substrates such as DBC substrates (copper-clad substrates) and lead frames. It can be used as a bonding layer or the like.
１，１１ 銅又は銅合金部材
１ａ，１１ａ 銅又は銅合金部材の表面
２，１２ 銀粉末
３，１３ 銀ペースト層
４，１４ バインダ
１５ 銀めっき疑似膜
1,11 Copper or copper alloy member 1a, 11a Surface of copper or
Claims (6)
前記バインダは少なくとも脂肪酸銀と脂肪族アミンとを含み、前記バインダの交換電流密度が１０μＡ／ｄｍ2以上１０００μＡ／ｄｍ2以下の範囲内にあることを特徴とする銀ペースト。 In a silver paste containing silver powder and a binder,
The binder and at least fatty acid silver and an aliphatic amine, exchange current density of the binder is 10 .mu.A / dm 2 or more 1000μA / dm 2 or less of silver paste, characterized in that in the range.
前記混合物を加熱して撹拌した後に冷却して混合溶液を得る工程と、
前記混合溶液と添加剤とにより構成されるバインダと銀粉末とを混練して銀ペーストを得る工程とを含み、
前記添加剤は、ジエチレングリコール、トリエチレングリコール、ポリエチレングリコール又は安息香酸のいずれか１種又は２種以上を含み、
前記バインダ中の前記添加剤の含有割合が質量比（添加剤／バインダ）で０．００３以上０．３３３以下の範囲内にあることを特徴とする銀ペーストの製造方法。 A step of mixing fatty acid silver and an aliphatic amine, or mixing a solvent excluding fatty acid silver, an aliphatic amine and a glycol-based solvent to obtain a mixture, and
A step of heating the mixture, stirring it, and then cooling it to obtain a mixed solution.
Look including the step of obtaining a silver paste by kneading a binder and silver powder composed of said mixed solution and added pressure agent,
The additive contains any one or more of diethylene glycol, triethylene glycol, polyethylene glycol and benzoic acid.
A method for producing a silver paste, wherein the content ratio of the additive in the binder is in the range of 0.003 or more and 0.333 or less in terms of mass ratio (additive / binder).
前記銀ペースト層上に電子部品を積層して積層体を作製する工程と、
前記積層体を、酸素濃度が体積基準で１０００ｐｐｍ以下の窒素雰囲気下で、加熱することにより前記銀ペースト層中の銀粉末を焼結させて接合層を形成させ、前記銅又は銅合金部材と前記電子部品とが接合層を介して接合された接合体を作製する工程と
を含む接合体の製造方法。 A step of directly applying the silver paste according to any one of claims 1 to 4 to the surface of a copper or copper alloy member to form a silver paste layer.
A step of laminating electronic components on the silver paste layer to prepare a laminate, and
By heating the laminate in a nitrogen atmosphere having an oxygen concentration of 1000 ppm or less on a volume basis, the silver powder in the silver paste layer is sintered to form a bonding layer, and the copper or copper alloy member and the copper or copper alloy member are formed. A method for manufacturing a bonded body, which includes a step of producing a bonded body in which electronic parts are bonded via a bonding layer.
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