JP6931390B2 - 表示装置、及びこのような装置を製造するための方法 - Google Patents
表示装置、及びこのような装置を製造するための方法 Download PDFInfo
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- 229910002601 GaN Inorganic materials 0.000 claims description 30
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 23
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- 238000012856 packing Methods 0.000 description 1
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- 239000010937 tungsten Substances 0.000 description 1
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Description
a) 前記表示装置の前記第1の画素及び第2の画素毎に金属接続パッドを第1の表面に有する一体化型の制御回路を形成する工程、
b) 前記第1の画素毎に、前記第1の画素の金属接続パッドに接する第1の電極と、前記制御回路と反対側の前記第1の電極の表面を覆う少なくとも1つの半導体層とを有する窒化ガリウム発光ダイオードの活性積層体を前記制御回路の第1の表面に載置する工程、
c) 前記窒化ガリウム発光ダイオードの活性積層体を横方向に分離する空間を絶縁性充填材料で充填する工程、及び
d) 前記第1の画素毎に前記第1の電極と反対側の前記半導体層の表面を覆う第2の電極を、前記第2の画素毎に前記絶縁性充填材料を覆って前記第2の画素の金属接続パッドに接続された第1の電極を同一の導電レベルに形成する工程
を順次的に有することを特徴とする方法を提供する。
Claims (12)
- モノリシック型の表示装置であって、
窒化ガリウム発光ダイオードを夫々有して第1の波長領域で光を発することができる複数の第1の画素(B) 、及び有機発光ダイオードを夫々有して第2の波長領域で光を発することができる複数の第2の画素(R, G)と、
前記第1の画素(B) 及び第2の画素(R, G)毎に金属接続パッド(113) を第1の表面の側に有する一体化型の制御回路(110) と
を備えており、
前記第1の画素(B) の発光ダイオード及び前記第2の画素(R, G)の発光ダイオードは、前記制御回路(110) の第1の表面の側に配置されており、前記第1の画素及び第2の画素毎に設けられた前記金属接続パッド(113) に接続された第1の電極(121, 133)を夫々有しており、
前記第1の画素(B) 及び前記第2の画素(R, G)の各々の発光ダイオードは、前記制御回路(110) と反対側の前記第1の電極(121, 133)の表面を覆う少なくとも1つの半導体層(123, 125, 127, 139; 339R, 339G)と、前記第1の電極と反対側の前記少なくとも1つの半導体層の表面を覆う第2の電極(131, 141)とを有しており、前記第1の画素(B) の第2の電極(131) 及び前記第2の画素(R, G)の第1の電極(133) は前記表示装置の同一の導電レベル(M) に配置されていることを特徴とする表示装置。 - 前記第1の画素(B) の発光ダイオードの第2の電極(131) 及び前記第2の画素(R, G)の発光ダイオードの第2の電極(141) は相互に接続されていることを特徴とする請求項1に記載の表示装置。
- 前記第2の画素(R, G)の前記少なくとも1つの半導体層(139) は、前記表示装置の全ての前記第2の画素(R, G)に共通の連続した層であり、前記表示装置の実質的に表面全体に亘って延びていることを特徴とする請求項1又は2に記載の表示装置。
- 各第1の画素(B) の第2の電極(131) は、前記第2の画素(R, G)の前記少なくとも1つの半導体層(139) から局所的な絶縁層(137) によって絶縁されていることを特徴とする請求項3に記載の表示装置。
- 前記第2の画素(R, G)の前記少なくとも1つの半導体層(339R, 339G)は、前記第2の画素の発光ダイオードのレベルのみに配置された連続していない層であることを特徴とする請求項1又は2に記載の表示装置。
- 第1の波長領域で光を発することができる複数の第1の画素(B) と、第2の波長領域で光を発することができる複数の第2の画素(R, G)とを備えたモノリシック型の表示装置を製造する方法であって、
a) 前記表示装置の前記第1の画素(B) 及び第2の画素(R, G)毎に金属接続パッド(113) を第1の表面に有する一体化型の制御回路(110) を形成する工程、
b) 前記第1の画素(B) 毎に、前記第1の画素の金属接続パッド(113) に接する第1の電極(121) と、前記制御回路(110) と反対側の前記第1の電極の表面を覆う少なくとも1つの半導体層(123, 125, 127) とを有する窒化ガリウム発光ダイオードの活性積層体を前記制御回路(110) の第1の表面に載置する工程、
c) 前記窒化ガリウム発光ダイオードの活性積層体を横方向に分離する空間を絶縁性充填材料(129) で充填する工程、及び
d) 前記第1の画素(B) 毎に前記第1の電極と反対側の前記少なくとも1つの半導体層(123; 125; 127) の表面を覆う第2の電極(131) を、前記第2の画素毎に前記絶縁性充填材料(129) を覆って前記第2の画素の金属接続パッド(113) に接続された第1の電極(133) を同一の導電レベル(M) に形成する工程
を順次的に有することを特徴とする方法。 - e) 工程d)の後に前記第2の画素(R; G)毎に、前記制御回路(110) と反対側の前記第2の画素の第1の電極(133) の表面を覆う少なくとも1つの有機半導体層(139; 339R, 339G) を成膜する工程を更に有することを特徴とする請求項6に記載の方法。
- 前記少なくとも1つの有機半導体層(139) は、前記表示装置の全ての前記第2の画素(R, G)に共通の連続した層であり、前記表示装置の実質的に表面全体に亘って延びていることを特徴とする請求項7に記載の方法。
- 工程d)と工程e)との間に、前記第1の画素(B) の第2の電極(131) を前記少なくとも1つの有機半導体層(139) から絶縁する局所的な絶縁層(137) を形成する工程を更に有することを特徴とする請求項8に記載の方法。
- 前記少なくとも1つの有機半導体層(339R, 339G)は、前記第2の画素(R, G)の発光ダイオードのレベルのみに配置された連続していない層であることを特徴とする請求項7に記載の方法。
- 工程e)の後に前記第2の画素毎に、前記第2の画素の第1の電極(133) と反対側の前記少なくとも1つの有機半導体層(139; 339R, 339G) の表面を覆う第2の電極(141) を成膜する工程を更に有することを特徴とする請求項7〜10のいずれか1つに記載の方法。
- 前記第2の画素(R, G)の第2の電極(141) は、前記表示装置の実質的に表面全体に亘って延びている連続した層を形成することを特徴とする請求項11に記載の方法。
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PCT/FR2017/052824 WO2018073515A1 (fr) | 2016-10-21 | 2017-10-13 | Dispositif d'affichage et procede de fabrication d'un tel dispositif |
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CN109148545B (zh) * | 2018-08-31 | 2021-03-30 | 上海天马微电子有限公司 | 一种显示面板和显示装置 |
KR20200082602A (ko) * | 2018-12-31 | 2020-07-08 | 엘지디스플레이 주식회사 | 유기 발광 패널 및 무기 발광 다이오드를 포함하는 조명장치 |
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WO2024043005A1 (ja) * | 2022-08-22 | 2024-02-29 | 国立大学法人東京大学 | 有機半導体素子、歪みゲージ、測定装置及び有機半導体素子の製造方法 |
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TW201703248A (zh) * | 2015-07-06 | 2017-01-16 | 友達光電股份有限公司 | 畫素結構及其製造方法 |
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FR3057995A1 (fr) | 2018-04-27 |
FR3057995B1 (fr) | 2019-03-29 |
EP3529834A1 (fr) | 2019-08-28 |
KR20190070928A (ko) | 2019-06-21 |
CN109844947A (zh) | 2019-06-04 |
CN109844947B (zh) | 2023-06-09 |
US10804326B2 (en) | 2020-10-13 |
US20190280048A1 (en) | 2019-09-12 |
WO2018073515A1 (fr) | 2018-04-26 |
KR102453674B1 (ko) | 2022-10-11 |
JP2019534473A (ja) | 2019-11-28 |
EP3529834B1 (fr) | 2020-09-16 |
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