JP6907280B2 - Decompression drying device - Google Patents

Decompression drying device Download PDF

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JP6907280B2
JP6907280B2 JP2019166447A JP2019166447A JP6907280B2 JP 6907280 B2 JP6907280 B2 JP 6907280B2 JP 2019166447 A JP2019166447 A JP 2019166447A JP 2019166447 A JP2019166447 A JP 2019166447A JP 6907280 B2 JP6907280 B2 JP 6907280B2
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liquid
substrate
peripheral portion
vacuum drying
chamber
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JP2021042919A (en
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慎也 福井
慎也 福井
雅樹 横山
雅樹 横山
寿夫 神戸
寿夫 神戸
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Chugai Ro Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0406—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
    • B05D3/0413—Heating with air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0486—Operating the coating or treatment in a controlled atmosphere

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  • Drying Of Solid Materials (AREA)
  • Coating Apparatus (AREA)

Description

この発明は、減圧乾燥装置に関する。 The present invention relates to a vacuum drying device.

基板上に形成された塗工膜の膜周縁部では、膜周縁部よりも内側に位置する膜内周部に比べて膜厚が大きくなる現象（いわゆる、エッジビード：edge-bead）が知られている。半導体デバイスの分野では、エッジビードが発生すると、基板内でチップとして利用可能な有効面積が縮小し、歩留りが低下する。表示ディスプレイの分野では、エッジビードの存在は、画像品位に直接的な影響を及ぼす。したがって、膜厚均一性の高い塗工膜を基板上に形成するための様々な取り組みがなされている。 It is known that the film thickness of the coating film peripheral portion formed on the substrate is larger than that of the inner peripheral portion of the film located inside the membrane peripheral portion (so-called edge-bead). There is. In the field of semiconductor devices, when edge beads occur, the effective area that can be used as a chip in the substrate is reduced, and the yield is lowered. In the field of display displays, the presence of edge beads has a direct effect on image quality. Therefore, various efforts have been made to form a coating film having a high film thickness uniformity on the substrate.

特許文献１は、液送ポンプからの塗工液の吐出とダイヘッドおよび基板の間の相対移動とのタイミングを制御する塗工装置を開示する。特許文献２は、塗布領域の周縁部に対してライン状の塗工膜をあらかじめ形成しておき、ライン状の塗工膜によって面状の塗工膜の広がりを規制する塗工装置を開示する。 Patent Document 1 discloses a coating device that controls the timing of discharge of a coating liquid from a liquid feed pump and relative movement between a die head and a substrate. Patent Document 2 discloses a coating apparatus in which a line-shaped coating film is formed in advance on the peripheral edge of a coating region, and the spread of the planar coating film is regulated by the line-shaped coating film. ..

特開２００１−１３７７６４号公報Japanese Unexamined Patent Publication No. 2001-137964 特開２００７−００７６３９号公報JP-A-2007-007639

特許文献１では、塗工液の特性（材質や粘度）、所望とする塗工膜の厚みが変わると、その都度、制御を調整する必要があるという問題がある。特許文献２では、ライン状の塗工膜を形成する工程と、面状の塗工膜を形成する工程という２つの膜形成工程が必要になるので、生産時間が長くなるという問題がある。特許文献１および特許文献２のいずれもが、塗工液膜を基板上に塗工することに関し、塗工後に行われる減圧乾燥に関するものではない。 Patent Document 1 has a problem that it is necessary to adjust the control each time the characteristics (material and viscosity) of the coating liquid and the desired thickness of the coating film change. Patent Document 2 requires two film forming steps, a step of forming a line-shaped coating film and a step of forming a planar coating film, so that there is a problem that the production time becomes long. Neither Patent Document 1 nor Patent Document 2 relates to coating a coating liquid film on a substrate, and does not relate to vacuum drying performed after coating.

基板に塗工される塗工液膜は、揮発性の溶媒を多量に含み、その後の減圧乾燥によって揮発性の溶媒が気化して抜けていくので、減圧乾燥における揮発性の溶媒の気化が、それ以降の形状を画定する上で多大な影響を及ぼす。それにもかかわらず、従来、減圧乾燥について十分な検討がなされていなかった。 The coating liquid film coated on the substrate contains a large amount of volatile solvent, and the volatile solvent is vaporized and released by the subsequent vacuum drying. It has a great influence on defining the shape after that. Nevertheless, conventionally, sufficient studies have not been made on vacuum drying.

そこで、この発明の課題は、膜厚均一性の高い塗工膜を基板上に形成できる減圧乾燥装置を提供することである。 Therefore, an object of the present invention is to provide a vacuum drying apparatus capable of forming a coating film having a high film thickness uniformity on a substrate.

上記課題を解決するため、この発明の一態様に係る減圧乾燥装置は、
溶媒を含む塗工液膜が塗工された基板を収容するチャンバと、
前記チャンバの内部を減圧排気する減圧排気部と、
前記塗工液膜からの前記溶媒の気化を促進する気化促進部とを備える減圧乾燥装置であって、
前記気化促進部を、前記基板に塗工された前記塗工液膜の液周縁部の周辺に配設することを特徴とする。 In order to solve the above problems, the vacuum drying device according to one aspect of the present invention is
A chamber containing a substrate coated with a coating liquid film containing a solvent, and
A decompression exhaust unit that decompresses and exhausts the inside of the chamber,
A vacuum drying device including a vaporization promoting unit that promotes vaporization of the solvent from the coating liquid film.
The vaporization promoting portion is arranged around the liquid peripheral portion of the coating liquid film coated on the substrate.

この発明によれば、液周縁部の周辺に配設される気化促進部により、液周縁部が保形性を有するともに、それ以外の部分が液周縁部に向けて流動することによって、液周縁部においてレベリングが行われるので、膜厚均一性の高い塗工膜を基板上に形成できる。 According to the present invention, the vaporization promoting portion arranged around the liquid peripheral portion has a shape-retaining property in the liquid peripheral portion, and the other portion flows toward the liquid peripheral portion, whereby the liquid peripheral portion is formed. Since leveling is performed in the portion, a coating film having high film thickness uniformity can be formed on the substrate.

一実施形態に係る減圧乾燥装置を含む塗工乾燥装置の模式図である。It is a schematic diagram of the coating drying apparatus including the vacuum drying apparatus which concerns on one Embodiment. 塗工液膜が塗工された基板の断面図である。It is sectional drawing of the substrate coated with the coating liquid film. 接触加熱部の斜視図である。It is a perspective view of the contact heating part. 開放状態にある減圧乾燥装置を説明する断面図である。It is sectional drawing explaining the vacuum drying apparatus in an open state. 減圧乾燥状態にある減圧乾燥装置を説明する断面図である。It is sectional drawing explaining the vacuum drying apparatus in the vacuum drying state. 図５に示した減圧乾燥装置に配設された基板を上方から見た模式図である。FIG. 5 is a schematic view of a substrate arranged in the vacuum drying apparatus shown in FIG. 5 as viewed from above. 取出可能状態にある減圧乾燥装置を説明する断面図である。It is sectional drawing explaining the vacuum drying apparatus in a state which can be taken out. 変形例に係る減圧乾燥装置を説明する断面図である。It is sectional drawing explaining the vacuum drying apparatus which concerns on a modification.

以下、図面を参照しながら、この発明に係る減圧乾燥装置３の実施の形態を説明する。 Hereinafter, embodiments of the vacuum drying device 3 according to the present invention will be described with reference to the drawings.

〔実施形態〕
図１を参照しながら、一実施形態に係る減圧乾燥装置３を含む塗工乾燥装置１を説明する。図１は、一実施形態に係る減圧乾燥装置３を含む塗工乾燥装置１の模式図である。 [Embodiment]
The coating drying apparatus 1 including the vacuum drying apparatus 3 according to the embodiment will be described with reference to FIG. FIG. 1 is a schematic view of a coating drying apparatus 1 including a vacuum drying apparatus 3 according to an embodiment.

図１に示すように、塗工乾燥装置１は、塗工装置２、減圧乾燥装置３、硬化装置４および搬送ロボット５を備えている。 As shown in FIG. 1, the coating drying device 1 includes a coating device 2, a vacuum drying device 3, a curing device 4, and a transfer robot 5.

塗工装置２では、図２のように、溶質および揮発性の溶媒を含む塗工液が、基板７の上面に塗工されて、塗工液膜８が塗工される。基板７上に塗工された塗工液膜８は、塗工液膜８の周縁部に位置する液周縁部４９と、液周縁部４９の近傍であって液周縁部４９よりも内側に位置する液内周部４８とを有する。塗工液膜８が平面視で矩形形状をしている場合、液周縁部４９は、矩形の４つの辺に対応した矩形形状をしている。基板７は、基板７を挟んで液周縁部４９の反対側において、液周縁部４９に対応する下面側周縁部３９を有する。 In the coating apparatus 2, as shown in FIG. 2, a coating liquid containing a solute and a volatile solvent is applied to the upper surface of the substrate 7 to coat the coating liquid film 8. The coating liquid film 8 coated on the substrate 7 is located near the liquid peripheral portion 49 located at the peripheral portion of the coating liquid film 8 and the liquid peripheral portion 49 and inside the liquid peripheral portion 49. It has a liquid inner peripheral portion 48 to be formed. When the coating liquid film 8 has a rectangular shape in a plan view, the liquid peripheral portion 49 has a rectangular shape corresponding to the four sides of the rectangle. The substrate 7 has a lower surface side peripheral portion 39 corresponding to the liquid peripheral portion 49 on the opposite side of the liquid peripheral portion 49 with the substrate 7 interposed therebetween.

塗工装置２は、例えば、塗工液を吐出口から吐出するスリット状のノズルを基板７に対して相対的に走査して塗工液膜８を塗工する、いわゆるスリットコーターである。当該構成によれば、フラットパネルディスプレイや半導体の製造に用いられる大型の基板７に対して、フォトレジスト液などからなる塗工液膜８を均一に塗工できる。もちろん、例えばスピンコートのような他方式の塗工装置を用いることができる。なお、所望厚みの塗工膜を形成するには、揮発性の溶媒の気化を考慮して、塗工膜よりも厚みの厚い塗工液膜８が形成される。 The coating device 2 is, for example, a so-called slit coater that coats the coating liquid film 8 by scanning a slit-shaped nozzle that discharges the coating liquid from the discharge port relative to the substrate 7. According to this configuration, a coating liquid film 8 made of a photoresist liquid or the like can be uniformly coated on a large substrate 7 used for manufacturing a flat panel display or a semiconductor. Of course, other types of coating equipment such as spin coating can be used. In order to form a coating film having a desired thickness, a coating liquid film 8 having a thickness thicker than that of the coating film is formed in consideration of vaporization of a volatile solvent.

塗工液膜８が塗工された基板７は、搬送ロボット５によって塗工装置２から減圧乾燥装置３に搬送される。減圧乾燥装置３では、塗工液膜８に含まれる揮発性の溶媒を気化させる（すなわち、塗工液膜８を乾燥させる）ことにより、厚みが薄くなった塗工液膜８が形成される。なお、減圧乾燥装置３の構成および動作の詳細については、後述する。 The substrate 7 coated with the coating liquid film 8 is transferred from the coating device 2 to the vacuum drying device 3 by the transfer robot 5. In the vacuum drying apparatus 3, the coating liquid film 8 having a reduced thickness is formed by vaporizing the volatile solvent contained in the coating liquid film 8 (that is, drying the coating liquid film 8). .. The details of the configuration and operation of the vacuum drying device 3 will be described later.

厚みが薄くなった塗工液膜８が形成された基板７は、搬送ロボット５により減圧乾燥装置３から硬化装置４に搬送される。硬化装置４は、熱や紫外線などを用いて、乾燥された塗工液膜８を硬化させることにより、塗工膜を形成する。硬化装置４は、基板７を一枚ごと加熱する枚葉式の加熱であってもよいし、複数の基板７を一括して加熱するバッチ式や連続式の加熱であってもよい。 The substrate 7 on which the coating liquid film 8 having a reduced thickness is formed is conveyed from the vacuum drying device 3 to the curing device 4 by the transfer robot 5. The curing device 4 forms a coating film by curing the dried coating liquid film 8 using heat, ultraviolet rays, or the like. The curing device 4 may be a single-wafer type heating in which the substrates 7 are heated one by one, or a batch type or a continuous type heating in which a plurality of substrates 7 are collectively heated.

次に、図３から図７を参照しながら、減圧乾燥装置３の構成および動作について説明する。 Next, the configuration and operation of the vacuum drying device 3 will be described with reference to FIGS. 3 to 7.

図４に示すように、減圧乾燥装置３は、チャンバ６と、ピン昇降部１７と、下加熱部１２と、上加熱部２２と、接触加熱部３０と、減圧排気部２０と、復圧部１９と、制御部（図示せず）とを備える。 As shown in FIG. 4, the decompression drying device 3 includes a chamber 6, a pin elevating unit 17, a lower heating unit 12, an upper heating unit 22, a contact heating unit 30, a decompression exhaust unit 20, and a pressure reducing unit. 19 and a control unit (not shown).

チャンバ６は、基板７を収容して、基板７に対して減圧乾燥処理（＝減圧処理＋加熱処理）を行うための内部空間１０を有する耐圧容器である。チャンバ６は、互いに離間可能なベース１１と蓋２１とから構成されている。ベース１１は、図示しない装置フレーム上に設置されている。 The chamber 6 is a pressure-resistant container that accommodates the substrate 7 and has an internal space 10 for performing a vacuum drying treatment (= vacuum treatment + heat treatment) on the substrate 7. The chamber 6 is composed of a base 11 and a lid 21 that can be separated from each other. The base 11 is installed on a device frame (not shown).

蓋２１には、蓋２１を上下に駆動する蓋昇降機構２７が接続されている。これにより、図示しない制御部からの昇降指令に応じて蓋昇降機構２７が動作することで、ベース１１に対して蓋２１が上下に移動する。図５のように蓋２１を下降させたときには、ベース１１と蓋２１とが当接して一体となり、その内部に内部空間１０（基板７の処理空間）が形成される。ベース１１の上面の周縁部には、Ｏリング溝１１ｂが設けられている。Ｏリング溝１１ｂには、シリコンゴムなどの弾性体で構成されたＯリング１１ａが取り付けられている。蓋２１の下降時には、ベース１１の上面と蓋２１の下面との間に介在されるＯリング１１ａにより、チャンバ６の内部空間１０が気密状態となる。一方、図７のように蓋２１の上昇時には、チャンバ６が開放され、チャンバ６の内部空間１０に対して基板７の出し入れが可能になる。基板７がピン昇降部１７によって持ち上げられる。持ち上げられた基板７は、搬送ロボット５によって減圧乾燥装置３から硬化装置４に搬送される。 A lid elevating mechanism 27 that drives the lid 21 up and down is connected to the lid 21. As a result, the lid elevating mechanism 27 operates in response to an elevating command from a control unit (not shown), so that the lid 21 moves up and down with respect to the base 11. When the lid 21 is lowered as shown in FIG. 5, the base 11 and the lid 21 are brought into contact with each other and integrated, and an internal space 10 (processing space of the substrate 7) is formed inside the base 11 and the lid 21. An O-ring groove 11b is provided on the peripheral edge of the upper surface of the base 11. An O-ring 11a made of an elastic body such as silicon rubber is attached to the O-ring groove 11b. When the lid 21 is lowered, the internal space 10 of the chamber 6 becomes airtight due to the O-ring 11a interposed between the upper surface of the base 11 and the lower surface of the lid 21. On the other hand, as shown in FIG. 7, when the lid 21 is raised, the chamber 6 is opened, and the substrate 7 can be taken in and out of the internal space 10 of the chamber 6. The substrate 7 is lifted by the pin elevating portion 17. The lifted substrate 7 is transferred from the vacuum drying device 3 to the curing device 4 by the transfer robot 5.

チャンバ６の内部空間１０を減圧するために、減圧排気部２０が設けられている。減圧排気部２０は、揮発性の溶媒を含むガス（以下「排気ガス」という）を、チャンバ６の内部空間１０から排気する排気ポンプ２０である。チャンバ６と排気ポンプ２０との間は、排気管１８によって接続されている。排気管１８の途中には、排気ガスの排気量を制御する排気バルブ１８ａが設けられている。図５に示すように、チャンバ６の内部空間１０を気密状態にした状態で、制御部からの動作指令に応じて排気ポンプ２０が作動するとともに制御部からの開閉指令に応じて排気バルブ１８ａを開くと、排気バルブ１８ａの開度に応じた排気量で排気ガスが排気管１８を通じて排気ラインに排気され、内部空間１０が所定の圧力に減圧される。内部空間１０の圧力を減圧することにより、塗工液膜８に含まれる揮発性の溶媒が気化する。 A decompression / exhaust unit 20 is provided to depressurize the internal space 10 of the chamber 6. The reduced pressure exhaust unit 20 is an exhaust pump 20 that exhausts a gas containing a volatile solvent (hereinafter referred to as “exhaust gas”) from the internal space 10 of the chamber 6. The chamber 6 and the exhaust pump 20 are connected by an exhaust pipe 18. An exhaust valve 18a for controlling the displacement of the exhaust gas is provided in the middle of the exhaust pipe 18. As shown in FIG. 5, with the internal space 10 of the chamber 6 in an airtight state, the exhaust pump 20 operates in response to an operation command from the control unit, and the exhaust valve 18a is operated in response to an open / close command from the control unit. When opened, exhaust gas is exhausted to the exhaust line through the exhaust pipe 18 with an exhaust amount corresponding to the opening degree of the exhaust valve 18a, and the internal space 10 is depressurized to a predetermined pressure. By reducing the pressure in the internal space 10, the volatile solvent contained in the coating liquid film 8 is vaporized.

減圧された内部空間１０を大気圧に復圧するために、復圧部１９が設けられている。復圧部１９は、外部からのガス（以下、「外部ガス」という）をチャンバ６の内部空間１０に導入する復圧管１９ａと、外部ガスの導入量を制御する復圧バルブ１９ｂとを有する。内部空間１０が減圧された状態で、制御部からの開閉指令に応じて復圧バルブ１９ｂを開くと、復圧バルブ１９ｂの開度に応じて、外部ガスが復圧管１９ａを通じて内部空間１０に導入され、内部空間１０が大気圧に復圧する。 A pressure recovery unit 19 is provided to restore the decompressed internal space 10 to atmospheric pressure. The decompression unit 19 includes a decompression pipe 19a that introduces an external gas (hereinafter, referred to as “external gas”) into the internal space 10 of the chamber 6, and a decompression valve 19b that controls the amount of the external gas introduced. When the pressure recovery valve 19b is opened in response to an open / close command from the control unit while the internal space 10 is depressurized, external gas is introduced into the internal space 10 through the pressure recovery pipe 19a according to the opening degree of the pressure recovery valve 19b. Then, the internal space 10 is restored to the atmospheric pressure.

下加熱部１２は、下支持部１３を介して、ベース１１の上面に立設されている。上加熱部２２は、上支持部２３を介して、蓋２１の下面から吊り下げられている。上加熱部２２および下加熱部１２は、例えば、電熱ヒータであり、制御部からの加熱指令に応じて内部空間１０を所定の温度に昇温し、基板７を上下から加熱する。下加熱部１２および上加熱部２２は、チャンバ加熱部として働き、チャンバ６の内部温度を常温（２０℃）よりも高温になるように、温度制御される。当該構成によれば、塗工液膜８に含まれる揮発性の溶媒が気化することを促進できる。 The lower heating portion 12 is erected on the upper surface of the base 11 via the lower support portion 13. The upper heating portion 22 is suspended from the lower surface of the lid 21 via the upper support portion 23. The upper heating unit 22 and the lower heating unit 12 are, for example, electric heaters, which raise the temperature of the internal space 10 to a predetermined temperature in response to a heating command from the control unit to heat the substrate 7 from above and below. The lower heating unit 12 and the upper heating unit 22 function as a chamber heating unit, and the temperature is controlled so that the internal temperature of the chamber 6 becomes higher than room temperature (20 ° C.). According to this configuration, it is possible to promote the vaporization of the volatile solvent contained in the coating liquid film 8.

接触加熱部３０は、下加熱部１２を介して、ベース１１の上面に立設されている。接触加熱部３０は、図３のように平面視で矩形形状をしている。接触加熱部３０は、熱伝導性の良い金属材料、例えばアルミニウムや銅から構成されている。接触加熱部３０は、熱容量の大きな材料、例えば樹脂材料から構成することもできる。接触加熱部３０は、基板７の下面に向けて延在している。接触加熱部３０は、例えば外側から内側に向けて斜め上方に延在している。すなわち、接触時において、接触加熱部３０の下端は、塗工液膜８よりも外側に位置し、接触加熱部３０の上端すなわち接触端３１は、基板７を挟んで液周縁部４９の反対側にある下面側周縁部３９に位置するように構成される。すなわち、接触加熱部３０は、下面側周縁部３９および基板７の厚み部分を介して、液周縁部４９の周辺に配設され、好ましくは、液周縁部４９の直下に配設される。 The contact heating unit 30 is erected on the upper surface of the base 11 via the lower heating unit 12. The contact heating unit 30 has a rectangular shape in a plan view as shown in FIG. The contact heating unit 30 is made of a metal material having good thermal conductivity, for example, aluminum or copper. The contact heating unit 30 can also be made of a material having a large heat capacity, for example, a resin material. The contact heating portion 30 extends toward the lower surface of the substrate 7. The contact heating portion 30 extends obliquely upward from the outside to the inside, for example. That is, at the time of contact, the lower end of the contact heating portion 30 is located outside the coating liquid film 8, and the upper end of the contact heating portion 30, that is, the contact end 31, is on the opposite side of the liquid peripheral portion 49 with the substrate 7 in between. It is configured to be located on the lower surface side peripheral portion 39 in. That is, the contact heating portion 30 is disposed around the liquid peripheral edge portion 49 via the lower surface side peripheral edge portion 39 and the thick portion of the substrate 7, and is preferably arranged directly below the liquid peripheral edge portion 49.

接触加熱部３０の上端である接触端３１は、先端が尖ったナイフエッジ形状をしており、基板７の下面側周縁部３９に対して線状に接触するように構成されている。接触加熱部３０の接触端３１の反対側すなわち下端側には、接触加熱用加熱源３２として、例えば、電熱ヒータが設けられている。接触加熱用加熱源３２からの熱は、接触加熱部３０の本体部を伝導して、接触端３１に伝導する。接触加熱用加熱源３２は、制御部によって制御される。接触加熱部３０は、チャンバ６の内部よりも高温に加熱される。当該構成によれば、液周縁部４９において塗工液膜８に含まれる揮発性の溶媒が、気化することを促進できる。制御部からの加熱指令に応じて接触加熱用加熱源３２を所定の温度に加熱すると、接触加熱部３０は、接触端３１を介して、基板７の下面側周縁部３９を接触加熱する。基板７の下面側周縁部３９、基板７の厚み部分、および塗工液膜８の液周縁部４９が、この順番で接触加熱される。当該構成によれば、簡単な構成で、液周縁部４９を下面側から加熱できる。 The contact end 31, which is the upper end of the contact heating portion 30, has a knife edge shape with a sharp tip, and is configured to make linear contact with the lower peripheral side peripheral portion 39 of the substrate 7. An electric heater, for example, is provided as a heat source 32 for contact heating on the opposite side, that is, the lower end side of the contact end 31 of the contact heating unit 30. The heat from the contact heating heating source 32 is conducted through the main body of the contact heating unit 30 and is conducted to the contact end 31. The contact heating heating source 32 is controlled by a control unit. The contact heating unit 30 is heated to a higher temperature than the inside of the chamber 6. According to this configuration, the volatile solvent contained in the coating liquid film 8 at the liquid peripheral portion 49 can be promoted to vaporize. When the contact heating heating source 32 is heated to a predetermined temperature in response to a heating command from the control unit, the contact heating unit 30 contact-heats the lower surface side peripheral edge portion 39 of the substrate 7 via the contact end 31. The lower surface side peripheral edge portion 39 of the substrate 7, the thick portion of the substrate 7, and the liquid peripheral edge portion 49 of the coating liquid film 8 are contact-heated in this order. According to this configuration, the liquid peripheral portion 49 can be heated from the lower surface side with a simple configuration.

ピン昇降部１７は、複数の支持ピン１４と、リンク１５と、ピン昇降モータ１６とを備える。複数の支持ピン１４として、例えば図６に示すように、４つの支持ピン１４が配設されている。各支持ピン１４の頭部が基板７の下面に当接することにより、基板７が、チャンバ６の内部空間１０において水平姿勢で支持される。各支持ピン１４は、ベース１１および下加熱部１２を貫通してチャンバ６の内部空間１０に突出している。複数の支持ピン１４は、チャンバ６の外部に配置されたリンク１５によって一体化されている。 The pin elevating portion 17 includes a plurality of support pins 14, a link 15, and a pin elevating motor 16. As the plurality of support pins 14, four support pins 14 are arranged, for example, as shown in FIG. When the head of each support pin 14 comes into contact with the lower surface of the substrate 7, the substrate 7 is supported in a horizontal posture in the internal space 10 of the chamber 6. Each support pin 14 penetrates the base 11 and the lower heating portion 12 and projects into the internal space 10 of the chamber 6. The plurality of support pins 14 are integrated by a link 15 arranged outside the chamber 6.

リンク１５には、ピン昇降モータ１６が接続されている。制御部からの昇降指令に応じてピン昇降モータ１６が作動することで、リンク１５によって一体となった複数の支持ピン１４が上下に移動する。複数の支持ピン１４上に基板７を載置しつつピン昇降モータ１６を作動させることにより、搬送ロボット５による基板７の受け渡しを可能にするとともに、下加熱部１２に対する基板７の高さ位置を調整できる。例えば、図５に示すように、チャンバ６の内部空間１０を気密状態にした状態で、各支持ピン１４が下降することにより、各支持ピン１４の上端が基板７の下面から離間するように、ピン昇降部１７が制御される。これにより、基板７の下面は、各支持ピン１４とは非接触になり、接触加熱部３０の接触端３１だけに接触して接触加熱部３０で支持される。したがって、チャンバ６の内部空間１０が減圧された状態で、上述した、接触加熱部３０による接触加熱が行われる。 A pin elevating motor 16 is connected to the link 15. By operating the pin elevating motor 16 in response to the elevating command from the control unit, the plurality of support pins 14 integrated by the link 15 move up and down. By operating the pin elevating motor 16 while mounting the substrate 7 on the plurality of support pins 14, the transfer robot 5 can transfer the substrate 7 and set the height position of the substrate 7 with respect to the lower heating unit 12. Can be adjusted. For example, as shown in FIG. 5, in a state where the internal space 10 of the chamber 6 is in an airtight state, each support pin 14 is lowered so that the upper end of each support pin 14 is separated from the lower surface of the substrate 7. The pin elevating unit 17 is controlled. As a result, the lower surface of the substrate 7 is not in contact with each of the support pins 14, is in contact with only the contact end 31 of the contact heating portion 30, and is supported by the contact heating portion 30. Therefore, in a state where the internal space 10 of the chamber 6 is depressurized, the contact heating by the contact heating unit 30 described above is performed.

従来技術で説明したように、基板７上に形成された塗工膜の膜周縁部では、膜周縁部の内側に位置する膜内周部に比べて膜厚が大きくなる現象（いわゆる、エッジビード：edge-bead）が知られている。当該現象は、十分に解明されていないが、例えば、塗工液膜８を基板７上に塗工する段階で、液周縁部４９での塗工液の表面張力が液内周部４８での塗工液の表面張力よりも大きいために、液内周部４８での塗工液が液周縁部４９に流動することにより、液周縁部４９の厚みが液内周部４８の厚みよりも厚くなると仮定することができる。 As described in the prior art, the film peripheral portion of the coating film formed on the substrate 7 has a larger film thickness than the inner peripheral portion of the film located inside the film peripheral portion (so-called edge bead: edge-bead) is known. Although this phenomenon has not been fully elucidated, for example, at the stage of coating the coating liquid film 8 on the substrate 7, the surface tension of the coating liquid at the liquid peripheral portion 49 is increased at the liquid inner peripheral portion 48. Since it is larger than the surface tension of the coating liquid, the coating liquid at the inner peripheral portion 48 flows to the liquid peripheral portion 49, so that the thickness of the liquid peripheral portion 49 becomes thicker than the thickness of the liquid inner peripheral portion 48. Can be assumed to be.

塗工液膜８は、上述したように、溶質および揮発性の溶媒から構成されているが、塗工液膜８の減圧乾燥によって塗工液膜８の厚みが大幅に低下することから、塗工液膜８には揮発性の溶媒が多く含まれている。したがって、塗工液膜８のうち、含有量の多い揮発性の溶媒が、エッジビードに関与していると推察することができる。 As described above, the coating liquid film 8 is composed of a solute and a volatile solvent. However, since the thickness of the coating liquid film 8 is significantly reduced by vacuum drying of the coating liquid film 8, the coating liquid film 8 is coated. The working liquid film 8 contains a large amount of volatile solvent. Therefore, it can be inferred that the volatile solvent having a high content in the coating liquid film 8 is involved in the edge bead.

接触加熱部３０は、液周縁部４９からの揮発性の溶媒の気化を促進する気化促進部として働き、接触加熱部３０は、基板７に塗工された塗工液膜８の液周縁部４９の周辺に配設される。図４および図５では、接触加熱部３０の接触端３１が、基板７を挟んで液周縁部４９の反対側にある下面側周縁部３９に接触するように、接触加熱部３０が配設されている。接触加熱部３０は、基板７の下面側周縁部３９を加熱したあと、基板７の厚み部分および塗工液膜８の液周縁部４９の順で加熱し、最終的に、液周縁部４９を局所的に加熱する。 The contact heating unit 30 acts as a vaporization promoting unit that promotes vaporization of the volatile solvent from the liquid peripheral portion 49, and the contact heating unit 30 serves as a liquid peripheral portion 49 of the coating liquid film 8 coated on the substrate 7. It is arranged around. In FIGS. 4 and 5, the contact heating portion 30 is arranged so that the contact end 31 of the contact heating portion 30 comes into contact with the lower surface side peripheral edge portion 39 on the opposite side of the liquid peripheral edge portion 49 across the substrate 7. ing. The contact heating portion 30 heats the lower surface side peripheral edge portion 39 of the substrate 7 and then heats the thick portion of the substrate 7 and the liquid peripheral edge portion 49 of the coating liquid film 8 in this order, and finally the liquid peripheral portion 49 is heated. Heat locally.

従来技術ではエッジビードが形成されるのに対して、気化促進部として働く接触加熱部３０を備える減圧乾燥装置３では、エッジビードが低減可能であることについて、一仮説に基づいて説明する。 It will be described based on one hypothesis that the edge bead can be reduced in the vacuum drying device 3 provided with the contact heating unit 30 that acts as a vaporization promoting unit, whereas the edge bead is formed in the prior art.

塗布直後の塗工液膜８は、揮発性の溶媒を多く含有するので、塗工液膜８の流動性が高いのに対して、減圧乾燥が行われた塗工液膜８は、揮発性の溶媒の含有量が少なくなるので、塗工液膜８の流動性が低くなる。 Since the coating liquid film 8 immediately after coating contains a large amount of volatile solvent, the coating liquid film 8 has high fluidity, whereas the coating liquid film 8 that has been dried under reduced pressure is volatile. Since the content of the solvent is reduced, the fluidity of the coating liquid film 8 is lowered.

塗布直後の塗工液膜８の液周縁部４９では、それ以外の部分（液内周部４８）との比較で、基板７との界面が存在する分だけ、表面張力が大きくなるので、液周縁部４９での盛り上がりが生じると考えられる。従来技術のように、液周縁部４９が盛り上がりを有する状態で塗工液膜８を単に減圧乾燥するだけでは、液周縁部４９での盛り上がりを維持した状態で膜厚が全体的に均等に薄くなるため、減圧乾燥後に、エッジビードが生じてしまう。 In the liquid peripheral portion 49 of the coating liquid film 8 immediately after coating, the surface tension increases by the amount of the interface with the substrate 7 as compared with the other portion (liquid inner peripheral portion 48). It is considered that the swelling at the peripheral portion 49 occurs. By simply drying the coating liquid film 8 under reduced pressure while the liquid peripheral portion 49 has a bulge as in the prior art, the film thickness is uniformly thin as a whole while maintaining the bulge at the liquid peripheral portion 49. Therefore, edge beads are generated after drying under reduced pressure.

これに対して、この発明に係る減圧乾燥装置３では、接触加熱部３０が液周縁部４９を局所的に加熱して、液周縁部４９での溶媒の気化を促進する。これにより、液周縁部４９において、揮発性の溶媒の含有量が少なくなって、液周縁部４９の流動性が低下するので、液周縁部４９が保形性を有するようになる。液周縁部４９が保形性を有するものの、液周縁部４９以外の部分（液内周部４８）は、液周縁部４９よりも大きな流動性を有する。液周縁部４９が盛り上がりを有していても、塗工液膜８を減圧乾燥する過程で、それ以外の部分（液内周部４８）での揮発性の溶媒が、保形性を有する液周縁部４９に向けて流動することによって、液周縁部４９とそれ以外の部分（液内周部４８）との間でレベリングが行われる。これにより、液周縁部４９とそれ以外の部分（液内周部４８）との間で高低差が少なくなり、膜厚均一性の高い塗工膜を基板７上に形成できる。 On the other hand, in the vacuum drying device 3 according to the present invention, the contact heating unit 30 locally heats the liquid peripheral portion 49 to promote the vaporization of the solvent at the liquid peripheral portion 49. As a result, the content of the volatile solvent in the liquid peripheral portion 49 decreases, and the fluidity of the liquid peripheral portion 49 decreases, so that the liquid peripheral portion 49 has shape retention. Although the liquid peripheral portion 49 has shape retention, the portion other than the liquid peripheral portion 49 (the liquid inner peripheral portion 48) has a larger fluidity than the liquid peripheral portion 49. Even if the liquid peripheral portion 49 has a bulge, in the process of vacuum-drying the coating liquid film 8, the volatile solvent in the other portion (liquid inner peripheral portion 48) has a shape-retaining property. By flowing toward the peripheral edge portion 49, leveling is performed between the liquid peripheral portion 49 and the other portion (liquid inner peripheral portion 48). As a result, the height difference between the liquid peripheral portion 49 and the other portion (liquid inner peripheral portion 48) is reduced, and a coating film having high film thickness uniformity can be formed on the substrate 7.

したがって、上記構成の減圧乾燥装置３によれば、液周縁部４９の周辺に配設される接触加熱部（気化促進部）３０により、液周縁部４９が保形性を有するともに、それ以外の部分（液内周部４８）が液周縁部４９に向けて流動することによって、液周縁部４９においてレベリングが行われるので、膜厚均一性の高い塗工膜を基板７上に形成できる。 Therefore, according to the vacuum drying device 3 having the above configuration, the liquid peripheral portion 49 has a shape-retaining property due to the contact heating portion (vaporization promoting portion) 30 arranged around the liquid peripheral portion 49, and other than that. Since the portion (inner peripheral portion 48) flows toward the peripheral portion 49 of the liquid, leveling is performed at the peripheral portion 49 of the liquid, so that a coating film having high film thickness uniformity can be formed on the substrate 7.

〔変形例〕
図８は、変形例に係る減圧乾燥装置３を説明する断面図である。変形例に係る減圧乾燥装置３では、離間加熱部３５が気化促進部として用いられている。 [Modification example]
FIG. 8 is a cross-sectional view illustrating the vacuum drying device 3 according to the modified example. In the vacuum drying device 3 according to the modified example, the separated heating unit 35 is used as the vaporization promoting unit.

図８に示すように、気化促進部として働く離間加熱部３５は、液周縁部４９および下面側周縁部３９に対して離間して上方および下方で対面するように構成されている。すなわち、上方に位置する離間加熱部３５は、液周縁部４９の周辺に配設され、好ましくは、液周縁部４９の直上に配設される。下方に位置する離間加熱部３５は、下面側周縁部３９および基板７の厚み部分を介して、液周縁部４９の周辺に配設され、好ましくは、液周縁部４９の直下に配設される。上方に位置する離間加熱部３５は、上加熱部２２を貫通する複数の離間支持部３６によって、蓋２１の下面から支持されている。下方に位置する離間加熱部３５は、下加熱部１２を貫通する複数の離間支持部３６によって、ベース１１の上面に支持されている。 As shown in FIG. 8, the separated heating unit 35 that acts as a vaporization promoting unit is configured to face the liquid peripheral portion 49 and the lower surface side peripheral edge portion 39 at an upper and lower sides with respect to the liquid peripheral portion 49. That is, the separated heating portion 35 located above is arranged around the liquid peripheral portion 49, preferably directly above the liquid peripheral portion 49. The separated heating portion 35 located below is disposed around the liquid peripheral edge portion 49 via the lower surface side peripheral edge portion 39 and the thick portion of the substrate 7, and is preferably arranged directly below the liquid peripheral edge portion 49. .. The separation heating portion 35 located above is supported from the lower surface of the lid 21 by a plurality of separation support portions 36 penetrating the upper heating portion 22. The separation heating portion 35 located below is supported on the upper surface of the base 11 by a plurality of separation support portions 36 penetrating the lower heating portion 12.

離間加熱部３５は、平面視で矩形形状をしている。離間加熱部３５は、例えば、電熱ヒータである。離間加熱部３５は、制御部によって制御される。制御部からの加熱指令に応じて上下の離間加熱部３５を所定の温度に昇温すると、上下の離間加熱部３５は、間隙を介して、液周縁部４９および下面側周縁部３９を局所的に加熱する。下面側周縁部３９への加熱は、基板７の厚み部分を介して、最終的に液周縁部４９を局所的に加熱する。 The separation heating unit 35 has a rectangular shape in a plan view. The separated heating unit 35 is, for example, an electric heater. The separation heating unit 35 is controlled by the control unit. When the upper and lower separated heating units 35 are heated to a predetermined temperature in response to a heating command from the control unit, the upper and lower separated heating units 35 locally move the liquid peripheral portion 49 and the lower surface side peripheral portion 39 through the gap. Heat to. The heating to the lower surface side peripheral edge portion 39 finally locally heats the liquid peripheral edge portion 49 through the thick portion of the substrate 7.

上下の離間加熱部３５を備える減圧乾燥装置３は、上下の離間加熱部３５によって液周縁部４９および下面側周縁部３９に対して局所的に離間加熱（非接触加熱）することにより、液周縁部４９での溶媒の気化を促進している。これにより、液周縁部４９において、揮発性の溶媒の含有量が少なくなって、液周縁部４９の流動性が低下するので、液周縁部４９が保形性を有するようになる。液周縁部４９が保形性を有するものの、液周縁部４９以外の部分（液内周部４８）は、液周縁部４９よりも大きな流動性を有する。液周縁部４９が盛り上がりを有していても、塗工液膜８を減圧乾燥する過程で、それ以外の部分（液内周部４８）での揮発性の溶媒が、保形性を有する液周縁部４９に向けて流動することによって、液周縁部４９とそれ以外の部分（液内周部４８）との間でレベリングが行われる。これにより、液周縁部４９とそれ以外の部分（液内周部４８）との間で高低差が少なくなり、膜厚均一性の高い塗工膜を基板７上に形成できる。 The decompression drying device 3 provided with the upper and lower separated heating portions 35 locally heats the liquid peripheral portion 49 and the lower surface side peripheral portion 39 by the upper and lower separated heating portions 35 (non-contact heating). The vaporization of the solvent in the part 49 is promoted. As a result, the content of the volatile solvent in the liquid peripheral portion 49 decreases, and the fluidity of the liquid peripheral portion 49 decreases, so that the liquid peripheral portion 49 has shape retention. Although the liquid peripheral portion 49 has shape retention, the portion other than the liquid peripheral portion 49 (the liquid inner peripheral portion 48) has a larger fluidity than the liquid peripheral portion 49. Even if the liquid peripheral portion 49 has a bulge, in the process of vacuum-drying the coating liquid film 8, the volatile solvent in the other portion (liquid inner peripheral portion 48) has a shape-retaining property. By flowing toward the peripheral edge portion 49, leveling is performed between the liquid peripheral portion 49 and the other portion (liquid inner peripheral portion 48). As a result, the height difference between the liquid peripheral portion 49 and the other portion (liquid inner peripheral portion 48) is reduced, and a coating film having high film thickness uniformity can be formed on the substrate 7.

したがって、上記構成の減圧乾燥装置３によれば、液周縁部４９の周辺に配設される離間加熱部（気化促進部）３５により、液周縁部４９が保形性を有するともに、それ以外の部分（液内周部４８）が液周縁部４９に向けて流動することによって、液周縁部４９においてレベリングが行われるので、膜厚均一性の高い塗工膜を基板７上に形成できる。さらに、例えば、上下の離間加熱部３５により、溶媒の気化を複数の方向から行うことができるので、液周縁部４９からの溶媒の気化が促進される。また、非接触での気化促進であるので、接触跡が基板７や液周縁部４９に付くことを防止できる。 Therefore, according to the vacuum drying device 3 having the above configuration, the liquid peripheral portion 49 has a shape-retaining property due to the separated heating portion (vaporization promoting portion) 35 arranged around the liquid peripheral portion 49, and other than that. Since the portion (inner peripheral portion 48) flows toward the peripheral portion 49 of the liquid, leveling is performed at the peripheral portion 49 of the liquid, so that a coating film having high film thickness uniformity can be formed on the substrate 7. Further, for example, the upper and lower separated heating portions 35 can vaporize the solvent from a plurality of directions, so that the vaporization of the solvent from the liquid peripheral portion 49 is promoted. Further, since the vaporization is promoted in a non-contact manner, it is possible to prevent the contact marks from being attached to the substrate 7 and the liquid peripheral portion 49.

この発明の具体的な実施の形態について説明したが、この発明は、上記実施形態に限定されるものではなく、この発明の範囲内で種々変更して実施することができる。 Although specific embodiments of the present invention have been described, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the present invention.

塗工液膜８の液周縁部４９が基板７の縁部の近傍まで延在しているとき、基板７の側方部分（厚み部分）を加熱する側方の離間加熱部３５を追加配置することもできる。側方からも離間加熱部３５で加熱することにより、液周縁部４９からの溶媒の気化が促進される。 When the liquid peripheral portion 49 of the coating liquid film 8 extends to the vicinity of the edge portion of the substrate 7, a laterally separated heating portion 35 for heating the side portion (thick portion) of the substrate 7 is additionally arranged. You can also do it. The vaporization of the solvent from the liquid peripheral portion 49 is promoted by heating with the separated heating portion 35 also from the side.

離間加熱部３５は、例えば、赤外線ハロゲンランプによる放射加熱方式や、熱風を吹き出す熱風ヒータ方式にすることもできる。 The separated heating unit 35 may be, for example, a radiant heating method using an infrared halogen lamp or a hot air heater method for blowing hot air.

下面側周縁部３９を接触加熱部３０で加熱するとともに、液周縁部４９を離間加熱部３５で上方から加熱する構成にすることもできる。 The lower surface side peripheral edge portion 39 may be heated by the contact heating portion 30, and the liquid peripheral edge portion 49 may be heated by the separated heating portion 35 from above.

液周縁部４９からの溶媒の気化を促進する気化促進部は、上述した加熱タイプだけでなく、液周縁部４９の周辺を減圧する減圧タイプとすることもできる。減圧タイプの気化促進部は、例えば、排気管１８の一部を分岐した分岐排気管を、液周縁部４９の周辺に配設した構成にすることもできる。 The vaporization promoting unit that promotes the vaporization of the solvent from the liquid peripheral portion 49 may be not only the heating type described above but also a decompression type that reduces the pressure around the liquid peripheral portion 49. The decompression type vaporization promotion unit may have, for example, a configuration in which a branched exhaust pipe in which a part of the exhaust pipe 18 is branched is arranged around the liquid peripheral portion 49.

この発明および実施形態をまとめると、次のようになる。 The present invention and embodiments can be summarized as follows.

この発明の一態様に係る減圧乾燥装置３は、
溶媒を含む塗工液膜８が塗工された基板７を収容するチャンバ６と、
前記チャンバ６の内部を減圧排気する減圧排気部２０と、
前記塗工液膜８からの前記溶媒の気化を促進する気化促進部３０，３５とを備える減圧乾燥装置３であって、
前記気化促進部３０，３５を、前記基板７に塗工された前記塗工液膜８の液周縁部４９の周辺に配設することを特徴とする。 The vacuum drying device 3 according to one aspect of the present invention is
A chamber 6 containing a substrate 7 coated with a coating liquid film 8 containing a solvent, and a chamber 6
A decompression exhaust unit 20 that decompresses and exhausts the inside of the chamber 6 and
A vacuum drying device 3 including vaporization promoting units 30 and 35 that promote vaporization of the solvent from the coating liquid film 8.
The vaporization promoting portions 30 and 35 are arranged around the liquid peripheral portion 49 of the coating liquid film 8 coated on the substrate 7.

上記構成によれば、液周縁部４９の周辺に配設される気化促進部３０，３５により、液周縁部４９が保形性を有するともに、それ以外の部分（液内周部４８）が液周縁部４９に向けて流動することによって、液周縁部４９においてレベリングが行われるので、膜厚均一性の高い塗工膜を基板７上に形成できる。 According to the above configuration, the vaporization promoting portions 30 and 35 arranged around the liquid peripheral portion 49 allow the liquid peripheral portion 49 to have shape retention, and the other portion (liquid inner peripheral portion 48) to be liquid. Since leveling is performed at the liquid peripheral portion 49 by flowing toward the peripheral portion 49, a coating film having high film thickness uniformity can be formed on the substrate 7.

また、一実施形態の減圧乾燥装置３では、
前記気化促進部３０，３５が、前記チャンバ６の内部よりも高温に加熱された加熱部である。 Further, in the vacuum drying device 3 of one embodiment,
The vaporization promoting portions 30 and 35 are heating portions heated to a higher temperature than the inside of the chamber 6.

上記実施形態によれば、液周縁部４９に含まれる溶媒が、気化することを促進できる。 According to the above embodiment, the solvent contained in the liquid peripheral portion 49 can be promoted to vaporize.

また、一実施形態の減圧乾燥装置３では、
前記加熱部が、前記液周縁部４９に対応して前記基板７の下面に位置する下面側周縁部３９に接触する接触加熱部３０である。 Further, in the vacuum drying device 3 of one embodiment,
The heating portion is a contact heating portion 30 that contacts the lower surface side peripheral edge portion 39 located on the lower surface of the substrate 7 corresponding to the liquid peripheral edge portion 49.

上記実施形態によれば、簡単な構成で、液周縁部４９を下面側から加熱できる。 According to the above embodiment, the liquid peripheral portion 49 can be heated from the lower surface side with a simple configuration.

また、一実施形態の減圧乾燥装置３では、
前記気化促進部３５を、前記液周縁部４９に対して離間して配設する。 Further, in the vacuum drying device 3 of one embodiment,
The vaporization promoting portion 35 is disposed at a distance from the liquid peripheral portion 49.

上記実施形態によれば、非接触での気化促進であるので、接触跡が基板７や液周縁部４９に付くことを防止でき、溶媒の気化を複数の方向から行うことができるので、液周縁部４９からの溶媒の気化が促進される。 According to the above embodiment, since the vaporization is promoted in a non-contact manner, it is possible to prevent contact marks from adhering to the substrate 7 and the liquid peripheral portion 49, and the solvent can be vaporized from a plurality of directions. The vaporization of the solvent from the part 49 is promoted.

また、一実施形態の減圧乾燥装置３では、
前記チャンバ６の内部を常温よりも高温に加熱するチャンバ加熱部１２，２２を、前記チャンバ６の内部に配設する。 Further, in the vacuum drying device 3 of one embodiment,
Chamber heating units 12 and 22 that heat the inside of the chamber 6 to a temperature higher than room temperature are arranged inside the chamber 6.

上記実施形態によれば、塗工液膜８に含まれる溶媒が気化することを促進できる。 According to the above embodiment, it is possible to promote the vaporization of the solvent contained in the coating liquid film 8.

また、一実施形態の減圧乾燥装置３では、
スリット状のノズルから前記塗工液を吐出しながら前記基板７の上を走査する塗工装置２によって、前記塗工液膜８を前記基板７に塗工する。 Further, in the vacuum drying device 3 of one embodiment,
The coating liquid film 8 is coated on the substrate 7 by a coating device 2 that scans the substrate 7 while discharging the coating liquid from a slit-shaped nozzle.

上記実施形態によれば、フラットパネルディスプレイや半導体の製造に用いられる大型の基板７の上に、フォトレジスト液などからなる塗工液膜８を均一に塗工できる。 According to the above embodiment, the coating liquid film 8 made of a photoresist liquid or the like can be uniformly coated on a large substrate 7 used for manufacturing a flat panel display or a semiconductor.

１…塗工乾燥装置
２…塗工装置
３…減圧乾燥装置
４…硬化装置
５…搬送ロボット
６…チャンバ
７…基板
８…塗工液膜
１０…内部空間
１１…ベース
１１ａ…Ｏリング
１１ｂ…Ｏリング溝
１２…下加熱部（チャンバ加熱部）
１３…下支持部
１４…支持ピン
１５…リンク
１６…ピン昇降モータ
１７…ピン昇降部
１８…排気管
１８ａ…排気バルブ
１９…復圧部
１９ａ…復圧管
１９ｂ…復圧バルブ
２０…排気ポンプ（減圧排気部）
２１…蓋
２２…上加熱部（チャンバ加熱部）
２３…上支持部
２７…蓋昇降機構
３０…接触加熱部（気化促進部）
３１…接触端
３２…接触加熱用加熱源
３５…離間加熱部（気化促進部）
３６…離間支持部
３９…下面側周縁部
４８…液内周部
４９…液周縁部 1 ... Coating drying device 2 ... Coating device 3 ... Vacuum drying device 4 ... Curing device 5 ... Transfer robot 6 ... Chamber 7 ... Substrate 8 ... Coating liquid film 10 ... Internal space 11 ... Base 11a ... O-ring 11b ... O Ring groove 12 ... Lower heating part (chamber heating part)
13 ... Lower support part 14 ... Support pin 15 ... Link 16 ... Pin elevating motor 17 ... Pin elevating part 18 ... Exhaust pipe 18a ... Exhaust valve 19 ... Depressurizing part 19a ... Depressurizing pipe 19b ... Depressurizing valve 20 ... Exhaust pump Exhaust part)
21 ... Lid 22 ... Upper heating part (chamber heating part)
23 ... Upper support part 27 ... Closure lifting mechanism 30 ... Contact heating part (vaporization promotion part)
31 ... Contact end 32 ... Heat source for contact heating 35 ... Separate heating part (vaporization promotion part)
36 ... Separation support 39 ... Lower surface peripheral edge 48 ... Liquid inner peripheral 49 ... Liquid peripheral edge

Claims (6)

溶媒を含む塗工液膜が塗工される上面と、前記塗工液膜の液周縁部の反対側にある下面側周縁部を有する下面とを含む基板を収容するチャンバと、
前記チャンバの内部を減圧排気する減圧排気部と、
前記塗工液膜からの前記溶媒の気化を促進する気化促進部とを備える減圧乾燥装置であって、
前記気化促進部は、前記チャンバの内部よりも高温に加熱される接触加熱部であり、
前記接触加熱部は、前記下面側周縁部に対向配置される接触端を有し、
前記接触加熱部の前記接触端が前記下面側周縁部に接触して前記液周縁部を加熱することによって、前記液周縁部からの前記溶媒の気化が促進されることを特徴とする、減圧乾燥装置。 A top surface coating liquid film containing solvent Ru is applied, a chamber containing a substrate and a lower surface having a lower surface peripheral edge portion on the opposite side of the liquid periphery of the coating liquid film,
A decompression exhaust unit that decompresses and exhausts the inside of the chamber,
A vacuum drying device including a vaporization promoting unit that promotes vaporization of the solvent from the coating liquid film.
The vaporization promoting unit is a contact heating unit that is heated to a higher temperature than the inside of the chamber.
The contact heating portion has a contact end that is arranged so as to face the lower surface side peripheral edge portion.
Decompression drying is characterized in that the contact end of the contact heating portion contacts the lower surface side peripheral edge portion to heat the liquid peripheral edge portion, thereby promoting vaporization of the solvent from the liquid peripheral edge portion. Device. 前記塗工液膜は、平面視で矩形形状であり、The coating liquid film has a rectangular shape in a plan view and has a rectangular shape.
前記接触加熱部は、平面視で矩形形状であることを特徴とする、請求項１に記載の減圧乾燥装置。The vacuum drying device according to claim 1, wherein the contact heating unit has a rectangular shape in a plan view. 前記接触端は、先端の尖ったナイフエッジ形状をしていることを特徴とする、請求項１または請求項２に記載の減圧乾燥装置。The vacuum drying device according to claim 1 or 2, wherein the contact end has a knife edge shape with a sharp tip. 前記基板の前記下面を支持する支持ピンと、前記支持ピンを上下に移動させるピン昇降モータとを有するピン昇降部をさらに備え、前記ピン昇降部によって前記基板の前記下面に対する前記支持ピンの離接を制御し、A pin elevating portion having a support pin for supporting the lower surface of the substrate and a pin elevating motor for moving the support pin up and down is further provided, and the pin elevating portion allows the support pin to be detached from the lower surface of the substrate. Control and
前記液周縁部を加熱するとき、前記支持ピンは、前記基板の前記下面から離れていることを特徴とする、請求項１から請求項３のいずれか１項に記載の減圧乾燥装置。The vacuum drying apparatus according to any one of claims 1 to 3, wherein the support pin is separated from the lower surface of the substrate when the liquid peripheral portion is heated. 前記接触加熱部は、前記液周縁部の直下に配設されることを特徴とする、請求項１から請求項４のいずれか１項に記載の減圧乾燥装置。The vacuum drying apparatus according to any one of claims 1 to 4, wherein the contact heating portion is arranged directly below the liquid peripheral portion. 前記チャンバの内部を常温よりも高温に加熱するチャンバ加熱部を、前記チャンバの内部に配設することを特徴とする、請求項１から請求項５のいずれか１項に記載の減圧乾燥装置。 The vacuum drying apparatus according to any one of claims 1 to 5 , wherein a chamber heating unit that heats the inside of the chamber to a temperature higher than room temperature is arranged inside the chamber.
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