JP6905652B2 - Led照明装置及びその製造方法 - Google Patents
Led照明装置及びその製造方法 Download PDFInfo
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- JP6905652B2 JP6905652B2 JP2019531502A JP2019531502A JP6905652B2 JP 6905652 B2 JP6905652 B2 JP 6905652B2 JP 2019531502 A JP2019531502 A JP 2019531502A JP 2019531502 A JP2019531502 A JP 2019531502A JP 6905652 B2 JP6905652 B2 JP 6905652B2
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- led
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Images
Classifications
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/70—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing phosphorus
- C09K11/71—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing phosphorus also containing alkaline earth metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
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- C09K11/771—Phosphates with alkaline earth metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7759—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing samarium
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
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- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
- F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Organic Chemistry (AREA)
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- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
Claims (6)
- LEDデバイス(101)、LED赤光光源(102)、LED回路基板(100)、ラジエーター(200)および電源コントローラ(400)を含み、LEDデバイス(101)とLED赤光光源(102)はLED回路基板の上に設置され、LED回路基板はラジエーターの上に設置され、電源コントローラーは導線(300)を通じてLED回路基板と繋がっているLED照明装置の製造方法であって、以下のステップを含むことを特徴とするLED照明装置の製造方法。
ステップ1:サファイアを使ってLED回路基板の基板として、LED回路基板(100)を製作する。
ステップ2:平均的な多層LED蛍光膜がLEDデバイスに沈積する。
ステップ3:LED照明装置のスペクトル設計によって、LED照明装置の効率を確認する。
ステップ4:必要なLED照明装置によって、LEDデバイスとLED赤光光源の数を計算する。
沈積過程では赤蛍光材料を第1層として、緑の蛍光材料は第2層として、青色の蛍光材料が第3層としている。まず赤蛍光材料の第一層の沈積:赤色の蛍光材料を混合溶剤に溶かし、それぞれ0.1ムーア/リットルの第1溶液を形成する。「混合溶剤」は、テトラヒドロフランと2-エチル酸がモル比率で3:2.5の割合で構成されている。第1溶液を350℃まで加熱して保温30-60min、加熱した後に気化室に送って気化をさせて、第1の混合の気体を形成する。アルゴンガスを通して、第1の混合ガスを4000sccmの流量として反応器のLEDデバイスに輸送する。反応器の温度300℃で、輸送完了後は静置30-45min、その後、デバイスの温度を800℃まで高くして、保温30-60min、LEDデバイス上に第1層の蛍光膜を形成する。上述のステップを繰り返して緑色の蛍光材料の第2層を繰り返して、青色の蛍光材料の第3層は徐々に沈積してLEDデバイスに3層のLEDの蛍光膜を形成する。それぞれコーティング膜の厚さは0.2-1μm、ベストは0.5μmである。 - ステップ1のサファイア製作方法に特徴があり、以下のステップを含むことを特徴とする請求項1に記載のLED照明装置の製造方法。
a)原料調整する。まずはα-A12O3原料を主原料として、立方構造のBN、ナノZrO2およびナノTiO2を加え、これらの材料を混合機の中で15-30min混合し、そのうちα-A12O3、立方構造のBN、ナノZrO2、ナノTiO2の質量比は10-25:2-5:2-3:1-4である。
b)原料を結晶の成長炉に入れて真空引きし、ヘリウムの保護ガスを入れて、2000-2100℃に昇温して原料を溶融状態に溶かし、溶融した後に4-5h保温する。
c)この結晶成長炉の上部は金型を持っていて、この金型の断面は円形で、中心は小さな穴を持っていて、小穴の毛細作用で溶体を金型の先端に導入させて、その溶体について結晶の成長を促進する。溶融体の表面温度は2089℃にコントロールして、引く速度は10-20mm/hで、結晶の成長が終わった後に、温度を1480-1570℃まで下げ、15-30min保温してから再び結晶に対して降温処理を行い、制御温度は30-60℃/hの速度で結晶を得る。
d)切断装置を使って結晶の棒をカットし、必要な形のチップを得る。
e)研磨機でチップを研磨する。研磨するとき、自製の研磨液を加えて、研磨盤はチップに0.025〜0.027MPaまで加圧し、研磨盤の回転速度は1000〜1200rpm/minで、研磨した後、無水アルコールで洗浄する。
f)焼鈍する。チップを焼鈍炉内に入れ、まず500℃まで昇温して1-2h保温し、800℃まで昇温して2-4h保温し、1600℃まで昇温してそれぞれ2〜4h保温し、それから210-220℃の温度で下げ、1300℃まで下げると0.5-1h保温し,1000℃まで下げると1-2h保温し、600℃まで下げると1-3h保温し、そのあとの温度は20-40℃/hのスピードで室温まで冷まして取り出す。
g)バフ研磨する。まず無水アルコールでチップを3〜5回洗浄し、洗浄後の結晶をポリシャに入れて固定する。バフ研磨するとき、バフ研磨液を加えて、回転速度は1000〜1500rpm/min、バフ研磨後のチップを無水アルコールで洗浄した後、室温で自然冷却を行う。 - ステップa)にあるα-Al2O3の原料の粒の直径は0.5-5μm、密度は3.98g/cm3であり、ステップe)中の研磨液は0.1-2μmの金剛砂粒、1-μmのAl2O3粒、α-オレフィン,N,N-nエチレンビスエステルアミドおよび脱イオン水であり、その質量比は1-5:1-5:3-6:30-50であり、ステップg)の中で記載された磨きをかける液はジルコニウムミクロン粒子、アルキルグリコシド、ヒドロキシメチルセルローストナトリウム、プロトリオール、ヒドロキシエチルジアミン、イオン水からなり、その質量比は1-5:1-5:5-10:3-6:30-50であり、記載されたヒドロキシエチルアミンは磨きをかける液のpHを制御するために使用され、磨きをかける液pH値は8-10のアルカリ性溶液であることを特徴とする請求項2に記載のLED照明装置の製造方法。
- ステップ2に特徴があり、LEDデバイス上に沈積した平均している多層のLED蛍光膜は以下のステップを含むことを特徴とする請求項1に記載のLED照明装置の製造方法。
(1)赤い蛍光材料の調製
原料はGd(NO3)3・6H2O、LiCO3、MgCO3、Nb2O5、H3B03、Sm2O3、Na2CO3および脱イオン水を用い、上述のGd(NO3)3・6H2O、LiCO3、MgCO3、Nb2O5、H3B03、Sm2O3、Na2CO3のモル比は(1-x-y):1-2:1-2:1-2:1-2:x:y、そのうち0.01≦x≦0.08,x/y=1-2,Gd(NO3)3・6H2Oと脱イオン水の質量比は1:1-2であり、Gd(NO3)3・6H2O、Li2CO3、MgCO3、Nb2O5、Sm2O3およびNa2C03を脱イオン水の中に入れて、懸濁液に配置して、懸濁液を50-60℃の条件の下で30-45minかき混ぜた後にH3BO3を滴下し、滴下完了後、沈澱物を脱イオン水で3-5回洗って乾燥箱に入れて乾かし、乾燥した材料をボールグラインダーして均一にし、ルツボに入れて、高温室で450℃下4-5h焼結し、1000-1200℃まで昇温して15-20h焼結し、その後は室温まで下げ、焼いた物を挽いて粉にし、それでGd1-x-yLi3Mg2(NbO6)(BO3):xSm3+、yNa1+を得る。
(2)緑の蛍光材料の調製
a.BaCO3、SiO2およびTb2O3を取って、容器に入れてエタノールを添加し、混合を通じて、十分に研磨した後にルツボの中に入れて、ルツボを高温ストーブの中に移動し、窒素ガスの効用の下で、1200〜1300℃まで昇温して、3-6h焼結して、その窒素ガスの流量は30ml/minで、900℃まで下げて2時間焼結した後、冷却して中間体Ba1.94SiO4:0.06Tb3+を得る。上述のBaCO3、SiO2およびTb2O3のモル比は1-2:1-2:0.01-0.1であり、上述のBaCO3とエタノールの質量比は1:2-3である。
b.中間体Ba1.94SiO4:0.06Tb3+、α-Si3N4とCe2O3を混合してH3BO3を添加して、各成分を研磨した後モリブデンのルツボに入れて、モリブデンのルツボを高温ストーブに移動し、N2:H2=95:5の雰囲気、1400℃で3-6時間焼結して、気体の流量計は気体を25mm/min内にコントロールし、その後室温まで冷却して取り出し、粉体Ba0.92Si2O2N2:0.06Tb3+,0.02Ce3+を合成する。粉体をイソプロパノールの中に置いて、上述の粉体とイソプロパノールの質量比は1:1-2であり、超音波破損器で分散し、超音時間は1-2h、分散した粉体を乾燥し、窒素酸化物緑色蛍光粉体Ba0.92Si2O2N2:0.06Tb3+,0.02Ce3+を得る。記載されたBa1.94SiO4:0.06Tb3+、α-Si3N4およびH3B03の質量比は2-4:1-2:0.01-0.1であり、Tb元素とCe元素のモル比は3:1である。
(3)青い蛍光材料の調製
a.モル比が1-n:1:1:2:nのBaCO3,MgO,CaCO3,NH4H2PO4、Tm(NO3)3・5H2Oを瑪瑙研究体で混ぜ、複合助剤を入れて40-60min研磨し、取り出した後ルツボの中に入れて、まず900℃で2-3hあらかじめ焼き、自然で冷却した後、サンプルを取り出して、さらに40-60min研磨し、サンプルを再びルツボに入れて、N2:H2=95:5の雰囲気、1200℃で3-6h焼結し、その後は自然に室温まで冷却し、Ba1-nMgCa(PO4)2:nTm3+の青い蛍光粉末を得る。
b.青い蛍光粉末の変性、前調製したBa1-nMgCa(PO4)2:nTm3+に蒸留水を加えて、十分分散した後懸濁液になり、MgF2コロイド溶液を添加して、混ぜた後混合体になり、ボールグラインダーで30-60min分散した後、100℃で乾燥して、500℃で2-3h置き、変性の青い蛍光材料を得る。青色の蛍光粉末、蒸留水、MgF2コロイド溶液の質量比は1-2:2-3:0.05-0.5である。
(4)化学ガスクロマトグラフィーの沈積法で、第1層の赤い蛍光材料、第2層の緑の蛍光材料、第3層の青い蛍光材料はそれぞれLEDのデバイスに沈積して、LED蛍光フィルムを形成している。
- 赤色の蛍光材料の調製に特徴があり、そのうちx=0.02,y=0.02であり、手に入れた赤色の蛍光材料はGd0.96Li3Mg2(NbO6)(BO3):0.02Sm3+,0.02Na1+であり、この材料の粒の直径は10μmより小さく、そのうち1-6μmは75%を占め、青い蛍光材料の調製中n=0.03であり、手に入れた青い蛍光粉末はBa0.97MgCa(PO4)2:0.03Tm3+であり、複合助剤は割合1:1のH3BO3+BaF2で構成され、この複合助剤はBaCO3の質量の10%で、青い蛍光粉末の直径は10μmより小さく、そのうち1-5μmは70%を占めていることを特徴とする請求項3に記載のLED照明装置の製造方法。
- ステップ2のLEDの上で沈積した3層のLED蛍光フィルムを特徴とする請求項1に記載のLED照明装置の製造方法。
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