JP6885010B2 - Manufacturing method of electronic parts - Google Patents

Description

The present invention relates to a method for manufacturing an electronic component including a laminated body including alternately laminated dielectric layers and internal electrode layers.

Conventionally, as a document in which a method for manufacturing a multilayer ceramic capacitor as an electronic component is disclosed, for example, Japanese Patent Application Laid-Open No. 2012-134286 (Patent Document 1) can be mentioned. In the method for manufacturing a laminated ceramic capacitor disclosed in Patent Document 1, the paste is adhered to the end face of the laminated body having a substantially rectangular parallelepiped shape by immersing the paste contained in the glass. The paste adhering to the end face is dried and then baked to form a baked electrode layer forming a part of the external electrode on the end face. Then, the glass component raised on the surface of the baking electrode layer is removed.

Japanese Unexamined Patent Publication No. 2012-134286

However, in the method for manufacturing a multilayer ceramic capacitor disclosed in Patent Document 1, a sandblasting method is used when removing a glass component. In this sandblasting method, a plurality of laminated bodies are placed in a basket, and the basket is rotated while spraying abrasive powder from the outside of the basket. Since excessive force is applied to the laminated body by rotating the basket, chipping may occur in the laminated body, and the characteristics as a capacitor may not be satisfied.

The present invention has been made in view of the above problems, and an object of the present invention is an electron capable of modifying the surface of a baking electrode layer provided on a laminated body while suppressing cracking and chipping of the laminated body. The purpose is to provide a method for manufacturing parts.

The method for manufacturing an electronic component based on the present invention includes a first end surface and a second end surface located relative to the length direction, and a first side surface and a second side surface located relative to the width direction orthogonal to the length direction. , And the first main surface and the second main surface located relative to each other in the height direction orthogonal to the length direction and the width direction, and the first seizure electrode layer is provided on the first end surface. A step of putting a plurality of laminates provided with a second baking electrode layer on the second end surface and a plurality of media into a container, a step of applying vibration energy to the plurality of laminates and the plurality of media, The container includes a bottom portion and a peripheral wall portion connected to the peripheral edge of the bottom portion, and an annular virtual shape that surrounds the central axis of the bottom portion in the circumferential direction in a state before the container is vibrated. In the step of applying vibration energy to the plurality of laminated bodies and the plurality of media when the axes are virtualized, the laminated bodies and the media spirally surround the virtual axis along the axial direction of the virtual axis. Vibration is applied to the laminate and the media so as to draw a spiral locus.

In the method for manufacturing an electronic component based on the present invention, it is preferable that the frequency of vibration applied to the container is a value that resonates with the natural frequency of the container.

In the method for manufacturing an electronic component based on the present invention, the first seizure electrode layer and the second seizure electrode layer are made of any metal of Cu, Ag, Ni, Pd, Ag—Pd alloy, and Au. It is preferable to use one containing.

In the method for manufacturing an electronic component based on the present invention, the total volume of the plurality of laminates charged into the container is one of the total volumes of the plurality of media charged into the container. It is preferably / 2 or less.

According to the present invention, it is possible to provide a method for manufacturing an electronic component capable of modifying the surface of a baking electrode layer provided on a laminated body while suppressing cracking and chipping of the laminated body.

It is a perspective view of the multilayer ceramic capacitor manufactured according to the manufacturing method of the multilayer ceramic capacitor which concerns on Embodiment 1. FIG. FIG. 5 is a cross-sectional view taken along the line II-II of the monolithic ceramic capacitor shown in FIG. FIG. 3 is a cross-sectional view taken along the line III-III of the monolithic ceramic capacitor shown in FIG. It is a partial cross-sectional view which shows the detail of the baking electrode layer of the multilayer ceramic capacitor which concerns on Embodiment 1. FIG. It is a flow chart which shows the manufacturing method of the multilayer ceramic capacitor which concerns on Embodiment 1. FIG. It is a figure which shows the surface treatment apparatus for carrying out the surface treatment of the baking electrode layer shown in FIG. It is a top view of the stirring tank shown in FIG. It is sectional drawing of the stirring tank shown in FIG. It is a top view which shows the positional relationship between the stirring tank shown in FIG. 6 and an elastic member. It is a flow chart which shows the detail of the process which carries out the surface treatment of the baking electrode layer shown in FIG. It is a figure which shows the step which applies vibration energy to a plurality of laminated bodies and a plurality of media in the step of applying vibration to the stirring tank shown in FIG. 10. It is a partial cross-sectional view which shows the detail of the baking electrode layer of the multilayer ceramic capacitor manufactured according to the manufacturing method of the multilayer ceramic capacitor which concerns on Embodiment 2. FIG. It is sectional drawing of the multilayer ceramic capacitor manufactured according to the manufacturing method of the multilayer ceramic capacitor which concerns on Embodiment 3. FIG. It is a flow chart which shows the manufacturing method of the multilayer ceramic capacitor which concerns on Embodiment 3. It is a figure which shows the condition and result of the verification experiment which carried out to verify the effect of embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiment shown below, a multilayer ceramic capacitor is exemplified as an electronic component, and a manufacturing method of a multilayer ceramic capacitor is exemplified as a manufacturing method of an electronic component. Further, in the embodiments shown below, the same or common parts are designated by the same reference numerals in the drawings, and the description thereof will not be repeated.

(Embodiment 1)
(Multilayer ceramic capacitor)
First, prior to explaining the manufacturing method of the monolithic ceramic capacitor according to the embodiment of the present invention, the monolithic ceramic capacitor manufactured according to the manufacturing method will be described.

FIG. 1 is a perspective view of a multilayer ceramic capacitor manufactured according to the method for manufacturing a multilayer ceramic capacitor according to the first embodiment. FIG. 2 is a cross-sectional view taken along the line II-II of the multilayer ceramic capacitor shown in FIG. FIG. 3 is a cross-sectional view taken along the line III-III of the multilayer ceramic capacitor shown in FIG.

As shown in FIGS. 1 to 3, the multilayer ceramic capacitor 10 has a laminate (ceramic element) 12, a first external electrode 15, and a second external electrode 16.

The laminated body 12 has a substantially rectangular parallelepiped outer shape. The laminated body 12 includes a plurality of laminated dielectric layers 13 and a plurality of internal electrode layers 14. The laminated body 12 has a first main surface 12c and a second side surface 12d facing each other in the width direction W, and a first main surface 12a and a second main surface 12b facing each other in the height direction T orthogonal to the width direction W in the width direction. It includes a first end face 12e and a second end face 12f that face each other in the length direction L orthogonal to both W and the height direction T.

The laminated body 12 has a substantially rectangular parallelepiped outer shape, but it is preferable that the corners and ridges are rounded. The corner portion is a portion where the three surfaces of the laminated body 12 intersect, and the ridge portion is a portion where the two surfaces of the laminated body 12 intersect. Concavities and convexities may be formed on at least one of the first main surface 12a, the second main surface 12b, the first side surface 12c, the second side surface 12d, the first end surface 12e, and the second end surface 12f.

The external dimensions of the laminate 12 are, for example, that the dimension of the length direction L is 0.2 mm or more and 5.7 mm or less, the dimension of the width direction W is 0.1 mm or more and 5.0 mm or less, and the width direction W. The size of is 0.1 mm or more and 5.0 mm or less. The external dimensions of the monolithic ceramic capacitor 10 can be measured with a micrometer.

The laminated body 12 is divided into a pair of outer layer portions and inner layer portions in the width direction W. One of the pair of outer layer portions is a portion of the laminated body 12 including the first main surface 12a, and is between the first main surface 12a and the first internal electrode layer 141 closest to the first main surface 12a, which will be described later. It is composed of a dielectric layer 13 located at. The other of the pair of outer layer portions is a portion of the laminated body 12 including the second main surface 12b, and is between the second main surface 12b and the second internal electrode layer 142, which will be described later, which is closest to the second main surface 12b. It is composed of a dielectric layer 13 located at.

The inner layer portion is a region sandwiched between a pair of outer layer portions. That is, the inner layer portion is composed of a plurality of dielectric layers 13 that do not form the outer layer portion, and all the internal electrode layers 14.

The number of laminated dielectric layers 13 is preferably 20 or more and 1000 or less. The thickness of each of the pair of outer layer portions is preferably 30 μm or more and 850 μm or less. The thickness of each of the plurality of dielectric layers 13 contained in the inner layer portion is preferably 0.3 μm or more and 30 μm or less.

The dielectric layer 13 is composed of a perovskite-type compound containing Ba or Ti. As a material for forming the dielectric layer _13, it is possible to use a BaTiO _3, CaTiO 3, SrTiO ₃ or CaZrO ₃ dielectric ceramics mainly the like. Further, using a material in which Mn compound, Mg compound, Si compound, Fe compound, Cr compound, Co compound, Ni compound, Al compound, V compound, rare earth compound and the like are added to these main components as sub-components. May be good.

The plurality of internal electrode layers 14 include a plurality of first internal electrode layers 141 connected to the first external electrode 15, and a plurality of second internal electrode layers 142 connected to each of the second external electrodes 16.

The number of laminated layers of the plurality of internal electrode layers 14 is preferably 10 or more and 1000 or less. The thickness of each of the plurality of internal electrode layers 14 is preferably 0.3 μm or more and 1.0 μm or less.

As the material constituting the internal electrode layer 14, one kind of metal selected from the group consisting of Ni, Cu, Ag, Pd and Au can be used. The internal electrode layer 14 may contain dielectric particles having the same composition as the dielectric ceramics contained in the dielectric layer 13.

The first internal electrode layer 141 and the second internal electrode layer 142 are alternately arranged at equal intervals in the width direction W of the laminated body 12. Further, the first internal electrode layer 141 and the second internal electrode layer 142 are arranged so as to face each other with the dielectric layer 13 interposed therebetween.

The first internal electrode layer 141 has a first counter electrode portion facing the second internal electrode layer 142 and a first drawer drawn from the first counter electrode portion to the first end surface 12e side of the laminated body 12. It is composed of an electrode portion.

The second internal electrode layer 142 has a second opposed electrode portion facing the first internal electrode layer 141 and a second drawer drawn from the second opposed electrode portion to the second end surface 12f side of the laminated body 12. It is composed of an electrode portion.

Capacitance is formed by the position of the dielectric layer 13 between the counter electrode portion of the first internal electrode layer 141 and the counter electrode portion of the second internal electrode layer 142. This gives rise to the function of a capacitor.

In the laminated body 12, the position between the counter electrode portion and the first side surface 12c is the position between the first side margin and the position between the counter electrode portion and the second side surface 12d when viewed from the height direction T of the laminated body 12. Is the second side margin. Further, when viewed from the height direction T of the laminated body 12, the position between the counter electrode portion and the first end surface 12e is the first end margin, and the position between the counter electrode portion and the second end surface 12f is the second end. It is a margin.

The first end margin is composed of a first lead-out electrode portion of the first internal electrode layer 141 and a plurality of dielectric layers 13 adjacent thereto. The second end margin is composed of a second lead-out electrode portion of the second internal electrode layer 142 and a plurality of dielectric layers 13 adjacent thereto.

The first external electrode 15 is formed on the first end surface 12e. More specifically, the first external electrode 15 is formed so as to extend from the first end surface 12e to the first main surface 12a and the second main surface 12b and the first side surface 12c and the second side surface 12d.

The second external electrode 16 is formed on the second end surface 12f. More specifically, the second external electrode 16 is formed so as to extend from the second end surface 12f to the first main surface 12a and the second main surface 12b and the first side surface 12c and the second side surface 12d.

The first external electrode 15 includes a first baking electrode layer 15a as a base electrode layer, and a plating layer 15b and a plating layer 15c provided on the first baking electrode layer 15a.

The second external electrode 16 includes a second baking electrode layer 16a as a base electrode layer, and a plating layer 16b and a plating layer 16c provided on the second baking electrode layer 16a.

The first seizure electrode layer 15a and the second seizure electrode layer 16a include voids, glass, and metal. Examples of the metal contained in the first seizure electrode layer 15a and the second seizure electrode layer 16a include appropriate metals such as Ni, Cu, Ag, Pd, Au, and Ag—Pd alloys. As the metal, Cu and Ag having high malleability are preferably used. The metal contained in the first seizure electrode layer 15a and the second seizure electrode layer 16a can be confirmed by using a wavelength dispersive X-ray analyzer (WDX) after polishing the multilayer ceramic capacitor 10. At the time of polishing, for example, the multilayer ceramic capacitor 10 is polished to the center position in the width direction W to expose a cross section orthogonal to the width direction W.

The first seizure electrode layer 15a and the second seizure electrode layer 16a may be composed of a plurality of laminated layers. The first baking electrode layer 15a and the second baking electrode layer 16a are layers in which a conductive paste containing glass and metal is applied to the laminated body 12 and baked. The first baked electrode layer 15a and the second baked electrode layer 16a may be formed by firing at the same time as the internal electrode layer 14, or may be formed by firing the internal electrode layer 14 after firing.

The maximum thickness of the first seizure electrode layer 15a and the second seizure electrode layer 16a is preferably 10 μm or more and 200 μm or less. The thickness of the first seizure electrode layer 15a and the second seizure electrode layer 16a becomes thin at the corners of the laminated body 12.

The details of the first seizure electrode layer 15a and the second seizure electrode layer 16a will be described later with reference to FIG.

As the material constituting the plating layer 15b, the plating layer 15c, the plating layer 16b, and the plating layer 16c, one kind of metal selected from the group consisting of Ni, Cu, Ag, Pd, Au, and Sn, or this metal is used. It is composed of the containing alloy.

For example, the plating layer 15b and the plating layer 16b are Ni plating layers, and the plating layers 15c and 16c are, for example, Sn plating layers. The Ni plating layer has a function of preventing the base electrode layer from being eroded by solder when mounting the multilayer ceramic capacitor. The Sn plating layer has a function of improving the wettability with solder when mounting the multilayer ceramic capacitor and facilitating the mounting of the multilayer ceramic capacitor. The thickness of the plating layer per layer is preferably 1.5 μm or more and 15.0 μm or less. The plating layer may be composed of a single layer, or may be a Cu plating layer or an Au plating layer.

FIG. 4 is a partial cross-sectional view showing details of the baking electrode layer of the multilayer ceramic capacitor according to the first embodiment. The circular shape included in the first baking electrode layer 15a shown in FIG. 4 represents a void or glass. The details of the first seizure electrode layer 15a will be described with reference to FIG. Since the configuration of the second seizure electrode layer 16a is the same as that of the first seizure electrode layer 15a, the description thereof will be omitted.

As shown in FIG. 4, the first seizure electrode layer 15a has a first region 15a1 and a second region 15a2 from the laminated body 12 side toward the surface layer side of the first seizure electrode layer 15a.

The first region 15a1 contains a considerable amount of voids and glass. The first region 15a1 occupies most of the first seizure electrode layer 15a. Since the first region 15a1 contains voids, the first seizure electrode layer 15a has a cushioning property. As a result, it is possible to absorb the external impact applied to the monolithic ceramic capacitor 10.

In the second region 15a2, the density of the metal increases in the thickness direction from the surface layer. The second region 15a2 contains almost no glass and voids. The surface of the second region 15a2 is smoothly configured. The thickness of the second region 15a2 is 0.1 μm or more and 10.0 μm or less. By setting the thickness of 15a2 in the second region to 0.1 μm or more and forming a metal dense film on the surfaces of the first seizure electrode layer and the second seizure electrode layer, the plating property is improved and the penetration of plating is prevented. It can be suppressed and the reliability of the monolithic ceramic capacitor 10 can be improved. The second region 15a2 is formed by rubbing the media 20 (see FIG. 11) on the surface layer of the baking electrode using the surface treatment device 100 (see FIG. 6) as described later. Therefore, by setting the thickness of the second region 15a2 to 10 μm or less, damage to the laminated body 12 can be suppressed, and chipping and cracking of the laminated body 12 can be suppressed.

The thickness of the second region 15a2 can be confirmed by SEM observation after polishing the multilayer ceramic capacitor 10. Specifically, for example, by polishing the multilayer ceramic capacitor 10 to a position of about 1/2 of the dimension of the width direction W, the cross section along the length direction L and the height direction T is exposed, and the first end surface 12e The thickness from the corner portion connecting the first main surface 12a and the first main surface 12a to the apex portion of the second region 15a2 located on the corner portion is measured. It is preferable that the average value of the thickness of the second region 15a2 obtained from the ten multilayer ceramic capacitors 10 is the thickness of the second region 15a2.

The second region 15a2 covers the first region 15a1. By providing the second region 15a2 having high metal density on the surface layer side, the moisture resistance of the laminated body 12 can be improved. Further, since the surface of the second region 15a2 is smoothly formed, it is possible to suppress the formation of defects in the plating layer 15b and the plating layer 15c when the plating layer 15b and the plating layer 15c are formed. .. Further, the continuity of the plating layer 15b and the plating layer 15c can be improved.

The second region 15a2 is formed by subjecting the first baking electrode layer 15a and the second baking electrode layer 16a to surface treatment in the surface treatment step of the baking electrode layer described later.

(Manufacturing method of multilayer ceramic capacitors)
FIG. 5 is a flow chart showing a method for manufacturing a multilayer ceramic capacitor according to the first embodiment. A method for manufacturing a multilayer ceramic capacitor according to the first embodiment will be described with reference to FIG.

As shown in FIG. 5, when manufacturing the monolithic ceramic capacitor 10, first, a ceramic dielectric slurry is prepared in step S1. Specifically, a ceramic dielectric powder, an added powder, a binder resin, a solution, and the like are dispersed and mixed, whereby a ceramic dielectric slurry is prepared. The ceramic dielectric slurry may be either solvent-based or water-based. When the ceramic dielectric slurry is used as a water-based paint, a ceramic dielectric slurry is prepared by mixing a water-soluble binder, a dispersant, or the like with a dielectric raw material dissolved in water.

Next, in step S2, a ceramic dielectric sheet is formed. Specifically, the ceramic dielectric slurry is formed on a carrier film into a sheet using a die coater, a gravure coater, a microgravure coater, or the like and dried to form a ceramic dielectric sheet. The thickness of the ceramic dielectric sheet is preferably 3 μm or less from the viewpoint of miniaturization and high capacity of the multilayer ceramic capacitor 10.

Next, in step S3, a mother sheet is formed. Specifically, by applying the conductive paste to the ceramic dielectric sheet so as to have a predetermined pattern, a mother sheet having a predetermined internal electrode pattern is formed on the ceramic dielectric sheet. As a method for applying the conductive paste, a screen printing method, an inkjet method, a gravure printing method, or the like can be used. The thickness of the internal electrode pattern is preferably 1.5 μm or less from the viewpoint of miniaturization and high capacity of the multilayer ceramic capacitor 10. As the mother sheet, in addition to the mother sheet having the internal electrode pattern, a ceramic dielectric sheet that has not undergone the step S3 is also prepared.

Next, in step S4, a plurality of mother sheets are laminated. Specifically, a predetermined number of mother sheets, in which the internal electrode pattern is not formed and are composed of only ceramic dielectric sheets, are laminated. A predetermined number of mother sheets provided with an internal electrode pattern are laminated on the mother sheet. Further, a predetermined number of mother sheets, which are not formed with an internal electrode pattern and are composed only of ceramic dielectric sheets, are laminated on the mother sheet. As a result, a mother sheet group is formed.

Next, in step S5, the mother sheet group is crimped to form a laminated block. Specifically, the laminated block is formed by pressing the mother sheet group in the laminating direction and crimping it by a hydrostatic press or a rigid body press.

Next, in step S6, the laminated block is divided to form a laminated chip. Specifically, the laminated blocks are divided into a matrix by push-cutting, dicing, or laser cutting, and are individualized into a plurality of laminated chips.

Next, in step S7, barrel polishing of the laminated chips is performed. Specifically, the laminated chips are enclosed in a small box called a barrel together with media balls having a hardness higher than that of the dielectric material, and the laminated chips are polished by rotating the barrel. As a result, the corners and ridges of the laminated chips are rounded.

Next, in step S8, the laminated chips are fired. Specifically, the laminated chips are heated, whereby the dielectric material and the conductive material contained in the laminated chips are fired to form the laminated body 12. The firing temperature is appropriately set according to the dielectric material and the conductive material, and is preferably 900 ° C. or higher and 1300 ° C. or lower.

Next, in step S9, the conductive paste is applied to the first end surface 12e and the second end surface 12f of the laminate 12 by a dipping method or the like. The conductive paste contains a vanishing agent such as glass and resin in addition to the conductive fine particles and the like.

Next, in step S10, the conductive paste applied to the laminate 12 is dried. Specifically, the conductive paste is dried with hot air for about 10 minutes at a temperature of, for example, 60 ° C. or higher and 180 ° C. or lower.

Next, in step S11, the dried conductive paste is baked. The baking temperature is preferably 700 ° C. or higher and 900 ° C. or lower. In this baking step, a plurality of voids are formed in the baking electrode layer due to the disappearance of the vanishing agent. In the post-state of step S11), the baking electrode layer is in the state of the above-mentioned first region 15a1 from the laminated body 12 side to the surface layer side. That is, even on the surface layer side of the baking electrode layer, voids are formed and glass is contained.

Next, in step S12, the surface treatment of the baking electrode layer is performed. By stirring the laminate provided with the baking electrode layer and the media described below in the stirring tank 150 described later, the surface layer of the baking electrode layer is polished while rubbing the media against the surface layer of the baking electrode layer. As a result, the glass contained in the surface layer of the baking electrode is reduced, and the surface layer of the baking electrode layer is flattened. As a result, the state of the surface layer of the baking electrode layer is modified, and the above-mentioned second region 15a2 having a highly dense metal and a smooth surface is formed. Details of the surface treatment will be described with reference to FIGS. 6 to 10.

FIG. 6 is a diagram showing a surface treatment apparatus for performing the surface treatment of the baked electrode layer shown in FIG. FIG. 7 is a plan view of the stirring tank shown in FIG. FIG. 8 is a cross-sectional view of the stirring tank shown in FIG. FIG. 9 is a plan view showing the positional relationship between the stirring tank shown in FIG. 6 and the elastic member. The surface treatment apparatus 100 used in step S12 will be described with reference to FIGS. 6 to 9.

As shown in FIG. 6, the surface treatment device 100 includes a first base portion 110, a second base portion 120, a third base portion 130, a vibration receiving plate 140, a stirring tank 150 as a container, a drive motor 160, and an eccentric load 170. , A plurality of elastic members 180, a drive motor support unit 190, a detection unit 200 for detecting the vibration state of the stirring tank 150, and a drive motor control unit 210.

The first base portion 110 has a plate-like shape. The first base portion 110 constitutes the lower portion of the surface treatment device 100. The first base portion 110 is installed on the floor surface and maintains the levelness of the surface treatment device 100.

The second base portion 120 has a substantially rectangular parallelepiped shape. The second base portion 120 functions as a pedestal for supporting the load of the vibration receiving plate 140, the stirring tank 150, the drive motor 160 supported by the vibration receiving plate 140, and the eccentric load 170. The second base portion 120 is configured to be able to penetrate the drive motor 160.

The third base portion 130 has a plate-like shape. The third base portion 130 is placed on the second base portion 120. The third base portion 130 is configured to be able to penetrate the drive motor 160.

The first base portion 110, the second base portion 120, and the third base portion 130 may be formed of separate independent members, or may be integrally formed.

The vibration receiving plate 140 has a substantially plate-like shape. The vibration receiving plate 140 is supported by a plurality of elastic members 180. A drive motor support portion 190 is provided on the lower surface side of the vibration receiving plate 140. The drive motor support unit 190 supports the drive motor 160 to which the eccentric load 170 is rotatably attached. As a result, the load due to the drive motor 160 and the eccentric load 170 is applied to the vibration receiving plate 140 via the drive motor support portion 190.

Further, a stirring tank mounting portion 145 is provided on the upper surface side of the vibration receiving plate 140. The stirring tank 150 is placed on the stirring tank mounting portion 145.

As shown in FIGS. 6 to 8, the stirring tank 150 has a bottomed tubular shape. The stirring tank 150 has a bottom portion 151, a peripheral wall portion 152, a shaft portion 155, and a flange portion 156.

The bottom portion 151 has a substantially disk shape. The bottom portion 151 is formed flat. The bottom portion 151 does not have to be flat. The peripheral wall portion 152 is connected to the peripheral edge of the bottom portion 151. The peripheral wall portion 152 rises upward from the peripheral edge of the bottom portion 151. The peripheral wall portion 152 includes a curved portion 153 connected to the bottom portion 151 and a tubular portion 154 extending linearly along the vertical direction. A flange portion 156 projecting in the radial direction is provided at the upper end of the tubular portion 154.

The shaft portion 155 is provided at the center of the bottom portion 151. The shaft portion 155 extends along the vertical direction. The shaft portion 155 may not be provided.

Further, the shape of the stirring tank 150 is not limited to the bottomed cylinder shape, and may be a hemispherical shape or a bowl shape. When the stirring tank 150 has a hemispherical shape, the bottom portion 151 constitutes the lower side of the hemispherical shape, and the peripheral wall portion 152 constitutes the upper side of the hemispherical shape. Further, when the stirring tank 150 has a bowl shape, the bottom portion 151 has a curved shape that bulges downward.

As will be described later, a plurality of laminated chips on which a baking electrode layer is formed and a plurality of media are charged into the stirring tank 150.

The inner surface of the stirring tank 150 is preferably provided with a flexible coating layer such as urethane. In particular, when handling a large laminated chip having a length dimension larger than 2.0 mm, a width dimension larger than 1.2 mm, and a thickness dimension larger than 1.2 mm, there is a concern that the laminated chip may be chipped or cracked. Therefore, it is preferable to use an elastic member such as rubber as the coating layer.

On the other hand, when handling a small laminated chip having a length dimension of 2.0 mm or less, a width dimension of 1.2 mm or less, and a thickness dimension of 1.2 mm or less, there is little concern about cracking or chipping. The coating layer may be omitted.

The stirring tank 150 is preferably mounted on the stirring tank mounting portion 145 so as to be removable. When handling the small laminated chips as described above, the inside of the stirring tank 150 can be cleaned by removing the stirring tank 150. As a result, it is possible to prevent chips from being mixed.

The stirring tank 150, the stirring tank mounting portion 145, and the vibration receiving plate 140 may be formed separately or integrally.

As shown in FIGS. 6 and 9, the plurality of elastic members 180 are arranged at a predetermined pitch in the circumferential direction centered on the shaft portion 155 when viewed from the extending direction of the shaft portion 155. The plurality of elastic members 180 are fixed on the base portion 130.

As shown in FIG. 6, the drive motor 160 has a rotating shaft 161 extending in the vertical direction. The drive motor 160 rotates the rotary shaft 161 to rotate the eccentric load 170 attached to the rotary shaft 161 around the rotary shaft.

By rotating the eccentric load 170, the position of the center of gravity of the vibration receiving plate 140 fluctuates, so that the expansion and contraction of the plurality of elastic members 180 are biased. The stirring tank 150 can be vibrated as described above by utilizing the expansion and contraction bias of the plurality of elastic members 180.

The detection unit 200 detects the vibration state of the stirring tank 150. The detection result detected by the detection unit 200 is input to the drive motor control unit 210. As the detection unit 200, for example, an acceleration sensor or a laser displacement meter is used.

When an acceleration sensor is used as the detection unit 200, the vibration state of the stirring tank 150 can be detected by directly measuring the acceleration of the media during vibration. As the acceleration sensor, for example, GH313A or GH613 (both manufactured by KEYENCE) can be adopted as the sensor head, and GA-245 (manufactured by KEYENCE) can be adopted as the amplifier unit.

The acceleration of the media is preferably 2.5 G or more and 20.0 G or less. If the acceleration of the media is less than 2.5 G, sufficient energy for extending the metal contained in the baking electrode layer cannot be obtained. On the other hand, when the acceleration of the media is larger than 10.0 G, the damage to the laminated chips becomes large.

When a laser displacement meter is used as the detection unit 200, the vibration state of the stirring tank 150 can be detected by irradiating the stirring tank 150 with a laser and measuring the amount of movement of the stirring tank 150.

By measuring the acceleration of the media or the movement amount of the stirring tank 150 in this way, the vibration state of the stirring tank 150, more specifically, the frequency of the stirring tank 150 can be detected.

The drive motor control unit 210 controls the operation of the drive motor 160 based on the detection result detected by the detection unit 200.

FIG. 10 is a flow chart showing details of a step of performing the surface treatment of the baked electrode layer shown in FIG. The details of the step S12 for carrying out the surface treatment of the baking electrode layer will be described with reference to FIG.

As shown in FIG. 10, in the step S12 for carrying out the surface treatment of the baking electrode layer, first, in the step S121, the first end surface 12e and the second end surface 12f located relative to each other and the first end surface 12f located relative to each other. The side surface 12c and the second side surface 12d, as well as the first main surface 12a and the second main surface 12b located opposite to each other, the first end surface 12e is provided with the first seizure electrode layer 15a, and the second end surface 12f is the second. 2. A plurality of laminated bodies 12 provided with the baking electrode layer 16a and a plurality of media (not shown) are put into the stirring tank 150.

The media has a spherical shape. The diameter of the media is preferably smaller than the diagonal of the first end face 12e and the second end face 12f. With such a diameter, the media and the laminate can be easily separated by using a mesh-like sieve.

Specifically, the diameter of the media is preferably 0.2 mm or more and 2.0 mm or less, and preferably 0.4 mm or more and 1.0 mm or less.

As the material of the media, for example, tungsten (may be super steel containing cobalt and chromium) and zirconium can be used. The surface of the media is preferably smooth, and the surface roughness Sa of the media is preferably 200 μm or less.

The specific gravity of the media is preferably 5 or more and 18 or less. If the specific gravity is too small, the kinetic energy of the media becomes small, and the metal exposed on the surface layer of the baking electrode layer cannot be sufficiently extended. On the other hand, if the specific gravity is too large, the laminated body will be damaged.

The hardness of the media is preferably 1000 HV or more and 2500 HV or less in terms of Vickers hardness. If the hardness is too low, the media will crack. If the hardness is too high, the laminate will be damaged.

Further, the total volume of the plurality of laminated bodies 12 charged into the stirring tank 150 is preferably 1/2 or less, preferably 1/3 or less of the total volume of the plurality of media charged into the stirring tank 150. Is more preferable. If the amount of the plurality of laminated bodies 12 with respect to the plurality of media is increased too much, the workability by the media deteriorates, cracks occur at the corners of the laminated body 12, and the laminated bodies 12 are chipped or cracked.

Next, in step S122, vibration energy is applied to the plurality of laminated bodies 12 and the plurality of media by vibrating the stirring tank 150. Specifically, the surface treatment device 100 described above is used to vibrate the stirring tank 150.

FIG. 11 is a diagram showing a step of applying vibration energy to a plurality of laminated bodies and a plurality of media in the step of applying vibration to the stirring tank shown in FIG. As shown in FIG. 11, in the surface treatment device 100, the position of the center of gravity of the drive motor 160 and the vibration receiving plate 140 is displaced by rotating the eccentric load 170. As a result, the vibration receiving plate 140 is tilted, and the expansion and contraction of each of the plurality of elastic members 180 is biased. Further, as the vibration receiving plate 140 is tilted, the central axis C of the bottom portion 151 of the stirring tank 150 is also tilted.

Since the position of the eccentric load 170 changes continuously with the rotation, the inclination of the vibration receiving plate 140 changes according to the position of the eccentric load 170. As a result, the position where the expansion / contraction bias of the elastic member 180 becomes large also moves in the circumferential direction. As the plurality of elastic members 180 expand and contract in this way, vibration is propagated from the plurality of elastic members 180 to the stirring tank 150 so that the inclination direction of the central axis C of the bottom portion 151 continuously changes.

By continuously changing the inclination direction of the central axis C of the bottom portion 151, an annular virtual axis VL that surrounds the central axis C of the bottom portion 151 in the circumferential direction in the state before the stirring tank 150 is vibrated is virtualized. Vibration is applied to the laminate 12 and the media so that the laminate 12 and the media 20 spirally surround the virtual axis VL along the axial direction of the virtual axis VL.

The vibration of the stirring tank 150 is transmitted to the plurality of laminated bodies and the plurality of media put into the stirring tank 150, so that the plurality of laminated bodies and the plurality of media are stirred while rotating in a spiral shape. As a result, the media stretches the surface layer of the baking electrode layer while reducing the glass contained in the surface layer of the baking electrode layer. As a result, the state of the surface layer of the baking electrode layer is modified, and the above-mentioned second region 15a2 having a highly dense metal and a smooth surface is formed.

Further, although the inclination direction of the stirring tank 150 changes in the circumferential direction, the stirring tank 150 itself does not rotate around the central axis C, so that even when the laminated body comes into contact with the stirring tank 150. , Excessive force is not applied to the laminate from the stirring tank 150. As a result, cracking and chipping of the laminated body can be suppressed.

In the stirring tank 150, the farther away from the shaft portion 155 in the radial direction, the greater the vibration is transmitted to the laminated body and the media charged in the stirring tank 150. Further, since the bottom portion 151 is tilted and the shaft portion 155 is also tilted, the closer the shaft portion 155 is to any of the plurality of elastic members 180, the more likely it is to receive vibration from the adjacent elastic members 180.

Therefore, by providing a structure in which the plurality of laminates and the plurality of media are retained at positions radially separated from the shaft portion 155 in the stirring tank 150, the plurality of laminates and the plurality of media can be effectively treated. Can transmit vibration. As a result, the surface treatment of the baked electrode layer can be performed more efficiently.

Further, it is preferable to vibrate the stirring tank 150 so that the frequency of the stirring tank 150 resonates with the natural frequency of the stirring tank 150. The natural frequency is a frequency at which the vibration intensity becomes high, that is, the processing energy becomes high. By vibrating the stirring tank 150 so that the frequency of the stirring tank 150 becomes the natural frequency, the surface treatment of the baking electrode layer can be efficiently performed.

The frequency of the stirring tank 150 can be adjusted, for example, by changing the speed at which the eccentric load 170 is rotated by the drive motor 160. In order to make such an adjustment, the detection unit 200 detects the vibration state of the stirring tank 150.

When the detection unit 200 detects that the frequency of the stirring tank 150 deviates from the natural frequency, the drive motor control unit 210 determines that the frequency of the stirring tank 150 is the natural frequency of the stirring tank 150. The operation of the drive motor 160 is controlled so as to approach.

Next, as shown in FIG. 5 again, in step S13, the laminated body 12 having the baking electrode layer on which the second region 15a2 is formed is plated. Ni plating and Sn plating are performed on the baking electrode layer in this order to form a plating layer 15b and a plating layer 16b, and a plating layer 15c and a plating layer 16c. As a result, the first external electrode 15 and the second external electrode 16 are formed on the outer surface of the laminated body 12.

The monolithic ceramic capacitor 10 can be manufactured by going through the series of steps described above.

As described above, the method for manufacturing a multilayer ceramic capacitor according to the first embodiment includes a first end surface 12e and a second end surface 12f located relative to each other, a first side surface 12c and a second side surface 12d located relative to each other, and a second side surface 12d. The first main surface 12a and the second main surface 12b are located opposite to each other, the first end surface 12e is provided with the first seizure electrode layer 15a, and the second end surface 12f is provided with the second seizure electrode layer 16a. It includes a step of putting a plurality of laminated bodies 12 and a plurality of media into a container, and a step of applying vibration energy to the plurality of laminated bodies 12 and the plurality of media by vibrating the stirring tank 150.

In the step of applying vibration to the plurality of laminated bodies 12 and the plurality of media 20, by vibrating the stirring tank 150, the laminated body 12 and the media 20 move along the axial direction of the virtual axis VL described above. Vibration is applied to the laminated body 12 and the media 20 so as to draw a spiral locus that spirally surrounds the laminate 12. As described above, in the present embodiment, the stirring tank 150 is not rotated around the central axis C at the bottom as compared with the sandblasting method in which the basket is rotated around the axis while the polishing powder is sprayed on the laminate. Therefore, even when the plurality of laminated bodies 12 come into contact with the stirring tank 150, it is possible to prevent an excessive force from being applied to the laminated body from the stirring tank 150. As a result, cracking and chipping of the laminated body can be suppressed.

Further, by applying vibration energy to the plurality of laminated bodies 12 and the plurality of media, the laminated body provided with the first baking electrode layer 15a and the second baking electrode layer 16a and the media are agitated, and the first baking electrode is stirred. The surface layer of the baking electrode layer is polished while rubbing the media against the surface layers of the layer 15a and the second baking electrode layer 16a.

As a result, the amount of glass contained in the surface layers of the first seizure electrode layer 15a and the second seizure electrode layer 16a is reduced, the metal contained in the first seizure electrode layer 15a and the second seizure electrode layer 16a is stretched, and the first seizure electrode is extended. The surface layers of the layer 15a and the second seizure electrode layer 16a are flattened. As a result, the surfaces of the first seizure electrode layer 15a and the second seizure electrode layer 16a are smooth, and the metal density can be increased on the surface layer side of the first seizure electrode layer 15a and the second seizure electrode layer 16a. , The surfaces of the first seizure electrode layer 15a and the second seizure electrode layer 16a can be modified.

(Embodiment 2)
(Multilayer ceramic capacitor)
FIG. 12 is a partial cross-sectional view showing details of the seizure electrode layer of the multilayer ceramic capacitor manufactured according to the method for manufacturing a multilayer ceramic capacitor according to the second embodiment. A multilayer ceramic capacitor 10A manufactured according to the method for manufacturing a multilayer ceramic capacitor according to the second embodiment will be described with reference to FIG.

As shown in FIG. 12, the monolithic ceramic capacitor 10A according to the second embodiment has a first seizure electrode layer 15aA and a second seizure electrode layer (not shown) when compared with the monolithic ceramic capacitor 10 according to the first embodiment. ) Is different. Other configurations are almost the same. Since the configuration of the second seizure electrode layer is the same as that of the first seizure electrode layer 15aA, the description thereof will be omitted.

The first seizure electrode layer 15aA has a configuration in which the second region 15a2 comes into contact with the corners of the laminated body 12. As an example, only the second region 15a2 of the first seizure electrode layer 15aA is provided on the corner portion C1 connecting the first main surface 12a of the laminated body 12 and the first end surface 12e of the laminated body 12. There is. Here, the corner portion C1 is a first virtual line VL1 passing through a ridge line portion where the first main surface 12a and the first side surface 12c intersect when viewed from the width direction W, and the first end surface 12e and the first surface portion C1. It is a curved portion located inside the second virtual line VL2 that passes through the ridgeline portion where the side surfaces 12c intersect.

On the other hand, on the first end surface 12e side on the first main surface 12a of the laminated body 12, the first region 15a1 and the second region 15a2 of the first seizure electrode layer 15aA are provided in order from the laminated body 12 side. Although not shown in FIG. 12, similarly, on the first end surface 12e side on the second main surface 12b of the laminate 12, the first region 15a1 of the first seizure electrode layer 15aA and the first region 15a1 from the laminate 12 side. The second region 15a2 is provided in order. Further, on the first end surface 12e of the laminated body 12, a first region 15a1 and a second region 15a2 of the first seizure electrode layer 15aA are provided from the laminated body 12 side.

The first baking electrode layer 15aA is formed by applying it to the first end surface 12e by a conductive paste containing glass and metal and a dipping method or the like, drying it, and then baking it. When the conductive paste is applied to the first end surface 12e, it tends to become thin at the corners.

Therefore, the baking electrode layer formed when the conductive paste applied to the first end surface 12e is baked is also thinned at the corners. When the baked electrode layer formed at the corner is considerably thin, the second region 15a2 has a high metal density and a smooth surface by being stretched over a medium when the surface treatment of the baked electrode layer is performed. Only are formed.

On the other hand, the baked electrode layer formed on the portion other than the corner portion is thicker than the baked electrode layer formed on the corner portion. Therefore, when the surface treatment of the baked electrode layer is performed, a second region 15a2 having a high metal density and a smooth surface is formed only on the surface layer side, and voids and glass remain on the laminate 12 side. The first region 15a1 is formed.

In particular, when handling a small laminated chip having a length dimension of 1.6 mm or less, a width dimension of 0.8 mm or less, and a thickness dimension of 0.8 mm or less, surface treatment is performed as described above. The metal of the seizure electrode layer at the corners tends to extend easily, and the multilayer ceramic capacitor 10A as in the second embodiment tends to be formed.

Even in the case of the above configuration, the second region 15a2 having high metal density is provided on the surface layer side of the first seizure electrode layer and the second seizure electrode layer, so that the laminate 12 has moisture resistance. The sex can be improved.

Further, since the surface of the second region 15a2 is smoothly formed, it is possible to suppress the formation of defects in the plating layer 15b and the plating layer 15c when the plating layer 15b and the plating layer 15c are formed. Can be done. Further, the continuity of the plating layer 15b and the plating layer 15c can be improved.

Further, since the first region 15a1 contains a gap, the first seizure electrode layer 15a has a cushioning property in a portion other than the corner portion, and it is possible to absorb an external impact loaded on the multilayer ceramic capacitor 10A. it can.

(Manufacturing method of multilayer ceramic capacitors)
The method for manufacturing the multilayer ceramic capacitor 10A according to the second embodiment basically conforms to the manufacturing method for the multilayer ceramic capacitor 10 according to the first embodiment.

When manufacturing the monolithic ceramic capacitor 10A according to the method for manufacturing the monolithic ceramic capacitor 10A according to the second embodiment, substantially the same processing as in steps S1 to S8 according to the first embodiment is carried out.

Next, in the step according to the step S9 according to the first embodiment, the film thickness of the conductive paste on the corners of the laminated body 12 is a part of the first main surface 12a and the second main surface 12b, the first. The conductive paste is applied to the first end surface 12e side and the second end surface 12e so as to be thinner than the film thickness of the conductive paste applied to the side surface 12c and a part of the second side surface 12d, and the first end surface 12e and the second end surface 12f. Apply to the end face 12f side.

Next, substantially the same processing as in steps S10 and S11 according to the first embodiment was carried out so that the thickness of the portion corresponding to the corner portion of the laminated body 12 was thinner than the thickness of the other portion. A plurality of laminates provided with the first seizure electrode layer and the second seizure electrode layer are formed (prepared).

Next, in the step according to the step S12 according to the first embodiment, the plurality of laminated bodies and the plurality of media are put into the stirring tank 150. Then, by vibrating the stirring tank 150, vibration energy is applied to the plurality of laminated bodies 12 and the plurality of media. In the step of applying vibration energy to the plurality of laminated bodies 12 and the plurality of media, the baking electrode layer includes a second region 15a2 having a highly dense metal and a smooth surface, and a first region containing glass and voids. It forms a region 15a1. At this time, in the portion of the baked electrode layer corresponding to the corner portion of the laminated body 12, the second region 15a2 is formed so as to be in contact with the corner portion of the laminated body 12, and in the other portion, the laminated body 12 is formed. The first region 15a1 is formed on the side, and the second region 15a2 is formed so as to cover the first region 15a1.

Next, substantially the same processing as in step S13 according to the first embodiment is carried out. By going through the above steps, the monolithic ceramic capacitor 10A according to the second embodiment is manufactured.

As described above, even in the method for manufacturing the multilayer ceramic capacitor 10A according to the second embodiment, substantially the same effect as the manufacturing method for the multilayer ceramic capacitor 10 according to the first embodiment can be obtained.

(Embodiment 3)
(Multilayer ceramic capacitor)
FIG. 13 is a cross-sectional view of a multilayer ceramic capacitor manufactured according to the method for manufacturing a multilayer ceramic capacitor according to the third embodiment. A multilayer ceramic capacitor 10B manufactured according to the method for manufacturing a multilayer ceramic capacitor according to the third embodiment will be described with reference to FIG.

As shown in FIG. 13, the multilayer ceramic capacitor 10B according to the third embodiment is different from the multilayer ceramic capacitor 10 according to the first embodiment in the configurations of the first external electrode 15A and the second external electrode 16B. .. Other configurations are almost the same.

The first external electrode 15B includes a first baking electrode layer 15a, a resin layer 15d, a plating layer 15b, and a plating layer 15c in this order from the laminated body 12 side. The first baking electrode layer 15a and the resin layer 15d function as base electrodes. The resin layer 15d is provided between the first baking electrode layer 15a and the plating layer 15b.

The second external electrode 16B includes a second baking electrode layer 16a, a resin layer 16d, a plating layer 16b, and a plating layer 16c in this order from the laminated body 12 side. The second baking electrode layer 16a and the resin layer 16d function as base electrodes. The resin layer 16d is provided between the second baking electrode layer 16a and the plating layer 16b.

The resin layer 15d and the resin layer 16d contain conductive particles and a thermosetting resin. As the conductive particles, metal particles such as Cu or Ag can be used. As the thermosetting resin, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, a polyimide resin, or the like can be used.

The resin layer 15d and the resin layer 16d may be composed of a plurality of laminated layers. The thickness of the resin layer 15d and the resin layer 16d is preferably 10 μm or more and 90 μm or less.

The resin layer 15d and the resin layer 16d have a continuity of 80% or more and 90% or less on the corners of the laminated body 12. This continuity can be confirmed by SEM observation after polishing the multilayer ceramic capacitor 10B. At the time of polishing, for example, the multilayer ceramic capacitor 10 is polished to the center position in the width direction W to expose a cross section orthogonal to the width direction W.

Even in the case of the above configuration, the second region 15a2 having high metal density is provided on the surface layer side of the first seizure electrode layer and the second seizure electrode layer, so that the laminate 12 has moisture resistance. The sex can be improved.

Further, since the first region 15a1 contains a gap, the first seizure electrode layer 15a has a cushioning property in a portion other than the corner portion, so that the impact from the outside applied to the multilayer ceramic capacitor 10B can be absorbed. it can.

Further, since the surface of the second region 15a2 is smoothly configured, the first baking electrode layer 15a and the resin layer 15d are formed on the end side of the folded portion of the first external electrode 15B and the second external electrode 16B. Delamination is likely to occur at the boundary between the second baking electrode layer 16a and the resin layer 16d.

When the multilayer ceramic capacitor 10 is mounted on the mounting substrate, the mounting substrate may be bent, so that an external force may be applied to the multilayer ceramic capacitor 10B. Such an external force tends to be concentrated on the end side of the folded portion of the first external electrode 15B and the second external electrode 16B. When the external force is concentrated on the end of the folded-back portion, delamination is performed at the boundary between the first baking electrode layer 15a and the resin layer 15d and the boundary between the second baking electrode layer 16a and the resin layer 16d. , The stress acting on the laminated body 12 can be relaxed. As a result, it is possible to prevent the laminated body 12 from cracking.

(Manufacturing method of multilayer ceramic capacitors)
FIG. 14 is a flow chart showing a method for manufacturing a multilayer ceramic capacitor according to the third embodiment. A method for manufacturing a monolithic ceramic capacitor according to a third embodiment will be described with reference to FIG.

As shown in FIG. 14, when manufacturing the multilayer ceramic capacitor 10B according to the manufacturing method of the multilayer ceramic capacitor 10B according to the third embodiment, substantially the same processing as that of the first embodiment is carried out in steps S1 to S12. To do.

Next, in step S13A, a thermosetting resin containing conductive particles is applied onto the first baking electrode layer 15a and the second baking electrode layer 16a, and this is heated and cured. As a result, the conductive resin layers 15d and 16d are formed.

Next, in step S13B, substantially the same treatment as in step S13 according to the first embodiment is carried out to form a plating layer 15b and a plating layer 15c on the resin layer 15d, and a plating layer is formed on the resin layer 16d. 16b and the plating layer 16c are formed.

By going through the above steps, the monolithic ceramic capacitor 10B according to the third embodiment can be manufactured.

As described above, even in the method for manufacturing the multilayer ceramic capacitor 10B according to the third embodiment, substantially the same effect as the manufacturing method for the multilayer ceramic capacitor 10 according to the first embodiment can be obtained.

(Verification experiment)
FIG. 15 is a diagram showing the conditions and results of the verification experiment carried out to verify the effect of the embodiment. A verification experiment carried out to verify the effect of the embodiment will be described with reference to FIG.

As shown in FIG. 15, in conducting the verification experiment, the first seizure electrode layer 15a was provided on the first end surface 12e side, and the second seizure electrode layer 16a was provided on the second end surface 12f side of the laminated body 12. A plurality of laminated bodies 12 according to Examples 1 and 2 and Comparative Examples 1 to 7 were prepared. In the prepared state, the surface treatment is not performed on the first seizure electrode layer 15a and the second seizure electrode layer 16a.

The size of each laminated body 12 was 1.0 mm in length, 0.5 mm in width, and 0.5 mm in height.

The prepared laminates according to Examples 1 and 2 and Comparative Examples 1 to 7 were subjected to surface treatment of the baking electrode layer using the above-mentioned surface treatment device 100 to determine the presence or absence of cracks and to determine the presence or absence of cracks in the baking electrode layer. It was confirmed whether the surface was modified.

In Comparative Example 1, the total volume of the plurality of laminates charged into the stirring tank 150 was set to 1/2 of the total volume of the plurality of media charged into the stirring tank 150. Further, the processing time was set to 7 hours, and the frequency of the stirring tank 150 was set to 15 Hz, which is smaller than the natural frequency of the stirring tank 150.

In this case, after the surface treatment, no cracks were generated in the laminated body, but the surface condition was not improved. That is, the second region 15a2 could not be sufficiently formed.

In Comparative Example 2, the total volume of the plurality of laminates charged into the stirring tank 150 was set to 1/2 of the total volume of the plurality of media charged into the stirring tank 150. Further, the processing time was set to 7 hours, and the frequency of the stirring tank 150 was set to 35 Hz, which is higher than the natural frequency of the stirring tank 150.

In this case, after the surface treatment, no cracks were generated in the laminated body, but the surface condition was not improved. That is, the second region 15a2 could not be sufficiently formed.

In Comparative Example 3, the total volume of the plurality of laminates charged into the stirring tank 150 was set to 6/10 of the total volume of the plurality of media charged into the stirring tank 150. Further, the processing time was set to 3 hours, and the frequency of the stirring tank 150 was set to 23 Hz, which is the same as the natural frequency of the stirring tank 150.

In this case, after the surface treatment, cracks were generated in 4 of the 100 laminates. Moreover, the surface condition was not improved, and the second region 15a2 could not be sufficiently formed.

In Comparative Example 4, the total volume of the plurality of laminates charged into the stirring tank 150 was set to 6/10 of the total volume of the plurality of media charged into the stirring tank 150. Further, the processing time was set to 5 hours, and the frequency of the stirring tank 150 was set to 23 Hz, which is the same as the natural frequency of the stirring tank 150.

In this case, after the surface treatment, cracks were generated in 6 of the 100 laminates. Moreover, the surface condition was not improved, and the second region 15a2 could not be sufficiently formed.

In Comparative Example 5, the total volume of the plurality of laminates charged into the stirring tank 150 was set to 8/10 of the total volume of the plurality of media charged into the stirring tank 150. Further, the processing time was set to 5 hours, and the frequency of the stirring tank 150 was set to 23 Hz, which is the same as the natural frequency of the stirring tank 150.

In this case, after the surface treatment, cracks were generated in 35 of the 100 laminates. Moreover, the surface condition was not improved, and the second region 15a2 could not be sufficiently formed.

In Comparative Example 6, the total volume of the plurality of laminates charged into the stirring tank 150 was made the same as the total volume of the plurality of media charged into the stirring tank 150. Further, the processing time was set to 5 hours, and the frequency of the stirring tank 150 was set to 23 Hz, which is the same as the natural frequency of the stirring tank 150.

In this case, after the surface treatment, 41 out of 100 laminates were cracked. Moreover, the surface condition was not improved, and the second region 15a2 could not be sufficiently formed.

In Comparative Example 7, the total volume of the plurality of laminates charged into the stirring tank 150 was made the same as the total volume of the plurality of media charged into the stirring tank 150. Further, the processing time was set to 7 hours, and the frequency of the stirring tank 150 was set to 23 Hz, which is the same as the natural frequency of the stirring tank 150.

In this case, after the surface treatment, 58 out of 100 laminates were cracked. Moreover, the surface condition was not improved, and the second region 15a2 could not be sufficiently formed.

In Example 2, the total volume of the plurality of laminates charged into the stirring tank 150 was set to 1/3 or less (3/10) of the total volume of the plurality of media charged into the stirring tank 150. Further, the processing time was set to 5 hours, and the frequency of the stirring tank 150 was set to 23 Hz, which is the same as the natural frequency of the stirring tank 150.

In this case, after the surface treatment, no cracks were generated in the laminated body, and the surface condition was improved. The second region 15a2 could be sufficiently formed on the surface layer of the baking electrode layer.

In Example 1, the total volume of the plurality of laminates charged into the stirring tank 150 was set to 1/2 of the total volume of the plurality of media charged into the stirring tank 150. Further, the processing time was set to 5 hours, and the frequency of the stirring tank 150 was set to 23 Hz, which is the same as the natural frequency of the stirring tank 150.

In this case, after the surface treatment, no cracks were generated in the laminated body, and the surface condition was improved. The second region 15a2 could be sufficiently formed on the surface layer of the baking electrode layer.

As described above, as shown in the results of Examples 1 and 2, by using the method for manufacturing the multilayer ceramic capacitor according to the present embodiment, the laminated ceramic capacitor is provided in the laminated body while suppressing cracking and chipping. It can be said that the surface of the baked electrode layer can be modified. The surface of the baking electrode layer provided on the laminated body can be modified while suppressing cracking and chipping of the laminated body.

In carrying out the surface treatment, the total volume of the plurality of laminated bodies 12 charged into the stirring tank 150 is set to 1/2 or less of the total volume of the plurality of media charged into the stirring tank 150. It was confirmed that the workability by the media can be improved, and that the corners of the laminated body 12 can be prevented from being cracked or the laminated body 12 can be chipped or cracked. Further, by making the total volume of the plurality of laminated bodies 12 charged into the stirring tank 150 1/3 or less of the total volume of the plurality of media charged into the stirring tank 150, a good surface condition can be obtained. It was confirmed that it could be obtained.

By comparing Examples 1 and 2 with Comparative Examples 1 and 2 and setting the frequency of the stirring tank 150 to the unique frequency of the stirring tank 150, even if the processing time is shortened, the laminated body 12 It was possible to prevent cracks from occurring at the corners and chipping or cracking of the laminated body 12, and it was possible to modify the surface of the baking electrode layer. From this, by setting the frequency of the stirring tank 150 to the unique frequency of the stirring tank 150, the vibration can be effectively transmitted to a plurality of laminated bodies and a plurality of media, and the surface treatment can be efficiently performed. It can be said that it can be done.

In the above-described first to third embodiments, the internal structure of the multilayer ceramic capacitor is not limited to the structure disclosed in the first to third embodiments, and can be appropriately changed.

In the above-described first to third embodiments, the case where the electronic component is a laminated ceramic condenser has been described as an example, but the present invention is not limited to this, and various electronic components including external electrodes such as piezoelectric components, thermistors, and inductors. Electronic components can be adopted.

Although the embodiments of the present invention have been described above, the embodiments disclosed this time are exemplary in all respects and are not restrictive. The scope of the present invention is indicated by the claims and includes all modifications within the meaning and scope equivalent to the claims.

10, 10A, 10B multilayer ceramic capacitor, 12 laminate, 12a first main surface, 12b second main surface, 12c first side surface, 12d second side surface, 12e first end surface, 12f second end surface, 13 dielectric layer, 14 Internal electrode layer, 15, 15A, 15B 1st external electrode, 15a, 15aA 1st baking electrode layer 15a1 1st region, 15a2 2nd region, 15b, 15c plating layer, 15d, 16d resin layer, 16, 16B second External electrode, 16a 2nd baking electrode layer, 16b, 16c plating layer, 16d resin layer, 100 surface treatment device, 110 1st base part, 120 2nd base part, 130 3rd base part, 140 vibration receiving plate, 141th 1 internal electrode layer, 142 second internal electrode layer, 145 mounting part, 150 stirring tank, 151 bottom part, 152 peripheral wall part, 153 curved part, 154 tubular part, 155 shaft part, 156 flange part, 160 drive motor, 161 Rotating shaft, 170 eccentric load, 180 elastic member, 190 drive motor support, 200 detector, 210 drive motor control.

Claims (2)

The first and second end faces located relative to the length direction, the first side surface and the second side surface located relative to the width direction orthogonal to the length direction, and the length direction and the width direction. A first baking electrode layer including a first main surface and a second main surface located relative to each other in the height direction orthogonal to the above , and containing metal, glass and voids is provided on the first end surface, and the second end surface is provided with a first baking electrode layer. A step of charging a plurality of laminates provided with a second baking electrode layer containing metal, glass and voids, and a plurality of media into a container.
A step of applying vibration energy to the plurality of laminated bodies and the plurality of media by vibrating the container is provided.
As the container, a container including a bottom portion and a peripheral wall portion connected to the peripheral edge of the bottom portion is used.
When imagining an annular virtual axis that surrounds the central axis of the bottom in the circumferential direction in the state before the container is vibrated,
In the step of applying vibration energy to the plurality of laminated bodies and the plurality of media, the laminated body and the media draw a spiral locus that spirally surrounds the virtual axis along the axial direction of the virtual axis. By applying vibration to the laminate and the media, the first region including the glass and the voids, the first baking electrode layer, and the first baking electrode layer and the second baking electrode layer are subjected to vibration. It is located on the surface layer side of the second baking electrode layer and is provided so as to cover the first region, and forms a second region including a metal dense film.
The frequency of vibration applied to the container is a value that resonates with the natural frequency of the container.
The total volume of the plurality of laminates charged into the container is ½ or less of the total volume of the plurality of media charged into the container.
A method for manufacturing an electronic component, which uses a medium having a spherical shape and containing tungsten as the medium. The electronic component according to claim 1, wherein as the first seizure electrode layer and the second seizure electrode layer, one containing any metal of Cu, Ag, Ni, Pd, Ag—Pd alloy, and Au is used. Production method.

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