JP6884425B2 - Board splitting device - Google Patents

Description

The present invention relates to a substrate dividing device that divides a printed circuit board by cutting a plurality of bridge portions formed on the printed circuit board.

Conventionally, a substrate dividing device that separates and divides a plurality of circuit boards from one printed circuit board on which electronic components are mounted at high density is well known (see, for example, Patent Document 1 and the like). As the board dividing device, a press type or a router spindle type is mainly used. Among them, the router spindle type board dividing device is relatively easy to divide even if it is a combination of circuit boards (product parts) having a complicated shape, and the cost of the router bit (cutting blade) is low. Therefore, it is now widely used.

Japanese Unexamined Patent Publication No. 2005-67971

However, as shown in Patent Document 1, the prior art substrate dividing device cuts all the bridge portions in the printed circuit board in order by one spindle having a router bit at the tip of the printed circuit board. There is still room for improvement in that there is a limit to shortening the time required for split machining and improving machining efficiency only by increasing the moving speed of the spindle, and it is not possible to significantly reduce the time. It was.

An object of the present invention is to provide a substrate dividing device which has been improved by examining the above-mentioned current situation.

The invention of claim 1 is a mounting table on which a printed substrate is mounted, a router spindle type cutting mechanism that cuts a plurality of bridge portions formed on the printed board on the above-described stand, and the cutting mechanism orthogonal to each other. In a substrate dividing device provided on a base with a transfer mechanism that movably supports the cutting mechanism in the XYZ-axis direction, the transfer mechanism includes a Z-axis transfer unit that transfers the cutting mechanism in the Z-axis direction and the Z-axis. It has an X-axis transfer unit that transfers the transfer unit in the X-axis direction and a Y-axis transfer unit that transfers the X-axis transfer unit in the Y-axis direction, and there are a plurality of the Z-axis transfer units with the cutting mechanism. Each Z-axis transfer unit is attached to the X-axis transfer unit so that the arrangement interval between the adjacent Z-axis transfer units and the adjacent Z-axis transfer units can be adjusted in a wide or narrow range.

According to the invention of claim 2, in the substrate dividing device according to claim 1, the arrangement interval of the adjacent Z-axis transfer portions in the X-axis direction is set between the adjacent Z-axis transfer portions of the X-axis transfer portions. It is set by a spacer that is detachably fixed between the two, and the plurality of Z-axis transfer portions are configured to be integrally transferred by the X-axis transfer portion.

According to the third aspect of the present invention, in the substrate dividing device according to the first or second aspect, the plurality of cutting mechanisms are configured to be movable in the Z-axis direction independently of each other by the corresponding Z-axis transfer unit. It is said that.

The invention of claim 4 comprises a mounting table on which a printed circuit board is mounted, a router spindle-type cutting mechanism for cutting a plurality of bridge portions formed on the printed circuit board on the above-mentioned table, and the cutting mechanism orthogonal to each other. In the substrate dividing device provided on the base with a transfer mechanism that movably supports in the XYZ axis direction, the above-mentioned pedestal is open up and down, and the above-mentioned pedestal covers the upper surface opening. The printed circuit board is placed on the pallet plate, and a detection member for detecting the presence or absence of the pallet plate on the pallet plate is provided on the pallet plate, and the detection member is provided on the pallet. If the presence of the plate is not detected, the operation of the cutting mechanism and the transfer mechanism is prohibited.

According to the fifth aspect of the present invention, in the substrate dividing device according to the fourth aspect, a removal groove facing the one side edge of the printed circuit board placed on the pallet plate is formed on the surface of the pallet plate. That is.

According to a sixth aspect of the present invention, in the substrate dividing device according to the fourth or fifth aspect, a dust absorbing mechanism for sucking dust generated when each bridge portion of the printed circuit board is cut is continuously connected to the above-described stand. In the above-mentioned stand, a lower constriction funnel-shaped dust collecting cylinder communicating with the dust collecting duct of the dust collecting mechanism is detachably attached.

According to the present invention, there are a plurality of Z-axis transfer portions with a cutting mechanism, and each Z-axis transfer portion adjusts the arrangement interval between the X-axis transfer portion and the adjacent Z-axis transfer portion in the X-axis direction. Since it is attached so as to be possible, when dividing one printed circuit board, it is possible to execute the division processing at a plurality of places at the same time by a plurality of cutting mechanisms. Therefore, the time required for the divided processing of the printed circuit board can be shortened and the processing efficiency can be improved. Further, since the arrangement interval in the X-axis direction with the adjacent Z-axis transfer portions can be adjusted widely and narrowly, the X-axis direction with the adjacent Z-axis transfer portions can be adjusted according to the arrangement pattern of the bridge portions on the printed circuit board. The arrangement interval can be changed and adjusted to further improve processing efficiency.

Further, in the present invention, the mounting table is open vertically, and the printed circuit board is placed on the mounting table via a pallet plate that covers the opening on the upper surface thereof. A detection member for detecting the presence or absence of the pallet plate is provided on the mounting table, and if the detection member does not detect the presence of the pallet plate, the operation of the cutting mechanism and the transfer mechanism is prohibited. Even if the operator carelessly operates the cutting mechanism or the transfer mechanism when the pallet plate is not correctly placed on the table, the cutting mechanism or the transfer mechanism does not operate. Therefore, it is possible to prevent troubles caused by an operator's mistake in placing the pallet plate.

It is a schematic perspective view of the substrate division apparatus. It is the schematic perspective view of the substrate dividing apparatus which replaced the spacer. It is an enlarged front view of the Z-axis transfer part and the cutting mechanism. It is an explanatory view of the upper and lower pallet plates, (a) is a plan view of the upper pallet plate, (b) is a sectional view taken along line bb of (a), (c) is a plan view of the lower pallet plate, and (d) is a plan view of the lower pallet plate. It is a front view of the lower pallet plate. It is a front sectional view of the mounting table on which the upper and lower pallet plates are placed. It is a front sectional view of a mounting table. It is a top view of the printed circuit board. It is a functional block diagram of the board division apparatus. It is an enlarged plan view of the printed circuit board explaining the cutting mode of a bridge part.

Hereinafter, embodiments embodying the present invention will be described with reference to the drawings. The board dividing device 10 shown in FIGS. 1 and 2 is a router spindle type cutting that cuts a mounting table 12 on which the printed circuit board 1 is mounted and a plurality of bridge portions 2 formed on the printed circuit board 1 on the mounting table 12. A mechanism 13 and a transfer mechanism 14 that movably supports the cutting mechanism 13 in the XYZ axis directions orthogonal to each other are provided on the base 11.

The transfer mechanism 14 on the base 11 includes a Z-axis transfer unit 17 that transfers the cutting mechanism 13 in the Z-axis direction, an X-axis transfer unit 15 that transfers the Z-axis transfer unit 17 in the X-axis direction, and an X-axis transfer. A Y-axis transfer unit 16 that transfers the unit 15 in the Y-axis direction is provided. As shown in FIGS. 1 and 2, the Y-axis transfer unit 16 has a Y-axis drive main body 23 extending in the Y-axis direction and a Y-axis slider configured to be movable in the Y-axis direction along the Y-axis drive main body 23. It has 24 and. In the embodiment, a pair of guide rails 25 are arranged on both sides in the X-axis direction with the mounting table 12 interposed therebetween.

The gate-shaped frame 26 is arranged so as to straddle the pair of guide rails 25. The Y-axis drive main body 23 is arranged so as to be adjacent to one of the guide rails 25 and arranged in parallel. The lower ends of the legs 27 on both sides of the portal frame 26 in the X-axis direction are slidably fitted to the corresponding guide rails 26. The Y-axis slider 24 is attached to the leg portion 27 corresponding to one of the guide rails 25 in the portal frame 26 so as to be located on the Y-axis drive main body 23. The actuator (not shown) of the Y-axis drive main body 23 is configured to move the Y-axis slider 24 in the Y-axis direction, so that the portal frame 26 moves in the Y-axis direction along the pair of guide rails 25. There is.

The X-axis transfer unit 15 is fixed to an X-axis drive main body 18 extending in the X-axis direction, an X-axis slider 19 configured to be movable in the X-axis direction along the X-axis drive main body 18, and an X-axis slider 19. It is provided with a horizontally long guide plate 20. In the embodiment, the cross beam portion of the gate-shaped frame 26 supported by both leg portions 27 is configured in the X-axis drive main body 18. The guide plate 20 is formed with a guide groove 21 long in the X-axis direction. The guide groove hole 21 penetrates in the Y-axis direction. A Z-axis transfer portion 17 with a cutting mechanism 13 is attached to the guide plate 20 so as to be adjustable in position by bolts 22 and nuts (not shown). In this case, a plurality of Z-axis transfer portions 17 with a cutting mechanism 13 (two in the embodiment) are arranged side by side in the X-axis direction.

The Z-axis rail 32 and the guide plate 20, which are the components of each Z-axis transfer portion 17, are overlapped in the Y-axis direction, and bolts 22 are formed in the connecting hole formed in the Z-axis rail 32 and the guide groove hole 21 of the guide plate 20. The guide plate 20 of the X-axis transfer portion 15 and the Z-axis rail 32 are fastened together by inserting the bolt 22 and screwing the nut into the tip end side of the bolt 22. Therefore, if the nut is loosened a little, each Z-axis transfer portion 17 can slide and move together with the cutting mechanism 13 in the X-axis direction along the guide groove hole 21. In other words, the Z-axis transfer unit 17 with the cutting mechanism 13 can adjust the arrangement interval between the adjacent Z-axis transfer units 17 in the X-axis direction along the guide groove hole 21. With this configuration, when dividing one printed circuit board 1, the plurality of cutting mechanisms 13 can simultaneously execute the division processing at a plurality of locations, shortening the time required for the division processing of the printed circuit board 1 and improving the processing efficiency. Can be improved. Further, since the arrangement interval between the adjacent Z-axis transfer portions 17 in the X-axis direction can be widely adjusted, the arrangement with the adjacent Z-axis transfer portions 17 can be adjusted according to the arrangement pattern of the bridge portions 2 on the printed circuit board 1. The arrangement interval in the X-axis direction can be changed and adjusted, and the machining efficiency can be further improved.

The actuator (not shown) of the X-axis drive main body 18 moves the X-axis slider 19 in the X-axis direction, so that the Z-axis transfer portion 17 attached to the guide plate 20 moves in the X-axis direction along the X-axis drive main body 18. It is configured to move to. In the embodiment, since both the Z-axis transfer portions 17 are attached to the guide plate 20 that moves integrally with the X-axis slider 19, both the Z-axis transfer portions 17 are in the X-axis direction by the X-axis transfer portion 15. Is integrally transferred to. The Z-axis transfer portions 17 are not limited to being integrally transferred, and may be configured to be movable in the X-axis direction independently of each other.

In the embodiment, the arrangement interval of the adjacent Z-axis transfer portions 17 in the X-axis direction is set by the spacer 28 which is detachably fixed between the adjacent Z-axis transfer portions 17 of the X-axis transfer portions 15. ing. That is, the spacer 28 is detachably screwed between both Z-axis transfer portions 17 of the guide plate 20. In this case, each Z-axis rail 32 is slid and positioned so as to sandwich the spacer 28 from both sides in the X-axis direction, and then the guide plate 20 and the Z-axis rail 32 of the X-axis transfer portion 15 are fastened together. Therefore, the arrangement interval in the X-axis direction of the two Z-axis transfer portions 17 (cutting mechanism 13) is defined by the width of the spacer 28 in the X-axis direction. The two Z-axis transfer portions 17 (cutting mechanism 13) are located at positions equidistant from the center of the guide plate 20 in the X-axis direction. Further, by replacing the spacers 28 having different widths in the X-axis direction, it is possible to smoothly change and adjust the arrangement interval in the X-axis direction in the two Z-axis transfer portions 17 (cutting mechanism 13). With such a configuration, the arrangement interval in the X-axis direction in the adjacent Z-axis transfer portions 17 (cutting mechanism 13) can be easily set by the spacer 28, and the workability when adjusting the arrangement interval is good.

As shown in detail in FIG. 3, each Z-axis transfer unit 17 includes a Z-axis slider 31 to which a spindle 30 for rotatably gripping a router bit 29 (cutting blade) for dividing the printed circuit board 1 is attached, and a Z-axis slider. It is provided with a Z-axis rail 32 that movably supports 31 in the Z-axis direction. Although detailed illustration is omitted, the spindle 30 has a built-in rotary actuator for rotating the router bit 29. An elevating actuator that moves the Z-axis slider 31 in the Z-axis direction is connected to the Z-axis slider 31. The spindle 30 rotates the router bit 29 and the Z-axis slider 31 moves together with the router bit 29 and the spindle 30 in the Z-axis direction, so that the router bit 29 rotates and moves in the Z-axis direction. .. The cutting mechanism 13 is composed of a combination of the router bit 29 and the spindle 30.

The elevating actuator moves the Z-axis slider 31 in the Z-axis direction, and the rotary actuator rotates the spindle 30 about the axis, so that the router bit 29 moves in the Z-axis direction and rotates about the axis. There is. In the embodiment, each cutting mechanism 13 is configured to be movable in the Z-axis direction independently of each other by the corresponding Z-axis transfer unit 17. That is, each router bit 29 can rotate independently of each other and can move in the Z-axis direction by the corresponding spindle 30 and the Z-axis slider 31 (see FIG. 3). Therefore, in addition to simultaneously performing the division processing at a plurality of locations by the plurality of cutting mechanisms 13, each cutting mechanism 13 can rotate independently of each other according to the arrangement pattern of the bridge portion 2 on the printed circuit board 1. Moreover, it can be moved in the Z-axis direction, and the processing efficiency can be further improved. As can be seen from the above, the cutting mechanism 13 is three-dimensionally moved and positioned along the XYZ axis direction by driving the X-axis transfer unit 15, the Y-axis transfer unit 16, and the Z-axis transfer unit 17.

As shown in FIGS. 1 and 2, a box-shaped mounting table 12 opened vertically is provided between the pair of guide rails 25 in the base 11. The printed circuit board 1 is placed on the mounting table 12 via the pallet plates 33 and 34 that cover the upper surface opening 12a. There are two upper and lower pallet plates 33 and 34 of the embodiment, and by placing the stacked upper and lower pallet plates 33 and 34 on the mounting table 12, the upper surface opening 12a of the mounting table 12 is closed. The printed circuit board 1 is placed on the upper pallet plate 33.

As shown in FIG. 4, each of the pallet plates 33 and 34 is formed with a plurality of elongated holes 35 and 36 penetrating in the plate thickness direction. In the state where the pallet plates 33 and 34 are overlapped with each other, the corresponding elongated holes 35 and 36 of the pallet plates 33 and 34 are in a position where they communicate with each other. Then, in a state where the printed circuit board 1 is placed on the upper pallet plate 33, a set of elongated holes 35 and 36 communicating with each other faces the bridge portion 2 of the corresponding printed circuit board 1 (see FIG. 9).

Mounting holes 12c are formed in two upper edges of the mounting table 12 arranged in the X-axis direction. On the back surface of the lower pallet plate 33, fitting projections 38 (two in the embodiment) that fit into the mounting holes 12c of the mounting table 12 are formed so as to project downward. The lower pallet plate 34 is positioned with respect to the mounting table 12 by fitting the fitting projection 38 on the back surface of the lower pallet plate 34 into the mounting hole 12c of the mounting table 12.

The upper pallet plate 33 has a side edge that is long in the X-axis direction, and the lower pallet plate 34 has a protrusion pin 40 (two in the embodiment) that is erected on the side edge that is long in the X-axis direction. The joint groove 39 is formed so as to open outward. The upper pallet plate 33 is formed with mounting holes 41 (two in the embodiment) penetrating in the plate thickness direction. On the surface of the lower pallet plate 34, mounting pins 42 that fit into the mounting holes 41 formed in the upper pallet plate 33 are erected (two in the embodiment).

When the upper and lower pallet plates 33 and 34 are overlapped, the fitting groove 39 of the upper pallet plate 33 is fitted into the protruding pin 40 of the lower pallet plate 34, and the mounting hole 41 of the upper pallet plate 33 is fitted with the mounting hole 41 on the surface of the lower pallet plate 34. By fitting the mounting pins 42, the corresponding elongated holes 35, 36 of the pallet plates 33, 34 communicate with each other, and the upper pallet plate 33 is positioned with respect to the lower pallet plate 34.

On the upper pallet plate 33, two sets (four in total) of two sets of guide pins 44 for abutting the corners of the printed circuit board 1 are erected, and alignment holes (alignment holes) formed in the printed circuit board 1 (4) are erected. A plurality of alignment pins 45 that fit into the alignment pins 45 (not shown) are erected. By fitting the alignment pin 45 into the alignment hole of the printed circuit board 1 while bringing the corresponding corner portion of the printed circuit board 1 into contact with the pair of guide pins 44, the printed circuit board 1 with respect to the upper pallet plate 33 Positioning is done.

On the surface of the upper pallet plate 33, a removal groove 46 facing each other on one side edge of the printed circuit board 1 placed on the upper pallet plate 33 is formed. In the embodiment, a removal groove 46 long in the X-axis direction is formed at a position opposite to the two sets of guide pins 44. When the printed circuit board 1 is placed on the upper pallet plate 33, one side edge of the printed circuit board 1 faces (covers) the removal groove 46. When the printed circuit board 1 is removed from the upper pallet plate 33, since the removal groove 46 is recessed, it is easy to insert a finger into the portion of the removal groove 46, that is, the lower side of the printed circuit board 1. Therefore, the printed circuit board 1 can be easily removed.

As shown in FIG. 4, the area of the upper pallet plate 33 is set to be larger than that of the lower pallet plate 34. When the pallet plates 33 and 34 are overlapped with each other, one side of the upper pallet plate 33 near the removal groove 46 projects longer than the lower pallet plate 34. In other words, the front side of the upper pallet plate 33 protrudes further in front of the lower pallet plate 34 and the mounting table 12.

A notch 47 is formed on the front side of the two side edges of the lower pallet plate 34 arranged in the X-axis direction. When the pallet plates 33 and 34 are overlapped with each other, the back surface of the upper pallet plate 33 is exposed at the notch 47. By loosening and removing the two set screws 43 and then inserting a finger into the notch 47, the upper pallet plate 33 can be independently grasped and removed.

A pallet sensor 48 as a detection member for detecting the presence or absence of the upper and lower pallet plates 33 and 34 on the mounting table 12 is provided on the outer side of the mounting table 12 on the front side. In the embodiment, when the upper and lower pallet plates 33 and 34 are positioned with respect to the mounting table 12 and correctly mounted, the detection unit of the pallet sensor 48 comes into contact with the front side (protruding portion) of the back surface of the upper pallet plate 33. The pallet sensor 48 is turned on and is configured to allow the cutting mechanism 13 and the transfer mechanism 14 to operate. Further, if the pallet sensor 48 does not abut on the front side of the back surface of the upper pallet plate 33 and does not detect the presence of the upper pallet plate 33, the operation of the cutting mechanism 13 and the transfer mechanism 14 is prohibited. There is. Therefore, even if the operator carelessly operates the cutting mechanism 13 or the transfer mechanism 14 in a state where the upper and lower pallet plates 33 and 34 are not correctly mounted on the mounting table 12, the pallet sensor 48 is the upper pallet plate. Since the presence of 33 is not detected, the cutting mechanism 13 and the transfer mechanism 14 do not operate. Therefore, it is possible to prevent troubles caused by misplacement of the upper and lower pallet plates 33 and 34 of the operator.

As shown in FIGS. 5 and 6, a dust absorbing mechanism 49 for sucking dust generated when each bridge portion 2 of the printed circuit board 1 is cut is continuously connected to the mounting table 12. The dust collecting mechanism 49 includes a dust collecting main body 50 in which a dust collecting pump or a dust collecting blower (not shown) is incorporated, and a dust collecting duct 51 connecting the dust collecting main body 50 and the lower surface opening of the mounting table 12. The dust collecting main body 50 communicates with the lower surface opening 12b of the mounting table 12 via the dust collecting duct 51.

A dust collecting cylinder 52 communicating with the dust collecting duct 51 of the dust collecting mechanism 49 is detachably mounted in the mounting table 12. In other words, the dust collecting cylinder 52 is housed in the mounting table 12 so as to be fitted. The dust collecting cylinder 52 has a funnel-shaped (inverted quadrangular pyramid-shaped) shape with a lower constriction, and is open at the top and bottom. The lower opening of the dust collecting cylinder 52 faces the lower surface opening 12b of the mounting table 12, and the upper opening faces the upper surface opening 12a of the mounting table 12. At the time of cutting each bridge portion 2 on the printed circuit board 1, the dust suction pump or the dust suction blower of the dust suction main body 50 is activated, and the dust suction cylinder 52 having a funnel-shaped lower constriction, the lower surface opening 12b of the mounting table 12 and the dust suction duct 51 Then, the dust is sucked into the dust suction main body 50. In this case, by operating the dust absorbing main body 50, a negative pressure is generated in the mounting table with the upper and lower pallet plates 33 and 34 and the printed circuit board 1 placed on the mounting table 12, and the upper and lower pallet plates 33 and 34 are printed. A suction force acts in the direction in which the substrate 1 and the substrate 1 are attracted to the lower surface opening 12b of the mounting table 12. As a result, the upper and lower pallet plates 33 and 34 and the printed circuit board 1 are stably held on the mounting table 12. Further, since the dust collecting cylinder 52 is constricted and funnel-shaped, the dust can be easily collected toward the lower surface opening 12b of the mounting table 12 without accumulating the dust on the lower surface corner of the mounting table 12, and the dust can be collected. Performance can be improved.

A handle 53 is attached to the inner wall of the dust collecting cylinder 52. The handle 53 of the embodiment is two long-screw bolts, which are screwed and fixed to the inner wall of the dust absorbing cylinder 52. When the dust absorbing cylinder 52 is taken in and out of the mounting table 12, the two handles can be picked up and put in and out with good workability. Since the dust collecting cylinder 52 can be taken out, it is easy to clean the mounting table 12 and the dust collecting cylinder 52.

As shown in FIG. 7, the printed circuit board 1 has a form in which a product portion 4 (circuit board) and an unnecessary portion 5 are connected by a plurality of bridge portions 2. Slits 3 are intermittently formed around the manufacturing portion 4 and the unnecessary portion 5. By cutting the plurality of bridge portions 2 with the router bits 29 of each cutting mechanism 13, the printed circuit board 1 is divided into a plurality of product portions 4 (circuit boards). In the printed circuit board 1 of FIG. 7, the alignment hole into which the alignment pin 45 on the upper pallet plate 33 is fitted is not shown.

FIG. 8 shows a functional block diagram of the controller 56 mounted on the board dividing device 10. The controller 56 mainly controls the overall operation of each of the cutting mechanism 13 and the transfer mechanism 14, and although detailed illustration is omitted, it stores control programs and data in addition to a CPU that executes various arithmetic processes and controls. It is equipped with a ROM for storing data, a RAM for temporarily storing control programs and data, an input / output interface, and the like.

The controller 56 includes an X-axis drive main body 18 of the X-axis transfer unit 15, a Y-axis drive main body 23 of the Y-axis transfer unit 16, a plurality of (two in the embodiment) Z-axis transfer units 17, and a pallet sensor as a detection member. 48, the dust collecting main body 50, the start button 57, the end button 58, the emergency stop button 59, and the like are electrically connected. The controller 56 of the embodiment prohibits the operation of the cutting mechanism 13 and the transfer mechanism 14 unless the pallet sensor 48 comes into contact with the front side of the back surface of the upper pallet plate 33 and detects the presence of the upper pallet plate 33. Take control.

In the embodiment, due to the operation of the X-axis transfer unit 15 and the Y-axis transfer unit 16, the cutting start point 54 adjacent to each bridge unit 2 in a state where the router bit 29 of each cutting mechanism 13 does not contact the printed circuit board 1 (FIG. The Z-axis transfer unit 17 with the cutting mechanism 13 is moved horizontally to just above (see 9). Next, the router bits 29 of each cutting mechanism 13 are lowered and inserted into the elongated holes 35 and 36 located below the cutting start point 54 by the operation of the corresponding Z-axis transfer unit 17. Then, by the operation of the X-axis transfer unit 15 and the Y-axis transfer unit 16, the router bit 29 of each cutting mechanism 13 moves to the cutting end point 55 while rotating along the longitudinal direction of the elongated holes 35 and 36. , The bridge portion 2 is cut. After that, the router bit 29 of each cutting mechanism 13 is raised by the operation of the corresponding Z-axis transfer unit 17, and then moves to the next cutting start point 54 by the operation of the X-axis transfer unit 15 and the Y-axis transfer unit 16. .. By repeating such a process, the product part 4 and the unnecessary part 5 of the printed circuit board 1 are finally separated.

The configuration of each part in the present invention is not limited to the illustrated embodiment, and various changes can be made without departing from the spirit of the present invention.

1 Printed circuit board 2 Bridge part 10 Board division device 12 Mounting stand 12a Top surface opening 12b Bottom surface opening 13 Cutting mechanism 14 Transfer mechanism 15 X-axis transfer unit 16 Y-axis transfer unit 17 Z-axis transfer unit 18 X-axis drive body 21 Guide groove Hole 28 Spacer 29 Router bit 30 Spindle 33 Upper pallet plate 34 Lower pallet plate 46 Removal groove 48 Pallet sensor 49 Dust collection mechanism 52 Dust collection cylinder

Claims (6)

A mounting table on which a printed circuit board is mounted, a router spindle-type cutting mechanism that cuts a plurality of bridge portions formed on the printed circuit board on the above-mentioned table, and the cutting mechanism that can be moved in the XYZ axis directions orthogonal to each other. In the board dividing device provided on the base with a transfer mechanism supporting the
The transfer mechanism includes a Z-axis transfer unit that transfers the cutting mechanism in the Z-axis direction, an X-axis transfer unit that transfers the Z-axis transfer unit in the X-axis direction, and an X-axis transfer unit that transfers the X-axis transfer unit in the Y-axis direction. Has a Y-axis transfer section
There are a plurality of the Z-axis transfer units with the cutting mechanism, and each Z-axis transfer unit can widely and narrowly adjust the arrangement interval of the X-axis transfer unit with the adjacent Z-axis transfer unit in the X-axis direction. It is attached like
Board splitting device. The arrangement interval of the adjacent Z-axis transfer portions in the X-axis direction is set by a spacer that is detachably fixed between the adjacent Z-axis transfer portions of the X-axis transfer portions. The Z-axis transfer units are configured to be integrally transferred by the X-axis transfer unit.
The substrate dividing device according to claim 1. Each of the plurality of cutting mechanisms is configured to be movable in the Z-axis direction independently of each other by the corresponding Z-axis transfer unit.
The substrate dividing device according to claim 1 or 2. A mounting table on which a printed circuit board is mounted, a router spindle-type cutting mechanism that cuts a plurality of bridge portions formed on the printed circuit board on the above-mentioned table, and the cutting mechanism that can be moved in the XYZ axis directions orthogonal to each other. In the board dividing device provided on the base with a transfer mechanism supporting the
The above-mentioned pedestal is open vertically, and the printed circuit board is placed on the above-mentioned pedestal via a pallet plate covering the upper surface opening of the pallet. A detection member for detecting the presence or absence of a plate is provided on the above-mentioned stand, and if the detection member does not detect the presence of the pallet plate, the operation of the cutting mechanism and the transfer mechanism is prohibited. Yes,
Board splitting device. On the surface of the pallet plate, removal grooves facing each other on one side edge of the printed circuit board placed on the pallet plate are formed.
The substrate dividing device according to claim 4. A dust-absorbing mechanism for sucking dust generated when each bridge portion of the printed circuit board is cut is connected to the above-mentioned stand, and a lower constriction funnel communicating with the dust-absorbing duct of the above-mentioned stand is connected to the above-mentioned stand. The shape of the dust collecting cylinder is detachably attached,
The substrate dividing device according to claim 4 or 5.

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