JPH11114894A - Printed circuit board dividing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To uniformly keep dividing accuracy and quality by providing a router to perform dividing work on a positioned printed circuit board, a sensor to detect a plate thickness of the printed circuit board and a control part to control the dividing router. SOLUTION: A base board plate thickness detecting sensor 8 measure a plate thickness of a dividing object base board 2, and supplies a measuring signal to a controller 6 to control operation of a dividing device. A finish detecting sensor 12 detects a finish condition of the dividing object base board 2, that is, the size of the dividing object base board 2, and supplies a detecting signal to the controller 6 to control operation of the dividing device. The controller 6 inputs a measuring signal on the basis of the measuring signal of the base board plate thickness detecting sensor 8, and indicates a dividing condition suitable for the dividing object base board 2, that is, a rotating speed and a feed speed of a spindle to the spindle 4, and controls so as to maintain accuracy of dividing work constant. This dividing condition is a moving speed of the spindle 4 and a rotating speed of a router 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the division of a printed circuit board on which electronic components are mounted, and more particularly, to minimizing the stress generated at the connection between the mounted electronic components when dividing the printed circuit board into a predetermined shape. And a printed circuit board dividing apparatus for dividing the printed circuit board.

[0002]

2. Description of the Related Art As a conventional printed circuit board dividing device,
As described in JP-A-5-175632, there is a method of dividing a printed circuit board by pressing a blade and using the blade as a fulcrum.

[0003]

However, in the conventional printed circuit board dividing apparatus, since the division is performed under a predetermined dividing condition, the thickness of the printed circuit board and the mounting position of the electronic components are varied, and the printed circuit board is divided. If the divisional printed circuit board is divided under certain divisional conditions when the board thickness is greater than or equal to the divisional condition, the electronic components mounted on the divided printed circuit board may be subjected to excessive stress. May be transported. That is, there is a problem that uniform division quality cannot be obtained, and the division accuracy of the division device is reduced.

Further, if the same cutting tool is continuously divided, the cutting tool is deteriorated with an increase in the number of divisions, and an excessive stress is applied to the electronic components mounted on the divided printed circuit board. There is a possibility that uniform division quality cannot be obtained and the division accuracy of the division device is reduced.

In the conventional printed circuit board dividing apparatus, there is no means for confirming the finished state of the printed circuit board. In the state of being divided into individual pieces, it is impossible to perform additional processing on the defective portion, so that the printed circuit board is re-manufactured, which requires a great deal of cost and labor.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and eliminates a variation in division accuracy due to a change in the thickness of a printed circuit board and a mounting position of an electronic component, and an additional operation due to deterioration of a cutting tool. It is an object of the present invention to provide a printed circuit board dividing apparatus which relieves defects in the above, improves the yield, and improves the working efficiency of the dividing apparatus.

[0007]

According to the present invention, there is provided a router for positioning a printed circuit board on which electronic components are mounted at a predetermined position, and performing a division process on the positioned printed circuit board. A sensor that detects the thickness of the printed circuit board, and a control unit that receives the output of the sensor, obtains a dividing condition corresponding to the thickness of the printed circuit board, that is, determines a rotation speed and a feed speed of the spindle, and controls the dividing router. In addition, the stress applied to the printed circuit board and the mounted electronic components when the printed circuit board is divided can be minimized, so that the printed circuit board is always divided uniformly. In addition, by synchronizing the splitting conditions such as the spindle rotation speed and feed speed with the timing of the router re-polishing instruction in accordance with the increase in cutting force, variations in work quality due to router deterioration are eliminated, and the same We divide by condition.

Further, before starting the division work, there is provided a mechanism for detecting a finished state of the printed circuit board in advance, determining a defective portion of the finished state, and determining whether or not the router can be used by additional processing by a router. And a control device for automatically controlling a series of these operations, thereby relieving defective substrates, increasing the number of boards to be removed, and improving work efficiency.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings.

FIG. 1 is a schematic sectional view of an embodiment of a printed circuit board dividing apparatus according to the present invention.

The printed circuit board dividing device in the present embodiment is
This is suitable for a dividing device for cutting a printed circuit board on which electronic components are mounted.

More specifically, as shown in FIG. 1, the substrate 2 to be divided is placed in the division chamber 13, and the substrate thickness detecting sensors 8 are arranged above and below the divided substrate.

A finish detection sensor 12 for detecting the finished state of the substrate 2 to be divided is arranged in the division chamber 13, and measures the finished state of the substrate 2 to be divided.

In the embodiment, the substrate thickness detecting sensor 8 and
A laser sensor is used as the finish detection sensor 12. The substrate thickness detecting sensor 8 measures the thickness of the substrate 2 to be divided and supplies a measurement signal to the controller 6 which controls the operation of the dividing device. The finish detection sensor 12 detects the finished state of the substrate 2 to be divided, that is, the size of the substrate 2 to be divided, and supplies a detection signal to the controller 6 that controls the operation of the dividing device.

On the basis of the detection signal, the controller 6 inputs the detection signal, obtains a difference between a measured dimension and a reference dimension of the substrate 2 to be divided, creates additional processing data, that is, position data to be deleted, And control is performed so as to relieve the board in which the board external dimension defect has occurred.

Based on the measurement signal of the substrate thickness detecting sensor 8, the controller 6 inputs the measurement signal and instructs the spindle 4 on division conditions suitable for the substrate 2 to be divided, that is, the rotation speed and the feed speed of the spindle. Then, control is performed so as to maintain the accuracy of the division work constant.

The dividing conditions include the moving speed of the spindle 4, the number of rotations of the router 3, and the like.

It should be noted that the substrate thickness measurement display meter 5 displays the thickness of the divided substrate 2 by inputting the measurement signal, and is not necessarily provided.

The data supply computer 7 supplies data such as the mounting position of the electronic component 1 mounted on the divided substrate 2 to the controller 6.

FIG. 2 is a view showing variations in processing accuracy due to an increase in cutting length and stress (strain) generated on a printed circuit board in a method in which the blade 9 and the like are pressed against the substrate 2 to be divided.

In the method in which the blade 9 and the like are pressed against the substrate 2 to be divided, the stress applied to the electronic component 1 is measured using a strain gauge 10. Since 244 με is added, there is a possibility that the electronic component is destroyed.

FIG. 3 is a diagram showing variations in processing accuracy due to an increase in cutting length and stress (strain) generated on a printed circuit board in the division method described in the present invention.

The present invention is a means for solving the above-mentioned problem. By changing the dividing conditions such as the moving speed of the spindle 4 and the number of rotations of the router 3, the stress becomes 71.4 με. It is about one-fourth compared to.

FIG. 4 is a view showing a state in which a variation in processing accuracy due to an increase in the cutting length and a stress (strain) generated on a printed circuit board are measured while the router 3 is polished again in the division method described in the present invention. It is.

When a substrate having a thickness of 4.0 mm is continuously cut, a cutting accuracy of 40 μm is obtained by cutting about 70 m. The increase in the cutting resistance generated due to the life of the router 3 described in the present invention is detected, and when it exceeds the set value, the control unit 6 is instructed to stop the apparatus, and the router 3 is polished again.
By synchronizing the control of the cutting resistance described above and the changing of the division conditions such as the rotation speed and the feed speed of the spindle 4 according to the thickness of the printed circuit board 2, the processing accuracy is 40 μm.
Becomes about 170 m, which is about 2.3 times longer than continuous cutting. According to the present invention, the provision of the measurement of the cutting resistance value prevents the printed board 2 and the electronic component 1 from being broken by excessive stress. Furthermore, since the router 3 is repolished without using it until its complete life, it can be said that it is an economical use.

FIG. 5 is a diagram showing a method of additional processing for the poorly finished printed circuit board 2, a manufacturing process flow of the printed circuit board 2, and a dividing work process flow.

As shown in FIG. 5A, the finish detection by the finish detection sensor 12 is performed by the finish detection sensor 1.
2 is performed.

When the printed circuit board 2 having an abnormal outer dimension is measured, the outer dimension becomes L '. Finish detection sensor 12 outputs measured value L ′ to controller 6 as a detection signal. The controller 6 compares the detection signal with the value of the reference external dimension that has been input in advance, and instructs the spindle 4 to perform additional processing based on the comparison signal. As a result, the spindle 4 operates to delete the portion (hatched portion) of the substrate 2 to be printed, so that it is possible to always perform uniform processing on the printed substrate 2 having slightly different sizes.

FIG. 5B shows a flow of a main manufacturing process of the printed circuit board 2. When a defective finish of the outer shape of the printed circuit board 2 is found in the check b11 after the board dividing b10 shown in the flow, the printed circuit board 2 is divided into individual pieces. The printed circuit board 2 that has been used becomes unusable, so that the printed circuit board 2 is reproduced. In other words, the process is performed from the pattern formation b1 in the previous process shown in the flow, and a great deal of cost and man-hours are required.

FIG. 5 (c) is a flowchart of the working process of the dividing apparatus described in the present invention. First, the finished state c1 is confirmed, and the presence or absence of additional processing c2 is determined. If there is additional processing, the additional processing is performed according to the procedure described in FIG. If no additional processing is required, measure the thickness of the printed circuit board 2 c3
Then, the dividing condition c4 corresponding to the thickness of the printed circuit board 2, that is, the number of rotations and the feed speed of the spindle 4 is obtained, and the stress applied to the printed circuit board 2 and the mounted electronic component 1 can be minimized, and the uniform Can be divided into

[0031]

According to the present invention, at the time of division, the thickness of the printed circuit board to be divided and the life of the cutting tool are detected without manual operation, and the dividing condition is changed based on the instruction of the controller to perform the dividing operation. Thereby, the division accuracy and quality can be kept uniform.

Further, by providing means for detecting the finished state of the outer shape at the time of dividing the printed circuit board and performing additional processing, defective finishing can be relieved, the yield can be improved, and the printed circuit board can be remanufactured. It is possible to eliminate the occurrence of additional work.

Further, since the dividing conditions such as the feed speed and the number of revolutions of the spindle can be varied according to the state of the substrate to be divided, the working time can be greatly reduced, and at the same time,
Since the cutting tool is used while detecting the cutting resistance of the cutting tool and re-polishing, the cutting tool can be used economically.

Since the accuracy of division is improved and checking and correcting operations in subsequent steps are eliminated, work efficiency can be greatly improved.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of an embodiment of a printed circuit board dividing apparatus according to the present invention.

FIG. 2 is a diagram showing a variation in processing accuracy due to an increase in a cutting length and a stress (strain) generated in a printed circuit board in a method in which a blade 9 or the like is pressed against a substrate 2 to be divided and divided.

FIG. 3 is a diagram showing a variation in processing accuracy due to an increase in a cutting length and a stress (strain) generated in a printed circuit board.

FIG. 4 shows a variation in processing accuracy due to an increase in cutting length and a stress (strain) generated on a printed circuit board in a division method.
FIG. 3 is a diagram showing a state in which the measurement is performed while the router 3 is polished again.

FIG. 5 is a diagram illustrating a method of additional processing for a printed board having a poor finish, a manufacturing process flow of the printed circuit board, and a dividing operation process flow.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Printed circuit board 3 Router (cutting tool) 4 Spindle 5 Board thickness measurement display meter 6 Controller 7 Data supply computer 8 Board thickness detection sensor 9 Blade 10 Strain gauge 11 Division position 12 Finish detection sensor 13 Division room

Claims (3)

[Claims] In a method of dividing a printed circuit board provided with processing lines for dividing the board into a plurality of units in advance,
A router for positioning a printed circuit board on which electronic components are mounted at a predetermined position and performing a division process on the positioned printed circuit board, a sensor for detecting the thickness of the printed circuit board, and inputting an output of the sensor for printing. A control unit is provided for controlling the dividing router, which determines a dividing condition according to a board thickness, that is, a spindle rotation speed and a feed speed, and minimizes a stress applied to the printed board and the mounted electronic components when the printed board is divided. A printed circuit board dividing apparatus characterized in that the printed circuit board is divided uniformly. 2. The printed circuit board dividing apparatus according to claim 1, wherein an increase in cutting resistance generated due to the life of the router is detected, and when the cutting resistance exceeds a set value, an instruction is given to the control unit.
By stopping the device and re-polishing the router, the control of the cutting resistance described above and the change of division conditions such as the rotation speed and the feed speed of the spindle according to the thickness of the printed circuit board are performed in synchronization with each other, so that the router is Long life and minimized stress applied to printed circuit board and mounted electronic components when dividing printed circuit board, providing uniform cutting quality at all times, and always dividing under the same conditions Printed circuit board dividing device. 3. A printed circuit board dividing apparatus according to claim 1, further comprising a mechanism for detecting a finished state of the printed circuit board before starting the dividing operation, so as to detect a defective portion of the finished state of the outer shape. To automatically control the judgment means for judging the presence / absence and whether or not it can be used by additional processing by the router and the processing means for performing additional processing on them to relieve defects in the previous process and improve the yield A printed circuit board dividing apparatus characterized by the above-mentioned.