JP6860562B2 - 電子デバイス製造において基板を搬送するためのロボットアセンブリ、基板処理装置、及び方法 - Google Patents

電子デバイス製造において基板を搬送するためのロボットアセンブリ、基板処理装置、及び方法 Download PDF

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JP6860562B2
JP6860562B2 JP2018520529A JP2018520529A JP6860562B2 JP 6860562 B2 JP6860562 B2 JP 6860562B2 JP 2018520529 A JP2018520529 A JP 2018520529A JP 2018520529 A JP2018520529 A JP 2018520529A JP 6860562 B2 JP6860562 B2 JP 6860562B2
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idler
drive
arm
robot
assembly
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Expired - Fee Related
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Japanese (ja)
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JP2018535548A5 (cg-RX-API-DMAC7.html
JP2018535548A (ja
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ポール ズィー． ウィルト，
ポール ズィー． ウィルト，
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Applied Materials Inc
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Applied Materials Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J5/00—Manipulators mounted on wheels or on carriages
    • B25J5/02—Manipulators mounted on wheels or on carriages travelling along a guideway
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/104—Programme-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons
    • B25J9/1045—Programme-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons comprising tensioning means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2018520529A 2015-10-23 2016-09-28 電子デバイス製造において基板を搬送するためのロボットアセンブリ、基板処理装置、及び方法 Expired - Fee Related JP6860562B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/921,806 US9799544B2 (en) 2015-10-23 2015-10-23 Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing
US14/921,806 2015-10-23
PCT/US2016/054093 WO2017069920A1 (en) 2015-10-23 2016-09-28 Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing

Publications (3)

Publication Number Publication Date
JP2018535548A JP2018535548A (ja) 2018-11-29
JP2018535548A5 JP2018535548A5 (cg-RX-API-DMAC7.html) 2020-08-27
JP6860562B2 true JP6860562B2 (ja) 2021-04-14

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JP2018520529A Expired - Fee Related JP6860562B2 (ja) 2015-10-23 2016-09-28 電子デバイス製造において基板を搬送するためのロボットアセンブリ、基板処理装置、及び方法

Country Status (6)

Country Link
US (1) US9799544B2 (cg-RX-API-DMAC7.html)
JP (1) JP6860562B2 (cg-RX-API-DMAC7.html)
KR (1) KR102182483B1 (cg-RX-API-DMAC7.html)
CN (1) CN108028215B (cg-RX-API-DMAC7.html)
TW (1) TWI704038B (cg-RX-API-DMAC7.html)
WO (1) WO2017069920A1 (cg-RX-API-DMAC7.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10043689B2 (en) * 2015-06-05 2018-08-07 Hirata Corporation Chamber apparatus and processing system
TWI707754B (zh) 2016-06-28 2020-10-21 美商應用材料股份有限公司 包括間隔上臂與交錯腕部的雙機器人以及包括該者之方法
US10453725B2 (en) 2017-09-19 2019-10-22 Applied Materials, Inc. Dual-blade robot including vertically offset horizontally overlapping frog-leg linkages and systems and methods including same
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
US11850742B2 (en) 2019-06-07 2023-12-26 Applied Materials, Inc. Dual robot including splayed end effectors and systems and methods including same
KR102211252B1 (ko) * 2019-06-26 2021-02-04 세메스 주식회사 기판 처리 장치
US11565402B2 (en) * 2020-03-09 2023-01-31 Applied Materials, Inc. Substrate transfer devices, systems and methods of use thereof
CN113675119A (zh) * 2020-05-15 2021-11-19 拓荆科技股份有限公司 基片传输模块及半导体处理系统
CN118952179B (zh) * 2024-08-27 2025-05-02 中科芯微智能装备(沈阳)有限公司 传动装置、真空机械手及真空机械手的传动方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0123025Y1 (ko) * 1992-09-28 1998-10-01 이범창 차량 배기가스의 소음저감구조
WO1997010079A1 (en) 1995-09-13 1997-03-20 Silicon Valley Group, Inc. Concentric dual elbow
JP2003209156A (ja) * 2002-01-17 2003-07-25 Juki Corp 基板搬送装置
US8960099B2 (en) 2002-07-22 2015-02-24 Brooks Automation, Inc Substrate processing apparatus
US7905960B2 (en) 2004-03-24 2011-03-15 Jusung Engineering Co., Ltd. Apparatus for manufacturing substrate
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
CN1942288B (zh) 2005-02-12 2010-12-22 应用材料公司 一种多轴真空电机组件
WO2007061603A2 (en) 2005-11-21 2007-05-31 Applied Materials, Inc. Methods and apparatus for transferring substrates during electronic device manufacturing
US7955043B2 (en) * 2006-05-29 2011-06-07 Ulvac, Inc. Substrate transfer apparatus
JP5185932B2 (ja) 2006-08-11 2013-04-17 アプライド マテリアルズ インコーポレイテッド ロボット・リスト・アセンブリの為の方法および装置
US8419341B2 (en) 2006-09-19 2013-04-16 Brooks Automation, Inc. Linear vacuum robot with Z motion and articulated arm
WO2008111410A1 (ja) 2007-03-14 2008-09-18 Kabushiki Kaisha Yaskawa Denki 基板搬送ロボット
WO2008150484A1 (en) 2007-05-31 2008-12-11 Applied Materials, Inc. Methods and apparatus for extending the reach of a dual scara robot linkage
JP4824645B2 (ja) 2007-08-03 2011-11-30 株式会社アルバック 基板搬送装置
KR101190872B1 (ko) 2008-02-26 2012-10-12 삼성테크윈 주식회사 기판 이송장치
US8777547B2 (en) 2009-01-11 2014-07-15 Applied Materials, Inc. Systems, apparatus and methods for transporting substrates
CN102349146B (zh) 2009-01-11 2013-09-18 应用材料公司 用于制造至机器人及所述机器人的电末端执行器的电连接的系统、设备及方法
JP5581338B2 (ja) 2009-01-11 2014-08-27 アプライド マテリアルズ インコーポレイテッド 電子デバイス製造において基板を搬送するためのロボットシステム、装置、および方法
CN102709221A (zh) 2011-06-28 2012-10-03 清华大学 一种平面三自由度晶圆传输装置
US9076830B2 (en) 2011-11-03 2015-07-07 Applied Materials, Inc. Robot systems and apparatus adapted to transport dual substrates in electronic device manufacturing with wrist drive motors mounted to upper arm
US20130149076A1 (en) 2011-12-12 2013-06-13 Applied Materials, Inc. Fully-independent robot systems, apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
US9117865B2 (en) 2012-04-12 2015-08-25 Applied Materials, Inc. Robot systems, apparatus, and methods having independently rotatable waists
JP6285926B2 (ja) * 2012-07-05 2018-02-28 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ブーム駆動装置、マルチアームロボット装置、電子デバイス処理システム、および電子デバイス製造システムにおいて基板を搬送するための方法
JP6382213B2 (ja) 2012-11-30 2018-08-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ モータモジュール、多軸モータ駆動アセンブリ、多軸ロボット装置、並びに、電子デバイス製造のシステム及び方法
TWI614102B (zh) 2013-03-15 2018-02-11 應用材料股份有限公司 基板沉積系統、機械手臂運輸設備及用於電子裝置製造之方法
JP6594304B2 (ja) 2013-10-18 2019-10-23 ブルックス オートメーション インコーポレイテッド 処理装置
US9724834B2 (en) 2014-01-05 2017-08-08 Applied Materials, Inc. Robot apparatus, drive assemblies, and methods for transporting substrates in electronic device manufacturing

Also Published As

Publication number Publication date
CN108028215B (zh) 2022-07-29
CN108028215A (zh) 2018-05-11
WO2017069920A1 (en) 2017-04-27
TW201725099A (zh) 2017-07-16
KR20180061393A (ko) 2018-06-07
TWI704038B (zh) 2020-09-11
JP2018535548A (ja) 2018-11-29
US20170117171A1 (en) 2017-04-27
KR102182483B1 (ko) 2020-11-24
US9799544B2 (en) 2017-10-24

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