JP6853273B2 - ニューラルネットワークと順物理モデルを半導体用途に組み込んだシステムおよび方法 - Google Patents

ニューラルネットワークと順物理モデルを半導体用途に組み込んだシステムおよび方法 Download PDF

Info

Publication number
JP6853273B2
JP6853273B2 JP2018563511A JP2018563511A JP6853273B2 JP 6853273 B2 JP6853273 B2 JP 6853273B2 JP 2018563511 A JP2018563511 A JP 2018563511A JP 2018563511 A JP2018563511 A JP 2018563511A JP 6853273 B2 JP6853273 B2 JP 6853273B2
Authority
JP
Japan
Prior art keywords
image
neural network
sample
input
inverse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018563511A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019525450A5 (enExample
JP2019525450A (ja
Inventor
ジン チャン
ジン チャン
クリス バスカー
クリス バスカー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Corp filed Critical KLA Corp
Publication of JP2019525450A publication Critical patent/JP2019525450A/ja
Publication of JP2019525450A5 publication Critical patent/JP2019525450A5/ja
Application granted granted Critical
Publication of JP6853273B2 publication Critical patent/JP6853273B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/82—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using neural networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/0499—Feedforward networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/241—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
    • G06F18/2413—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches based on distances to training or reference patterns
    • G06F18/24133—Distances to prototypes
    • G06F18/24143—Distances to neighbourhood prototypes, e.g. restricted Coulomb energy networks [RCEN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G06N3/0455—Auto-encoder networks; Encoder-decoder networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/0464—Convolutional networks [CNN, ConvNet]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/0475—Generative networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/06—Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons
    • G06N3/063—Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons using electronic means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/088—Non-supervised learning, e.g. competitive learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/0895—Weakly supervised learning, e.g. semi-supervised or self-supervised learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/094—Adversarial learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/764—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • Artificial Intelligence (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Data Mining & Analysis (AREA)
  • Computing Systems (AREA)
  • General Health & Medical Sciences (AREA)
  • Software Systems (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Computational Linguistics (AREA)
  • Molecular Biology (AREA)
  • Mathematical Physics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Multimedia (AREA)
  • Medical Informatics (AREA)
  • Databases & Information Systems (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Biology (AREA)
  • Neurology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2018563511A 2016-06-01 2017-06-01 ニューラルネットワークと順物理モデルを半導体用途に組み込んだシステムおよび方法 Active JP6853273B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662344214P 2016-06-01 2016-06-01
US62/344,214 2016-06-01
US15/609,009 2017-05-31
US15/609,009 US10346740B2 (en) 2016-06-01 2017-05-31 Systems and methods incorporating a neural network and a forward physical model for semiconductor applications
PCT/US2017/035494 WO2017210455A1 (en) 2016-06-01 2017-06-01 Systems and methods incorporating a neural network and a forward physical model for semiconductor applications

Publications (3)

Publication Number Publication Date
JP2019525450A JP2019525450A (ja) 2019-09-05
JP2019525450A5 JP2019525450A5 (enExample) 2020-07-30
JP6853273B2 true JP6853273B2 (ja) 2021-03-31

Family

ID=60479143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018563511A Active JP6853273B2 (ja) 2016-06-01 2017-06-01 ニューラルネットワークと順物理モデルを半導体用途に組み込んだシステムおよび方法

Country Status (8)

Country Link
US (1) US10346740B2 (enExample)
EP (1) EP3465552B1 (enExample)
JP (1) JP6853273B2 (enExample)
KR (1) KR102213730B1 (enExample)
CN (1) CN109313724B (enExample)
IL (1) IL262787B (enExample)
TW (1) TWI715773B (enExample)
WO (1) WO2017210455A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220121956A1 (en) * 2020-10-16 2022-04-21 Samsung Electronics Co., Ltd. Method of training deep learning model for predicting pattern characteristics and method of manufacturing semiconductor device

Families Citing this family (133)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10373055B1 (en) * 2016-05-20 2019-08-06 Deepmind Technologies Limited Training variational autoencoders to generate disentangled latent factors
US10181391B2 (en) * 2016-05-26 2019-01-15 Nanojehm Inc. Image processing system and method of processing images
US10197908B2 (en) 2016-06-21 2019-02-05 Lam Research Corporation Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling framework
US10504004B2 (en) * 2016-09-16 2019-12-10 General Dynamics Mission Systems, Inc. Systems and methods for deep model translation generation
DE112016007498B4 (de) * 2016-12-06 2020-11-26 Mitsubishi Electric Corporation Untersuchungseinrichtung und untersuchungsverfahren
US11237872B2 (en) 2017-05-23 2022-02-01 Kla-Tencor Corporation Semiconductor inspection and metrology systems for distributing job among the CPUs or GPUs based on logical image processing boundaries
US11282695B2 (en) * 2017-09-26 2022-03-22 Samsung Electronics Co., Ltd. Systems and methods for wafer map analysis
TWI653605B (zh) 2017-12-25 2019-03-11 由田新技股份有限公司 利用深度學習的自動光學檢測方法、設備、電腦程式、電腦可讀取之記錄媒體及其深度學習系統
US20210271968A1 (en) * 2018-02-09 2021-09-02 Deepmind Technologies Limited Generative neural network systems for generating instruction sequences to control an agent performing a task
EP3531205A1 (en) 2018-02-22 2019-08-28 ASML Netherlands B.V. Control based on probability density function of parameter
CN111788883B (zh) * 2018-02-26 2021-11-05 株式会社高迎科技 部件贴装状态的检查方法、印刷电路板检查装置及计算机可读记录介质
US10795346B2 (en) 2018-03-13 2020-10-06 Applied Materials, Inc. Machine learning systems for monitoring of semiconductor processing
US10789703B2 (en) * 2018-03-19 2020-09-29 Kla-Tencor Corporation Semi-supervised anomaly detection in scanning electron microscope images
KR20200123858A (ko) 2018-03-21 2020-10-30 케이엘에이 코포레이션 합성 이미지를 사용한 머신 러닝 모델 트레이닝
KR102565278B1 (ko) 2018-03-26 2023-08-09 삼성전자주식회사 영상 분할 방법, 영상 분할 장치, 및 영상 분할을 위한 학습 방법
US10670536B2 (en) 2018-03-28 2020-06-02 Kla-Tencor Corp. Mode selection for inspection
US10599951B2 (en) * 2018-03-28 2020-03-24 Kla-Tencor Corp. Training a neural network for defect detection in low resolution images
US10572697B2 (en) 2018-04-06 2020-02-25 Lam Research Corporation Method of etch model calibration using optical scatterometry
US11921433B2 (en) 2018-04-10 2024-03-05 Lam Research Corporation Optical metrology in machine learning to characterize features
KR102812035B1 (ko) 2018-04-10 2025-05-22 램 리써치 코포레이션 레지스트 및 에칭 모델링
US11460753B2 (en) 2018-05-10 2022-10-04 The Board Of Trustees Of The Leland Stanford Junior University Systems and methods for activation functions for photonic neural networks
EP3791332A4 (en) * 2018-05-10 2022-03-09 The Board of Trustees of the Leland Stanford Junior University TRAINING PHOTONIC NEURAL NETWORKS BY IN SITU BACK PROPAGATION
US10824909B2 (en) 2018-05-15 2020-11-03 Toyota Research Institute, Inc. Systems and methods for conditional image translation
US12020167B2 (en) 2018-05-17 2024-06-25 Magic Leap, Inc. Gradient adversarial training of neural networks
CN110555800A (zh) * 2018-05-30 2019-12-10 北京三星通信技术研究有限公司 图像处理装置及方法
US10592635B2 (en) 2018-05-31 2020-03-17 International Business Machines Corporation Generating synthetic layout patterns by feedforward neural network based variational autoencoders
CN110555340B (zh) * 2018-05-31 2022-10-18 赛灵思电子科技(北京)有限公司 神经网络计算方法和系统及相应的双神经网络实现
US10713569B2 (en) 2018-05-31 2020-07-14 Toyota Research Institute, Inc. System and method for generating improved synthetic images
US10621301B2 (en) 2018-06-06 2020-04-14 International Business Machines Corporation Coordinates-based variational autoencoder for generating synthetic via layout patterns
WO2019233738A1 (en) * 2018-06-08 2019-12-12 Asml Netherlands B.V. Metrology apparatus and method for determining a characteristic of one or more structures on a substrate
EP3579052A1 (en) * 2018-06-08 2019-12-11 ASML Netherlands B.V. Metrology apparatus and method for determining a characteristic of one or more structures on a substrate
US11315231B2 (en) 2018-06-08 2022-04-26 Industrial Technology Research Institute Industrial image inspection method and system and computer readable recording medium
US10810460B2 (en) * 2018-06-13 2020-10-20 Cosmo Artificial Intelligence—AI Limited Systems and methods for training generative adversarial networks and use of trained generative adversarial networks
CN114997408A (zh) * 2018-06-14 2022-09-02 诺威有限公司 半导体度量方法和半导体度量系统
CN112384860B (zh) 2018-06-15 2023-12-08 Asml荷兰有限公司 基于机器学习的逆光学邻近效应校正和过程模型校准
CN109061131A (zh) * 2018-06-29 2018-12-21 志诺维思（北京）基因科技有限公司 染色图片处理方法及装置
TWI689875B (zh) * 2018-06-29 2020-04-01 由田新技股份有限公司 利用深度學習系統的自動光學檢測分類設備及其訓練設備
US10169852B1 (en) * 2018-07-03 2019-01-01 Nanotronics Imaging, Inc. Systems, devices, and methods for providing feedback on and improving the accuracy of super-resolution imaging
KR101936029B1 (ko) * 2018-07-18 2019-01-11 한국과학기술정보연구원 딥러닝 기반의 가치 평가 방법 및 그 장치
US10846845B2 (en) * 2018-07-25 2020-11-24 Fei Company Training an artificial neural network using simulated specimen images
JP2020024121A (ja) * 2018-08-06 2020-02-13 澁谷工業株式会社 物品検査装置
JPWO2020031984A1 (ja) * 2018-08-08 2021-08-10 Ｂｌｕｅ Ｔａｇ株式会社 部品の検査方法及び検査システム
US11386304B2 (en) 2018-08-20 2022-07-12 Samsung Electronics Co., Ltd. Electronic device and method of controlling the same
WO2020055555A1 (en) * 2018-09-12 2020-03-19 Applied Materials, Inc. Deep auto-encoder for equipment health monitoring and fault detection in semiconductor and display process equipment tools
US10949964B2 (en) * 2018-09-21 2021-03-16 Kla Corporation Super-resolution defect review image generation through generative adversarial networks
US10314477B1 (en) 2018-10-31 2019-06-11 Capital One Services, Llc Systems and methods for dynamically modifying visual content to account for user visual impairment
US12299582B2 (en) * 2018-11-06 2025-05-13 Emory University Systems and methods for training an autoencoder neural network using sparse data
KR102734292B1 (ko) 2018-11-12 2024-11-26 삼성전자주식회사 데이터 분류 방법 및 장치, 분류기의 학습 방법 및 장치
KR102638267B1 (ko) 2018-12-03 2024-02-21 삼성전자주식회사 반도체 웨이퍼 불량 분석 시스템 및 그것의 동작 방법
US10740901B2 (en) * 2018-12-17 2020-08-11 Nvidia Corporation Encoder regularization of a segmentation model
US11010885B2 (en) * 2018-12-18 2021-05-18 Kla Corporation Optical-mode selection for multi-mode semiconductor inspection
US10923318B2 (en) * 2018-12-20 2021-02-16 Fei Company Optical alignment correction using convolutional neural network evaluation of a beam image
IL284031B2 (en) * 2018-12-31 2025-04-01 Asml Netherlands Bv Fully automated SEM sampling system for E-beam image enhancement
US11170475B2 (en) * 2019-01-10 2021-11-09 Kla Corporation Image noise reduction using stacked denoising auto-encoder
US11347788B2 (en) 2019-01-16 2022-05-31 Toyota Research Institute, Inc. Systems and methods for generating a requested image view
US11379967B2 (en) * 2019-01-18 2022-07-05 Kla Corporation Methods and systems for inspection of semiconductor structures with automatically generated defect features
CN109901835B (zh) * 2019-01-25 2020-09-04 北京三快在线科技有限公司 布局元素的方法、装置、设备及存储介质
US10977405B2 (en) 2019-01-29 2021-04-13 Lam Research Corporation Fill process optimization using feature scale modeling
US10482584B1 (en) * 2019-01-31 2019-11-19 StradVision, Inc. Learning method and learning device for removing jittering on video acquired through shaking camera by using a plurality of neural networks for fault tolerance and fluctuation robustness in extreme situations, and testing method and testing device using the same
US11294162B2 (en) * 2019-02-07 2022-04-05 Nanotronics Imaging, Inc. Fluorescence microscopy inspection systems, apparatus and methods with darkfield channel
US10922808B2 (en) 2019-02-14 2021-02-16 KLA—Tencor Corp. File selection for test image to design alignment
US11227102B2 (en) * 2019-03-12 2022-01-18 Wipro Limited System and method for annotation of tokens for natural language processing
US11047807B2 (en) * 2019-03-25 2021-06-29 Camtek Ltd. Defect detection
US11551348B2 (en) * 2019-04-09 2023-01-10 KLA Corp. Learnable defect detection for semiconductor applications
JP7203678B2 (ja) * 2019-04-19 2023-01-13 株式会社日立ハイテク 欠陥観察装置
US11900026B1 (en) 2019-04-24 2024-02-13 X Development Llc Learned fabrication constraints for optimizing physical devices
US11684253B2 (en) * 2019-04-24 2023-06-27 Topcon Corporation 2D multi-layer thickness measurement with reconstructed spectrum
US11379633B2 (en) 2019-06-05 2022-07-05 X Development Llc Cascading models for optimization of fabrication and design of a physical device
CN110246145B (zh) * 2019-06-21 2023-02-21 福州大学 一种腹部ct图像的分割方法
US11461519B2 (en) * 2019-06-24 2022-10-04 Nanyang Technological University Machine learning techniques for estimating mechanical properties of materials
US12198298B2 (en) * 2019-07-03 2025-01-14 Korea Advanced Institute Of Science And Technology Video processing method and apparatus
US11880193B2 (en) * 2019-07-26 2024-01-23 Kla Corporation System and method for rendering SEM images and predicting defect imaging conditions of substrates using 3D design
US11693386B2 (en) * 2019-08-27 2023-07-04 Samsung Eleotronics Co., Ltd. Method and electronic device for guiding semiconductor manufacturing process
US11727169B2 (en) 2019-09-11 2023-08-15 Toyota Research Institute, Inc. Systems and methods for inferring simulated data
US11126891B2 (en) 2019-09-11 2021-09-21 Toyota Research Institute, Inc. Systems and methods for simulating sensor data using a generative model
CN114402342A (zh) * 2019-09-16 2022-04-26 Asml荷兰有限公司 用于生成特性图案以及训练机器学习模型的方法
US11494695B2 (en) 2019-09-27 2022-11-08 Google Llc Training neural networks to generate structured embeddings
US11580650B2 (en) 2019-10-01 2023-02-14 KLA Corp. Multi-imaging mode image alignment
AU2020358062A1 (en) * 2019-10-01 2022-04-21 Chevron U.S.A. Inc. Artificial learning fracture system and method for predicting permeability of hydrocarbon reservoirs
US11087449B2 (en) 2019-10-24 2021-08-10 KLA Corp. Deep learning networks for nuisance filtering
KR102144975B1 (ko) * 2019-11-08 2020-08-14 주식회사 알체라 머신 러닝 시스템 및 머신 러닝 시스템의 동작 방법
CN110929864B (zh) * 2019-12-05 2023-04-18 北京超放信息技术有限公司 光学衍射神经网络在线训练方法及系统
KR102282989B1 (ko) * 2019-12-26 2021-07-29 주식회사 나눔에너지 머신러닝을 이용한 태양광패널 설치용 지붕 가장자리 이미지 추출 시스템
SE1930421A1 (en) * 2019-12-30 2021-07-01 Unibap Ab Method and means for detection of imperfections in products
US12124944B2 (en) 2020-01-03 2024-10-22 Silicon Storage Technology, Inc. Precise data tuning method and apparatus for analog neural memory in an artificial neural network
US11636322B2 (en) 2020-01-03 2023-04-25 Silicon Storage Technology, Inc. Precise data tuning method and apparatus for analog neural memory in an artificial neural network
EP3885813B1 (en) * 2020-03-27 2025-12-10 Leica Microsystems CMS GmbH Method and device for estimating a sted resolution
US12131103B2 (en) 2020-03-30 2024-10-29 Kla Corporation Semiconductor fabrication process parameter determination using a generative adversarial network
CN111461300B (zh) * 2020-03-30 2022-10-14 北京航空航天大学 光学残差深度网络构建方法
CN111524078B (zh) * 2020-04-20 2023-04-18 浙江大学 一种基于稠密网络的显微镜图像去模糊方法
US11796794B2 (en) 2020-05-12 2023-10-24 The Board Of Trustees Of The Leland Stanford Junior University Multi-objective, robust constraints enforced global topology optimizer for optical devices
US11531842B2 (en) 2020-05-20 2022-12-20 Toyota Research Institute, Inc. Invertible depth network for image reconstruction and domain transfers
US11769242B2 (en) 2020-05-21 2023-09-26 Kla Corporation Mode selection and defect detection training
CN113761979B (zh) * 2020-06-04 2023-11-14 富士通株式会社 用于优化模型的方法、设备和存储介质
DE102021205690A1 (de) * 2020-06-05 2021-12-09 Nvidia Corporation Trainieren neuronaler Netze mit begrenzten Daten unter Verwendung invertierbarer Augmentationsoperatoren
US12321825B2 (en) 2020-06-05 2025-06-03 Nvidia Corporation Training neural networks with limited data using invertible augmentation operators
US12061862B2 (en) 2020-06-11 2024-08-13 Capital One Services, Llc Systems and methods for generating customized content based on user preferences
US20230169352A1 (en) * 2020-06-12 2023-06-01 Haijun Zhao Generate source code to build secure machine learning engine for edge devices and existing toolchains
US11232554B1 (en) * 2021-06-07 2022-01-25 Elementary Robotics, Inc. Machine-learning based camera image triggering for quality assurance inspection processes
WO2022002399A1 (en) * 2020-07-02 2022-01-06 Ecole Polytechnique Federale De Lausanne (Epfl) Multicore fiber endoscope for phase imaging based on intensity recording using deep neural networks
US20220075916A1 (en) 2020-09-07 2022-03-10 Kla Corporation System and method for accelerating physical simulation models during microelectronic device fabrication
CN112200218B (zh) * 2020-09-10 2023-06-20 浙江大华技术股份有限公司 一种模型训练方法、装置及电子设备
US11530913B2 (en) * 2020-09-24 2022-12-20 Kla Corporation Methods and systems for determining quality of semiconductor measurements
CN114330471A (zh) * 2020-09-25 2022-04-12 辉达公司 基于能量的变分自动编码器
US12372864B2 (en) 2020-10-22 2025-07-29 D2S, Inc. Methods and systems to determine shapes for semiconductor or flat panel display fabrication
EP4264518A4 (en) * 2020-12-18 2024-12-11 Strong Force VCN Portfolio 2019, LLC ROBOT FLEET MANAGEMENT AND ADDITIVE MANUFACTURING FOR VALUE CHAIN NETWORKS
CN112301322B (zh) * 2020-12-21 2021-04-13 上海陛通半导体能源科技股份有限公司 具有工艺参数智能调节功能的气相沉积设备及方法
US20220270212A1 (en) * 2021-02-25 2022-08-25 Kla Corporation Methods for improving optical inspection and metrology image quality using chip design data
EP4610886A3 (en) * 2021-02-25 2025-09-24 Silicon Storage Technology, Inc. Precise data tuning method and apparatus for analog neural memory in an artificial neural network
CN113032778B (zh) * 2021-03-02 2021-09-21 四川大学 一种基于行为特征编码的半监督网络异常行为检测方法
EP4301548A4 (en) * 2021-03-03 2025-01-29 Applied Materials, Inc. IN-SITU MONITORING FOR MARKING TRAINING SPECTRA FOR A MACHINE LEARNING SYSTEM FOR SPECTROGRAPHIC MONITORING
CN113239978B (zh) * 2021-04-22 2024-06-04 科大讯飞股份有限公司 医学图像预处理模型与分析模型的相关方法和装置
US12469725B2 (en) * 2021-06-27 2025-11-11 Delta Design, Inc. Method for determining corrective film pattern to reduce semiconductor wafer bow
WO2023008983A1 (ko) 2021-07-30 2023-02-02 주식회사 딥엑스 이미지 신호 프로세서의 제어 방법 및 이를 수행하는 제어 장치
KR20240051271A (ko) * 2021-09-03 2024-04-19 램 리써치 코포레이션 웨이퍼 프로세싱 툴의 머신 비전 검사 (machine vision inspection)
US11868689B2 (en) * 2021-10-11 2024-01-09 KLA Corp. Systems and methods for setting up a physics-based model
CN114036607B (zh) * 2021-11-03 2022-07-01 清华大学 多模态输入深度神经网络、框架结构梁柱设计方法及装置
CN114170107B (zh) * 2021-12-13 2024-06-11 浙江理工大学 一种基于生成对抗网络的浑浊水下偏振图像复原方法
US20230229844A1 (en) 2022-01-19 2023-07-20 D2S, Inc. Interactively presenting for minimum overlap shapes in an ic design
CN114564768B (zh) * 2022-03-03 2024-12-24 上海大学 一种基于深度学习的端到端智能平面设计方法
US20230314336A1 (en) 2022-03-31 2023-10-05 Kla Corporation Multi-mode optical inspection
US11922619B2 (en) 2022-03-31 2024-03-05 Kla Corporation Context-based defect inspection
CN114880739B (zh) * 2022-04-25 2023-03-24 清华大学 生成式建筑结构设计方案的再优化设计方法和装置
US12223641B2 (en) * 2022-05-19 2025-02-11 Applied Materials Israel Ltd. Defect detection of a semiconductor specimen
CN114881990B (zh) * 2022-05-23 2025-10-31 北京御微半导体技术有限公司 掩模版缺陷检测方法、装置、电子设备及存储介质
US20230418995A1 (en) * 2022-06-23 2023-12-28 Onto Innovation Inc. Multiple sources of signals for hybrid metrology using physical modeling and machine learning
CN115935779B (zh) * 2022-08-01 2023-09-08 先进半导体材料(安徽)有限公司 刻蚀仿真模型的构建方法
JP2024021487A (ja) * 2022-08-03 2024-02-16 ＪＤＩ Ｄｅｓｉｇｎ ａｎｄ Ｄｅｖｅｌｏｐｍｅｎｔ 合同会社 検査方法、検査装置及びプログラム
US12489020B2 (en) * 2022-09-19 2025-12-02 Applied Materials Israel Ltd. End-to-end measurement for semiconductor specimens
WO2024088665A1 (en) * 2022-10-23 2024-05-02 Asml Netherlands B.V. Training a machine learning model to predict images representative of defects on a substrate
TWI870179B (zh) * 2023-12-25 2025-01-11 財團法人工業技術研究院 神經網路模型的深度學習編譯方法及儲存對應程式之非暫態電腦可讀取媒體
US20250225638A1 (en) * 2024-01-09 2025-07-10 Kla Corporation Digital nonlinear neural network based image filtering for semiconductor applications
CN119295681B (zh) * 2024-12-13 2025-04-04 四川轻化工大学 基于ga-bp神经网络的辐射场三维重建方法

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08136466A (ja) * 1994-11-10 1996-05-31 Dainippon Screen Mfg Co Ltd 画像パターン検査装置
US5711843A (en) * 1995-02-21 1998-01-27 Orincon Technologies, Inc. System for indirectly monitoring and controlling a process with particular application to plasma processes
US6466314B1 (en) 1998-09-17 2002-10-15 Applied Materials, Inc. Reticle design inspection system
US6641746B2 (en) * 2001-09-28 2003-11-04 Agere Systems, Inc. Control of semiconductor processing
JP2003243470A (ja) * 2002-02-18 2003-08-29 Mitsubishi Electric Corp 異常検出システム、プログラムおよび記録媒体
US7346208B2 (en) 2003-10-25 2008-03-18 Hewlett-Packard Development Company, L.P. Image artifact reduction using a neural network
US7729529B2 (en) * 2004-12-07 2010-06-01 Kla-Tencor Technologies Corp. Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8698093B1 (en) 2007-01-19 2014-04-15 Kla-Tencor Corporation Objective lens with deflector plates immersed in electrostatic lens field
WO2008133951A2 (en) * 2007-04-24 2008-11-06 Massachusetts Institute Of Technology Method and apparatus for image processing
CN101785009B (zh) * 2007-08-20 2012-10-10 恪纳腾公司 确定实际缺陷是潜在系统性缺陷还是潜在随机缺陷的计算机实现的方法
US8126255B2 (en) 2007-09-20 2012-02-28 Kla-Tencor Corp. Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions
US8238635B2 (en) 2008-03-21 2012-08-07 General Electric Company Method and system for identifying defects in radiographic image data corresponding to a scanned object
CN102077230A (zh) 2008-04-17 2011-05-25 旅行者保险公司 用于确定和处理物体结构状况信息的方法和系统
US8577820B2 (en) * 2011-03-04 2013-11-05 Tokyo Electron Limited Accurate and fast neural network training for library-based critical dimension (CD) metrology
US8664594B1 (en) 2011-04-18 2014-03-04 Kla-Tencor Corporation Electron-optical system for high-speed and high-sensitivity inspections
US8692204B2 (en) 2011-04-26 2014-04-08 Kla-Tencor Corporation Apparatus and methods for electron beam detection
US8761476B2 (en) * 2011-11-09 2014-06-24 The Johns Hopkins University Hyperspectral imaging for detection of skin related conditions
US8716662B1 (en) 2012-07-16 2014-05-06 Kla-Tencor Corporation Methods and apparatus to review defects using scanning electron microscope with multiple electron beam configurations
US9189844B2 (en) * 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9222895B2 (en) 2013-02-25 2015-12-29 Kla-Tencor Corp. Generalized virtual inspector
US9430824B2 (en) * 2013-05-14 2016-08-30 Kla-Tencor Corporation Machine learning method and apparatus for inspecting reticles
US9183624B2 (en) * 2013-06-19 2015-11-10 Kla-Tencor Corp. Detecting defects on a wafer with run time use of design data
US9612541B2 (en) * 2013-08-20 2017-04-04 Kla-Tencor Corporation Qualifying patterns for microlithography
US10483081B2 (en) 2014-10-22 2019-11-19 Kla-Tencor Corp. Self directed metrology and pattern classification
US10267746B2 (en) 2014-10-22 2019-04-23 Kla-Tencor Corp. Automated pattern fidelity measurement plan generation
US10650508B2 (en) * 2014-12-03 2020-05-12 Kla-Tencor Corporation Automatic defect classification without sampling and feature selection
US10062543B2 (en) 2015-06-23 2018-08-28 Kla-Tencor Corp. Determining multi-patterning step overlay error
US10416087B2 (en) 2016-01-01 2019-09-17 Kla-Tencor Corporation Systems and methods for defect detection using image reconstruction
US10319076B2 (en) * 2016-06-16 2019-06-11 Facebook, Inc. Producing higher-quality samples of natural images
US10043088B2 (en) * 2016-06-23 2018-08-07 Siemens Healthcare Gmbh Image quality score using a deep generative machine-learning model

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220121956A1 (en) * 2020-10-16 2022-04-21 Samsung Electronics Co., Ltd. Method of training deep learning model for predicting pattern characteristics and method of manufacturing semiconductor device
US12205040B2 (en) * 2020-10-16 2025-01-21 Samsung Electronics Co., Ltd. Method of training deep learning model for predicting pattern characteristics and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
IL262787A (en) 2018-12-31
KR20190004000A (ko) 2019-01-10
TWI715773B (zh) 2021-01-11
EP3465552A1 (en) 2019-04-10
IL262787B (en) 2020-09-30
EP3465552A4 (en) 2020-01-22
US20170351952A1 (en) 2017-12-07
KR102213730B1 (ko) 2021-02-05
EP3465552B1 (en) 2023-05-24
CN109313724A (zh) 2019-02-05
TW201802726A (zh) 2018-01-16
US10346740B2 (en) 2019-07-09
WO2017210455A1 (en) 2017-12-07
JP2019525450A (ja) 2019-09-05
CN109313724B (zh) 2021-06-29

Similar Documents

Publication Publication Date Title
JP6853273B2 (ja) ニューラルネットワークと順物理モデルを半導体用途に組み込んだシステムおよび方法
KR102321953B1 (ko) 다양한 모댈리티들로 획득된 이미지들의 정렬을 위한 학습 기반 접근 방식
JP6758418B2 (ja) 半導体用途のための、入力画像からのシミュレーション画像の生成
KR102637409B1 (ko) 반도체 적용들을 위한 저해상도 이미지들로부터 고해상도 이미지들의 생성
JP6893514B2 (ja) ハイブリッドインスペクタ
TWI713672B (zh) 為樣品產生模擬輸出之系統，非暫時性電腦可讀媒體及電腦實施方法
KR20190072569A (ko) 반도체 애플리케이션을 위해 구성된 심층 학습 모델을 위한 진단 시스템 및 방법
CN108475351A (zh) 用于半导体应用的基于机器学习的模型的加速训练
CN110785709B (zh) 从低分辨率图像产生高分辨率图像以用于半导体应用

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200601

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200601

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200618

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20200618

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20200828

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200908

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20201204

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210302

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210311

R150 Certificate of patent or registration of utility model

Ref document number: 6853273

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250