JP6844948B2 - A vacuum bonding device, a vacuum bonding system using the device, and a vacuum bonding method using the system. - Google Patents

Description

The present invention relates to a vacuum bonding device, a vacuum bonding system using the device, and a vacuum bonding method using the system.

Conventionally, a vacuum bonding system has been used in which two members coated with an adhesive are placed facing each other, the surroundings of the two members are evacuated, and then the two members are bonded together by returning to the atmospheric pressure state. (See, for example, Patent Document 1 and Patent Document 2). Here, it is assumed that the vacuum bonding system is used in a substrate assembly system in which an upper substrate (glass substrate) and a lower substrate (glass substrate) are bonded together to assemble a substrate such as a liquid crystal panel.

The vacuum bonding system used as a board assembly system controls the operation of a vacuum bonding device (board assembly device) that assembles a substrate by bonding an upper substrate and a lower substrate in a vacuum chamber and a vacuum bonding device. A configuration having a control device for carrying the upper substrate and the lower substrate into the vacuum chamber of the vacuum bonding device, and a transfer device for carrying out the substrate assembled by the vacuum bonding device to the outside of the vacuum chamber. It has become.

The vacuum bonding device includes a vacuum chamber in which the upper chamber and the lower chamber are joined and separated so as to be separable, a vacuum pump mechanism for removing gas from the vacuum chamber, and a vacuum chamber which is vertically opposed to each other in the vacuum chamber. It has a table and a lower table. The vacuum bonding device holds the upper substrate facing the lower table on the upper table, and holds the lower substrate on which the liquid crystal is dropped on the lower table. An adhesive is applied to either the upper substrate or the lower substrate. The vacuum bonding device evacuates the inside of the vacuum chamber by operating the vacuum pump mechanism in a state where the upper chamber and the lower chamber are joined, and pressurizes the upper substrate and the lower substrate with the upper table in the vacuum. As a result, the upper substrate and the lower substrate are bonded together with the adhesive applied to either of the substrates. Hereinafter, the operation of evacuating the inside of the vacuum chamber is referred to as "evacuation".

After this, the vacuum bonding device opens the inside of the vacuum chamber to the atmosphere and finally reaches a predetermined cell gap while crushing the adhesive by pressurizing the upper substrate and the lower substrate at atmospheric pressure. The upper board and the lower board are pasted together. As a result, the vacuum bonding system assembles a substrate such as a liquid crystal panel.

Japanese Patent No. 4379435 Japanese Patent No. 5837247

However, in the conventional vacuum bonding device, there is room for further improvement in making the characteristics of the adhesive uniform in each area, as described below.

For example, circuits and wiring having various configurations are embedded in each area of the board. Therefore, the substrate has a different heat storage amount and heat transfer efficiency for each area.
In an atmospheric environment where the surroundings are at atmospheric pressure, there is air convection around the substrate. Therefore, even if the amount of heat stored in the substrate and the efficiency of heat transfer differ for each area, the heat storage in each area of the substrate is transmitted to the surroundings and diffused by the convection of air. As a result, in the atmospheric environment, the surface temperature of the substrate becomes a substantially uniform temperature in all areas.
However, in a vacuum environment where the surroundings are in a vacuum state, there is no air convection around the substrate. Therefore, the heat storage in each area of the substrate is not transferred to the surroundings due to the convection of air. Therefore, the surface temperature of the substrate varies greatly from area to area.

By the way, in the bonding of the upper substrate and the lower substrate, it may be required to use an adhesive whose characteristics such as viscosity greatly fluctuate depending on the temperature in response to the recent demand for assembling various types of substrates.
However, in such an adhesive, the surface temperature of the substrate varies greatly from area to area in a vacuum environment, so that the properties such as viscosity greatly fluctuate. As a result, for example, the amount of crushed adhesive may vary from area to area.

Then, in the conventional vacuum bonding device, when an adhesive whose characteristics such as viscosity greatly fluctuate depending on such a temperature is used, the adhesive is crushed by pressurizing the upper substrate and the lower substrate at atmospheric pressure. At that time, there is a possibility that the bonding of the upper substrate and the lower substrate may be hindered until a predetermined cell gap is uniformly reached in the entire area.

The present invention has been made to solve the above-mentioned problems, and is a vacuum bonding device for making the characteristics of the adhesive uniform, a vacuum bonding system using the device, and a vacuum bonding system using the system. Its main purpose is to provide legal methods.

In order to achieve the above object, the present invention has a vacuum chamber capable of accommodating a lower member and an upper member in a vacuum environment, a lower table on which the lower member is placed in the vacuum chamber, and a vacuum chamber. An upper table for holding the upper member, a table temperature adjusting mechanism for adjusting the temperature of either or both of the lower table and the upper table for each arbitrarily set area, and moving the upper table in the vertical direction. It has a vertical movement mechanism for causing the evacuation and a vacuum pump mechanism for executing a vacuum to discharge the gas inside the vacuum chamber to the outside, and the temperature of the table temperature adjusting mechanism when heating a table to be adjusted in temperature. Is a vacuum bonding device characterized by being at room temperature or higher and at a temperature of (normal temperature +50) ° C. or lower, a vacuum bonding system using the device, and a vacuum bonding method using the system.

In the vacuum bonding device of the present invention, the temperature of the table can be adjusted for each area, so that the characteristics of the adhesive can be made uniform in all areas. Thereby, for example, the amount of crushed adhesive can be made uniform in all areas.
Other means will be described later.

According to the present invention, the properties of the adhesive can be made uniform.

It is a figure which shows the structure of the vacuum bonding system which concerns on Embodiment 1. FIG. It is a figure (1) which shows typically the structure of the table temperature control mechanism of the vacuum bonding apparatus which concerns on Embodiment 1. FIG. It is a figure (2) which shows typically the structure of the table temperature control mechanism of the vacuum bonding apparatus which concerns on Embodiment 1. FIG. It is a figure (3) which shows typically the structure of the table temperature control mechanism of the vacuum bonding apparatus which concerns on Embodiment 1. It is a figure (4) which shows typically the structure of the table temperature control mechanism of the vacuum bonding apparatus which concerns on Embodiment 1. FIG. It is a figure which shows the structure of the control device used in Embodiment 1. FIG. It is a flowchart which shows the operation of the vacuum bonding system which concerns on Embodiment 1. It is a figure which shows an example of the temperature detection part. It is a figure which shows the example of the temperature change of each area of the lower table. It is a figure (1) which shows typically the correction example of the dimension of the substrate in Embodiment 1. It is a figure (2) which shows typically the correction example of the dimension of the substrate in Embodiment 1. It is a figure which shows typically the structure of the vacuum bonding apparatus which concerns on Embodiment 2. It is a figure (1) which shows typically the correction example of the dimension of the substrate in Embodiment 2. It is a figure (2) which shows typically the correction example of the dimension of the substrate in Embodiment 2.

Hereinafter, embodiments of the present invention (hereinafter, referred to as “the present embodiment”) will be described in detail with reference to the drawings. It should be noted that each figure is merely schematically shown to the extent that the present invention can be fully understood. Therefore, the present invention is not limited to the illustrated examples. Further, in each figure, common components and similar components are designated by the same reference numerals, and duplicate description thereof will be omitted.

[Embodiment 1]
<Overall configuration of vacuum bonding system>
Hereinafter, the configuration of the vacuum bonding system 1000 according to the first embodiment will be described with reference to FIG. FIG. 1 is a diagram showing a configuration of a vacuum bonding system 1000. Here, it is assumed that the vacuum bonding system 1000 is used in a substrate assembly system for assembling a substrate such as a liquid crystal panel. Further, the member (upper member) arranged on the upper side will be referred to as an upper substrate K1 (glass substrate), and the member (lower member) arranged on the lower side will be referred to as a lower substrate K2 (glass substrate).

As shown in FIG. 1, the vacuum bonding system 1000 according to the first embodiment includes a vacuum bonding device (board assembly device) 1, a control device 100, and a transfer device 200.

In the vacuum bonding device 1, two members coated with an adhesive are arranged to face each other, the surroundings of the two members are evacuated, and then the two members are returned to the atmospheric pressure state to bond the two members. It is a device.
The control device 100 is a device that controls the operations of the vacuum bonding device 1 and the transfer device 200.
The transfer device 200 carries the upper substrate K1 (glass substrate) and the lower substrate K2 (glass substrate) into the vacuum chamber 5 of the vacuum bonding device 1, or a liquid crystal panel assembled by the vacuum bonding device 1 or the like. It is a device for carrying out the substrate to the outside of the vacuum chamber 5. The transport device 200 includes a holding portion for holding the upper substrate K1 and the lower substrate K2.

<Vacuum bonding device configuration>
The vacuum bonding device 1 has a frame 1a and an upper frame 2. The gantry 1a is placed on an installation surface (floor surface or the like). The upper frame 2 is provided so as to be vertically movable (moving upward and moving downward) above the gantry 1a.
A Z-axis drive mechanism 20, which is a vertical movement mechanism of the upper frame 2, is mounted on the gantry 1a. An upper frame 2 is mounted on the Z-axis drive mechanism 20 via a load cell 20d. In the first embodiment, two Z-axis drive mechanisms 20 and two load cells 20d are arranged in the X-axis direction and two in the Y-axis direction, respectively, and the vacuum bonding device 1 has a total of four Z-axis drive mechanisms 20 and a total of four. It will be described as having a load cell 20d.

The vacuum bonding device 1 includes an upper table 3 and a lower table 4.
The upper table 3 is fixed to the upper frame 2 via a plurality of upper shafts 2a. In the first embodiment, the upper table 3 has a back plate 30 and a cushion sheet 31. The back plate 30 is a plate material that supports the cushion sheet 31, and is made of a rigid material. The back plate 30 is attached to the upper shaft 2a and moves up and down integrally with the upper frame 2. The cushion sheet 31 is a sheet material made of an elastic material.

The lower table 4 is attached to the gantry 1a via the XYθ moving unit 40. The XYθ movement unit 40 is a unit that arbitrarily executes movement in the X-axis direction, movement in the Y-axis direction, and rotation around the Z-axis with respect to the lower table 4. The XYθ moving unit 40 is configured to be independently movable in two axes (X-axis and Y-axis) orthogonal to each other with respect to the gantry 1a. Further, the XYθ moving unit 40 is configured to be rotatable around the Z axis with respect to the gantry 1a.

The upper table 3 and the lower table 4 are rectangular in which the Y-axis direction and the X-axis direction are vertical and horizontal directions. The lower plane (upper substrate surface 3a) of the upper table 3 and the upper plane (lower substrate surface 4a) of the lower table 4 face each other.

In the first embodiment, the direction of the upper frame 2 with respect to the gantry 1a is the Z-axis direction (vertical direction). Further, the direction of one axis orthogonal to the Z axis is defined as the X-axis direction (horizontal direction), and the direction of one axis orthogonal to the Z-axis and the X-axis is defined as the Y-axis direction (vertical direction).

The upper frame 2 is attached to the gantry 1a via four Z-axis drive mechanisms 20 and four load cells 20d. Each Z-axis drive mechanism 20 has a ball screw mechanism 20b that moves the ball screw shaft 20a extending in the Z-axis direction (vertical direction) up and down. The ball screw shaft 20a is rotated by the electric motor 20c and moved up and down by the ball screw mechanism 20b.

An upper table 3 is fixed to the upper frame 2 via a plurality of upper shafts 2a. The upper frame 2 and the upper table 3 move up and down integrally. An upper chamber 5a is arranged around the upper table 3. The upper chamber 5a has a structure in which the lower side (the side of the gantry 1a) is open, and is arranged so as to cover the upper side and the side surface of the upper table 3.

The upper chamber 5a is attached to the upper frame 2 via a hanging mechanism 6.
The suspension mechanism 6 has a support shaft 6a extending downward from the upper frame 2 and a locking portion 6b formed by spreading the lower end portion of the support shaft 6a in a flange shape.
Further, the upper chamber 5a is provided with a hook 6c. The hook 6c freely moves up and down around the support shaft 6a. Further, the hook 6c engages with the locking portion 6b at the lower end of the support shaft 6a.

The upper shaft 2a penetrates the upper chamber 5a. The upper shaft 2a and the upper chamber 5a are sealed with a vacuum seal (not shown).
When the upper frame 2 moves upward (upward movement), the hook 6c engages with the locking portion 6b of the support shaft 6a, and the upper chamber 5a moves upward together with the upper frame 2 accordingly. Further, when the upper frame 2 moves downward (moves downward), the hook 6c moves downward by its own weight, and the upper chamber 5a moves downward accordingly.

A plurality of suction holes (not shown) are opened on the lower substrate surface 4a of the lower table 4. Each suction hole of the lower table 4 is connected to the vacuum pump P3. When the vacuum pump P3 is driven, the lower substrate K2 placed on the lower substrate surface 4a is attracted and held by the lower table 4 (lower substrate surface 4a).

Further, a lower chamber 5b is arranged around the lower table 4. The lower chamber 5b is supported by a plurality of lower shafts 1b attached to the gantry 1a. The lower shaft 1b projects into the lower chamber 5b. The lower chamber 5b and the lower shaft 1b are sealed with a vacuum seal (not shown).
The lower chamber 5b has a structure in which the upper side (the side of the upper frame 2) is open, and is arranged so as to cover the lower side and the side of the lower table 4.
The XYθ moving unit 40 is attached to the lower shaft 1b protruding into the lower chamber 5b to support the lower table 4.

The upper chamber 5a and the lower chamber 5b are combined with each other to form a vacuum chamber 5. That is, the lower chamber 5a is configured to engage with the lower chamber 5b from above, and the opening of the lower chamber 5b is closed by the upper chamber 5a. The connection portion between the upper chamber 5a and the lower chamber 5b is sealed with a seal ring (not shown) to ensure the airtightness of the vacuum chamber 5.

The upper frame 2 can move further downward than in a state where the upper chamber 5a is in contact with the lower chamber 5b. That is, the upper frame 2 can move further downward than the state in which the lower movement of the upper chamber 5a is regulated by the lower chamber 5b. In the hanging mechanism 6, the upper frame 2 moves further downward than in that state, so that the engagement between the locking portion 6b and the hook 6c is released. At this time, the upper chamber 5a is placed on the lower chamber 5b by its own weight. Then, the upper table 3 and the lower table 4 are arranged inside the vacuum chamber 5.

The vacuum bonding device 1 is provided with a vacuum pump mechanism P0. The vacuum pump mechanism P0 is connected to the vacuum chamber 5 and discharges the gas in the vacuum chamber 5 to the outside to bring the state inside the vacuum chamber 5 into a vacuum state. That is, when the vacuum pump mechanism P0 is driven, the inside of the vacuum chamber 5 becomes a vacuum environment.

The vacuum pump mechanism P0 has a configuration in which a low vacuum pump (not shown) and a high vacuum pump (not shown) are combined. Low vacuum pump is a pump capable of changing the internal state of the vacuum chamber 5 from atmospheric pressure ^{(101,300 (Pa) ≒ 10 5} (Pa)) in a low vacuum state. As the low vacuum pump, for example, a dry pump or the like can be used. The high vacuum pump is a pump capable of changing the internal state of the vacuum chamber 5 from a low vacuum state to an extremely high vacuum state. As the high vacuum pump, for example, a turbo molecular pump or the like can be used.

The upper table 3 moves downward inside the vacuum chamber 5 as the upper frame 2 moves downward. By such a downward movement of the upper table 3, the upper substrate K1 held by the upper table 3 and the lower substrate K2 held by the lower table 4 are pressurized in a vacuum. An adhesive is applied to either the upper substrate K1 or the lower substrate K2. Therefore, the upper substrate K1 and the lower substrate K2 are bonded together by the adhesive applied to one of the substrates.

Further, as described above, the upper table 3 is fixed to the upper frame 2 via a plurality of upper shafts 2a. Therefore, the load when the upper substrate K1 and the lower substrate K2 are pressurized by the downward movement of the upper table 3 is detected in the load cell 20d. The detection signal of the load cell 20d is input to the control device 100. The control device 100 specifies the load applied to the substrate from the upper table 3 based on the detected value detected in the load cell 20d. In the first embodiment, since the vacuum bonding device 1 has four load cells 20d, the total value of the detected values detected by the four load cells 20d is the total load value of the entire device. That is, the total value of the detected values detected in the four load cells 20d becomes the value of all the loads applied to the substrate from the upper table 3. The control device 100 manages the load applied to the substrate from the upper table 3.
The control device 100 also manages the Z-axis height (Z-axis coordinates) of the upper table 3 which is moved up and down by the Z-axis drive mechanism 20.

The vacuum bonding device 1 has a suction mechanism 7. The suction mechanism 7 is a mechanism for sucking up the upper substrate K1 with the suction pin 7a and moving the suction pin 7a up and down. The suction mechanism 7 is attached to the upper frame 2.

The suction mechanism 7 includes a plurality of suction pins 7a, one to a plurality of suction pin pads 7b, and a pin vertical movement mechanism 70. The suction pin 7a is a tubular member extending in the vertical direction, and is provided so as to be movable up and down independently of the upper table 3.

Each suction pin 7a is attached to one or more suction pin pads 7b. A plurality of suction pins 7a are attached to each suction pin pad 7b. Each suction pin 7a moves up and down at the same time as the suction pin pad 7b moves up and down. The suction pin pad 7b is arranged between the upper chamber 5a and the upper table 3. The suction pin pad 7b moves up and down by the pin up and down movement mechanism 70.

In the first embodiment, the case where the pin vertical movement mechanism 70 is configured by the ball screw mechanism will be described. The pin vertical movement mechanism 70 includes a ball screw shaft 71 extending rotatably in the Z-axis direction, an electric motor 73 for rotating the ball screw shaft 71, and a ball that moves up and down with the rotation of the ball screw shaft 71. It has a screw mechanism 72 and. The electric motor 73 rotates the ball screw shaft 71. The ball screw shaft 71 rotates to move the ball screw mechanism 72 up and down. The ball screw mechanism 72 is attached to the suction pin pad 7b. The suction pin pad 7b moves up and down integrally with the ball screw mechanism 72 as the ball screw mechanism 72 moves up and down.

The suction pin 7a is arranged above the upper substrate surface 3a of the upper table 3 when it is not moving downward, while it protrudes below the upper substrate surface 3a when it is moving downward. Further, the suction pin 7a is pulled upward from the upper substrate surface 3a by moving upward from the downwardly moved state.

The suction pin 7a has a hollow tubular shape. The suction pin pad 7b also has a hollow tubular shape. The hollow portion of the suction pin 7a communicates with the hollow portion of the suction pin pad 7b. A vacuum pump P1 is connected to the hollow portion of the suction pin pad 7b. When the vacuum pump P1 is driven, the hollow portion of the suction pin 7a and the hollow portion of the suction pin pad 7b are evacuated, and the upper substrate K1 is evacuated to the suction pin 7a.

The vacuum bonding device 1 has an adhesive holding mechanism 8. The adhesive holding mechanism 8 is a mechanism for adhesively sucking the upper substrate K1 with the adhesive pin 8a and moving the adhesive pin 8a up and down. The adhesive holding mechanism 8 is attached to the upper frame 2.

The adhesive holding mechanism 8 includes a plurality of adhesive pins 8a, one to a plurality of adhesive pin plates 8b, and a pin vertical movement mechanism 80. The adhesive pin 8a is a tubular member extending in the vertical direction, and is provided so as to be vertically movable independently of the upper table 3 and the suction pin 7a.

Each adhesive pin 8a is attached to one or more adhesive pin plates 8b (base portion). A plurality of adhesive pins 8a are attached to each adhesive pin plate 8b. Each adhesive pin plate 8b can move up and down independently (perpendicular movement with respect to the upper substrate surface 3a). Each adhesive pin 8a moves up and down at the same time in units of the adhesive pin plate 8b by moving the adhesive pin plate 8b up and down. The adhesive pin plate 8b is arranged between the upper chamber 5a and the upper table 3. The adhesive pin plate 8b moves up and down by the pin vertical movement mechanism 80.

In the first embodiment, the case where the pin vertical movement mechanism 80 is configured by the ball screw mechanism will be described. The pin vertical movement mechanism 80 includes a ball screw shaft 81 rotatably extended in the Z-axis direction, an electric motor 83 for rotating the ball screw shaft 81, and a ball that moves up and down with the rotation of the ball screw shaft 81. It has a screw mechanism 82 and. The electric motor 83 rotates the ball screw shaft 81. The ball screw shaft 81 moves the ball screw mechanism 82 up and down by rotating. The ball screw mechanism 82 is attached to the adhesive pin plate 8b. The adhesive pin plate 8b moves up and down integrally with the ball screw mechanism 82 as the ball screw mechanism 82 moves up and down.

The adhesive pin 8a is arranged above the upper substrate surface 3a of the upper table 3 when it is not moving downward, while it protrudes below the upper substrate surface 3a when it is moving downward. Further, the adhesive pin 8a is pulled upward from the upper substrate surface 3a by moving upward from the downwardly moved state.

The adhesive pin 8a has an adhesive portion 8c at the tip, which is made of an elastic material and has adhesiveness. Further, the adhesive pin 8a has a hollow tubular shape. The adhesive pin plate 8b also has a hollow tubular shape. The hollow portion of the adhesive pin 8a communicates with the hollow portion of the adhesive pin plate 8b. A vacuum pump P2 is connected to the hollow portion of the adhesive pin plate 8b. When the vacuum pump P2 is driven, the hollow portion of the adhesive pin 8a and the hollow portion of the adhesive pin plate 8b are evacuated, and the upper substrate K1 is evacuated to the adhesive pin 8a.

In the process, the adhesive pin 8a vacuum-sucks the upper substrate K1 when the vacuum pump P2 is driven and the hollow portion becomes a vacuum state, and further, the vacuum-sucked upper substrate K1 is attached to the adhesive portion 8c. Hold (adhesive hold). The adhesive pin 8a holds the upper substrate K1 when it protrudes from the upper substrate surface 3a.

A gas supply means (not shown) is connected to the hollow portion of the adhesive pin plate 8b. The gas supply means is driven in response to a command from the control device 100 to supply a predetermined gas (air, nitrogen gas, etc.) to the hollow portion of the adhesive pin plate 8b. The hollow portion of the adhesive pin 8a is boosted by the supplied gas. As a result, the upper substrate K1 attached to the adhesive portion 8c of the adhesive pin 8a is peeled off from the adhesive portion 8c.

The vacuum bonding device 1 has a table temperature control mechanism 60. The table temperature adjusting mechanism 60 is a mechanism for adjusting the temperature of the table (lower table 3 in the first embodiment) for each arbitrarily set area.

Hereinafter, the configuration of the table temperature control mechanism 60 will be described with reference to FIGS. 2 to 5. 2 to 5 are diagrams schematically showing the configuration of the table temperature control mechanism 60, respectively. FIG. 2 schematically shows the configuration of the table temperature control mechanism 60 as viewed from the side surface direction. FIG. 3 schematically shows the configuration of the table temperature control mechanism 60 as viewed from the upper surface direction. FIG. 4A shows an example of the table temperature control mechanism 60 viewed from the top surface direction, and FIG. 4B shows the main part thereof viewed from the side surface direction. FIG. 5A shows another example of the table temperature control mechanism 60 viewed from the top surface direction, and FIG. 5B shows the main part thereof viewed from the side surface direction.

As shown in FIG. 2, the table temperature control mechanism 60 includes, for example, a flow path 61 for flowing a liquid such as water or oil, and a heater 62 for heating the liquid flowing in the flow path 61. .. Here, it is assumed that water is used as the liquid. Further, it is assumed that the heater 62 includes a heating mechanism for heating the liquid and a pressurizing mechanism for pressurizing the liquid and sending it out to the outside.

In the example shown in FIG. 3, the lower table 4 is divided into four areas Ar1 to Ar4 having 2 rows and 2 columns. The table temperature control mechanism 60 is configured to include a flow path 61 and a heater 62 for each area. Specifically, the table temperature control mechanism 60 includes a flow path 61a and a heater 62a for the upper left area Ar1, a flow path 61b and a heater 62b for the upper right area Ar2, and a lower left area Ar3. The flow path 61c and the heater 62c are provided with respect to the area Ar4, and the flow path 61d and the heater 62d are provided with respect to the lower right area Ar4.

The number of areas can be arbitrarily increased or decreased according to the specifications of the vacuum bonding device 1. Further, the shape and size of the area can be changed for each area according to the specifications of the vacuum bonding device 1.

The flow path 61 is composed of a hollow pipe. As shown in FIGS. 3 and 4A, the flow path 61 is configured to fold back a plurality of times, and is arranged over almost the entire surface of each area partitioned by the lower table 4. There is. Further, as shown in FIG. 4B, the flow path 61 is embedded inside the lower table 4. The flow path 61 preferably has a uniform inner diameter over the entire area, and is preferably arranged at the same height and at equal intervals inside the lower table 4.

The flow path 61 is drawn out from the inside of the lower table 4 through the non-mounting surface of the lower substrate K1 in the lower table 4. In the example shown in FIG. 4A, since the lower table 4 is divided into four areas of 2 rows and 2 columns, each area of the lower table 4 has a side surface exposed to the outside. Therefore, the flow path 61 is pulled out from the side surface exposed to the outside of each area of the lower table 4.

However, the number of areas in the lower table 4 can be increased or decreased, for example, 9 in 3 rows and 3 columns. If the number of areas is set to 9, for example, the central area of the lower table 4 has a configuration in which all side surfaces are not exposed to the outside. Such an area where all the side surfaces are not exposed to the outside may be configured so that the flow path 61 is pulled out from the lower surface to the outside.

The flow path 61 drawn out to the outside is connected to the heater 62. The heater 62 sends out a liquid such as water to the outside while heating it inside. As a result, the heated liquid flows inside the flow path 61, for example, along the direction of the arrow shown in FIGS. 3 and 4A. As a result, the liquid passes through the inside of the lower table 4 while heating the lower table 4 with its own heat, and then returns to the heater 62.

As shown in FIG. 4A, the flow path 61 preferably has a straight portion formed of a straight pipe and a folded portion formed of a U-shaped pipe to form a U-shaped pipe. It is preferable to connect the two straight pipes. As a result, the flow path 61 can be configured such that only the straight portion is embedded in the lower table 4 in advance and the folded portion is later attached to the straight portion. Such a configuration can be easily manufactured, although the folded portion has a shape protruding to the outside of the lower table 4. However, the folded portion may have a shape that does not protrude to the outside of the lower table 4 (that is, a configuration that is embedded in the lower table 4 in advance).

The temperature of the table temperature adjusting mechanism 60 (here, the temperature of the liquid flowing inside the flow path 61) when the table to be adjusted in temperature (here, the lower table 4) is heated as in the first embodiment. ) Is preferably a temperature of room temperature or higher and (normal temperature +50) ° C. or lower. The reason is that if the liquid is heated at a temperature higher than (room temperature +50) ° C., the circuit and wiring may be affected, or the liquid may evaporate, making it difficult to adjust the temperature of the lower table 4.

<Another example of table temperature control mechanism>
The table temperature control mechanism 60 can be configured as shown in FIG. 5, for example. In the example shown in FIG. 5, the table temperature control mechanism 60 is provided with a heating wire 63 instead of the flow path 61, and is provided with a heater 64 instead of the heater 62.
The heating wire 63 is a metal wire rod that is heated by the heater 64.
The heater 64 is a device for heating the heating wire 63. Unlike the heater 62 shown in FIG. 4, the heater 64 does not have a pressurizing mechanism that pressurizes the liquid and sends it out to the outside, but includes only a heating mechanism that heats the heating wire 63.

As shown in FIG. 5A, the heating wire 63 is configured to fold back a plurality of times, and is arranged in each area partitioned by the lower table 4 over substantially the entire surface of each area. Further, as shown in FIG. 5B, the heating wire 63 is embedded inside the lower table 4. The heating wires 63 preferably have a uniform width over the entire area, and are preferably arranged at equal intervals on a single plane inside the lower table 4.

<Control device configuration>
Each part of the vacuum bonding device 1 is controlled by the control device 100. Hereinafter, the configuration of the control device 100 will be described with reference to FIG. FIG. 6 is a diagram showing the configuration of the control device 100.

As shown in FIG. 6, the control device 100 includes a control unit 110, a storage unit 160 such as a ROM, RAM, and HDD, a display unit 180 such as a liquid crystal display, and an input unit 190 such as a touch panel, a numeric keypad, and a keyboard. ing.

The control unit 110 is composed of a CPU, and by executing the control program Pr1 stored in advance in the storage unit 160, the pin height control unit 111, the movement control unit 112, the vacuum process control unit 113, and the table temperature control It functions as a unit 114.

The pin height control unit 111 is a functional means for controlling the operation of the pin vertical movement mechanisms 70 and 80 (see FIG. 1). The pin height control unit 111 drives the pin vertical movement mechanisms 70 and 80 to control the height adjusting operation of the suction pin pad 7b and the height adjusting operation of the adhesive pin plate 8b.

The movement control unit 112 is a functional means for controlling the operation of the Z-axis drive mechanism 20 (see FIG. 1) and the XYθ movement unit 40 (see FIG. 1). The movement control unit 112 drives the Z-axis drive mechanism 20 (see FIG. 1) to move the upper frame 2 up and down, thereby moving the upper table 3 up and down. Further, the movement control unit 112 drives the XYθ movement unit 40 (see FIG. 1) to displace the lower table 4 to determine the bonding position between the upper substrate K1 and the lower substrate K2.

The vacuum process control unit 113 is a functional means for controlling the operation of the upper chamber 5a, the vacuum pump mechanism P0, and the vacuum pumps P1, P2, and P3.

The table temperature control unit 114 is a functional means for controlling the temperature of the table temperature adjusting mechanism 60 for each area. The table temperature control unit 114 manages the temperature of each area of the lower table 4 based on the value of the signal output from the temperature sensor (see FIG. 8) embedded in each area of the lower table 4.

The storage unit 160 stores, for example, the control program Pr1, the setting data D1, and the like.
The control program Pr1 is a program that defines the operation of the vacuum bonding device 1 and the transfer device 200.
The setting data D1 is data representing the operation setting values of the vacuum bonding device 1 and the transfer device 200.

In the first embodiment, as the setting data D1, for example, the set temperature determination data, the dimension correction data, and the like will be described as being stored in the storage unit 160 in advance.
The “set temperature determination data” is data referred to for determining the set temperature described later in the table temperature adjusting step (see FIG. 7) of S130 described later. In the "data for determining the set temperature", when the temperature of the table to be adjusted (in the first embodiment, the lower table 4) is, what is the set temperature described later of the heater 62 of the table temperature adjusting mechanism 60? It stipulates whether to set.
The “dimension correction data” is data referred to in the table temperature adjustment step (see FIG. 7) of S130 described later for determining the set temperature described later in the case of performing the dimensional correction of the substrate. The "dimension correction data" defines how much the set temperature described later of the heater 62 of the table temperature adjusting mechanism 60 is set when the required dimensional correction amount of the substrate is.

<Operation of vacuum bonding system>
Hereinafter, the operation of the vacuum bonding system 1000 will be described with reference to FIG. 7. FIG. 7 is a flowchart showing the operation of the vacuum bonding system 1000. Here, it is assumed that the table temperature control mechanism 60 has the configuration shown in FIG.

The vacuum bonding system 1000 operates based on the time measured by a timer (not shown). Further, a series of operations of the vacuum bonding system 1000 is defined by a control program Pr1 that is readable and stored in advance in the storage unit 160 of the control device 100. Further, each information is temporarily stored in the storage unit 160 so as to be readable, and then output to a predetermined component to be processed thereafter. Hereinafter, since these points are conventional means in information processing, detailed description thereof will be omitted.

As shown in FIG. 7, the operator who operates the vacuum bonding system 1000 operates the control device 100 and inputs an instruction to cause the vacuum bonding system 1000 to assemble the substrate. As a result, the vacuum bonding system 1000 starts operation.

When the operator inputs an instruction, the vacuum bonding system 1000 executes the upper substrate loading step as follows (S110).

Specifically, the control device 100 drives the transfer device 200 to carry the upper substrate K1 into the vacuum chamber 5 of the vacuum bonding device 1. At this time, the transfer device 200 holds the upper substrate K1 by the holding portion outside the vacuum chamber 5, puts the holding portion into the vacuum chamber 5 in that state, and arranges the upper substrate K1 below the upper table 3. To do.

When the transfer device 200 arranges the upper substrate K1 below the upper table 3, the control device 100 drives the vacuum bonding device 1, lowers the suction pin 7a, and drives the vacuum pump P1. As a result, the suction pin 7a vacuum-sucks the upper substrate K1 and holds the upper substrate K1.

When the suction pin 7a holds the upper substrate K1, the holding portion of the transport device 200 releases the upper substrate K1. Then, the transfer device 200 moves the holding portion upward to separate the holding portion from the upper substrate K1. After that, the transfer device 200 moves the holding portion out of the vacuum chamber 5.

When the holding portion of the transfer device 200 goes out of the vacuum chamber 5, the control device 100 drives the vacuum bonding device 1 to move the suction pin 7a upward. As a result, the upper substrate K1 comes into contact with the upper substrate surface 3a of the upper table 3.

When the upper substrate K1 comes into contact with the upper substrate surface 3a of the upper table 3, the control device 100 drives the vacuum bonding device 1, lowers the adhesive pin 8a, and drives the vacuum pump P2. As a result, the adhesive pin 8a vacuum-sucks the upper substrate K1 and holds the upper substrate K1.
As a result, the upper substrate loading step of S110 is completed.

When the upper substrate loading step of S110 is completed, the vacuum bonding system 1000 executes the lower substrate loading step as follows (S120).

Specifically, the control device 100 drives the transfer device 200 to carry the lower substrate K2 into the vacuum chamber 5 of the vacuum bonding device 1. At this time, the transfer device 200 holds the lower substrate K2 by the holding portion outside the vacuum chamber 5, puts the holding portion into the vacuum chamber 5 in that state, and arranges the lower substrate K2 above the lower table 4. .. Then, the transfer device 200 moves the holding portion downward to place the lower substrate K2 on the lower substrate surface 4a of the lower table 4. After this, the control device 100 drives the vacuum pump P3. As a result, the lower table 4 vacuum-sucks the lower substrate K2 and holds the lower substrate K2.

When the lower table 4 holds the lower substrate K2, the holding portion of the transport device 200 releases the lower substrate K2. Then, the transfer device 200 moves the holding portion upward to separate the holding portion from the lower substrate K2. After that, the transfer device 200 moves the holding portion out of the vacuum chamber 5.
As a result, the lower substrate loading step of S120 is completed.

When the lower substrate loading step of S120 is completed, the vacuum bonding system 1000 executes the table temperature adjusting step as follows (S130).

Specifically, the control device 100 (mainly the table temperature control unit 114) detects the temperature of each area of the lower table 4 based on the detection signal output from the temperature sensor embedded in the lower table 4.

FIG. 8 is a diagram showing an example of a temperature detection location. In the example shown in FIG. 8, in the lower table 4 divided into four areas Ar1 to Ar4 in 2 rows and 2 columns, nine temperature sensors SN1 to SN9 are arranged one by one around each area. Specifically, three rows in the vertical direction and three columns in the horizontal direction are formed in the lower table 4 so as to avoid the four areas Ar1 to Ar4, and 9 at the intersection of each row and each column. One temperature sensor SN1 to SN9 are arranged one by one.

Here, the temperature sensor SN1 is the sensor PAr1 representing the temperature of the upper left area Ar1, the temperature sensor SN3 is the sensor PAr2 representing the temperature of the upper right area Ar2, and the temperature sensor SN7 is the lower left area. It is assumed that the sensor PAr3 represents the temperature of Ar3, and the temperature sensor SN9 is the sensor PAr4 representing the temperature of the lower right area Ar4. However, the sensors PAr1 to PAr4 may be arranged near the center of each of the corresponding areas Ar1 to Ar4. The temperature of each area of the lower table 4 detected by the sensors PAr1 to PAr4 is, for example, the state shown in FIG. Details of FIG. 9 will be described later.

When the control device 100 detects the temperature of each area of the lower table 4, for example, the control device 100 determines the set temperature of each heater 62a to 62d (see FIG. 4) for each area based on the above-mentioned set temperature determination data. At this time, the control device 100 determines the set temperatures of the heaters 62a to 62d so that the temperatures of all the areas of the lower table 4 are substantially the same in a vacuum environment. Here, "under a vacuum environment" means that the inside of the vacuum chamber 5 is from the start of the vacuuming process in S140 of FIG. 7 described later to the start of the atmospheric opening (bonding) process in S170 of FIG. 7 described later. It means the environment.

After that, the control device 100 drives each of the heaters 62a to 62d. At this time, each of the heaters 62a to 62d sends the heated liquid to the lower table 4 while heating the liquid so that the temperature of the liquid becomes the same as the respective set temperature. As a result, the vacuum bonding device 1 can make the temperature of all areas of the lower table 4 substantially the same. At this time, since heat is transferred from the lower table 4 to the lower substrate K2 placed on the lower table 4, the temperature of the entire area of the lower substrate K2 can be set to substantially the same temperature.
This completes the table temperature control step of S130.

When the table temperature control step of S130 is completed, the vacuum bonding system 1000 executes the vacuuming step as follows (S140).

Specifically, first, the control device 100 drives the Z-axis drive mechanism 20 (vertical movement mechanism) to move the upper chamber 5a downward and close the vacuum chamber 5. Next, the control device 100 drives the vacuum pump mechanism P0 to exhaust the gas in the vacuum chamber 5 to the outside.
As a result, the evacuation step of S140 is completed.

When the evacuation step of S140 is completed, the vacuum bonding system 1000 executes the positioning step as follows (S150).
Specifically, the control device 100 drives the vacuum bonding device 1 to displace the lower table 4 with the XYθ moving unit 40. As a result, the vacuum bonding device 1 determines the bonding position between the upper substrate K1 and the lower substrate K2.
When the bonding position between the upper substrate K1 and the lower substrate K2 is determined, the positioning step of S150 is completed.

When the positioning step of S150 is completed, the vacuum bonding system 1000 executes the pressing (pressurizing) step as follows (S160).

Specifically, the control device 100 drives the vacuum bonding device 1 to move the upper substrate K1 downward together with the upper table 3 by the Z-axis drive mechanism 20 (vertical movement mechanism). At this time, the adhesive portion 8c of the adhesive pin 8a is crushed, and the upper substrate surface 3a of the upper substrate K1 and the upper substrate K1 come into contact with each other. The vacuum bonding device 1 presses the upper substrate K1 against the lower substrate K2 by further moving the upper substrate K1 downward from that state, and pressurizes the upper substrate K1 and the lower substrate K2 on the upper table 3. At this time, the upper substrate K1 and the lower substrate K2 are bonded together by the adhesive applied to either the upper substrate K1 or the lower substrate K2.
As a result, the pressing (pressurizing) step of S160 is completed.

When the pressing (pressurizing) step of S160 is completed, the vacuum bonding system 1000 executes the atmospheric release (bonding) step as follows (S170).

Specifically, the control device 100 drives the vacuum bonding device 1 to first move the adhesive pin 8a upward by the pin vertical movement mechanism 80, and then by the Z-axis drive mechanism 20 (vertical movement mechanism). Move the upper table 3 up. After that, the vacuum bonding device 1 moves the upper chamber 5a up together with the upper table 3 by the Z-axis drive mechanism 20 (vertical movement mechanism). At this time, since the inside of the vacuum chamber 5 is opened to the atmosphere, atmospheric pressure is applied to the upper substrate K1 and the lower substrate K2. As a result, the vacuum bonding device 1 pressurizes the upper substrate K1 and the lower substrate K2 at atmospheric pressure. As a result, the vacuum bonding device 1 crushes the adhesive and bonds the upper substrate K1 and the lower substrate K2 until a predetermined cell gap is finally reached. As a result, the vacuum bonding system 1000 assembles a substrate such as a liquid crystal panel.
This completes the process of opening (bonding) the S170 to the atmosphere.

When the opening (bonding) step of S170 to the atmosphere is completed, the vacuum bonding system 1000 executes the substrate unloading step as follows (S180).

Specifically, the control device 100 drives the transfer device 200 to put the holding portion into the vacuum chamber 5. The transfer device 200 moves the holding portion downward to hold the substrate to which the upper substrate K1 and the lower substrate K2 are bonded by the holding portion, and moves the holding portion upward to move the holding portion out of the vacuum chamber 5. Let me put it out. As a result, the substrate to which the upper substrate K1 and the lower substrate K2 are bonded is carried out of the vacuum bonding device 1.
As a result, the substrate unloading process of S180 is completed.
When the substrate unloading process of S180 is completed, a series of routine processes is completed.

<Operation of table temperature control mechanism>
Hereinafter, the operation of the table temperature control mechanism 60 will be described with reference to FIG. FIG. 9 is a diagram showing an example of changes in temperature in each area of the lower table 4. In FIG. 9, the temperature change according to the comparative example is shown by the lines To (PAr1) to To (PAr4), and the temperature change according to the first embodiment is shown by the lines Tn (PAr1) to Tn (PAr4). .. The comparative example is an example in which the temperature of the lower table 4 is not adjusted, and corresponds to an example in which a substrate is assembled by a conventional vacuum bonding device.

In FIG. 9, the lines To (PAr1) to To (PAr4) of the comparative example and the lines Tn (PAr1) to Tn (PAr4) of the first embodiment are each of the lower table 4 detected by the sensors PAr1 to PAr4, respectively. It shows the change in temperature of the area.

(1) Comparative example: An example in which the temperature of the lower table is not adjusted (the period from the closing of the vacuum chamber to the evacuation step of S140).
For example, as shown by the lines To (PAr1) to To (PAr4), in the comparative example when the temperature of the lower table 4 is not adjusted, from the closing of the vacuum chamber 5 to the evacuation step of S140. During this period, the temperature of each area of the lower table 4 is substantially constant. Therefore, the temperature difference in each area of the lower table 4 is within the range of the relatively small temperature difference ΔTo1.

The reason why the temperature of each area of the lower table 4 becomes almost constant during the above period is that the heat storage of each area of the lower substrate K2 placed on the lower table 4 by the convection of air is explained below. Is transmitted and diffused around it.

That is, during the above period, the inside of the vacuum chamber 5 is in an atmospheric environment. In an atmospheric environment, there is air convection around the substrates (upper substrate K1 and lower substrate K2). Therefore, even if the amount of heat stored in the substrate and the efficiency of heat transfer differ for each area, the heat storage in each area of the substrate is transmitted to the surroundings and diffused by the convection of air. As a result, in the atmospheric environment, the surface temperature of the substrate becomes a substantially uniform temperature in all areas. The upper substrate K1 and the lower substrate K2 are in contact with the corresponding upper table 3 or lower table 4, respectively. Therefore, the heat storage of the upper substrate K1 is transferred from the upper substrate K1 to the upper table 3, and the heat storage of the lower substrate K2 is transferred from the lower substrate K2 to the lower table 4. As a result, in the above-mentioned period, the temperature of each area of the lower table 4 becomes substantially constant as in the case of the lower substrate K2.

In other words, during the above period, each of the sensors PAr1 to PAr4 detects the temperature after being diffused around each area of the lower substrate K2 placed on the lower table 4. Therefore, the temperature of each area of the lower table 4 is detected as a substantially constant temperature.

(Period from the evacuation process of S140 to the opening (bonding) process of S170 to the atmosphere)
When the vacuuming step of S140 is performed, the temperature of each area of the lower table 4 drops by several degrees. This is because the gas molecules in the air in the vacuum chamber 5 collide with other molecules to form a heating element in the air environment and raise the temperature in the vacuum chamber 5, whereas the molecules in the vacuum chamber 5 rise. This is because the vacuum chamber 5 is discharged from the inside to the outside.

Then, in the period from the evacuation step of S140 to the opening (bonding) step of S170 to the atmosphere, the temperature of each area of the lower table 4 is significantly different for each area. .. Therefore, the temperature difference in each area of the lower table 4 spreads to the temperature difference ΔTo2 which is significantly larger than the temperature difference ΔTo1.

The reason why the temperature of each area of the lower table 4 becomes significantly different for each area during the above period is that each of the lower substrates K2 placed on the lower table 4 due to air convection, as described below. This is because the heat storage in the area is not transferred to the surrounding area.

That is, during the above period, the inside of the vacuum chamber 5 is in a vacuum environment. In a vacuum environment, there is no air convection around the substrates (upper substrate K1 and lower substrate K2). Therefore, the heat storage in each area of the substrate is not transferred to the surroundings due to the convection of air. Therefore, in a vacuum environment, the surface temperature of the substrate varies greatly from area to area. The upper substrate K1 and the lower substrate K2 are in contact with the corresponding upper table 3 or lower table 4, respectively. Therefore, the heat storage of the upper substrate K1 is transferred from the upper substrate K1 to the upper table 3, and the heat storage of the lower substrate K2 is transferred from the lower substrate K2 to the lower table 4. As a result, in the above-mentioned period, the temperature of each area of the lower table 4 becomes a significantly different temperature for each area, similarly to the lower substrate K2.

In other words, during the above period, each of the sensors PAr1 to PAr4 directly detects the heat storage temperature of each area of the lower substrate K2 placed on the lower table 4. Therefore, the temperature of each area of the lower table 4 is detected as a temperature that is significantly different for each area.

(Period after the opening (bonding) process of S170 to the atmosphere)
When the opening (bonding) step of S170 to the atmosphere is performed, the temperature of each area of the lower table 4 rises by several degrees and returns to the original temperature (the temperature before the vacuuming step of S140 is performed). This is because the environment in the vacuum chamber 5 has returned to the original state (the state before the evacuation step of S140 was performed). That is, the environment in the vacuum chamber 5 has returned to a state in which gas molecules in the air in the vacuum chamber 5 collide with other molecules to become a heating element and raise the temperature in the vacuum chamber 5 in an atmospheric environment. ..

Then, in the period after the opening (bonding) step of S170 to the atmosphere is performed, the temperature of each area of the lower table 4 is substantially constant.

The reason why the temperature of each area of the lower table 4 becomes almost constant in the above period is due to air convection, as in the period from the closing of the vacuum chamber 5 to the evacuation step of S140. This is because the heat storage in each area of the lower substrate K2 placed on the lower table 4 is transmitted to the surroundings and diffused.

(Amount of crushed adhesive in comparative example)
By the way, in the bonding of the upper substrate K1 and the lower substrate K2, it may be required to use an adhesive whose characteristics such as viscosity greatly fluctuate depending on the temperature in response to the recent demand for assembling various types of substrates. ..

As in the comparative example, when the surface temperature of the substrate of such an adhesive is significantly different for each area in a vacuum environment, the properties such as the viscosity of the adhesive greatly fluctuate. Therefore, in the comparative example, for example, the amount of crushed adhesive varies from area to area.

That is, in the comparative example, the temperature of each area of the lower table 4 is significantly different for each area during the period from the evacuation step of S140 to the opening (bonding) step of S170 to the atmosphere. Become. Therefore, in the comparative example, the amount of crushed adhesive may be non-uniform in each area.

(2) Embodiment: Example when the temperature of the lower table is adjusted In contrast to the above-mentioned comparative example, in the first embodiment, as described below, after the vacuuming step of S140 is performed, S170 Since the temperature of all areas of the lower table 4 can be set to substantially the same temperature until the process of opening to the atmosphere (bonding) is performed, the amount of crushed adhesive can be made uniform in all areas. .. The details will be described below.

(Period from closing the vacuum chamber to performing the table temperature control step of S130)
For example, as shown by the lines Tn (PAr1) to Tn (PAr4), in the first embodiment when the temperature of the lower table 4 is adjusted, the table temperature adjustment step of S130 is performed after the vacuum chamber 5 is closed. In the period until the vacuum chamber 4 is used, the temperature of each area of the lower table 4 is substantially constant.

(Period from the table temperature control step of S130 to the vacuuming step of S140)
After that, the table temperature control step of S130 is performed at an arbitrary timing. As a result, when the temperature rise stabilization time ΔR elapses after the execution of the table temperature adjusting step of S130 is started, the temperature of each area of the lower table 4 rises to the above-mentioned set temperature. Here, the “temperature rise stabilization time ΔR” means the time required for the temperature of the liquid flowing through the flow path 61 to reach the set temperature.

During the period from the elapse of the temperature rise stabilization time ΔR to the evacuation step of S140, the temperature of each area of the lower table 4 is substantially constant around the set temperature. Therefore, the temperature difference in each area of the lower table 4 is within a range of a relatively small temperature difference ΔTn1. The value of the temperature difference ΔTn1 is equal to or smaller than the temperature difference ΔTo1 of the comparative example.

The reason why the temperature of each area of the lower table 4 becomes almost constant during the above period is that the temperature of each area of the lower substrate K2 placed on the lower table 4 due to the convection of air is the same as in the case of the comparative example. This is because the heat storage is transmitted to the surroundings and diffused.

(Period from the evacuation process of S140 to the opening (bonding) process of S170 to the atmosphere)
When the vacuuming step of S140 is performed, the temperature of each area of the lower table 4 drops by several degrees. This is because the gas molecules in the air in the vacuum chamber 5, which was a heating element, were discharged from the inside of the vacuum chamber 5 to the outside, as in the case of the comparative example.

Then, in the period from the evacuation step of S140 to the opening (bonding) step of S170 to the atmosphere, the temperature of each area of the lower table 4 is within a range of a relatively small temperature difference ΔTn2. The temperature is high. The value of the temperature difference ΔTn2 is smaller than the temperature difference ΔTo2 of the comparative example.

The reason why the temperature of each area of the lower table 4 is within the range of the temperature difference ΔTn2 in the above period is that the temperature of each area of the lower table 4 is adjusted by the table temperature adjusting mechanism 60. Because.

(Period after the opening (bonding) process of S170 to the atmosphere)
When the opening (bonding) step of S170 to the atmosphere is performed, the temperature of each area of the lower table 4 rises by several degrees and returns to the original temperature (the temperature before the vacuuming step of S140 is performed). This is because the environment in the vacuum chamber 5 has returned to the original state (the state before the evacuation step of S140 was performed) as in the case of the comparative example.

Then, in the period after the opening (bonding) step of S170 to the atmosphere is performed, the temperature of each area of the lower table 4 is substantially constant around the set temperature.

The reason why the temperature of each area of the lower table 4 becomes almost constant during the above period is that the temperature of each area of the lower substrate K2 placed on the lower table 4 due to the convection of air is the same as in the case of the comparative example. This is because the heat storage is transmitted to the surroundings and diffused.

(Amount of crushed adhesive in the embodiment)
In the first embodiment, since the table temperature adjusting mechanism 60 adjusts the temperature of each area of the lower table 4, the surface temperature difference of each area of the substrate can be reduced in a vacuum environment, and the viscosity of the adhesive can be reduced. It is possible to suppress fluctuations in characteristics such as. Therefore, in the first embodiment, for example, the amount of crushed adhesive can be made uniform in all areas.

(Correction of board dimensions)
The vacuum bonding device 1 according to the first embodiment may perform dimensional correction of the substrate in the table temperature adjusting step of S130, for example, by adjusting the temperature of the table with reference to the above-mentioned dimensional correction data. it can.

Hereinafter, the dimensional correction of the substrate will be described with reference to FIGS. 10 and 11. 10 and 11 are diagrams schematically showing an example of correcting the dimensions of the substrate in the first embodiment, respectively. Here, it is assumed that the upper substrate K1 has a rectangular shape in a top view and has four alignment marks MUa to MUd (see FIG. 10) near the four corners, and the lower substrate K2 has an upper surface. It will be described as having a rectangular shape in the visual sense and having four alignment marks MLa to MLd (see FIG. 10) near the four corners. The alignment marks Mua to Mud and the alignment marks MLa to MLd are marks used for aligning the positions of the upper substrate K1 and the lower substrate K2. Further, here, it is assumed that the upper substrate K1 has a circuit pattern PtU (see FIG. 11) and the lower substrate K2 has a circuit pattern PtL (see FIG. 11).

FIG. 10A shows a state in which the centers of the alignment marks MUa to MUd of the upper substrate K1 and the centers of the alignment marks MLa to MLd of the lower substrate K2 do not exactly match. In the example shown in FIG. 10A, the alignment marks MLa to MLd of the lower substrate K2 are deviated from the center of the alignment marks MUa to MUd of the upper substrate K1 in the direction of the center O of the substrate. At this time, the circuit pattern PtU of the upper substrate K1 and the circuit pattern PtL of the lower substrate K2 are slightly deviated from each other, for example, as shown in FIG. 11A.

The state shown in FIG. 10A can be regarded as matching because the alignment marks MLa to MLd of the lower substrate K2 are contained inside the alignment marks MUa to MUd of the upper substrate K1. Therefore, the vacuum bonding device 1 can bond the upper substrate K1 and the lower substrate K2 even in the state shown in FIG. 10A. However, the quality of the substrate can be improved if the centers of the alignment marks MUa to MUd of the upper substrate K1 and the centers of the alignment marks MLa to MLd of the lower substrate K2 are exactly aligned. ,preferable.

Therefore, the vacuum bonding device 1 adjusts the temperature of the lower table 4 to make a correction for enlarging the size of the lower substrate K2 (see FIG. 10B). As shown in FIG. 10B, as the dimensions of the lower substrate K2 are expanded, the alignment marks MLa to MLd of the lower substrate K2 are aligned in the directions of arrows A1a to A1d from the positions shown in FIG. 10A, respectively. Moving. As a result, the centers of the alignment marks MUa to MUd of the upper substrate K1 and the centers of the alignment marks MLa to MLd of the lower substrate K2 are in a state of being exactly aligned. At this time, the circuit pattern PtU of the upper substrate K1 and the circuit pattern PtL of the lower substrate K2 are in an exactly overlapping state, for example, as shown in FIG. 11B. The vacuum bonding device 1 can assemble a high-quality substrate by bonding the upper substrate K1 and the lower substrate K2 in that state.

As described above, according to the vacuum bonding device 1 according to the first embodiment, the characteristics such as the viscosity of the adhesive can be made uniform in all areas. As a result, for example, the amount of crushed adhesive can be made uniform in all areas.
Further, according to the vacuum bonding device 1, the dimensions of the lower substrate K2 can be corrected.

[Embodiment 2]
Hereinafter, the configuration of the vacuum bonding device 1A according to the second embodiment will be described with reference to FIG. FIG. 12 is a diagram schematically showing the configuration of the vacuum bonding device 1A.

As shown in FIG. 12, the vacuum bonding device 1A according to the second embodiment has not only the lower table 4 but also the upper table 3 and the lower table 4 as compared with the vacuum bonding device 1 according to the first embodiment. The difference is that both have a table temperature control mechanism 60.

Such a vacuum bonding device 1A can correct the dimensions not only of the lower substrate K2 but also of the upper substrate K1. Therefore, the vacuum bonding device 1A can adjust the positions of the alignment marks and circuit patterns as shown in FIGS. 13 and 14, for example. 13 and 14 are diagrams schematically showing an example of correcting the dimensions of the substrate in the second embodiment, respectively.

FIG. 13A shows a state in which the centers of the alignment marks MUa to MUd of the upper substrate K1 and the centers of the alignment marks MLa to MLd of the lower substrate K2 do not exactly match. In the example shown in FIG. 13A, the alignment marks MLa to MLd of the lower substrate K2 are displaced from the center of the alignment marks MUa to MUd of the upper substrate K1 in a direction away from the center O of the substrate. At this time, the circuit pattern PtU of the upper substrate K1 and the circuit pattern PtL of the lower substrate K2 are slightly deviated from each other, for example, as shown in FIG. 14A.

Therefore, the vacuum bonding device 1A corrects the size of the upper substrate K1 by adjusting the temperature of the upper table 3 (see FIG. 13B). As shown in FIG. 13 (b), as the dimensions of the upper substrate K1 are expanded, the alignment marks Mua to Mud of the upper substrate K1 are respectively located in the directions of arrows A2a to A2d from the positions shown in FIG. 13 (a). Moving. As a result, the centers of the alignment marks MUa to MUd of the upper substrate K1 and the centers of the alignment marks MLa to MLd of the lower substrate K2 are in a state of being exactly aligned. At this time, the circuit pattern PtU of the upper substrate K1 and the circuit pattern PtL of the lower substrate K2 are in an exactly overlapping state, for example, as shown in FIG. 14B. The vacuum bonding device 1A can assemble a high-quality substrate by bonding the upper substrate K1 and the lower substrate K2 in that state.

As described above, according to the vacuum bonding device 1A according to the second embodiment, the characteristics such as the viscosity of the adhesive can be made uniform in all areas as in the vacuum bonding device 1 according to the first embodiment. .. As a result, for example, the amount of crushed adhesive can be made uniform in all areas.
Moreover, according to the vacuum bonding device 1A according to the second embodiment, the dimensions of not only the lower substrate K2 but also the upper substrate K1 are corrected as compared with the vacuum bonding device 1 according to the first embodiment. be able to.

The present invention is not limited to the above-described embodiment, and includes various modifications. For example, the above-described embodiment has been described in detail in order to explain the present invention in an easy-to-understand manner, and is not necessarily limited to the one including all the described configurations. Further, it is possible to replace a part of the configuration of one embodiment with another configuration, and it is also possible to add another configuration to the configuration of one embodiment. In addition, it is possible to add / delete / replace other configurations for a part of each configuration.

Further, for example, in the above-described embodiment, the two members to be bonded by the vacuum bonding device 1 are the upper substrate K1 (glass substrate) and the lower substrate K2 (glass substrate), and the vacuum bonding device 1 is the upper substrate K1. It is described as a substrate assembly device for assembling a substrate such as a liquid crystal panel by laminating a (glass substrate) and a lower substrate K2 (glass substrate). However, the two members are not necessarily limited to the substrate.

Further, for example, in the first embodiment, the table temperature control mechanism 60 is provided on the lower table 4, and further, in the second embodiment, the table temperature control mechanism 60 is provided on the upper table 3 and the lower table 4. It was explained as being provided. However, the table temperature control mechanism 60 may be provided only on the upper table 3.

Further, for example, in the above-described first and second embodiments, the table temperature adjusting mechanism 60 has been described as having a heating mechanism such as a heater. However, the table temperature control mechanism 60 has a heating / cooling mechanism having a built-in Peltier element instead of the heater 62 or 63, and can be configured to control the temperature of the table to be temperature-controlled. That is, the table temperature adjusting mechanism 60 can be heated or cooled by the Peltier elements arranged in each area of the table to be adjusted in temperature. In this case, in the table temperature control mechanism 60, the temperature of the table temperature control mechanism 60 (the temperature of the liquid flowing inside the flow path 61) is preferably (normal temperature −10) ° C. or higher and normal temperature or lower. It is good. The reason is that if the liquid is cooled at a temperature lower than (normal temperature −10) ° C., there is a risk of causing problems such as dew condensation.
Further, for example, the table temperature control mechanism 60 may be configured to have both a heating mechanism and a cooling mechanism.

1 Vacuum bonding device 1a Stand 1b Lower shaft 2 Upper frame 2a Upper shaft 3 Upper table 3a Upper substrate surface 4 Lower table 4a Lower substrate surface 5 Vacuum chamber 5a Upper chamber 5b Lower chamber 6 Suspension mechanism 6a Support shaft 6b Locking part 6c Hook 7 Suction mechanism 7a Suction pin 7b Suction pin pad 8 Adhesive holding mechanism 8a Adhesive pin 8b Adhesive pin plate (base part)
8c Adhesive part 20 Z-axis drive mechanism (vertical movement mechanism)
20a ball screw shaft 20b ball screw mechanism 20c electric motor 20d load cell 30 back plate 31 cushion sheet 40 XYθ moving unit 60 table temperature adjustment mechanism 70,80 pin vertical movement mechanism 71,81 ball screw shaft 72,82 ball screw mechanism 73,83 Electric motor 100 Control device 110 Control unit 111 Pin height control unit 112 Movement control unit 113 Vacuum process control unit 114 Table temperature control unit 160 Storage unit 180 Display unit 190 Input unit 200 Transfer device 1000 Vacuum bonding system Ar1, Ar2, Ar3 , Ar4 Area D1 Setting data K1 Upper board K2 Lower board MLa, MLb, MLc, MLd, MUa, MUb, MUc, MUd Alignment mark P0 Vacuum pump mechanism P1, P2, P3 Vacuum pump Pr1 Control program PtL, PtU Circuit pattern SN1 PAr1), SN2, SN3 (PAr2), SN4, SN5, SN6, SN7 (PAR3), SN8, SN9 (PAr4) Temperature sensor

Claims (9)

A vacuum chamber that can store the lower member and upper member in a vacuum environment,
A lower table on which the lower member is placed in the vacuum chamber,
An upper table that holds the upper member in the vacuum chamber,
A table temperature control mechanism that adjusts the temperature of either or both of the lower table and the upper table for each arbitrarily set area.
A vertical movement mechanism that moves the upper table in the vertical direction,
It has a vacuum pump mechanism that executes evacuation to discharge the gas inside the vacuum chamber to the outside.
A vacuum bonding device characterized in that the temperature of the table temperature control mechanism when heating a table to be temperature-controlled is a temperature of room temperature or higher and (normal temperature +50) ° C. or lower. A vacuum chamber that can store the lower member and upper member in a vacuum environment,
A lower table on which the lower member is placed in the vacuum chamber,
An upper table that holds the upper member in the vacuum chamber,
A table temperature control mechanism that adjusts the temperature of either or both of the lower table and the upper table for each arbitrarily set area.
A vertical movement mechanism that moves the upper table in the vertical direction,
It has a vacuum pump mechanism that executes evacuation to discharge the gas inside the vacuum chamber to the outside.
A vacuum bonding device characterized in that the temperature of the table temperature adjusting mechanism when cooling a table to be temperature-controlled is (normal temperature −10) ° C. or higher and lower than normal temperature. In the vacuum bonding apparatus according to claim 1 or 2.
The table temperature adjusting mechanism is a vacuum bonding device including a liquid flow path arranged in each area of a table to be adjusted in temperature and a heater for heating the liquid. In the vacuum bonding apparatus according to claim 1 or 2.
The table temperature adjusting mechanism is a vacuum bonding device having a heating wire arranged in each area of a table to be adjusted in temperature and a heater for heating the heating wire. In the vacuum bonding apparatus according to claim 1 or 2.
The table temperature adjusting mechanism is a vacuum bonding device characterized in that it is heated or cooled by a Peltier element arranged in each area of a table to be adjusted in temperature. A vacuum bonding device that bonds the upper member and the lower member,
A control device for controlling the operation of the vacuum bonding device is provided.
The vacuum bonding device is
A vacuum chamber capable of accommodating the lower member and the upper member in a vacuum environment,
A lower table on which the lower member is placed in the vacuum chamber,
An upper table that holds the upper member in the vacuum chamber,
A table temperature control mechanism that adjusts the temperature of either or both of the lower table and the upper table for each arbitrarily set area.
A vertical movement mechanism that moves the upper table in the vertical direction,
It has a vacuum pump mechanism that executes evacuation to discharge the gas inside the vacuum chamber to the outside.
The control device has a table temperature control unit that operates the table temperature control mechanism, and when the table to be temperature-controlled is heated , the temperature of the table temperature control mechanism is kept at room temperature or higher (normal temperature). A vacuum bonding system characterized by keeping the temperature below +50) ° C. A vacuum bonding device that bonds the upper member and the lower member,
A control device for controlling the operation of the vacuum bonding device is provided.
The vacuum bonding device is
A vacuum chamber capable of accommodating the lower member and the upper member in a vacuum environment,
A lower table on which the lower member is placed in the vacuum chamber,
An upper table that holds the upper member in the vacuum chamber,
A table temperature control mechanism that adjusts the temperature of either or both of the lower table and the upper table for each arbitrarily set area.
A vertical movement mechanism that moves the upper table in the vertical direction,
It has a vacuum pump mechanism that executes evacuation to discharge the gas inside the vacuum chamber to the outside.
The control device has a table temperature control unit that operates the table temperature control mechanism, and when the table to be temperature-controlled is cooled, the temperature of the table temperature control mechanism is set to (normal temperature −10) ° C. A vacuum bonding system characterized by keeping the temperature above and below room temperature. An optional vacuum chamber in which the lower member and the upper member can be stored in a vacuum environment, a lower table on which the lower member is placed in the vacuum chamber, and an upper table in which the upper member is held in the vacuum chamber. A table temperature control mechanism that adjusts the temperature of one or both of the lower table and the upper table for each area set in, a vertical movement mechanism that moves the upper table in the vertical direction, and the inside of the vacuum chamber. A table temperature control step in which a vacuum bonding device having a vacuum pump mechanism for executing a vacuum to discharge the gas of the above gas is adjusted to adjust the temperature of the table to be adjusted.
A vacuuming step of causing the vacuum bonding device to execute the vacuuming,
A pressurizing step of moving the upper table downward to press the upper member against the lower member on the vacuum bonding device.
The vacuum bonding device includes an air opening step of opening the inside of the vacuum chamber to the atmosphere and bonding the upper member and the lower member to the atmosphere.
In the table temperature control step, when the table to be temperature-controlled is heated , the temperature of the table temperature control mechanism is set to a temperature of room temperature or higher and (normal temperature +50) ° C. or lower. Method. An optional vacuum chamber in which the lower member and the upper member can be stored in a vacuum environment, a lower table on which the lower member is placed in the vacuum chamber, and an upper table in which the upper member is held in the vacuum chamber. A table temperature control mechanism that adjusts the temperature of one or both of the lower table and the upper table for each area set in, a vertical movement mechanism that moves the upper table in the vertical direction, and the inside of the vacuum chamber. A table temperature control step in which a vacuum bonding device having a vacuum pump mechanism for executing a vacuum to discharge the gas of the above gas is adjusted to adjust the temperature of the table to be adjusted.
A vacuuming step of causing the vacuum bonding device to execute the vacuuming,
A pressurizing step of moving the upper table downward to press the upper member against the lower member on the vacuum bonding device.
The vacuum bonding device includes an air opening step of opening the inside of the vacuum chamber to the atmosphere and bonding the upper member and the lower member to the atmosphere.
In the table temperature control step, when the table to be temperature-controlled is cooled, the temperature of the table temperature control mechanism is set to a temperature of (normal temperature −10) ° C. or higher and lower than normal temperature. How to do it.

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