JP3173518B2 - Liquid crystal panel manufacturing method - Google Patents
Liquid crystal panel manufacturing methodInfo
- Publication number
- JP3173518B2 JP3173518B2 JP33087891A JP33087891A JP3173518B2 JP 3173518 B2 JP3173518 B2 JP 3173518B2 JP 33087891 A JP33087891 A JP 33087891A JP 33087891 A JP33087891 A JP 33087891A JP 3173518 B2 JP3173518 B2 JP 3173518B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal panel
- silicon substrate
- substrate
- glass substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
【0001】[0001]
【産業上の利用分野】本発明は、液晶ディスプレイに使
用される液晶パネルに関し、特にシリコン基板とガラス
基板のように熱膨張率の異なる基板同士を貼り合わせて
間に液晶を封入する場合のシール技術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal panel used for a liquid crystal display, and more particularly to a seal for sealing substrates between substrates having different coefficients of thermal expansion such as a silicon substrate and a glass substrate. About technology.
【0002】近年、投射型の液晶ディスプレイの需要が
高まっており、投射型の液晶パネルの開発が盛んに行わ
れているが、よりコンパクトでより明るい投射型の液晶
ディスプレイとして、反射型でしかもシリコン基板を用
いた液晶パネルの研究が進められている。2. Description of the Related Art In recent years, the demand for projection type liquid crystal displays has been increasing, and the development of projection type liquid crystal panels has been actively pursued. Research on liquid crystal panels using substrates is under way.
【0003】[0003]
【従来の技術】図5は従来の液晶パネルのシール剤の熱
硬化処理方法を示す縦断面図である。1はシリコン基
板、2はガラス基板であり、両者間の外周部を接着剤3h
でシールし、内部の空間4にスペーサ用ボール5と液晶
が封入される。通常、接着剤3hとして熱硬化性樹脂が使
用される。2. Description of the Related Art FIG. 5 is a longitudinal sectional view showing a conventional method for thermally curing a sealant for a liquid crystal panel. 1 is a silicon substrate and 2 is a glass substrate.
, And a spacer ball 5 and liquid crystal are sealed in the internal space 4. Usually, a thermosetting resin is used as the adhesive 3h.
【0004】図6は液晶パネルの従来のシール方法を工
程順に示す斜視図である。1はシリコン基板であり、内
面にスイッチング用の薄膜トランジスタがマトリクス状
に形成されている。このシリコン基板1の外周に、液晶
注入口6を除いて、接着剤3hをスクリーン印刷した状態
で、(2) のように、内面にシリカボールが散布されたガ
ラス基板2と重ねる。FIG. 6 is a perspective view showing a conventional liquid crystal panel sealing method in the order of steps. Reference numeral 1 denotes a silicon substrate on which switching thin film transistors are formed in a matrix. The adhesive 3h is screen-printed on the outer periphery of the silicon substrate 1 except for the liquid crystal injection port 6, and the silicon substrate 1 is overlapped with the glass substrate 2 on which silica balls are dispersed as shown in (2).
【0005】次に、両基板1、2間に均一な圧力を加え
て、熱硬化性接着剤3hを均一な厚さに押し延ばすため
に、(3) のようにビニール袋7に入れて内部を排気し、
真空にした状態で、加熱して接着剤を熱硬化させる。そ
の後、真空パック用袋7から取り出して、前記の液晶注
入口6から液晶を注入してから、(4) のように液晶注入
口6を接着剤で塞ぐと、液晶パネルが完成する。Next, in order to apply a uniform pressure between the substrates 1 and 2 to push the thermosetting adhesive 3h to a uniform thickness, the thermosetting adhesive 3h is put into a plastic bag 7 as shown in FIG. Exhaust
With the vacuum applied, the adhesive is thermally cured by heating. Thereafter, the liquid crystal panel is completed by taking out the vacuum pack bag 7 and injecting the liquid crystal through the liquid crystal inlet 6, and closing the liquid crystal inlet 6 with an adhesive as shown in (4).
【0006】[0006]
【発明が解決しようとする課題】このように、接着剤3h
として熱硬化性樹脂を使用し、熱硬化によってシリコン
基板1とガラス基板2を貼り合わすため、シリコン基板
1とガラス基板2の熱膨張率の差によって、図5(3)の
ようにシリコン基板1側が湾曲するという問題が生じて
いる。As described above, the adhesive 3h
As shown in FIG. 5 (3), the silicon substrate 1 and the glass substrate 2 are bonded together by thermosetting. There is a problem that the side is curved.
【0007】シール剤3hとして、紫外線硬化樹脂を用い
ることも提案されているが、紫外線硬化樹脂は、シール
部の接着強度に問題がある上、紫外線が配向膜に与える
影響も無視出来ない。したがって、通常はシール剤3hと
して熱硬化性樹脂が使用されているが、その結果前記の
ようなシリコン基板1の湾曲は避けられない。It has been proposed to use an ultraviolet-curable resin as the sealant 3h. However, the ultraviolet-curable resin has a problem in the adhesive strength of the seal portion, and the influence of ultraviolet rays on the alignment film cannot be ignored. Therefore, although a thermosetting resin is usually used as the sealant 3h, the curvature of the silicon substrate 1 as described above cannot be avoided.
【0008】次に、湾曲の発生原因を図5で説明する。
シリコン基板1の熱膨張係数は28×10-7/℃、ガラス基
板2の熱膨張係数は32〜140×10-7/℃程度と、通常は
ガラス基板2の熱膨張係数がはるかに大きい。そのた
め、図5(1) のように、両側のシール剤3h・3h間の寸法
が同じサイズL1のシリコン基板1とガラス基板2を熱硬
化性樹脂3hで貼り合わせた伏態で、(2) のように135℃
程度の熱を加えて熱硬化させた際に、シリコン基板1は
熱膨張によってL2の寸法まで延びるのに対し、熱膨張率
の高いガラス基板2の熱膨張量が大きいためにL3まで延
びる。すなわL2<L3となる。Next, the cause of the occurrence of bending will be described with reference to FIG.
The thermal expansion coefficient of the silicon substrate 1 is 28 × 10 −7 / ° C., and the thermal expansion coefficient of the glass substrate 2 is about 32 to 140 × 10 −7 / ° C., and the thermal expansion coefficient of the glass substrate 2 is usually much larger. Therefore, as shown in FIG. 5 (1), the silicon substrate 1 and the glass substrate 2 having the same size L1 between the sealing agents 3h and 3h on both sides are bonded together with the thermosetting resin 3h, 135 ° C as
When the silicon substrate 1 is thermally cured by applying a certain amount of heat, the silicon substrate 1 extends to the dimension of L2 due to thermal expansion, whereas the silicon substrate 1 having a high thermal expansion coefficient extends to L3 due to the large thermal expansion. That is, L2 <L3.
【0009】このように、シリコン基板1よりもガラス
基板2側が延びた状態で、熱硬化性樹脂3hが熱硬化する
ため、常温に戻すと(3) のように、ガラス基板2の熱収
縮率が大きく、シリコン基板1が凸に湾曲する。すなわ
ち、常温に戻ると、シリコン基板1は元の寸法L1に戻る
が、ガラス基板2側は (2)図のようにシリコン基板1側
よりも延びた状態で熱硬化固定されるため、シール部3h
〜3h間の寸法L2が、常温に戻った後はL4となり、シリコ
ン基板1側の寸法L1よりも小さくなる。その結果、シリ
コン基板1側がガラス基板2の熱収縮力で引っ張られ
て、湾曲する。As described above, the thermosetting resin 3h is thermoset with the glass substrate 2 side extending beyond the silicon substrate 1, so that when the temperature is returned to normal temperature, the heat shrinkage of the glass substrate 2 becomes as shown in (3). Is large, and the silicon substrate 1 is convexly curved. That is, when the temperature returns to the normal temperature, the silicon substrate 1 returns to the original dimension L1, but the glass substrate 2 side is thermoset and fixed while extending from the silicon substrate 1 side as shown in FIG. 3h
The dimension L2 between 3h and 3h becomes L4 after returning to room temperature, and is smaller than the dimension L1 on the silicon substrate 1 side. As a result, the silicon substrate 1 side is pulled by the heat shrinkage of the glass substrate 2 and is bent.
【0010】このような湾曲が発生すると、液晶パネル
の中央部と外側とでセル厚が異なり、その結果、コント
ラスト、しきい値電圧等にむらが生じてしまい、表示品
質が低下する。また、熱硬化後のシール部3hに常に応力
が作用するため、シリコン基板1およびガラス基板2に
もストレスが発生し、外力が作用したりすると容易に損
傷する恐れがある。When such a curvature occurs, the cell thickness differs between the central portion and the outside of the liquid crystal panel. As a result, the contrast, the threshold voltage and the like become uneven, and the display quality deteriorates. Further, since a stress always acts on the seal portion 3h after the thermosetting, a stress also occurs on the silicon substrate 1 and the glass substrate 2, and there is a possibility that the seal portion 3h may be easily damaged when an external force acts.
【0011】一方、図7(1) に示すように、完成状態の
液晶パネルにおいて、常温ではシリコン基板1とガラス
基板2の寸法が同一であっても、投射型の液晶ディスプ
レイの場合は、大きな光量を要するため、光源8で熱せ
られた高温側の基板(2) の熱膨張量が大きく、反対側の
基板(1) の熱膨張量が少ない。その結果、光源8側の基
板が湾曲し、セル厚が不均一になったり、シール剤3hに
応力が発生する。なお、この図は、反射式の投射型液晶
ディスプレイであり、液晶ディスプレイの画像がスクリ
ーンSに反射され、スクリーンS上に拡大された像が表
示される。On the other hand, as shown in FIG. 7A, in the liquid crystal panel in a completed state, even if the dimensions of the silicon substrate 1 and the glass substrate 2 are the same at room temperature, the size of the projection type liquid crystal display is large. Since a large amount of light is required, the amount of thermal expansion of the high-temperature side substrate (2) heated by the light source 8 is large, and the amount of thermal expansion of the opposite side substrate (1) is small. As a result, the substrate on the light source 8 side is curved, the cell thickness becomes non-uniform, and stress is generated in the sealant 3h. This figure is a reflection type projection type liquid crystal display. An image of the liquid crystal display is reflected on a screen S, and an enlarged image is displayed on the screen S.
【0012】本発明の技術的課題は、このような問題に
着目し、熱膨張率の異なるシリコン基板とガラス基板を
貼り合わせて液晶パネルを製造する際に、基板が湾曲し
たりシール部に応力が発生するのを未然に防止すること
にある。[0012] The technical problem of the present invention focuses on such problems, a different silicon substrate and a glass base plate having thermal expansion coefficients bonded <br/> in manufacturing a liquid crystal panel, the substrate is curved The purpose of the present invention is to prevent the occurrence of stress in the sealing portion.
【0013】[0013]
【課題を解決するための手段】請求項1の発明は、図1
のように、熱膨張率が異なるシリコン基板1とガラス基
板2とを、固化した状態でゴム状の弾力を有する材料3g
により常温下にて貼り合わせて液晶封入空間を形成する
ことを特徴としている。 Means for Solving the Problems The first aspect of the present invention is shown in FIG.
The silicon substrate 1 and the glass substrate 2 having different coefficients of thermal expansion are made of a material 3g having a rubber-like elasticity in a solidified state.
To form a liquid crystal enclosure space at room temperature
It is characterized by:
【0014】[0014]
【作用】前記のように請求項1の発明は、熱膨張率が互
いに異なるシリコン基板1とガラス基板2を貼り合わせ
て液晶封入空間を形成する際に、固化した状態でゴム状
の弾力を有する材料3gを用い常温下にて貼り合わせる。
そのため、熱膨張率の異なる基板同士を貼り合わせて
も、加熱を要しないので、両基板間で熱変化による湾曲
は発生しない。また、図1に示すように液晶表示パネル
として使用している際に、片側の基板が他方より高温に
さらされても、弾性のシール剤3gに拘束されず、平面状
態で伸縮するので、高温側の基板が湾曲することはな
く、またシール剤3gは容易に弾性変形するので、基板側
にストレスが発生することもない。 As described above, according to the first aspect of the invention, the thermal expansion coefficients are mutually different.
Bonding different silicon substrate 1 and glass substrate 2
Te in forming a liquid crystal filling the space, bonded under room temperature using a material 3g having rubber-like elasticity in the solid phased state.
Therefore, substrates with different coefficients of thermal expansion are bonded together.
Does not require heating, so it is curved by heat change between both substrates
Does not occur. Also , as shown in FIG. 1, when used as a liquid crystal display panel , one of the substrates has a higher temperature than the other.
Even if exposed, it is not constrained by 3 g of elastic sealant and is flat.
The substrate on the high temperature side does not bend because
And 3g of sealant can be easily elastically deformed.
No stress occurs.
【0015】[0015]
【実施例】次に本発明による液晶パネルの製造方法が実
際上どのように具体化されるかを実施例で説明する。EXAMPLES Next manufacturing method of a liquid crystal panel according to the present invention will be described how the embodied practically in the Examples.
【0016】図2は請求項1の発明の実施例を示す断面
図であり、熱硬化性樹脂3hを用いず、固化した状態でゴ
ム様の弾力を有する材料でシールするものである。この
ような材料としては、シリコーン系の接着性ゴム剤が適
している。FIG . 2 is a sectional view showing an embodiment of the first aspect of the present invention, in which a thermosetting resin 3h is not used, and a solidified state is sealed with a rubber-like elastic material. As such a material, a silicone-based adhesive rubber agent is suitable.
【0017】図2(a) は液晶パネルの製造方法を示すも
ので、まずガラス基板2とシリコン基板1との間に接着
性ゴム剤3gを塗布し、スペーサ4を挟んで貼り合わせた
状態で、常温で所定時間放置すると、接着性ゴム剤が固
化して、ガラス基板2とシリコン基板1が接着される。FIG. 2A shows a method of manufacturing a liquid crystal panel. First, an adhesive rubber 3g is applied between a glass substrate 2 and a silicon substrate 1, and the glass substrate 2 and the silicon substrate 1 are bonded together with a spacer 4 interposed therebetween. When left at room temperature for a predetermined time, the adhesive rubber agent solidifies, and the glass substrate 2 and the silicon substrate 1 are bonded to each other.
【0018】図3は接着性ゴム剤を使用して液晶パネル
を貼り合わせる方法を工程順に示す斜視図である。 (1)
のように、シリコン基板1には、例えばディスペンサー
25等を利用して、液晶注入口6を除いて、接着性ゴム剤
3gを塗布した後、 (2)のように、内面にシリカボールが
散布されたガラス基板2と重ねる。FIG. 3 is a perspective view showing a method of bonding liquid crystal panels using an adhesive rubber in the order of steps. (1)
As shown in FIG.
Using 25 etc., except for the liquid crystal injection port 6, adhesive rubber
After the application of 3 g, as shown in (2), the glass substrate 2 is overlaid with the glass substrate 2 on which silica balls are dispersed.
【0019】次に、 (3)のようにビニール袋6に入れて
内部を排気し、真空にすることで、両基板1、2間に均
一な圧力を加えて、接着性ゴム剤3gを均一な厚さに押し
延ばす。この状態で、例えば24時間程度常温に放置した
後、真空パック用袋7から取り出して、前記の液晶注入
口6から液晶を注入してから、 (4)のように液晶注入口
6を接着性ゴム剤で塞ぐと、液晶パネルが完成する。Next, as shown in (3), the interior is evacuated by placing it in a plastic bag 6 and evacuated to apply a uniform pressure between the substrates 1 and 2 to uniformly disperse 3 g of the adhesive rubber agent. And stretch it to the right thickness. In this state, after leaving at room temperature for about 24 hours, for example, it is taken out from the bag 7 for vacuum packing, liquid crystal is injected from the liquid crystal injection port 6, and the liquid crystal injection port 6 is adhered as shown in (4). When sealed with a rubber agent, the liquid crystal panel is completed.
【0020】このように、固化した状態でゴム状の弾力
を持つ接着性ゴム剤3gでガラス基板2とシリコン基板1
を貼り合わせた液晶パネルは、熱硬化性樹脂の場合と違
って、加熱を要しないため、ガラス基板2とシリコン基
板1のように熱膨張率の異なる基板同士を貼り合わせた
場合でも、両基板の熱による伸縮が発生しない。As described above, the glass substrate 2 and the silicon substrate 1 are bonded with 3 g of an adhesive rubber agent having a rubber-like elasticity in a solidified state.
Since the liquid crystal panel to which is bonded does not require heating unlike the case of thermosetting resin, even when substrates having different coefficients of thermal expansion such as the glass substrate 2 and the silicon substrate 1 are bonded together, Does not expand or contract due to heat of
【0021】また、投射型の液晶ディスプレイの場合
は、大きな光量を要するため、図2(b) に示すように、
光源8の熱によって、光源8側の基板1が他方の基板2
より熱膨張量が大きい。In the case of a projection type liquid crystal display, a large amount of light is required, and as shown in FIG.
Due to the heat of the light source 8, the substrate 1 on the light source 8 side
Larger thermal expansion.
【0022】そのため、光源8側の基板1がより多く伸
長するが、従来の液晶パネルと違って、接着性ゴム剤3g
で接着されているため、接着性ゴム剤3gが弾性変形する
のみであって、光源8側の基板1は他方の基板2と平行
状態のまま伸長する。したがって、光源8側の基板1が
湾曲するようなことはなく、また接着性ゴム剤3gは可逆
性の弾力に富んでいるので、応力は発生せず、両基板に
ストレスが加わるようなこともない。Therefore, the substrate 1 on the side of the light source 8 expands more, but unlike the conventional liquid crystal panel, 3 g of the adhesive rubber agent is used.
Therefore, only the adhesive rubber 3g is elastically deformed, and the substrate 1 on the light source 8 side extends while being parallel to the other substrate 2. Therefore, the substrate 1 on the side of the light source 8 does not bend, and since the adhesive rubber 3g is rich in reversible elasticity, no stress is generated, and stress may be applied to both substrates. Absent.
【0023】図4は、図3の実施例の方法でシール剤と
して東芝シリコン株式会社製RTVを用いてシールした
液晶パネルと、熱硬化性樹脂で貼り合わされた液晶パネ
ルの、温度変化によるセル厚変化を測定した結果であ
る。横軸のように液晶パネルの温度を次第に上昇させて
いくにつれて、液晶パネルの中央の一点におけるセル厚
が次第に増加していく。FIG. 4 shows a cell thickness of a liquid crystal panel sealed by using an RTV manufactured by Toshiba Silicon Co., Ltd. as a sealant by the method of the embodiment of FIG. 3 and a liquid crystal panel bonded with a thermosetting resin due to a temperature change. It is the result of measuring the change. As the temperature of the liquid crystal panel gradually increases as indicated by the horizontal axis, the cell thickness at one point in the center of the liquid crystal panel gradually increases.
【0024】実線と破線の2本の曲線で示すように、2
点の試料について測定した結果、熱硬化性樹脂でシール
された液晶パネルは、温度上昇に従ってセル厚が急激に
増大しており、 200℃になるとセル厚が5μmも厚くな
るのに対し、接着性ゴム剤でシールされた液晶パネル
は、 200℃になっても1μmも厚くなっていない。As shown by two curves, a solid line and a broken line,
As a result of the measurement of the sample at the point, the cell thickness of the liquid crystal panel sealed with the thermosetting resin increased rapidly with the temperature rise. At 200 ° C, the cell thickness increased by 5 μm. The liquid crystal panel sealed with the rubber agent does not become 1 μm thick even at 200 ° C.
【0025】以上、ガラス基板2の熱膨張率がシリコン
基板1よりも高いことを前提に説明したが、シリコン基
板1の方がガラス基板2よりも大きい場合は、図におけ
る1をガラス基板とし、2をシリコン基板とすれば足り
る。また、各実施例における各部の寸法や熱硬化処理温
度などの条件は、シリコン基板1およびガラス基板2の
材質によって決まる熱膨張係数などから計算によって求
めることができる。The above description has been made on the assumption that the coefficient of thermal expansion of the glass substrate 2 is higher than that of the silicon substrate 1. However, when the silicon substrate 1 is larger than the glass substrate 2, 1 in FIG. It is sufficient if 2 is a silicon substrate. In addition, the conditions such as the size of each part and the thermosetting temperature in each embodiment can be obtained by calculation from the coefficient of thermal expansion determined by the materials of the silicon substrate 1 and the glass substrate 2.
【0026】[0026]
【発明の効果】以上のように、請求項1の発明は、熱硬
化性樹脂を用いず、固化した状態でゴム状の弾力を有す
る材料でシリコン基板1とガラス基板2とを、常温下に
て貼り合わせて液晶封入空間を形成するため、熱膨張率
の異なる基板同士を貼り合わせても、加熱を要しないの
で、両基板間で熱変化による湾曲は発生しない。As described above, according to the first aspect of the present invention, the silicon substrate 1 and the glass substrate 2 are made of a material having a rubber-like elasticity in a solidified state without using a thermosetting resin at room temperature.
Since liquid crystal enclosing spaces are formed by bonding together, even if substrates having different coefficients of thermal expansion are bonded to each other, no heating is required, so that no bending occurs between the two substrates due to a thermal change.
【0027】また、使用時に片側の基板が他方より高温
にさらされても、弾性のシール剤3gに拘束されず、平面
状態で伸縮するので、高温側の基板が湾曲することはな
く、またシール剤3gは容易に弾性変形するので、基板側
にストレスが発生することもない。Also, even if one substrate is exposed to a higher temperature than the other during use, it is not restrained by the elastic sealing agent 3g and expands and contracts in a planar state. Since the agent 3g is easily elastically deformed, no stress is generated on the substrate side.
【図1】本発明による液晶パネルの製造方法の基本原理
を説明する縦断面図である。FIG. 1 is a longitudinal sectional view illustrating a basic principle of a method for manufacturing a liquid crystal panel according to the present invention.
【図2】本発明の実施例を示す縦断面図である。FIG. 2 is a longitudinal sectional view showing an embodiment of the present invention .
【図3】本発明による液晶パネルのシール方法を示す斜
視図である。FIG. 3 is a perspective view showing a liquid crystal panel sealing method according to the present invention .
【図4】図3の方法でシールされた液晶パネルの効果を
示す特性実測図である。FIG. 4 is a characteristic measurement diagram showing the effect of the liquid crystal panel sealed by the method of FIG. 3;
【図5】従来の液晶パネルの熱硬化処理方法を示す縦断
面図である。FIG. 5 is a longitudinal sectional view showing a conventional liquid crystal panel thermosetting method.
【図6】従来の熱硬化性樹脂によるシール方法を示す斜
視図である。FIG. 6 is a perspective view showing a conventional sealing method using a thermosetting resin.
【図7】従来の投射型の液晶ディスプレイを示す縦断面
図である。FIG. 7 is a longitudinal sectional view showing a conventional projection type liquid crystal display.
1 シリコン基板 2 ガラス基板 3h 熱硬化性のシール剤(熱硬化性樹脂) 3g 固化状態で弾性を有するシール剤 4 液晶封入空間 5 スペーサ 6 液晶注入口 7 真空パック袋 8 光源 S スクリーン 25 ディスペンサ DESCRIPTION OF SYMBOLS 1 Silicon substrate 2 Glass substrate 3h Thermosetting sealing agent (thermosetting resin) 3g Sealing agent which has elasticity in solidified state 4 Liquid crystal sealing space 5 Spacer 6 Liquid crystal injection port 7 Vacuum packing bag 8 Light source S screen 25 Dispenser
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) G02F 1/1339 505 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 7 , DB name) G02F 1/1339 505
Claims (1)
製造方法において、 互いに熱膨張率の異なるシリコン基板とガラス基板と
を、固化した状態でゴム状の弾力を有する材料により常
温下にて貼り合わせて液晶封入空間を形成する工程を含
むことを特徴とする液晶パネルの製造方法。1. A liquid crystal panel having liquid crystal encapsulated therein.
In the manufacturing method, the silicon substrate and a glass substrate having a different thermal expansion coefficients from each other
The atmospheric of a material having rubber-like elasticity in solidified state
Includes the process of forming the liquid crystal enclosure space by bonding under temperature
Method of manufacturing a liquid crystal panel, wherein the free it.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33087891A JP3173518B2 (en) | 1991-12-13 | 1991-12-13 | Liquid crystal panel manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33087891A JP3173518B2 (en) | 1991-12-13 | 1991-12-13 | Liquid crystal panel manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05165036A JPH05165036A (en) | 1993-06-29 |
JP3173518B2 true JP3173518B2 (en) | 2001-06-04 |
Family
ID=18237526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33087891A Expired - Lifetime JP3173518B2 (en) | 1991-12-13 | 1991-12-13 | Liquid crystal panel manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3173518B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200490137Y1 (en) * | 2017-07-19 | 2019-10-01 | 삼성중공업 주식회사 | Measuring Apparatus |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016146449A (en) | 2015-02-09 | 2016-08-12 | トヨタ自動車株式会社 | Semiconductor device manufacturing method |
JP6844948B2 (en) * | 2016-02-10 | 2021-03-17 | Aiメカテック株式会社 | A vacuum bonding device, a vacuum bonding system using the device, and a vacuum bonding method using the system. |
-
1991
- 1991-12-13 JP JP33087891A patent/JP3173518B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200490137Y1 (en) * | 2017-07-19 | 2019-10-01 | 삼성중공업 주식회사 | Measuring Apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPH05165036A (en) | 1993-06-29 |
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