JP6843621B2 - 目標とする高い洗浄性能を得るためのこぶの比率 - Google Patents

目標とする高い洗浄性能を得るためのこぶの比率 Download PDF

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Publication number
JP6843621B2
JP6843621B2 JP2016553552A JP2016553552A JP6843621B2 JP 6843621 B2 JP6843621 B2 JP 6843621B2 JP 2016553552 A JP2016553552 A JP 2016553552A JP 2016553552 A JP2016553552 A JP 2016553552A JP 6843621 B2 JP6843621 B2 JP 6843621B2
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Japan
Prior art keywords
hump
brush
humps
diameter
ratio
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JP2016553552A
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English (en)
Japanese (ja)
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JP2017513210A (ja
JP2017513210A5 (cg-RX-API-DMAC7.html
Inventor
チンタン・パテル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
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Entegris Inc
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Publication of JP2017513210A publication Critical patent/JP2017513210A/ja
Publication of JP2017513210A5 publication Critical patent/JP2017513210A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning In General (AREA)
  • Brushes (AREA)
JP2016553552A 2014-02-20 2015-02-20 目標とする高い洗浄性能を得るためのこぶの比率 Active JP6843621B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461942231P 2014-02-20 2014-02-20
US61/942,231 2014-02-20
PCT/US2015/016949 WO2015127301A1 (en) 2014-02-20 2015-02-20 Nodule ratios for targeted enhanced cleaning performance

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020165904A Division JP7097415B2 (ja) 2014-02-20 2020-09-30 目標とする高い洗浄性能を得るためのこぶの比率

Publications (3)

Publication Number Publication Date
JP2017513210A JP2017513210A (ja) 2017-05-25
JP2017513210A5 JP2017513210A5 (cg-RX-API-DMAC7.html) 2018-04-05
JP6843621B2 true JP6843621B2 (ja) 2021-03-17

Family

ID=53879067

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016553552A Active JP6843621B2 (ja) 2014-02-20 2015-02-20 目標とする高い洗浄性能を得るためのこぶの比率
JP2020165904A Active JP7097415B2 (ja) 2014-02-20 2020-09-30 目標とする高い洗浄性能を得るためのこぶの比率

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020165904A Active JP7097415B2 (ja) 2014-02-20 2020-09-30 目標とする高い洗浄性能を得るためのこぶの比率

Country Status (4)

Country Link
US (1) US10790167B2 (cg-RX-API-DMAC7.html)
JP (2) JP6843621B2 (cg-RX-API-DMAC7.html)
TW (1) TWI670763B (cg-RX-API-DMAC7.html)
WO (1) WO2015127301A1 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2552512A (en) * 2016-07-26 2018-01-31 Matchstick Monkey Ltd An improved teething device
US11766703B2 (en) * 2018-08-15 2023-09-26 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for wafer cleaning
US20200203192A1 (en) * 2018-12-14 2020-06-25 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Backside brush for cleaning wafer and cleaning apparatus having the same
US11109667B2 (en) * 2019-10-16 2021-09-07 Tung An Development Ltd. Device of bi-spiral cleaning brush
US12131896B2 (en) * 2021-08-30 2024-10-29 Taiwan Semiconductor Manufacturing Company Ltd. Method for wafer backside polishing
CN114227526B (zh) * 2022-02-28 2022-06-07 西安奕斯伟材料科技有限公司 一种研磨载台、研磨装置、研磨方法及硅片

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US937509A (en) * 1908-03-09 1909-10-19 Donald A Carpenter Lavatory-fixture.
US4098728A (en) 1976-01-02 1978-07-04 Solomon Rosenblatt Medical surgical sponge and method of making same
JPS596974A (ja) 1982-07-05 1984-01-14 カネボウ株式会社 洗浄方法
JPH03155551A (ja) 1989-11-14 1991-07-03 Seiko Epson Corp 洗浄用治具
US6080092A (en) * 1994-10-06 2000-06-27 Xomed Surgical Products, Inc. Industrial cleaning sponge
JP3680185B2 (ja) 1996-07-19 2005-08-10 アイオン株式会社 洗浄用ローラ
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
JP3403108B2 (ja) 1999-02-26 2003-05-06 アイオン株式会社 洗浄用スポンジローラ
JP3378015B2 (ja) * 1996-11-08 2003-02-17 アイオン株式会社 洗浄用スポンジローラ
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP2000270929A (ja) 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
JP2001358110A (ja) 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
JP2004298767A (ja) * 2003-03-31 2004-10-28 Aion Kk 洗浄用多孔質ロール体
JP4965253B2 (ja) 2003-08-08 2012-07-04 インテグリス・インコーポレーテッド 回転可能ベース上に鋳造されるモノリシック多孔性パッドを作製する方法および材料
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
US8092730B2 (en) 2005-12-06 2012-01-10 Entegris, Inc. Molded rotatable base for a porous pad
JP2009066527A (ja) 2007-09-13 2009-04-02 Nec Electronics Corp 洗浄用ローラおよび洗浄装置
JP2009117765A (ja) 2007-11-09 2009-05-28 Aion Kk 洗浄用スポンジローラ
JP5470746B2 (ja) * 2008-05-22 2014-04-16 富士通セミコンダクター株式会社 半導体装置の製造方法
US8555458B2 (en) * 2008-06-30 2013-10-15 Aion Co., Ltd Cleaning sponge roller
US9524886B2 (en) 2009-05-15 2016-12-20 Illinois Tool Works Inc. Brush core and brush driving method
KR20130038806A (ko) * 2010-02-22 2013-04-18 인티그리스, 인코포레이티드 Ｃｍｐ 후 세정 브러시
JP5535687B2 (ja) 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
WO2013049207A2 (en) 2011-09-26 2013-04-04 Entegris, Inc. Post-cmp cleaning apparatus and method
US20130255721A1 (en) * 2012-04-03 2013-10-03 Illinois Tool Works Inc. Concave nodule sponge brush

Also Published As

Publication number Publication date
JP2021013028A (ja) 2021-02-04
TWI670763B (zh) 2019-09-01
JP7097415B2 (ja) 2022-07-07
WO2015127301A1 (en) 2015-08-27
JP2017513210A (ja) 2017-05-25
US10790167B2 (en) 2020-09-29
TW201539567A (zh) 2015-10-16
US20170018422A1 (en) 2017-01-19

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