JP6840515B2 - Electronic components - Google Patents

Description

The present invention relates to an electronic component mounted on a substrate with the bottom of the main body in contact with or close to the substrate.

As this type of electronic component, the electronic component disclosed in Patent Document 1 below is known. This electronic component is configured to include a rectangular parallelepiped electronic component body, and a first external electrode and a second external electrode provided at both ends of the electronic component body. When mounting this electronic component on a mounting board, the first external electrode and the first land electrode of the mounting board face each other, and the second external electrode and the second land electrode of the mounting board face each other. , The first main surface (bottom) of the electronic component main body and the mounting substrate are bonded with a resin adhesive to fix the electronic component main body to the mounting substrate. Next, a flow process is performed to form a first solder layer so as to connect the first land electrode and the first external electrode, and to connect the second land electrode and the second external electrode. A second solder layer is formed on the surface. As a result, the electronic components are mounted on the mounting board.

Japanese Unexamined Patent Publication No. 2013-105969 (Pages 8-9, Fig. 1)

However, the conventional electronic components including the above-mentioned electronic components have the following problems to be improved. Specifically, the conventional electronic component of this type is fixed to the mounting substrate by adhering the electronic component main body and the mounting substrate with an adhesive or the like as described above. Here, from the viewpoint of improving heat dissipation efficiency, it is preferable that the electronic component and the mounting substrate are brought into close contact with each other (the distance between the two is narrowed). However, when the amount of the adhesive applied is large, the thickness of the adhesive becomes thick and the electronic component and the mounting substrate are separated from each other, resulting in a decrease in adhesiveness. On the other hand, when the amount of the adhesive applied is too small, the adhesiveness can be improved, but the adhesiveness of the electronic component to the substrate is lowered. In this case, a method is conceivable in which, after applying a certain amount of adhesive, the electronic components placed on the mounting substrate are pressed against the mounting substrate to improve the adhesiveness and the adhesiveness. However, in this method, the adhesive spreads on the surface of the mounting substrate by pressing the electronic component and penetrates between the land electrode (conductor pattern of the substrate) and the external electrode, whereby the land electrode and the external electrode are electrically connected. Connection may be hindered. In addition, this method also has a problem that the mounting cost increases due to the use of a large amount of adhesive.

The present invention has been made in view of the above problems, and has realized improvement of heat dissipation efficiency, improvement of adhesiveness to a substrate, and cost reduction without obstructing an electrical connection between a substrate and an electronic component. The main purpose is to provide the electronic components to be obtained.

The electronic component according to claim 1 for achieving the above object includes a main body portion and a conductive conductor portion extending outward from the main body portion, and the bottom portion of the main body portion is brought into contact with or close to a substrate. It is an electronic component mounted on the substrate in a state of being provided with a holding portion for holding the main body portion, and the holding portion is arranged on the base portion arranged around the main body portion and the base portion. It is provided with a first movement restricting portion that regulates the movement of the main body portion in a first direction from the top portion toward the bottom portion in a non-loading state in which no external force is applied to the top portion of the main body portion. The base portion is provided with a wall portion arranged so as to face the side surface of the main body portion, and the first movement restricting portion is the electronic component along the inner surface of the wall portion. An arm portion that is elastically deformable so that one end portion extending in the first direction and located on the bottom side is in contact with and separated from the inner surface, and the one end portion so as to project in a direction away from the inner surface. In the unloaded state, the claw portion engages with the bottom portion to restrict the movement of the main body portion in the first direction, and the claw portion is formed on the top of the main body portion. In a load state in which an external force is applied, the elastic deformation of the arm portion disengages the bottom portion from the claw portion, and the movement restriction of the main body portion in the first direction is released. ..

The electronic component according to claim 2 is the electronic component according to claim 1, wherein the conductor portion has a tip portion protruding in the first direction from the base end portion of the holding portion where the bottom side is located. It is configured as follows.

The electronic component of claim 3, wherein, in the electronic component according to claim 2, wherein the conductor portion includes an extending out the lead from the main body portion, attached to said base portion together with the conductive wire is connected It is configured to include a terminal portion as the tip portion.

Further, the electronic component according to claim 4 is the electronic component according to any one of claims 1 to 3 , when the holding portion moves the main body portion in the first direction by a predetermined distance. A second movement restricting unit that engages with the main body unit and regulates the movement of the main body unit in the direction opposite to the first direction is provided.

According to the electronic component according to claim 1, by providing the first movement restricting portion that regulates the movement of the main body portion in the first direction in the unloaded state, the main body portion is placed close to the substrate for fixing. Before the adhesive is spread, the tip of the conductor can be brought into contact with the conductor pattern of the substrate via a solder paste or the like for connection. Therefore, according to this electronic component, the adhesive spread between the substrate and the bottom of the main body covers the conductor pattern or the solder paste, so that the tip of the conductor and the conductor pattern are electrically connected. It is possible to surely prevent the situation of being hindered. Further, according to this electronic component, by pushing the main body portion in the first direction, the main body portion and the substrate can be sufficiently brought close to each other, so that the heat generated by the electronic component is efficiently conducted to the substrate. As a result, the heat dissipation efficiency can be sufficiently improved. Further, according to this electronic component, by pushing the main body portion in the first direction, the adhesive can be spread uniformly and in a sufficiently wide range, so that the adhesiveness of the main body portion to the substrate is sufficiently improved. be able to. Furthermore, according to this electronic component, by pushing the main body in the first direction, a small amount of adhesive can be spread uniformly and over a sufficiently wide range, thus preventing excessive use of the adhesive. As a result, the amount of adhesive used can be reduced, and as a result, the cost can be reduced accordingly.

According to the electronic component according to claim 2, the conductor portion is configured so that the tip portion protrudes in the first direction from the base end portion of the holding portion where the bottom side is located, so that the adhesive is spread before being spread. Since the process of bringing the tip of the conductor into contact with the conductor pattern can be reliably performed, the situation in which the electrical connection between the tip of the conductor and the conductor pattern is hindered by the spread adhesive is further improved. It can be reliably prevented.

According to the electronic component according to claim 3, the conductor portion is provided with a conducting wire extending from the main body portion and a terminal portion to which the conducting wire is connected and attached to the base portion, so that the conductor portion has high rigidity. Since the terminal portion can be used, for example, unlike the configuration in which the conductor portion provided only with the conducting wire (not provided with the terminal portion) is used, the deformation of the conductor portion when the main body portion is pushed in the first direction is ensured. Can be prevented.

Further, in the electronic component according to claim 1, wherein the elastically deformable arm portion toward and away from one end extending in a first orientation relative to the inner surface along the inner surface of the wall portion of the base portion, The first movement restricting portion is configured with a claw portion formed at one end so as to project in a direction away from the inner surface. Therefore, according to this electronic component, the claw portion engages with the bottom portion of the main body portion in a non-load state in which no external force is applied to the top portion of the main body portion, and the movement of the main body portion in the first direction is reliably regulated. In addition to being able to do so, the elastic deformation of the arm in a load state where an external force is applied to the top disengages the engagement between the bottom and the claw, and the movement restriction of the main body in the first direction is surely released. Can be done.

According to the electronic component according to claim 4 , when the main body portion moves in the first direction by a predetermined distance, the main body portion engages with the main body portion and moves in the direction opposite to the first direction. By configuring the holding portion with a second movement restricting portion that regulates the movement distance of the main body portion, a predetermined distance is required for the bottom portion of the main body portion to be sufficiently close to the substrate in the first direction of the main body portion. In the work of mounting the electronic component on the substrate, the main body portion that has been moved in the first direction and brought close to the substrate can be reliably maintained in that state. Further, according to this electronic component, when the main body portion moves in the first direction by a predetermined distance, the second movement restricting portion engages with the main body portion, so that the operator can visually recognize this. As a result, the operator can surely and easily recognize that the main body is sufficiently close to the substrate, and as a result, workability can be sufficiently improved.

It is a perspective view of the electronic component 1. It is an exploded perspective view of the electronic component 1. It is sectional drawing of electronic component 1. It is 1st explanatory drawing explaining the mounting method of the electronic component 1. It is a 2nd explanatory drawing explaining the mounting method of the electronic component 1. It is a 3rd explanatory diagram explaining the mounting method of the electronic component 1. It is a 4th explanatory diagram explaining the mounting method of the electronic component 1. It is sectional drawing which shows the structure of the electronic component 201. It is sectional drawing which shows the structure of the electronic component 301. It is sectional drawing which shows the structure of the electronic component 401.

Hereinafter, embodiments of electronic components will be described with reference to the accompanying drawings.

First, the configuration of the electronic component 1 shown in FIG. 1 will be described. As an example, the electronic component 1 is an electronic component that functions as a coil (choke coil), and is configured to include a main body portion 11, a holding portion 12, and a conductor portion 13 as shown in FIGS. As shown in FIG. 7, the bottom portion 11a of the main body portion 11 is mounted (mounted) on the substrate 100 in a state of being in contact with or close to the surface of the substrate 100.

As an example, the main body 11 has a core and windings (neither shown) housed in a case, and is formed in a rectangular parallelepiped shape as shown in FIGS. 1 and 2.

The holding portion 12 is configured to be able to hold the main body portion 11. Specifically, as shown in FIG. 2, the holding unit 12 includes a base unit 20, a plurality of (four as an example) first movement control unit 21, and a plurality (four as an example) second movement regulation unit. 22 is provided.

As shown in FIG. 2, the base portion 20 includes four wall portions 31a to 31d (hereinafter, also referred to as “wall portion 31” when not distinguished), and is formed in a rectangular frame shape in a plan view. As shown in the above, the wall portions 31a to 31d are arranged around the main body portion 11 so as to face the side surfaces 11c to 11f of the main body portion 11. Further, the substrate portion 20 is made of a non-conductive material. In this case, in the electronic component 1, the base portion 20, the first movement restricting portion 21, and the second movement restricting portion 22 are integrally formed by injection molding a resin as a non-conductive material.

As shown in FIG. 2, the first movement restricting unit 21 is arranged on the base unit 20 and has a main body in a first direction (downward A shown in FIG. 3) from the top 11b of the main body 11 toward the bottom 11a. It has a function of regulating the movement of the portion 11 (the relative movement of the main body portion 11 with respect to the base portion 20). In this case, in the electronic component 1, as shown in FIG. 2, two first movement restricting portions 21 are arranged on the wall portions 31b and 31d of the base portion 20.

Further, as shown in FIG. 3, the first movement restricting portion 21 includes an arm portion 51 and a claw portion 51b formed on one end portion 51a of the arm portion 51. As shown in the figure, the arm portion 51 is formed in a thin plate shape, extends downward A (first direction) along the inner surface 41 of the wall portion 31 of the base portion 20, and one end portion 51a (main body). The end portion located on the bottom portion 11a side of the portion 11) is elastically deformable so as to come into contact with and separate from the inner surface 41. As shown in the figure, the claw portion 51b is formed on one end portion 51a of the arm portion 51 so as to project in a direction away from the inner surface 41 of the wall portion 31 (inward direction B shown in the figure). Further, the claw portion 51b is formed so that the upper surface 51c is slightly inclined downward with respect to the horizontal direction (the surface of the bottom portion 11a of the main body portion 11).

As shown in FIG. 3, the first movement restricting portion 21 has a claw portion 51b in a non-loaded state in which no external force is applied to the top portion 11b of the main body portion 11 (a state in which the claw portion 51b is not pressed against the top portion 11b described later). Engage with the bottom portion 11a of the main body portion 11 (specifically, the edge portion of the bottom portion 11a) to regulate the movement of the main body portion 11 downward A (the relative movement of the main body portion 11 with respect to the base portion 20). .. Further, the first movement restricting portion 21 has a bottom portion 11a of the main body portion 11 due to elastic deformation of the arm portion 51 in a load state in which an external force is applied to the top portion 11b of the main body portion 11 (a state in which the arm portion 11b is pressed against the top portion 11b described later). The engagement between the claw portion 51b and the claw portion 51b is released, and the movement restriction of the main body portion 11 to the downward A is released.

The second movement restricting unit 22 is arranged on the base unit 20 as shown in FIG. 2, and as shown in FIG. 7, the main body 11 moves downward A by a predetermined distance L. Engage with the portion 11 (the edge of the top portion 11b) to regulate the movement of the main body portion 11 (relative movement of the main body portion 11 with respect to the base portion 20) in the upward direction C (opposite to the first direction). It has a function. In this case, in the electronic component 1, as shown in FIG. 2, two second movement restricting portions 22 are arranged on the wall portions 31b and 31d of the base portion 20.

Further, as shown in FIG. 3, the second movement restricting portion 22 has a claw portion 52b formed on the arm portion 52 and one end portion 52a of the arm portion 52 (the end portion located on the top portion 11b side of the main body portion 11). It is configured with and. As shown in the figure, the arm portion 52 is formed in a thin plate shape and extends upward C (opposite to the first orientation) along the inner surface 41 of the wall portion 31 of the base portion 20 at one end. It is configured to be elastically deformable so that the 52a is brought into contact with and separated from the inner surface 41. As shown in the figure, the claw portion 52b is formed on one end portion 52a of the arm portion 52 so as to project inward B away from the inner surface 41 of the wall portion 31.

As shown in FIG. 3, the second movement restricting unit 22 is in a state where the movement of the main body portion 11 downward to A is restricted by the first movement restricting unit 21 (the claw portion 51b of the first movement restricting unit 21 is restricted. In the state of being engaged with the bottom portion 11a of the main body portion 11), the arm portion 52 is elastically deformed and the claw portion 52b is in contact with the side surfaces 11d and 11f of the main body portion 11. Further, as shown in FIG. 7, when the main body portion 11 moves downward A by a distance L, the second movement restricting portion 22 is released from the elastic deformation of the arm portion 52 and the one end portion 52a is turned inward B. As a result, the claw portion 52b engages with the top portion 11b of the main body portion 11 to move the main body portion 11 upward C (opposite to the first direction) (relative of the main body portion 11 to the base portion 20). It has a function to regulate the movement).

The conductor portion 13 is connected to the conductor pattern 102 (see FIG. 7) of the substrate 100 on which the electronic component 1 is mounted via the solder paste 103, and an electric signal or electric power is transmitted between the conductor pattern 102 and the main body portion 11. It is a conductor for conducting input and output, and is configured to include a terminal portion 61 and a conducting wire 62 as shown in FIGS. 1 to 3.

The terminal portion 61 is a member corresponding to the tip portion of the conductor portion 13, and is made of a conductive material (for example, a metal such as copper). Further, as shown in FIG. 3, the terminal portion 61 has a tip portion 61a at the base end portion 12a of the holding portion 12 (one end portion 51a of the arm portion 51 in the first movement restricting portion 21) (the bottom portion 11a side of the component main body 11 is It is attached to the base portion 20 so as to project downward from the located end portion). In this case, as a method of attaching the terminal portion 61 to the base portion 20, a method of press-fitting the terminal portion 61 into the base portion 20, a holding portion 12 (base portion 20, the first movement restricting portion 21, and the second movement restricting portion 22) A method of attaching by insert molding at the time of injection molding, a method of adhering using an adhesive, or the like can be adopted.

As an example, the lead wire 62 is composed of a covered lead wire and extends from the main body portion 11 as shown in FIG. Further, the tip of the lead wire 62 is connected to the terminal portion 61 by soldering or the like.

Next, a method of mounting (mounting) the electronic component 1 on the substrate 100 will be described with reference to the drawings. As shown in FIG. 4, it is assumed that the substrate 100 is formed with a conductor pattern 102 for connecting the conductor portion 13 of the electronic component 1.

First, as shown in FIG. 4, the solder paste 103 is applied to the formation position of the conductor pattern 102 on the surface 101 of the substrate 100, and the electronic component 1 on the surface 101 of the substrate 100 is attached (the main body 11 is fixed). The adhesive 104 is applied to the site. In this case, in order to increase the heat conduction efficiency of the heat generated by the electronic component 1 to the substrate 100, it is preferable to use a heat conductive adhesive having high thermal conductivity as the adhesive 104.

Next, as shown in FIG. 4, with the surface 101 of the substrate 100 facing upward, the conductor pattern 102 (solder paste 103 applied to the conductor pattern 102) and the terminal portion 61 of the conductor portion 13 face each other. The electronic component 1 is moved above the substrate 100.

In this case, in this state (a non-loading state in which no external force is applied to the top portion 11b), as shown in FIG. 4, the claw portion 51b of the first movement restricting portion 21 in the holding portion 12 is the edge of the bottom portion 11a of the main body portion 11. The movement of the main body portion 11 (movement relative to the base portion 20) toward the downward A is restricted by engaging with the portions.

Subsequently, as shown in FIG. 5, the electronic component 1 is placed on the substrate 100 so that the tip portion 61a of the terminal portion 61 comes into contact with the solder paste 103 applied to the conductor pattern 102. Next, as shown in FIG. 6, the top portion 11b of the main body portion 11 is pushed downward A (the load state is such that an external force is applied to the top portion 11b). At this time, the pressing force due to the pushing of the main body portion 11 is applied to the upper surface 51c (see FIG. 3) of the claw portion 51b of the first movement restricting portion 21 that is engaged with the bottom portion 11a of the main body portion 11.

In this case, as shown in FIG. 3, since the upper surface 51c is inclined downward with respect to the horizontal direction, the component force of the pressing force applied to the upper surface 51c is close to the inner surface 41 of the wall portion 31 of the base portion 20. It acts in the direction (outward D shown in FIG. 6). Therefore, the arm portion 51 of the first movement restricting portion 21 is elastically deformed outward D, and the claw portion 51b moves outward D, whereby the engagement between the bottom portion 11a and the claw portion 51b is released and the claw portion 51b is released downward. The restriction on the movement of the main body 11 to A is lifted.

Subsequently, the top portion 11b of the main body portion 11 is further pushed downward A. At this time, as shown in FIG. 6, the bottom portion 11a of the main body portion 11 is close to the surface 101 of the substrate 100, and the adhesive 104 applied to the surface 101 is pushed between the surface 101 and the bottom portion 11a. Can be unfolded.

Then, as shown in FIG. 7, the top portion 11b of the main body portion 11 is further pushed downward A to bring the bottom portion 11a sufficiently close to the surface 101 of the substrate 100. At this time, the adhesive 104 is further spread between the surface 101 and the bottom 11a.

Here, the electronic component 1 has a holding portion 12 that regulates the movement of the main body portion 11 toward the downward direction A (movement relative to the base portion 20), and a tip that is directed downward from the base end portion 12a of the holding portion 12. It is provided with a conductor portion 13 having a protruding portion. Therefore, in this electronic component 1, as shown in FIG. 5, the terminal portion is placed on the substrate 100 before the main body portion 11 is placed close to the surface 101 of the substrate 100 and the adhesive 104 is spread out. 61 is in contact with the conductor pattern 102 via the solder paste 103. Therefore, in the electronic component 1, the adhesive 104 spread between the surface 101 and the bottom portion 11a applies the conductor pattern 102 and the solder paste 103 before the terminal portion 61 and the solder paste 103 (conductor pattern 102) come into contact with each other. By covering the terminal portion 61, it is possible to reliably prevent a situation in which the electrical connection between the terminal portion 61 and the solder paste 103 (conductor pattern 102) is obstructed.

Further, in this electronic component 1, by pushing the main body 11 downward to A, the main body 11 can be sufficiently brought close to the substrate 100, so that the heat generated by the electronic component 1 is conducted to the substrate 100 for efficiency. As a result of being able to dissipate heat effectively, it is possible to sufficiently improve the heat dissipation efficiency. Further, by pushing the main body 11 downward A, the adhesive 104 can be spread uniformly and in a sufficiently wide range, so that the adhesiveness of the main body 11 to the substrate 100 can be sufficiently improved. ing. Further, in this electronic component 1, by pushing the main body portion 11 downward A, a small amount of the adhesive 104 can be spread uniformly and in a sufficiently wide range, so that excessive use of the adhesive 104 can be prevented. As a result, the amount of the adhesive 104 used can be reduced, and as a result, the cost can be reduced accordingly.

On the other hand, as shown in FIG. 7, when the main body portion 11 moves downward A by the distance L, the elastic deformation of the arm portion 52 in the second movement restricting portion 22 is released and one end portion 52a moves inward B. As a result, the claw portion 52b engages with the top portion 11b of the main body portion 11, thereby restricting the movement of the main body portion 11 upward C. Further, when the main body portion 11 moves downward A by a distance L, the claw portion 52b engages with the top portion 11b of the main body portion 11, so that the operator visually recognizes this, and the main body portion 11 becomes the substrate 100. As a result of the operator being able to reliably and easily recognize that they are sufficiently close to each other, it is possible to improve workability.

Subsequently, the adhesive 104 is cured by maintaining this state (the state shown in FIG. 7) for a predetermined time. As a result, the main body 11 is adhered to the substrate 100 and the electronic component 1 is fixed. The adhesive 104 may be cured during the reflow treatment, which will be described later, or after the reflow treatment is completed.

Next, a reflow process is performed on the substrate 100 to which the electronic component 1 is fixed, the solder paste 103 is melted, and the conductor pattern 102 and the terminal portion 61 are soldered. This completes the mounting of the electronic component 1.

As described above, according to the electronic component 1, the main body portion 11 is provided on the surface 101 of the substrate 100 by providing the first movement restricting portion 21 that regulates the movement of the main body portion 11 downward A in the unloaded state. The tip of the conductor portion 13 can be brought into contact with the conductor pattern 102 via the solder paste 103 before the adhesive 104 is spread out in close proximity. Therefore, according to the electronic component 1, the adhesive 104 spread between the surface 101 and the bottom portion 11a covers the conductor pattern 102 and the solder paste 103 to form the tip portion of the conductor portion 13 and the conductor pattern 102. It is possible to reliably prevent a situation in which the electrical connection is obstructed. Further, according to the electronic component 1, by pushing the main body 11 downward to A, the main body 11 and the substrate 100 can be sufficiently brought close to each other, so that the heat generated by the electronic component 1 is conducted to the substrate 100. As a result of being able to dissipate heat efficiently, the heat dissipation efficiency can be sufficiently improved. Further, according to the electronic component 1, by pushing the main body 11 downward to A, the adhesive 104 can be spread uniformly and in a sufficiently wide range, so that the adhesiveness of the main body 11 to the substrate 100 is sufficient. Can be improved. Further, according to the electronic component 1, by pushing the main body portion 11 downward A, a small amount of the adhesive 104 can be spread uniformly and in a sufficiently wide range, so that the excessive use of the adhesive 104 can be avoided. As a result of being able to prevent and reduce the amount of the adhesive 104 used, the cost can be reduced accordingly.

Further, according to the electronic component 1, since the conductor portion 13 having the tip portion protruding downward A from the base end portion 12a of the holding portion 12 is formed, the conductor portion 13 is formed before the adhesive 104 is spread. Since the step of bringing the tip portion into contact with the conductor pattern 102 can be reliably performed, the situation in which the electrical connection between the tip portion of the conductor portion 13 and the conductor pattern 102 is hindered by the spread adhesive 104 is further improved. It can be reliably prevented.

Further, according to the electronic component 1, the conducting wire 62 extending from the main body portion 11 and the conducting wire 62 are connected to the base portion 20 so as to project downward from the base end portion 12a of the holding portion 12 to the base portion 20. Since the conductor portion 13 is configured with the attached terminal portion 61, the terminal portion 61 having high rigidity can be used. Therefore, for example, a conductor provided with only the conducting wire 62 (not provided with the terminal portion 61). Unlike the configuration using the portion 13, the deformation of the conductor portion 13 when the main body portion 11 is pushed downward A can be reliably prevented.

Further, in the electronic component 1, the arm portion 51 that extends downward A along the inner surface 41 of the wall portion 31 and can be elastically deformed so that the one end portion 51a comes into contact with and separates from the inner surface 41, and the inner surface 41. The first movement restricting portion 21 is configured to include a claw portion 52b formed at one end portion 51a so as to project inwardly away from each other. Therefore, according to the electronic component 1, the claw portion 52b engages with the bottom portion 11a of the main body portion 11 in a non-loaded state in which no external force is applied to the top portion 11b of the main body portion 11, and the main body portion 11 faces downward A. The movement can be reliably regulated, and the bottom portion 11a and the claw portion 52b are disengaged by the elastic deformation of the arm portion 51 under a load state in which an external force is applied to the top portion 11b, so that the main body portion 11 moves downward A. Movement restrictions can be reliably lifted.

Further, according to the electronic component 1, when the main body portion 11 moves downward A by a distance L, it engages with the main body portion 11 and restricts the movement of the main body portion 11 upward C. By configuring the holding portion 12 with the above, the moving distance of the downward A of the main body portion 11 required for the bottom portion 11a of the main body portion 11 to be sufficiently close to the surface 101 of the substrate 100 is defined as the distance L. In the work of mounting the electronic component 1 on the substrate 100, the main body 11 which is moved downward A and brought close to the substrate 100 can be reliably maintained in that state. Further, according to the electronic component 1, when the main body portion 11 moves downward by the distance L, the claw portion 52b engages with the top portion 11b of the main body portion 11, so that the operator can visually recognize this. As a result of the operator being able to reliably and easily recognize that the main body 11 is sufficiently close to the substrate 100, workability can be sufficiently improved.

The configuration of the electronic component is not limited to the configuration of the electronic component 1 described above. For example, as shown in FIG. 8, the electronic component 201 provided with the first movement regulation unit 221 can be adopted instead of the first movement regulation unit 21 described above. In the following description, the same components as those of the electronic component 1 described above will be designated by the same reference numerals, and duplicate description will be omitted. The first movement restricting portion 221 is composed of, for example, an arc-shaped curved leaf spring, and is arranged on the wall portions 31b and 31d of the base portion 20 of the holding portion 12, respectively. In the electronic component 201, the first movement restricting unit 221 presses the side surfaces 11d and 11f of the main body portion 11 inward B (direction away from the inner surface 41) shown in the figure, thereby causing the main body portion to face downward A. Regulate the movement of 11. Also in this electronic component 201, the bottom portion 11a of the main body portion 11 is sufficiently brought close to the substrate 100 without obstructing the electrical connection between the terminal portion 61 and the conductor pattern 102 (solder paste 103), and the main body portion 11 is moved. It can be securely fixed to the substrate 100. Therefore, it is possible to realize the same effect as the above-mentioned effect (improvement of heat dissipation efficiency, improvement of adhesiveness, and reduction of cost) of the electronic component 1.

Further, the electronic component 301 shown in FIG. 9 can also be adopted. In this electronic component 301, a conducting wire 362 is used as the conductor portion instead of the conductor portion 13 described above. That is, in this electronic component 301, the conductor portion is composed of only the conducting wire 362 (without providing the terminal portion 61). In this case, the lead wire 362 has a higher rigidity than the lead wire 62 described above. Further, in this electronic component 301, the tip end portion 362a of the lead wire 362 is configured to protrude downward A from the base end portion 12a of the holding portion 12. Further, in the lead wire 362, the upper portion of the tip portion 362a is fixed to the base portion 20 by the adhesive 362b. When the electronic component 301 is mounted on the substrate 100, as shown in the figure, the electronic component 301 is mounted on the substrate so that the tip portion 362a of the conducting wire 362 is brought into contact with the solder paste 103 applied to the conductor pattern 102 of the substrate 100. By placing it on the 100 and subsequently pressing the top 11b of the main body 11 downward with a fingertip, the electrical connection between the tip 362a of the lead wire 362 and the solder paste 103 (conductor pattern 102) is not hindered. The bottom portion 11a of the main body portion 11 can be sufficiently brought close to the substrate 100, and the main body portion 11 can be securely fixed to the substrate 100. Therefore, the same effects as those of the above-mentioned electronic components 1,201 (improvement of heat dissipation efficiency, improvement of adhesiveness, and cost reduction) can be realized in this electronic component 301 as well.

Further, as shown in FIG. 10, when the main body portion 11 moves downward A by a distance L, the recesses 11g with which the claw portion 52b of the second movement restricting portion 22 engages are provided on the side surfaces 11d and 11f of the main body portion 11. The electronic component 401 to be formed can also be adopted.

Further, the tip end portion of the conductor portion (in the above example, the tip end portion 61a of the terminal portion 61 and the tip end portion 362a of the conductor wire 362) is configured to protrude downward A from the base end portion 12a of the holding portion 12. Although the example has been described above, for example, when the conductor pattern 102 connecting the conductor portions is located above the base end portion 12a of the holding portion 12, the tip portion of the conductor portion is positioned above the base end portion 12a. (A configuration in which the tip end portion of the conductor portion does not protrude downward A from the base end portion 12a) can also be adopted.

Further, although the example applied to the electronic component 1 functioning as a coil (choke coil) has been described above, it can be applied to various electronic components other than the coil such as a resistor, a capacitor, and a semiconductor element (for example, a diode).

Further, the example of fixing the main body portion 11 to the substrate 100 with the adhesive 104 (thermally conductive adhesive) has been described above, but the main body portion 11 is attached to the substrate 100 with the adhesive tape having high thermal conductivity (thermally conductive adhesive tape). It can also be fixed.

Further, the main body portion 11 can be fixed to the substrate 100 by a potting process. In this case, the electronic component 1 (or the electronic components 201, 301) is attached to the substrate 100 so that the terminal portion 61 (or the tip portion 362a of the conducting wire 362) is brought into contact with the solder paste 103 applied to the conductor pattern 102 of the substrate 100. A potting material (resin material) is supplied to the surface 101 of the substrate 100 in a state before the main body 11 is pressed against the substrate 100 (a state in which the bottom 11a of the main body 11 and the substrate 100 are separated from each other). Then, the main body 11 is pressed against the substrate 100 before the potting material is cured, and then the potting material is cured. By mounting the electronic component 1 (or the electronic component 201, 301) in this way, the same effect as the above-mentioned electronic component 1,201 (improvement of heat dissipation efficiency, improvement of adhesiveness, and cost reduction) is realized. can do.

1,201,301,401 Electronic components 11 Main body 11a Bottom 11b Top 12 Holding 13 Conductor 20 Base 20a Base end 21,221 First movement control 22 Second movement control 31a to 31d Wall 41 Inner surface 51 Arm 51a One end 52b Claw 61 Terminal 62,632 Conductor 100 Board A Downward C Upward B Inward L Distance

Claims (4)

An electronic component that includes a main body and a conducting conductor that extends from the main body to the outside, and is mounted on the board with the bottom of the main body in contact with or close to the board.
A holding portion for holding the main body portion is provided.
The holding portion is arranged around the main body portion and the base portion, and is arranged from the top portion toward the bottom portion in a non-load state in which no external force is applied to the top portion of the main body portion. An electronic component configured to include a first movement restricting unit that regulates the movement of the main body portion in the first direction.
The base portion includes a wall portion arranged so as to face the side surface of the main body portion.
The first movement restricting portion is an arm that is elastically deformable so that one end portion that extends in the first direction along the inner surface of the wall portion and is located on the bottom side thereof is brought into contact with and separated from the inner surface. A portion and a claw portion formed at one end portion so as to project in a direction away from the inner surface are provided, and the claw portion engages with the bottom portion in the unloaded state to move to the first direction. In addition to restricting the movement of the main body, the elastic deformation of the arm in a load state in which an external force is applied to the top of the main body disengages the bottom and the claw to release the first orientation. An electronic component that is configured to lift restrictions on the movement of the main body to the device . The electronic component according to claim 1, wherein the conductor portion is configured such that the tip portion protrudes in the first direction from the base end portion of the holding portion where the bottom side is located. The conductor portion includes an extending out the lead from the body portion, the conductors of the terminal portion and the Configured claim 2 provided with as the tip attached to the base portion is connected Electronic components. The holding portion engages with the main body portion when the main body portion moves in the first direction by a predetermined distance, and moves the main body portion in a direction opposite to the first direction. The electronic component according to any one of claims 1 to 3, further comprising a second movement control unit for regulation.

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