JP6604406B2 - Power supply - Google Patents

Description

  The present invention relates to a power supply device such as a DC-DC converter.

  A power supply device such as a DC-DC converter or a charging device equipped with the DC-DC converter includes, for example, a transformer including a primary coil and a secondary coil, a secondary-side semiconductor component connected to the secondary coil side of the transformer, Some have a choke coil connected to the secondary semiconductor component.

  In such a power supply device, since the component parts are arranged so as to spread on a two-dimensional plane, there is a problem that the power supply device increases in size in the spreading direction of the two-dimensional plane. In order to solve this problem, Patent Document 1 discloses a power supply device in which a secondary-side semiconductor component and a choke coil are stacked in the normal direction of the two-dimensional plane. This facilitates miniaturization of the power supply device.

JP 2012-213309 A

  However, in the power supply device described in Patent Document 1, wiring routing for electrically connecting a plurality of components tends to be complicated. Therefore, when screw terminals, welding, soldering, or the like is used in connecting the terminals of the components, the connecting operation tends to be difficult. Further, when screw tightening, welding, soldering, or the like is used to connect the terminals of the components, a sufficient space for performing these fastening operations is required, and it is difficult to reduce the size of the power supply apparatus.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power supply device capable of improving productivity and downsizing.

One aspect of the present invention is a transformer including a primary coil and a secondary coil;
A primary-side semiconductor component connected to the primary coil side of the transformer;
A secondary-side semiconductor component connected to the secondary coil side of the transformer;
A choke coil connected to the secondary semiconductor component;
A control circuit board connected to at least the primary-side semiconductor component;
A wiring formed by integrating a conductor portion connected to at least one of the transformer, the primary side semiconductor component, the secondary side semiconductor component, the choke coil, and the control circuit board with a resin conductor holding portion. A module, and
The conductor portion includes a connection terminal connected to any one of the transformer, the primary side semiconductor component, the secondary side semiconductor component, the choke coil, and the connected terminal of the control circuit board from the conductor holding portion. Exposed,
At least one of the transformer, the choke coil, and the control circuit board is disposed in at least one of the primary side semiconductor component and the secondary side semiconductor component in a stacking direction that is a normal direction of a main surface thereof. Are arranged in layers,
The wiring module has a two-terminal conductor portion that is the conductor portion formed by projecting the connection terminal in both the laminating directions from the conductor holding portion,
In the both terminal conductor portions, the connection terminals protruding in both the stacking directions from the conductor holding portions are connected to the connected terminals respectively disposed in both the stacking directions of the conductor holding portions,
One of the connection terminal and the connection terminal connected to each other is inserted in the stacking direction with respect to the other, and elastically abuts with each other .
At least one of the connection terminal and the connected terminal is in a power supply device, which is a clip-shaped terminal configured to sandwich a terminal to be connected from a direction orthogonal to the stacking direction .

  The power supply device includes a wiring module in which the conductor portion is integrated with the resin conductor holding portion. And the connection terminal of a conductor part and a to-be-connected terminal are mutually fitted with respect to the other so that it may insert in the lamination direction. Therefore, electrical connection between the connection terminal and the connected terminal can be facilitated. That is, by moving the wiring module relative to the transformer, the primary side semiconductor component, the secondary side semiconductor component, the choke coil, or the control circuit board with the connection terminal facing the connected terminal, the connection terminal And the connected terminal can be fitted. Therefore, the connection terminal and the connected terminal can be connected to each other without using screw tightening, welding, soldering, or the like. As a result, it is not necessary to secure a particularly large space for connection work, and it is easy to reduce the size of the power supply device.

  As described above, according to the present invention, it is possible to provide a power supply device capable of improving productivity and downsizing.

FIG. 3 is a perspective view of the power supply device with the control circuit board removed in the first embodiment. FIG. 3 is an exploded perspective view of the power supply device according to the first embodiment. The schematic cross section for demonstrating the arrangement place of the component of a power supply device in Example 1. FIG. The perspective view which looked at the wiring module in Example 1 from the lower side. FIG. 2 is a schematic cross-sectional view showing how to connect both terminal conductor portions in Example 1, (a) a diagram before connection between a connection terminal and a connected terminal, and (b) a diagram after connection. FIG. 3 is a schematic cross-sectional view showing how to connect one-terminal conductor portions in Example 1, (a) a diagram before connection between a connection terminal and a connected terminal, and (b) a diagram after connection. The perspective view just before a wiring module is laminated | stacked and arrange | positioned with respect to the semiconductor holding member in Example 1. FIG.

  The power supply device can be a DC-DC converter that is mounted on, for example, an electric vehicle or a hybrid vehicle, and that is used to step down high-voltage DC power of a DC power supply to a low-voltage DC voltage and supply it to an auxiliary battery. .

(Example 1)
An embodiment of the power supply device 1 will be described with reference to FIGS.
As shown in FIGS. 1 to 3, the power supply device 1 of this example includes a transformer 13 including a primary coil and a secondary coil, a primary-side semiconductor component 11 connected to the primary coil side of the transformer 13, and a transformer 13. A secondary-side semiconductor component 12 connected to the secondary coil side. Further, the power supply device 1 includes a choke coil 14 connected to the secondary side semiconductor component 12, a control circuit board 15 connected to at least the primary side semiconductor component 11, and the wiring module 2.

  As shown in FIGS. 2 and 4, the wiring module 2 includes a conductor portion connected to at least one of the transformer 13, the primary side semiconductor component 11, the secondary side semiconductor component 12, the choke coil 14, and the control circuit board 15. 3 is integrated with a resin conductor holding portion 21. The power supply device 1 of this example has two wiring modules 2, and the conductor portion 3 of each wiring module 2 is connected to any one of the primary side semiconductor component 11, the secondary side semiconductor component 12, and the control circuit board 15. ing. Moreover, in this example, the conductor part 3 and the conductor holding part 21 are integrated by the insert molding of the conductor part 3 in the conductor holding part 21, and the wiring module 2 is comprised. In addition, the conductor portion 3 exposes the connection terminal 5 connected to any one of the connected terminals 4 of the primary side semiconductor component 11, the secondary side semiconductor component 12, and the control circuit board 15 from the conductor holding portion 21. Become.

As shown in FIGS. 2 and 3, the primary side semiconductor component 11 and the secondary side semiconductor component 12 are laminated with a transformer 13, a choke coil 14, and a control circuit board 15 in the normal direction of the main surface. Has been. That is, the transformer 13 is stacked on the primary semiconductor component 11, and the choke coil 14 is stacked on the secondary semiconductor component 12. In the transformer 13 and the choke coil 14, a control circuit board 15 is laminated and disposed on the side opposite to the side where the primary side semiconductor component 11 and the secondary side semiconductor component 12 are arranged.
And as shown in FIGS. 5-7, the connection terminal 5 and the to-be-connected terminal 4 are mutually fitted so that one may insert in the lamination direction Z with respect to the other.

  The power supply device 1 of this example can be, for example, a DC-DC converter that steps down high-voltage DC power from a DC power supply and converts it to low-voltage DC power. Moreover, the power supply device 1 can be mounted on, for example, an electric vehicle or a hybrid vehicle.

  The primary semiconductor component 11 includes a plurality of switching elements. As the switching element, for example, IGBT (insulated gate bipolar transistor) or MOSFET (MOS type field effect transistor) can be used. The secondary semiconductor component 12 includes a plurality of diodes.

  As shown in FIGS. 2 and 3, the power supply device 1 has the primary-side semiconductor component 11 and the secondary-side semiconductor component 12 mounted side by side on a mounting surface 171 that is one main surface of a metal base plate 17. Yes. Here, in this example, the mounting surface 171 side of the base plate 17 is the upper side, and the opposite side is the lower side. The arrangement direction of the primary side semiconductor component 11 and the secondary side semiconductor component 12 is referred to as a horizontal direction X.

  The power supply device 1 includes a semiconductor holding member 16 that holds the primary-side semiconductor component 11 and the secondary-side semiconductor component 12. That is, the primary side semiconductor component 11 and the secondary side semiconductor component 12 are stacked on the base plate 17 together with the semiconductor holding member 16 while being held by the semiconductor holding member 16. As shown in FIG. 2, the semiconductor holding member 16 includes a first housing portion 161 that houses and arranges the primary-side semiconductor component 11 and a second housing portion 162 that houses and holds the secondary-side semiconductor component 12. The first housing part 161 and the second housing part 162 each penetrate in the stacking direction Z.

  As shown in FIG. 3, the semiconductor holding member 16 and the wiring module 2 are stacked in the stacking direction Z. Further, the semiconductor holding member 16, the plurality of wiring modules 2, and the control circuit board 15 are stacked in the stacking direction Z. In the stacking direction Z, a transformer 13 and a choke coil 14 are disposed between the semiconductor holding member 16 and the control circuit board 15. The primary semiconductor component 11 and the control circuit board 15 are connected by the wiring module 2.

  As shown in FIG. 2, a metal shielding cover 18 is disposed between the transformer 13 and the choke coil 14 and the control circuit board 15. The shielding cover 18 presses and fixes the transformer 13 and the choke coil 14 toward the base plate 17, and protects the control circuit board 15 from electromagnetic noise generated by the transformer 13 and the choke coil 14. Moreover, the opening part is provided in the shielding cover 18 so that the connection terminal 5 of the wiring module 2 may be exposed to the control circuit board 15 side. The shielding cover 18 is omitted as appropriate in the drawings other than FIG.

  Moreover, as shown in FIGS. 1-3, the power supply device 1 of this example has the two wiring modules 2 (2a, 2b). The two wiring modules 2 (2a, 2b) are arranged on the upper surface of the semiconductor holding member 16 holding the primary-side semiconductor component 11 and the secondary-side semiconductor component 12 at positions separated from each other in the lateral direction X. When viewed from the stacking direction Z, one wiring module 2a of the two wiring modules 2 is arranged in a portion along the mutually opposing sides in the primary-side semiconductor component 11 and the secondary-side semiconductor component 12. . The other wiring module 2 b is arranged in a portion along the side opposite to the secondary semiconductor component 12 in the primary semiconductor component 11.

  A support member 19 is disposed at a portion along the side opposite to the primary semiconductor component 11 in the secondary semiconductor component 12. The support member 19 and the conductor holding portions 21 of the two wiring modules 2 support the semiconductor holding member 16 and the control circuit board 15 at a predetermined interval.

As shown in FIGS. 4 and 7, the wiring modules 2 a and 2 b each have a plurality of conductor portions 3. The plurality of conductor portions 3 in the wiring modules 2a and 2b are inserted into the conductor holding portion 21 while being insulated from each other.
As shown in FIGS. 4 to 6, the wiring module 2 is laminated from the conductor holding portion 21 and the two terminal conductor portions 31 that are the conductor portions 3 that project the connection terminals 5 in both the lamination directions Z from the conductor holding portion 21. One terminal conductor part 32 which is the conductor part 3 which protrudes the connection terminal 5 in one side of the direction Z is provided.

As shown in FIG. 5B, the both terminal conductor portions 31 are connected to the connected terminals 4 respectively disposed in both the stacking directions Z of the conductor holding portions 21.
The connection terminal 5 (52) on the upper side of both terminal conductor portions 31 is connected to the through hole 415 of the control circuit board 15 which is the connected terminal 4 arranged on the upper side. That is, the connection terminal 52 on the upper side of the both terminal conductor portions 31 is inserted into the through hole 415 and fitted. The connection terminal 52 protrudes from the conductor holding portion 21 in the stacking direction Z and has a structure that can be compressed and elastically deformed in a direction orthogonal to the stacking direction Z. Thus, when the connection terminal 52 is inserted into the through hole 415, the side surface of the connection terminal 52 comes into pressure contact with the inner wall surface of the through hole 415.

  Further, the lower connection terminal 5 (51) of both terminal conductor portions 31 is connected to the signal terminal 41 of the primary side semiconductor component 11 or the secondary side semiconductor component 12 which is the connected terminal 4 arranged on the lower side. Has been. Examples of the signal terminal 41 include a gate terminal of a semiconductor element and an electrode terminal of a thermistor element molded in a semiconductor component.

  As shown in FIGS. 2 and 5, the primary-side semiconductor component 11 and the secondary-side semiconductor component 12 each have a plurality of terminals that are pulled out in the lateral direction X from the side surfaces, bent upward, and protruded upward. Some of these terminals are the signal terminals 41, which become the connected terminals 4 connected to the wiring module 2.

  As shown in FIG. 5B, the connection terminal 51 is a clip-like terminal configured to sandwich the connected terminal 4 from a direction orthogonal to the protruding direction (stacking direction Z). That is, the connection terminal 51 is configured such that the pair of sandwiching pieces elastically deform in the direction in which the pair of sandwiching pieces are aligned with each other so that the connection terminal 4 is sandwiched in a state where the pair of sandwiching pieces are biased toward each other. It is configured.

  In the two terminal conductor portions 31, a connection portion 311 between the lower connection terminal 51 and the upper connection terminal 52 is embedded in the conductor holding portion 21.

  As shown in FIG. 6, the one-terminal conductor portion 32 connects the pair of connected terminals 4 arranged on one side in the stacking direction Z of the conductor holding portion 21 or the connected terminal 4 and the ground terminal 172. . In this example, the one-terminal conductor portion 32 connects the ground terminal 172 a provided on the base plate 17 and the grounded terminal 42 (connected terminal 4) of the primary side semiconductor component 11, or the ground terminal of the base plate 17. 172b and the grounded terminal 42 (connected terminal 4) of the secondary-side semiconductor component 12 are connected.

  The connection terminal 5 (53) of the one-terminal conductor part 32 clamps the connected terminal 4 from the direction orthogonal to the protruding direction (stacking direction Z), similarly to the connection terminal 51 of the both-terminal conductor part 31 described above. It is the clip-shaped terminal comprised in this.

  As shown in FIG. 2, FIG. 6B, and FIG. 7, the ground terminal 172 is formed by being partially bent upward from the main body portion of the base plate 17. The ground terminal 172 and the connected terminal 4 are overlapped in the thickness direction, and are connected to each other by sandwiching the overlapping portion by the connection terminal 53 of the one-terminal conductor portion 32.

  In the one-terminal conductor part 32, a protruding part 321 protruding above the connection terminal 53 is embedded in the conductor holding part 21.

  As shown in FIGS. 2 and 7, the wiring module 2 has a positioning convex portion 211 protruding toward the semiconductor holding member 16, and the semiconductor holding member 16 has a positioning concave portion 163 on the upper end surface. The wiring module 2 is positioned with respect to the semiconductor holding member 16 by inserting the positioning protrusion 211 into the positioning recess 163.

Next, a method for assembling the power supply device 1 of this example will be described.
First, the semiconductor holding member 16 and the primary-side semiconductor component 11 and the secondary-side semiconductor component 12 held by the semiconductor holding member 16 are placed on the mounting surface 171 of the base plate 17. In this state, the signal terminal 41 (connected terminal 4), the grounded terminal 42 (connected terminal 4) of the primary semiconductor component 11, the signal terminal 41 (connected terminal 4) of the secondary semiconductor component 12, and the grounded The terminal 42 (connected terminal 4) is facing upward.

Next, the wiring module 2 is a semiconductor that holds the primary-side semiconductor component 11 and the secondary-side semiconductor component 12 from the stacking direction Z so that the connected terminal 4 is inserted into each of the plurality of connection terminals 51 and 53. The holding member 16 is laminated. As a result, the plurality of connected terminals 4 in the primary-side semiconductor component 11 and the secondary-side semiconductor component 12 are inserted into the connection terminals 5 of the wiring module 2 at a time and are connected to each other. At this time, the positioning convex portion 211 of the wiring module 2 is inserted into the positioning concave portion 163 of the semiconductor holding member 16.
The above operation is performed for each of the two wiring modules 2 (2a, 2b). The support member 19 is also placed and assembled at a predetermined position on the upper surface of the semiconductor holding member 16.

  Next, the transformer 13 and the choke coil 14 are stacked on the upper surface of the semiconductor holding member 16 that holds the primary-side semiconductor component 11 and the secondary-side semiconductor component 12. At this time, the transformer 13 is disposed on the upper surface of the primary-side semiconductor component 11, and the choke coil 14 is disposed on the upper surface of the secondary-side semiconductor component 12. The transformer 13 and the choke coil 14 can be placed on the upper side of the semiconductor holding member 16 in a state where they are connected to each other. Then, predetermined terminals of the transformer 13 and the choke coil 14 are appropriately connected to predetermined terminals of the primary-side semiconductor component 11 or the secondary-side semiconductor component 12.

  Next, the shielding cover 18 is disposed from above the transformer 13 and the choke coil 14 so as to cover them. Then, the shielding cover 18 and the base plate 17 are fixed at the edges of each other. At this time, the upper connection terminal 52 of the wiring module 2 is exposed and protrudes from the opening provided in the shielding cover 18.

  Next, the control circuit board 15 is laminated and disposed from above the shielding cover 18. At this time, each of the upper connection terminals 52 of the wiring module 2 is appropriately inserted into each of the plurality of through holes 415 that are the connected terminals 4 provided on the control circuit board 15. When the connection terminal 52 is inserted into the through hole 415, the connection terminal 52 is elastically deformed inward. As a result, an outward biasing force is generated in the connection terminal 52, and the connection terminal 52 is fitted in a state of being pressed against the inner wall surface of the through hole 415 by the biasing force.

Thus, the power supply device 1 is assembled.
As described above, the components are assembled and connected to each other by being sequentially laminated in the lamination direction Z. In particular, when the wiring module 2 is moved relative to the other components in the stacking direction Z, the connection terminals 5 and the connected terminals 4 are fitted and connected.

Next, the function and effect of this example will be described.
The power supply device 1 includes a wiring module 2 in which the conductor portion 3 is integrated with a resin conductor holding portion 21. And the connection terminal 5 and the to-be-connected terminal 4 of the conductor part 3 are mutually fitted so that one may be inserted in the lamination direction Z with respect to the other. Therefore, the electrical connection between the connection terminal 5 and the connected terminal 4 can be facilitated. That is, the wiring module 2 is moved relative to the primary side semiconductor component 11, the secondary side semiconductor component 12, or the control circuit board 15 with the connection terminal 5 facing the connected terminal 4. The terminal 5 and the connected terminal 4 can be fitted. Therefore, the connection terminal 5 and the connected terminal 4 can be connected to each other without using screw tightening, welding, soldering, or the like. As a result, it is not necessary to secure a particularly large space for connection work, and it becomes easy to reduce the size of the power supply device 1.

  Further, the wiring module 2 has both terminal conductor portions 31, and the both terminal conductor portions 31 are connected to the connected terminals 4 respectively disposed in both the stacking directions Z of the conductor holding portions 21. Therefore, the electrical connection between the components arranged on both sides of the wiring module 2 in the stacking direction Z can be facilitated.

  In addition, the wiring module 2 includes a single-terminal conductor portion 32 and connects the connected terminal 4 and the ground terminal 172 disposed on one side in the stacking direction Z of the conductor holding portion 21. Therefore, it is possible to facilitate electrical connection between components arranged in one side of the wiring module 2 in the stacking direction Z.

  The semiconductor holding member 16 and the wiring module 2 are stacked in the stacking direction Z. Therefore, by laminating the wiring module 2 on the semiconductor holding member 16 with the connection terminal 5 facing the connection terminal 4, one of the connection terminal 5 (51) and the connection terminal 4 (signal terminal 41) is obtained. However, it is possible to easily realize a configuration in which the other is inserted and fitted in the stacking direction Z.

  Further, the semiconductor holding member 16, the plurality of wiring modules 2, and the control circuit board 15 are stacked in the stacking direction Z. In the stacking direction Z, the transformer 13 and the choke coil 14 are disposed between the semiconductor holding member 16 and the control circuit board 15. Therefore, the power supply device 1 can be prevented from increasing in size in the direction orthogonal to the stacking direction Z. Further, since the transformer 13, the primary-side semiconductor component 11, the secondary-side semiconductor component 12, the choke coil 14, and the control circuit board 15 can be arranged at positions close to each other, the wiring for connecting these electronic components can be shortened. It's easy to do.

  As described above, according to this example, it is possible to provide a power supply device capable of improving productivity and downsizing.

  The present invention is not limited to those described in the above embodiments. For example, the positional relationship among the transformer, the primary side semiconductor component, the secondary side semiconductor component, the choke coil, and the control circuit board can be appropriately changed. Also, the wiring module can be connected to a transformer or choke coil.

  Further, in the above-described embodiment, the wiring module is an example in which the conductor portion and the conductor holding portion are integrated by insert molding the conductor portion into the conductor holding portion. It is not something that can be done. For example, the wiring module may be configured such that the conductor portion and the conductor holding portion are integrated by outsert-molding the conductor portion into the conductor holding portion.

  In addition, the connected terminal and the connecting terminal are not limited to the above-described embodiment as long as one of the connected terminals and the connecting terminal are fitted to each other so as to be inserted in the stacking direction. For example, the configurations of the connecting terminal and the connected terminal shown in the above embodiment may be interchanged. Further, for example, by connecting the other of the connection terminal and the connected terminal so as to cover the outer periphery of one of the connection terminals and the connected terminal, one of the connected terminal and the connected terminal is inserted in the stacking direction with respect to the other. A configuration that fits together can be realized. In addition, the configuration of the power supply device of the present invention can take various forms.

DESCRIPTION OF SYMBOLS 1 Power supply device 11 Primary side semiconductor component 12 Secondary side semiconductor component 13 Transformer 14 Choke coil 15 Control circuit board 2 Wiring module 21 Conductor holding part 3 Conductor part 4 Connected terminal 5 Connection terminal Z Stacking direction

Claims (4)

A transformer (13) comprising a primary coil and a secondary coil;
A primary-side semiconductor component (11) connected to the primary coil side of the transformer (13);
A secondary semiconductor component (12) connected to the secondary coil side of the transformer (13);
A choke coil (14) connected to the secondary semiconductor component (12);
A control circuit board (15) connected to at least the primary semiconductor component (11);
A conductor connected to at least one of the transformer (13), the primary semiconductor component (11), the secondary semiconductor component (12), the choke coil (14), and the control circuit board (15). A wiring module (2) formed by integrating the part (3) with a resin conductor holding part (21);
The conductor portion (3) includes the transformer (13), the primary-side semiconductor component (11), the secondary-side semiconductor component (12), the choke coil (14), and the control circuit board (15). The connection terminal (5) connected to any one of the connected terminals (4) is exposed from the conductor holding portion (21),
At least one of the primary-side semiconductor component (11) and the secondary-side semiconductor component (12) has the transformer (13) and the choke coil (Z) in the stacking direction (Z) that is the normal direction of the main surface thereof. 14) and at least one component of the control circuit board (15) is stacked and arranged,
The wiring module (2) is a two-terminal conductor part (31) which is the conductor part (3) formed by projecting the connection terminal (5) in both the laminating direction (Z) from the conductor holding part (21). Have
In the both terminal conductor portions (31), the connection terminal (5) protruding from the conductor holding portion (21) in both the stacking directions (Z) is connected to the stacking direction (Z of the conductor holding portions (21). ) Are connected to the above-mentioned connected terminals (4) arranged on both sides,
One of the connection terminal (5) and the connected terminal (4) connected to each other is inserted in the stacking direction (Z) with respect to the other, and elastically abuts with each other .
At least one of the connection terminal (5) and the connected terminal (4) is a clip-like terminal configured to sandwich a terminal to be connected from a direction orthogonal to the stacking direction (Z). Device (1).   The wiring module (2) includes a single terminal conductor portion (32) which is the conductor portion (3) formed by projecting the connection terminal (5) from the conductor holding portion (21) in one of the stacking directions (Z). The one-terminal conductor part (32) is a pair of the connected terminals (4) arranged on one side in the stacking direction (Z) of the conductor holding part (21) or the connected terminals. The power supply device (1) according to claim 1, wherein (4) and a ground terminal (172) are connected.   The semiconductor holding member (16) holding the said primary side semiconductor component (11) and the said secondary side semiconductor component (12) is provided, and this semiconductor holding member (16) and the said wiring module (2) are the said lamination | stacking. The power supply device (1) according to claim 1 or 2, wherein the power supply device (1) is stacked in the direction (Z).   The semiconductor holding member (16), the plurality of wiring modules (2), and the control circuit board (15) are stacked in the stacking direction (Z), and in the stacking direction (Z), The transformer (13) and the choke coil (14) are arranged between the semiconductor holding member (16) and the control circuit board (15), and the primary-side semiconductor component (11) and the control are arranged. The power supply device (1) according to claim 3, wherein the power supply device (1) is connected to the circuit board (15) by the wiring module (2).

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