JP2018082035A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component which achieves improvement of heat radiation efficiency and adhesiveness to a substrate and cost reduction without inhibiting electric connection between a substrate and the electronic component.SOLUTION: An electronic component includes: a body part 11; a conductor part 13 for conduction which extends from the body part 11 to the outside; and a holding part 12 which holds the body part 11. The electronic component is configured to be attached to a substrate in a state where a bottom part 11a of the body part 11 is placed in contact with or located close to the substrate. The holding part 12 includes: a base part 20 disposed at a periphery of the body part 11; and a first movement restriction part 21 which is disposed at the base part 20 and restricts movement of the body part 11 in a downward direction A from a top part 11b to the bottom part 11a in a non-load state in which an external force is not applied to the top part 11b of the body part 11.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic component mounted on a substrate in a state where a bottom portion of a main body is in contact with or close to the substrate.

  As this type of electronic component, an electronic component disclosed in Patent Document 1 below is known. This electronic component is configured to include a rectangular parallelepiped electronic component main body, and first and second external electrodes provided at both ends of the electronic component main body. When mounting the electronic component on the mounting board, the first external electrode and the first land electrode of the mounting board are made to face each other, and the second external electrode and the second land electrode of the mounting board are made to face each other. The first main surface (bottom portion) of the electronic component main body and the mounting substrate are bonded with a resin adhesive to fix the electronic component main body to the mounting substrate. Next, a flow process is performed to form a first solder layer so as to connect the first land electrode and the first external electrode, and to connect the second land electrode and the second external electrode. A second solder layer is formed. As a result, the electronic component is mounted on the mounting substrate.

JP 2013-105969 A (page 8-9, FIG. 1)

  However, conventional electronic parts including the above-described electronic parts have the following problems to be improved. Specifically, this type of conventional electronic component is fixed to the mounting substrate by bonding the electronic component main body and the mounting substrate using an adhesive or the like as described above. Here, from the viewpoint of improving the heat dissipation efficiency, it is preferable that the electronic component and the mounting substrate are in close contact (the interval between the two is narrowed). However, when the application amount of the adhesive is large, the thickness of the adhesive is increased and the electronic component and the mounting substrate are separated from each other, and the adhesiveness is lowered. On the other hand, when the application amount of the adhesive is too small, the adhesion can be enhanced, but the adhesion of the electronic component to the substrate is lowered. In this case, after applying a certain amount of adhesive, a method of improving the adhesion while improving the adhesiveness by pressing the electronic component placed on the mounting substrate against the mounting substrate can be considered. However, in this method, the adhesive spreads on the surface of the mounting substrate due to the pressing of the electronic component and penetrates between the land electrode (substrate conductor pattern) and the external electrode, thereby electrically connecting the land electrode and the external electrode. Connection may be hindered. In addition, this method has a problem that the mounting cost is increased by using a large amount of adhesive.

  The present invention has been made in view of such a problem, and realizes improvement in heat dissipation efficiency, improvement in adhesion to the board, and cost reduction without hindering electrical connection between the board and the electronic component. The main purpose is to provide an electronic component to be obtained.

  In order to achieve the above object, an electronic component according to claim 1 is provided with a main body portion and a conductive conductor portion extending from the main body portion to the outside, and the bottom portion of the main body portion is in contact with or close to the substrate. An electronic component mounted on the board in a state of being held, and having a holding part for holding the main body part, the holding part being disposed around the main body part and the base part. And a first movement restricting portion that restricts movement of the main body portion in a first direction from the top portion toward the bottom portion in a non-load state where no external force is applied to the top portion of the main body portion. Has been.

  According to a second aspect of the present invention, in the electronic component according to the first aspect, a tip portion of the conductor portion protrudes in the first direction from a base end portion of the holding portion where the bottom portion side is located. It is configured as follows.

  According to a third aspect of the present invention, in the electronic component according to the first or second aspect, the conductor portion is connected to the conductor portion connected to the lead wire extending from the main body portion and the base portion. And a terminal portion as the tip portion.

  The electronic component according to claim 4 is the electronic component according to any one of claims 1 to 3, wherein the base portion includes a wall portion disposed so as to face a side surface of the main body portion, The first movement restricting portion is an arm that extends in the first direction along the inner surface of the wall portion and is elastically deformable so that one end portion located on the bottom side is in contact with or separated from the inner surface. And a claw portion formed at the one end so as to protrude in a direction away from the inner surface, and the claw portion engages with the bottom portion in the non-load state and moves in the first direction. The movement of the main body is restricted, and the engagement between the bottom part and the claw part is released by the elastic deformation of the arm part in a load state in which an external force is applied to the top part of the main body part. It is comprised so that the movement restriction | limiting of the said main-body part may be canceled.

  The electronic component according to claim 5 is the electronic component according to any one of claims 1 to 4, wherein the holding unit is moved by a predetermined distance in the first direction in the main body. And a second movement restricting portion for restricting movement of the main body portion in a direction opposite to the first direction by engaging with the main body portion.

  According to the electronic component of the first aspect, the first movement restricting portion that restricts the movement of the main body portion in the first direction in the non-load state is provided, so that the main body portion is fixed to be close to the substrate. Before the adhesive is spread, the tip of the conductor can be brought into contact with the conductor pattern of the substrate through a connecting solder paste or the like. Therefore, according to this electronic component, the adhesive spread between the substrate and the bottom of the main body covers the conductor pattern or the solder paste, thereby electrically connecting the tip of the conductor and the conductor pattern. It is possible to reliably prevent the situation from being hindered. Further, according to this electronic component, since the main body portion and the substrate can be sufficiently brought close to each other by pushing the main body portion in the first direction, the heat generated in the electronic component can be conducted to the substrate efficiently. As a result, the heat radiation efficiency can be sufficiently improved. Further, according to this electronic component, since the adhesive can be uniformly and sufficiently widened by pushing the main body portion in the first direction, the adhesion of the main body portion to the substrate is sufficiently improved. be able to. Furthermore, according to this electronic component, by pushing the main body portion in the first direction, a small amount of adhesive can be uniformly spread over a sufficiently wide range, thereby preventing excessive use of the adhesive. As a result, the amount of adhesive used can be reduced, and as a result, the cost can be reduced accordingly.

  According to the electronic component of claim 2, before the adhesive is spread by configuring the conductor portion so that the tip portion protrudes in the first direction from the base end portion of the holding portion on which the bottom side is located. Since the process of bringing the tip of the conductor part into contact with the conductor pattern can be reliably performed, the situation where the electrical connection between the tip of the conductor part and the conductor pattern is hindered by the spread adhesive is further prevented. It can be surely prevented.

  According to the electronic component of claim 3, the conductor portion is configured to include the conducting wire extending from the main body portion and the terminal portion to which the conducting wire is connected and attached to the base portion, so that the rigidity is high. Since the terminal portion can be used, for example, unlike a configuration using a conductor portion having only a conductive wire (not having a terminal portion), the conductor portion is reliably deformed when the main body portion is pushed in the first direction. Can be prevented.

  In the electronic component according to claim 4, the arm portion that extends in the first direction along the inner surface of the wall portion of the base portion and can be elastically deformed so that one end portion is in contact with or separated from the inner surface, and the inner surface The 1st movement control part is comprised including the nail | claw part formed in the one end part so that it may protrude in the direction to separate. For this reason, according to this electronic component, the claw portion engages with the bottom portion of the main body portion in an unloaded state where no external force is applied to the top portion of the main body portion, thereby reliably restricting the movement of the main body portion in the first direction. In addition, it is possible to release the restriction of the movement of the main body portion in the first direction by releasing the engagement between the bottom portion and the claw portion by elastic deformation of the arm portion in a load state in which an external force is applied to the top portion. Can do.

  According to the electronic component of claim 5, when the main body moves in the first direction by a predetermined distance, the main body engages with the main body and moves in the direction opposite to the first direction. Since the holding portion is configured to include the second movement restricting portion that restricts the movement, the movement distance in the first direction of the main body necessary for the bottom of the main body to be sufficiently close to the substrate is a predetermined distance. By prescribing as follows, in the operation of mounting the electronic component on the substrate, the main body portion moved in the first direction and brought close to the substrate can be reliably maintained in that state. Further, according to this electronic component, since the second movement restricting portion is engaged with the main body when the main body moves in the first direction by a predetermined distance, the operator can visually recognize this. As a result, the operator can surely and easily recognize that the main body is sufficiently close to the substrate, so that workability can be sufficiently improved.

1 is a perspective view of an electronic component 1. FIG. 1 is an exploded perspective view of an electronic component 1. FIG. 1 is a cross-sectional view of an electronic component 1. FIG. FIG. 3 is a first explanatory diagram illustrating a method for mounting the electronic component 1. It is a 2nd explanatory view explaining the mounting method of electronic component 1. FIG. It is a 3rd explanatory drawing explaining the mounting method of the electronic component 1. FIG. It is a 4th explanatory view explaining the mounting method of electronic parts 1. 2 is a cross-sectional view illustrating a configuration of an electronic component 201. FIG. 2 is a cross-sectional view illustrating a configuration of an electronic component 301. FIG. 2 is a cross-sectional view illustrating a configuration of an electronic component 401. FIG.

  Embodiments of an electronic component will be described below with reference to the accompanying drawings.

  First, the configuration of the electronic component 1 shown in FIG. 1 will be described. As an example, the electronic component 1 is an electronic component that functions as a coil (choke coil), and includes a main body portion 11, a holding portion 12, and a conductor portion 13, as shown in FIG. As shown in FIG. 7, the bottom 11 a of the main body 11 is mounted (mounted) on the substrate 100 in a state where the bottom 11 a is in contact with or close to the surface of the substrate 100.

  As an example, the main body 11 is configured such that a core and a winding (both not shown) are accommodated in a case, and is formed in a rectangular parallelepiped shape as shown in FIGS.

  The holding part 12 is configured to hold the main body part 11. Specifically, as shown in FIG. 2, the holding unit 12 includes a base unit 20, a plurality of (for example, four) first movement restriction units 21, and a plurality of (for example, four) second movement restriction portions. 22 is provided.

  As shown in FIG. 2, the base portion 20 includes four wall portions 31a to 31d (hereinafter also referred to as “wall portion 31” when not distinguished), and is formed in a rectangular frame shape in plan view. As shown in FIG. 2, the wall portions 31a to 31d are disposed around the main body portion 11 so as to face the side surfaces 11c to 11f of the main body portion 11, respectively. Moreover, the base | substrate part 20 is formed with the nonelectroconductive material. In this case, in the electronic component 1, the base portion 20, the first movement restriction portion 21, and the second movement restriction portion 22 are integrally formed by injection molding a resin as a non-conductive material.

  As shown in FIG. 2, the first movement restricting portion 21 is disposed on the base portion 20, and the main body in the first direction (downward A shown in FIG. 3) from the top portion 11 b to the bottom portion 11 a of the main body portion 11. It has a function of restricting movement of the portion 11 (relative movement of the main body portion 11 with respect to the base portion 20). In this case, in the electronic component 1, as shown in FIG. 2, two first movement restricting portions 21 are disposed on the wall portions 31 b and 31 d of the base portion 20.

  Moreover, the 1st movement control part 21 is provided with the arm part 51 and the nail | claw part 51b formed in the one end part 51a of the arm part 51, as shown in FIG. As shown in the figure, the arm portion 51 is formed in a thin plate shape, extends downward A (first direction) along the inner surface 41 of the wall portion 31 of the base body portion 20, and has one end 51a (main body). The end portion of the portion 11 located on the bottom 11 a side) is configured to be elastically deformable so as to be in contact with and away from the inner surface 41. As shown in the figure, the claw part 51b is formed at one end 51a of the arm part 51 so as to protrude in a direction away from the inner surface 41 of the wall part 31 (inward B shown in the figure). The claw portion 51b is formed such that the upper surface 51c is slightly inclined downward with respect to the horizontal direction (the surface of the bottom portion 11a of the main body portion 11).

  As shown in FIG. 3, the first movement restricting portion 21 is configured such that the claw portion 51 b is in a non-load state where the external force is not applied to the top portion 11 b of the main body portion 11 (a state where the top portion 11 b described later is not pressed). Engage with the bottom 11a of the main body 11 (specifically, the edge of the bottom 11a) to restrict the movement of the main body 11 downward A (relative movement of the main body 11 with respect to the base body 20). . The first movement restricting portion 21 has a bottom portion 11a of the main body portion 11 due to elastic deformation of the arm portion 51 in a load state in which an external force is applied to the top portion 11b of the main body portion 11 (a state in which the first movement restricting portion 21 is pressed against the top portion 11b described later). And the claw portion 51b are disengaged, and the movement restriction of the main body portion 11 in the downward direction A is released.

  As shown in FIG. 2, the second movement restricting portion 22 is disposed on the base portion 20, and as shown in FIG. 7, when the main body portion 11 moves downward A by a predetermined distance L, Engage with the portion 11 (the edge of the top portion 11b) to restrict the movement of the main body 11 in the upward direction C (opposite to the first direction) (relative movement of the main body 11 with respect to the base body 20). It has a function. In this case, in the electronic component 1, as shown in FIG. 2, two second movement restricting portions 22 are disposed on the wall portions 31 b and 31 d of the base portion 20.

  Further, as shown in FIG. 3, the second movement restricting portion 22 includes an arm portion 52 and a claw portion 52b formed on one end portion 52a of the arm portion 52 (an end portion located on the top portion 11b side of the main body portion 11). And is configured. As shown in the figure, the arm portion 52 is formed in a thin plate shape, and extends upward C (opposite to the first direction) along the inner surface 41 of the wall portion 31 of the base body portion 20 and has one end portion. 52 a is configured to be elastically deformable so as to be in contact with and away from the inner surface 41. As shown in the figure, the claw portion 52b is formed at one end portion 52a of the arm portion 52 so as to protrude inward B which is separated from the inner surface 41 of the wall portion 31.

  As shown in FIG. 3, the second movement restricting portion 22 is in a state where the movement of the main body portion 11 in the downward direction A is restricted by the first movement restricting portion 21 (the claw portion 51 b of the first movement restricting portion 21 is In a state where the arm portion 52 is engaged with the bottom portion 11 a of the main body portion 11, the arm portion 52 is elastically deformed and the claw portion 52 b is in contact with the side surfaces 11 d and 11 f of the main body portion 11. Further, as shown in FIG. 7, when the main body 11 moves downward A by a distance L, the second movement restricting portion 22 is released from the elastic deformation of the arm 52 and the one end 52a is inward B. As a result, the claw 52b engages with the top 11b of the main body 11, and the main body 11 moves upward C (opposite to the first direction) (relative to the main body 11 relative to the base 20). A function of restricting the movement of an object.

  The conductor portion 13 is connected to the conductor pattern 102 (see FIG. 7) of the substrate 100 on which the electronic component 1 is mounted via the solder paste 103, so that an electric signal or power is transmitted between the conductor pattern 102 and the main body portion 11. As shown in FIGS. 1 to 3, it is a conductive conductor for inputting and outputting, and includes a terminal portion 61 and a conducting wire 62.

  The terminal portion 61 is a member corresponding to the tip portion of the conductor portion 13 and is formed of a conductive material (for example, a metal such as copper). In addition, as shown in FIG. 3, the terminal portion 61 has a distal end portion 61 a that is the base end portion 12 a of the holding portion 12 (one end portion 51 a of the arm portion 51 in the first movement restricting portion 21) (the bottom portion 11 a side of the component main body 11 is It is attached to the base portion 20 so as to protrude downward A from the end portion). In this case, as a method of attaching the terminal portion 61 to the base portion 20, a method of press-fitting the terminal portion 61 into the base portion 20, the holding portion 12 (base portion 20, first movement restricting portion 21 and second movement restricting portion 22). A method of attaching by insert molding at the time of injection molding, a method of bonding using an adhesive, and the like can be employed.

  As an example, the conducting wire 62 is formed of a covered conducting wire, and extends from the main body 11 as shown in FIG. Further, the leading end of the conducting wire 62 is connected to the terminal portion 61 by soldering or the like.

  Next, a method for mounting (mounting) the electronic component 1 on the substrate 100 will be described with reference to the drawings. As shown in FIG. 4, it is assumed that a conductor pattern 102 that connects the conductor portion 13 of the electronic component 1 is formed on the substrate 100.

  First, as shown in FIG. 4, the solder paste 103 is applied to the formation position of the conductor pattern 102 on the surface 101 of the substrate 100, and the electronic component 1 is mounted on the surface 101 of the substrate 100 (fixing the main body 11). Adhesive 104 is applied to the site. In this case, in order to increase the heat conduction efficiency of the heat generated by the electronic component 1 to the substrate 100, it is preferable to use a heat conductive adhesive having a high heat conductivity as the adhesive 104.

  Next, as shown in FIG. 4, the conductor pattern 102 (the solder paste 103 applied to the conductor pattern 102) and the terminal portion 61 of the conductor portion 13 face each other with the surface 101 of the substrate 100 facing upward. The electronic component 1 is moved above the substrate 100.

  In this case, in this state (non-load state in which no external force is applied to the top portion 11b), the claw portion 51b of the first movement restricting portion 21 in the holding portion 12 has an edge of the bottom portion 11a of the main body portion 11 as shown in FIG. The movement of the main body portion 11 downward (relative movement with respect to the base portion 20) is restricted by engaging the portion.

  Subsequently, as shown in FIG. 5, the electronic component 1 is placed on the substrate 100 so that the tip portion 61 a of the terminal portion 61 contacts the solder paste 103 applied to the conductor pattern 102. Next, as shown in FIG. 6, the top part 11b of the main body part 11 is pushed downward A (a load state in which an external force is applied to the top part 11b). At this time, the pressing force due to the pressing of the main body portion 11 is applied to the upper surface 51c (see FIG. 3) of the claw portion 51b of the first movement restricting portion 21 engaged with the bottom portion 11a of the main body portion 11.

  In this case, as shown in FIG. 3, since the upper surface 51 c is inclined downward with respect to the horizontal direction, the component force of the pressing force applied to the upper surface 51 c approaches the inner surface 41 of the wall portion 31 of the base body portion 20. It acts on the direction (outward direction D shown in FIG. 6). For this reason, the arm part 51 of the first movement restricting part 21 is elastically deformed outward D and the claw part 51b moves outward D, thereby releasing the engagement between the bottom part 11a and the claw part 51b downward. The movement restriction of the main body 11 to A is released.

  Subsequently, the top part 11 b of the main body part 11 is further pushed downward A. At this time, as shown in FIG. 6, the bottom portion 11a of the main body portion 11 is close to the surface 101 of the substrate 100, and the adhesive 104 applied to the surface 101 is pushed between the surface 101 and the bottom portion 11a. Can be spread.

  Next, as shown in FIG. 7, the top 11 b of the main body 11 is further pushed downward A so that the bottom 11 a is sufficiently close to the surface 101 of the substrate 100. At this time, the adhesive 104 is further spread between the surface 101 and the bottom 11a.

  Here, the electronic component 1 has a holding portion 12 that restricts the movement of the main body portion 11 in the downward direction A (relative movement with respect to the base portion 20), and a distal end in the downward direction A with respect to the base end portion 12 a of the holding portion 12. The conductor part 13 from which a part protrudes is provided. For this reason, in this electronic component 1, as shown in FIG. 5, when the main body 11 is placed on the substrate 100 before the adhesive 104 is spread out in the vicinity of the surface 101 of the substrate 100, the terminal portion 61 is in contact with the conductor pattern 102 via the solder paste 103. Therefore, in this electronic component 1, the adhesive 104 spread between the surface 101 and the bottom portion 11 a applies the conductor pattern 102 and the solder paste 103 before the contact between the terminal portion 61 and the solder paste 103 (conductor pattern 102). By covering, it is possible to reliably prevent a situation where the electrical connection between the terminal portion 61 and the solder paste 103 (conductor pattern 102) is hindered.

  Moreover, in this electronic component 1, since the main-body part 11 can be sufficiently brought close to the board | substrate 100 by pushing the main-body part 11 downward A, the heat which the electronic component 1 generate | occur | produces is conducted to the board | substrate 100, and efficiency. As a result, the heat radiation efficiency can be sufficiently improved. Further, since the adhesive 104 can be uniformly spread over a sufficiently wide range by pushing the main body 11 downward A, the adhesion of the main body 11 to the substrate 100 can be sufficiently improved. ing. Further, in this electronic component 1, by pushing the main body 11 downward A, a small amount of the adhesive 104 can be uniformly spread over a sufficiently wide range, thereby preventing excessive use of the adhesive 104. As a result, the amount of the adhesive 104 used can be reduced, and as a result, the cost can be reduced accordingly.

  On the other hand, as shown in FIG. 7, when the main body 11 moves downward A by the distance L, the elastic deformation of the arm 52 in the second movement restricting portion 22 is released, and the one end 52 a moves inward B. As a result, the claw portion 52b engages with the top portion 11b of the main body portion 11, whereby the movement of the main body portion 11 upward C is restricted. Further, when the main body part 11 moves downward A by the distance L, the claw part 52b engages with the top part 11b of the main body part 11, so that the main body part 11 is attached to the substrate 100 when the operator visually recognizes this. As a result of the operator being able to reliably and easily recognize that they are close enough, workability can be improved.

  Subsequently, the adhesive 104 is cured by maintaining this state (the state shown in FIG. 7) for a predetermined time. Thereby, the main body 11 is bonded to the substrate 100 and the electronic component 1 is fixed. Note that the adhesive 104 may be cured during a reflow process described later or after the end of the reflow process.

  Next, a reflow process is performed on the substrate 100 to which the electronic component 1 is fixed, the solder paste 103 is melted, and the conductor pattern 102 and the terminal portion 61 are soldered. Thus, the mounting of the electronic component 1 is completed.

  As described above, according to the electronic component 1, the main body portion 11 is provided on the surface 101 of the substrate 100 by including the first movement restricting portion 21 that restricts the movement of the main body portion 11 in the downward direction A in an unloaded state. Before the adhesive 104 is pushed and spread in proximity, the tip of the conductor portion 13 can be brought into contact with the conductor pattern 102 via the solder paste 103. Therefore, according to the electronic component 1, the adhesive 104 pushed between the surface 101 and the bottom portion 11 a covers the conductor pattern 102 and the solder paste 103, whereby the tip of the conductor portion 13 and the conductor pattern 102 are formed. It is possible to reliably prevent a situation where the electrical connection is hindered. Further, according to the electronic component 1, since the main body portion 11 and the substrate 100 can be sufficiently brought close to each other by pushing the main body portion 11 downward A, the heat generated in the electronic component 1 is conducted to the substrate 100. As a result, the heat dissipation efficiency can be sufficiently improved. Further, according to this electronic component 1, since the adhesive 104 can be uniformly spread over a sufficiently wide range by pushing the main body 11 downward A, the adhesiveness of the main body 11 to the substrate 100 is sufficient. Can be improved. Furthermore, according to this electronic component 1, by pushing the main body 11 downward A, a small amount of the adhesive 104 can be uniformly spread over a sufficiently wide range. As a result, the usage amount of the adhesive 104 can be reduced, and as a result, the cost can be reduced accordingly.

  In addition, according to the electronic component 1, the conductor portion 13 whose tip portion protrudes downward A from the base end portion 12 a of the holding portion 12 is configured, so that before the adhesive 104 is spread and spread, Since the step of bringing the tip portion into contact with the conductor pattern 102 can be performed with certainty, the situation in which the electrical connection between the tip portion of the conductor portion 13 and the conductor pattern 102 is hindered by the spread adhesive 104 is further prevented. It can be surely prevented.

  Further, according to the electronic component 1, the lead wire 62 extended from the main body portion 11 and the lead wire 62 are connected to the base body portion 20 so as to protrude downward A from the base end portion 12 a of the holding portion 12. Since the highly rigid terminal portion 61 can be used by configuring the conductor portion 13 with the attached terminal portion 61, for example, a conductor having only the conductive wire 62 (without the terminal portion 61). Unlike the configuration using the portion 13, the deformation of the conductor portion 13 when the main body portion 11 is pushed downward A can be reliably prevented.

  Further, in the electronic component 1, the arm portion 51 that extends downward along the inner surface 41 of the wall portion 31 and can be elastically deformed so that the one end portion 51 a contacts and separates from the inner surface 41, and the inner surface 41. The 1st movement control part 21 is provided with the nail | claw part 52b formed in the one end part 51a so that it may protrude inward B which spaces apart. Therefore, according to the electronic component 1, the claw portion 52b engages with the bottom portion 11a of the main body portion 11 in a non-load state where no external force is applied to the top portion 11b of the main body portion 11, and the main body portion 11 faces downward A. The movement can be reliably controlled, and the engagement of the bottom portion 11a and the claw portion 52b is released by elastic deformation of the arm portion 51 in a load state in which an external force is applied to the top portion 11b, and the body portion 11 is directed downward A. The movement restriction can be reliably released.

  Further, according to the electronic component 1, the second movement restricting portion 22 that engages with the main body portion 11 and restricts the movement of the main body portion 11 upward C when the main body portion 11 moves downward A by the distance L. And the holding part 12 is configured to define the distance L as the distance L of the downward movement A of the main body 11 necessary for the bottom 11a of the main body 11 to be sufficiently close to the surface 101 of the substrate 100. In the operation of mounting the electronic component 1 on the substrate 100, the main body portion 11 moved downward A and brought close to the substrate 100 can be reliably maintained in that state. Moreover, according to this electronic component 1, since the nail | claw part 52b engages with the top part 11b of the main-body part 11 when the main-body part 11 moves downward A by the distance L, an operator visually recognizes that. As a result of the fact that the operator can reliably and easily recognize that the main body portion 11 is sufficiently close to the substrate 100, workability can be sufficiently improved.

  The configuration of the electronic component is not limited to the configuration of the electronic component 1 described above. For example, as illustrated in FIG. 8, an electronic component 201 including a first movement restriction unit 221 can be employed instead of the first movement restriction unit 21 described above. In addition, in the following description, about the component similar to the above-mentioned electronic component 1, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted. The first movement restricting portion 221 is configured by, for example, a leaf spring that is curved in an arc shape, and is disposed on each of the wall portions 31 b and 31 d of the base portion 20 of the holding portion 12. In this electronic component 201, the first movement restricting portion 221 presses the side surfaces 11d and 11f of the main body portion 11 inward B (direction away from the inner surface 41) shown in FIG. 11 movement is restricted. Also in this electronic component 201, the main body part 11 is placed with the bottom 11 a of the main body part 11 sufficiently close to the substrate 100 without obstructing the electrical connection between the terminal part 61 and the conductor pattern 102 (solder paste 103). It can be securely fixed to the substrate 100. For this reason, the effect similar to the above-mentioned effect (the improvement of heat dissipation efficiency, the improvement of adhesiveness, and the reduction of cost) which the electronic component 1 has is realizable.

  Moreover, the electronic component 301 shown in FIG. 9 can also be employ | adopted. In this electronic component 301, a conductive wire 362 is used as a conductor portion instead of the conductor portion 13 described above. That is, in this electronic component 301, a conductor portion is configured only by the conductive wire 362 (without the terminal portion 61). In this case, the conducting wire 362 has higher rigidity than the conducting wire 62 described above. In addition, the electronic component 301 is configured such that the distal end portion 362 a of the conducting wire 362 protrudes downward A from the proximal end portion 12 a of the holding portion 12. Furthermore, the conducting wire 362 is fixed to the base portion 20 with an adhesive 362b at the top of the tip 362a. When the electronic component 301 is mounted on the substrate 100, the electronic component 301 is mounted on the substrate so that the tip portion 362a of the conductor 362 contacts the solder paste 103 applied to the conductor pattern 102 of the substrate 100, as shown in FIG. 100, and then pressing the top portion 11b of the main body portion 11 downward with a fingertip without obstructing the electrical connection between the tip portion 362a of the conductor 362 and the solder paste 103 (conductor pattern 102), The bottom part 11 a of the main body part 11 can be made sufficiently close to the substrate 100 to securely fix the main body part 11 to the substrate 100. For this reason, also in this electronic component 301, the same effect (an improvement in heat radiation efficiency, an improvement in adhesiveness, and a reduction in cost) as in the electronic components 1, 201 described above can be realized.

  Further, as shown in FIG. 10, when the main body portion 11 moves downward A by a distance L, the concave portion 11 g engaged with the claw portion 52 b of the second movement restricting portion 22 is formed on the side surfaces 11 d and 11 f of the main body portion 11. The electronic component 401 to be formed can also be employed.

  Further, the distal end portion of the conductor portion (in the above example, the distal end portion 61a of the terminal portion 61 and the distal end portion 362a of the conducting wire 362) is configured to protrude downward A from the proximal end portion 12a of the holding portion 12. Although the example has been described above, for example, when the conductor pattern 102 to which the conductor portion is connected is positioned above the base end portion 12a of the holding portion 12, the tip end portion of the conductor portion is positioned above the base end portion 12a. (A configuration in which the leading end portion of the conductor portion does not protrude downward A from the base end portion 12a) can also be employed.

  Moreover, although it described above about the example applied to the electronic component 1 which functions as a coil (choke coil), it is applicable to various electronic components other than coils, such as a resistor, a capacitor | condenser, and a semiconductor element (for example, diode).

  Further, the example in which the main body 11 is fixed to the substrate 100 with the adhesive 104 (thermal conductive adhesive) has been described above. However, the main body 11 is attached to the substrate 100 with an adhesive tape (thermal conductive adhesive tape) having high thermal conductivity. It can also be fixed.

  Further, the main body 11 can be fixed to the substrate 100 by a potting process. In this case, the electronic component 1 (or the electronic components 201 and 301) is placed on the substrate 100 so that the terminal portion 61 (or the tip portion 362a of the conductive wire 362) contacts the solder paste 103 applied to the conductor pattern 102 of the substrate 100. The potting material (resin material) is supplied to the surface 101 of the substrate 100 in a state before the main body portion 11 is pressed against the substrate 100 (the bottom portion 11a of the main body portion 11 is separated from the substrate 100). Before the potting material is cured, the main body 11 is pressed against the substrate 100, and then the potting material is cured. By mounting the electronic component 1 (or the electronic components 201 and 301) in this way, the same effects as the above-described electronic components 1 and 201 (improving heat radiation efficiency, improving adhesiveness, and reducing costs) are realized. can do.

1, 201, 301, 401 Electronic component 11 Main body 11a Bottom 11b Top 12 Holding part 13 Conductor 20 Base 20a Base end part 21, 221 First movement restriction part 22 Second movement restriction part 31a-31d Wall part 41 Inner surface 51 Arm part 51a One end part 52b Claw part 61 Terminal part 62,632 Conductor 100 Substrate A Downward C Upward B Inward L Distance

Claims (5)

An electronic component comprising a main body portion and a conductive portion for conduction extending from the main body portion to the outside, and mounted on the substrate in a state where the bottom portion of the main body portion is in contact with or close to the substrate,
A holding part for holding the body part;
The holding portion is disposed around the main body portion, and is disposed on the base portion, and is directed from the top portion to the bottom portion in an unloaded state where no external force is applied to the top portion of the main body portion. An electronic component comprising: a first movement restricting portion that restricts movement of the main body portion in the first direction.   2. The electronic component according to claim 1, wherein the conductor portion is configured such that a distal end portion protrudes in the first direction from a proximal end portion of the holding portion where the bottom portion side is located.   The said conductor part is comprised including the conducting wire extended from the main-body part, and the terminal part as the said front-end | tip part to which the said conducting wire was connected and attached to the said base | substrate part. Electronic components. The base portion includes a wall portion disposed to face the side surface of the main body portion,
The first movement restricting portion is an arm that extends in the first direction along the inner surface of the wall portion and is elastically deformable so that one end portion located on the bottom side is in contact with or separated from the inner surface. And a claw portion formed at the one end so as to protrude in a direction away from the inner surface, and the claw portion engages with the bottom portion in the non-load state and moves in the first direction. The movement of the main body is restricted, and the engagement between the bottom part and the claw part is released by the elastic deformation of the arm part in a load state in which an external force is applied to the top part of the main body part. The electronic component according to claim 1, wherein the electronic component is configured to cancel the movement restriction of the main body portion.   The holding portion engages with the main body portion when the main body portion moves by a predetermined distance in the first direction and moves the main body portion in a direction opposite to the first direction. The electronic component according to claim 1, further comprising a second movement restricting portion that restricts.

Images