JP6840447B2 - Circuit pattern manufacturing equipment, circuit pattern forming sheet, circuit pattern forming board, circuit pattern manufacturing method and circuit pattern manufacturing program - Google Patents

Description

The present invention relates to a circuit pattern manufacturing apparatus, a circuit pattern forming sheet, a circuit pattern forming substrate, a circuit pattern manufacturing method, and a circuit pattern manufacturing program.

In the above technical field, Patent Document 1 discloses a technique of irradiating a photomask on which a circuit pattern is formed with light to expose the circuit pattern on a substrate.

Japanese Unexamined Patent Publication No. 2012-194253

However, in the technique described in the above document, since the circuit pattern is exposed on the substrate by using the photomask on which the circuit pattern is formed, it is not possible to quickly create or change the circuit pattern.

An object of the present invention is to provide a technique for solving the above-mentioned problems.

In order to achieve the above object, the circuit pattern manufacturing apparatus according to the present invention is
A stage for holding a sheet having a mixture containing a conductive material and a photocurable resin or a substrate coated with the mixture, and a stage.
It has an optical engine that irradiates a laser beam toward the stage.
The optical engine
With the housing
At least one first laser diode and second laser diode arranged on one side in the housing and emitting the laser beam,
A collimator lens that adjusts the focal length of the laser beam to infinity,
A prism mirror that reflects the laser beam from the first laser diode and further reflects it along the optical axis of the second laser diode.
It has a drive mirror that reflects the laser beam while changing the angle in the vertical direction and the horizontal direction.
The laser beam irradiates the mixture to cure the photocurable resin.
The optical engine is characterized in that a laser beam from a first laser diode and a laser beam from a second laser diode are superimposed and scanned so that a circuit pattern is formed on the sheet or the substrate. ..

In order to achieve the above object, the circuit pattern forming sheet according to the present invention is
A sheet for forming a circuit pattern used in the above circuit pattern manufacturing apparatus.
The sheet contains an insulating sheet base material layer and a mixture layer.
The mixture layer is characterized by comprising the mixture containing the conductive material and the photocurable resin.

In order to achieve the above object, the circuit pattern forming sheet according to the present invention is
The conductive material is silver particles having an average diameter of 10 μm.

In order to achieve the above object, the circuit pattern forming sheet according to the present invention is
It is characterized in that the upper and lower parts of the insulating sheet base material layer are sandwiched between the mixture layers.

In order to achieve the above object, the circuit pattern forming substrate according to the present invention is
A substrate for forming a circuit pattern used in the above circuit pattern manufacturing apparatus.
It is characterized in that a paste-like mixture containing the conductive material and the photocurable resin is thinly applied.

In order to achieve the above object, the circuit pattern forming substrate according to the present invention is
The conductive material is silver particles having an average diameter of 10 μm.

In order to achieve the above object, the circuit pattern manufacturing method according to the present invention is used.
A circuit pattern manufacturing method using the above circuit pattern manufacturing apparatus.
It is characterized by including a forming step of irradiating the sheet having the mixing agent or the substrate coated with the mixing agent with light to form a circuit pattern.

In order to achieve the above object, the circuit pattern manufacturing program according to the present invention is
Using the circuit pattern manufacturing apparatus, the computer is provided with a function of irradiating the sheet having the mixture or the substrate coated with the mixture with light to form a circuit pattern. And.

According to the present invention, since the circuit pattern is exposed on the substrate without using the photomask on which the circuit pattern is formed, the circuit pattern can be quickly created or changed.

It is a figure which shows the outline of the structure of the circuit pattern manufacturing apparatus which concerns on 1st Embodiment of this invention. It is a figure which shows the outline of the circuit pattern formation process by the circuit pattern manufacturing apparatus which concerns on 1st Embodiment of this invention. It is a figure which shows the structure of the optical engine which the circuit pattern manufacturing apparatus which concerns on 1st Embodiment of this invention has. It is a figure which shows the structure of the optical engine which the circuit pattern manufacturing apparatus which concerns on 1st Embodiment of this invention has. It is a figure which shows the optical path in the optical engine which the circuit pattern manufacturing apparatus which concerns on 1st Embodiment of this invention has. It is a figure which shows the structure of the projector which the circuit pattern manufacturing apparatus which concerns on 1st Embodiment of this invention has. It is a block diagram which shows the functional structure of the projector which the circuit pattern manufacturing apparatus which concerns on 1st Embodiment of this invention has. It is a figure which shows the circuit pattern manufactured by the circuit pattern manufacturing apparatus which concerns on 1st Embodiment of this invention. It is a flowchart which shows the circuit pattern formation procedure of the circuit pattern manufacturing apparatus which concerns on 1st Embodiment of this invention. It is a figure which shows the structure of the optical engine which the circuit pattern manufacturing apparatus which concerns on 2nd Embodiment of this invention has. It is a figure which shows the structure of the optical engine which the circuit pattern manufacturing apparatus which concerns on 2nd Embodiment of this invention has. It is a figure which shows the optical path in the optical engine which the circuit pattern manufacturing apparatus which concerns on 2nd Embodiment of this invention has. It is a figure which shows the structure of the projector which the circuit pattern manufacturing apparatus which concerns on 2nd Embodiment of this invention has. It is a figure which shows the structure of the optical engine which the circuit pattern manufacturing apparatus which concerns on 3rd Embodiment of this invention has. It is a figure which shows the structure of the optical engine which the circuit pattern manufacturing apparatus which concerns on 3rd Embodiment of this invention has. It is a figure which shows the optical path in the optical engine which the circuit pattern manufacturing apparatus which concerns on 3rd Embodiment of this invention has.

Hereinafter, embodiments for carrying out the present invention will be described in detail exemplarily with reference to the drawings. However, the configuration, numerical values, processing flow, functional elements, etc. described in the following embodiments are merely examples, and modifications and changes thereof are free, and the technical scope of the present invention is described below. It is not intended to be limited.

[First Embodiment]
The circuit pattern manufacturing apparatus 100 as the first embodiment of the present invention will be described with reference to FIGS. 1A to 6. The circuit pattern manufacturing apparatus 100 is an apparatus for forming a circuit pattern by irradiating a circuit pattern forming sheet with light rays.

<< Prerequisite technology >>
First, the prerequisite technology of this embodiment will be described. Normally, the circuit pattern is determined by PCB (Printed Circuit Board) design using CAD (Computer Aided Design) such as PADS (Personal Automated Design System), and then silk screen printing by an outsourced manufacturer. And the photoresist method is used to form the circuit pattern. In these design processes, there is an increasing need to examine the suitability of circuit pattern design using actual products, in addition to checking on the screen of monitors such as personal computers.

In the conventional circuit pattern development method, it is necessary to outsource the mask for circuit pattern printing used for screen printing, photoresist method, etc., and it takes a lot of time and cost to actually complete the prototype. There was a problem. Therefore, in order to reduce these times and costs, the development of circuit patterns is often advanced simply by checking the circuit patterns created by CAD or CAE (Computer Aided Engineering) on a monitor such as a personal computer. However, it is difficult to completely grasp the problem by checking the circuit pattern data displayed on the monitor, and the problem is often noticed only after making a prototype. Therefore, the mask had to be outsourced to produce a prototype, and as a result, the time and cost required to complete the prototype increased. Further, in a method using a mask such as screen printing, it is not possible to form a circuit pattern on, for example, the housing itself, the curved surface portion of the housing, the corner portion of the housing, and the like.

<< Technology of the present embodiment >>
As shown in FIG. 1A, the circuit pattern manufacturing apparatus 100 includes a control unit 101 and a laser projector 102. The control unit 101 controls the laser projector 102 to form a circuit pattern on the circuit pattern forming sheet 130 placed on the stage 140. That is, the control unit 101 irradiates the light beam 122 from the optical engine 121 based on the circuit pattern data created by CAD to form the circuit pattern on the sheet 130. The creation of the circuit pattern is not limited to CAD, and may be created by, for example, a smartphone application or CAE. The control unit 101 also controls the overall operation of the circuit pattern manufacturing apparatus 100.

The laser projector 102 has an optical engine 121, and the control unit 101 controls the laser projector 102 to irradiate the sheet 130 with light rays from the optical engine 121.

The sheet 130 is made of a mixture containing a conductive material and a photocurable resin, and when the sheet 130 is irradiated with light, the portion irradiated with the light is cured and the uncured portion is washed away. A circuit pattern is formed by. Further, if the sheet 130 is an adhesive sheet, the circuit pattern can be drawn anywhere, regardless of the location, not only on a flat surface but also on a curved surface, simply by pasting the sheet on which the circuit pattern is formed. ..

FIG. 1B is a diagram showing an outline of a circuit pattern forming process by the circuit pattern manufacturing apparatus 100 according to the present embodiment. When the sheet 130 for forming a circuit pattern placed on the stage 140 is irradiated with light rays by scanning based on the circuit pattern created by the control unit 101, the circuit pattern is drawn on the sheet 130. The irradiation time of the light beam is about 20 minutes. Then, the circuit pattern drawn on the sheet 130, that is, the portion irradiated with the light beam is cured. After that, when the uncured portion is washed and washed away, a circuit pattern according to the circuit pattern created by the control unit 101 can be manufactured. This makes it possible to immediately manufacture and evaluate a prototype using, for example, a circuit pattern designed on CAD.

The sheet 130 includes at least two layers, an insulating sheet base material layer and a mixing agent layer, and typically, the mixing agent layer is laminated on the insulating sheet base material layer, but the sheet 130 The composition of is not limited to this. For example, the structure of the sheet 130 is such that the upper and lower parts of the insulating sheet base material layer are sandwiched between the mixing agent layers even if the insulating sheet base material layer and the mixing agent layer are alternately stacked. There may be. The mixture contains, for example, about 83 wt% of silver particles and about 5 to 15 wt% of a photocurable resin, and the average diameter of the silver particles is about 10 μm, but the mixture is not limited thereto. As the insulating sheet base material, for example, a rigid base material, a flexible base material, a rigid flexible base material, and the like can be used, but the material is not limited as long as it is a suitable material as the sheet base material.

Further, instead of using the sheet 130, a paste-like mixture containing a conductive material and a photocurable resin may be thinly applied to the substrate 160, and the paste 150 may be irradiated with light rays. Further, as the conductive material, silver (Ag) is assumed in the present embodiment, but the conductive material is not limited to this. In addition to silver, there are, for example, gold (Au), copper (Cu), platinum (Pt), lead (Pb), zinc (Zn), tin (Sn), iron (Fe) and aluminum (Al). These may be used alone or in combination of a plurality. Furthermore, ultraviolet rays (UV: Ultraviolet) are typical as light rays, but the light rays are not limited to these.

<Optical engine configuration>
The optical engine 121 incorporated in the laser projector 102 will be described with reference to FIGS. 2A to 2C. 2A and 2B are perspective views of the internal configuration of the optical engine 121 as viewed from different angles. FIG. 2C is a diagram showing an optical path in the optical engine 121.

As shown in FIGS. 2A and 2B, the optical engine 121 has an amazing width of about 24 mm, a depth of about 13 mm, a height of about 5 mm, and a volume of about 1.5 cc, while achieving high resolution and high image quality of 720P. It is an optical engine for a laser pico projector that has achieved a compact size. The optical engine 121 includes an ultraviolet laser diode (semiconductor laser) 201 and a prism mirror 204 for reflecting light rays from the laser diode 201.

The laser diode 201 is arranged on one side of the housing 210 toward the inside of the housing 210. The prism mirror 204 reflects the laser beam (light beam) from the laser diode 201 on the upper side of the paper surface of FIG. 2C, and further reflects it toward the inside of the housing 210. Further, the optical engine 121 includes a collimator lens 205 between the laser diode 201 and the prism mirror 204, and adjusts the focal length of the laser beam to infinity.

Inside the housing 210, an inclined mirror 206 inclined toward the bottom surface of the housing 210 is provided at an end opposite to the mounting surface of the laser diode 201. The tilt mirror 206 reflects the laser beam incident from the prism mirror 204 toward the bottom surface of the housing 210. Further, a bottom mirror 207 is attached upward to the bottom surface of the housing 210 between the prism mirror 204 and the tilt mirror 206. A two-dimensional MEMS (Micro Electro Mechanical Systems) mirror 209 and a cover glass 212 are provided so as to sandwich the bottom mirror 207. The bottom mirror 207 reflects the laser beam incident from the tilt mirror 206 upward toward the two-dimensional MEMS mirror 209. A prism 208 that determines the image projection elevation angle and size is provided at a position adjacent to the two-dimensional MEMS mirror 209 and on the cover glass 212 side.

On the other hand, another bottom mirror 213 is provided between the bottom mirror 207 and the cover glass 212. Further, a photo sensor 215 is provided between the prism mirror 204 and the prism 208. In order to calibrate the position of the two-dimensional MEMS mirror 209, the photo sensor 215 transmits the timing at which the light beam is incident from the two-dimensional MEMS mirror 209 through the bottom mirror 213 to the external MEMS control unit.

Further, the tilt mirror 206 is a semi-transmissive mirror, and a laser power sensor 216 is provided behind the semi-transmissive mirror, that is, in the gap between the wall portion of the housing 210 and the tilt mirror 206 to detect the laser power. This is communicated to the external laser scan display control unit.

The scanning rays reflected by the two-dimensional MEMS mirror 209 and passed through the prism 208 and the cover glass 212 form a circuit pattern on the sheet 130.

Next, the optical path in the optical engine 121 will be described with reference to FIG. 2C. In FIG. 2C, in order to explain the optical path, unnecessary wiring, housing, and the like are omitted or simplified.

The laser beam emitted from the prism mirror 204 is reflected by the tilt mirror 206 and directed toward the bottom mirror 207. The bottom mirror 207 reflects the laser light incident from the tilt mirror 206 upward, and causes the laser light incident on the central portion of the two-dimensional MEMS mirror 209 via the prism 208. The two-dimensional MEMS mirror 209 is a drive mirror driven based on a control signal input from the outside, and vibrates so as to reflect the laser beam by changing the angle in the horizontal direction (X direction) and the vertical direction (Y direction). To do.

<Projector configuration>
FIG. 3 is a diagram showing a configuration of a laser projector 102 including an optical engine 121. The optical engine 121 includes a laser diode drive unit (LD drive unit in the figure) 311 and a power management circuit 312, in addition to the configurations described with reference to FIGS. 2A and 2B.

In addition to the optical engine 121, the laser projector 102 includes a MEMS control unit 301 and a laser scan display control unit 302. When the laser scan display control unit 302 inputs a circuit pattern signal from the outside, the laser scan display control unit 302 extracts the number of pixels, the size, and the like, and transmits the circuit pattern signal to the MEMS control unit 301.

The power management circuits (PMCs) 312 control the laser diode drive unit 311 so that it does not malfunction in the initial transient section, for example, the rising period or the falling period. In particular, during the transient section, the output power may be lower than the required voltage. The laser diode drive 311 can malfunction due to low voltage and / or voltage fluctuations. To avoid such problems, the functional circuit block can be placed in the Reset state during the transient section.

The laser power sensor 216 controls the illuminance of the laser diode 201 by detecting the power of the laser light transmitted through the tilt mirror 206 and feeding back the power data to the laser scan display control unit 302.

FIG. 4 is a block diagram showing a functional configuration of the laser projector 102. The circuit pattern signal input to the laser scan display control unit 302 is modulated here and sent to the laser diode drive unit 311. The laser diode driving unit 311 drives the LD (Laser Diode) to control the brightness and irradiation timing of the projected laser. The laser scan display control unit 302 simultaneously drives the MEMS control unit 301 to vibrate the two-dimensional MEMS mirror 209 in two axes under optimum conditions. The power management circuit 312 controls the laser diode driving unit 311 to cause the laser diode 201 to emit light at an appropriate voltage and timing. The laser light reflected by the two-dimensional MEMS mirror 209 through the collimator lens 205 and the optical system such as the prism mirror 204 and the tilt mirror 206 is projected onto the sheet 130 as the laser light for circuit formation. Although the LD has been described as an example of the light source here, the light source is not limited to the LD and may be an LED (Light Emitting Diode).

As described above, the MEMS scanning method has overwhelmingly higher light utilization efficiency than DLP (Digital Light Processing). Therefore, it is possible to form and model the same circuit pattern as DLP with an overwhelmingly low power laser. In other words, it is possible to reduce the price, power consumption, and miniaturization while achieving high accuracy. In addition, it is possible to narrow down the laser beam (φ0.8 mm → 0.02 mm) to improve the molding accuracy. Further, the irradiation area of the laser beam can be changed by changing the irradiation distance of the optical engine 121. Further, the irradiation area of the laser beam may be changed by software without changing the irradiation distance of the optical engine 121.

FIG. 5 is a diagram showing a circuit pattern manufactured by the circuit pattern manufacturing apparatus 100 according to the present embodiment. The L / S (Line / Space) of the manufactured circuit pattern was 0.39 mm / 0.37 mm.

FIG. 6 is a flowchart illustrating a circuit pattern manufacturing procedure of the circuit pattern manufacturing apparatus 100 according to the present embodiment. In step S601, the circuit pattern manufacturing apparatus 100 sets the circuit pattern forming sheet 130 at a predetermined position on the stage 140. In step S603, the circuit pattern manufacturing apparatus 100 irradiates the sheet 130 for forming the circuit pattern with, for example, a laser beam (light beam) having a wavelength of 405 nm to cure the circuit pattern. The irradiation of the light beam may be performed by scanning, or may be performed by a method of printing the entire circuit pattern with one irradiation.

In step S605, the circuit pattern manufacturing apparatus 100 washes the sheet 130 irradiated with the laser beam with, for example, isopropyl alcohol (IPA: Isopropyl Alcohol) or the like to wash away the uncured portion. As for the cleaning of the uncured portion, ultrasonic cleaning may be performed together with cleaning by IPA. As a result, more reliable cleaning can be performed. In step S607, the circuit pattern manufacturing apparatus 100 dries the washed sheet 130. Although step S609 is an additional step, in step S609, if the circuit pattern manufacturing apparatus 100 is baked on the sheet 130 on which the circuit pattern is formed, the resistance value of the circuit can be further lowered and stabilized. It is possible.

In step S601, an example of using a sheet 130 for forming a circuit pattern using a mixture containing a conductive material and a photocurable resin has been described, but a mixture containing the conductive material and a photocurable resin has been described. A paste-like agent may be uniformly applied to a substrate such as a film.

According to the present embodiment, since the circuit pattern is exposed on the substrate without using the photomask on which the circuit pattern is formed, the circuit pattern can be quickly created or changed. Further, since the circuit pattern can be formed without using a mask for screen printing or photoresist, the development cost can be suppressed, and further, since the mask manufacturing time is not required, the development period of the circuit pattern can be shortened.

Further, since a high resolution (720P) optical engine is used, it is possible to form a high-definition circuit pattern equivalent to, for example, a membrane wiring board (L / S = 0.39 / 0.37 mm). Furthermore, since a MEMS scanner using a laser diode as a light source is used, energy consumption can be reduced, the burden on the environment can be reduced, productivity can be improved, and a device that is easy to use in PCB design can be provided. You can also.

Furthermore, since it is a focus-free scanner using a laser diode, a circuit pattern can be formed on any object as long as a paste-like mixture can be applied thinly and uniformly.

[Second Embodiment]
Next, the circuit pattern manufacturing apparatus according to the second embodiment of the present invention will be described with reference to FIGS. 7A to 8. 7A and 7B are diagrams for explaining an optical engine included in the circuit pattern manufacturing apparatus according to the present embodiment. The circuit pattern manufacturing apparatus according to the present embodiment is different from the first embodiment in that the optical engine has three laser diodes. Since other configurations and operations are the same as those in the first embodiment, the same configurations and operations are designated by the same reference numerals and detailed description thereof will be omitted.

7A and 7B are perspective views of the internal configuration of the optical engine 721 as viewed from different angles. The optical engine 721 further includes laser diodes 702 and 703. That is, the optical engine 721 has three laser diodes 201, 702, and 703. The prism mirror 204 is a mirror for collecting the light rays from the laser diodes 201, 702, and 703 into one luminous flux. The prism mirror 204 reflects two laser beams from the laser diodes 201 and 702 toward the laser diode 703, respectively. Then, the two reflected lights are reflected again toward the inside of the housing 210 so as to overlap the optical axis of the laser diode 703.

The three laser diodes 201, 702, and 703 may all be the same laser diode or may be different laser diodes. For example, all three may be ultraviolet laser diodes, two of the three may be ultraviolet laser diodes, and the remaining one may be a laser diode other than ultraviolet, and the combination may be arbitrary. Can be decided.

Next, the optical path in the optical engine 721 will be described with reference to FIG. 7C. In FIG. 7C, in order to explain the optical path, unnecessary wiring, housing, and the like are omitted or simplified. As shown in FIG. 7C, the three light rays from the laser diodes 201, 702, and 703 are incident on the prism mirror 204 via the collimator lens 205 and combined into one luminous flux.

FIG. 8 is a diagram showing a configuration of a laser projector 102 including an optical engine 721. The power management circuit 312 controls the laser diode driving unit 311 to cause the laser diodes 201, 702, and 703 to emit light at appropriate voltages and timings.

As described above, the total power of the laser diodes can be increased by changing the number of laser diodes attached to the optical engine 721. For example, it is possible to realize an output of 60 mW by using three 20 mW laser diodes. A high-power optical engine can be realized by attaching a plurality of laser diodes as light sources of the same wavelength.

Further, by attaching a plurality of laser diodes that emit laser light of the same wavelength and have different beam diameters, it is possible to select a shape such as sharp or soft at an arbitrary place. Further, by providing a plurality of laser diodes that emit laser light having different wavelengths, it is possible to select the optimum wavelength for the photocurable resin.

The wavelength of the laser light can be set to, for example, infrared light and ultraviolet light, and a circuit pattern can be automatically formed at a predetermined position by ultraviolet light while detecting the position by infrared light. In this case, the infrared light serves as a guide light.

Further, it is possible to change the irradiation power of the laser beam for each irradiation dot. As a result, the irradiation power of the edge portion of the cross-sectional shape can be increased, or the irradiation power can be weakened in order to prevent penetration hardening in inclined molding or the like. Power control according to the shape becomes possible. Further, the step on the modeling surface can be changed by changing the spot diameter.

According to the present embodiment, since the number of laser diodes is increased, the output of the laser light is improved, whereby the scanning speed of the laser light can be increased, and the formation speed of the circuit pattern can be further improved. ..

[Third Embodiment]
Next, the circuit pattern manufacturing apparatus according to the third embodiment of the present invention will be described with reference to FIGS. 9A to 9C. 9A and 9C are diagrams for explaining an optical engine included in the circuit pattern manufacturing apparatus according to the present embodiment. The circuit pattern manufacturing apparatus according to the present embodiment is different from the first embodiment in that the arrangement position of the optical engine is different and that the circuit pattern manufacturing apparatus does not have a prism mirror. Since other configurations and operations are the same as those in the first embodiment, the same configurations and operations are designated by the same reference numerals and detailed description thereof will be omitted.

As shown in FIGS. 9A to 9C, the optical engine 921 has a laser diode 901, and the laser diode 901 is provided on the cover glass 212 side. Further, in the present embodiment, since the laser diode 901 is provided on the cover glass 212 side, the prism mirror for guiding the light beam from the laser diode 901 to the tilt mirror 206 or the like is not provided.

If the laser diode 901 is provided on the cover glass 212 side, the prism mirror becomes unnecessary, so that the housing 210 of the optical engine 121 can be further miniaturized, so that the laser projector 102 incorporating the optical engine 121 can also be further miniaturized. Can be done.

According to the present embodiment, since the laser diode is provided on the cover glass side, the optical engine and the laser projector can be miniaturized, and the circuit pattern manufacturing apparatus can be further miniaturized.

[Other Embodiments]
Although the invention of the present application has been described above with reference to the embodiment, the invention of the present application is not limited to the above embodiment. Various changes that can be understood by those skilled in the art can be made within the scope of the present invention in terms of the structure and details of the present invention. Also included in the scope of the present invention are systems or devices in which the different features contained in each embodiment are combined in any way.

Further, the present invention may be applied to a system composed of a plurality of devices, or may be applied to a single device. Furthermore, the present invention is also applicable when the information processing program that realizes the functions of the embodiment is supplied directly or remotely to the system or device. Therefore, in order to realize the functions of the present invention on a computer, a program installed on the computer, a medium containing the program, and a WWW (World Wide Web) server for downloading the program are also included in the scope of the present invention. .. In particular, at least a non-transitory computer readable medium containing a program that causes a computer to execute the processing steps included in the above-described embodiment is included in the scope of the present invention.

Claims (3)

A stage for holding a sheet having a mixture containing a conductive material and a photocurable resin or a substrate coated with the mixture, and a stage.
It has an optical engine that irradiates a laser beam toward the stage.
The optical engine
With the housing
At least one first laser diode and second laser diode arranged on one side in the housing and emitting the laser beam,
A collimator lens that adjusts the focal length of the laser beam to infinity,
A prism mirror that reflects the laser beam from the first laser diode and further reflects it along the optical axis of the second laser diode.
It has a drive mirror that reflects the laser beam while changing the angle in the vertical direction and the horizontal direction.
The laser beam irradiates the mixture to cure the photocurable resin.
A circuit pattern manufacturing apparatus in which the optical engine superimposes a laser beam from a first laser diode and a laser beam from a second laser diode for scanning irradiation so that a circuit pattern is formed on the sheet or the substrate. A circuit pattern manufacturing method using the circuit pattern manufacturing apparatus according to claim 1.
A circuit pattern manufacturing method including a forming step of irradiating the sheet having the mixing agent or the substrate coated with the mixing agent with light to form a circuit pattern. A circuit for realizing a function of irradiating a sheet having the mixing agent or a substrate coated with the mixing agent with light rays to form a circuit pattern by using the circuit pattern manufacturing apparatus according to claim 1. Pattern manufacturing program.

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