JP6838963B2 - Vacuum suction member - Google Patents

Description

The present invention relates to a vacuum suction member used for vacuum suction of an object such as a semiconductor wafer.

Conventionally, in a semiconductor manufacturing apparatus such as an exposure apparatus, an object such as a semiconductor wafer is vacuum-adsorbed via a vacuum adsorption member on the stage in order to fix and process the object on the stage.

As such a vacuum suction member, for example, Patent Document 1 describes two ring-shaped convex portions surrounding the outer peripheral portion and the central portion of the main surface facing the wafer when sucking the wafer, and these ring-shaped convex portions. A substrate holding member with a large number of suction holes arranged in a region on the main surface between the protrusions and pin-shaped protrusions surrounding each suction hole is described.

In this substrate holding member, the wafer and each pin-shaped convex portion are vacuum-sucked through a suction hole in a separable chamber formed inside the convex portion, so that the wafer is placed on each pin-shaped convex portion. It is fixed. Further, in this substrate holding member, the heat generated in the wafer or the like is discharged by flowing the temperature control fluid into the temperature control chamber formed on the outside of the pin-shaped convex portion by the wafer and the ring-shaped convex portion. It prevents inconveniences that may occur due to heat.

Further, in Patent Document 2, a ring body seal provided on a main surface facing the wafer and a sealed space formed between the wafer and the ring body seal by placing the wafer on the wafer support surface of the wafer support member. A wafer holder that sucks a wafer by vacuum is described. In this wafer holder, by providing a groove on the wafer support surface, the frequency of occurrence of a situation where particles (fine particles) are sandwiched between the wafer support surface and the wafer is reduced, and the adsorption distortion of the wafer that causes an exposure error is reduced. I have to.

Further, in Patent Document 3, an annular bank portion for sealing air is provided on the outer periphery of a main surface (wafer adsorption surface) facing the wafer, and a plurality of pin-shaped convex portions for holding the wafer are arranged inside the annular bank portion. , Vacuum chuck is described. In this vacuum chuck, a plurality of pin-shaped convex portions different from the pin-shaped convex portions are provided along the inner and outer circumferences of the annular bank portion.

In this vacuum chuck, the height of these convex portions is set higher than the height of the annular bank portion, and the wafer is supported by these convex portions in the very vicinity of the annular bank portion, thereby creating a negative pressure on the wafer suction surface. While retaining the function of the annular bank portion, the possibility of foreign matter (particles) being caught between the annular bank portion and the wafer is reduced.

Japanese Patent No. 3106499 Japanese Unexamined Patent Publication No. 2012-9720 Japanese Unexamined Patent Publication No. 2005-32977

However, according to the substrate holding member of Patent Document 1, two ring-shaped convex portions for forming the temperature control partition chamber are required, and fine particles (particles) are formed between the ring-shaped convex portion and the wafer. There is a risk of getting caught. Further, the fine particles may be wound up by the temperature control fluid and adhere to the pin-shaped protrusions or the wafer, which may deteriorate the processing accuracy of the wafer.

On the other hand, in the wafer holder of Patent Document 2, the wafer is sucked by vacuum sucking the sealed space formed between the wafer and the ring seal. Therefore, the particles sandwiched between the wafer support surface and the wafer at the start of vacuum suction do not cause air flow in the groove of the wafer support surface during vacuum suction, and therefore remain as they are.

On the other hand, according to the vacuum chuck of Patent Document 3, the possibility of foreign matter being caught between the annular bank portion and the wafer can be reduced, but the foreign matter is caught and remains between the pin-shaped convex portion and the wafer. There is a risk.

An object of the present invention is to provide a vacuum suction member that prevents fine particles from being caught in a contact surface between an object and a vacuum suction member as much as possible in view of the problems of the prior art.

The vacuum suction member according to the first invention is
A substrate having a main surface facing the object and having a ventilation path inside,
It is provided with a plurality of suction portions which are erected on the main surface and have a hollow tubular portion that defines an internal space leading to the ventilation path.
In a vacuum suction member for sucking an object by vacuum suction through the plurality of suction portions.
At least a part of the suction portions of the plurality of suction portions has a protrusion protruding from the end surface of the tubular portion.
The end face of each of the protrusions constitutes a first surface that supports the object to be vacuum-sucked.
Flow for vacuum suction air to flow between the internal space side and the external space side of the tubular portion at the level between the first surface and the second surface which is the end surface of the tubular portion. Space is formed ,
The plurality of suction portions are erected in a plurality of regions having a central region of the main surface and at least one annular region outside the central region.
The area of the support surface that supports the object for each suction portion is different for each region .

According to the first invention, the object is vacuum-sucked by arranging the object on the suction portion of the vacuum suction member and vacuum-sucking the internal space of the tubular portion in each suction portion through the ventilation path in the substrate. It is attracted and supported on the member. For this reason, an annular bank portion for forming a closed space for vacuum suction by surrounding the peripheral portion of the main surface, which is provided by the conventional vacuum suction member, becomes unnecessary. As a result, the contact area between the object and the vacuum suction member can be reduced as compared with the conventional case, and it is possible to prevent fine particles from being caught in the contact surface as much as possible.

In addition, since the temperature control fluid does not flow in the space between the object and the main surface other than the suction part, as was the case with the conventional vacuum suction member, the temperature control fluid causes fine particles to fly up to the object. It does not adhere or get caught between the suction part and the object.

Further, while the object is adsorbed on the vacuum suction member, at least a part of the suction part has the first surface of the protruding part and the tubular part due to the vacuum suction of the internal space of the suction part. Air flows from the outer space side to the inner space side of the tubular portion through the circulation space at the level between the second surface and the second surface. At this time, even if the fine particles are present in the air, the fine particles are discharged to the outside of the vacuum suction member through the ventilation path in the substrate by the air flowing into the internal space side. Therefore, it is possible to prevent such fine particles from being sandwiched between the first surface and the object.
Further, since the suction portions having different support surface areas are arranged in each of the plurality of radial regions, the suction force per unit area with respect to the object can be easily adjusted in the radial direction. As a result, for example, by starting the suction from the suction portion near the center of the main surface, it is possible to suck the object that is greatly bent while correcting the bending.

The vacuum suction member according to the second invention is the first invention.
At least a part of the plurality of suction portions has the plurality of protrusions.
Each of the suction portions having the plurality of protruding portions is characterized in that the internal space side and the external space side of the tubular portion communicate with each other through the adjacent protruding portions.

According to the second invention, in addition to the same action and effect as in the case of the first invention, the following effects are exhibited. That is, by appropriately selecting the distance between the adjacent protrusions and appropriately setting the cross-sectional area of the distribution space passing through the internal space side and the external space side of the tubular portion, the suction force per suction portion can be increased. It can be adjusted appropriately.

The vacuum suction member according to the third invention is the first or second invention.
At least a part of the suction portions of the plurality of suction portions has a plurality of pin-shaped convex portions as the protrusions, respectively.
The suction portion having the pin-shaped convex portion has an annular convex portion erected on the end surface of the tubular portion so as to surround the opening of the internal space of the tubular portion.
The end surface of the annular convex portion is characterized to be located at a level between the first surface and the second surface.

According to the third invention, in addition to the same action and effect as in the case of the second invention, the following effects are exhibited. That is, by appropriately selecting the height of the annular convex portion, the cross-sectional area of the distribution space can be adjusted, and the suction force of the object by the suction portion can be appropriately set.

The vacuum suction member according to the fourth invention is the first invention.
The area of the support surface for each suction portion is characterized in that the region to which the suction portion belongs is larger as it is closer to the center of the main surface.

According to the fourth invention, for example, the suction force per suction portion for an object is increased as the region to which the suction portion belongs is closer to the center of the main surface, and the region closer to the center of the main surface is as the suction portion. It can be configured so that the suction force per one is large. As a result, by starting the suction from the suction portion near the center of the main surface, it is possible to suck the object that is greatly bent while correcting the bending without any trouble.

FIG. 1A is a schematic plan view of the vacuum suction member according to the first embodiment of the present invention, and FIG. 1B is a cross-sectional view showing the cross section together with the wafer. It is a schematic plan view of the suction part in the vacuum suction member of FIG. FIG. 2 is a cross-sectional view taken along the line III-III of FIG. It is a figure which shows the example of the arrangement of the suction part with respect to the wafer in the vacuum suction member of FIG. It is a top view of the suction part of the vacuum suction member which concerns on 2nd Embodiment of this invention. It is a top view of the suction part of the vacuum suction member which concerns on 3rd Embodiment of this invention. It is a figure which shows four regions in which different kinds of suction parts are arranged on the main surface of the vacuum suction member which concerns on 4th Embodiment of this invention. 8A to 8D are schematic plan views of suction portions arranged in the four regions of FIG. 7, respectively. A table showing the number of particles of 0.3 μm or more transferred to the wafer when the wafer is sucked with respect to the conventional vacuum suction members of Comparative Examples 1 and 2 and the vacuum suction members of Examples 1 to 4 according to the present invention. Is. It is a table which shows the main specifications about the vacuum suction member of Comparative Examples 1 and 2 and Examples 1 and 4.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIGS. 1A and 1B, the vacuum suction member 1 according to the first embodiment of the present invention has a main surface 3 facing the wafer 2 as an object, and a ventilation passage 4 is provided inside. The substrate 5 is provided with a plurality of suction portions 6 erected on the main surface 3, and the wafer 2 is sucked by vacuum suction through the plurality of suction portions 6 by a vacuum suction mechanism (not shown).

In order to clarify the configuration of the vacuum suction member 1, each component shown in the drawing is deformed, and in addition to the aspect ratio in the cross-sectional view of each component, the ratio of the width or height to the mutual spacing and the like are shown. It is different from the actual one.

The substrate 5 and the adsorption portion 6 are formed by using the materials and methods usually used for forming them. Specifically, the substrate 5 is formed as a ceramic sintered body such as _{Si 3} N ₄ or an AlN sintered body, a SiC sintered body, or an Al ₂ O _{3 sintered body.}

It is desirable that the adsorption portion 6 is formed as a ceramic sintered body and is made of the same material as the substrate 5. When the substrate 5 and the adsorption portion 6 are integrally formed of the same material, they can be formed by machining the substrate 5 and the ceramic sintered body to be the adsorption portion 6. When the substrate 5 and the adsorption portion 6 are formed separately, the adsorption portion 6 can be fixed to the substrate 5 by a conventional method such as active brazing or adhesion (organic adhesion, inorganic adhesion).

As shown in FIGS. 2 and 3, each suction portion 6 has a hollow tubular portion 8 that defines an internal space 7 that leads to the ventilation passage 4. Each suction portion 6 has a plurality of pin-shaped convex portions 9 as protruding portions protruding from the end surface of the tubular portion 8. The end surface of each pin-shaped convex portion 9 constitutes a planar first surface 10 that supports the wafer 2 to be vacuum-adsorbed.

In the range from the level of the first surface 10 to the level of the second surface 11 which is the end surface of the tubular portion 8, vacuum suction air is generated between the internal space 7 side and the external space 12 side of the tubular portion 8. A distribution space 13 for distribution is formed. The height of the second surface 11 from the main surface 3 is 0.5 mm, and the height of the first surface 10 from the second surface 11 is 10 μm.

The height of the first surface 10 from the second surface 11 is preferably 0.1 to 30 μm. If the height of the first surface 10 from the second surface 11 is less than 0.1 μm, the height is about the same as the surface roughness of the second surface 11, so that the effect of providing the pin-shaped convex portion 9 can be obtained. It becomes difficult to be damaged. Further, if the height of the first surface 10 from the second surface 11 exceeds 30 μm, the flow of air through the distribution space 13 becomes too large, and it becomes difficult to obtain a desired adsorption force.

As shown in FIG. 4, the actual arrangement of the suction portion 6 in the vacuum suction member 1 is such that when a wafer 2 having a diameter of 200 mm is sucked, the suction portion 6 is located at a position (main surface) corresponding to the center of the wafer 2. One is arranged at the center of 3), and a plurality of them are arranged at approximately equal intervals on each of the six concentric circles whose diameters increase by 30 mm from 40 mm to 190 mm around the center.

That is, 149 suction portions 6 are arranged on the main surface 3 so as to be substantially uniform with respect to the wafer 2. The inner diameter of the tubular portion 8 of the suction portion 6 is 3.0 mm, and the outer diameter is 6.0 mm.

In this configuration, when the vacuum suction member 1 sucks the wafer 2, the wafer 2 is arranged on the suction portion 6 of the vacuum suction member 1, and the internal space 7 of the tubular portion 8 in each suction portion 6 is the substrate 5. Vacuum is sucked through the ventilation passage 4 inside. As a result, the wafer 2 is attracted and supported on the vacuum suction member 1.

While the wafer 2 is being sucked in this way, in each suction portion 6, the second surface of the pin-shaped convex portion 9 is changed to the second surface of the tubular portion 8 due to the vacuum suction of the internal space 7. Air flows from the outer space 12 side of the tubular portion 8 to the inner space 7 side through the circulation space 13 existing in the range up to the level of the surface 11.

During this time, if fine particles (particles) are suspended on the external space 12 side or are soared by the flow of air, the fine particles are separated by the air flowing into the internal space 7 side in the ventilation passage 4 in the substrate 5. Is discharged to the outside of the vacuum suction member 1. As a result, it is possible to prevent fine particles from being caught between the first surface 10 of the pin-shaped convex portion 9 and the wafer 2.

As described above, according to the first embodiment, the temperature control fluid that has been flowed by the conventional vacuum suction member can be flowed in the space between the wafer 2 and the main surface 3 other than the suction part 6. Therefore, the fine particles do not fly up due to the flow of the temperature control fluid and do not adhere to the wafer 2 or the contact surface between the wafer 2 and the vacuum suction member.

Further, even when the fine particles are suspended on the external space 12 side while the wafer 2 is sucked on the vacuum suction member 1, the fine particles are generated by the air flowing from the external space 12 side to the internal space 7 side. It is discharged to the outside of the vacuum suction member 1. Therefore, it is possible to prevent fine particles from being caught between the first surface 10 of the pin-shaped convex portion 9 and the wafer 2.

Further, an annular bank portion for forming a closed space for vacuum adsorption by surrounding the peripheral portion of the main surface, which is provided by the conventional vacuum suction member, becomes unnecessary. As a result, the contact area between the wafer 2 and the vacuum suction member 1 can be reduced as compared with the conventional case, and it is possible to further prevent fine particles from being caught in the contact surfaces of both.

In the vacuum suction member of the second embodiment, as shown in FIG. 5, the suction portion 14 has four partially cylindrical annular convex portions 15 as protruding portions erected on the second surface 11 of the tubular portion 8. Be prepared. The four annular convex portions 15 have a partially cylindrical shape in which the wall is divided into four equal parts by providing four slits S in a cylindrical wall erected on a second surface 11 which is an end surface of the tubular portion 8. Has.

However, the slit S does not necessarily have to be provided from the lower end (level of the second surface 11) to the upper end (level of the first surface 10) of the cylindrical wall, and the lower end of the slit S is at a level above the second surface 11. May be located at.

In the suction portion 14, the inner space 7 side and the outer space 12 side of the tubular portion 8 communicate with each other through the adjacent annular convex portions 15. That is, the portion of the slit S constitutes a distribution space for air for vacuum suction to flow between the internal space 7 side and the external space 12 side of the tubular portion 8.

According to the second embodiment, by selecting the width and length of the slit S, the suction force per suction portion 14 can be appropriately adjusted. Other configurations and actions / effects are the same as in the case of the first embodiment.

In the vacuum suction member of the third embodiment, as shown in FIG. 6, each of the suction portions 16 has a plurality of pin-shaped convex portions 9 as protruding portions erected on the second surface 11 which is the end surface of the tubular portion 8. Have. Further, the suction portion 16 has an annular convex portion 17 erected on the second surface 11 which is an end surface of the tubular portion 8 so as to surround the opening of the internal space 7 of the tubular portion 8. The end face of the annular convex portion 17 is located at a level between the first surface 10 and the second surface 11, which are the end faces of the pin-shaped convex portion 9.

The suction portion 16 of the present embodiment has a configuration in which the above-mentioned annular convex portion 17 is provided with respect to the suction portion 6 of the first embodiment. That is, the cross-sectional area (the area of the minimum cross section perpendicular to the air flow) of the circulation space through which the air for vacuum suction flows between the internal space 7 side and the external space 12 side of the tubular portion 8 is the annular convex portion. Limited by 17.

Therefore, by selecting the height of the annular convex portion 17, the suction force per suction portion 16 can be appropriately adjusted. Other configurations and actions / effects are the same as in the case of the first embodiment.

In the vacuum suction member of the fourth embodiment, a plurality of suction portions are erected in a plurality of regions having a central region of the main surface 3 and at least one annular region outside the central region of the main surface 3, and each suction portion has a plurality of suction portions. The area of the support surface that supports the wafer 2 is different for each region.

Specifically, as shown in FIG. 7, for example, four regions 3a to 3d, which are a region 3a at the center of the main surface 3 and three annular regions 3b to 3d outside the region 3a, are set. Then, the area of the support surface per the suction portion arranged there is different for each of the regions 3a to 3d. That is, the adsorption portions 21 to 24 are arranged in the regions 3a to 3d as shown in FIGS. 8A to 8D, respectively.

The suction portion 21 has the entire end surface of the tubular portion 8 as a support surface. The suction portion 22 is configured by erection of only 12 pin-shaped convex portions 9 similar to those in the first embodiment on the second surface 11. The suction portion 23 is configured by erection of only six similar pin-shaped convex portions 9 on the second surface 11. The suction portion 24 is configured by erection of only three similar pin-shaped convex portions 9 on the second surface 11.

Therefore, the area of the support surface for each of the suction portions 21 to 24 (the end surface of the suction portion 21 and the first surface 10 of the suction portions 22 to 24) is the region 3a to 3d to which the suction portions 21 to 24 belong. Is larger as it is closer to the center of the main surface 3. In this case, the closer the regions 3a to 3d are to the center of the main surface 3, the smaller the cross-sectional area of the above-mentioned distribution space per one of the suction portions 21 to 24 belonging to the regions 3a to 3d (in the case of the suction portion 21). Since it is zero), the adsorption force per one is larger as the regions 3a to 3d to which it belongs are closer to the center of the main surface 3.

Therefore, on condition that the suction portions 21 to 24 are arranged in the corresponding regions 3a to 3d, by arranging them substantially evenly over the entire main surface 3 as shown in FIG. 4, the region closer to the center of the main surface 3 is closer. , The adsorption force per unit area acting on the wafer 2 can be increased.

In this configuration, when the wafer 2 is sucked by the vacuum suction member, vacuum suction is started from the suction portion 21 of the region 3a near the center of the main surface 3, and the suction portions 22 of the regions 3b to 3d farther away are sequentially started. Vacuum suction is started from ~ 24. As a result, even if the wafer 2 is greatly bent, the wafer 2 is sequentially adsorbed from the central side to the outer peripheral side thereof, so that the bending is corrected and adsorbed without any trouble.

As described above, according to the fourth embodiment, by sequentially starting the suction from the suction portion 21 of the region 3a near the center of the main surface 3, the greatly bent wafer 2 is sucked while correcting the bending. can do. Other configurations, actions and effects of the vacuum suction member of the present embodiment are the same as those of the first embodiment.

FIG. 9 shows 0.3 μm or more transferred to the wafer 2 when the wafer 2 is vacuum-sucked with respect to the conventional vacuum suction members of Comparative Examples 1 and 2 and the vacuum suction members of Examples 1 to 4 according to the present invention. Indicates the number of particles in. The number of particles was measured using WM10 (manufactured by Topcon).

The vacuum suction members of Comparative Examples 1 and 2 correspond to the conventional ring chuck and pin chuck, respectively, and the vacuum suction members of Examples 1 to 4 correspond to the vacuum suction members of the above-described embodiments 1 to 4, respectively.

Here, the ring chuck is provided with 17 concentric ring-shaped ribs (convex stripes) having the center of the main surface as a common center on the main surface, and is composed of the wafer 2, the main surface, and 17 ribs. It is a vacuum suction member configured to suck the wafer 2 by vacuum sucking each space to be formed through an intake path opened in a portion corresponding to each space on the main surface.

Further, the pin chuck has one ring-shaped rib (convex) provided on the outer peripheral portion of the main surface thereof, and a large number of support pins arranged substantially evenly on the inner portion of the rib on the main surface. It is a vacuum suction member configured to suck the wafer 2 by vacuum sucking a space formed by a wafer 2, a main surface, and a ring-shaped rib through an intake path opened at the center of the main surface.

FIG. 10 shows the main specifications of the vacuum suction members of Comparative Examples 1 and 2 and Examples 1 to 4. Regarding Examples 1 to 4, as specifications related to the first surface 10 of the suction portions 6, 14, 16, 21 to 24, the diameter of the pin-shaped convex portion 9 (pin diameter), the suction portions 6, 16, 22 to 22 The number of pin-shaped convex portions 9 (number of pins) per 24, the number of suction portions per substrate 5, and the annular convex portions (the annular convex portion 15 in Example 2 and the annular convex portion 17 in Example 3). The values of the inner diameter, the width of the annular convex portion, and the width of the slit S are shown.

Regarding Comparative Example 2, as specifications related to the support pins, the diameter of the support pins, the spacing between the support pins (pin spacing), the number of support pins (the number of pins), and the contact surface of the support pins with the wafer 2 The total area (total pin area) is shown.

Further, as specifications related to the ribs of Comparative Examples 1 and 2, the width of the ribs and the number of ribs (number of ribs) are shown. Further, for Comparative Examples 1 and 2 and Examples 1 to 4, the total area of the contact surface between the vacuum suction member and the wafer 2 (total contact area) and the ratio of the total contact area to the area of the wafer 2 are shown. ..

As can be understood from FIGS. 9 and 10, the larger the total area (total contact area) of the contact surface between the vacuum suction member and the wafer 2, the more particles (number of particles) adhere to the contact surface (sandwiched). ) Increases. Further, in Examples 1 to 4, the total contact area is reduced by exclusively using the adsorption portions 6, 14, 16 and 21 to 24 without using ribs, thereby reducing the number of particles adhering. I understand.

Further, in Examples 1 to 4, since the number of the suction portions 6, 14, 16 or 21 to 24 is 149, each contact surface of the suction portions 6, 14, 16, 21 to 24 It can be seen that the number of adsorbed particles increases as the area of the above increases. Then, according to Examples 1 to 4, it can be seen that the total contact area with the wafer 2 is smaller than that of Comparative Examples 1 and 2, and the number of particles adhering to the contact surface is smaller.

As described above, according to Examples 1 to 4, the ribs (annular bank portion) for forming the closed space that the conventional ring chuck (Comparative Example 1) and pin chuck (Comparative Example 2) have are provided. Since it does not exist, the contact area between the wafer 2 and the vacuum suction member 1 can be reduced as compared with the conventional case, and fine particles can be prevented from being caught in the contact surfaces of the two as much as possible.

Further, while the wafer 2 is sucked by the vacuum suction member, the air flow flowing from the outer space 12 side through the flow space 13 to the inner space 7 side floats or soars fine particles on the outer space 12 side to the vacuum suction member. It is thought that it is discharged to the outside of. It is considered that this also reduces the number of fine particles sandwiched between the vacuum suction member and the wafer 2 as compared with the cases of Comparative Examples 1 and 2 in which the air flow does not exist.

Although the embodiments and examples of the present invention have been described above, the present invention is not limited thereto. For example, the protruding portion protruding from the end surface (second surface 11) of the tubular portion 8 may have a shape other than the pin-shaped convex portion 9 and the annular convex portion 15. Further, the object of suction by the vacuum suction member is not limited to the wafer 2, and may be another semiconductor substrate that is supported and positioned by the vacuum suction member and processed.

Further, the vacuum suction member of the first to third embodiments may have a suction portion having no protruding portion as shown in FIG. 8A, in addition to the suction portions 6, 14 or 16. In this case, when the wafer 2 is sucked, the end face of the suction portion becomes the contact surface with the wafer 2.

1 ... Vacuum suction member, 2 ... Wafer (object), 3 ... Main surface, 3a to 3d ... Region, 4 ... Ventilation path, 5 ... Base, 6, 14, 16, 21 to 24 ... Suction part, 7 ... Inside Space, 8 ... Cylindrical part, 9 ... Pin-shaped convex part (protruding part), 10 ... First surface, 11 ... Second surface, 12 ... External space, 13 ... Distribution space, 15 ... Partial cylindrical annular convex part (Protruding part), 17 ... Circular convex part.

Claims (4)

A substrate having a main surface facing the object and having a ventilation path inside,
It is provided with a plurality of suction portions which are erected on the main surface and have a hollow tubular portion that defines an internal space leading to the ventilation path.
In a vacuum suction member for sucking an object by vacuum suction through the plurality of suction portions.
At least a part of the suction portions of the plurality of suction portions has a protrusion protruding from the end surface of the tubular portion.
The end face of each of the protrusions constitutes a first surface that supports the object to be vacuum-sucked.
Flow for vacuum suction air to flow between the internal space side and the external space side of the tubular portion at the level between the first surface and the second surface which is the end surface of the tubular portion. Space is formed ,
The plurality of suction portions are erected in a plurality of regions having a central region of the main surface and at least one annular region outside the central region.
A vacuum suction member , wherein the area of the support surface for supporting the object for each suction portion is different for each region. At least a part of the plurality of suction portions has the plurality of protrusions.
The vacuum according to claim 1, wherein each of the suction portions having the plurality of protruding portions communicates with the internal space side and the external space side of the tubular portion via the adjacent protruding portions. Adsorption member. At least a part of the suction portions of the plurality of suction portions has a plurality of pin-shaped convex portions as the protrusions, respectively.
The suction portion having the pin-shaped convex portion has an annular convex portion erected on the end surface of the tubular portion so as to surround the opening of the internal space of the tubular portion.
The vacuum suction member according to claim 1 or 2, wherein the end surface of the annular convex portion is located at a level between the first surface and the second surface. The vacuum suction member according to claim 1 , wherein the area of the support surface for each suction portion is larger as the region to which the suction portion belongs is closer to the center of the main surface.