JP2018110148A - Vacuum suction member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vacuum suction member in which fine particles are prevented from being sandwiched by contact surfaces of an object and the vacuum suction member as much as possible.SOLUTION: A vacuum suction member 1 includes a substrate 5 having a principal surface facing a wafer 2 and a ventilation path 4, and multiple suction parts 6 being erected on the principal surface 3, and having hollow cylindrical parts 8 defining internal spaces 7 communicating with the ventilation path 4. Each suction part 6 has a pin-shaped protrusion portion 9 projecting from an end surface of the cylindrical part 8 thereof, and an end surface of the pin-shaped protrusion portion 9 constitutes a first surface 10 supporting the wafer 2 to be sucked, and at a level between the first surface 10 and a second surface 11, i.e., the end face of the cylindrical part 8, a circulation space 13 for circulating vacuum suction air between an internal space 7 side and an outer space 12 side of the cylindrical part 8 is formed.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a vacuum suction member used for vacuum suction of an object such as a semiconductor wafer.

  2. Description of the Related Art Conventionally, in a semiconductor manufacturing apparatus such as an exposure apparatus, an object such as a semiconductor wafer is vacuum-sucked through a vacuum suction member on the stage in order to fix and process the object on the stage.

  As such a vacuum suction member, for example, Patent Document 1 discloses two annular-shaped convex portions respectively surrounding the outer peripheral portion and the central portion of the main surface facing the wafer when the wafer is sucked, and these annular shapes. There is described a substrate holding member provided with a large number of suction holes arranged in a region on the main surface between the projections and pin-like projections surrounding each suction hole.

  In this substrate holding member, the wafer is placed on each pin-shaped convex portion by vacuum-sucking a compartment formed inside the convex portion between the wafer and each pin-shaped convex portion through a suction hole. Fixed. In addition, in this substrate holding member, the heat generated in the wafer or the like is discharged by flowing a temperature adjustment fluid in the temperature adjustment chamber formed outside the pin-like protrusions between the wafer and the annular protrusions, Inconveniences that may occur due to heat are prevented.

  Further, Patent Document 2 discloses a sealed space formed between a wafer and a ring-shaped seal by placing the wafer on a wafer-supporting surface of a ring-shaped seal and a wafer support member provided on the main surface facing the wafer. Describes a wafer holder that sucks the wafer by vacuum suction. In this wafer holder, by providing a groove on the wafer support surface, the frequency of occurrence of particles (fine particles) between the wafer support surface and the wafer is reduced, and the wafer suction distortion that causes an exposure error is reduced. I have to.

  Further, in Patent Document 3, an annular bank portion that seals air is provided on the outer periphery of a main surface (wafer adsorption surface) facing the wafer, and a plurality of pin-shaped convex portions that hold the wafer are arranged on the inner side thereof. A vacuum chuck is described. In this vacuum chuck, a plurality of pin-shaped convex portions different from the pin-shaped convex portions are provided along the inner and outer circumferences of the annular bank portion.

  In this vacuum chuck, the height of these convex portions is set to be higher than the height of the annular bank portion, and the wafer is supported in the vicinity of the annular bank portion by these convex portions, thereby making the wafer suction surface negative pressure. The possibility of foreign matter (particles) being caught between the annular bank portion and the wafer is reduced while the action of the annular bank portion remains.

Japanese Patent No. 3106499 JP 2012-9720 A JP 2005-32977 A

  However, according to the substrate holding member of Patent Document 1, two ring-shaped convex portions for forming the temperature control chamber are required, and fine particles (particles) are formed between the ring-shaped convex portion and the wafer. There is a risk of getting caught. In addition, the fine particles are wound up by the temperature control fluid and adhere to the pin-shaped convex portion or the wafer, which may deteriorate the processing accuracy for the wafer.

  On the other hand, in the wafer holder disclosed in Patent Document 2, the wafer is adsorbed by vacuum suction of a sealed space formed between the wafer and the ring seal. For this reason, the particles sandwiched between the wafer support surface and the wafer at the start of vacuum suction remain as they are because no air flows in the grooves of the wafer support surface while vacuum suction is performed.

  On the other hand, according to the vacuum chuck of the above-mentioned Patent Document 3, the possibility that foreign matter is caught between the annular bank portion and the wafer can be reduced, but the foreign matter remains between the pin-shaped convex portion and the wafer. There is a fear.

  An object of the present invention is to provide a vacuum suction member that prevents as much as possible fine particles from being caught on the contact surface between an object and a vacuum suction member in view of the problems of the prior art.

The vacuum suction member according to the first invention is
A base body having a main surface facing the object and provided with an air passage inside;
A plurality of adsorbing portions that are erected on the main surface and have a hollow cylindrical portion that defines an internal space that communicates with the air passage;
In a vacuum suction member for sucking the object by vacuum suction through the plurality of suction portions,
At least some of the plurality of suction portions each have a protruding portion that protrudes from an end surface of the cylindrical portion,
The end surface of each protrusion constitutes a first surface that supports the object to be vacuum-sucked,
Flow for air for vacuum suction to flow between the internal space side and the external space side of the cylindrical portion at a level between the first surface and the second surface that is an end surface of the cylindrical portion. A space is formed.

  According to the first invention, the object is placed on the suction part of the vacuum suction member, and the object is vacuum sucked by vacuum-sucking the internal space of the cylindrical part in each suction part through the air passage in the substrate. Adsorbed and supported on the member. For this reason, the annular bank part for enclosing the peripheral part of the main surface which the conventional vacuum suction member had, and forming the sealed space for vacuum suction becomes unnecessary. Thereby, the contact area between a target object and a vacuum suction member can be reduced compared with the past, and it can avoid that a microparticle is pinched | interposed into this contact surface as much as possible.

  In addition, in the space other than the adsorbing part between the object and the main surface, the temperature control fluid that has flowed by the conventional vacuum adsorbing member does not flow. It is not attached or sandwiched between the suction part and the object.

  Further, while the object is being adsorbed on the vacuum adsorbing member, at least a part of the adsorbing part is formed by the vacuum suction of the internal space of the adsorbing part and the first surface of the protruding part and the cylindrical part. Air flows from the external space side to the internal space side of the cylindrical portion through a distribution space at a level between the second surface. At this time, even if the fine particles are present in the air, the fine particles are discharged to the outside of the vacuum adsorption member via the air passage in the base body by the air flowing into the internal space. Therefore, it is possible to prevent such fine particles from being sandwiched between the first surface and the object.

The vacuum suction member according to the second invention is the first invention,
At least some of the plurality of suction portions each have a plurality of the protruding portions,
Each adsorbing portion having the plurality of projecting portions is characterized in that the inner space side and the outer space side of the cylindrical portion communicate with each other through the adjacent projecting portions.

  According to the second invention, in addition to the same effects as those of the first invention, the following effects can be obtained. That is, by appropriately selecting the interval between adjacent protrusions and appropriately setting the cross-sectional area of the flow space through the inner space side and the outer space side of the cylindrical portion, the adsorption force per adsorption portion can be increased. It can be adjusted appropriately.

The vacuum suction member according to the third invention is the first or second invention,
At least some of the plurality of suction portions each have a plurality of pin-shaped convex portions as the protruding portions,
The adsorbing part having the pin-like convex part has an annular convex part erected on the end surface of the cylindrical part so as to surround the opening of the internal space of the cylindrical part,
The end surface of the annular convex portion is located at a level between the first surface and the second surface.

  According to the third invention, in addition to the same effects as those of the second invention, the following effects can be obtained. That is, by appropriately selecting the height of the annular convex portion, the cross-sectional area of the circulation space can be adjusted, and the suction force of the object by the suction portion can be set appropriately.

The vacuum suction member according to a fourth invention is any one of the first to third inventions,
The plurality of adsorbing portions are erected in a plurality of regions having a central region of the main surface and at least one annular region outside thereof.
The area of the support surface that supports the object for each suction portion is different for each region.

  According to the 4th invention, in addition to the effect similar to the case of the said 1st invention, there exist the following effects. That is, since the suction portions having different support surface areas are arranged for each of the plurality of regions in the radial direction, the suction force per unit area on the object can be easily adjusted in the radial direction. As a result, for example, by starting the suction from the suction portion close to the center of the main surface, it is possible to suck the object that is greatly bent while correcting the bending.

A vacuum suction member according to a fifth invention is the fourth invention,
The area of the support surface for each suction portion is larger as the area to which the suction portion belongs is closer to the center of the main surface.

  According to the fifth aspect of the invention, for example, the suction force per suction part for an object is increased as the region to which the suction part belongs is closer to the center of the main surface, and the closer to the center of the main surface, the suction unit. It can comprise so that the adsorption | suction power per one may become large. Thereby, by starting the suction from the suction portion close to the center of the main surface, it is possible to suck the object that is greatly bent while correcting the bending without hindrance.

FIG. 1A is a schematic plan view of a vacuum suction member according to the first embodiment of the present invention, and FIG. 1B is a cross-sectional view showing a cross section thereof together with a wafer. It is a typical top view of the adsorption | suction part in the vacuum adsorption member of FIG. It is the III-III sectional view taken on the line of FIG. It is a figure which shows the actual example of arrangement | positioning of the adsorption | suction part with respect to the wafer in the vacuum adsorption member of FIG. It is a top view of the adsorption part of the vacuum adsorption member concerning a 2nd embodiment of the present invention. It is a top view of the adsorption part of the vacuum adsorption member concerning a 3rd embodiment of the present invention. It is a figure which shows four area | regions where a different kind of adsorption | suction part is arrange | positioned in the main surface of the vacuum suction member which concerns on 4th Embodiment of this invention. 8A to 8D are schematic plan views of the suction portions respectively disposed in the four regions in FIG. Table showing the number of particles having a size of 0.3 μm or more transferred to a wafer when the wafer is adsorbed with respect to the conventional vacuum adsorption members of Comparative Examples 1 and 2 and the vacuum adsorption members of Examples 1 to 4 according to the present invention. It is. It is a table | surface which shows the main specifications about the vacuum suction member of Comparative Examples 1 and 2 and Examples 1-4.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIGS. 1A and 1B, the vacuum suction member 1 according to the first embodiment of the present invention has a main surface 3 that faces a wafer 2 as an object, and an air passage 4 is provided therein. The substrate 5 is provided with a plurality of suction portions 6 erected on the main surface 3, and the wafer 2 is sucked by vacuum suction with a vacuum suction mechanism (not shown) through the plurality of suction portions 6.

  In addition, in order to clarify the configuration of the vacuum suction member 1, each illustrated component is deformed, and in addition to the aspect ratio in the cross-sectional view of each component, the ratio between the width or height and the interval between them is It is different from the actual.

The base 5 and the adsorption part 6 are formed by using materials and methods usually used for the formation thereof. Specifically, the base 5 is formed as a ceramic sintered body such as Si ₃ N ₄ , an AlN sintered body, an SiC sintered body, or an Al ₂ O ₃ sintered body.

  The adsorbing part 6 is formed as a ceramic sintered body and is preferably formed of the same material as the base 5. When the base body 5 and the suction portion 6 are integrally formed of the same material, the base body 5 and the ceramic sintered body to be the suction portion 6 can be formed by machining. When the base body 5 and the suction part 6 are formed separately, the suction part 6 can be fixed to the base body 5 by a conventional method such as active brazing or adhesion (organic adhesion or inorganic adhesion).

  As shown in FIGS. 2 and 3, each adsorption portion 6 has a hollow cylindrical portion 8 that defines an internal space 7 that communicates with the ventilation path 4. Each suction part 6 has a plurality of pin-like convex parts 9 as projecting parts that project from the end face of the cylindrical part 8. The end face of each pin-like convex portion 9 constitutes a flat first face 10 that supports the wafer 2 to be vacuum-sucked.

  In the range from the level of the first surface 10 to the level of the second surface 11 that is the end surface of the cylindrical portion 8, air for vacuum suction is generated between the inner space 7 side and the outer space 12 side of the cylindrical portion 8. A distribution space 13 for distribution is formed. The height of the second surface 11 from the main surface 3 is 0.5 mm, and the height of the first surface 10 from the second surface 11 is 10 μm.

  In addition, it is preferable that the height from the 2nd surface 11 of the 1st surface 10 is 0.1-30 micrometers. If the height of the first surface 10 from the second surface 11 is less than 0.1 μm, the height is about the same as the surface roughness of the second surface 11, so that the effect of providing the pin-shaped convex portion 9 is obtained. It becomes difficult to be. Moreover, if the height from the 2nd surface 11 of the 1st surface 10 exceeds 30 micrometers, the flow of the air through the circulation space 13 will become large too much, and it will become difficult to obtain desired adsorption power.

  As shown in FIG. 4, the actual arrangement of the suction unit 6 in the vacuum suction member 1 is, for example, when the wafer 2 having a diameter of 200 mm is sucked, the suction unit 6 is located at a position (main surface) corresponding to the center of the wafer 2. And a plurality of them arranged at approximately equal intervals on each of six concentric circles whose diameter increases from 40 mm to 190 mm by 30 mm.

  That is, 149 suction portions 6 are arranged on the main surface 3 so as to be substantially equal to the wafer 2. The inner diameter of the cylindrical portion 8 of the suction portion 6 is 3.0 mm, and the outer diameter is 6.0 mm.

  In this configuration, when the vacuum suction member 1 sucks the wafer 2, the wafer 2 is disposed on the suction portion 6 of the vacuum suction member 1, and the internal space 7 of the cylindrical portion 8 in each suction portion 6 is the base 5. Vacuum suction is performed through the inner ventilation path 4. As a result, the wafer 2 is sucked and supported on the vacuum suction member 1.

  While the wafer 2 is being sucked in this manner, in each suction portion 6, the second portion of the cylindrical portion 8 starts from the level of the first surface 10 of the pin-like convex portion 9 with the vacuum suction of the internal space 7. Air flows from the outer space 12 side to the inner space 7 side of the cylindrical portion 8 through the circulation space 13 existing in the range up to the level of the surface 11.

  In the meantime, when fine particles (particles) float on the external space 12 side or float up by the flow of air, the fine particles flow into the air passage 4 in the base body 5 by the air flowing into the internal space 7 side. Then, it is discharged to the outside of the vacuum suction member 1. Thereby, it is avoided as much as possible that a microparticle is pinched | interposed between the 1st surface 10 of the pin-shaped convex part 9, and the wafer 2. FIG.

  As described above, according to the first embodiment, in the space other than the suction portion 6 between the wafer 2 and the main surface 3, the temperature-controlled fluid that has been flowed by the conventional vacuum suction member is allowed to flow. Therefore, the fine particles do not rise due to the flow of the temperature control fluid and do not adhere to the wafer 2 or the contact surface between the wafer 2 and the vacuum suction member.

  Further, even when fine particles are floating on the external space 12 side while the wafer 2 is adsorbed on the vacuum suction member 1, such fine particles are caused by air flowing from the external space 12 side to the internal space 7 side. It is discharged outside the vacuum suction member 1. Therefore, it is possible to prevent the fine particles from being sandwiched between the first surface 10 of the pin-shaped convex portion 9 and the wafer 2 as much as possible.

  Furthermore, an annular bank for enclosing the periphery of the main surface of the conventional vacuum suction member and forming a sealed space for vacuum suction becomes unnecessary. As a result, the contact area between the wafer 2 and the vacuum suction member 1 can be reduced as compared with the prior art, and it is possible to further avoid the fine particles from being caught between the contact surfaces of both.

  In the vacuum suction member of the second embodiment, as shown in FIG. 5, the suction portion 14 has four partial cylindrical annular protrusions 15 as protrusions erected on the second surface 11 of the cylindrical portion 8. Prepare. The four annular protrusions 15 are formed in a partial cylindrical shape obtained by dividing the wall into four equal parts by providing four slits S on the cylindrical wall standing on the second surface 11 which is the end surface of the cylindrical part 8. Have

  However, the slit S is not necessarily provided from the lower end (level of the second surface 11) to the upper end (level of the first surface 10) of the cylindrical wall, and the lower end of the slit S is a level above the second surface 11. May be located.

  In the suction portion 14, the inner space 7 side and the outer space 12 side of the cylindrical portion 8 communicate with each other through the adjacent annular protrusions 15. That is, the slit S portion constitutes a circulation space for the vacuum suction air to circulate between the inner space 7 side and the outer space 12 side of the cylindrical portion 8.

  According to the second embodiment, by selecting the width and length of the slit S, the suction force per one suction portion 14 can be adjusted appropriately. Other configurations, operations, and effects are the same as those in the first embodiment.

  In the vacuum suction member of the third embodiment, as shown in FIG. 6, the suction part 16 has a plurality of pin-like convex parts 9 as protruding parts erected on the second surface 11 which is an end face of the cylindrical part 8. Have. Further, the suction portion 16 has an annular convex portion 17 erected on the second surface 11 which is an end surface of the tubular portion 8 so as to surround the opening of the internal space 7 of the tubular portion 8. The end surface of the annular convex portion 17 is located at a level between the first surface 10 and the second surface 11 which are end surfaces of the pin-shaped convex portion 9.

  The suction portion 16 of the present embodiment has a configuration in which the annular convex portion 17 is provided with respect to the suction portion 6 of the first embodiment. That is, the cross-sectional area (the area of the minimum cross section perpendicular to the air flow) in which the air for vacuum suction is circulated between the inner space 7 side and the outer space 12 side of the cylindrical portion 8 is an annular convex portion. 17.

  For this reason, by selecting the height of the annular convex portion 17, it is possible to appropriately adjust the suction force per suction portion 16. Other configurations, operations, and effects are the same as those in the first embodiment.

  In the vacuum suction member of the fourth embodiment, the plurality of suction portions are erected in a plurality of regions having a central region of the main surface 3 and at least one annular region outside thereof, The area of the support surface that supports the wafer 2 varies from region to region.

  Specifically, as shown in FIG. 7, for example, four regions 3 a to 3 d including a central region 3 a of the main surface 3 and three outer annular regions 3 b to 3 d are set. And the area of the support surface per adsorption | suction part arrange | positioned there differs for every area | region 3a-3d. That is, the adsorbing portions 21 to 24 whose plan views are shown in FIGS. 8A to 8D are arranged in the regions 3a to 3d, respectively.

  The suction part 21 has the entire end surface of the cylindrical part 8 as a support surface. The suction part 22 is configured by standing up to twelve pin-like convex parts 9 similar to those in the first embodiment on the second surface 11. The suction part 23 is configured by standing up to six similar pin-shaped convex parts 9 on the second surface 11. The adsorbing part 24 is configured by upstanding only three similar pin-shaped convex parts 9 on the second surface 11.

  Accordingly, the area of the support surface (the end surface in the case of the suction portion 21 and the first surface 10 in the case of the suction portions 22 to 24) of each suction portion 21 to 24 is the area 3a to 3d to which the suction portions 21 to 24 belong. Is closer to the center of the main surface 3. In this case, the closer the regions 3a to 3d are to the center of the main surface 3, the smaller the cross-sectional area of the above-described circulation space per one of the suction portions 21 to 24 belonging to the regions 3a to 3d (in the case of the suction portion 21). Zero), the adsorption force per one becomes larger as the regions 3a to 3d to which it belongs are closer to the center of the main surface 3.

  Therefore, on the condition that the adsorbing portions 21 to 24 are arranged in the corresponding regions 3a to 3d, the region closer to the center of the main surface 3 is arranged as shown in FIG. The adsorbing force per unit area acting on the wafer 2 can be increased.

  In this configuration, when the wafer 2 is sucked by the vacuum suction member, vacuum suction is started from the suction portion 21 in the region 3a close to the center of the main surface 3, and the suction portions 22 in the farther regions 3b to 3d in order. Vacuum suction starts to ~ 24. As a result, even if the wafer 2 is greatly bent, the wafer 2 is sequentially sucked from the center side toward the outer peripheral portion side, so that the bending is sucked while being corrected without any trouble.

  As described above, according to the fourth embodiment, by sequentially starting the suction from the suction portion 21 in the region 3a close to the center of the main surface 3, the wafer 2 that has been greatly bent is sucked while correcting the bending. can do. Other configurations, operations, and effects of the vacuum suction member of the present embodiment are the same as those of the first embodiment.

  FIG. 9 shows the conventional vacuum suction members of Comparative Examples 1 and 2 and the vacuum suction members of Examples 1 to 4 according to the present invention, in which 0.3 μm or more transferred to the wafer 2 when the wafer 2 was vacuum-sucked. Indicates the number of particles. The number of particles was measured using WM10 (Topcon).

  The vacuum suction members of Comparative Examples 1 and 2 correspond to conventional ring chucks and pin chucks, respectively, and the vacuum suction members of Examples 1 to 4 correspond to the vacuum suction members of Embodiments 1 to 4, respectively.

  Here, the ring chuck is provided with 17 concentric ring-shaped ribs (projections) having the center of the main surface as a common center on the main surface, and the wafer 2, the main surface, and the 17 ribs. The vacuum suction member is configured to suck the wafer 2 by sucking each formed space by vacuum suction through an intake passage opened in a portion corresponding to each space on the main surface.

  Further, the pin chuck has one ring-shaped rib (protrusion) provided on the outer peripheral portion of the main surface, and a large number of support pins arranged almost evenly on the inner side of the rib on the main surface, This is a vacuum suction member configured to suck the wafer 2 by vacuum suction through a suction path opened at the center of the main surface of the space formed by the wafer 2, the main surface, and the ring-shaped rib.

  FIG. 10 shows the main specifications of the vacuum suction members of Comparative Examples 1 and 2 and Examples 1 to 4. About Examples 1-4, as a specification relevant to the 1st surface 10 of adsorption part 6,14,16,21-24, the diameter (pin diameter) of pin-shaped convex part 9, adsorption part 6,16,22- The number of pin-shaped convex portions 9 per 24 (the number of pins), the number of adsorbing portions per base 5, and the annular convex portions (the annular convex portion 15 in the second embodiment and the annular convex portion 17 in the third embodiment). Among the inner diameter, the width of the annular convex portion, and the width of the slit S, values of corresponding ones are shown.

  In Comparative Example 2, the specifications related to the support pins include the diameter of the support pins, the distance between the support pins (pin interval), the number of support pins (number of pins), and the contact surface of the support pins with the wafer 2. The total area (total pin area) is shown.

  In addition, as specifications related to the ribs of Comparative Examples 1 and 2, the width of the ribs and the number of ribs (rib number) are shown. Further, for Comparative Examples 1 and 2 and Examples 1 to 4, the total area (contact total area) of the contact surface between the vacuum suction member and the wafer 2 and the ratio of the total contact area to the area of the wafer 2 are shown. .

  As understood from FIGS. 9 and 10, the larger the total area (total contact area) of the contact surface between the vacuum suction member and the wafer 2, the larger the number of particles adhering to the contact surface (the number of particles). ) Increases. Further, in Examples 1 to 4, the total contact area is reduced by using the adsorption portions 6, 14, 16, 21 to 24 exclusively without using ribs, thereby reducing the number of adhered particles. I understand.

  Furthermore, in Examples 1-4, since the number of adsorption | suction part 6, 14, 16 or 21-24 is all 149, the contact surface per adsorption | suction part 6, 14, 16, 21-24 It can be seen that the number of particles adhering increases as the area increases. According to Examples 1 to 4, it can be seen that the number of particles adhering to the contact surface is smaller as compared with Comparative Examples 1 and 2, because the total contact area with the wafer 2 is smaller.

  Thus, according to Examples 1-4, the rib (annular bank part) for forming the sealed space which the conventional ring chuck (comparative example 1) and the pin chuck (comparative example 2) had. Since it does not exist, it is possible to reduce the contact area between the wafer 2 and the vacuum suction member 1 as compared with the conventional case, and to prevent the fine particles from being caught between the contact surfaces of the two as much as possible.

  Further, while the wafer 2 is adsorbed by the vacuum adsorbing member, the air flow flowing from the external space 12 side through the circulation space 13 to the internal space 7 side floats or rises fine particles that float on the external space 12 side. It is thought that it is discharged outside. It can be considered that this also reduces the number of fine particles sandwiched between the vacuum suction member and the wafer 2 as compared with Comparative Examples 1 and 2 where the air flow does not exist.

  As mentioned above, although embodiment and Example of this invention were described, this invention is not limited to this. For example, the protruding portion that protrudes from the end surface (second surface 11) of the cylindrical portion 8 may have a shape other than the pin-shaped protruding portion 9 and the annular protruding portion 15. The object to be sucked by the vacuum suction member is not limited to the wafer 2 but may be another semiconductor substrate that is supported and positioned by the vacuum suction member and processed.

  Moreover, the vacuum suction member of 1st-3rd embodiment may have the adsorption | suction part which does not have a protrusion part like FIG. 8A in addition to the adsorption | suction part 6, 14, or 16. FIG. In this case, when adsorbing the wafer 2, the end surface of the adsorbing portion is a contact surface with the wafer 2.

  DESCRIPTION OF SYMBOLS 1 ... Vacuum adsorption member, 2 ... Wafer (object), 3 ... Main surface, 3a-3d ... area | region, 4 ... Air flow path, 5 ... Base | substrate, 6, 14, 16, 21-24 ... Adsorption part, 7 ... Inside Space, 8 ... Cylindrical part, 9 ... Pin-shaped convex part (protruding part), 10 ... First surface, 11 ... Second surface, 12 ... External space, 13 ... Distribution space, 15 ... Partial cylindrical annular convex part (Protrusion part), 17 ... annular convex part.

Claims (5)

A base body having a main surface facing the object and provided with an air passage inside;
A plurality of adsorbing portions that are erected on the main surface and have a hollow cylindrical portion that defines an internal space that communicates with the air passage;
In a vacuum suction member for sucking the object by vacuum suction through the plurality of suction portions,
At least some of the plurality of suction portions each have a protruding portion that protrudes from an end surface of the cylindrical portion,
The end surface of each protrusion constitutes a first surface that supports the object to be vacuum-sucked,
Flow for air for vacuum suction to flow between the internal space side and the external space side of the cylindrical portion at a level between the first surface and the second surface that is an end surface of the cylindrical portion. A vacuum suction member characterized in that a space is formed. At least some of the plurality of suction portions each have a plurality of the protruding portions,
2. The vacuum according to claim 1, wherein each suction portion having the plurality of projecting portions communicates between the inner space side and the outer space side of the cylindrical portion through the adjacent projecting portions. Adsorption member. At least some of the plurality of suction portions each have a plurality of pin-shaped convex portions as the protruding portions,
The adsorbing part having the pin-like convex part has an annular convex part erected on the end surface of the cylindrical part so as to surround the opening of the internal space of the cylindrical part,
The vacuum suction member according to claim 1, wherein an end surface of the annular convex portion is located at a level between the first surface and the second surface. The plurality of adsorbing portions are erected in a plurality of regions having a central region of the main surface and at least one annular region outside thereof.
The vacuum suction member according to any one of claims 1 to 3, wherein an area of a support surface that supports the object for each suction portion is different for each region.   The vacuum suction member according to claim 4, wherein an area of the support surface for each suction portion is larger as the region to which the suction portion belongs is closer to the center of the main surface.