JP6823800B2 - 発光モジュールおよび照明装置 - Google Patents
発光モジュールおよび照明装置 Download PDFInfo
- Publication number
- JP6823800B2 JP6823800B2 JP2016192458A JP2016192458A JP6823800B2 JP 6823800 B2 JP6823800 B2 JP 6823800B2 JP 2016192458 A JP2016192458 A JP 2016192458A JP 2016192458 A JP2016192458 A JP 2016192458A JP 6823800 B2 JP6823800 B2 JP 6823800B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- light
- emitting elements
- sub
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 31
- 238000010586 diagram Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 239000003086 colorant Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 235000000177 Indigofera tinctoria Nutrition 0.000 description 3
- 229940097275 indigo Drugs 0.000 description 3
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000005469 synchrotron radiation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016192458A JP6823800B2 (ja) | 2016-09-30 | 2016-09-30 | 発光モジュールおよび照明装置 |
KR1020170013825A KR20180036493A (ko) | 2016-09-30 | 2017-01-31 | 발광모듈 및 조명장치 |
CN201720214912.8U CN206496229U (zh) | 2016-09-30 | 2017-03-07 | 发光模块及照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016192458A JP6823800B2 (ja) | 2016-09-30 | 2016-09-30 | 発光モジュールおよび照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018056406A JP2018056406A (ja) | 2018-04-05 |
JP6823800B2 true JP6823800B2 (ja) | 2021-02-03 |
Family
ID=59806379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016192458A Active JP6823800B2 (ja) | 2016-09-30 | 2016-09-30 | 発光モジュールおよび照明装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6823800B2 (zh) |
KR (1) | KR20180036493A (zh) |
CN (1) | CN206496229U (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7263404B2 (ja) * | 2018-10-11 | 2023-04-24 | 廈門市三安光電科技有限公司 | 発光ダイオードチップ及びその製作方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007258202A (ja) * | 2006-03-20 | 2007-10-04 | Showa Denko Kk | 照明光源 |
JP5029203B2 (ja) * | 2006-08-11 | 2012-09-19 | 三菱化学株式会社 | 照明装置 |
JP4869275B2 (ja) * | 2007-03-26 | 2012-02-08 | 三菱電機株式会社 | 光源モジュール及び発光装置 |
JP4542116B2 (ja) * | 2007-04-20 | 2010-09-08 | 株式会社 日立ディスプレイズ | 液晶表示装置 |
JP4521013B2 (ja) * | 2007-05-15 | 2010-08-11 | 株式会社日立製作所 | 照明装置および該照明装置を用いた液晶表示装置 |
JP5052397B2 (ja) * | 2008-04-23 | 2012-10-17 | 三菱電機株式会社 | 発光装置並びに発光器具 |
WO2010126065A1 (ja) * | 2009-04-27 | 2010-11-04 | 東芝ライテック株式会社 | 照明装置 |
JP2011192704A (ja) * | 2010-03-12 | 2011-09-29 | Toshiba Lighting & Technology Corp | 発光装置及び照明装置 |
US20120099303A1 (en) * | 2010-10-26 | 2012-04-26 | Industrial Technology Research Institute | Cct modulating method, led light source module, and package structure thereof |
KR20140073565A (ko) * | 2011-10-06 | 2014-06-16 | 오스람 실바니아 인코포레이티드 | 고체 상태 광원들의 어레인지먼트와 그를 이용하는 램프 |
JP2014143307A (ja) * | 2013-01-24 | 2014-08-07 | Panasonic Corp | 発光モジュールおよび照明装置 |
JP2014170853A (ja) * | 2013-03-04 | 2014-09-18 | Mitsubishi Chemicals Corp | 発光装置及び照明方法 |
DE102013211525A1 (de) * | 2013-06-19 | 2014-12-24 | Osram Gmbh | LED-Modul mit LED-Chips |
-
2016
- 2016-09-30 JP JP2016192458A patent/JP6823800B2/ja active Active
-
2017
- 2017-01-31 KR KR1020170013825A patent/KR20180036493A/ko unknown
- 2017-03-07 CN CN201720214912.8U patent/CN206496229U/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20180036493A (ko) | 2018-04-09 |
CN206496229U (zh) | 2017-09-15 |
JP2018056406A (ja) | 2018-04-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10153408B2 (en) | Light-emitting apparatus and illumination apparatus | |
JP6147977B2 (ja) | Led照明器具およびledユニット | |
US9515055B2 (en) | Light emitting devices including multiple anodes and cathodes | |
US20150211723A1 (en) | Led lamp and heat sink | |
US20140175966A1 (en) | Led lamp | |
US10082269B2 (en) | LED lamp | |
US9406654B2 (en) | Package for high-power LED devices | |
JP2010250962A (ja) | 発光モジュール及び照明器具 | |
JP2005158957A (ja) | 発光装置 | |
WO2017038209A1 (ja) | 発光装置およびその製造方法 | |
JP6694153B2 (ja) | 発光装置、および照明装置 | |
JP6823800B2 (ja) | 発光モジュールおよび照明装置 | |
JP6648594B2 (ja) | 発光装置、および照明装置 | |
JP6598137B2 (ja) | 発光装置、および照明装置 | |
JP2018056407A (ja) | 発光モジュールおよび照明装置 | |
JP6784046B2 (ja) | 発光装置、および照明装置 | |
JP6695114B2 (ja) | 発光装置 | |
JP6845996B2 (ja) | 発光装置、および照明装置 | |
JP5742629B2 (ja) | 発光装置及びこれを備えた照明器具 | |
JP2017168744A (ja) | 発光装置、および照明装置 | |
JP2017050356A (ja) | 発光装置の製造方法 | |
CN104676376A (zh) | 一种led照明器件以及led灯具 | |
KR20170102409A (ko) | 발광장치 및 조명장치 | |
JP2017174742A (ja) | 照明装置 | |
JP2015060972A (ja) | 発光モジュール、照明装置および照明器具 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190313 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200122 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200227 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20200401 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200420 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20200820 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201120 |
|
C60 | Trial request (containing other claim documents, opposition documents) |
Free format text: JAPANESE INTERMEDIATE CODE: C60 Effective date: 20201120 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20201202 |
|
C21 | Notice of transfer of a case for reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C21 Effective date: 20201203 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20201210 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20201223 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6823800 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |