JP6800521B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP6800521B2 JP6800521B2 JP2016178861A JP2016178861A JP6800521B2 JP 6800521 B2 JP6800521 B2 JP 6800521B2 JP 2016178861 A JP2016178861 A JP 2016178861A JP 2016178861 A JP2016178861 A JP 2016178861A JP 6800521 B2 JP6800521 B2 JP 6800521B2
- Authority
- JP
- Japan
- Prior art keywords
- unit
- cutting
- light
- blade
- light receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005520 cutting process Methods 0.000 title claims description 121
- 238000001514 detection method Methods 0.000 claims description 83
- 238000005286 illumination Methods 0.000 claims description 24
- 238000006243 chemical reaction Methods 0.000 claims description 18
- 230000003287 optical effect Effects 0.000 claims description 11
- 230000007423 decrease Effects 0.000 claims description 9
- 230000004044 response Effects 0.000 claims description 2
- 239000000498 cooling water Substances 0.000 description 8
- 238000003754 machining Methods 0.000 description 8
- 239000013307 optical fiber Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 230000004397 blinking Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Description
6 チャックテーブル
32 切削ユニット
38 切削ブレード
42 加工室ケーシング
44 加工室
46 非接触セットアップ機構(ブレード摩耗検出ユニット)
51 照明
52 ブレード破損検出ユニット
78 調整ねじ
80 固定ブロック
82 移動ブロック
86 発光部
88 発光素子
94 発光端面
96 受光部
98 受光素子
104 受光端面
108 制御ユニット
116 報知ユニット
121 ブレード侵入部
122 発光部
124 受光部
Claims (4)
- 被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を切削する切削ブレードを備えた切削ユニットと、該切削ブレードの摩耗又は破損を検出する検出ユニットと、該切削ユニットと該検出ユニットが設置された加工室と、該加工室に設置された照明を含む報知ユニットと、少なくとも該チャックテーブル、該切削ユニット、該検出ユニット及び該報知ユニットを制御する制御ユニットと、を備えた切削装置であって、
該検出ユニットは、
凹形状のブレード侵入部と、該ブレード侵入部の一方の側に配設された発光端面と、該発光端面からの光を受光する該ブレード侵入部の他方の側に配設された受光端面と、該受光端面に接続され該受光端面の受光量に応じた電気信号を出力する光電変換部と、を含み、
該制御ユニットは、
該受光端面が受光する受光量が第1の閾値へと減少していくのに応じて徐々に該照明を暗く変化させ、該受光端面が受光する受光量が該第1の閾値に達した際に該照明を明るく変化させて該受光量が該第1の閾値に達したことを報知することを特徴とする切削装置。 - 該検出ユニットは、該ブレード侵入部に侵入した該切削ブレードの破損を検出し、該切削ブレードに対し進退可能に設定され、
該制御ユニットは、該発光端面からの光が該切削ブレードに部分的に遮られて該受光端面が受光する受光量が該第1の閾値以下になる検出位置に検出ユニットを位置付ける際、該受光端面が受光する受光量が減少して該第1の閾値以下になると、該照明の明るさを急激に上昇させ該検出ユニットが該検出位置に位置付けられたことを報知することを特徴とする請求項1記載の切削装置。 - 該制御ユニットは、該受光端面が受光する受光量が該第1の閾値より少ない第2の閾値以下になると、該照明を点滅させることを特徴とする請求項2記載の切削装置。
- 被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を切削する切削ブレードを備えた切削ユニットと、該切削ブレードの摩耗を検出する検出ユニットと、該切削ユニットと該検出ユニットが設置された加工室と、該加工室に設置された照明を含む報知ユニットと、少なくとも該チャックテーブル、該切削ユニット、該検出ユニット及び該報知ユニットを制御する制御ユニットと、を備えた切削装置であって、
該検出ユニットは、
ブレード侵入部と、該ブレード侵入部の一方の側に配設された発光部と、該発光部からの光を受光する該ブレード侵入部の他方の側に配設された受光部と、該受光部に接続され該受光部が受光する受光量に応じた電気信号を出力する光電変換部と、該発光部に接続された光源と、該光源の電力を調整するアンプユニットと、を含み、
該制御ユニットは、
該アンプユニットを調整する際、該受光部が受光する受光量が閾値以上になると、該照明の明るさを急激に上昇させて報知することを特徴とする切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016178861A JP6800521B2 (ja) | 2016-09-13 | 2016-09-13 | 切削装置 |
TW106127556A TWI732923B (zh) | 2016-09-13 | 2017-08-15 | 切割裝置 |
KR1020170115029A KR102281152B1 (ko) | 2016-09-13 | 2017-09-08 | 절삭 장치 |
CN201710803657.5A CN107813225B (zh) | 2016-09-13 | 2017-09-08 | 切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016178861A JP6800521B2 (ja) | 2016-09-13 | 2016-09-13 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018043309A JP2018043309A (ja) | 2018-03-22 |
JP6800521B2 true JP6800521B2 (ja) | 2020-12-16 |
Family
ID=61600935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016178861A Active JP6800521B2 (ja) | 2016-09-13 | 2016-09-13 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6800521B2 (ja) |
KR (1) | KR102281152B1 (ja) |
CN (1) | CN107813225B (ja) |
TW (1) | TWI732923B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7521173B2 (ja) | 2020-06-15 | 2024-07-24 | 株式会社東京精密 | ブレード検出装置及びブレード検出装置の洗浄方法 |
CN112606234A (zh) * | 2020-12-28 | 2021-04-06 | 郑州光力瑞弘电子科技有限公司 | 划片机刀片监测装置及划片机 |
JP2023023057A (ja) * | 2021-08-04 | 2023-02-16 | Towa株式会社 | 加工装置、及び加工品の製造方法 |
CN116021654B (zh) * | 2023-04-02 | 2023-07-25 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | 一种晶片切割自动换刀装置的换刀方法 |
CN116441638B (zh) * | 2023-06-16 | 2023-09-08 | 沈阳和研科技股份有限公司 | 划片机 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08288244A (ja) * | 1995-04-11 | 1996-11-01 | Disco Abrasive Syst Ltd | 光学検出手段 |
JPH11214334A (ja) | 1998-01-29 | 1999-08-06 | Disco Abrasive Syst Ltd | ブレードのセットアップ装置 |
JP4105905B2 (ja) * | 2002-07-01 | 2008-06-25 | 株式会社ディスコ | 切削装置の切削ブレード監視装置 |
US20070088454A1 (en) * | 2004-10-25 | 2007-04-19 | Ford Motor Company | System and method for troubleshooting a machine |
JP4791813B2 (ja) * | 2005-12-08 | 2011-10-12 | 株式会社ディスコ | 切削装置 |
CN102490112B (zh) * | 2006-10-06 | 2015-03-25 | 株式会社荏原制作所 | 加工终点检测方法、研磨方法及研磨装置 |
JP5236918B2 (ja) * | 2007-10-02 | 2013-07-17 | 株式会社ディスコ | 切削装置の切削ブレード検出機構 |
JP5068621B2 (ja) | 2007-10-03 | 2012-11-07 | 株式会社ディスコ | 切削装置 |
JP2009083077A (ja) | 2007-10-03 | 2009-04-23 | Disco Abrasive Syst Ltd | 切削ブレード検出機構 |
JP5415917B2 (ja) * | 2009-11-27 | 2014-02-12 | 株式会社ディスコ | 切削装置 |
JP5918562B2 (ja) * | 2012-02-15 | 2016-05-18 | シチズンホールディングス株式会社 | 工作機械 |
CN104932462A (zh) * | 2015-05-08 | 2015-09-23 | 苏州首旗信息科技有限公司 | 一种基于位移检测的远程监控系统 |
KR101573411B1 (ko) | 2015-05-11 | 2015-12-03 | (주)오아이씨코리아 | Ict기반 지능형 전자어항 |
CN105965330B (zh) * | 2016-07-06 | 2017-12-26 | 苏州工业园区代思科电子科技有限公司 | 一种v型划片刀的加工装置 |
-
2016
- 2016-09-13 JP JP2016178861A patent/JP6800521B2/ja active Active
-
2017
- 2017-08-15 TW TW106127556A patent/TWI732923B/zh active
- 2017-09-08 CN CN201710803657.5A patent/CN107813225B/zh active Active
- 2017-09-08 KR KR1020170115029A patent/KR102281152B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN107813225A (zh) | 2018-03-20 |
JP2018043309A (ja) | 2018-03-22 |
KR20180029899A (ko) | 2018-03-21 |
KR102281152B1 (ko) | 2021-07-22 |
CN107813225B (zh) | 2021-05-07 |
TW201822951A (zh) | 2018-07-01 |
TWI732923B (zh) | 2021-07-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6800521B2 (ja) | 切削装置 | |
JP2009231760A (ja) | ブレード破損/磨耗検出装置 | |
EP1600248A2 (en) | Nozzle presetter for laser machining tool of laser beam machine | |
JP2009083077A (ja) | 切削ブレード検出機構 | |
JP6800520B2 (ja) | 切削装置 | |
JP2016010809A (ja) | レーザー加工装置 | |
KR102008532B1 (ko) | 가공 장치 | |
JP7114166B2 (ja) | 切削ブレードの管理方法及び切削装置 | |
KR20200140725A (ko) | 레이저 발진기 지지 테이블, 레이저 가공 장치 및 레이저 발진기 지지 테이블의 조정 방법 | |
TW201739590A (zh) | 切割裝置 | |
JP2017144511A (ja) | ノズル調整治具 | |
JP5947056B2 (ja) | レーザー加工方法およびレーザー加工装置 | |
JP2012040651A (ja) | 切削ブレード検出機構 | |
JP2015138950A (ja) | 切削装置 | |
JP6974087B2 (ja) | 切削装置 | |
JP5611012B2 (ja) | 切削ブレード検出機構 | |
CN108538718B (zh) | 切削装置 | |
JP6999227B2 (ja) | 切削ブレードの位置検出方法及び切削装置 | |
JP2003234309A (ja) | 光学式カッターセット装置及びカッターセット方法 | |
JP2021109183A (ja) | 集光レンズユニット及びレーザ加工装置 | |
JP6184214B2 (ja) | 切削装置及び切削方法 | |
CN212704966U (zh) | 一种超硬材料加工设备 | |
JP5956111B2 (ja) | 切削装置 | |
JP6460763B2 (ja) | 切削装置 | |
JP2017144510A (ja) | ノズル調整治具 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190725 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200722 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200804 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200929 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20201124 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20201124 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6800521 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |