JP6771647B2 - 複数の目標からのオーバレイ信号の同時取得 - Google Patents

複数の目標からのオーバレイ信号の同時取得 Download PDF

Info

Publication number
JP6771647B2
JP6771647B2 JP2019504839A JP2019504839A JP6771647B2 JP 6771647 B2 JP6771647 B2 JP 6771647B2 JP 2019504839 A JP2019504839 A JP 2019504839A JP 2019504839 A JP2019504839 A JP 2019504839A JP 6771647 B2 JP6771647 B2 JP 6771647B2
Authority
JP
Japan
Prior art keywords
irradiation
path
pupil
measurement system
images
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019504839A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019526053A (ja
JP2019526053A5 (https=
Inventor
アンドリュー ヒル
アンドリュー ヒル
アンノン マナッセン
アンノン マナッセン
ユリ パスコヴァー
ユリ パスコヴァー
ユバル ルバシェブスキー
ユバル ルバシェブスキー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Corp filed Critical KLA Corp
Publication of JP2019526053A publication Critical patent/JP2019526053A/ja
Publication of JP2019526053A5 publication Critical patent/JP2019526053A5/ja
Application granted granted Critical
Publication of JP6771647B2 publication Critical patent/JP6771647B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J4/00Measuring polarisation of light
    • G01J4/04Polarimeters using electric detection means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/70633Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/26Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4233Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • G01N2021/4792Polarisation of scatter light

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Peptides Or Proteins (AREA)
  • Medicines That Contain Protein Lipid Enzymes And Other Medicines (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2019504839A 2016-07-28 2017-07-28 複数の目標からのオーバレイ信号の同時取得 Active JP6771647B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/222,503 US10048132B2 (en) 2016-07-28 2016-07-28 Simultaneous capturing of overlay signals from multiple targets
US15/222,503 2016-07-28
PCT/US2017/044528 WO2018023078A1 (en) 2016-07-28 2017-07-28 Simultaneous capturing of overlay signals from multiple targets

Publications (3)

Publication Number Publication Date
JP2019526053A JP2019526053A (ja) 2019-09-12
JP2019526053A5 JP2019526053A5 (https=) 2020-09-10
JP6771647B2 true JP6771647B2 (ja) 2020-10-21

Family

ID=61009490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019504839A Active JP6771647B2 (ja) 2016-07-28 2017-07-28 複数の目標からのオーバレイ信号の同時取得

Country Status (7)

Country Link
US (2) US10048132B2 (https=)
JP (1) JP6771647B2 (https=)
KR (1) KR102180433B1 (https=)
CN (2) CN109564160B (https=)
SG (2) SG10201912512UA (https=)
TW (1) TWI728157B (https=)
WO (1) WO2018023078A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3528047A1 (en) * 2018-02-14 2019-08-21 ASML Netherlands B.V. Method and apparatus for measuring a parameter of interest using image plane detection techniques
US10809124B2 (en) 2018-05-07 2020-10-20 Perkinelmer Health Sciences, Inc. Spectrometers and instruments including them
EP3575875A1 (en) 2018-05-31 2019-12-04 ASML Netherlands B.V. Measurement apparatus and method of measuring a target
US11281111B2 (en) * 2018-08-28 2022-03-22 Kla-Tencor Corporation Off-axis illumination overlay measurement using two-diffracted orders imaging
CN112740109B (zh) 2018-09-19 2024-04-30 Asml荷兰有限公司 用于位置量测的量测传感器
US11119417B2 (en) * 2018-11-21 2021-09-14 Kla-Tencor Corporation Single cell grey scatterometry overlay targets and their measurement using varying illumination parameter(s)
US11073768B2 (en) * 2019-06-26 2021-07-27 Kla Corporation Metrology target for scanning metrology
US11359916B2 (en) * 2019-09-09 2022-06-14 Kla Corporation Darkfield imaging of grating target structures for overlay measurement
US11933717B2 (en) 2019-09-27 2024-03-19 Kla Corporation Sensitive optical metrology in scanning and static modes
CN115004113B (zh) * 2020-01-29 2026-03-24 Asml荷兰有限公司 量测方法和用于测量衬底上的周期性结构的装置
US11604149B2 (en) * 2020-04-23 2023-03-14 Kla Corporation Metrology methods and optical schemes for measurement of misregistration by using hatched target designs
KR20230052877A (ko) * 2020-08-17 2023-04-20 도쿄엘렉트론가부시키가이샤 반도체 제조를 위해 절대 참조물을 통해 오버레이 결과물을 제조하기 위한 방법
US11428642B2 (en) * 2021-01-04 2022-08-30 Kla Corporation Scanning scatterometry overlay measurement
US20220357674A1 (en) * 2021-05-04 2022-11-10 Kla Corporation Oblique illumination for overlay metrology
US11531275B1 (en) * 2021-08-25 2022-12-20 Kla Corporation Parallel scatterometry overlay metrology
US20240427251A1 (en) * 2021-10-29 2024-12-26 Asml Netherlands B.V. Inspection apparatus, polarization-maintaining rotatable beam displacer, and method
JP2023116048A (ja) * 2022-02-09 2023-08-22 キオクシア株式会社 計測装置および計測方法
KR20250040583A (ko) * 2022-07-19 2025-03-24 에이에스엠엘 네델란즈 비.브이. 리소그래피 시스템을 위한 향상된 정렬 장치
US20250362617A1 (en) * 2022-08-10 2025-11-27 Asml Netherlands B.V. Metrology method and associated metrology device
KR20240108945A (ko) 2023-01-03 2024-07-10 삼성전자주식회사 기판 검사 장치 및 기판 검사 방법
US12411420B2 (en) * 2023-09-29 2025-09-09 Kla Corporation Small in-die target design for overlay measurement
US20250306477A1 (en) * 2024-03-27 2025-10-02 Kla Corporation Single grab pupil landscape via outside the objective lens broadband illumination

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8600638A (nl) * 1986-03-12 1987-10-01 Philips Nv Inrichting voor het ten opzichte van elkaar uitrichten van een masker en een substraat.
JPH05157521A (ja) * 1991-08-29 1993-06-22 Nkk Corp エリプソパラメータ測定方法及びエリプソメータ
US5734498A (en) * 1994-05-09 1998-03-31 The Regents Of The University Of California Illuminator elements for conventional light microscopes
US6710876B1 (en) * 2000-08-14 2004-03-23 Kla-Tencor Technologies Corporation Metrology system using optical phase
US6768543B1 (en) 2001-11-01 2004-07-27 Arun Ananth Aiyer Wafer inspection apparatus with unique illumination methodology and method of operation
US7957066B2 (en) * 2003-02-21 2011-06-07 Kla-Tencor Corporation Split field inspection system using small catadioptric objectives
US7561282B1 (en) * 2006-03-27 2009-07-14 Kla-Tencor Technologies Corporation Techniques for determining overlay and critical dimension using a single metrology tool
ATE532104T1 (de) * 2006-04-04 2011-11-15 Tesa Scribos Gmbh Vorrichtung und verfahren zur steuerung einer vorrichtung zur mikrostrukturierung eines speichermediums
US7692792B2 (en) * 2006-06-22 2010-04-06 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
US7701577B2 (en) * 2007-02-21 2010-04-20 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
IL194839A0 (en) * 2007-10-25 2009-08-03 Asml Netherlands Bv Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US8441639B2 (en) * 2009-09-03 2013-05-14 Kla-Tencor Corp. Metrology systems and methods
NL2006229A (en) * 2010-03-18 2011-09-20 Asml Netherlands Bv Inspection method and apparatus, and associated computer readable product.
US8896832B2 (en) * 2010-06-17 2014-11-25 Kla-Tencor Corp. Discrete polarization scatterometry
JP5873212B2 (ja) * 2012-04-12 2016-03-01 エーエスエムエル ネザーランズ ビー.ブイ. 位置測定方法、位置測定装置、リソグラフィ装置及びデバイス製造方法並びに光学要素
US8817273B2 (en) * 2012-04-24 2014-08-26 Nanometrics Incorporated Dark field diffraction based overlay
US9778025B2 (en) 2012-08-16 2017-10-03 Asml Netherlands B.V. Method and apparatus for measuring asymmetry of a microstructure, position measuring method, position measuring apparatus, lithographic apparatus and device manufacturing method
US9892812B2 (en) * 2012-10-30 2018-02-13 California Institute Of Technology Fourier ptychographic x-ray imaging systems, devices, and methods
US9497379B2 (en) * 2013-08-22 2016-11-15 California Institute Of Technology Variable-illumination fourier ptychographic imaging devices, systems, and methods
US9091650B2 (en) * 2012-11-27 2015-07-28 Kla-Tencor Corporation Apodization for pupil imaging scatterometry
CN108398856B (zh) 2013-08-07 2020-10-16 Asml荷兰有限公司 量测方法和设备、光刻系统和器件制造方法
US10795144B2 (en) * 2014-12-06 2020-10-06 Howard Hughes Medical Institute Microscopy with structured plane illumination and point accumulation for imaging and nanoscale topography

Also Published As

Publication number Publication date
CN109564160B (zh) 2020-11-10
US10401228B2 (en) 2019-09-03
TW201805593A (zh) 2018-02-16
JP2019526053A (ja) 2019-09-12
KR102180433B1 (ko) 2020-11-19
US10048132B2 (en) 2018-08-14
CN112432926B (zh) 2025-10-10
CN109564160A (zh) 2019-04-02
KR20190026039A (ko) 2019-03-12
SG10201912512UA (en) 2020-02-27
US20180335346A1 (en) 2018-11-22
WO2018023078A1 (en) 2018-02-01
US20180031424A1 (en) 2018-02-01
CN112432926A (zh) 2021-03-02
TWI728157B (zh) 2021-05-21
SG11201900509YA (en) 2019-02-27

Similar Documents

Publication Publication Date Title
JP6771647B2 (ja) 複数の目標からのオーバレイ信号の同時取得
US11841621B2 (en) Moiré scatterometry overlay
CN112840202B (zh) 多极照明系统以及叠对度量系统
US10401738B2 (en) Overlay metrology using multiple parameter configurations
EP2724361B1 (en) Illumination control
US12585200B2 (en) Imaging overlay with mutually coherent oblique illumination
JP5840789B2 (ja) 共焦点分光計および共焦点分光計における画像形成方法
JP6084620B2 (ja) 共焦点分光計および共焦点分光計における画像形成方法
KR20250005042A (ko) 다수의 조명 파라미터 및 분리된 이미징을 사용한 다방향 오버레이 계측
US11365961B2 (en) Polarization holographic microscope system and sample image acquisition method using the same
JP2014532173A5 (https=)
TW202441305A (zh) 多疊對堆疊光柵度量目標
US20250328087A1 (en) System and method for determining overlay measurement of a scanning target using multiple wavelengths
TWI915613B (zh) 藉由相互地相干傾斜照明之成像疊對計量
TWI915630B (zh) 光學度量衡系統及光學度量衡方法
JP4422533B2 (ja) 分光装置
JP2020091320A (ja) 観察装置、内視鏡装置、顕微鏡装置および観察方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200728

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200728

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20200728

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20200901

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200908

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200929

R150 Certificate of patent or registration of utility model

Ref document number: 6771647

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250